JP2002194451A - Treatment system and treatment method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a treatment device and a treatment method with which effectively treating a material body including resin and metal can be safely and effectively treated. SOLUTION: The body including lead and resin as components is held in an airtight vessel, the resin is decomposed by adjusting the temperature and the oxygen concentration in the airtight vessel, and lead in the body is selectively vaporized by adjusting the temperature and the pressure in the vessel. The gas generated from the decomposed resin is reformed at the temperature so that dioxin is decomposed, and recovered after it is rapidly cooled so that the increase in dioxin concentration in the gas is suppressed. Lead vaporized from the body is separately recovered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a processing apparatus and a processing apparatus, and more particularly, to a processing system and a processing method for an object containing metal and resin.

[0002] The present invention also relates to a processing apparatus and a processing method for processing an object containing a harmful metal such as lead and a resin. Further, the present invention is a metal, joined by an alloy,
The present invention relates to a processing system and a processing method for releasing a joint between an object containing a metal and a resin. Furthermore, the present invention relates to a processing apparatus and a processing method for recycling an object containing metal and resin such as shredder dust while suppressing the generation of dioxin. Further, the present invention provides a processing system for separating an electronic component and a circuit board from an object such as a circuit board on which the electronic component is mounted, while suppressing the generation of dioxin, and collecting harmful metals such as lead and metals such as copper. And a processing method.

[0003]

2. Description of the Related Art The enormous amount of wastes in modern society is increasing daily, and it is urgently necessary to establish effective treatment techniques.

Although various useful substances are contained in waste, they are not separated from waste due to difficulty in separation.
Most waste is disposed of by landfill or incineration. Useful substances in waste have energy problems and resource depletion problems, and it is required to separate and collect and reuse them as much as possible.

On the other hand, harmful substances are contained in waste, and such harmful substances not only cause environmental destruction but also one of the major causes that make it difficult to recycle waste. It is. Therefore, if the harmful substances in the waste can be effectively removed, the waste can be actively reused as a treasure trove of resources, and the impact on the environment and living things can be minimized. it can.

As described above, a technology for effectively treating waste must be established in order to solve serious problems surrounding the modern society such as environmental pollution by harmful substances, depletion of resources, and lack of energy sources. Must.

[0007] However, in recent years, the forms of waste have become complicated and diverse, and there are many complex wastes in which a plurality of different materials are integrated, and there are also wastes containing harmful substances. In order to reuse such complex waste as a resource, it is necessary to selectively separate and recover useful and harmful substances from the waste in which multiple different materials are integrated. Such processing technology has not been established yet.

[0008] For example, in recent years, as the number of end-of-life vehicles has increased and iron, which is a constituent material of automobiles, has been replaced by resins such as plastics, the amount of shredder dust generated has continued to increase. The safe and effective disposal of this shredder dust is difficult, and most of it is still disposed of by landfill. Here, shredder dust refers to shredding used cars, waste home appliances, etc. with shredders,
It is a name of unnecessary materials that are separated by wind power etc. when collecting valuables, such as plastic, rubber, glass, metal,
Mixed waste consisting of fiber waste and the like.

It is known that such shredder dust contains not only organic substances but also various heavy metals at a relatively high concentration. In particular, shredder dust derived from automobiles includes 10
Some report that it contains more than twice as much lead. Also, for example, resin-coated aluminum foil obtained by laminating a resin film and an aluminum foil is inexpensive and has good workability, and is used in large quantities in various packaging containers such as food and pharmaceuticals, such as packaging containers for retort foods. .

[0010] Similarly, a large amount of resin-coated copper foil obtained by laminating a resin film and a copper foil is also used in large quantities as a component part of electronic equipment such as a so-called circuit board, a flexible board, and a TAB film carrier. It is used for

However, since the resin-coated aluminum foil and the resin-coated copper foil after use are complex wastes integrally formed from a plurality of different materials, effective treatment techniques have been established. There is no present.

Conventionally, waste such as shredder dust, waste circuit boards on which electronic components are mounted, resin-coated aluminum foil and resin-coated copper foil have been treated by landfill, incineration, and melt-solidification, but the landfill is bulky. However, there is a problem that it is difficult to secure a place. On the other hand, incineration has a problem that the furnace is damaged and aluminum and copper are converted into oxides.

A large amount of electric power is used for refining aluminum and copper, and it is a waste of energy to convert the aluminum or copper refined into a metal into an oxide again by incineration. It is desired to establish a technology for reuse.

On the other hand, for example, the above-mentioned waste such as shredder dust and circuit boards of electronic equipment contains a large amount of harmful substances such as lead. 2. Description of the Related Art Conventionally, solder alloys such as lead-tin alloys are often used for solder connection of various electronic devices because of their low melting point and good wettability even in an oxidizing atmosphere.

By the way, since lead is highly toxic and impairs the nervous system and reproductive functions when ingested into the body, the handling of lead and lead-containing alloys is regulated.

[0016] In addition, due to the recent growing interest in environmental destruction, waste disposal of electronic devices and components using a solder alloy containing lead has become a social problem.

That is, composite waste such as waste electronic equipment using a large amount of a lead-containing solder alloy is generally landfilled in the same manner as conventional industrial waste and general waste.

However, when a composite waste containing harmful substances such as lead, such as waste electronic equipment, is landfilled, lead components are eluted due to rainfall and the like, polluting soil and groundwater and seriously damaging the environment. Problem. In particular, the amount of lead eluted from the solder alloy increases rapidly due to acid rain,
There is concern that it will have a serious impact on the environment and living organisms.

For this reason, when treating waste containing harmful substances such as lead, such as shredder dust, waste circuit boards, and scales, it is necessary to separate and collect harmful substances such as lead. is there.

However, at present, a technique for effectively recovering lead has not been found.

On the other hand, since the cost of recovering lead may lead to an increase in product cost, the development of a lead-free solder that does not use lead has been desired and some of them have been put into practical use. There are still many unsolved problems, and lead-containing solder alloys are still used in large quantities. To date, huge amounts of waste containing lead have been generated, and efficient and safe processing technologies have not been found. is there.

From another point of view, the above-mentioned complex waste such as shredder dust and circuit boards of electronic equipment can be a treasure trove of resources if harmful substances can be separated. So-called waste is so called by relative value judgment. If resources recycling technology is established and the costs required for resource recycling can be reduced, it will not be waste.

For example, various electronic components such as an IC, an LSI, a resistor, and a capacitor are mounted on a circuit board.
It contains useful metals such as copper, nickel, aluminum, gold, platinum, tantalum, tungsten, molybdenum, cobalt, and chromium, as well as resins, and many of them are depleted as resources.

However, since a large number of electronic components are mounted on a substrate, and the number of joints tends to increase and the joining pitch tends to become finer with recent high integration, the substrate and the electronic components are separated. It is quite difficult to do. The board and the electronic component are joined by a solder alloy as described above, and the use of toxic lead is also a major factor that hinders the effective treatment of waste electronic equipment.

Further, when the above-mentioned waste and municipal waste are treated by incineration or the like, there is a problem that harmful organic substances are generated from constituent resins of the waste. In particular, PCDDs are used when halides are used in components such as shredder dust and waste circuit boards.
There is a problem that so-called dioxins such as PCDFc and PCDFc are generated. In addition, there is a problem that when burning the resin component, more harmful substances such as dioxin such as decablo and Sb trioxide contained in ICs and circuit boards are generated. The toxicity of dioxin is extremely high, for example, 2,3
The half-lethal dose (LD50) of monkeys on 7,8-T, CDD is only 70 μg / Kg.

For example, when vinyl chloride, flame-retardant plastic, or preservative-treated wood is incinerated, halogen gas is generated, and PCDDs (polychlorinated dioxin) and PCDFc (polychlorinated benzofuran) having extremely high toxicity are generated. It has been found that such dioxins are also generated inside the electric dust collector.

On the other hand, there is a problem that the landfill processing is bulky and it is difficult to secure a place. Further, there is a problem that harmful substances such as heavy metals in the object to be treated are eluted due to corrosion and the like, causing water pollution and soil pollution. In particular, the amount of constituent metals eluted from the object to be treated is rapidly increased due to the acid rain, and there is a concern that it has a serious effect on the environment and living things.

Therefore, when treating an object to be treated such as waste, metal is reused as a resource without landfill or incineration, and resin (including paper, wood, rubber, etc.) is treated with dioxin. It is desired to establish a processing technique for suppressing the occurrence.

[0029]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. That is, the present invention is effective for an object having metal and resin as constituent materials,
It is an object of the present invention to provide a processing system and a processing method that can be economically and safely processed.

Another object of the present invention is to provide a processing system and a processing method capable of effectively and economically processing an object having a metal and a resin as constituents so that dioxin is not generated. An object of the present invention is to provide a processing system and a processing method capable of separating and recovering lead from an object containing resin and lead. It is another object of the present invention to provide a processing system and a processing method capable of releasing a joint of an object joined by an alloy. In addition, the present invention releases the joining of an object having as a constituent material a resin joined by an alloy containing lead,
It is an object of the present invention to provide a processing system and a processing method capable of recycling a resin component. Another object of the present invention is to provide a processing system and a processing method capable of effectively separating and recovering a resin component and a metal from an object having a resin and a metal as constituent materials.

The present invention also provides a processing system capable of effectively separating a resin component and a metal from an object in which a resin and a plurality of metals are integrated, and separating and recovering the resin and a plurality of metals, respectively. It is an object to provide a processing method. Still another object of the present invention is to provide a processing system and a processing method for processing an object containing a metal and a resin such as shredder dust while suppressing generation of dioxin. Furthermore, the present invention separates an object such as a circuit board on which an electronic component is mounted from an electronic component and a circuit board while suppressing the generation of dioxin, and separates and recovers harmful metals such as lead and metals such as copper. It is an object of the present invention to provide a processing system and a processing method.

[0032]

In order to solve such a problem, a processing system according to the present invention comprises: an airtight container for holding an object having lead and resin as constituents;
Temperature adjusting means for adjusting the temperature in the airtight container, pressure adjusting means for adjusting the pressure in the airtight container, oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container, and temperature in the airtight container First control means for controlling the temperature control means and the oxygen concentration control means so that the resin decomposes the oxygen concentration, and the lead in the object selectively vaporizes the temperature and pressure in the container. A second control means for controlling the temperature control means and the pressure control means so as to perform the first control, wherein the first control means is connected to the airtight container, and the gas generated by decomposing the resin is decomposed by dioxin. A reforming unit for reforming at a temperature, connected to the reforming unit, and a cooling unit for rapidly cooling the gas so that an increase in dioxin concentration of the gas reformed by the reforming unit is suppressed; Connected to the cooling means Wherein the first recovery means for recovering the cooled gas in the cooling means, connected to said airtight container, characterized by comprising a second recovery means for recovering the lead vaporized from the object.

[0033] The processing system of the present invention is connected to first pyrolysis means for pyrolyzing an object containing a resin, a first metal and a second metal at a first temperature, and to the first pyrolysis means. And a reforming means for reforming a gaseous effluent generated from the object at a second temperature at which dioxin is decomposed,
The gaseous effluent is connected to the reforming means, and the gaseous effluent is reformed at a second temperature so that an increase in dioxin concentration in the gaseous effluent is suppressed to a third temperature. Cooling means for quenching, and first reduced-pressure heating for heating a residue generated by thermal decomposition of the object under reduced pressure so that the first metal contained in the residue is vaporized and the second metal is retained. Means connected to the first decompression and heating means for condensing the first metal vaporized from the residue; and second means contained in the residue vaporized from the first metal.
And a second reduced pressure heating means for heating under reduced pressure so that the metal is melted.

[0034] The second reduced pressure heating means of the processing system of the present invention includes the second depressurization heating means, which is included in the residue obtained by vaporizing the first metal.
The metal may be heated under reduced pressure so that the metal is melted and aggregated by its surface tension.

Further, the processing system of the present invention has a first resin having a resin and a metal as a part of a constituent material and joined by a joining metal.
A pyrolysis means for thermally decomposing an object having a portion and a second portion while holding the joining metal; and connecting the pyrolysis means to the pyrolysis means, wherein a gaseous effluent generated from the object is converted to dioxin. A reforming means for reforming at a second temperature at which the gas is decomposed; and a reforming means connected to the reforming means so as to suppress an increase in dioxin concentration in the reformed gaseous effluent. A cooling means for rapidly cooling the gaseous emission to a third temperature; and a decompression heating means for heating a residue generated by thermal decomposition of the object under reduced pressure so that the bonding metal is vaporized. You may do so.

The thermal decomposition means of the processing system of the present invention may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration. The cooling means may cool the temperature up to the third temperature in as short a time as possible, preferably within about 10 seconds. Further, the processing apparatus of the present invention may further include a neutralizing unit disposed to be connected to the cooling unit and neutralizing the cooled gaseous emission.

[0037] The treatment method of the present invention may further include a neutralization step of neutralizing the gaseous effluent cooled by the cooling means.

The thermal decomposition step may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration.

In addition, it is preferable that the cooling step is carried out to a third temperature as quickly as possible, preferably within about 10 seconds.

The first temperature is about 250 to about 500 ° C.
It is preferable to set to. Also, the second temperature is at least higher than about 800 ° C., more preferably at least higher than 1000 ° C., even more preferably at least 120 ° C.
It is preferable to set the temperature higher than 0 ° C.

The third temperature is preferably set to a temperature lower than at least 150 ° C., more preferably a temperature lower than at least 100 ° C., and further preferably a temperature lower than 35 ° C. The gaseous effluent discharged from the object to be treated is reformed and pyrolyzed at such a high temperature that dioxin is decomposed, and the residence time in the temperature range where dioxin is generated and resynthesized from this state is minimized. Then, by rapidly cooling to a third temperature at which dioxin is not generated and resynthesized, the dioxin concentration in the gaseous emission is greatly reduced. In addition, by performing the first pyrolysis, the second pyrolysis or the reforming in two stages of the first temperature and the second temperature and simultaneously performing them in a reducing atmosphere, the source concentration of dioxin can be significantly increased. To be reduced.

Here, the second temperature is a temperature at which dioxin is decomposed, and not only dioxin but also other compounds contained in the gaseous emission are decomposed.
Therefore, in the present invention, not only dioxins but also halogenated hydrocarbons, PCBs and the like can be decomposed and made harmless.

That is, the present invention provides a means for decomposing a resin for treating an object having a resin and a metal as constituents, a means for further thermally decomposing a gaseous effluent generated from an object to be treated, It is provided with a cooling means for rapidly cooling the gas so that dioxin is not synthesized, and a means for vaporizing or liquefying the metal from the pyrolysis residue under reduced pressure to recover the metal. Here, the resin may be a synthetic resin or a natural resin, or a mixture thereof. The term “metal” as used herein is a generic term for metals contained in an object to be treated, unless otherwise specified, and is not limited to a specific metal element.

The first thermal decomposition means thermally decomposes the object to be treated at a first temperature at which the object to be treated is thermally decomposed under the control of the oxygen concentration. For example, gaseous discharge from shredder dust, waste circuit board, etc. Extract things. Here, the gaseous emission basically consists of an exhaust gas, but does not exclude the case where the exhaust gas contains solid fine particles, liquid fine particles, and the like mixed therein.

As the temperature adjusting means for adjusting the first temperature of the first thermal decomposition means, a heating means and a temperature measuring means may be used. As the heating means, various types of convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber.
Furthermore, the gas discharged from the resin or the like of the object to be treated is reformed, made harmless, and neutralized, and then reused as a fuel gas as a heat source of the first thermal decomposition means and the processing apparatus of the present invention. It may be. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator and converted into electric power, and this electric power is used to operate the first thermal decomposition means and other processing apparatuses of the present invention. It may be.

Various temperature sensors may be used as the temperature measuring means. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. To cut off, it is preferred to keep the first pyrolysis means in reducing conditions. For example, by thermally decomposing an aromatic hydrocarbon compound containing chlorine under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, generation of dioxin is suppressed.

In the present invention, unless otherwise specified, polychlorinated dibenzoparadioxin (Polychloro) is used.
ripped dibenzo-p-dioxin
s: PCCDs), polychlorinated dibenzofurans (Pol
ychlorinated dibenzofuran
s: PCDFs) and their homologs having different chlorine numbers and substitution positions are collectively referred to as dioxins.

Therefore, the first thermal decomposition means is preferably maintained in a reducing atmosphere so that the metal contained in the object to be treated is not substantially oxidized. It is preferable to provide In general, when the object to be treated is complicated, the object to be treated may be partially oxidized during the treatment, but the first pyrolysis means may be kept in a reducing atmosphere as a whole. .

As the oxygen concentration adjusting means, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system may be used.

As the oxygen concentration sensor, for example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used, or the absorption of, for example, CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

As the carrier gas, a rare gas such as Ar may be used. The carrier gas not only controls the oxygen concentration in the first pyrolysis means but also guides the gas to the reforming means or the second pyrolysis means efficiently. Further, the pressure adjusting means may also be used.

Further, a shredder may be provided before the first thermal decomposition means. The object to be treated brought in from the outside of the apparatus may be crushed and separated by a shredder and then introduced into the first pyrolysis means, or may be introduced into the first pyrolysis means without crushing. Good.
When the object to be processed is a waste circuit board, it is preferable that the object is introduced into the first pyrolysis means without being crushed.

In the first thermal decomposition means into which the object to be treated is introduced, the state of the metal in the object to be treated is minimized to be oxidized as much as possible. Temperature and oxygen concentration conditions may be adjusted so that The temperature and oxygen concentration conditions may be set in advance, or the measured values of the temperature and the oxygen concentration may be fed back to the heating unit, the oxygen concentration adjusting unit, and the like for control. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor may be used.

The pressure in the chamber of the first thermal decomposition means may be controlled. For example, when the pressure in the first thermal decomposition means is reduced, the oxygen concentration also decreases and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, the resin hardly generates oxygen even when decomposed. Further, decomposition products of the resin are easily vaporized.

On the other hand, when the pressure is reduced, the thermal conductivity in the hermetic zone decreases. However, if the inside of the first pyrolysis means is a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or under pressure. Therefore, if the inside of the first thermal decomposition means is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

Here, a gaseous emission processing system for processing the gaseous emission discharged from the object to be processed will be described. The gaseous emission treatment system is for treating gaseous emission discharged from the object to be treated by the first thermal decomposition means, and includes a reforming means, a second thermal decomposition means, and a cooling means. Is configured. The gaseous effluent treated by the cooling means is used as a clean fuel gas by performing post-treatments such as neutralization, filtration and washing as required.

[0057] The reforming means is provided so as to be connected to the first heating means, and converts the gaseous effluent discharged from the object to be treated in the first pyrolysis means into a first gas having a temperature higher than the first temperature. At a temperature of 2. Here, reforming refers to changing a hydrocarbon compound contained in a gaseous effluent discharged from the object to be treated to lower molecular hydrogen, methane, carbon monoxide or the like. In addition, hydrorefining treatment (kyd
(reforming) may be performed. Reforming while maintaining the inside of the system under reducing conditions is also suitable from the viewpoint of cutting off the source of dioxin as described above. If the inside of the reforming unit is kept in a reducing atmosphere, a small amount of air may be introduced into the reforming unit. As the reforming means, not only the thermal reforming means but also a catalytic reforming means using, for example, a catalyst may be provided. As a catalyst, for example, Pt, a solid acid such as silica-alumina or zeolite (aluminosilicate) is used.
A metal such as Re may be supported and used.

Further, in place of the reforming means, a second pyrolysis means connected to the first pyrolysis means for pyrolyzing the gaseous effluent in a reducing atmosphere may be provided.

By separating the reforming means and the second thermal decomposition means from the first thermal decomposition means, the second temperature higher than the first temperature can be obtained.
At this temperature, the gaseous emission from the object to be treated can be treated, and the reformation of the gaseous emission and the mineralization of chlorine are effectively performed.

It is desirable that the reforming means or the second thermal decomposition means maintain conditions under which dioxin derived directly or indirectly from the object to be treated is decomposed as much as possible. For example, by setting the second temperature to about 800 ° C., considerable dioxin can be decomposed. Further, the second temperature is set to 1000 ° C. or more, more preferably 120 ° C.
By setting the temperature at 0 ° C. or higher, dioxin can be more effectively decomposed. Since this reforming means is performed at a second temperature at which dioxin is decomposed,
At this second temperature, thermal decomposition of the gaseous effluent will also occur simultaneously.

The hydrocarbon compound contained in the gaseous effluent discharged from the object to be treated is reduced by being reformed by the reforming means and by being thermally decomposed by the second pyrolysis means. It is molecularized and changes to hydrogen, methane, carbon monoxide, etc. When the gaseous emission contains dioxin, most of the dioxin is decomposed.
Further, the organic chlorine is mineralized, and the resynthesis of dioxin is suppressed.

[0062] The reforming means or the second pyrolysis means is provided with, for example, a gaseous effluent from the first pyrolysis means and a small amount of air in a chamber filled with coke, thereby reducing the gas. Atmosphere and a temperature condition under which dioxin is decomposed may be formed. Further, as described above, the chamber is heated to a temperature at which dioxin is decomposed by burning the fuel gas and the air, and gaseous emission from the first pyrolysis means is introduced into the chamber. Is also good.

The chamber may be provided with catalytic cracking means such as a catalyst as described above.

Further, if necessary, the reforming means or the second
May be provided with a temperature adjusting means for adjusting the temperature and oxygen concentration in the system and an oxygen concentration measuring means. As the oxygen concentration adjusting means, an oxygen concentration sensor and a carrier gas introduction system as described above may be used. Further, a hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

The gaseous effluent contained in the gaseous effluent discharged from the object to be treated is reduced in molecular weight by the reforming means or the second pyrolysis means, and hydrogen, methane,
Changes to carbon monoxide and the like.

In the first pyrolysis means, the reforming means or the second pyrolysis means, and the cooling means, the gaseous effluent contains chlorine or the like. The apparatus may use Hastelloy or a titanium alloy instead of stainless steel as needed.

In the processing apparatus of the present invention, the gaseous effluent reformed or pyrolyzed at the second temperature, which is provided in connection with the reforming means or the second pyrolyzing means, is supplied to the gaseous effluent. A quenching means for quenching to a third temperature is provided so that an increase in dioxin concentration in the effluent is suppressed.

That is, in the reforming means or the second pyrolysis means, the concentration of dioxin in the gaseous effluent reformed or pyrolyzed at the second temperature is such that the second temperature is such that the dioxin is decomposed. The temperature, and the chlorine of the hydrocarbon compound which is decomposed or reformed at this temperature is extremely low because it is made mineral by the reducing atmosphere. Therefore, in order to prevent the generation and resynthesis of dioxin from this state, the dioxin concentration in the gaseous emission is rapidly cooled to the third temperature so as to suppress the increase as much as possible. The third temperature may be set to a temperature that does not cause a dioxin generation reaction. For example, from a gaseous effluent in which dioxin is decomposed (the temperature is not necessarily the same as the temperature in the reforming means or the second pyrolysis means, but may be any temperature at which dioxin is decomposed), preferably 150 ° C. or less Is rapidly cooled to 100 ° C. or lower, more preferably 50 ° C. or lower, thereby suppressing the generation and resynthesis of dioxin.
At this time, it is preferable to cool the gaseous emission to the third temperature in the shortest possible time. This is about 200 ° C to about 4
At 00 ° C., dioxin is easily generated and resynthesized, and the gaseous effluent is rapidly cooled to the third temperature to shorten the time for which dioxin is generated and stayed in a temperature range in which dioxin is easily resynthesized. The dioxin concentration in the gaseous effluent can be reduced. Therefore, the cooling of the gaseous emission in the cooling means is preferably carried out rapidly, preferably within about 10 seconds.

As such a cooling means, contact cooling may be performed by directly injecting a coolant such as water or cooling oil into the gaseous emission. At this time, if an alkaline powder such as lime powder is injected into the gaseous emission, the gaseous emission is neutralized. Also, for example, HCl in gaseous emissions
Is diffused on the solid surface in contact with the lime powder, so that the production and resynthesis of dioxin can be suppressed.

As described above, the first thermal decomposition means, the reforming means or the second thermal decomposition means, and the cooling means change the gaseous emission from the object to be treated into hydrogen, methane, carbon monoxide and the like. Also, the dioxin concentration in the gaseous effluent is greatly reduced. In the present invention, the decomposition of the object to be treated, the decomposition of the gaseous effluent from the object to be treated are performed in a plurality of stages of a first pyrolysis means and a reforming means or a second pyrolysis means, and By maintaining such a decomposition means under reducing conditions, the generation of dioxin is suppressed.

When the gaseous effluent cooled by the cooling means contains a halide, SOx, NOx, etc., the gaseous effluent is washed and desulfurized by washing means and desulfurizing means. You may. Further, a filter means using activated carbon may be provided. Further, the gaseous emission cooled by the cooling means may be introduced into a neutralization reaction filtering means such as a bag filter.
Between the cooling means and the neutralization reaction filtration means, slaked lime, a filter aid (eg, zeolite,
Particles having a high porosity such as activated carbon) may be blown into the gaseous exhaust gas stream.

The gaseous effluent discharged from the object to be treated thus treated may be used as a heat source for heating the first pyrolyzing means, or supplied to a gas turbine generator to generate electric power. It may be obtained. Further, this electric power may be used as a heat source or the like of the processing apparatus of the present invention.

Next, the processing of the pyrolysis residue of the object to be processed pyrolyzed by the first pyrolysis means will be described.

The processing apparatus of the present invention comprises a means for decomposing and recovering the resin and a means for separating and recovering metal in order to process an object having resin and metal as a part of the constituent material. The reduced-pressure heating means is means for separating and collecting metal from the residue of the object to be treated thermally decomposed by the first thermal decomposition means.

The resin component of the object to be treated is almost decomposed by the first thermal decomposition means, and the gaseous emission is treated as described above. Further, the oxygen concentration in the first thermal decomposition means is controlled, and the metal in the object to be treated is held on the object to be treated without being substantially oxidized and almost not being vaporized. On the other hand, most of the resin of the object to be treated remains as carbide as a result of thermal decomposition. In the present invention, the first
The object to be processed, which has been processed by the thermal decomposition means, is transferred from the first thermal decomposition means to the reduced pressure heating means.

The reduced-pressure heating means provided in the processing apparatus of the present invention includes a first thermal decomposition means and a temperature adjusting means and a pressure adjusting means for selectively vaporizing a metal in an object separated by an openable / closable partition. A first hermetic zone, and first collecting means for collecting vaporized metal from an object connected to the first hermetic zone.

As the temperature adjusting means, a heating means and a temperature measuring means may be used. As the heating means,
Various types of convection heating, radiation heating, and the like may be selected as needed, or may be used in combination. As the heat source, a fuel gas obtained by processing gaseous emission or electric power generated by the fuel gas may be used as the heat source. For example, resistance heating such as a sheathed heater may be used, or heavy oil or light oil may be burned. Further, an induction heating means may be used. Various temperature sensors may be used as the temperature measuring means.

In the first thermal decomposition means, the object to be treated is thermally decomposed under temperature and pressure conditions such that the metal in the object to be treated is hardly oxidized or vaporized, and is mainly vaporized (including a substance which has been vaporized after being oiled). Or carbonize. Then, the gaseous effluent is treated by the reforming means or the second pyrolysis means as described above.

The balance can change. For example, when the constituent metals of the object to be treated are mixed in the gaseous effluent, the gas is collected by providing a cooling step, a bag filter, or a cyclone separating means as needed in the path, and collecting the first heat. What is necessary is just to process by the reduced pressure heating means with the thermal decomposition residue of a decomposition means.

As the pressure adjusting means, an exhaust means or a pressurizing means and a pressure measuring means may be used. Various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used as the exhaust means. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube, a Pirani gauge, or the like.

Further, a purge area may be provided between the first thermal decomposition means and the first hermetic area of the reduced pressure heating means so as to be connected to the first hermetic area. The purge area may be provided with a pressure adjusting means such as an exhaust system or a pressurizing system, and a temperature adjusting means for preheating or cooling the object to be treated. Further, a carrier gas introduction system for gas replacement in the system may be provided, and the carrier gas introduction system may also serve as a pressurization system.

The object to be processed is introduced from the thermal decomposition means into the first hermetic zone via the purge zone. By providing the purge region, the first hermetic region is isolated from the outside of the apparatus when introducing the processing target object into the first hermetic region.
Further, since the inside of the first hermetic zone is constantly evacuated to maintain the reduced pressure, the load on the vacuum pump is reduced.

The reduced pressure heating means may have a plurality of hermetic regions. For example, by connecting to the first hermetic zone,
May be provided.

Further, a purge region may be provided adjacent to the first hermetic region or the second hermetic region. The object to be processed is taken out of the apparatus from the first hermetic zone or the second hermetic zone through the purge zone.

By providing the purge area after the second hermetic area, the first or second hermetic area is isolated from the outside when the object to be processed is taken out of the first or second hermetic area. . Therefore, the load on the vacuum pump is reduced because the inside of the first or second hermetic region is constantly evacuated to maintain a reduced pressure. Further, the object can be kept shut from the outside air until the temperature of the heated object to be processed is cooled to a temperature at which the object is not oxidized even under atmospheric pressure.

In other words, the purge area functions as a buffer area between the outside of the decompression heating means and the first and second hermetic areas from the viewpoint of preserving the decompression heating means and the object to be processed.

The first hermetic region and the second hermetic region of the reduced pressure heating means are separated from each other by a partition which can be opened and closed. This partition keeps the airtightness of each region and the heat insulation of each region. For example, a vacuum door for maintaining airtightness and a heat insulating door for maintaining heat insulation may be used in combination. If the first and second hermetic regions are separated by a partition wall such as a heat insulating door-a vacuum door-a heat insulating door, the airtightness and the heat insulating property of each region are maintained. By arranging the heat insulating door between the vacuum door and the area separated by the vacuum door, the vacuum door can be protected from a thermal load even when a large thermal load is applied to the vacuum door. Can be. In this case, the vacuum door is protected from the heat of the first and second hermetic zones.

Such a partition is naturally disposed between the outside of the decompression heating means and the purge region, between the purge region and the first hermetic region, and between the second hermetic region and the purge region. However, what kind of partition is provided may be designed as needed. For example, when the thermal load of the purge chamber is small, a vacuum door may be provided.

In the first hermetic region into which the pyrolysis residue of the object to be treated or the solid emission separated from the gaseous emission of the object to be treated is introduced, the metal in the object to be treated is vaporized. Temperature and pressure conditions are adjusted. The temperature and pressure conditions may be set in advance, or the measured values of the temperature and the pressure may be fed back to the heating unit, the pressure adjusting unit, and the like for control. The same applies to the second hermetic zone.

In the first hermetic region into which the object to be processed is introduced, the temperature and pressure conditions are adjusted so that the metal in the object to be processed is vaporized. When the pressure in the first hermetic zone is reduced, the metal in the object to be processed evaporates at a temperature lower than that under normal pressure. Further, since the oxygen concentration is also reduced and the first hermetic region becomes a non-oxidizing atmosphere, the metal state of the vaporized metal is maintained.

For example, the boiling point of Zn at 760 Torr is 1203 K, but the boiling point at 1 Torr is 743 K.
K, the boiling point at 10 @ -4 Torr is 533K.

Further, for example, 760 Torr (1a) of Pb
tm) is 2017K, but 10 -1 To
The boiling point at rr is 1100K, and the boiling point at 10-3 Torr is 900K.

Thus, the metal is selectively vaporized in the first hermetic zone according to the temperature and pressure conditions.

Also, when introduced into the first hermetic zone,
Since most of the resin of the object to be processed is carbide, even if metal is vaporized from the object to be processed, almost no decomposition product gas is generated. Therefore, the vaporized metal is recovered with high purity in the metal state, and the load on the vacuum pump is reduced.

The condensing means is for condensing and collecting the metal vaporized in the first hermetic zone.

For example, a recovery chamber having an exhaust system may be connected to the first hermetic region, and the metal vaporized in this chamber may be cooled to a melting point or lower to condense and recover. The inside of the recovery chamber may have, for example, a countercurrent structure or a spiral structure. Alternatively, a valve or an openable / closable partition may be provided between the collection chamber and the first hermetic region and between the collection chamber and the exhaust system. That is, when the metal vaporized from the object to be processed is introduced into the recovery chamber, the recovery chamber may be closed and cooled, and the metal may be condensed and recovered.

Regardless of whether the vaporized metal is continuously condensed and recovered, or the case where the vaporized metal is condensed and recovered in a batch process, the recovery efficiency is increased by increasing the residence time of the vaporized metal in the recovery chamber.

Further, N2 or a rare gas may be introduced as a carrier gas into the first hermetic zone. The vaporized metal is efficiently introduced into the collection chamber by the carrier gas.

The condensing means may have a plurality of systems. The same metal may be recovered by a plurality of condensing means, or the temperature and pressure in the first hermetic zone may be adjusted stepwise to selectively vaporize the plurality of metals, respectively, to thereby provide a plurality of systems of condensing means. May be switched and collected.

The condensing means may be connected in multiple stages.

As described above, the reduced pressure heating means provided in the processing apparatus of the present invention is for processing an object having resin and metal as constituents. The reduced-pressure heating means included in the processing apparatus of the present invention includes a first thermal decomposition means for decomposing the constituent resin of the object to be treated, provided before the decompression and heating means for vaporizing the constituent metal of the object to be treated, so that the resin and This enables processing of an object having metal as a constituent material. The gaseous effluent from the object to be treated, which is discharged from the inside of the pyrolyzing means, is supplied to the reforming means or the second
The thermal decomposition means and the cooling means are used as described above. Therefore, sufficient heating and decompression can be performed by the reduced pressure heating means so that the metal is vaporized. Also, the first
In the thermal decomposition means, the object to be treated is decomposed under the condition that the metal of the object to be treated is not so oxidized or vaporized, so that the metal is effectively separated and recovered from the object to be treated by the reduced pressure heating means.

The reduced-pressure heating means provided in the processing apparatus of the present invention comprises: a first thermal decomposition means provided with a temperature adjusting means for evaporating a metal contained in the object to be processed from the object to be processed; A temperature adjusting means and a pressure adjusting means for selectively vaporizing a metal in the object to be processed, which is separated from the first hermetic region by a partition which can be opened and closed.
Condensing means connected to the first hermetic region and condensing the metal vaporized from the object to be processed, and a second means connected to the second hermetic region and recovering the vaporized metal from the object to be processed May be provided.

As described above, the reduced pressure heating means may be provided with a plurality of hermetic regions for vaporizing metals contained in the object to be treated such as the pyrolysis residue of the first pyrolysis means. That is, when processing an object having the first metal and the second metal as constituents, the first thermal decomposition means thermally decomposes the object to be processed so that the first and second metals are not oxidized too much. Temperature adjusting means and pressure adjusting means for selectively vaporizing the first metal in the object to be treated separated by the first pyrolyzing means and the openable / closable partition. A first gas-tight region having a first gas-tight region and a temperature control device and a pressure control device for selectively vaporizing a second metal in an object separated from the first gas-tight region by a partition which can be opened and closed. A second hermetic zone, first condensing means for condensing the first metal vaporized from the object connected to the first hermetic zone, and a first condensing means connected to the second hermetic zone and vaporized from the object to be processed. And second condensing means for recovering the second metal. It may be then you. The feature of the reduced pressure heating means is that a plurality of second hermetic regions are provided. By providing a plurality of second hermetic regions, a plurality of metals contained in the object are selectively vaporized and condensed and recovered.

Further, the decompression and heating means provided in the processing apparatus of the present invention includes one airtight area provided with a temperature adjusting means and a pressure adjusting means, and an airtight area connected to the airtight container. First condensing means for recovering the first metal vaporized from the object when the temperature and pressure in the hermetic container are adjusted so that the first metal is selectively vaporized, and connected to the hermetic container. Second condensing means for recovering the vaporized second metal from the object when the temperature and pressure in the hermetic container are adjusted so that the second metal in the object is selectively vaporized. You may make it. The aforementioned reduced pressure heating means,
While a plurality of hermetic regions having different conditions such as temperature, pressure, and oxygen concentration conditions in the hermetic container are provided, this reduced-pressure heating means has a plurality of condensing means according to the conditions in one hermetic container. Heating means provided in the processing apparatus.

As the temperature adjusting means in the airtight container, that is, the temperature adjusting means for the object to be treated, the heating means and the temperature sensor may be used in the same manner as described above. Regarding heating, various heating means such as convection and radiation may be selected or used in combination as necessary. As for the pressure adjusting means, the exhaust means, the pressurizing means, and the pressure measuring means may be used as in the case of the above-described reduced pressure heating means. Various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used as the exhaust means. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube, a Pirani gauge, or the like. Condensing means may be provided in the same manner as described above.

As the first and second condensing means, for example, a recovery chamber having an exhaust system is connected to an airtight area, and the metal vaporized in this chamber is cooled to a melting point or lower to condense and recover. Is also good. The inside of the recovery chamber may have, for example, a countercurrent structure or a spiral structure. Alternatively, a valve or an openable / closable partition may be provided between the collection chamber and the first and second hermetic regions and between the collection chamber and the exhaust system. That is, when the metal vaporized from the object to be processed is introduced into the recovery chamber, the recovery chamber may be closed and cooled, and the metal may be condensed and recovered.

For example, an object to be treated containing lead is held in the decompression heating means, and a temperature adjustment means for adjusting the temperature in the decompression heating means, a pressure adjustment means for adjusting the pressure of the decompression heating means, Control means for controlling the temperature adjusting means and the pressure adjusting means such that the lead in the object to be treated is selectively vaporized with the temperature and pressure of the object, and the lead vaporized from the object to be treated, which is connected to the reduced pressure heating means. If the recovery means for condensing is provided, lead can be recovered from the pyrolysis residue of the object to be treated (including solid and liquid components separated from the gaseous emission).

The decompression and heating means of this processing apparatus introduces the object to be treated into the hermetic container and adjusts the temperature, pressure or oxygen concentration in the hermetic container to selectively vaporize the lead in the object to be treated. To separate and collect from the object to be treated. Further, metals other than lead may be separated and recovered from the object to be treated by controlling the inside of the hermetic container at a predetermined temperature and pressure condition such that the metals are selectively vaporized.

Further, even when the object to be treated contains lead and resin, the object to be treated is first subjected to the first thermal decomposition means under conditions that lead is not vaporized or oxidized too much. By thermal decomposition, the resin portion is decomposed (gasification, oilification, carbideization), and then the lead is selectively vaporized by the reduced pressure heating means, and the vaporized lead can be recovered in a metal state. By thermally decomposing the constituent resin of the object to be treated by the first thermal decomposition means, lead in the object to be treated can be positively collected.

The processing apparatus of the present invention may be provided with control means for controlling such temperature control means, pressure control means or oxygen concentration control means. This control means thermally decomposes the object to be treated while maintaining, for example, the temperature and oxygen concentration in the first thermal decomposition means so that the metal in the object to be treated is not oxidized. Control is performed so that the metal is selectively vaporized. This control means measures the state of the airtight region with the above-described temperature sensor, pressure sensor, oxygen concentration sensor, and the like,
The measured value may be fed back to a heating means, an exhaust system, a pressurizing system, a carrier gas introducing system, or the like to optimize the state in the airtight container.

In such control, the parameters of the heating means, the exhaust system, the pressurizing system, the carrier gas introducing system, etc. in the hermetic container are optimized by inputting the parameters of the state of the decompression heating means in the hermetic region. A control device that outputs a signal for performing such an operation may be provided. This control circuit may be stored as a program in the storage means of the control device. These control means may be controlled integrally with the first thermal decomposition means, the reforming means, the second thermal decomposition means, the cooling means and the like.

The thermal decomposition step in the treatment method of the present invention comprises:
This is a step of heating the object to be treated under oxygen concentration control to thermally decompose the object to be treated.

The resin such as plastic starts melting at about 50 ° C., decomposes at about 180 to 500 ° C., and mainly emits C1 to C16 hydrocarbon gases. The gaseous emission generated by the thermal decomposition of these resins and the like is treated so as not to generate dioxin as described above, and is recycled as a fuel gas.

As described above, the thermal decomposition of the object to be treated is preferably performed in a state where the oxygen concentration in the chamber is adjusted. The oxygen concentration may be adjusted by introducing a carrier gas such as Ar, or may be adjusted by the total pressure in the chamber of the first thermal decomposition means.

By adjusting the oxygen concentration in the first pyrolysis step and keeping the system in a reducing atmosphere, oxidation of metals such as lead can be prevented and generation of dioxins can be suppressed. Further, by adjusting the oxygen concentration separately from the total pressure, it is possible to prevent oxidation of the metal without lowering the thermal conductivity in the first thermal decomposition means, and to improve the thermal decomposition efficiency of the object to be treated and the gas. The efficiency of collecting waste waste is improved. In some cases, the first gas is introduced by introducing a carrier gas such as Ar.
The resin may be decomposed by applying pressure to the thermal decomposition means.

In the first thermal decomposition means, it is preferable that the resin in the object to be treated is completely thermally decomposed. However, if the resin can be decomposed to such an extent that the separation and recovery of the metal by the reduced pressure heating means is not adversely affected. Good. Most of the water and oil in the object to be treated are removed from the object to be treated in the thermal decomposition step, so that there is no adverse effect on the step of vaporizing the metal.

For example, lead (metal) exhibits a vapor pressure of 760 mmHg at about 1745 ° C., whereas lead oxide exhibits a lower vapor pressure of 760 mmHg at 1472 ° C. Therefore, by controlling the oxygen concentration of the first thermal decomposition means, it is possible to prevent the metal lead from being oxidized to lead oxide, thereby preventing the lead from being scattered, and more positively recovering the lead by the reduced pressure heating means. Can be.

When the object to be treated is thermally decomposed while maintaining the metal in the object to be treated so as not to be oxidized so much, the metal contained in the object to be treated is vaporized. Then, the metal is separated from the object to be treated and recovered.

When a plurality of metals are contained in the object to be processed, the target metal is selectively vaporized by a difference in vapor pressure.

For example, the temperature at which lead vaporizes varies depending on the pressure in the chamber. Under atmospheric pressure, for example, when heated to 1400 ° C., the vapor pressure of lead is 84 mmHg, whereas the vapor pressure of iron, copper, and tin does not reach 1 mmHg. Therefore, by heating the object to be processed to about 1400 ° C., almost only lead vapor can be selectively generated from the object to be processed.

At atmospheric pressure, for example, the vapor pressure of lead at 1740 ° C. is 760 mmHg, whereas the vapor pressure of tin is 15 mmHg and the vapor pressure of copper does not reach 3 mmHg. Therefore, by heating the object to about 1740 ° C., almost only lead vapor can be selectively generated from the object.

Further, by reducing the pressure in the airtight container, the metal in the object to be treated can be vaporized at a lower temperature.

The pressure in the hermetic zone of the reduced pressure heating means is set to 10 -1.
By adjusting to Torr, it is possible to selectively generate almost only lead vapor from the object by heating to about 1100K. In addition, the pressure in the hermetic zone is 10-3T
If it is adjusted to orr, it is possible to selectively generate almost only lead vapor from the object by heating to about 900K. Further, the pressure in the hermetic zone is set to 10 -4 To
By adjusting to rr, it is possible to selectively generate almost only lead vapor from the object by heating to about 700K. The vapor of a metal such as lead thus selectively generated is recovered as a metal by a condensing means cooled to a temperature lower than the melting point of the metal.

When the vaporized metal is condensed and crystallized and recovered from the object to be treated as described above, the recovery rate is increased by setting a longer residence time of the vapor lead in the apparatus. Therefore, the structure of the condensing means is preferably a countercurrent structure or a spiral structure.

Further, by flowing a rare gas such as N 2 or Ar as a carrier gas from the airtight region of the reduced pressure heating means to the condensation means, metal vapor can be more selectively recovered.

When the first thermal decomposition step and the reduced pressure heating step are performed continuously, the input energy can be largely suppressed. That is, since the thermal conductivity of the gas decreases as the pressure decreases, it is necessary to input more energy as the pressure in the airtight container is reduced in the reduced pressure heating step. In the processing apparatus and the processing method of the present invention, for example,
If the first thermal decomposition step is used as a preheating stage of the reduced pressure heating means for vaporizing metal, the thermal decomposition means and the reduced pressure heating means are connected so as to suppress the cooling of the object to be treated. Energy input in the process can be greatly saved. Further, it is possible to prevent the object to be treated heated by the first thermal decomposition means from being oxidized and burned in the atmosphere. For example, the first thermal decomposition means and the hermetic region of the reduced pressure heating means may be connected via a purge chamber.

Further, the decompression and heating means provided in the processing apparatus of the present invention comprises an airtight region for holding a processing object having a first portion and a second portion joined by a metal inside, and a temperature in the airtight region. Temperature adjusting means for adjusting, pressure adjusting means for adjusting the pressure in the airtight area, and control means for controlling the temperature adjusting means and the pressure adjusting means so that the metal evaporates the temperature and the pressure in the airtight area. It may be provided.

Further, an airtight region for holding an object to be processed having a first portion and a second portion joined by an alloy having a first metal and a second metal therein, and a temperature in the airtight region. Temperature adjusting means for adjusting the pressure, pressure adjusting means for adjusting the pressure in the airtight area, and control means for controlling the temperature adjusting means and the pressure adjusting means so that the alloy vaporizes the temperature and the pressure in the airtight area. May be provided.

For example, Zn, Cd, Hg, Ga, In, T
At least one element of l, Sn, Pb, Sb, Bi, Ag or In may be separated or recovered from the object to be treated as the first metal.

By adjusting the temperature, pressure, and oxygen concentration in the hermetic zone, other metals can be separated and recovered in the metal state (FIGS. 13 and 1).
8, see FIG. 19). This applies to all parts of the present invention unless otherwise specified.

The thermal decomposition residue of the object to be treated having the first part and the second part thermally decomposed by the first thermal decomposition means is introduced into the airtight area of the reduced pressure heating means, and the airtight area is sealed.
The temperature and the pressure in the hermetic region may be adjusted so that the metal joining the first portion and the object to be processed having the second portion is vaporized.

When the joining metal is an alloy having a first metal and a second metal, first, the temperature, the pressure, and the pressure in the hermetic region are set so that the first metal in the alloy is selectively vaporized. Then, the temperature and pressure in the hermetic zone may be adjusted so that the second metal in the alloy is vaporized.

For example, a mounting board comprising a substrate having a resin as a constituent material and an electronic component joined by an alloy having a first metal and a second metal is used as the first pyrolyzing means. The temperature and oxygen concentration in the first pyrolyzing means are controlled so that the first and second metals of the alloy are not vaporized and the resin is thermally decomposed. Then, the thermal decomposition residue of the mounting substrate is introduced into the reduced pressure heating means, and the first residue in the alloy is removed.
The temperature and pressure in the hermetic region of the reduced-pressure heating means are controlled so that the metal of the second type is selectively vaporized, and then the temperature and pressure in the hermetic region are controlled such that the second metal in the alloy is vaporized. You may do so.

As described above, according to the present invention, for example, a printed circuit board and various electronic components have a portion joined by a metal or an alloy, such as a mounting board joined by a solder alloy such as Pb-Sn. The joining of the object to be treated can be released, and even when a harmful metal such as lead is contained in the joint alloy, these metals can be separated and recovered from the object to be treated.

That is, the object to be treated thermally decomposed by the first pyrolyzing means is introduced into the airtight area of the decompression and heating means, and the temperature, pressure, oxygen concentration and the like in the airtight area are adjusted, and the metal Alternatively, the bonding can be released by vaporizing the alloy. The vaporized metal may be recovered.

When the object to be treated has a resin as a constituent material, first, the resin portion is thermally decomposed by the first thermal decomposition means, and is vaporized, oiled, and carbonized. The decomposition of the resin may be performed by adjusting the temperature and the oxygen concentration in the first thermal decomposition means to conditions such that the metal does not oxidize or vaporize too much. Even when the metal is vaporized from the object to be processed, the metal may be condensed and collected by, for example, a cooling unit and introduced into the reduced pressure heating unit.

Next, the temperature and pressure in the hermetic zone are adjusted to selectively vaporize the bonding metal in the object to be processed. When a plurality of metals (elements) are contained in the object to be treated,
The temperature and pressure in the hermetic zone may be adjusted according to each metal so that each metal is selectively vaporized.

If the object to be processed is joined with a metal or an alloy other than the mounting substrate, the joining can be released.

For example, the mounting substrate is introduced into the processing apparatus of the present invention without crushing, the oxygen concentration is adjusted, and
Pyrolysis at a temperature that does not evaporate (e.g., 450-500
C) to decompose the constituent resin of the mounting board. Then, the thermally decomposed mounting substrate is introduced into a reduced pressure heating means, and heated so as to evaporate the lead to vaporize the lead (for example, 10 -3 Torr).
In this case, tin may be vaporized, and the mounting board may be separated into an electronic component and a circuit board (the board on which the electronic component is mounted is referred to as a circuit board in this case) and collected.

Even if a metal such as lead is vaporized by the first thermal decomposition means, a means for separating the metal may be provided in the gaseous emission treatment system.

Further, for example, after the mounting substrate is introduced into the processing apparatus of the present invention and lead is collected, the lead is further added to, for example, 973K.
By heating to the extent, Zn, Sb, etc. may be vaporized and collected.

Further, for example, by heating to about 1773 K, Au, Pt, Pd, Ta, Ni, Cr, Cu, A
l, Co, W, Mo, etc. may be vaporized and collected. The solder alloy is not limited to Pb-Sn. For example, Ag-Sn, Zn-Sn, In-Sn, Bi-S
A so-called Pb-free solder such as n, Sn-Ag-Bi, Sn-Ag-Bi-Cu or the like may be used. In addition, it may be joined by an alloy other than these or a simple metal.

Further, according to the present invention, the object to be treated in which the resin and the metal are integrated can be effectively treated, that is, the object to be treated in which the resin and the metal are integrated is sent to the first thermal decomposition means. First, the resin part is thermally decomposed, vaporized, oiled, and carbonized. The decomposition of the resin may be performed by adjusting the temperature, the oxygen concentration or the pressure of the first thermal decomposition means to a condition such that the metal does not oxidize or vaporize too much.

When it is still difficult to separate the metal from the object to be treated by this operation alone, the metal is then introduced into the decompression heating means to adjust the temperature and pressure in the hermetic zone to adjust the metal in the object to be treated. Is selectively vaporized. When a plurality of metals (elements) are included in the object to be processed, the temperature and pressure in the hermetic region may be adjusted according to each metal, and the metal may be selectively vaporized. As described above, the apparatus and the processing method of the present invention can process not only a processing target object having a resin and a metal but also a processing target object in which a resin and a metal are integrated. Examples of the object to be treated having such a resin and a metal include, for example, an aluminum foil laminated with a plastic film such as a packaging container for a retort food, a printed board in which a resin and a metal such as copper and nickel are integrated, Examples include a flexible substrate or TAB film carrier, IC, LSI, resistor, shredder dust, and the like.

To prevent the constituent metals of the object to be treated from being oxidized or vaporized as a whole, for example, the pressure in the hermetic zone may be controlled to heat the waste, The object to be processed may be heated by controlling the oxygen concentration in the region. To control the oxygen concentration, the partial pressure of oxygen may be adjusted by adjusting the total pressure in the hermetic zone, or a gas such as nitrogen gas or a rare gas may be introduced into the hermetic zone to control the oxygen concentration. May be adjusted. If the oxidation of the resin portion progresses rapidly due to the heating of the object to be treated, that is, if it burns, not only the metal portion integrated with the resin portion is also oxidized to become an oxide and the utility value decreases, but also as described above. Care must be taken because this will lead to the generation of dioxins.

In the case where the metal portion is composed of a plurality of metals, it may be further heated to selectively evaporate and recover each element.

The decomposition product gas of the resin of the object to be treated may be condensed and collected, or may be collected by, for example, an oiling device. The hydrogen gas may be recovered by adsorption or the like, or when a halogenated hydrocarbon or the like is generated, it may be decomposed using a catalyst or the like, for example.

When the resin contains chlorine such as a polyvinyl chloride resin, for example, between the first thermal decomposition means and the reforming means or the second thermal decomposition means, or between the reforming means and the second thermal decomposition means. In a gaseous effluent treatment system such as between the thermal decomposition means and the cooling means, for example, it may be brought into contact with, for example, iron heated to a high temperature and recovered as iron halide.

As an example of the treatment, the treatment of an aluminum foil (resin-coated aluminum foil, hereinafter the same) laminated with a plastic film used for various packaging containers will be described.

When the first temperature is lower than 400 ° C., decomposition such as carbonization and oilification of the resin portion is insufficient. Further, aluminum is melted when heated to 650 ° C. or more, so the first portion is set to about 400 to 650 ° C. and thermally decomposed, whereby the resin portion is decomposed (vaporized, oiled, carbonized), The aluminum foil is recovered in a metal state.

[0151] The pressure in the first thermal decomposition means is set to 10-2 Torr.
It is more preferable to reduce the pressure to about r or less, or to introduce a gas such as Ar to adjust the oxygen concentration to perform thermal decomposition.
It is more preferable that the first temperature is set to 550 to 600 ° C.

The present invention can also process an object to be processed such as a circuit board in which resin and copper are integrated. For example, a circuit board on which resin and copper are laminated is thermally decomposed by a first pyrolyzing means, and the resin component is thermally decomposed and then introduced into a reduced pressure heating means. The pyrolysis residue is further heated so that the copper of the circuit board is melted under reduced pressure and agglomerated by the surface tension. Then, by removing the object to be treated from the reduced pressure heating means through the purge chamber, separation of copper and carbide becomes easy.

[0153]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a view schematically showing an example of a processing apparatus according to the present invention. FIG. 2 is a diagram schematically illustrating the configuration of the processing apparatus of the present invention illustrated in FIG.

The processing apparatus 10 is connected to a pyrolysis furnace 20 as first pyrolysis means for pyrolyzing an object to be processed containing a resin and a metal at a first temperature, and the pyrolysis furnace 2. A gas decomposer 30 that reforms or thermally decomposes a gaseous effluent generated from the object to be treated at a second temperature at which dioxin is decomposed; and a gas decomposer 30 connected to the gas decomposer 30. A cooling tower 40 which is a cooling means for rapidly cooling the gaseous effluent to a third temperature so as to suppress an increase in dioxin concentration in the gaseous effluent reformed at the second temperature.
And a vacuum heating furnace 50 for heating a residue generated by the thermal decomposition of the object to be treated, a solid separated from the gaseous effluent, and the like under a reduced pressure so that the metal contained in the residue is vaporized.
And a recovery chamber 60 for condensing vaporized metal from the residue.
Is provided.

That is, the processing apparatus of the present invention introduces an object to be treated containing a resin and a metal into a pyrolysis furnace and thermally decomposes the gas. The main part of the tower is treated by a gaseous emission treatment system consisting of a tower to render it harmless and clean gas fuel. It is separated and collected.

The pyrolysis furnace 20 is for pyrolyzing the object to be treated at a first temperature at which the object to be processed is thermally decomposed under the control of oxygen concentration. For example, gaseous emissions from shredder dust, waste circuit boards and the like are removed. Extract. Here, the gaseous emission basically consists of an exhaust gas, but does not exclude the case where the exhaust gas contains solid fine particles, liquid fine particles, and the like mixed therein.

FIG. 3 is a diagram schematically showing one example of the structure of the thermal decomposition furnace 20. As shown in FIG. The pyrolysis furnace 20 includes a pyrolysis chamber 21 for pyrolyzing an object to be treated and a combustion chamber 22 for heating the pyrolysis chamber 21, and burns a fuel gas introduced from a fuel gas pipe 23 in a combustion chamber 24. ,
The combustion heat heats the inside of the pyrolysis chamber 21. The pyrolysis furnace 20 is provided with temperature control means and oxygen concentration control means (not shown). The temperature of the pyrolysis chamber 21 is maintained at a first temperature, and the oxygen concentration is controlled so that the pyrolysis is performed in a reducing atmosphere. Is adjusted.

As the temperature adjusting means for adjusting the first temperature of the thermal decomposition furnace 20, a heating means and a temperature measuring means may be used. As the heating means, various types of convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber. Further, the gas discharged from the resin or the like of the object to be treated is reformed, made harmless, neutralized, and then reused as a fuel gas as a heat source of the processing apparatus of the present invention such as the pyrolysis furnace 20. Is also good. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator and converted into electric power, and the electric power is used for operation of the processing apparatus of the present invention including the pyrolysis furnace 20. Is also good.

Various temperature sensors may be used as the temperature measuring means. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. In order to cut off, it is preferable to keep the pyrolysis furnace 20 under reducing conditions. For example, by thermally decomposing an aromatic hydrocarbon compound containing chlorine under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, generation of dioxin is suppressed.

In this pyrolysis furnace 20, the object to be treated is
50 ° C to about 600 ° C, more preferably 400 to 55 ° C
It is designed to thermally decompose in a temperature range of about 0 ° C. The first temperature may be adjusted as necessary depending on the properties and configuration of the object to be processed. Pyrolysis furnace 20
By setting the first temperature to a relatively low temperature, it is possible to prevent evaporation of heavy metals and the like of the object to be processed. Separation and recovery can be performed more efficiently in the vacuum heating furnace 50 in the subsequent stage. Also, the load on the pyrolysis furnace 20 is reduced, the service life can be extended, and the processing cost can be reduced.

As the oxygen concentration adjusting means, for example, an oxygen concentration sensor as an oxygen concentration measuring means and a carrier gas introduction system may be used.

As the oxygen concentration sensor, a so-called zirconia sensor using, for example, zirconia (zirconium oxide) may be used, or the absorption of, for example, CO and CO2 may be measured by infrared spectroscopy. Furthermore, G
C-MS may be used, and may be selected as needed or used in combination.

As the carrier gas, a rare gas such as Ar may be used. The carrier gas not only regulates the oxygen concentration in the pyrolysis furnace 20 but also guides the gas to the gas decomposer 30 efficiently. Further, the pressure adjusting means may also be used.

The pyrolysis furnace 20 only needs to be capable of pyrolyzing the object to be treated under oxygen concentration control. For example, a rotary kiln may be used.

[0166] A shredder 25 may be provided in a stage preceding the pyrolysis furnace 20 (see Fig. 10). The object to be treated brought from outside the apparatus may be crushed and separated by a shredder and then introduced into the pyrolysis furnace 20, or may be introduced into the pyrolysis furnace 20 without crushing. When the object to be processed is a waste circuit board, it is preferable to introduce the object into the pyrolysis furnace 20 without crushing.

In the thermal decomposition furnace 20 into which the object to be treated is introduced, the state of the metal in the object to be treated is minimized and the mineralization of chlorine combined with the organic compound during the thermal decomposition of the resin is minimized. Thus, the temperature and oxygen concentration conditions may be adjusted. The temperature and oxygen concentration conditions may be set in advance, or the measured values of the temperature and the oxygen concentration may be fed back to the heating unit, the oxygen concentration adjusting unit, and the like for control. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor may be used.

The pyrolysis chamber 21 of the pyrolysis furnace 20
The internal pressure may be controlled. For example, when the pressure in the thermal decomposition chamber 21 is reduced, the oxygen concentration also decreases, and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, the resin hardly generates oxygen even when decomposed. Further, decomposition products of the resin are easily vaporized.

On the other hand, when the pressure is reduced, the thermal conductivity in the pyrolysis chamber 21 decreases. However, if the inside of the pyrolysis furnace 20 is in a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or under pressure. Therefore, if the inside of the thermal decomposition chamber 21 is a non-oxidizing atmosphere, pressurization is possible, and the thermal conductivity in the system is improved.

The gaseous effluent discharged from the object to be treated is introduced into the gas decomposer 30 through a pipe. In the processing apparatus 10 illustrated in FIG. 1, the thermal decomposition furnace 20 and the gas decomposer 3
Although a cyclone separator 29 for separating solid emissions such as dust in the gaseous emission is disposed between 0 and 0, this cyclone separator 29 may be provided if necessary.

The gas decomposer 30 thermally decomposes or reforms the gaseous emission discharged from the object to be treated at a second temperature higher than the first temperature. Here, pyrolysis or reforming refers to converting a hydrocarbon compound contained in a gaseous effluent discharged from an object to be treated into lower-molecular hydrogen,
It means to change to methane, carbon monoxide, etc. In addition, hydrorefining treatment (kidroforming)
May be performed. Reforming while maintaining the inside of the system under reducing conditions is also suitable from the viewpoint of cutting off the source of dioxin as described above. Gas decomposer 3
0 is maintained in a reducing atmosphere, the gas decomposer 30
A small amount of air may be introduced therein. The gas decomposer 30 may perform not only thermal decomposition but also catalytic decomposition using a catalyst, for example. As the catalyst, for example, a solid acid such as silica-alumina or zeolite (aluminosilicate) may be used by supporting a metal such as Pt or Re.

By providing the gas decomposer 30 separately from the pyrolysis furnace 20, gaseous emissions from the object to be treated can be processed at a second temperature higher than the first temperature,
Modification of gaseous emission and mineralization of chlorine can be effectively performed.

It is desirable for the gas decomposer 30 to maintain such conditions that dioxin derived directly or indirectly from the object to be treated is decomposed as much as possible. For example, by setting the second temperature to about 800 ° C., considerable dioxin can be decomposed. The second temperature is set to 10
By setting the temperature at 00 ° C. or higher, more preferably at 1200 ° C. or higher, dioxin can be decomposed more effectively. Since the gas decomposer 30 is set at the second temperature at which dioxin is decomposed, thermal decomposition of hydrocarbons in the gaseous effluent occurs at this second temperature.

The hydrocarbon-based compound contained in the gaseous effluent discharged from the object to be treated is reformed and thermally decomposed by the gas decomposer 30 to become low-molecular-weight hydrogen, methane and carbon monoxide. And so on. When the gaseous emission contains dioxin, most of the dioxin is decomposed. Further, the organic chlorine is mineralized, and the resynthesis of dioxin is suppressed.

FIG. 4 is a diagram schematically showing an example of the structure of the gas decomposer 30. As shown in FIG. The gas decomposer illustrated in FIG. 4A thermally decomposes the gaseous effluent by introducing gaseous effluent from the pyrolysis furnace 20 and a small amount of air into a chamber filled with coke. Reforming, and a reducing atmosphere and a temperature condition such that dioxin is decomposed.

The gas decomposer illustrated in FIG. 4 (b) heats a chamber to a temperature at which dioxin is decomposed by burning fuel gas and air, and a pyrolysis furnace 2 is provided in the chamber.
A gaseous effluent from 0 is introduced to perform pyrolysis and reforming.

[0177] The chamber of the gas decomposer 30 may be provided with catalytic decomposition means such as a catalyst as described above.

Further, if necessary, the gas decomposer 30 may be provided with a temperature adjusting means for adjusting the temperature and oxygen concentration in the chamber and an oxygen concentration measuring means. As the oxygen concentration adjusting means, an oxygen concentration sensor and a carrier gas introduction system as described above may be used. further,
A hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

The gaseous effluent contained in the gaseous effluent discharged from the object to be treated in this way is
Alternatively, it is degraded by the second thermal decomposition means and changes to hydrogen, methane, carbon monoxide and the like.

The gaseous emission thermally decomposed and reformed by the gas decomposition means 30 is introduced into the cooling tower 40.

The cooling tower 40 is provided so as to be connected to the gas decomposer 30, and suppresses the gaseous effluent reformed or pyrolyzed at the second temperature from increasing the dioxin concentration in the gaseous effluent. As a result, the temperature is rapidly cooled to a third temperature.

That is, in the gas decomposer 30 or the second pyrolysis means, the concentration of dioxin in the gaseous effluent reformed or pyrolyzed at the second temperature is determined so that the dioxin is decomposed at the second temperature. Is low, and the chlorine of the hydrocarbon compound decomposed or reformed at this temperature is extremely low because it is made mineral by the reducing atmosphere. Therefore, in order to prevent the generation and resynthesis of dioxin from this state, the dioxin concentration in the gaseous emission is rapidly cooled to the third temperature so as to suppress the increase as much as possible. Third
May be set to a temperature at which a dioxin generation reaction does not occur. For example, from a gaseous effluent in which dioxin is decomposed (the temperature is not necessarily the same as the second temperature in the gas decomposer 30 but may be any temperature higher than the temperature at which dioxin is decomposed), and is preferably 150 ° C. or less. Is 100 ° C or less, more preferably 50 ° C or less,
Most preferably, the rapid cooling to 35 ° C. or lower can suppress the generation and resynthesis of dioxin. At this time, it is preferable to cool the gaseous emission to the third temperature in the shortest possible time. This is about 200 ° C to about 400
This is because dioxin is easily generated and re-synthesized at ℃, and the gaseous effluent is rapidly cooled to the third temperature to minimize the time for which dioxin stays in a temperature range where dioxin is easily generated and re-synthesized, so that more effect can be obtained. The dioxin concentration in the gaseous effluent can be reduced. Therefore, the gaseous emission in the cooling tower 40 is preferably rapidly cooled within about 10 seconds.

[0183] In such a cooling tower 40, a coolant such as water or cooling oil may be directly injected into the gaseous effluent to perform contact cooling. At this time, if an alkaline powder such as lime powder is injected into the gaseous emission, the gaseous emission is neutralized. Also, for example, HC in gaseous emissions
Since l is diffused to the solid surface in contact with the lime powder, the production and resynthesis of dioxin can be suppressed.

FIG. 5 is a diagram schematically showing one example of the structure of the cooling tower 40. As shown in FIG. FIG. 5A shows a structure in which the gaseous effluent introduced from the decomposer 30 is rectified and the refrigerant such as cooling water or cooling oil is directly injected to cool the gaseous effluent to a third temperature. . In FIG. 5B, a neutralizing agent such as lime powder is injected together with the refrigerant to neutralize the gaseous emission,
The structure is such that chlorine in the gaseous emission is fixed and the source of dioxin is removed from the gaseous emission.

The cooling tower 40 is provided with a temperature sensor (not shown) at the gaseous emission introduction portion and the cooling gas discharge portion, and a cooling speed management means for the introduced gaseous emission, for example, a flow rate of the refrigerant. -Temperature control means is provided, and the cooling rate of the gaseous emission is controlled so as to suppress generation and resynthesis of dioxin.

The gaseous effluent discharged from the object to be treated in the pyrolysis furnace 20 is pyrolyzed or reformed in the gas decomposer 30 at a temperature at which dioxin is decomposed.
By being rapidly cooled by the cooling tower 40 so as not to generate and re-synthesize dioxin, it is changed to hydrogen, methane, carbon monoxide and the like, and the dioxin concentration in the gaseous effluent is also greatly reduced. As described above, in the processing apparatus of the present invention, the decomposition of the object to be treated and the decomposition of the gaseous effluent from the object to be treated are performed in the pyrolysis furnace 20 and the gas decomposer 30 in a plurality of stages. By maintaining such a decomposition means in a reducing atmosphere, generation of dioxin can be suppressed.

By setting the second temperature at 800 ° C. and the third temperature at 150 ° C., the dioxin concentration in the gaseous effluent can be reduced to 0.1 to 0.5 TEQng / Nm 3. Was. By setting the second temperature at 1150 ° C. and the third temperature at 50 ° C., the dioxin concentration in the gaseous effluent can be reduced to 0.1 TEQng / N.
m3 or less.

The gaseous emission cooled in the cooling tower 40 is
Cleaning and desulfurization may be performed as necessary.

Further, the gaseous effluent cooled by the cooling tower 40 may be introduced into a neutralization reaction filtering means such as a bag filter. Between the cooling tower 40 and the neutralization reaction filtering means, slaked lime, filter aids (eg, particles with high porosity such as zeolite and activated carbon, tesssorb, shirasu balloon) and the like are introduced into the gaseous exhaust gas stream by a dry venturi or the like. You may make it blow in. FIG. 6 shows the cooling tower 4
FIG. 3 is a diagram showing a part of the configuration of a gaseous emission processing system in which a bag filter 70 is connected to a stage subsequent to a zero. Solid emissions such as heavy metal fine particles condensed in the cooling tower 40, solids discharged from the bag filter 70, and the like are introduced into the reduced pressure heating furnace 50 for treatment, so that lead, tin, Even when metals such as arsenic and cadmium are contained, they can be separated and recovered.

The gaseous emission discharged from the object to be processed thus treated may be used as a heat source for heating the pyrolysis furnace 20 or supplied to a gas turbine generator to obtain electric power. It may be. Further, this electric power may be used as a heat source or the like of the processing apparatus of the present invention.

On the other hand, the pyrolysis residue of the object to be processed, which has been discharged from the pyrolysis furnace 20 as a gaseous emission, is introduced into the reduced pressure heating furnace 50. Since organic components of the object to be treated are mostly decomposed in the pyrolysis furnace 20 as the first pyrolysis means, the pyrolysis residue is mainly composed of metal and carbide, or glass.

The vacuum heating furnace 50 for separating and recovering the metal from the pyrolysis residue which is the object to be treated includes a purge chamber 51,
It comprises a first airtight chamber 52 and a cooling chamber 53,
Each chamber is separated by a partition 54 that can be opened and closed. Further, the first hermetic chamber of the pyrolysis furnace 20 and the decompression heating furnace 50 is
The connection may be made via the purge chamber 51.

The reduced pressure heating furnace 50 of the processing apparatus illustrated in FIG.
Then, the object to be processed opens the partition wall 54a and opens the purge chamber 51.
Will be introduced. After the partition 54a is closed and the inside of the purge chamber 51 is roughly evacuated by an exhaust system (not shown), the partition 54b is opened and the object to be processed is moved to the first hermetic chamber 52.

The partition 54b is closed, and the pressure in the first hermetic chamber 52 is increased so that the metal in the object to be treated is vaporized under reduced pressure.
Control the temperature. The metal vaporized from the object to be processed is condensed and collected in the collection chamber 60. 55 is an exhaust system. The exhaust gas of the exhaust system may be introduced into the decomposer 30.

After the desired metal is vaporized, the partition 54c between the metal chamber 53 and the vacuum chamber 53, which has been depressurized by an exhaust system (not shown), is opened, and the object to be processed is moved to the cooling chamber 53.

When the object to be processed is cooled by closing the partition wall 54c and the object to be processed is stable in the atmosphere,
The cooling chamber 53 leaks and the partition 54d is opened to take out the object to be processed.

The object to be treated is composed of carbides and unvaporized metals, and these metals can be easily separated from the carbides.

As described above, according to the present invention, an object to be treated having a resin and a metal can be highly recycled, and the generation of dioxin can be prevented.

(Embodiment 2) FIG. 7 is a view schematically showing another example of the processing apparatus of the present invention. FIG. 8 is a diagram schematically illustrating the configuration of the processing apparatus of the present invention illustrated in FIG.
In this processing apparatus, the acidic components in the gaseous effluent cooled by the cooling tower 40 are neutralized by the neutralization washing tower 61 and desulfurized by the desulfurization tower 62 so as to be used as a clean fuel gas. This fuel gas is sent to the combustion chamber 23 of the pyrolysis furnace 20 to be used as heating fuel for the pyrolysis furnace, and is filtered by the activated carbon filter 63 and then sent to the gas turbine generator 64 to be converted into electric power. . The exhaust gas heated in the pyrolysis furnace 20 and the exhaust gas from the gas turbine generator 64 are GC-M
The components and concentrations are monitored by S or the like, and safety is confirmed, and then released into the atmosphere from the chimney 66.

By adopting such a configuration, the processing apparatus of the present invention can process the object to be processed more efficiently. For example, neutralize and wash detoxified gaseous effluent and use it as a clean fuel gas for heating the pyrolysis furnace, and then operate the decompression heating furnace with the power obtained by the gas generator or sell electricity As a result, the running cost of the apparatus can be extremely low.

When the first temperature in the first thermal decomposition means is 6
Since the temperature is as low as 00 ° C. or less, the service life of the pyrolysis furnace is long, and the maintenance can be facilitated.

FIG. 9 is a diagram schematically showing an example in which the treatment method of the present invention is applied to waste treatment. That is, waste is thermally decomposed, and gaseous emissions emitted from waste are converted into clean fuel gas in a gaseous emission treatment system, and the pyrolysis residue is introduced into a reduced-pressure heating furnace to be used as heavy metals, useful metals, activated carbon, etc. Can be recovered.

FIG. 10 is a diagram schematically showing an example of the configuration of a shredder device which can be provided in a stage preceding the processing device of the present invention. Here, a shredder device for treating a waste vehicle is exemplified.

The scrap car is shredded by a shredder.
Iron, non-ferrous metals, non-metals, etc. are separated by magnetism, wind, etc. Such a separation residue is shredder dust. Shredder dust contains various metals including resin (including fiber and paper), glass, and heavy metals.
By adopting the above-described configuration, the present invention can safely and efficiently treat such shredder dust for which a conventional treatment technique has not been established.

The shredder dust is charged into the pyrolysis furnace 20 and thermally decomposed at 400 to 500 ° C., and the gaseous emission discharged from the resin component or organic component of the shredder dust is led to the gas decomposer 30. The second temperature is set to 1100 to decompose and make harmful substances such as dioxin harmless.
Decomposition by heating at a temperature of at least 1 ° C (more preferably at least 1150 ° C). Immediately thereafter, the cooling tower 40 sets the third temperature to 100 ° C. or lower (preferably 50 ° C. or lower) for 10 seconds.
By rapid cooling within c, the generation of dioxin could be suppressed to 0.1 TEQng / Nm3 or less. The gaseous effluent from the object to be treated thus treated was removed by a gas washing (neutralization) device and a desulfurization device to remove cyanide, sulfide, nitride, and the like, thereby obtaining a clean fuel gas. .

This fuel gas is used as a heat source for heating the pyrolysis furnace 20, and is generated by a gas turbine generator to be converted into electric power.

The thermal decomposition residue of the object to be treated is introduced into a reduced pressure heating furnace 50 and heated under a reduced pressure of 10 -1 to 10 -3 Torr to remove metals such as Pb, Sb, As, Cd, Sn and Zn. Separation and recovery were achieved at a yield of 99% or more. The objects to be processed in the reduced pressure heating furnace 50 are Pb, Sb, A
s, Cd, Sn, and Zn could be reduced to the 0.1 ppm level.

The iron remaining on the object to be treated which was treated in the reduced pressure heating furnace 50 was separated and recovered by a specific gravity selection method, an electric magnet or the like, and finally a harmless and high-purity carbide was obtained. This carbide may be used in the activated carbon filter 63 or may be used as an effective soil conditioner.

As described above, according to the present invention, household electrical appliances, automobiles, precision equipment, and the like, or shredder dust of these wastes are pyrolyzed by controlling the oxygen concentration, and the gaseous emission treatment system is thermally decomposed. By treating with a decomposition residue treatment system, gaseous effluents can decompose and detoxify harmful substances such as dioxin to produce clean gas fuel. This gaseous fuel can be introduced into a combustion chamber such as a pyrolysis furnace and used as a heating heat source. Further, power can also be generated using this gas fuel. Shredder dust is abundant and inexpensive resource compared to hydropower methods, which have a shortage of water during the drought period and have difficulty supplying power constantly, and are extremely efficient using the treatment equipment of the present invention. Power can be generated. In addition, since the processing apparatus of the present invention has a module configuration, it can be used in a wide range from a small scale to a large scale, and can be used in accordance with a use.

On the other hand, the pyrolysis residue can separate and recover various metals in a high-purity metal state by heating in vacuum.
The heavy metals have also been removed from the carbides, and can be used effectively. Further, the decompression heating furnace is smaller in size than the melting furnace, requires less installation cost and installation place, and can efficiently cope with municipal waste treatment.

As described above, a large amount of waste containing harmful substances or raw materials thereof and producing toxic substances such as dioxins when burned is converted into harmful substances in the environment.
A reusable substance can be recovered in a high-purity state without releasing heavy metals or the like.

According to the processing apparatus and the processing method of the present invention,
The circuit board and various electronic components such as ICs, resistors and capacitors can be easily separated from the mounting board waste without generating harmful gas, and at the same time, the solder alloy and the like can be separated and recovered.

First, without cracking the mounting substrate, the thermal decomposition furnace 20 was used.
And pyrolyze at a first temperature of 250 to 500 ° C. At this time, the pressure in the pyrolysis furnace may be reduced. The gaseous effluent generated by thermal decomposition of the mounting substrate is guided to the gas decomposer 30 and thermally decomposed at 800 ° C. or higher, and then rapidly cooled to 100 ° C. or lower in the cooling tower 40 in order to suppress generation of harmful substances such as dioxin. . The pyrolysis residue is introduced into a reduced pressure heating furnace 50, and the pressure is reduced to about 10 -3.
The temperature was sequentially increased to about 700 ° C. to evaporate constituent metals of the solder alloy. Therefore, the circuit board and various ICs, resistors,
An electronic component such as a capacitor is separated, and at the same time, metal such as evaporated lead is recovered by a coagulation means provided in the middle of a recovery path.

By such a method, the electronic component and the circuit board could be almost completely separated. Also, harmful P
Almost completely low melting point metals such as b (0.1 ppm level)
Removed. The concentration of harmful substances in the gaseous effluent generated from the resin part is also extremely low.
It could be reduced to 0.5 TEQng / Nm3.
The circuit board from which the electronic components were unmounted and from which the bonding metal was removed was carbonized and contained copper for wiring. Harmful metals such as Pb and Sb are removed from various electronic components such as ΔC, resistors and capacitors, and resin parts such as mold resin are carbonized and partially Si, Δu, Δi, W,
A state including a metal such as Mo was obtained.

Next, the carbonized circuit board containing copper is further heated in a reduced pressure heating furnace 50 (at a temperature of 1050 to 1200 ° C.).
Then, the copper foil was semi-melted and aggregated into a spherical shape of several mm.
By performing such a treatment, separation and recovery of copper from carbide are facilitated. The circuit board composed of the carbide and metallic copper was washed with an aqueous solution of calcium carbonate or the like, and high-purity copper could be recovered.

As described above, according to the present invention, it is possible to eliminate the harmful substance from the waste of the mounting board, remove the harmful substance, and easily separate the circuit board and various electronic components without manual operation. it can. At the same time, various metals including the constituent metals of the solder alloy can be evaporated and separated and recovered. In addition, metals such as copper that have not evaporated can be recovered with high purity. According to the present invention, it is possible to recover a reusable substance in a high-purity state without releasing harmful substances, heavy metals, etc. into the environment from wastes such as a mounting substrate, for which a conventionally effective processing technique has not been established. Can be.

(Embodiment 3) Next, the reduced pressure heating means of the present invention will be described in more detail.

FIG. 11 is a perspective view schematically showing one example of a reduced pressure heating device provided in the processing apparatus of the present invention. The inside is shown with a part cut away.

[0219] The reduced pressure heating furnace 100 is for treating the pyrolysis residue of the object to be treated 150 having resin and metal as constituents, solid effluent separated from gaseous effluent, slag, and the like. It comprises a purge chamber 101, a first hermetic chamber 102, a second hermetic chamber 103, and a cooling chamber 104.

Each of these chambers is a door 10 which is a partition which can be opened and closed.
Separated by five. That is, the outside of the apparatus and the purge chamber 101 are separated by the door 105a, the purge chamber 101 and the first hermetic chamber 102 are separated by the door 105b, and the first hermetic chamber 102 and the second hermetic chamber 103 are separated by the door 105c. The second hermetic chamber 103 and the cooling chamber 104 are separated from each other by a door 105d, and the cooling chamber 104 and the outside of the apparatus are separated from each other by a door 105e.

The door 105 separating these chambers has airtightness and heat insulation, and separates the chambers thermally and pressure. Since the thermal load applied to the doors 105a and 105b is small, it is sufficient that airtightness can be maintained.

An exhaust system 106 is connected to the purge chamber 101. The exhaust system 106 includes an oil diffusion pump 106a,
Booster pump 106b, rotary pump 106c
It has. Between the purge chamber 101 and the exhaust system 106,
A valve (not shown) is provided between the vacuum pumps.

The object 1 to be treated is placed between the purge chamber 101 and the exhaust system 106 due to the reduced pressure in the purge chamber 101 or the like.
A trap 107 for removing moisture, hydrogen gas, and the like discharged from 50 is provided. Therefore, even if moisture, hydrogen gas, and the like are discharged from the processing target object 150 in the purge chamber, the exhaust system 106 is not adversely affected. The trap 107 may be provided as needed.

The pressure in the purge chamber 101 is controlled by the exhaust system 10.
6 and a vacuum gauge as a pressure sensor (not shown). As a vacuum gauge, a Bourdon tube, a Pirani gauge and the like may be used as necessary.

Further, the purge chamber 101 is
A carrier gas introduction system for gas replacement inside is connected, and 108 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas, but a rare gas such as Ar may be used.

Further, a heating means may be provided in the purge chamber 101 to preheat the object 150 to be processed.

The pressure in the purge chamber 101 and the pressure in the first hermetic chamber 102 are made substantially equal, and the door 105 b is opened to push the pusher 130.
Moves the processing target object 150 to the first hermetic chamber 102. Although not particularly described hereinafter, the door 105 may be opened and closed by balancing the pressure on both sides separated by the door.

The first hermetic chamber 102 contains the object 15 to be treated.
This is a processing chamber for selectively vaporizing and collecting the constituent metal 0 from the processing target object 150.

The first hermetic chamber 102 is provided with an electric heater 109 as a heating means. This electric heater is
Electric power may be supplied by the gas turbine generator 64. The heating means is not limited to the electric heater 109, and may be selected or combined as needed. For example, gas, oil, or the like may be burned from outside the hermetic zone, or dielectric heating may be performed. Further, the fuel gas obtained from the processing target object 150 may be used.

The temperature in the first hermetic chamber 102 is adjusted by the electric heater 109, a temperature sensor (not shown), and control means (not shown) for controlling the electric heater based on a measured value from the temperature sensor. The control means may be, for example, a computer in which a program for inputting a measured value or a measured voltage from a temperature sensor and for outputting a signal or voltage for changing the power supplied to the electric heater is used. Good.

[0231] Such control may be performed by an analog circuit, or an operator may operate the heating means in accordance with the measured temperature.

In the decompression heating apparatus illustrated in FIG. 11, the temperature in the first hermetic chamber 102 is controlled by the pressure in the first hermetic chamber 102, which will be described later,
With the various conditions in the second hermetic chamber 103 and the cooling chamber 104, the opening and closing of the partition 105, and the transfer of the processing object 150,
Control is performed integrally by control means (not shown). This control means may be implemented by mounting a control program in an electronic computer, for example. An exhaust system 110 is also connected to the first hermetic chamber 102. The configuration of this exhaust system is the same as that of the exhaust system 110 of the purge chamber 101.

The pressure in the first hermetic chamber 102 is adjusted by the exhaust system 110 and a vacuum gauge, which is a pressure sensor (not shown). As the vacuum gauge, a Bourdon tube, a Pirani gauge, or the like may be used as necessary, as described above.

The first hermetic chamber 102 is connected to a carrier gas introduction system for adjusting the oxygen concentration in this chamber. Reference numeral 112 denotes a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown).

The oxygen concentration adjusting means may be provided if necessary. When the inside of the first hermetic chamber 102 is decompressed, the heating efficiency of the object to be treated decreases, so that the object to be treated is heated by adjusting the oxygen concentration at a relatively low degree of vacuum, and then the degree of vacuum is increased. For example, the heating efficiency of the object to be processed may be increased.

Although N2 is used as the carrier gas here, a rare gas such as Ar may be used.

Exhaust system 110 and carrier gas introduction valve 112
By appropriately operating the first airtight chamber,
Or it can be pressurized. The pressure adjusting means of this apparatus can adjust the pressure in the system from 10 @ -3 Torr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the pressure may be further increased by pre-pressing the carrier gas.

The oxygen concentration in the first hermetic chamber 102 is adjusted by a carrier gas introduction valve 112 and an oxygen concentration sensor (not shown). For example, a zirconia sensor may be used as the oxygen concentration sensor. When the temperature in the first hermetic chamber 102 is low for the zirconia sensor,
For example, the gas extracted from the inside of the first hermetic chamber 102 is 773
You may make it measure by adjusting to about K.

In addition to the zirconia sensor, for example, the oxygen concentration may be measured by infrared spectroscopy of the gas in the system.

The oxygen concentration in the first hermetic chamber 102 may be adjusted by the total pressure in the system instead of introducing a carrier gas such as N2.

As described above, the pressure and the oxygen concentration in the first hermetic chamber 102 may be controlled in the same manner as the temperature. For example, a computer is provided with a program that receives a measured value or a measured voltage from a pressure sensor or an oxygen concentration sensor as an input, and outputs a signal or voltage for controlling a valve of the exhaust system 110 and a carrier gas introduction valve 112 as an electronic computer. It may be used.

A collection chamber 111 is provided between the first hermetic chamber 102 and the exhaust system 110 for collecting vaporized metal from the object 150 to be processed.
The recovery chamber 111 cools and condenses the metal vaporized in the chamber to a temperature lower than its melting point and recovers the metal. The inside of the recovery chamber 111 may have, for example, a countercurrent structure or a spiral structure. Alternatively, the recovery chamber 111
A valve or an openable / closable partition may be provided between the first airtight chamber 102 and the collection chamber 111 and the exhaust system 110. That is, when the vaporized metal is introduced from the processing object 150 into the recovery chamber 111, the recovery chamber 111 may be closed and cooled, and the metal may be condensed and recovered.

When harmful gas is discharged from the object 150 to be treated, the exhaust gas of the exhaust system is supplied to the gas decomposition device 30.
To make it harmless. Further, the latter stage of the exhaust systems 106, 110, 114, 115 connected to the respective chambers may be connected to the gas decomposer 30.

The temperature, pressure and oxygen concentration in the first hermetic chamber 102 are controlled as described above. Therefore, the constituent metals of the processing target object 150 can be selectively vaporized and collected.

At the end of the processing in the first hermetic chamber 102,
Although a predetermined metal is even removed from the object 150 to be processed, a second hermetic chamber 103 is provided between the first hermetic chamber 102 and the cooling chamber 104 when it is desired to recover an even higher boiling metal. What should I do?

The reduced pressure heating device 1 provided in the processing apparatus of the present invention
In the case of 00, since the processing object 150 heated in the first hermetic chamber 102 is transferred to the second hermetic chamber 103 without cooling, the thermal efficiency is very high.

The second hermetic chamber 103 contains the object 15 to be treated.
This is a processing chamber for further selectively vaporizing and recovering the constituent metal 0 from the processing target object 150.

The second hermetic chamber 103 is provided with the same electric heater 109 as the first hermetic chamber as a heating means. The heating means is not limited to the electric heater 109, and may be selected or combined as needed.

As described above, the temperature in the second hermetic chamber 103 is controlled by the electric heater 113 and a temperature sensor (not shown) in the same manner as in the first hermetic chamber 102. That is, the temperature in the second hermetic chamber 103 is determined by the pressure, the oxygen concentration, and the like in the second hermetic chamber 103, the various conditions of the purge chamber 101, the first hermetic chamber 102, the cooling chamber 104, and the partition 105. Is controlled by a control means (not shown) in an integrated manner.

The exhaust system 114 is also connected to the second hermetic chamber 103. The configuration of the exhaust system is similar to that of the exhaust system 114 of the purge chamber 101.

The pressure in the second hermetic chamber 103 is adjusted by the exhaust system 114 and a vacuum gauge (not shown) which is a pressure sensor. As the vacuum gauge, a Bourdon tube, a Pirani gauge, or the like may be used as necessary, as described above.

The second hermetic chamber 103 is connected to a carrier gas introduction system for adjusting the oxygen concentration in this chamber. Reference numeral 112 denotes a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas, but a rare gas such as Ar may be used.

Evacuation system 114 and carrier gas introduction valve 112
By appropriately operating the first airtight chamber,
Or it can be pressurized. In this device, 10-3T
The pressure in the system can be adjusted from orr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the pressure may be further increased by pre-pressurizing the carrier gas.

[0254] The vapor pressure (boiling point) of the constituent metal of the object 150 to be treated is reduced as the pressure in the second hermetic chamber 103 is reduced, so that the metal can be vaporized at a lower temperature. Therefore, the abilities of the heating means and the exhaust means provided in the second hermetic chamber 103 may be changed according to the type of metal to be separated and recovered from the processing object 150. For example, a dielectric heating means may be provided to heat the inside of the second hermetic chamber 103 to a higher temperature. Further, for example, a vacuum pump having a higher capacity and a larger displacement may be provided to reduce the pressure in the second hermetic chamber 103 to a higher vacuum. Depending on the capacity in the second hermetic chamber 103, a higher vacuum may be obtained by using an ion getter pump, a turbo molecular pump, or the like.

The oxygen concentration in the second hermetic chamber 103 is sufficiently low without any special adjustment because the pressure in the system is sufficiently reduced. Therefore, there is no need to actively adjust,
When an oxygen concentration adjusting means is provided, the first airtight chamber 10
What is necessary is just to carry out similarly to 2.

The reduced pressure heating device 100 shown in FIG.
Has exemplified a configuration including one second hermetic chamber 103, but a plurality of second hermetic chambers 103 may be provided. By providing a plurality of second hermetic chambers 103 having different internal temperature conditions and pressure conditions, a plurality of metals having different vapor pressures can be vaporized and collected from the processing target object 150.

In the case where it is not necessary to separate and collect metals from the object 150 to be processed, elements may be vaporized and recovered from the object 150. For example, when removing the Pb-Sn alloy from the object to be treated, the Pb and Sn are heated to a temperature at which Pb and Sn are vaporized by the pressure in the second hermetic chamber 103, and Pb and Sn are removed.
May be collected. Of course, Pb and Sn may be selectively vaporized and recovered.

A collection chamber 115 is provided between the second hermetic chamber 103 and the exhaust system 114 for collecting vaporized metal from the object 150 to be processed.
The recovery chamber cools and condenses the metal vaporized in the chamber to a temperature lower than the melting point and recovers the metal. The inside of the recovery chamber 115 may have, for example, a countercurrent structure or a spiral structure. Alternatively, between the collection chamber 115 and the second hermetic chamber 103, the collection chamber 115 and the exhaust system 11
A valve or an openable / closable partition wall may be provided between the control unit 4. That is, when the vaporized metal is introduced from the processing target object 150 into the recovery chamber 115, the recovery chamber 115 may be closed and cooled, and the metal may be condensed and recovered.

Regardless of whether the vaporized metal is continuously condensed and recovered, or whether the vaporized metal is condensed and recovered in a batch process, the recovery efficiency increases as the residence time of the vaporized metal in the recovery chamber 115 increases.

Also, N 2 or a rare gas may be introduced into the second hermetic chamber 103 as a carrier gas. The vaporized metal is efficiently introduced into the collection chamber by the carrier gas.

The recovery chamber 115 is provided in the second hermetic chamber 10.
3 may be provided with a plurality of systems. The same metal may be collected in a plurality of collection chambers 115,
A plurality of metals may be selectively vaporized by adjusting the temperature and pressure in the second hermetic chamber 103 in a stepwise manner, and the plurality of collection chambers 115 may be switched to be collected.

The temperature, pressure and oxygen concentration in the second hermetic chamber 103 are controlled as described above. Therefore, the constituent metals of the processing target object 150 are vaporized according to the vapor pressure thereof,
In the recovery chamber 115, it can be recovered in a metal state.

Incidentally, depending on the degree of decomposition of the constituent resin of the object 150 to be treated by the first thermal decomposition means, the constituent resin may discharge decomposition product gas and the like. Such a decomposition product gas may be connected to the gas decomposition device 30 at a later stage of the recovery chamber 115.

As described above, even in the second hermetic chamber 103, a predetermined metal can be vaporized and recovered from the object to be processed.

From the second hermetic chamber 103 to the processing object 15
If 0 is directly taken out of the apparatus 100, the object 150 to be processed may be rapidly oxidized. Further, the inside of the second hermetic chamber 103 must be returned to the atmospheric pressure.
It is also inconvenient from the viewpoint of maintaining the airtightness in the area 03. For this purpose, the decompression / heating apparatus 100 illustrated in FIG. 11 includes a cooling chamber 104 after the second hermetic chamber 103.

The cooling chamber has the same pressure adjusting means as the purge chamber 101, the first hermetic chamber 102, and the second hermetic chamber 103, and oxygen concentration adjusting means. That is, an exhaust system 116 similar to that described above and a carrier gas introduction valve 117 are provided.

The target object 150 from which the predetermined metal has been separated in the second hermetic chamber 103 is transferred to the cooling chamber 104 and cooled in a state where the pressure and the oxygen concentration are adjusted. The carrier gas not only controls the oxygen concentration but also controls the object 15 to be treated.
It also functions as 0 cooling gas.

[0268] A trap 118 for removing gas or the like discharged from the object to be treated by preheating may be provided between the cooling chamber 104 and the exhaust system 116.

When the object 150 is sufficiently cooled in the cooling chamber 104, it is taken out of the apparatus.

The introduction and removal of the object 150 to and from the decompression / heating apparatus 100 and the transfer of the object 150 between the chambers are performed by the pusher 130 and the drawer 131.
What should be done is:

The pusher 130 and the drawer 131
This operation may be performed by the above-described control unit (not shown) together with the opening and closing of the partition wall 105.

FIG. 12 is a diagram schematically showing a reduced pressure heating device provided in the processing apparatus of the present invention exemplified in FIG.

The purge chamber 10 not shown in FIG.
1, the temperature sensor 201a in the first hermetic chamber 102, the pressure sensor 202b, the oxygen concentration sensor 203, and the temperature sensor 201 in the second hermetic chamber 103.
c, a signal from the pressure sensor 202c, and a signal from the pressure sensor 202d in the cooling chamber 104 are transmitted to a control panel 200 constituting control means.
Is transmitted to The control means may be configured by mounting a program on an electronic computer.

The control means may control the heating means, the pressure adjusting means, and the oxygen concentration adjusting means according to the state of each room in the apparatus. Opening and closing of the partition 105;
The transfer of the processing target object 150 by the pusher 130 and the drawer 131 may be performed by this control means. Reference numeral 210 denotes a monitor that indicates to the operator the state of each room such as temperature, pressure, oxygen concentration, and the open / closed state of the partition 105. Reference numeral 211 denotes a gaseous emission processing system for processing the above-mentioned gaseous emission.

(Embodiment 4) FIG. 13 is a view schematically showing another example of the reduced pressure heating device provided in the processing apparatus of the present invention. The inside is shown with a part cut away. The decompression / heating apparatus 300 also treats a thermal decomposition residue or the like of the object to be treated 350 having resin and metal as constituent materials.

[0276] The reduced pressure heating device 300 is
1, an airtight chamber 302 and a cooling chamber 303.
The airtight chamber 300 is provided with the reduced pressure heating device 1 illustrated in FIG.
The first airtight chamber 102 and the second airtight chamber 103 have the same functions. That is, first, a predetermined metal is separated and recovered from the processing target object 350 in the hermetic chamber 302, and then another metal is further separated and recovered in the same hermetic chamber 302.

Although the hermetic chamber 302 is provided with temperature adjusting means, pressure adjusting means, and oxygen concentration adjusting means, the oxygen concentration may be adjusted by the total pressure in the hermetic chamber 302 as described above. .

The temperature in the airtight chamber 302 may be adjusted by the electric heater 309 and a temperature sensor (not shown).

The pressure in the hermetic chamber 302 is adjusted by the exhaust system 31.
0, 314, a carrier gas introduction system, and a pressure sensor (not shown). 312 is a carrier gas introduction valve.

[0280] Between the airtight chamber 302 and the exhaust system 310,
A recovery chamber 311 as a condensation and recovery means for recovering vaporized metal from the processing object 350 is provided. Further, between the airtight chamber 302 and the exhaust system 314, a collection chamber 315 which is a condensation and collection means for collecting gas of another constituent metal vaporized from the processing object 350 is provided. If it is not necessary to vaporize the constituent metal of the object to be treated, a plurality of collection chambers 31
1 may be provided.

Purge chamber 301, cooling chamber 303, partition 30
5. With respect to the carrier gas introduction system, the pusher 330 and the drawer 331, the reduced pressure heating device 10 illustrated in FIG.
Same as 0. The control means may be provided in the same manner.

As described above, the processing apparatus of the present invention combines a part for thermally decomposing the constituent resin of the object to be treated and a part for separating and recovering the constituent metal from the object to be treated which has been thermally decomposed with the resin. The range of possible objects can be greatly expanded. For example, it is possible to cope with a processing object such as a waste circuit board, a waste home appliance, a shredder dust, which is conventionally difficult to process, and for which an effective and safe processing technology has not been established.

For example, in the treatment of a resin-coated aluminum foil or the like, aluminum can be recovered in a metal state by thermally decomposing the resin portion in a controlled atmosphere.

[0284] The processing of a mounting substrate or the like having an electronic component mounted on a substrate may be performed by vaporizing and collecting a solder alloy and separating the electronic component from the substrate.

(Embodiment 5) FIG. 14 is a diagram schematically showing another example of the reduced pressure heating device provided in the processing apparatus of the present invention.

[0286] The reduced-pressure heating device 400 includes the first airtight chamber 4
01 and a second hermetic chamber 402. The first hermetic chamber 401 includes a temperature control unit (not shown), and is connected to the exhaust system 403 and the collection chamber 404. Second
The airtight chamber is provided with a temperature control means (not shown), and is connected to the exhaust system 405 and the collection chamber 406. Further, a carrier gas introduction system 407 is connected to the first hermetic chamber 401 and the second hermetic chamber 402, so that the oxygen concentration in the hermetic chamber can be adjusted and pressurized. 408 is a carrier gas reservoir.

That is, the thermal decomposition residue of the object to be treated having a resin and a metal is heated under reduced pressure in the first hermetic chamber 401, and the vaporized metal is recovered in the recovery chamber 404. At this time, the first hermetic chamber 401 is controlled by the aforementioned control means or the like.
The desired metal may be vaporized while adjusting the temperature, pressure, and oxygen concentration in the inside to maintain the state of the other constituent metals of the object to be processed.

In the second hermetic chamber 402, another internal metal is vaporized by adjusting the internal temperature and pressure, and is recovered in the recovery chamber 406. Temperature in the second hermetic chamber 402,
The pressure may be adjusted by the same control means as the first airtight chamber 401.

A purge chamber may be provided before the first airtight chamber 401 or after the second airtight chamber 402.

(Embodiment 6) FIG. 15 is a diagram schematically showing another example of the reduced pressure heating device provided in the processing apparatus of the present invention.

[0291] The decompression / heating apparatus 500 is an apparatus for processing an object to be processed having a resin and a metal as constituents, and includes a purge chamber 501, a first hermetic chamber 502, a second hermetic chamber 503, and a third hermetic chamber. A closed room 504 and a cooling room 505 are provided.

The purge chamber 501 is connected to a trap 506 and an exhaust system 507. The first hermetic chamber 502 is connected to a collection chamber 508 and an exhaust system 509. The second hermetic chamber 503 is connected to the collection chamber 510 and the exhaust system 511. The third hermetic chamber 504 includes the collection chamber 51
2 and the exhaust system 513. The cooling chamber 505 is connected to the trap 514 and the exhaust system 515. First hermetic chamber 502, second hermetic chamber 503, third hermetic chamber 50
Reference numeral 4 includes a temperature adjusting means (not shown). 516 is a carrier gas introduction system, and 517 is a carrier gas reservoir.

The first hermetic chamber 502 has an oxygen concentration sensor (not shown) so that the oxygen concentration in the system can be adjusted independently of the total pressure.

That is, the reduced pressure heating device 500 is provided with a plurality of processing chambers for vaporizing constituent metals of the object to be processed. Even when the object to be processed has a plurality of constituent metals, the object can be selectively vaporized and collected in the second hermetic chamber 503 and the third hermetic chamber 504, respectively.

(Embodiment 7) FIG. 16 is a diagram schematically showing another example of the reduced pressure heating device provided in the reduced pressure heating device of the present invention.

The decompression / heating apparatus 600 is an apparatus capable of treating, for example, thermal decomposition residues of an object to be treated having resin and metal as constituents. This reduced pressure heating device 60
Numeral 0 denotes a case where a plurality of recovery systems are connected to one airtight container 601, and the processing is performed by switching the recovery systems according to the temperature, pressure, and oxygen concentration inside the airtight container 601.

(Embodiment 8) FIG. 17 is a diagram schematically showing a configuration of a control system 610 for adjusting the temperature, pressure and oxygen concentration in the airtight container 601. As described above, the control unit 611
May be mounted on an electronic computer as a control program, for example, to control the apparatus.

The airtight container 601 is connected to a plurality of collection chambers 602 for collecting vaporized gas of constituent metals of the object to be processed. Each of the collection chambers 602 is connected to an exhaust system 603.

The airtight container 601 is connected to a plurality of systems of recovery chambers 605 for recovering constituent metals of the object to be processed vaporized in the airtight container 601, and each of the recovery chambers is connected to an exhaust system 606.

A plurality of collection chambers 605 connected to the airtight container 601 may collect the same metal. Alternatively, a plurality of metals having different vapor pressures (boiling points) may be recovered by switching according to the temperature and pressure conditions in the airtight container 601.

[0301] A carrier gas introduction system is connected to the airtight container 601. 607 is a carrier gas reservoir. By introducing a carrier gas such as N2 or Ar, the oxygen concentration in the hermetic container 601 can be adjusted independently of the total pressure. Further, the inside of the airtight container 601 may be pressurized by introducing a prepressurized carrier gas. By heating the object to be processed in a non-oxidizing atmosphere, the efficiency of raising the temperature of the object to be processed is improved.

[0302] The oxygen concentration in the airtight container 601 may be adjusted by the total pressure. (Embodiment 9) FIG. 18 is a diagram schematically showing another example of the recovery system of the reduced pressure heating device provided in the processing apparatus of the present invention.

This decompression / heating apparatus has the same configuration as the decompression / heating apparatus illustrated in FIG. 16, but illustration of parts other than the recovery system is omitted.

A collection chamber 611 separated from the airtight container 601 by a partition 610 that can be opened and closed is provided. The collection chamber 611 has a temperature control unit (not shown). The recovery chamber 611 may be connected to a carrier gas introduction system.

The collection chamber 611 is connected with a collection chamber 605 and an exhaust system 606.

When the temperature and pressure conditions for evaporating a predetermined metal in the airtight container 601 are satisfied, the partition 610 is opened, the object to be treated 612 is introduced into the collection chamber 611, and the partition 610 is closed. Then, while maintaining the temperature and pressure conditions, the collection chamber 605
The vaporized metal may be condensed and recovered.

If such a collection chamber 611 is provided, while collecting metal from the object to be treated in the collection chamber 611,
Various conditions such as temperature, pressure, and oxygen concentration in the airtight container 601 can be controlled independently of the collection chamber 611. Therefore, the operation efficiency of the device is improved.

Such a collecting chamber is, for example, shown in FIGS.
3, it may be arranged in a reduced pressure heating device as exemplified in FIGS.

FIG. 19 is a diagram schematically showing a recovery system including a recovery chamber 901 connected to, for example, the reduced pressure heating device 100 illustrated in FIG.

The second hermetic chamber 103 of the reduced pressure heating device 100
The collection chamber 901 is connected to the second airtight chamber 103.
And the collection chamber 901 are separated by a partition 902 that can be opened and closed. The collection chamber 901 includes a temperature control unit (not shown). Further, a carrier gas introduction system may be connected. The collection chamber 901 includes a collection chamber 115,
An exhaust system 114 is connected. Further, the collection chamber 115 and the exhaust system 114 may be connected in parallel with the collection chamber 901.

(Embodiment 10) FIGS. 20 and 21 are diagrams schematically showing an example of the structure of the recovery chamber.

FIG. 20 shows a counter-current recovery chamber, and FIG.
Numeral 1 indicates a cyclone type recovery chamber. The recovery chamber only needs to be able to condense metal vaporized from the object to be processed. Further, these recovery chambers may be connected in multiple stages. FIG. 12 is a diagram schematically illustrating an example of the configuration of an exhaust gas processing apparatus that processes exhaust gas discharged from an object to be processed and not recovered by a recovery chamber or a recovery chamber. A multi-exhaust gas treatment filter 1201, a smokeless filter 1202, and an odorless filter 1203 are connected to a recovery chamber or a downstream of a recovery system such as a recovery chamber. In addition, for example, an alkali trap for collecting a halogen gas or the like, a halogenated hydrocarbon decomposition device using a catalyst, or the like may be provided.

As described above, the processing apparatus of the present invention decomposes (processes, evaporates, oils, and carbonizes) the processing object having resin and metal as constituents, and vaporizes the constituent metal to convert the processing target object. It can be separated and collected.

(Embodiment 11) Next, a description will be given of a process for removing lead from an object having lead and resin as a part of the constituent material.

According to the present invention, an object in which lead and resin are used for at least a part of a constituent material can be effectively treated.
For example, lead can be removed from electronic devices and automobile electronic components using an alloy containing lead such as a Pb-Sn-based solder alloy.

In the present invention, first, the resin portion is thermally decomposed by vaporization, oiling, carbonization or the like by the first thermal decomposition means, and then lead is vaporized and separated from the pyrolysis residue. The vaporized lead may be recovered. The processing apparatus of the present invention as described above may be used as the apparatus.

First, the object to be treated is thermally decomposed so that the lead in the object to be treated is not oxidized as much as possible and is not vaporized as much as possible.

The resin melts from about 50 ° C.
When the temperature is maintained at about 00 to 600 ° C, mainly C
1 to C8 hydrocarbon gas is discharged. Such a gaseous emission such as a decomposition product gas of the resin may be collected in the gaseous emission treatment system described above.

[0319] The thermal decomposition step of the object to be treated is preferably performed in a reducing atmosphere by adjusting the oxygen concentration as described above. By adjusting the oxygen concentration, the recovery efficiency of the decomposition product gas of the resin is improved. Further, oxidation of lead can be prevented. Since lead oxide evaporates at a temperature lower than that of lead, by controlling the oxygen concentration, scattering of lead can be prevented, and lead can be more actively recovered in a later step.
Further, generation of dioxin in the gaseous emission treatment system can be suppressed.

The object to be treated thermally decomposed in this way is introduced into the reduced pressure heating means, and the temperature and pressure are adjusted to vaporize lead from the object to be treated. When the object to be treated includes metals such as iron, copper, aluminum, and tin in addition to lead, each metal may be selectively vaporized by a difference in vapor pressure.

The temperature at which lead vaporizes changes depending on the pressure in the airtight container. At atmospheric pressure, for example, when heated to 1400 ° C., the vapor pressure of lead is 84 mmHg, whereas iron is
The vapor pressure of copper and tin does not reach 1 mmHg. Therefore, by heating the object to about 1400 ° C., almost only lead vapor can be selectively generated from the object.

Further, for example, the vapor pressure of lead at 1740 ° C. is 760 mmHg, while the vapor pressure of tin is 15
mmHg, the vapor pressure of copper does not reach 3 mmHg. Therefore, even when the object is heated to about 1740 ° C., almost only lead vapor can be selectively generated from the object to be treated.

By heating the object under reduced pressure, the lead in the object can be vaporized at a lower temperature.

If the pressure is adjusted to 10 -1 Torr, about 8
By heating to about 27 ° C., almost only lead vapor can be selectively generated from the object to be treated.

If the pressure is adjusted to 10 -3 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 627 ° C.

Further, when the pressure is adjusted to 10 -4 Torr, almost only lead vapor can be selectively generated from the object to be treated by heating to about 427 ° C. The lead vapor thus selectively generated may be recovered as metallic lead by, for example, a recovery device cooled to a temperature lower than the melting point of lead.

FIG. 22 is a graph showing the relationship between the vapor pressure of lead and the temperature. It can be seen that if the pressure in the airtight container of the reduced pressure heating means is reduced, the boiling point of lead decreases.

Based on this graph, the heating temperature may be adjusted, for example, according to the pressure in the airtight container.
Further, for example, this relationship may be installed in an electronic computer as a program and used as the control means of the above-described processing device of the present invention.

(Embodiment 12) As an example of an object having lead and resin as constituents, a mounting substrate in which various electronic components are mounted on a circuit board with a solder alloy containing Pb is processed as an object to be processed. An example will be described.

FIG. 23 is a diagram schematically showing such a mounting board 1300. As shown in FIG.

An electronic component 1304 is mounted on a circuit board 1303 on which a copper foil 1301 and a resin 1302 are laminated. The electronic component 1304 is packaged with a resin 1305. Then, the connection terminal 1306 of the electronic component made of a Cu alloy and the copper foil are combined with the Pb-Sn-based solder alloy 13.
07. Although the surface of the connection terminal 1306 of the electronic component may be plated with a solder alloy, the same processing can be performed.

First, the mounting board 1300 is heated by adjusting the oxygen concentration by the first thermal decomposition means, and
3 is pyrolyzed. The component resin of the printed circuit board is generally a thermosetting resin and is mostly carbonized, but still generates a gaseous emission containing a large amount of decomposition product gas. The same applies to the packaging resin 1303 for electronic components. The gaseous emission is detoxified in the gaseous emission treatment system described above and reused as a clean fuel gas.

FIG. 24 is a diagram schematically showing the mounting board 1300 that has been thermally decomposed.

In this state, most of the constituent resin of the mounting board is carbonized. In addition, lead is not scattered by adjusting the oxygen concentration.

Next, the thermally decomposed object to be treated is introduced into the reduced pressure heating means, and the temperature and pressure in the hermetic container are adjusted to selectively vaporize lead in the object to be treated. The temperature and the pressure may be determined based on FIG. It is preferable to reduce the pressure inside the airtight container. This is because lead is vaporized at a low temperature, so that the input energy can be reduced, and because the oxygen concentration decreases, lead and other constituent metals of the object to be treated are not oxidized. When the constituent metal of the object to be treated may be oxidized, a carrier gas such as N2 or Ar may be introduced to adjust the oxygen concentration in the hermetic container.

As the pressure in the airtight container is reduced, the lead vaporizes at a lower temperature. FIG. 25 is a diagram schematically showing a state in which lead 1308 is vaporized in a metal state.

By adjusting the temperature and pressure in the airtight container, only lead can be selectively vaporized. If the object to be treated contains a metal with a lower boiling point than lead,
What is necessary is just to vaporize such a metal first.

As described above, lead can be removed from the mounting substrate 1300 which is an object to be processed. In addition, by processing a large amount of mounted electronic devices such as waste electronic devices, it can be processed as general waste and does not pollute the environment due to elution of lead. Further, constituent metals other than lead can be easily separated and can be used as resources. The constituent resin can also be recovered as valuable oil or as carbide. This carbide may be used as fertilizer or activated carbon.

Although the description has been made up to the point where lead is removed from the mounting substrate 1300, the temperature and pressure in the hermetic container may be further adjusted to vaporize constituent metals other than lead of the object to be processed. Good.

For example, the circuit board 1303 and the electronic component 1304 can be separated from the object to be treated from which lead has been removed, by further evaporating tin which has formed a solder alloy.

FIG. 26 shows a case where the circuit board 130 is vaporized from tin.
FIG. 3 is a diagram schematically showing a state where electronic component 3 and electronic component 1304 are separated.

As described above, the lead is removed or the circuit board 1 is removed.
By separating the electronic component 303 from the electronic component 1304, the complexity of the object to be processed is reduced, and the subsequent processing is facilitated. For the electronic components separated from the circuit board, the temperature and pressure in the airtight container are adjusted to include, for example, Au, Ag, Pt, and B contained in the circuit board 1303 and the electronic components 1304.
i, In, Ta, Ni, Cr, Cu, Al, W, Mo,
Metals such as Co and Pd may be vaporized and collected. Such collection is performed by the circuit board 1303 and the electronic component 1.
It is more efficient to use a reduced-pressure heating means capable of recovering another metal having a lower vapor pressure after separating from the metal 304.

FIG. 27 is a diagram showing the dependency of the boiling point (vapor pressure) on the pressure of various metals. This drawing shows an example of a recoverable metal, and a metal not shown can also be recovered. FIG. 28 is a diagram showing the temperature dependence of the free energy of formation of an oxide. The elements shown in FIG. 28 are shown as an example, and data on other elements can be easily calculated or obtained from a database. The relationship shown in FIGS. 27 and 28 is used together with the relationship between the boiling point (vapor pressure) of lead and the pressure shown in FIG. 22 to control, for example, the temperature, pressure, and oxygen concentration in an airtight container. I just need. Further, for example, this relationship may be installed in an electronic computer as a program and used as the control means of the above-described processing device of the present invention.

(Embodiment 13) FIG. 29 is a view schematically showing one example of an apparatus used for removing lead from a processing object having lead and resin of the present invention as constituent materials. The apparatus is not limited to the apparatus illustrated in FIG. 29, and the processing apparatus of the present invention as described above may be used.

This processing apparatus 2000 is composed of a thermal decomposition furnace 2001.
And a reduced pressure heating furnace 2002. This pyrolysis furnace 2
Reference numeral 001 includes an oxygen concentration control device 2003 and a heating device (not shown). The control unit (not shown) is configured to maintain the temperature at a predetermined temperature for a predetermined time.

The gaseous effluent containing hydrocarbon-based gas discharged from the constituent resin by heating the object to be treated 2004 is reformed and heated at a high temperature (here, 1200 ° C.) at which dioxin is decomposed in the gas decomposer 2005. It is decomposed and immediately cooled to 35 ° C. in the cooling tower 2006. The gaseous effluent cooled so that dioxin is not generated and resynthesized can be neutralized and washed using an alkaline water shower washing device or the like, and reused as fuel gas.

[0347] The reduced pressure heating furnace 2002 is a vacuum heating furnace.
A lead recovery chamber 2007 and an exhaust device 2008 are provided.

[0348] The object to be processed is transferred to a pyrolysis furnace 2001 and a decompression heating furnace 2002 by a transfer means 2009 such as a conveyor.
Sent in order to. Pyrolysis furnace 2001 and vacuum heating furnace 20
A purge chamber (not shown) is provided between the purge chamber and the chamber 02.

The thermal decomposition furnace 2001 for these objects to be treated,
The residence time, heating temperature, pressure, and oxygen concentration in the reduced pressure heating furnace 2002 are respectively controlled by a control unit (not shown).

In the thermal decomposition furnace 2001, the object to be processed 2004 is heated and maintained at a temperature of, for example, about 200 ° C. to 600 ° C., and the resin component, which is a part of the constituent material of the object to be processed 2004, is thermally decomposed. It is discharged as a gaseous emission containing C1 to C8 hydrocarbon gas and introduced into the gaseous emission treatment system.

Next, the object to be processed 2004 is sent to the reduced pressure heating furnace 2002, and the pressure is reduced to, for example, about 10 −5 Torr, the temperature is set to about 427 ° C., and this state is maintained. Lead in the object to be treated is vaporized from the object to be treated as vapor lead. A gas discharge unit is provided at the upper part of the reduced pressure heating furnace 2002, and vapor lead released from the object to be treated is condensed as metal lead by lowering the vapor pressure.
The crystallized metal lead is precipitated and recovered in the lead recovery chamber 2005. Further, in order to efficiently send vapor lead from the decompression heating furnace 2002 to the lead recovery chamber 2005, an inert gas such as N2 or Ar is introduced from a carrier gas introduction unit provided in the decompression heating furnace 2002, and the vapor lead is transferred to the carrier. The gas is sent to the lead recovery chamber 2005 together with the gas.

The object to be treated from which lead has been removed through the reduced pressure heating furnace 2002 is sent to the residue receiving section 2010. The resin component of the object to be treated is almost completely carbonized, and heavy metals such as lead and zinc contained in the object to be treated are also removed, so the object to be treated is rendered harmless and post-processing is easy. It is. When another useful metal or the like is included in the object to be treated, these metals may be separated and collected by a specific gravity separation method, an electric magnet, or the like.
The harmless and high-purity carbide that has passed through the reduced pressure heating means can be reused as activated carbon having excellent characteristics and a soil conditioner.

(Embodiment 14) Next, an example in which an electronic device including solder as a processing object is processed using the processing apparatus 2000 having the above configuration will be described.

[0354] The electronic device as the object to be processed 2004 may be crushed in the pre-processing, but it is more preferable to introduce the electronic device without crushing in the processing of the mounting substrate.

The pyrolysis furnace 2001 has a furnace temperature of about 500 ° C.
The electronic device was kept in an almost oxygen-free state at about 600 ° C., and the electronic device was kept for about 60 minutes. The constituent resin occupying about 40% of the constituent ratio of the electronic device was thermally decomposed in the pyrolysis furnace 2001 and was discharged as a gaseous emission containing hydrocarbon gas or carbonized.

In addition, iron, copper,
Metals such as aluminum and constituent metals of the mounting substrate occupying about 10% of the constituent ratio hardly vaporized and were not oxidized in the pyrolysis furnace 2001.

The electronic equipment obtained by thermally decomposing the constituent resin was conveyed to the reduced pressure heating furnace 2002 through the purge chamber without being cooled. The reduced pressure heating furnace 2002 has a pressure of about 10 -3 Torr,
The temperature was maintained at about 627 ° C., and the electronic device was kept for about 60 minutes.

For a mounting substrate occupying about 10% of the electronic equipment, an alloy containing about 5% to 10% of the board weight of solder is used. Also, about 40 wt% of this solder alloy is lead.

That is, in electronic equipment, 0.2 to 0.4
% Lead is used as part of the component. This lead was vaporized as evaporating lead in a reduced pressure heating furnace 2002, sent to a lead recovery chamber 2005 together with a carrier gas, and recovered as metallic lead.

In order to improve the lead recovery rate, it is preferable to make the residence time of the lead vapor inside the lead recovery chamber 2005 as long as possible. In this example, the lead recovery is 98
%Met. The recovered lead contained few impurities and could be reused as valuable metal.

The hydrocarbon gas discharged by pyrolysis in the pyrolysis furnace 2001 is sent to the gaseous decomposer 2005 of the gaseous emission treatment system described above, and reformed and co-heated in coke heated to about 1200 ° C. Decomposed, immediately after 8s to 35 ℃
quenched at ec. The cooled gaseous effluent is neutralized and filtered by a bag filter which is a neutralization reaction filter, further washed, and reused as fuel gas. In this embodiment, 40% of the electronic device is made of resin. Although the resin recovery rate differs depending on the components of the constituent resin, about 90% of the weight ratio was reused as fuel gas, and about 10% remained as a residue mainly composed of carbide.

Metals such as iron, copper, and aluminum, which make up about 50% of the electronic equipment, are used in the pyrolysis furnace 200.
1 and is not oxidized in the reduced pressure heating furnace 2002 and can be recovered in a metal state, so that it has high reuse value.
In this example, the residue discharged into the residue receiving portion 30 was mainly iron, copper, aluminum and carbide residues of resin.

FIG. 30 is a diagram schematically showing an example of an openable and closable partition wall 2101 for maintaining airtightness and heat insulation between the thermal decomposition furnace 2001 and the reduced pressure heating furnace 2002 of the processing apparatus 2000 shown in FIG. 29, for example. . The partition 2101 is a wire 210
2 and the hoist 2103.

A vacuum door and a heat insulating door may be separately provided at the positions of the partition walls 2101. For example, partition 2
A heat-insulating door, which can be opened and closed similarly, may be provided on the side of the pyrolysis furnace 2001 and on the side of the reduced-pressure heating furnace 2002 of the door 101b as a vacuum door.

(Embodiment 15) Wastes containing a large amount of resin and metal (including shredder dust), including various electronic devices, automobiles, precision instruments, stationery, pharmaceutical and food packages, etc. Is taken as a processing target object, and a processing system thereof will be described. As for the apparatus, the above-described processing apparatus of the present invention may be used.

[0366] Such waste containing resin and metal is generally incinerated or landfilled because it is difficult to separate and collect it. In the processing system of the present invention, the thermal decomposition (vaporization, oilification, and carbonization) of the constituent resin of the waste in the same apparatus
The constituent metals are vaporized and recovered in a metal state.

In the treatment of the present invention, waste containing a resin and a metal is first introduced into a pyrolysis furnace. Then, in order to recover the resin portion, the oxygen concentration is adjusted to perform thermal decomposition. Next, the pyrolysis residue is introduced into a reduced pressure heating furnace to perform reduced pressure and heating for vaporization and recovery of metal.

FIG. 31 is a diagram schematically showing one example of the reduced pressure heating means of the present invention which can be used in this processing system. A waste containing a resin and a metal is accommodated in an airtight container 2201, and a charging shelf 2202 made of a metal having high heat-up efficiency and high heat resistance is provided in the airtight container. 22
03 is a door that opens and closes the airtight container 2201. A heating device 2204 such as a sheath heater is provided in the airtight container, and is operated by the control panel 2205 together with the pressure and oxygen concentration in the airtight container. Reference numeral 2206 denotes a sensor, which transmits the temperature, pressure, and oxygen concentration in the airtight container 2201 to the control panel 2205 as signals.

The airtight container 2201 is connected to an exhaust device 2208. Between the airtight container 2201 and the exhaust device 2208, metal recovery systems 2209 and 2210, which are devices for recovering constituent metals of waste, are provided. The metal recovery apparatus may include, for example, a cyclone separator provided with a cooling unit.

[0370] The waste, which is the object to be treated thermally decomposed in the pyrolysis furnace, is placed in an input shelf 220 provided in an airtight container 2201.
Then, heating (400 ° C.) and pressurization (3 atm) are started with the collection system closed at first. In this case, the heating efficiency is higher than the heating in the reduced pressure state, and contributes to the heating efficiency in the reduced pressure heating at the time of collecting the metal later.

Then, the inside of the airtight container 2201 is evacuated to a pressure of about 10 -3 Torr by an exhaust device, and heated to a temperature higher than the boiling point of the alloy according to the type of the metal, thereby evaporating the metal and causing the metal in the middle of the metal recovery system 2209, 2210. It is collected by the condensing means provided. In this case, the evaporation temperature of the metal is lower than normal pressure, so that a relatively low heating temperature is sufficient, and the metal is hardly oxidized, so that the recovery efficiency is high.

The reduced-pressure heating furnace illustrated in FIG. 31 has two systems of the metal recovery system. However, two systems may be used at the same time, or the system may be switched according to the temperature and pressure conditions in the airtight container. May be used to collect a plurality of metals.

As described above, according to the processing system of the present invention, the thermal efficiency is high and the processing cost is low. In addition, the recovery rate of high-purity metal is high by vacuum heating.

(Embodiment 16) Next, wastes of mounting boards, in which various electronic components are mounted on circuit boards used in large quantities, including various electronic devices, automobiles, precision instruments, and the like, are taken as objects to be treated. The processing will be described. As for the apparatus, the above-described processing apparatus of the present invention may be used. FIG. 32 is a diagram schematically showing a processing scheme of a mounting substrate using the processing apparatus of the present invention.

This processing system efficiently separates and collects electronic components from a mounting board on which various electronic components such as ICs, LSIs, resistors, and capacitors are mounted.
In addition, the system also separates and recovers the constituent resin and constituent metal of the mounting board composed of a circuit board, electronic components, and the like, and turns them into resources.

The waste of such a mounting board is difficult to separate the electronic components from the circuit board, and the mounting board is an object in which different materials are complicatedly integrated, and its processing is difficult. For this reason, landfill treatment, incineration treatment and the like have been common.

In the present invention, the mounting substrate is first introduced into the pyrolysis furnace without crushing, and the mounting substrate is thermally decomposed. The resin component of the board and the electronic components constituting the mounting board is thermally decomposed and emits gaseous emissions and is carbonized. The package resin of the electronic component also decomposes, becomes very brittle, and is easily separated from elements in the package. At this time, the temperature and the oxygen concentration in the pyrolysis furnace may be set under such conditions that heavy metals such as lead do not vaporize or oxidize.

The gaseous emission may be treated as described above. When the gaseous emission contains heavy metals such as lead, for example, the gaseous emission may be condensed in a gaseous emission treatment system such as a cooling unit, and the condensate may be introduced into a reduced pressure heating furnace together with the pyrolysis residue. . If chlorine is contained in the gaseous effluent, it may be brought into contact with high-temperature heated iron and recovered as iron chloride.

The mounting substrate, which is the object to be processed thermally decomposed in this way, is introduced into a reduced pressure heating furnace, and the temperature, pressure and oxygen concentration in the hermetic container are adjusted according to the metal to be recovered, and the desired metal is removed. Collect. For example, an alloy (for example, a Pb-Sn alloy) joining the circuit board and the electronic component is vaporized. It is preferable from the viewpoint of recycling that the alloys are selectively vaporized by the vapor pressure and separated.

If the alloy joining the circuit board and the electronic component is vaporized, the electronic component is separated from the circuit board. Even when the joining metals are melted in the pyrolysis furnace and the joining has already been released, the joining metal components (for example, lead, tin, etc.) are retained in the object to be treated. It can be vaporized and separated and collected from the object to be treated.

Not only the joining alloy for joining the circuit board and the electronic component but also the Zn, Sb, A
Various metals such as u, Pt, Ni, Cr, Cu, Al, Mo, W, and Ta may be vaporized and separated and recovered. Since the metal can be recovered in a metal state without being converted into an oxide, the utility value is high.

At the time of vaporizing the solder alloy, in order to increase the temperature raising efficiency, the solder alloy is heated to a temperature (for example, about 200 ° C.) at which the solder alloy is not so oxidized, and then the inside of the airtight container is further depressurized by the exhaust means (for example, for example). (About 400 ° C.), and may be condensed by condensing means provided in the middle of the recovery path.

According to this system, as shown in FIG. 26, the solder alloy of the mounting substrate is completely removed, and IC, L
The solder at the lead terminals of the SI, resistor, capacitor, etc. has also been completely removed. For this reason, not only can the electronic component be separated from the substrate, but also the circuit board and the electronic component can be easily recycled to enhance the value.

The constituent resin of the mounting board is vaporized, carbonized, or becomes an intermediate product, and can be effectively used.

If, for example, copper and carbide remain as processing residues of the reduced pressure heating furnace, copper and carbide may be separated with, for example, a calcium carbonate solution, and then the copper may be washed with washing water.

The constituent metals of the solder alloy evaporate in accordance with the degree of vacuum in the hermetic container. The higher the degree of vacuum, the lower the temperature of the constituent metals, so that the furnace wall of the processing apparatus is not damaged.

When the mounting substrate is landfilled, harmful metals such as Pb and Sb in the solder alloy are eluted by acid rain or the like, thereby contaminating soil and rivers. In addition, most of the resin remains semi-permanently without spontaneous decomposition.
There is also a problem in terms of environmental protection. According to the processing system of the present invention, these problems can be solved.

Further, various metals contained in circuit boards and electronic components can be separated and recovered for recycling. These metals include metals that may deplete resources, and rare metals that have a low elemental abundance in the crust. Therefore, recovering these metals will greatly help solve the resource and energy problems faced by the mass consumer society.

(Embodiment 17) Next, a circuit board on which a copper foil and a resin are laminated will be described as an object to be processed, and a processing system thereof will be described.

The circuit board may be a so-called copper-clad laminate, a flexible board, or a TAB (Tape Auto).
(Material Bonding) film carrier. Further, a cut-off portion of the copper-clad laminate, which is generated in a circuit board manufacturing process, may be processed. Further, as described above, a circuit board in which an electronic component and a bonding alloy are separated from a mounting board may be processed.

Although a circuit board will be described here, any object having copper and resin as constituents can be treated in the same manner.

The separation of the solder alloy and the electronic components from the mounting board is as described above. The decomposition of the constituent resin of the mounting board is also as described above.

This processing system heats a circuit board under non-oxidizing conditions in order to efficiently separate copper foil and resin,
The constituent resin of the circuit board is processed as a gaseous emission in the gaseous emission processing object physical system.

The copper foil is recovered as almost pure metal. Impurities such as carbides adhering to copper may be cleaned, vibrated, mixed with fine sand, and rotated as necessary. The apparatus may use the processing apparatus of the present invention.

FIG. 33 shows a circuit board 23 to be processed.
It is a figure which shows 00 schematically. The circuit board 2300 is a two-layer board in which a copper foil 2301 and a resin 2302 are integrally laminated.

[0396] The circuit board 2300 is introduced into the pyrolysis furnace,
The temperature and oxygen concentration in the pyrolysis furnace are adjusted so that the copper 2301 is not oxidized, and the resin 2302 is pyrolyzed (vaporized, oiled,
Carbonized). The gaseous effluent containing the decomposition product gas of the resin 2302 is processed in the gaseous effluent treatment system, and is rendered harmless and clean fuel gas.

FIG. 34 is a diagram schematically showing the circuit board 2300 after the constituent resin is thermally decomposed. Many of the resins exist as carbides.

In this state, the carbonized resin 2302 may be mechanically separated, but in the present invention, the pyrolysis residue of the circuit board mainly composed of metal copper and carbide is introduced into a reduced pressure heating furnace, While adjusting the pressure or the oxygen concentration in the airtight container, the temperature is heated to a temperature several tens of degrees higher than the melting point of copper to melt copper so as not to oxidize and vaporize. Copper 2301 in a liquid state becomes granular copper 2301b due to surface free energy (surface tension) (FIG. 35). If cooled in this state, the separation and recovery of copper is easier. For example, the melting point of copper at 760 Torr is 1080 ° C., but the temperature in the hermetic container is set to about 1150 ° C. (7
By heating to 60 Torr), copper can be collected in a granular form.

By heating the circuit board under reduced pressure or in a non-oxidizing atmosphere, the copper foil can be recovered almost without being oxidized. Incidentally, if necessary, impurities such as carbides attached to the surface may be removed by washing or the like.

As described above, according to the processing system of the present invention, copper can be separated and recovered in a metal state from an object in which resin and copper are integrated. Resins can also be recovered as oils and carbides.

(Embodiment 18) Next, a processing system using a resin-coated aluminum foil in which an aluminum foil and a resin are laminated will be described as an object to be processed.

[0402] Such a resin-coated aluminum foil is widely used for packaging containers for retort foods such as bags of potato chips and curries, packaging containers for foods and pharmaceuticals, and heat insulating materials.

[0403] Such a resin-coated aluminum foil is difficult to treat because the resin and the aluminum foil are integrated, and is treated by landfill or incineration. When incinerated, aluminum becomes an oxide, and its value as a resource is significantly reduced.

[0404] A great amount of energy is input into the refining of aluminum, and it is a waste of energy not to recycle.

According to the present invention, the resin-coated aluminum foil is heated in a pyrolysis furnace while controlling the oxygen concentration.
The constituent resin is thermally decomposed while maintaining the oxidation state of aluminum.

That is, in order to efficiently separate the aluminum foil and the resin, the resin-coated aluminum foil is heated under reduced pressure or non-oxidizing conditions, and the gaseous effluent is treated in the same manner as described above. Aluminum foil is recovered as almost pure metal. Impurities such as carbides adhering to aluminum may be cleaned, vibrated, mixed with fine sand and rotated as necessary.

When the aluminum foil contains another metal such as zinc, it may be introduced into a reduced pressure heating furnace, heated under reduced pressure, selectively vaporized, and separated and recovered. .

FIG. 36 shows a resin-coated aluminum foil 2600.
It is a figure which shows typically. Resin 2601 and aluminum foil 2602 are integrated.

First, the resin-coated aluminum foil 2600 to be treated is introduced into the thermal decomposition furnace of the processing apparatus of the present invention, and the resin-coated aluminum foil 2600 is heated to 400 to 650 ° C. while controlling the temperature and pressure conditions. Decomposes thermally.

[0410] When the temperature is lower than 400 ° C, the constituent resins are not sufficiently decomposed, and when the temperature is higher than 650 ° C, the aluminum foil is melted.

FIG. 37 is a view schematically showing the appearance of the resin-coated aluminum foil after the constituent resin 2601 has been decomposed. Carbide 2602b, which is a resin decomposition product, is adhered to the aluminum foil 2601 in a metal state. State. In this state, carbide 2602b is easily peeled off from the aluminum foil just by touching. Therefore, the aluminum foil can be easily recovered in a metal state (see FIG. 3).
8). In general, the constituent resin of the resin-coated aluminum foil is a thermoplastic resin, and a large part of the resin can be treated as gaseous effluent and converted into a fuel gas. The carbide of the constituent resin could be easily separated from the aluminum foil. Aluminum retained its metallic properties.

By heating the resin-coated aluminum foil in a non-oxidizing atmosphere as described above, aluminum can be recovered without being substantially oxidized. Incidentally, if necessary, impurities such as carbides attached to the surface may be removed by washing or the like.

[0413]

As described above, the processing apparatus of the present invention,
The processing method can safely and efficiently process an object to be processed including a resin and a metal. ADVANTAGE OF THE INVENTION According to this invention, a household electric appliance, a motor vehicle, a precision apparatus, etc. can make a harmful substance harmless or separate and collect | recover, without releasing a harmful substance into an environment. Further, the present invention includes a harmful substance and a source substance thereof, and prevents the destruction of the natural environment from the object to be treated, such as waste, which generates harmful substances such as dioxins when burned. Can be recovered in a high purity state. The present invention reforms and thermally decomposes the gaseous effluent discharged from the object to be treated at such a high temperature that dioxin is decomposed, and reduces the residence time in the temperature range where dioxin is generated and recombined from this state as much as possible. do it,
By rapidly cooling to a third temperature at which dioxin is not generated and resynthesized, the concentration of dioxin in the gaseous effluent can be greatly reduced. A first pyrolysis,
The second pyrolysis or reforming is performed at a first temperature and a second temperature of two.
By carrying out these in a reducing atmosphere at the same time as treating at the stage, the source concentration of dioxin is greatly reduced,
Dioxin concentration in gaseous effluent can be greatly reduced.

According to the present invention, a resin containing a resin such as shredder dust and a metal, and from a difficult-to-treat waste containing a heavy metal and a source of dioxin, without generating harmful substances such as dioxin. The components can be converted into clean gas fuels, and high purity can be recovered without releasing harmful heavy metals such as lead, arsenic, and cadmium into the environment.

[0415] According to the present invention, harmful substances such as difficult-to-treat waste such as a mounting board are not released, and harmful substances are removed.
It can be separated into electronic components such as C, resistors and capacitors. At the same time, heavy metals such as lead and other metals can be vaporized and recovered in a highly pure metal state.
Further, metals and copper constituting the circuit board and the like can be recovered with high purity. The resin portion is carbonized, and can be used for activated carbon and an effective component of soil.
Further, the processing apparatus and the processing method of the present invention can remove lead by vaporizing lead from an object containing lead. Further, lead can be removed from an object containing lead and a resin. The resin can be recovered by converting it into carbide and fuel gas. By removing lead, environmental pollution can be prevented and adverse health effects can be prevented. In addition, shortage of a waste disposal site can be solved.

[0416] The treatment apparatus and treatment method of the present invention can also vaporize metal from an object containing resin and metal and recover it in a metal state. The resin can be recovered by converting it into carbide and fuel gas.

[0417] Further, the processing apparatus and the processing method of the present invention can remove the bonding metal by vaporizing the bonding metal of the object bonded with the metal. Further, the joining alloy of the object joined by the alloy can be vaporized to remove the joining metal. Even when the object contains a resin, the resin can be recovered by converting it into a carbide and a fuel gas.

Further, the processing apparatus and processing method of the present invention can vaporize the constituent metal of the solder alloy of the object joined by the solder alloy and remove the joining metal. Even when the solder alloy contains harmful lead, heavy metals such as lead can be separated and recovered with high purity and high yield.

[0419] The processing apparatus and method of the present invention can process a mounting board on which electronic components are mounted on a circuit board, and can effectively separate the electronic components from the circuit board. Even in the case where a solder alloy containing lead is used for joining the electronic component to the circuit board, the lead can be effectively separated and harmful lead can be recovered. The constituent resin of the mounting substrate can be recovered by converting it into carbide and fuel gas. .

The processing apparatus and processing method of the present invention can effectively and economically process an object having a metal and a resin as constituents. The metal can be recovered in a substantially metallic state. The resin can be used as a carbide or as a clean fuel gas. Further, the present invention can effectively separate a resin component and a metal from an object in which a resin and a plurality of metals are integrated.

Further, the processing apparatus, processing system, and processing method of the present invention can easily recover copper in a metal state from an object in which resin and copper are integrated. The resin can be utilized as a carbide or as a clean fuel gas.

The processing apparatus, processing system, and processing method of the present invention can easily recover aluminum in a metal state from an object in which resin and aluminum are integrated. The fuel gas recovered from the resin can also be used as a heating unit of the processing apparatus. In addition, by operating the processing apparatus of the present invention or selling electricity by generating power using the fuel gas, the operating cost of the processing apparatus can be greatly reduced. In addition, carbide is excellent as activated carbon, fertilizer, and the like.

Further, since the processing apparatus and the processing method of the present invention have high energy efficiency, objects in a wider range of categories can be processed to increase the value and to achieve recycling. In other words, the processing apparatus and the processing method of the present invention are intended to safely and effectively process and recycle resources to be processed, such as a resin and a metal, a substrate and an electronic component, and a metal and a metal. Can be.

[Brief description of the drawings]

FIG. 1 is a view schematically showing an example of a processing apparatus according to the present invention.

FIG. 2 is a diagram schematically showing the configuration of the processing apparatus of the present invention illustrated in FIG.

FIG. 3 is a diagram schematically showing an example of the structure of a pyrolysis furnace.

FIG. 4 is a diagram schematically showing one example of the structure of a gas decomposer.

FIG. 5 is a diagram schematically showing an example of the structure of a cooling tower.

FIG. 6 is a diagram showing a part of the configuration of a gaseous emission treatment system in which a bag filter is connected to a stage subsequent to a cooling tower.

FIG. 7 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 8 is a diagram schematically showing the configuration of the processing apparatus of the present invention illustrated in FIG. 7;

FIG. 9 is a diagram schematically showing an example in which the treatment method of the present invention is applied to waste treatment.

FIG. 10 is a diagram schematically showing an example of the configuration of a shredder device.

FIG. 11 is a perspective view schematically showing one example of a processing apparatus of the present invention.

FIG. 12 is a diagram schematically showing the processing apparatus of the present invention exemplified in FIG. 1;

FIG. 13 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 14 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 15 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 16 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 17 is a diagram schematically showing a configuration of a control system for adjusting the temperature, pressure, and oxygen concentration of the processing apparatus of the present invention.

FIG. 18 is a view schematically showing another example of the processing apparatus of the present invention.

FIG. 19 is a diagram schematically showing a recovery system including a recovery chamber connected to the processing apparatus of the present invention.

FIG. 20 is a diagram schematically showing an example of the structure of a collection chamber.

FIG. 21 is a view schematically showing an example of the structure of a collection chamber.

FIG. 22 is a graph showing the temperature dependence of the boiling point (vapor pressure) of lead.

FIG. 23 is a diagram schematically showing a state before processing of a mounting substrate as a processing target object.

FIG. 24 is a view schematically showing a state of a mounting board in which constituent resins are decomposed.

FIG. 25 is a view schematically showing a state in which lead is vaporized.

FIG. 26 is a diagram schematically showing a state where the circuit board and the electronic component are separated.

FIG. 27 is a graph showing pressure dependence of boiling points (vapor pressures) of various metals.

FIG. 28 is a graph showing the free energy of formation of various oxides and their temperature dependence.

FIG. 29 is a view schematically showing one example of a processing apparatus of the present invention.

FIG. 30 is a diagram schematically showing a partition wall of the processing apparatus of the present invention.

FIG. 31 is a view schematically showing one example of a processing apparatus of the present invention.

FIG. 32 is a view schematically showing a processing scheme of a mounting substrate using the processing apparatus of the present invention.

FIG. 33 is a diagram schematically showing a state before processing of a circuit board as a processing target object.

FIG. 34 is a view schematically showing a state of a circuit board in which constituent resins are decomposed.

FIG. 35 is a diagram schematically showing a state in which copper gathers in a granular form due to surface tension.

FIG. 36 is a view schematically showing a state before processing of a resin-coated aluminum foil as a processing target object.

FIG. 37 is a view schematically showing a state of a resin-coated aluminum foil in which a constituent resin is decomposed.

FIG. 38 is a view schematically showing an aluminum foil separated from a resin-coated aluminum foil.

[Explanation of symbols]

10 processing apparatus 20 pyrolysis furnace 25 shredder 30 gas decomposer 40 cooling tower 50 reduced pressure heating furnace 51 purge chamber 52 first airtight chamber 53 cooling chamber 70 Neutralization reaction filter 54a, 54b, 54c, 54d Partition wall 55 Exhaust system 60 Recovery chamber 100 Reduced pressure heating device 101 Purge chamber 102 First airtight chamber 103 Second hermetic chamber 104 Cooling chamber 105 Door 106 Exhaust system 107 Trap 108 Carrier gas introduction valve 109 Electric heater 110 Exhaust system 111 Recovery chamber 112 Carrier gas Introduction valve 113 Electric heater 114 Exhaust system 115 Recovery chamber 116 Exhaust system 117 Carrier gas introduction valve 118 Trap 130 Pusher 131 drawer 150 processing object 200 control panel 201 temperature sensor 202 pressure sensor 203 oxygen concentration sensor 204 carrier gas reservoir 1300 mounting board 1301 copper foil 1302 ... Resin 1303 ... Circuit board 1304 ... Electronic component 1305 ... Package resin 1306 ... Lead terminal 1307 ... Pb-Sn-based solder alloy 1308 ... Lead 2300 ... Circuit board 2301 ... Copper foil 2302 ... Resin 2600 ... Resin-coated aluminum foil 2601 ... Aluminum 2602 ... Resin

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C10L 3/06 C22B 7/00 F 4K063 C22B 1/00 601 9/02 7/00 F27D 7/06 C 9 / 02 17/00 104A F27D 7/06 104D 17/00 104 104G 19/00 A D 19/00 B09B 3/00 ZAB C10L 3/00 A (72) Inventor Naohiko Chisato Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa No. 8 In the Toshiba Yokohama Office (72) Inventor Tomiaki Furuya 8 in Shinsugita-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture Inside the Toshiba Yokohama Office (72) Inventor Yoshiaki Yokoyama 1807- 1. Within Ogihara Ecology Co., Ltd. (72) Inventor Eihisa Ogihara 1807-1 Takabayashi Kotobukicho, Ota City, Gunma Prefecture Ogihara Ecology Co., Ltd. (72) Akiha Kaichiro Ogiwara 1807-1 Takabayashi Kotobukicho, Ota City, Gunma Prefecture F-term (reference) in Ogihara Ecology Co., Ltd. AA01 AA05 AA06 AA11 AA14 AA15 AA20 AA21 AA24 AA42 BA24 EA01 EA12 GB09 GB11 4K056 AA19 BB01 CA14 CA18 CA20 DB01 DB07 DC15 FA02 FA08 FA11 FA15 4K063 AA13 BA12 BA13 CA02 DA16 DA17 DA32 DA33 DA34 EA01

Claims (5)

[Claims] 1. An airtight container holding therein an object having lead and resin as constituents, a temperature adjusting device for adjusting the temperature in the airtight container, and a pressure adjusting device for adjusting the pressure in the airtight container. An oxygen concentration adjusting means for adjusting the oxygen concentration in the hermetic container; and a second controlling the temperature adjusting means and the oxygen concentration adjusting means such that the resin decomposes the temperature and the oxygen concentration in the hermetic container. Control means for controlling the temperature control means and the pressure control means such that lead in the object selectively vaporizes the temperature and pressure in the container; and A reforming unit connected to an airtight container and reforming a gas generated by decomposing the resin at a temperature at which dioxin is decomposed; and a reforming unit connected to the reforming unit and a gas reformed by the reforming unit. Increase in dioxin concentration A cooling means for rapidly cooling the gas, a first recovery means connected to the cooling means and recovering the gas cooled by the cooling means, and A second recovery means for recovering vaporized lead from the wastewater. 2. A step of introducing an object having lead and resin as constituents and sealing the airtight container, and adjusting a temperature and an oxygen concentration in the airtight container so that the resin is decomposed. A control step; a second control step of adjusting the temperature and pressure in the hermetic container so that lead in the object is selectively vaporized; and dioxin decomposes a gas generated by decomposing the resin. A reforming step of reforming at such a temperature, a cooling step of rapidly cooling the gas so that an increase in dioxin concentration in the gas reformed in the reforming step is suppressed, and cooling in the cooling step. A processing method comprising: a first recovery step of recovering gas; and a second recovery step of recovering vaporized lead from the object. 3. An airtight container which holds therein a first object and a second object each having a resin as a constituent material, the airtight container being joined with an alloy having a first metal and a second metal, and the airtight container. Temperature adjusting means for adjusting the temperature in the airtight container; pressure adjusting means for adjusting the pressure in the airtight container; oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container; and temperature and oxygen concentration in the airtight container. A first control means for controlling the temperature control means and the oxygen concentration control means so that the resin is decomposed; and a first metal of the alloy selectively controlling a temperature and a pressure in the airtight container. Second control means for controlling the temperature control means and the pressure control means so as to vaporize, and the temperature control so that the second metal of the alloy vaporizes the temperature and pressure in the airtight container. Third means for controlling the means and the pressure regulating means A control means connected to the airtight container, and a reforming means for reforming a gas generated by decomposing the resin at a temperature at which dioxin is decomposed; a reforming means connected to the reforming means; Cooling means for rapidly cooling the gas so as to suppress an increase in the dioxin concentration of the reformed gas; and first recovery means connected to the cooling means and recovering the gas cooled by the cooling means. And a second recovery means for recovering the first metal vaporized from the alloy. 4. The method according to claim 1, wherein the first metal is Zn, Cd, Hg, G
a, As, In, Tl, Sn, Pb, Sb, Bi, Ag
4. The processing system according to claim 3, wherein the element is at least one element of In. 5. An object having a first object and a second object, each of which is made of a resin and is joined by an alloy having a first metal and a second metal, is introduced into an airtight container. A step of sealing the airtight container, a first control step of adjusting the temperature and the oxygen concentration in the airtight container so that the resin is decomposed, and a first metal in the alloy is selectively vaporized. A second control step of adjusting the temperature and pressure in the hermetic container, and a third control step of adjusting the temperature and pressure in the hermetic container so that the second metal of the alloy is vaporized. A reforming step of reforming a gas generated by decomposing the resin at a temperature at which dioxin is decomposed, so that an increase in dioxin concentration in the gas reformed in the reforming step is suppressed. A cooling step of quenching the gas, and cooling in the cooling step A processing method comprising: a first recovery step of recovering a gas; and a second recovery step of recovering a first metal vaporized from the alloy.