JP2007196229A - Treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively and cost-effectively treat an object comprising a metal or an organic material as a constituent. <P>SOLUTION: This treatment apparatus comprises a first hermetically sealing chamber having a first opening, a pipe, which is disposed so as to be insertable into the first opening, has a second opening at the end of the insertion direction, and has a third opening on its surface, a hermetically sealing door, which is disposed on the outer side of the first hermetically sealing chamber so as to open and close the first opening, and, upon the insertion of the pipe into the first opening, is located between the second opening and the third opening, and is shielded from the first hermetically sealing chamber by the pipe, and an exhaust system comprising an exhaust port. Upon the insertion of the pipe into the first opening, the exhaust port is located opposite to the third opening, and the first hermetically sealing chamber is evacuated through the second opening, the third opening, and the exhaust port. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a processing apparatus.

  The enormous amount of waste that modern society has is increasing day by day, and the establishment of effective treatment technology is urgently needed.

  Although various useful substances are included in the waste, it is not separated from the waste due to difficulty in separation, and most of the waste is disposed as it is by landfill or incineration. Useful substances in waste have energy problems and resource depletion problems, and are required to be separated, recovered and reused as much as possible.

  On the other hand, hazardous substances are also included in the waste, and such harmful substances not only cause environmental destruction, but are one of the major causes that make it difficult to reuse the waste. Therefore, if harmful substances in waste can be effectively removed, waste can be actively reused as a treasure trove of resources, and the impact on the environment and living organisms can be minimized. it can.

  Thus, in order to solve the serious problems surrounding modern society such as environmental pollution by harmful substances, depletion of resources, and shortage of energy sources, technology for effectively treating waste must be established.

  However, in recent years, the form of waste has been complicated and varied, and there are many complex wastes in which a plurality of different materials are integrated, and there are also wastes containing harmful substances. In order to reuse such composite waste as a resource, it is necessary to selectively separate and recover useful and harmful substances from waste that integrates multiple different materials. Such processing technology has not yet been established.

In other words, waste can be a treasure trove of resources if toxic substances can be separated. So-called waste is so called by relative value judgment. If resource recovery technology is established and the cost required for resource recovery can be reduced, it is a resource and not a waste product.
JP-A-11-92588

  The present invention has been made to solve such problems. That is, an object of the present invention is to provide a processing apparatus capable of effectively and economically processing an object having a metal or organic material as a constituent material.

  The present invention also relates to a treatment method and a treatment apparatus capable of suppressing the generation of dioxins, and in particular, organic matter containing dioxins in the treatment of pyrolysis treatment of waste vehicles, garbage generated from factories, general households, and waste. It aims at providing the processing apparatus which can suppress generating of a halide. Moreover, it aims at providing the processing apparatus which can reduce the residual dioxin density | concentration in the thermal decomposition residue, incineration residue, residual liquid, soil, sludge, etc. containing harmful organic halides, such as dioxin. Furthermore, this invention aims at providing the processing method s which can clean the soil contaminated with organic halides, such as dioxins, PCB, and coplana PCB, and harmful substances such as heavy metals, and incineration fly ash. .

  In order to solve such a problem, the processing apparatus of the present invention employs the following configuration. That is, the processing apparatus of the present invention includes a first hermetic chamber having a first opening, a tube that is inserted in the first opening and has a second opening in the insertion direction, and the first And an airtight door which is disposed so as to be openable and closable and is shielded from the first airtight chamber by the tube when the tube is inserted into the first opening. To do.

  Examples of the first hermetic chamber include a heating furnace, a decompression furnace, and a decompression heating furnace. Further, such a hermetic chamber is not limited to a single chamber configuration, and a plurality of such hermetic chambers may be arranged with a door therebetween. In addition, a purge chamber for purging the processing atmosphere of the processing target object, a preheating chamber for preheating the processing target object, a cooling chamber for cooling the processing target object, and the like may be further provided in the front stage or the rear stage of these hermetic chambers. When the pressure in the first hermetic chamber is reduced, an exhaust system that exhausts the first hermetic chamber through the first opening may be provided. Examples of the exhaust system include various vacuum pumps (rotary pumps, oil diffusion pumps, mechanical booster pumps, turbo molecular pumps, ion getter pumps, liquid seal pumps, etc.), blowers, fans, and the like. With such an exhaust system, the pressure in the first hermetic chamber can be adjusted.

  The first hermetic chamber is provided with a first opening. In the treatment apparatus of the present invention, the gaseous emission generated from the object to be treated by heating, depressurizing or the like in the first hermetic chamber is discharged through a pipe inserted into the first opening when the hermetic door is open. Retrieved and processed. Here, the gaseous emission includes gas, droplets, mist, solid fine particles, and the like generated by heating, depressurizing, and the like of the object to be processed. Examples of the gaseous emission include a gas generated by thermal decomposition or reaction of a constituent component of the object to be treated, a gas obtained by vaporizing the constituent component, and the like. These gaseous effluents taken out from the first hermetic chamber are introduced into a predetermined processing system. There are various types of treatment systems for gaseous emissions. For example, condensation, thermal decomposition, cracking, reforming (including hydro reforming), decomposition by catalyst, decomposition by plasma or glow discharge, adsorption by various adsorbents A trap by a dry filter or a wet filter (liquid filter) can be used. A plurality of the first openings may be provided. The first opening is preferably provided separately from the opening for introducing the object to be processed into the first hermetic chamber and the opening for taking out the object to be processed from the first hermetic chamber.

  An airtight door, which is a shutter that can be opened and closed, is disposed in the first opening of the first hermetic chamber. The hermetic door may be opened and closed by a driving mechanism such as a cylinder. A mechanism such as a joint that converts the pressing force of the cylinder into the normal direction of the opening surface of the first opening when the operation direction of the hermetic door is substantially perpendicular to the normal direction of the opening surface of the first opening. You may make it provide in the connection part of a cylinder and an airtight door. By doing in this way, an airtight door can be pressed more strongly in the normal line direction of a 1st opening surface, and airtightness can be improved. The airtight doors may be arranged in multiple. Moreover, it is preferable to cool the part which the seal part of an airtight door contacts when the airtight door is closed.

  In the processing apparatus of the present invention, the hermetic door is opened, a tube is inserted from the outside into the first opening of the first hermetic chamber, and the gaseous discharge is taken out from the hermetic chamber through this tube. Further, a second hermetic chamber connected to the first hermetic chamber via the first opening may be provided, and the tube may be inserted into the first opening from the second hermetic chamber. The tube has an outer shape that aligns with the first opening. As a form of the pipe, there is a pipe having a third opening on a side facing the first hermetic chamber with the hermetic door interposed therebetween when the pipe is inserted into the first opening. The third opening may be disposed so as to face the second opening, or may be disposed on the side surface of the pipe.

    Further, the pipe may have a double structure, and a refrigerant such as nitrogen gas, air, water, etc. may be circulated between the inner layer and the outer layer. Thereby, the shielding capability of the airtight door by the pipe is improved, and the pipe can be effectively cooled. For example, the condensation efficiency can be improved also when the metal is vaporized from the object to be treated and the vaporized metal is condensed in the tube. Further, the tubes may be disposed so as to be replaceable. In this way, the tube also functions as a replaceable cartridge for collecting the condensate.

  When the tube is inserted into the first opening, the hermetic door is shielded from the first hermetic chamber by the region between the second opening and the third opening on the side of the tube. For this reason, it is possible to prevent the gaseous emission from condensing or adhering to the hermetic door. Further, for example, even when a packing made of resin or the like is disposed on the seal portion of the hermetic door, the seal portion of the hermetic door can be prevented from being damaged by the heat of the gaseous emission. Therefore, the sealing performance of the hermetic door can be maintained. Thus, in the processing apparatus of the present invention, the interface from the first hermetic chamber to the outside is realized by the hermetic door and the pipe.

  A cylindrical sleeve may be provided in the first opening of the first hermetic chamber, and the tube may be inserted into the sleeve. As the temperature in the first hermetic chamber changes, the tube, the first opening, or the sleeve is deformed by thermal expansion or the like. Due to this thermal expansion, the inserted tube may not be able to be removed from the first opening or the tube. For this reason, for example, the thermal expansion coefficient of the sleeve may be the same as or larger than the thermal expansion coefficient of the tube. Further, the tube may be selectively contracted by heating or keeping the sleeve and cooling the tube.

  The sleeve is preferably made of a material having high thermal conductivity such as carbon or metal. By doing in this way, the evaporate from the object to be treated is condensed after reaching the farther from the second opening of the tube. Therefore, recovery efficiency can be improved.

  In the processing apparatus of the present invention, in order to assist the movement operation of the tube, a means may be provided which is disposed along the insertion direction of the tube and guides the insertion and removal operations of the tube. For example, the guide means may be provided with a guide rail, a guide roller or the like as required.

  Further, as an aspect of the processing apparatus of the present invention, the treatment apparatus further includes a second hermetic chamber adjacent to the first hermetic chamber via the hermetic door, and the pipe is connected to the first airtight chamber from the second hermetic chamber. Some are inserted into the first opening of the closed chamber. That is, the first hermetic chamber and the second hermetic chamber are connected through the first opening provided with the hermetic door. The tube is then inserted from the second hermetic chamber into the first opening. When the tube is inserted into the first opening of the first hermetic chamber, the first hermetic chamber and the second hermetic chamber are connected by the tube. When the tube is inserted into the first opening, the second opening of the tube is located closer to the first hermetic chamber than the hermetic door, and the third opening is located closer to the second hermetic chamber than the hermetic door. It is arranged as follows. At the same time, the hermetic door is shielded from the first hermetic chamber and the second hermetic chamber by a tube.

  In the second hermetic chamber, various types of treatment of gaseous emission from the object to be treated can be performed. For example, the gaseous discharge may be condensed by cooling the second hermetic chamber or tube. Further, reforming or cracking of the gaseous emission may be performed in the second hermetic chamber. The tube or the second hermetic chamber may be provided between the first hermetic chamber and the exhaust system. In this case, the exhaust system is connected to the first hermetic chamber via the pipe or the second hermetic chamber. By adopting such a configuration, for example, the metal vaporized under reduced pressure from the object to be treated in the first hermetic chamber can be condensed in the tube or the second hermetic chamber in a reduced pressure state. Further, the treatment of gaseous effluent can be performed in a reduced pressure state. Since the intermolecular distance becomes longer under reduced pressure, the chance of reaction between molecules is less than that at normal pressure or under pressure. For example, even when the gaseous effluent contains a component having an organic halide generating ability such as aromatic hydrocarbon, halogen, and oxygen, the generation of the organic halide can be suppressed. The reduced pressure state is also suitable for the case where, for example, processing is performed by plasma discharge of gaseous emission.

  The second hermetic chamber is preferably controlled (cooled, heated) in temperature. As a cooling structure of the second hermetic chamber, for example, a so-called water-cooled jacket structure in which the second hermetic chamber has a double structure and a refrigerant such as water is circulated in the outer layer can be exemplified. By doing so, it is possible to efficiently condense the evaporated matter and the gaseous emission from the object to be treated in the pipe or the second hermetic chamber.

  When the tube is arranged as a replaceable cartridge, for example, an airtightly openable / closable door for replacing the tube is provided in the second hermetic chamber, and the tube is exchanged by opening the door. Also good. If the metal condensed in the pipe or the second hermetic chamber is taken out into the atmosphere as it is, it may burn violently. For this reason, when condensing and recovering metal, it is preferable to cool the condensed metal with a non-oxidizing gas before taking it out. Therefore, it is preferable that the second hermetic chamber is provided with means for supplying a non-oxidizing gas.

  In the processing apparatus of the present invention, even when the second hermetic chamber is opened and the pipe is taken out, the airtightness of the hermetic door is maintained, so that the outside air can be prevented from leaking into the first hermetic chamber. . Therefore, the tube can be taken out while maintaining the temperature condition and pressure condition in the first hermetic chamber. For this reason, the processing apparatus can be operated continuously, and the processing productivity can be improved. In the processing apparatus of the present invention, this point is greatly different from the conventional processing apparatus in which the processing apparatus is stopped to take out the gaseous emission and its condensate out of the system.

    The exhaust system may be connected to the second hermetic chamber or to the third opening of the tube. In the former case, the gaseous effluent is led from the pipe through the second hermetic chamber to the exhaust system. In the latter case, gaseous effluent is led directly from the third opening of the tube to the exhaust system. The third opening of the tube and the exhaust system are preferably connected as tightly as possible. By directly connecting the third opening of the tube and the exhaust system, it is possible to prevent the evaporation from the object to be processed from condensing in the second hermetic chamber.

  In order to guide the gaseous effluent from the object to be processed to the outside by the pipe while shielding the hermetic door by the pipe, the pipe is preferably fitted as much as possible to the first opening or the sleeve. However, due to thermal expansion of the sleeve, the tube, or the condensate in the tube, the tube may not easily come off the sleeve. When the third opening of the tube and the exhaust system are directly connected, the space between the second hermetic chamber and the tube is not limited to the first hermetic chamber and the tube, even if there is a slight gap between the tube and the sleeve. It is possible to prevent the gaseous exhaust from flowing into the space between the second hermetic chamber and the pipe through the pipe. In order to connect the third opening of the tube and the exhaust system, when the tube is inserted into the first opening, a pipe or packing that connects the third opening and the exhaust system is used. May be.

  Further, when the tube is inserted into the first opening of the first hermetic chamber, the pressure in the space between the tube and the second hermetic chamber is the pressure in the first hermetic chamber. It is also possible to further comprise means for adjusting the height to be higher. Further, when the tube is inserted into the first opening of the first hermetic chamber, the pressure in the first hermetic chamber is changed to the pressure in the space between the tube and the second hermetic chamber. There may be provided means for adjusting the pressure so that the pressure is lower and higher than the pressure in the pipe. That is, assuming that the pressure in the first hermetic chamber is P1, the pressure in the space between the pipe and the second hermetic chamber is P2, and the pressure in the pipe is P3, P2> P1, more preferably P2> P1>. By setting it as P3, it is possible to prevent the evaporant from entering the space between the pipe and the second hermetic chamber from the first hermetic chamber.

  Such pressure adjustment may be performed by supplying a carrier gas to a space between the tube and the second hermetic chamber. The carrier gas supplied to the space between the tube and the second hermetic chamber is guided into the tube through the first hermetic chamber and exhausted through the third opening of the tube. For this reason, the space between the tube and the second hermetic chamber is sealed from the first hermetic chamber by pressure. Since the space between the pipe and the second hermetic chamber is also connected to the space accommodated when the hermetic door is open, the evaporated material from the object to be processed into the hermetic door, particularly its seal portion. Can be prevented from condensing. Furthermore, by adopting such a configuration. The fitting margin between the tube and the sleeve is increased. For this reason, it is possible to prevent the tube and the sleeve from engaging with each other and becoming unable to come off.

  The processing apparatus of the present invention may further include a filter means disposed between the second hermetic chamber (or a pipe) and the exhaust means. It is preferable to provide at least a wet filter as the filter means. In the case where the first hermetic chamber is decompressed by the exhaust system and the evaporant from the object to be treated is condensed between the first hermetic chamber and the exhaust system, uncondensed evaporant or condensed solid particles are The vacuum pump is inevitably reached. For this reason, the vacuum pump hurts and the maintenance frequency increases. In the treatment apparatus of the present invention, a wet filter that traps fine particles and dust in a gas in a liquid such as oil and water is provided in front of the exhaust system, thereby preventing the fine particles and dust from reaching the vacuum pump. can do. As the wet filter, for example, an oil film filter in which a cloth-like carrier is impregnated with oil can be used. Oil is sucked into the cloth by a capillary phenomenon or the like to form an oil film. Dust and fine particles guided to the exhaust system are trapped in this oil film. Instead of oil, a liquid film made of an aqueous solution such as an alkaline solution may be formed to trap acidic substances such as nitrogen oxides and sulfur oxides. Further, a liquid ring pump such as a water ring pump or an oil ring pump may be used as a wet filter. In this case, dust and fine particles are trapped in the liquid seal of the liquid ring pump.

  Of course, a dry filter such as a net or a non-woven fabric may be disposed between the tube, the second hermetic chamber, or the vacuum pump. Such a dry filter may be disposed inside the tube or in the second hermetic chamber. However, this type of filter that traps solids in a dry state is inevitable to pass a part of the trapped dust when the back side is exhausted by a vacuum pump. It is preferable to use it.

  The treatment method of the present invention is caused by the thermal decomposition, wherein the object to be treated is heated in an airtight region to thermally decompose the components of the object to be treated, and is adjacent to the airtight region with an airtight door that can be opened and closed. From the treatment system side of the gaseous emission component, the gas-tight emission is introduced to the treatment system side by opening the hermetic door and inserting a tube so that the hermetic door is shielded from the airtight region. It is characterized by that.

  Further, the processing method of the present invention introduces a processing target object into an airtight region, extracts a component of the processing target object by reducing the pressure in the airtight region, and sandwiches the airtight door that can be opened and closed with the airtight region. Opening the hermetic door from the processing system side of the adjacent extraction component and inserting a tube so that the hermetic door is shielded from the hermetic region, and introducing the extraction component to the processing system side, Features.

  Further, the processing method of the present invention comprises heating an object to be processed containing the first metal under reduced pressure in the first hermetic zone to evaporate the first metal, thereby providing an airtight door that can be opened and closed with the hermetic zone. A tube is inserted from a second hermetic chamber adjacent to the airtight chamber so that the hermetic door is shielded from the first hermetic chamber, and the tube is cooled to condense the first metal. To do.

  Moreover, the processing apparatus of this invention heats the soil containing a 1st metal under pressure reduction within an airtight area | region, the said 1st metal is evaporated, and it adjoins on both sides of the airtight door which can be opened and closed with the said airtight area | region. A tube is inserted from the second hermetic chamber so that the hermetic door is shielded from the hermetic region, and the first metal evaporated from the object to be treated is condensed by cooling the tube. And

  Moreover, the treatment apparatus of the present invention heats the soil containing moisture, organic matter, and the first metal in an airtight region to evaporate the moisture, and evaporates or pyrolyzes the organic matter, evaporating the moisture, From the treatment system side of the moisture, the organic matter or the pyrolysis product of the organic matter, the organic matter or the pyrolysis product of the organic matter is connected to the hermetic zone through a first hermetic door that can be opened and closed. 1 is opened, a tube is inserted so that the first hermetic door is shielded from the hermetic region and introduced into the processing system, the evaporation of the moisture and the organic matter, and the heat of the organic matter After the decomposition, the first metal is evaporated, and the evaporated first metal is supplied from the second hermetic chamber side adjacent to the second hermetic door that can be opened and closed with the hermetic region. Open the airtight door and the second airtight door Insert the tube to be shielded from the high-density regions introduced into the second airtight chamber, and cooling the tube to condense at least the first metal, the processing method of the soil, characterized in that. After evaporating the first metal from the soil, it is preferable to cool the heating residue of the processing apparatus with a cooling gas that is substantially free of organic halides.

  That is, in the treatment method of the present invention, when the object to be treated is heated, depressurized or the like in the airtight region, the gaseous emission containing the evaporant from the object to be treated is converted into the temperature, pressure, oxygen concentration, etc. It is a method of taking out gaseous emission from an airtight region while maintaining various conditions. For this reason, the present invention employs a door that is disposed in the opening of the hermetic region and can hermetically seal the hermetic region, and a tube that is inserted into and removed from the opening of the hermetic region. As described above, in the present invention, when the door is opened and gaseous effluent is introduced into the treatment system from the airtight region, a tube is inserted into the opening, and the door in the retracted position opened by the tube is inserted. Shield from gaseous emissions. By adopting such a configuration, it is possible to prevent the gaseous emission from condensing or adhering to the hermetic door. Further, it is possible to prevent the sealing portion of the hermetic door from being damaged by the heat of the gaseous emission, and the sealing performance of the hermetic door can be maintained.

  Next, an example of a processing apparatus to which the present invention can be applied will be described. By using a tube and an airtight door, the present invention for extracting gaseous emission from the object to be treated from the airtight region to the treatment system can be applied to various treatment apparatuses as described below.

  The present invention includes a processing system means for processing an organic substance such as a resin and a processing system for vaporizing and recovering the metal in order to process an object to be processed having a resin and a metal as constituent materials. .

  The processing apparatus of the present invention is a processing apparatus for processing a processing target object having a resin and a metal as constituents, and adjusts the temperature and pressure so that the resin of the processing target object is selectively thermally decomposed. A temperature control means and a pressure control means that are separated from each other by a first airtight area and a partition wall that can be opened and closed, and selectively vaporize the metal in the object to be treated. A second airtight region having a temperature adjusting means and a pressure adjusting means for adjusting the pressure and the pressure, and a first process connected to the first airtight region and treating a gas generated by thermal decomposition of the resin And a second processing system that is connected to the second hermetic zone and processes metal vaporized from the object to be processed.

  The first hermetic zone is for selectively thermally decomposing organic substances such as resin so that metals (except mercury) in the object to be treated are not vaporized. In general, when the object to be processed is complex, the object to be processed may be partially oxidized or reduced or the phase equilibrium state may change during the process. (However, excluding mercury) may remain in the object to be treated or in the first hermetic zone without being vaporized. Moreover, you may make it provide the temperature control means and pressure control means which decompose | disassemble organic substance, maintaining the component metal of a process target object not oxidizing substantially.

  As the temperature adjusting means, a heating means and a temperature measuring means may be used. As the heating means, various convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater or a radiant tube may be used, or gas, heavy oil, light oil, or the like may be burned. Further, induction heating means may be used. Various temperature sensors may be used as the temperature measuring means.

  In the first hermetic zone, organic substances such as resin are selectively decomposed under temperature and pressure conditions such that the metal in the object to be treated does not oxidize or vaporize so much, and vaporize (including those vaporized after being oiled) or carbonized. To do.

  The vaporized decomposition product gas of the resin is processed in the first processing system. For example, the recovered resin decomposition product may be burned and used as a heating means. As described above, in general, when the object to be processed is complicated and has a large amount, the object to be processed may be partially oxidized or reduced or the phase equilibrium state may change during the process. possible. For example, when the constituent metal of the object to be processed is mixed in the first processing system that recovers the decomposition product of the resin, it may be separated and recovered in a subsequent process.

  As the pressure adjusting means, exhaust means or pressurizing means and pressure measuring means may be used. As the exhaust means, various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube or a Pirani gauge.

  Further, a purge region may be provided adjacent to the first hermetic region. In the purge region, pressure adjusting means such as an exhaust system or pressurizing system, and temperature adjusting means for preheating or cooling the object to be processed may be provided. Further, a carrier gas introduction system for gas replacement in the system may be provided, and this carrier gas introduction system may also serve as a pressurization system.

  The object to be treated is introduced from the outside of the apparatus into the first hermetic zone through the purge zone.

  By providing the purge region, the first hermetic region is isolated from the outside of the apparatus when the object to be processed is introduced into the first hermetic region. Moreover, since the inside of the first hermetic zone is always evacuated to maintain the reduced pressure state, the burden on the vacuum pump is reduced.

  Similarly, a purge region may be provided adjacent to the second hermetic region. The object to be processed is taken out of the apparatus from the second airtight region through the purge region.

  By providing a purge area after the second airtight area, the second airtight area is isolated from the outside of the apparatus when the object to be treated is taken out from the second airtight area. Therefore, since the inside of the second hermetic zone is always evacuated to maintain the reduced pressure state, the burden on the vacuum pump is reduced. In addition, the object to be treated can be held from outside air until the heated object to be treated is cooled to a temperature that is not oxidized even under atmospheric pressure.

  In other words, the purge area functions as a buffer area between the outside of the apparatus and the first and second airtight areas from the viewpoint of apparatus maintenance and the maintenance of the object to be processed.

  The first hermetic region and the second hermetic region of the processing apparatus are separated by a partition that can be opened and closed. This partition keeps the airtightness of each region and also keeps the heat insulation of each region. For example, you may make it use combining the vacuum door which maintains airtightness, and the heat insulation door which maintains heat insulation. If the first and second airtight regions are separated by a partition such as a heat insulating door-vacuum door-heat insulating door, the airtightness and heat insulating properties of the respective regions are maintained. In this way, by disposing a heat insulating door between the vacuum door and the area separated by the vacuum door, the vacuum door can be protected from the thermal load even when a large thermal load is applied to the vacuum door. Can do. In this case, the vacuum door is protected from the heat of the first and second hermetic zones.

  Such a partition wall is naturally disposed between the outside of the apparatus and the purge region, between the purge region and the first hermetic region, and between the second hermetic region and the purge region. Whether the partition wall is provided may be designed as necessary. For example, when the thermal load in the purge chamber is small, a vacuum door may be provided.

  In the first hermetic zone where the object to be treated is introduced, the state of the metal in the object to be treated is maintained, and the temperature and pressure conditions are adjusted so that the resin decomposes. The temperature and pressure conditions may be set in advance, or may be controlled by feeding back measured values of temperature and pressure to a heating means, a pressure adjusting means, or the like. The same applies to the second airtight region.

  Further, when the pressure in the first hermetic zone is reduced, the oxygen concentration is also reduced and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, even when the resin is decomposed, almost no oxygen is generated. Furthermore, the decomposition product of the resin is easily vaporized.

  On the other hand, when the pressure is reduced, the thermal conductivity in the hermetic region decreases. However, if the inside of the first hermetic zone is a non-oxidizing atmosphere, the object to be treated is not substantially oxidized even under atmospheric pressure or pressure. Therefore, if the inside of the first hermetic zone is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

  The first treatment system treats a gaseous emission containing an organic substance decomposition product gas constituting the object to be treated. Here, the resin may be a synthetic resin, a natural resin, or a mixture thereof.

  As the first processing system tail, an oil making apparatus that condenses gas to make oil may be used. Further, when a gas such as halogen or organic halide is contained in the decomposition product gas of the resin, it may be decomposed using, for example, a catalyst.

  As described above, heavy oil or light oil recovered in the first processing system may be used for heating the first or second hermetic zone.

  Further, the first processing system may be provided with a plurality of systems, or may be connected in multiple stages.

  In the first airtight region, the resin component of the object to be treated is almost decomposed, and the decomposition product gas is recovered or rendered harmless. Therefore, the metal in the object to be processed is present in the object to be processed without being vaporized. On the other hand, most of the resin of the object to be treated exists as a carbide. In this state, the object to be processed is transferred from the first hermetic zone to the second hermetic zone.

  In the processing apparatus of the present invention, the object to be processed heated in the first hermetic container is introduced into the second hermetic zone without being cooled. Therefore, the input energy in the second hermetic zone is greatly saved and the heating time is shortened.

  In the second hermetic zone where the object to be treated is introduced, the temperature and pressure conditions are adjusted so that the metal in the object to be treated is vaporized. When the pressure in the second hermetic zone is reduced, the metal in the object to be processed evaporates at a temperature lower than that under normal pressure. Further, since the oxygen concentration is lowered and the second hermetic region becomes a non-oxidizing atmosphere, the metal state of the vaporized metal is maintained.

  For example, the boiling point of Zn at 760 Torr is 1203 K, but the boiling point at 1 Torr is 743 K, and the boiling point at 10 −4 Torr is 533 K.

  For example, the boiling point of Pb at 760 Torr (1 atm) is 2017K, but the boiling point at 10-1 Torr is 1100K, and the boiling point at 10-3 Torr is 900K.

  Thus, the metal is selectively vaporized in the second hermetic zone according to the temperature and pressure conditions.

  Moreover, since most of the resin of the object to be treated is carbide when introduced into the second hermetic zone, almost no decomposition product gas is generated even if the metal is vaporized from the object to be treated. Therefore, the vaporized metal is recovered with high purity in the metal state, and the load on the vacuum pump is reduced.

  The second recovery means recovers the metal vaporized in the second hermetic zone in this way.

  For example, a recovery chamber having an exhaust system may be connected to the second hermetic zone, and the metal vaporized in the chamber may be cooled to a melting point or lower and condensed to be recovered. For example, the inside of the recovery chamber may have a counterflow structure or a spiral structure. Alternatively, a valve or an openable / closable partition wall may be provided between the recovery chamber and the second airtight region and between the recovery chamber and the exhaust system. Whether the vaporized metal is continuously condensed and recovered, or when it is condensed and recovered by batch processing, the recovery efficiency increases if the residence time of the vaporized metal in the recovery chamber is increased.

  Further, N2 or a rare gas may be introduced as a carrier gas into the second hermetic zone. The vaporized metal is efficiently introduced into the recovery chamber by the carrier gas.

  The second collecting means may be provided with a plurality of systems. The plurality of second recovery means may recover the same metal, or the temperature and pressure in the second hermetic zone may be adjusted stepwise to selectively vaporize the plurality of metals, and a plurality of systems The second collection means may be switched and collected.

  Further, the second recovery means may be connected in multiple stages.

  Thus, the processing apparatus of this invention processes the process target object which has resin and a metal as a structural material. The processing apparatus of the present invention comprises a resin and a metal by providing a first airtight region for decomposing the constituent resin of the object to be processed before the second airtight region for vaporizing the constituent metal of the object to be processed. This makes it possible to process an object to be processed as a material. The decomposition product gas of the resin to be processed generated in a large amount in the airtight region is subjected to processing such as cracking, catalytic reaction, cooling, neutralization and adsorption in the first processing system connected to the first airtight region. The Therefore, sufficient heating and decompression can be performed so that the metal vaporizes in the second hermetic zone.

  Further, in the first hermetic zone, the resin is selectively thermally decomposed under such a condition that the metal of the object to be treated is not oxidized or vaporized so much, so that the metal is separated and recovered from the object to be treated in the metal state.

  The processing apparatus of the present invention may further include an oxygen concentration adjusting means for adjusting the oxygen concentration in the first hermetic zone. For example, the oxygen concentration in the first hermetic region may be detected, and the temperature, pressure, and carrier gas flow rate in the first hermetic region may be adjusted according to the detected oxygen concentration.

  By providing the oxygen concentration adjusting means, the constituent resin of the object to be processed can be thermally decomposed more selectively. The first hermetic zone may be provided with a temperature adjusting means, a pressure adjusting means, and an oxygen concentration adjusting means for selectively thermally decomposing the resin while keeping the metal from being substantially oxidized. .

  This processing apparatus is characterized in that oxygen concentration adjusting means is provided in the first hermetic zone. By this oxygen concentration adjusting means, the oxygen concentration in the first hermetic zone can be adjusted independently of the total pressure in the first hermetic zone.

  By adjusting the oxygen concentration in the first hermetic zone, the degree of freedom of processing in the first hermetic zone is increased. For example, the state of the constituent metal of the object to be processed can be maintained without reducing the thermal conductivity in the first hermetic zone. In addition, the resin can be more actively decomposed under pressurized conditions.

  As the oxygen concentration adjusting means, for example, an oxygen concentration sensor which is an oxygen concentration measuring means and a carrier gas introduction system may be used.

  For example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used as the oxygen concentration sensor, or absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, GC-MS may be used, and may be selected or used in combination as necessary.

  As the carrier gas, for example, a rare gas such as N2 or Ar may be used. The carrier gas not only adjusts the oxygen concentration in the first hermetic zone, but also efficiently introduces the resin decomposition product gas to the first recovery means. Moreover, you may make it serve as a pressure adjustment means. Furthermore, not only oxygen but also the concentration of halogen such as chlorine may be detected, and the temperature, pressure, and carrier gas flow rate in the first hermetic zone may be adjusted according to the detected chlorine concentration. By doing in this way, it can control that dioxin is generated or re-synthesized.

  A plurality of second airtight regions may be provided. That is, a processing apparatus for processing an object to be processed having a resin, a first metal, and a second metal as constituent materials, the temperature adjusting means for selectively thermally decomposing the resin, the pressure adjusting means, and the oxygen concentration A temperature adjusting means and a pressure adjusting means for selectively vaporizing the first metal in the object to be treated, which is separated by a first hermetic area having an adjusting means; and a partition wall that can be opened and closed; And a temperature adjusting means and a pressure adjusting means for selectively vaporizing the second metal in the object to be treated separated from the second hermetic area by a partition wall that can be opened and closed. Vaporized from the third airtight area, the first recovery means for recovering the gas generated by decomposition of the resin connected to the first airtight area, and the object to be processed connected to the second airtight area A second recovery means for recovering the first metal; The second metal may be and a third recovery means for recovering vaporized from the connected object to be treated in an air-tight region of.

  The feature of this processing apparatus is that a plurality of second airtight regions are provided. By providing a plurality of second hermetic regions, a plurality of metals contained in the object to be processed are selectively vaporized and recovered.

  The processing apparatus of the present invention is a processing apparatus for processing an object to be processed having a resin and a metal as constituent materials, the temperature adjusting means, the pressure adjusting means, and the oxygen concentration adjusting means for holding the processing object. An airtight container provided with an airtight container, and when the temperature and oxygen concentration in the airtight container are adjusted so that the resin of the object to be treated is thermally decomposed, by thermal decomposition of the resin A first recovery means for recovering the generated gas and a temperature and pressure in the hermetic container disposed so as to be connected to the hermetic container so that the first metal in the object to be treated is selectively vaporized. And a second recovery means for recovering the vaporized metal from the object to be treated. The second metal vaporized from the object to be treated is disposed when connected to the airtight container and the temperature and pressure in the hermetic container are adjusted so that the second metal in the object to be treated is selectively vaporized. You may make it further comprise the 3rd collection | recovery means to collect | recover.

  The first recovery means maintains the temperature and oxygen concentration in the hermetic container so that the first and second metals in the object to be processed are not substantially oxidized and the resin is selectively thermally decomposed. You may make it collect | recover the gas which the resin decomposed | disassembled and produced | generated when it adjusted.

  This processing apparatus has a plurality of airtight regions with different conditions such as the temperature, pressure, and oxygen concentration conditions in the airtight container described above, whereas the conditions in one airtight container are the same. The processing apparatus includes a changing means and a plurality of recovery means according to conditions in the system.

  The temperature adjusting means in the airtight container, that is, the temperature adjusting means for the object to be processed may be a heating means and a temperature sensor as in the processing apparatus of the present invention described above. As for heating, various heating means such as convection and radiation may be selected or combined as necessary.

  As for the pressure adjusting means, the exhaust means, the pressurizing means and the pressure measuring means may be used as in the processing apparatus of the present invention. As the exhaust means, various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump may be used. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir. The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube or a Pirani gauge.

  Similarly, an oxygen concentration sensor and a carrier gas introduction system may be used for the oxygen concentration adjusting means.

  The recovery means may be provided in the same manner as the processing apparatus of the present invention described above.

  That is, as the first recovery system, for example, an oil converting apparatus that condenses and recovers a resin decomposition product gas may be provided. And you may make it use the oil obtained with this oil-ized apparatus as a heating means.

  As the second and third recovery means, for example, a recovery chamber having an exhaust system may be connected to an airtight region, and the metal vaporized in the chamber may be cooled to a melting point or lower and condensed to be recovered. For example, the inside of the recovery chamber may have a counterflow structure or a spiral structure. Alternatively, a valve or an openable / closable partition wall may be provided between the recovery chamber and the second airtight region and between the recovery chamber and the exhaust system. That is, when the metal vaporized from the object to be treated is introduced into the recovery chamber, the recovery chamber may be closed and cooled, and the metal may be condensed and recovered.

  The processing system of the present invention is a processing system for processing an object to be processed having lead as a constituent material, an airtight container for holding the object to be processed inside, and a temperature adjusting means for adjusting the temperature in the airtight container. Pressure adjusting means for adjusting the pressure in the airtight container, control means for controlling the temperature adjusting means and the pressure adjusting means so that lead in the object to be treated is selectively vaporized, and the airtightness A recovery means connected to the container and recovering the vaporized lead from the object to be processed is provided. As the recovery means, a configuration in which the above-described tube and an airtight door are combined can be employed.

  In addition, an airtight container that holds an object to be processed having lead and resin as constituent materials therein, a temperature adjusting means that adjusts the temperature in the airtight container, a pressure adjusting means that adjusts the pressure in the airtight container, and an airtight First control for controlling the temperature adjusting means and the pressure adjusting means so as to maintain the temperature and pressure in the container so that lead in the object to be treated is not substantially vaporized and to selectively thermally decompose the resin. Means, a second control means for controlling the temperature adjusting means and the pressure adjusting means so that lead in the object to be treated is selectively vaporized, and the temperature and pressure in the hermetic container, and connected to the hermetic container, You may make it comprise the 1st collection | recovery means which collect | recovers the gas produced | generated when resin decomposed | disassembled, and the 2nd collection | recovery means which collect | recovers the lead vaporized from the process target object connected to the airtight container.

  The processing system of the present invention is a processing system for processing an object to be processed having lead and resin as constituent materials, and an airtight container that holds the object to be processed inside, and a temperature in the airtight container is adjusted. A temperature adjusting means; a pressure adjusting means for adjusting the pressure in the hermetic container; an oxygen concentration adjusting means for adjusting an oxygen concentration in the hermetic container; and the temperature adjusting means so that the resin is selectively thermally decomposed. And a first control means for controlling the oxygen concentration adjusting means, and the temperature adjusting means and the pressure adjusting means so that lead in the object to be treated selectively vaporizes the temperature and pressure in the container. A second control means for controlling, a first recovery means connected to the airtight container and recovering a gas generated by thermal decomposition of the resin, and connected to the airtight container, from the object to be treated Vaporization Characterized by comprising a second recovery means for recovering lead.

  The first control means maintains the temperature and oxygen concentration in the hermetic container so that lead in the object to be treated is not substantially oxidized, and controls the temperature adjustment means and oxygen concentration so that the resin is selectively thermally decomposed. You may make it control a means.

  The treatment method of the present invention includes a step of introducing an object to be treated having lead as a constituent material in an airtight container and sealing the airtight container, and the airtight container so that lead in the object to be treated is selectively vaporized. And adjusting the temperature and pressure inside, and recovering vaporized lead from the object to be treated.

  In addition, a process target object having lead and resin as components is introduced and the hermetic container is sealed, and the temperature and pressure in the hermetic container are adjusted so that the resin in the process target object is selectively thermally decomposed. A first control step, a second control step of adjusting the temperature and pressure in the hermetic container so that lead in the object to be treated is selectively vaporized, and recovering a gas generated by thermal decomposition of the resin You may make it have a 1st collection | recovery process to perform, and a 2nd collection process to collect | recover the lead vaporized from the process target object.

  Further, the processing method of the present invention includes a step of introducing an object to be processed having lead and resin as constituent materials and sealing the hermetic container, and a temperature in the hermetic container so that the resin is selectively thermally decomposed. A first control step of adjusting the oxygen concentration, a second control step of adjusting the temperature and pressure in the hermetic container so that lead in the object to be treated is selectively vaporized, and the resin It has the 1st collection process which collects the gas generated by thermal decomposition, and the 2nd collection process which collects the lead vaporized from the processing object.

  In the first control step, the temperature in the airtight container and the oxygen concentration are adjusted so that the lead in the object to be treated is not substantially oxidized and the resin is selectively thermally decomposed. May be.

  These processing system and processing method of the present invention can separate and recover lead from a processing target object containing lead.

  In the first control step, for example, the oxygen concentration in the hermetic container may be adjusted to about 10 vol% or less. By adjusting the oxygen concentration, oxidation of lead is prevented.

  Moreover, you may make it adjust a temperature in an airtight container in the range of 323-1073K, for example in a 1st control process.

  In the first control step, for example, the pressure in the airtight container may be adjusted to about 760 to 10 Torr. By adjusting the pressure, lead is vaporized at a lower temperature.

  In the second control step, for example, the pressure in the hermetic container may be adjusted to about 7.6 × 10 2 to 7.6 × 10 3 Torr. The thermal decomposition of the resin is promoted by selectively thermally decomposing the resin under pressure.

  Moreover, you may make it adjust a temperature in an airtight container in the range of 713-2273K, for example in a 2nd control process.

  The basic feature of this processing system and method is that the object to be processed is introduced into an airtight container, and the temperature, pressure and oxygen concentration in the airtight container are adjusted to selectively vaporize lead in the object to be processed. It is to separate and recover from the object to be processed. Further, metals other than lead may also be separated from the object to be treated and recovered by controlling the inside of the hermetic container to a predetermined temperature and pressure conditions such that the metal is selectively vaporized.

  Further, when the object to be treated contains lead and resin, first, the resin part is selectively thermally decomposed by heating the object to be treated under the condition that lead is not vaporized or oxidized. Gasification, oilification, carbideization), and then lead is selectively vaporized, and the vaporized lead is recovered in a metallic state. Here, the resin may be a synthetic resin, a natural resin, or a mixture thereof. In general, a thermoplastic resin can be vaporized and oiled to recover many parts by heating, but a thermosetting resin has many parts that are carbonized and vaporized. In any case, lead can be positively recovered by selectively thermally decomposing the constituent resin of the object to be treated.

  For example, the processing apparatus of the present invention as described above may be used for the apparatus portion of the processing system. That is, for example, the conditions such as temperature, pressure, and oxygen concentration in one hermetic container may be adjusted stepwise to perform selective thermal decomposition of the resin and lead vaporization. In addition, a plurality of hermetic regions having different conditions such as temperature, pressure, oxygen concentration, etc. are provided, and the resin is selectively thermally decomposed by sequentially opening and closing the partition walls between the respective hermetic regions and transferring the object to be treated. The vaporization of lead may be performed.

  As the temperature adjusting means, a heating means and a temperature measuring means may be used. As the heating means, for example, resistance heating such as a sheathed heater may be used, or oil such as heavy oil or light oil may be burned. Further, induction heating may be used. Various thermometers may be used as the temperature measuring means.

  By controlling the temperature, pressure, and oxygen concentration in the airtight container, the resin is selectively thermally decomposed and vaporized (oiled and then vaporized) under temperature and pressure conditions so that lead in the object to be treated is not oxidized or vaporized. Or carbonized. The vaporized thermal decomposition product gas of the resin is recovered by the first recovery means, but the recovered decomposition product of the resin may be burned and used as a heating means.

  As the pressure adjusting means, exhaust means or pressurizing means and pressure measuring means may be used. The exhaust means may be provided with various vacuum pumps such as a rotary pump, an oil diffusion pump, and a booster pump as required, such as the degree of vacuum and the exhaust capacity. As the pressurizing means, for example, a gas may be introduced into the system from a gas reservoir.

  Further, a carrier gas may be introduced into the hermetic container, and this carrier gas may be used as a pressurizing means by adjusting an exhaust system valve or an introduction flow rate, for example.

  The pressure measuring means may be used in accordance with the degree of vacuum for measuring a Bourdon tube or a Pirani gauge.

  Also in the treatment system of the present invention, in addition to the temperature adjusting means and the pressure adjusting means, an oxygen concentration adjusting means for adjusting the oxygen concentration in the hermetic container may be provided.

  By providing this oxygen concentration adjusting means, the oxygen concentration in the hermetic container is adjusted independently of the total pressure. By adjusting the oxygen concentration in the hermetic container, the degree of freedom of processing in the hermetic container is increased. For example, the resin can be selectively thermally decomposed without reducing the thermal conductivity in the hermetic container. Moreover, oxidation and vaporization of the constituent metal of the object to be treated can be suppressed. In particular, when the object to be treated contains a resin as a constituent material, the resin can be selectively thermally decomposed more effectively while maintaining the lead state substantially by adjusting the oxygen concentration in the hermetic container. For example, the inside of the airtight container can be pressurized to about 1 to 10 atm in a non-oxidizing atmosphere, and the resin can be selectively and thermally decomposed more actively.

  As the oxygen concentration adjusting means, for example, an oxygen concentration sensor which is an oxygen concentration measuring means and a carrier gas introduction system may be used.

  For example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used as the oxygen concentration sensor, or absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, GC-MS may be used, and may be selected or used in combination as necessary.

  The processing system of the present invention includes control means for controlling such temperature adjusting means, pressure adjusting means or oxygen concentration adjusting means. This control means controls the temperature, pressure or oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed, and lead in the object to be treated is selectively vaporized. This control means measures the state in the airtight container with the temperature sensor, pressure sensor, oxygen concentration sensor, etc. described above, and feeds back the measured values to the heating means, exhaust system, pressurization system, carrier gas introduction system, etc. You may make it optimize the state in an airtight container.

  Such control may be performed by the operator operating the heating means, the exhaust system, the pressurization system, and the carrier gas introduction system in accordance with the parameters of the state in the hermetic container.

  Also, using the measured parameters of the state in the hermetic container as an input, a signal for operating the heating means, the exhaust system, the pressurization system, the carrier gas introduction system, etc. so that the conditions in the hermetic container are optimized is output You may make it provide such a control apparatus. This control circuit may be stored as a program in the storage means of the control device.

  The first step in the treatment method of the present invention is a step of selectively pyrolyzing the resin by heating the object to be treated.

  Resins such as plastics begin to melt at about 323 K (50 ° C.), thermally decompose at about 453 to 873 K (180 to 600 ° C.), and mainly discharge C1-C16 hydrocarbon gases. The decomposition product gas generated by the selective thermal decomposition of these resins can be recovered as valuable oil by condensing it in an exhaust gas treatment system, for example.

  This selective thermal decomposition of the resin is preferably carried out with the oxygen concentration in the container adjusted. The oxygen concentration may be adjusted by the total pressure in the hermetic container, or may be adjusted by introducing a carrier gas such as N2 or Ar.

  Oxidation of lead can be prevented by adjusting the oxygen concentration in the hermetic container. In addition, by adjusting the oxygen concentration separately from the total pressure, it is possible to prevent lead oxidation without lowering the thermal conductivity in the hermetic container, improving the resin decomposition efficiency and the decomposition product gas recovery efficiency To do. In some cases, a carrier gas such as N2 or Ar may be introduced to pressurize the inside of the hermetic container to selectively thermally decompose the resin.

  The resin in the object to be treated does not need to be completely thermally decomposed, and may be decomposed to such an extent that it does not adversely affect lead separation and recovery.

  Lead (metal) exhibits a vapor pressure of 760 mmHg at 2017K, but lead oxide exhibits a vapor pressure of 760 mmHg at a lower 1745K. Therefore, by adjusting the oxygen concentration in the hermetic container, it is possible to prevent metallic lead from being oxidized to lead oxide and prevent lead from being scattered, and lead can be more actively recovered in a subsequent process.

  If the resin in the object to be treated is selectively pyrolyzed in this way, the temperature and pressure in the hermetic container are controlled so that lead is selectively vaporized, and lead is separated and recovered from the object to be treated.

  If the object to be treated contains a metal other than lead, lead is selectively vaporized due to the difference in vapor pressure.

  The temperature at which lead vaporizes varies depending on the pressure in the hermetic container. Under atmospheric pressure, for example, the vapor pressure of lead when heated to 1673 K is 84 mmHg, whereas the vapor pressure of iron, copper, and tin does not reach 1 mmHg.

  Therefore, only the lead vapor can be selectively generated from the object to be treated by heating the object to be treated to about 1673K.

  Further, under atmospheric pressure, for example, the vapor pressure of lead when heated to 2013K is 760 mmHg, whereas the vapor pressure of tin does not reach 15 mmHg, and the vapor pressure of copper does not reach 3 mmHg. Therefore, only the lead vapor can be selectively generated from the object to be treated by heating the object to be treated to about 1673K.

  Moreover, lead in the object to be treated can be vaporized at a lower temperature by reducing the pressure in the hermetic container.

  If the pressure in the hermetic container is adjusted to 10-1 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 1100K.

  Further, if the pressure in the hermetic container is adjusted to 10 <-3> Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 900K.

  Furthermore, if the pressure in the hermetic container is adjusted to 10 @ -4 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 700K.

  The vapor of lead thus selectively generated is recovered as metallic lead by, for example, a recovery device cooled below the melting point of lead.

  Thus, when vapor lead is condensed and crystallized and recovered, the recovery rate of lead is increased by setting the residence time of vapor lead in the apparatus longer. For example, the structure of the recovery device may be a countercurrent structure or a spiral structure.

  Further, lead vapor can be recovered more selectively by flowing a rare gas such as N2 or Ar as a carrier gas from the inside of the airtight container to the recovery device.

  By continuously performing the process of thermally decomposing the resin and the process of selectively vaporizing lead, the input energy in the subsequent process can be greatly suppressed.

  That is, since the thermal conductivity of the gas decreases as the pressure decreases, it is necessary to input a larger amount of energy as the inside of the hermetic container is depressurized in the process of vaporizing lead. However, in the treatment system and the treatment method of the present invention, the thermal decomposition step of the resin is also a preheating step of the step of vaporizing lead, and the energy input in the step of vaporizing lead can be greatly saved.

  Furthermore, since moisture and oil in the object to be treated are removed from the object to be treated in the thermal decomposition process of the resin, the process of vaporizing lead is not adversely affected.

  The processing system of the present invention is a processing system for processing a processing target object having a first object and a second object joined with metal, and an airtight container for holding the processing target object inside the processing system. The temperature adjusting means for adjusting the temperature in the hermetic container, the pressure adjusting means for adjusting the pressure in the hermetic container, and the metal that joins the first object and the second object are vaporized. And a control means for controlling the temperature adjusting means and the pressure adjusting means.

  A first object joined by an alloy having the first metal and the second metal; an airtight container for holding the second object therein; and temperature adjusting means for adjusting the temperature in the airtight container; Pressure adjusting means for adjusting the pressure in the hermetic container and control means for controlling the temperature adjusting means and the pressure adjusting means so that the alloy vaporizes the temperature and pressure in the hermetic container may be provided. .

  In addition, a first object having a resin as a component and a hermetic container holding the second object inside, which are joined by an alloy composed of a first metal and a second metal, and a temperature in the hermetic container Temperature adjusting means for adjusting, pressure adjusting means for adjusting the pressure in the hermetic container, first control means for controlling the temperature adjusting means so that the resin is selectively thermally decomposed, and temperature and pressure in the hermetic container The second control means for controlling the temperature adjusting means and the pressure adjusting means so that the first metal of the alloy selectively vaporizes, and the temperature and pressure in the hermetic container are controlled by the second metal of the alloy. Third control means for controlling the temperature adjustment means and the pressure adjustment means so as to vaporize, first recovery means for recovering gas generated by selective thermal decomposition of the resin, and first vaporized from the alloy You may make it comprise the 2nd collection | recovery means to collect | recover these metals. Further, the resin may be selectively thermally decomposed while substantially maintaining the oxidation state of the first and second metals.

  In addition, a first object having a resin as a component and a hermetic container holding the second object inside, which are joined by an alloy composed of a first metal and a second metal, and a temperature in the hermetic container Temperature adjusting means for adjusting, pressure adjusting means for adjusting the pressure in the airtight container, and first control means for controlling the temperature adjusting means so that the resin selectively thermally decomposes the temperature and pressure in the airtight container. A second control means for controlling the temperature adjusting means and the pressure adjusting means so that the first metal of the alloy selectively vaporizes the temperature and pressure in the hermetic container, and the temperature in the hermetic container. A third control means for controlling the temperature adjusting means and the pressure adjusting means so that the second metal of the alloy vaporizes, and a first gas for recovering a gas generated by selective thermal decomposition of the resin. A recovery means, and a second recovery means for recovering the first metal vaporized from the alloy. It may be Bei. Further, the resin may be selectively thermally decomposed while substantially maintaining the oxidation state of the first and second metals.

  In addition, the processing system of the present invention processes a processing target object having a first object and a second object having a resin as a constituent material, which are joined by an alloy having a first metal and a second metal. An airtight container for holding the object to be processed therein, temperature adjusting means for adjusting the temperature in the airtight container, pressure adjusting means for adjusting the pressure in the airtight container, and the airtight container Oxygen concentration adjusting means for adjusting the oxygen concentration in the inside, first control means for controlling the temperature adjusting means and the oxygen concentration adjusting means so that the resin is selectively thermally decomposed, and a first of the alloy. Second temperature control means for controlling the temperature adjustment means and the pressure adjustment means so that the metal of the alloy selectively vaporizes, and the temperature adjustment means and the pressure adjustment of the second metal of the alloy for vaporization. A third controlling means Control means, first recovery means for recovering a gas generated by thermal decomposition of the resin, and second recovery means for recovering the first metal vaporized from the alloy. .

  Further, the first control means adjusts the temperature so that the temperature in the hermetic container and the oxygen concentration are maintained so that the state of the first metal of the alloy is not substantially oxidized and the resin is selectively thermally decomposed. The means and the oxygen concentration adjusting means may be controlled.

  For example, at least one element of Zn, Cd, Hg, Ga, In, Tl, Sn, Pb, Sb, Bi, Ag, or In may be separated or collected from the object to be treated as the first metal.

  In addition, by adjusting the temperature, pressure, and oxygen concentration in the hermetic container, other metals can be separated and recovered in the metal state (see FIG. 30). This is the same throughout all parts of the present invention unless otherwise stated.

  The processing method of the present invention is a processing method for processing a processing target object having a first object and a second object joined with metal, the processing target object being introduced into an airtight container. The method includes the steps of sealing the container and adjusting the temperature and pressure in the hermetic container so that the metal is vaporized.

  In addition, a step of introducing the first object and the second object joined by an alloy having the first metal and the second metal into the hermetic container and sealing the hermetic container, and the alloy vaporizes. Thus, a step of adjusting the temperature and pressure in the hermetic container may be included.

  In addition, a processing target object having a first object and a second object having a resin as a constituent material, which is joined with an alloy having a first metal and a second metal, is introduced into the hermetic container. A step of sealing the hermetic vessel, a first step of adjusting the temperature and pressure in the hermetic vessel so that the resin is selectively thermally decomposed, and the first metal in the alloy is selectively vaporized. A second step of adjusting the temperature and pressure in the hermetic vessel, a third step of adjusting the temperature and pressure in the hermetic vessel so that the second metal in the alloy is vaporized, and the resin decomposes. You may make it have the 1st collection process which collects the gas which arose, and the 2nd collection process which collects the 1st metal vaporized from the alloy.

  In the first step, the temperature and pressure in the hermetic container may be adjusted so that the state of the first metal in the alloy is substantially maintained and the resin is selectively thermally decomposed. .

  Moreover, the processing method of this invention processes the process target object which has joined the alloy which has the 1st metal and the 2nd metal, and has the 1st object which has resin as a structural material, and a 2nd object. A treatment method, the step of introducing the object to be treated in an airtight container and sealing the airtight container, and adjusting the temperature and oxygen concentration in the airtight container so that the resin is selectively thermally decomposed. A first control step, a second control step of adjusting the temperature and pressure in the hermetic vessel so that the first metal in the alloy is selectively vaporized, and a second metal of the alloy A third control step of adjusting the temperature and pressure in the hermetic container so as to vaporize; a first recovery step of recovering gas generated by thermal decomposition of the resin; and a first control step that is vaporized from the alloy And a second recovery step for recovering the metal.

  Further, the first control step maintains the first and second metals of the alloy so as not to be substantially oxidized and adjusts the temperature and oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed. You may do it.

  In addition, a mounting board comprising a circuit board having a resin as a constituent material and an electronic component joined by an alloy having the first metal and the second metal is introduced into the hermetic container. A step of sealing the vessel, a first control step of adjusting the temperature and oxygen concentration in the hermetic vessel so that the resin is selectively thermally decomposed, and the first metal in the alloy is selectively vaporized. A second control step for adjusting the temperature and pressure in the hermetic vessel, a third control step for adjusting the temperature and pressure in the hermetic vessel so that the second metal in the alloy is vaporized, and a resin. It has the 1st collection process which collects the gas generated by selective thermal decomposition, and the 2nd collection process which collects the 1st metal vaporized from the alloy. The first control step substantially maintains the state of the first and second metals of the alloy and adjusts the temperature and oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed. Also good.

  Such a processing system of the present invention can release bonding of objects to be processed bonded with a metal or an alloy. Further, the treatment method of the present invention can release the joining of the object to be treated joined with a metal or an alloy.

  The basic concept of such a processing system and processing method of the present invention is to introduce the object to be processed into an airtight container, adjust the temperature, pressure, oxygen concentration, etc. in the airtight container, and join the metal Alternatively, the joining is released by vaporizing the alloy. The vaporized metal may be recovered by condensing it.

  When the object to be treated has a resin as a constituent material, first, the resin portion is selectively thermally decomposed to vaporize, oil, or carbonize. This selective thermal decomposition of the resin may be carried out by adjusting the temperature, pressure or oxygen concentration in the hermetic container to such a condition that the metal does not oxidize or vaporize so much. That is, the resin may be pyrolyzed while keeping the oxidation state and phase equilibrium state of the constituent metal of the object to be treated as much as possible.

  Next, the temperature and pressure in the hermetic container are adjusted to selectively vaporize the bonding metal in the object to be treated. When a plurality of metals (elements) are included in the object to be processed, the temperature and pressure in the hermetic container may be adjusted according to each metal to selectively vaporize each metal.

  The processing device of the present invention described above may be used for the processing device portion of the processing system. That is, for example, conditions such as temperature, pressure, and oxygen concentration in one hermetic container may be adjusted stepwise to perform selective thermal decomposition of the resin and lead vaporization. In addition, a plurality of hermetic regions having different conditions such as temperature, pressure, oxygen concentration, etc. are provided, and the resin is selectively thermally decomposed by sequentially opening and closing the partition walls between the respective hermetic regions and transferring the object to be treated. Further, vaporization of lead may be performed.

  The temperature adjusting means, pressure adjusting means, oxygen concentration adjusting means, control means, resin recovery means, metal recovery means, and the like are the same as described above.

  As a processing target object of the processing system and the processing method of the present invention, for example, a mounting board in which a printed board and various electronic components are joined with a solder alloy such as Pb-Sn, an electronic device having such a mounting board, etc. As an example.

  In addition to the mounting substrate, any object to be treated that is bonded with a metal or an alloy can be released from the bonding.

  For example, the mounting substrate is introduced into the processing apparatus of the present invention, the oxygen concentration is adjusted and heated to a temperature at which the resin is not very oxidized (for example, about 473 K), then the inside of the hermetic container is depressurized to adjust the oxygen concentration and lead Is heated to a temperature at which it does not oxidize or vaporize (for example, about 523 to 773 K at 10 -3 Torr) to thermally decompose the constituent resin of the mounting substrate, and further heated to the boiling point of lead (for example, about 900 K at 10 -3 Torr) Then, lead is vaporized and tin is vaporized in the same manner, and the mounting board may be separated into an electronic component and a circuit board (herein, the board on which the electronic component is mounted is called a circuit board) and recovered. .

  Even if a metal such as lead is vaporized during the selective thermal decomposition of the resin, a metal separation means may be provided in the recovery system. This is common to all of the present inventions.

  Also, for example, a mounting substrate is introduced into the processing apparatus of the present invention, the oxygen concentration is adjusted and heated to a temperature at which the resin is not oxidized much (for example, about 473 K), and then the inside of the hermetic container is decompressed to adjust the oxygen concentration. Furthermore, heating is performed to a temperature at which lead is not substantially oxidized or vaporized (for example, about 523 to 773 K at 10 −3 Torr) to thermally decompose the constituent resin of the mounting substrate, and further heated to about 973 K, for example. Sb or the like may be vaporized and recovered.

  Furthermore, for example, it may be heated to about 1773 K to vaporize and collect Au, Pt, Pd, Ta, Ni, Cr, Cu, Al, Co, W, Mo, and the like.

  The solder alloy is not limited to Pb—Sn, for example, so-called Pb-free such as Ag—Sn, Zn—Sn, In—Sn, Bi—Sn, Sn—Ag—Bi, Sn—Ag—Bi—Cu, etc. Solder may be used. Moreover, you may join by alloys other than these, or a metal simple substance.

  The object to be processed may contain a resin as a constituent material. The resin may be a thermoplastic resin, a thermosetting resin, or a mixture thereof.

  When the object to be treated contains a resin as a constituent material, the resin portion may be selectively thermally decomposed (e.g., vaporized, oiled, carbonized) as described above. The gas generated by the selective thermal decomposition may be condensed and recovered by, for example, an exhaust gas treatment system. The recovered resin decomposition products such as light oil and heavy oil may be used for heating the object to be treated. The selective thermal decomposition of the resin component does not need to be carried out completely, and it is sufficient that it is thermally decomposed to the extent that it does not hinder the separation and recovery of the joining metal. In addition, as described above, even if a part of the joining metal is vaporized, the vaporized metal separation and recovery means may be provided in the recovery system.

  Resins such as plastic begin to melt at about 323K, thermally decompose at about 453 to 873K, and mainly discharge hydrocarbon gases such as C1 to C8 and C8 to C16. The decomposition product gas generated by the selective thermal decomposition of these resins can be recovered as valuable oil by condensing it in an exhaust gas treatment system, for example. In general, the resin constituting the circuit board is mostly a thermosetting resin and has many components that are carbonized and vaporized.

  This selective thermal decomposition of the resin is preferably carried out with the oxygen concentration in the container adjusted. The oxygen concentration may be adjusted by the total pressure in the hermetic container, or may be adjusted by introducing a carrier gas such as N2 or Ar.

  By adjusting the oxygen concentration in the hermetic container, for example, oxidation of the joining metal such as lead or tin can be prevented. In addition, by adjusting the oxygen concentration separately from the total pressure, it is possible to prevent metal oxidation without lowering the thermal conductivity in the hermetic container, improving the resin decomposition efficiency and the decomposition product gas recovery efficiency. To do. In some cases, a carrier gas such as N2 or Ar may be introduced to pressurize the inside of the hermetic container to selectively thermally decompose the resin. The resin in the object to be treated does not need to be completely pyrolyzed, and may be decomposed to such an extent that it does not adversely affect the separation and recovery of the metal.

  For example, metallic lead exhibits a vapor pressure of 760 mmHg at 2017K, while lead oxide exhibits a vapor pressure of 760 mmHg at a lower 1745K. Therefore, by adjusting the oxygen concentration in the hermetic container, the metal can be prevented from being oxidized into an oxide, and can be recovered more actively in the subsequent process. Furthermore, utilization value becomes high by collect | recovering as a metal. In this way, if the resin is thermally decomposed while substantially maintaining the state of lead in the object to be treated, the temperature and pressure in the hermetic container are controlled so that lead selectively vaporizes, and lead is treated as an object to be treated. Separate and collect from inside.

  Even when the object to be treated contains a metal other than lead, lead is selectively vaporized by the difference in vapor pressure.

  For example, the temperature at which lead is vaporized varies depending on the pressure in the hermetic container. Under atmospheric pressure, for example, the vapor pressure of lead when heated to 1673 K is 84 mmHg, whereas the vapor pressure of iron, copper, and tin does not reach 1 mmHg. Therefore, only the lead vapor can be selectively generated from the object to be treated by heating the object to be treated to about 1673K.

  Further, under atmospheric pressure, for example, the vapor pressure of lead when heated to 2013K is 760 mmHg, whereas the vapor pressure of tin does not reach 15 mmHg, and the vapor pressure of copper does not reach 3 mmHg. Therefore, only the lead vapor can be selectively generated from the object to be treated by heating the object to be treated to about 1673K.

  Moreover, lead in the object to be treated can be vaporized at a lower temperature by reducing the pressure in the hermetic container.

  If the pressure in the hermetic container is adjusted to 10-1 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 1100K.

  Further, if the pressure in the hermetic container is adjusted to 10 −3 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 900K.

  Furthermore, if the pressure in the hermetic container is adjusted to 10 @ -4 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 700K.

  The vapor of lead thus selectively generated is recovered as metallic lead by, for example, a recovery device cooled below the melting point of lead.

  Thus, when vapor lead is condensed and crystallized and recovered, the recovery rate of lead is increased by setting the residence time of vapor lead in the apparatus longer. For example, the structure of the recovery device may be a countercurrent structure or a spiral structure.

  Further, lead vapor can be recovered more selectively by flowing a rare gas such as N2 or Ar as a carrier gas from the inside of the airtight container to the recovery device.

  By continuously performing the step of thermally decomposing the resin and the step of selectively vaporizing lead, the input energy in the subsequent steps can be greatly suppressed.

  That is, since the thermal conductivity of the gas decreases as the pressure decreases, it is necessary to input a larger amount of energy as the inside of the hermetic container is depressurized in the process of vaporizing lead. However, in the treatment system and the treatment method of the present invention, the thermal decomposition step of the resin is also a preheating step of the step of vaporizing lead, and the energy input in the step of vaporizing lead can be greatly saved.

  Furthermore, since moisture and oil in the object to be treated are removed from the object to be treated in the selective thermal decomposition process of the resin, the process for vaporizing lead is not adversely affected.

  The processing system of the present invention is a processing system for processing an object to be processed in which resin and metal are integrated, an airtight container for holding the object to be processed inside, and a temperature for adjusting the temperature in the airtight container. Adjusting means; pressure adjusting means for adjusting the pressure in the hermetic container; and control means for controlling the temperature adjusting means and the pressure adjusting means in the hermetic container so that the resin is selectively thermally decomposed. It is characterized by comprising.

  In addition, the control means for controlling the temperature adjusting means and the pressure adjusting means in the hermetic container substantially maintains the metal state and the temperature adjusting means and the pressure in the hermetic container so that the resin is selectively thermally decomposed. The adjusting means may be controlled.

  In addition, the treatment system of the present invention adjusts the oxygen concentration in the hermetic container, an airtight container that holds the object to be treated in which the resin and the metal are integrated, temperature adjusting means for adjusting the temperature in the hermetic container, and An oxygen concentration adjusting means; and a control means for controlling the temperature adjusting means and the oxygen concentration adjusting means in the hermetic container so as to substantially maintain the metal state and selectively thermally decompose the resin. May be. During selective thermal decomposition of the resin, the temperature, pressure, or oxygen concentration may be adjusted so as to maintain the state of the constituent metals as much as possible.

  The processing system of the present invention is a processing system for processing an object to be processed in which resin and metal are integrated, an airtight container for holding the object to be processed inside, and a temperature for adjusting the temperature in the airtight container. Adjusting means, pressure adjusting means for adjusting the pressure in the hermetic container, oxygen concentration adjusting means for adjusting the oxygen concentration in the hermetic container, and in the hermetic container so that the resin is selectively thermally decomposed. Control means for controlling the temperature adjusting means, the pressure adjusting means, and the oxygen concentration adjusting means is provided.

  The control means may control the temperature adjusting means, the pressure adjusting means, and the oxygen concentration adjusting means in the hermetic container so as to substantially maintain the metal state and selectively thermally decompose the resin. Good.

  Further, the treatment system of the present invention includes an airtight container that holds an object to be treated in which the resin, the first metal, and the second metal are integrated, and a temperature adjusting unit that adjusts the temperature in the airtight container; Pressure adjusting means for adjusting the pressure in the airtight container, oxygen concentration adjusting means for adjusting the oxygen concentration in the airtight container, temperature adjusting means and oxygen concentration adjusting means in the airtight container so that the resin is selectively thermally decomposed Control means for controlling the temperature, second control means for controlling the temperature adjusting means and the pressure adjusting means so that the first metal is selectively vaporized, and recovering the first metal vaporized from the object to be treated. You may make it comprise a collection | recovery means. The control means controls the temperature adjusting means and the oxygen concentration adjusting means in the hermetic container so that the state of the first and second metals is substantially maintained and the resin is selectively thermally decomposed. Good.

  Further, the treatment method of the present invention includes a step of introducing an object to be treated in which a resin and a metal are integrated into an airtight container, and a temperature and an oxygen concentration in the airtight container so that the resin is selectively thermally decomposed. And a step of adjusting.

  Further, the temperature and oxygen concentration in the hermetic container may be adjusted so that the metal state is substantially maintained and the resin is selectively thermally decomposed. The processing system of the present invention also includes a step of introducing an object to be processed in which a resin and a metal are integrated into an airtight container, and a temperature and pressure in the airtight container are adjusted so that the resin is selectively thermally decomposed. You may make it have a process to do.

  Further, the treatment method of the present invention includes a step of introducing an object to be treated in which a resin and a metal are laminated in an airtight container, and a temperature and an oxygen concentration in the airtight container so that the resin is selectively thermally decomposed. And adjusting the temperature and pressure in the hermetic container so that the metal melts and the surface area of the object to be processed is reduced.

  Further, the temperature and oxygen concentration in the hermetic container may be adjusted so that the metal is not substantially oxidized and the resin is selectively thermally decomposed.

  Further, the treatment method of the present invention introduces a process target object in which a resin and copper are laminated in an airtight container, so that the state of copper is substantially maintained and the resin is selectively thermally decomposed. You may make it have the process of adjusting the temperature and oxygen concentration in an airtight container, and the process of adjusting the temperature and pressure in an airtight container so that copper may fuse | melt a process target object and a surface area may become small. .

  Further, the treatment method of the present invention includes a step of introducing an object to be treated in which a resin and a metal are integrated into an airtight container, a gastight so that the resin is selectively thermally decomposed while substantially maintaining the state of the metal. You may make it have the process of adjusting the temperature in a container, a pressure, and oxygen concentration.

  The processing method of the present invention includes a step of introducing an object to be processed in which a resin, a first metal, and a second metal are integrated into an airtight container, and the airtightness so that the resin is selectively thermally decomposed. A first control step of adjusting the temperature and oxygen concentration in the container; a second control step of adjusting the temperature and pressure in the hermetic container so that the first metal is selectively vaporized; Recovering the first metal vaporized from the object to be treated.

  Further, the first control step maintains the first and second metals so as not to be substantially oxidized and adjusts the temperature and oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed. It may be.

  Such a processing system of the present invention is a system capable of processing a processing object having a resin and a metal as constituent materials.

  Moreover, such a processing method of the present invention is a method capable of processing an object to be processed having a resin and a metal as constituent materials.

  That is, the basic concept of such a processing system or processing method of the present invention is to introduce an object to be processed having a resin and a metal as constituent materials in an airtight container, and first thermally decompose the resin portion selectively. , Vaporize, oil, carbonize. This selective thermal decomposition of the resin may be carried out by adjusting the temperature, pressure or oxygen concentration in the hermetic container to such a condition that the metal is not oxidized or vaporized.

  If it is still difficult to separate the metal from the object to be treated only by this operation, the metal in the object to be treated is selectively vaporized by adjusting the temperature and pressure in the hermetic container. When a plurality of metals (elements) are included in the object to be processed, the temperature and pressure in the hermetic container may be adjusted according to each metal to selectively vaporize each metal. As the apparatus, for example, the processing apparatus of the present invention as described above may be used.

  Such a processing target object of the processing system or processing method of the present invention can process not only a processing target object having resin and metal but also a processing target object in which resin and metal are integrated.

  Examples of objects to be treated having such resin and metal include aluminum foil laminated with a plastic film such as a packaging container for retort foods, a syringe, and a print in which a resin and metal such as copper and nickel are integrated. A substrate, a flexible substrate, a TAB film carrier, an IC, an LSI, a resistor, and the like can be given as examples. Further, for example, waste from which lead has been removed by the treatment system or treatment method of the present invention may be used as the object to be treated.

  Furthermore, in the processing system or the processing method of the present invention, the processing target object that has been released from the metal or alloy bonding may be used as the processing target object. For example, the mounting substrate may be separated into a substrate and an electronic component by the processing system or the processing method of the present invention, and the substrate and the component may be used as objects to be processed. Further, for example, each aspect of the processing apparatus, processing system or processing method of the present invention may be combined.

  In order to selectively thermally decompose the organic matter of the object to be treated or to selectively thermally decompose the organic matter while preventing the constituent metals from being oxidized or vaporized as much as possible as a whole, for example, in an airtight container The pressure may be controlled to heat the object to be processed, or the oxygen concentration in the hermetic container may be controlled to heat the object to be processed.

  In order to control the oxygen concentration, the partial pressure of oxygen may be adjusted by adjusting the total pressure in the airtight container, or a gas such as nitrogen gas or a rare gas is introduced into the airtight container. The oxygen concentration may be adjusted. When the oxidation of the resin part proceeds rapidly due to the heating of the object to be treated, that is, if it burns, the metal part integrated with the resin part is also oxidized to become an oxide, and the utility value is lowered.

  Further, when heating the object to be treated, if the pressure inside the hermetic container is reduced, the thermal conductivity is lowered and the temperature raising efficiency is lowered. Therefore, the resin is heated to a predetermined temperature and then reduced in pressure and further heated. May be.

  Furthermore, by heating and pressurizing the inside of the hermetic container to a temperature at which the oxidation state of the metal is maintained in a non-oxidizing atmosphere, the thermal conductivity is increased to improve the temperature rising efficiency, and the oxidation state is maintained. After heating to temperature, the pressure may be reduced and further heated. By carrying out the pressure heating, the recovery rate of the decomposition component of the resin having a relatively small molecular weight is increased.

  Further, when the metal portion is made of a plurality of metals, it may be further heated and selectively evaporated for each element and recovered.

  The decomposition product gas of the resin of the object to be treated may be condensed and recovered, for example, it may be recovered by an exhaust gas treatment system or the like. For example, it may be condensed after being reformed and thermally decomposed at a high temperature of 1000 ° C. or higher. Dioxin generation can be suppressed by cooling from a high temperature of 1000 ° C. or higher to room temperature.

  Further, the hydrogen gas may be recovered by adsorption or the like, and when a halogenated hydrocarbon or the like is generated, it may be decomposed using, for example, a catalyst.

  In addition, when the resin contains a halogen such as a polyvinyl chloride resin, first, halogen gas may be generated by heating at room temperature within a range in which the oxidation state of the constituent metal of the waste is maintained. . The generated halogen gas may be recovered, for example, as iron halide by contacting with iron heated to a high temperature, or may be recovered as ammonium halide by reacting with ammonia.

  These gases generated by heating the waste may be processed by a multi-gas processing system.

  As an example of treatment, for example, for treatment of aluminum foil laminated with a plastic film used for various packaging containers (hereinafter referred to as “resin-coated aluminum foil”, the same shall apply hereinafter) Decomposition is insufficient. Moreover, since aluminum melts when heated to 923K or higher, the resin portion is selectively thermally decomposed (vaporized, oiled, carbonized) by heating at a temperature of 673-923K, and the aluminum foil is in a metallic state. It is collected as it is.

  More preferably, the pressure in the hermetic container is reduced to about 10 @ -2 Torr or less, or a gas such as N2 Ar is introduced to adjust the oxygen concentration and heat. More preferably, the heating temperature is 823 to 873K.

  In addition, the waste treatment system of the present invention includes an airtight container that holds waste in which resin and copper are integrated, temperature adjusting means that adjusts the temperature in the airtight container, and copper is not substantially oxidized. And a control means for controlling the temperature in the hermetic container so that the resin is selectively thermally decomposed.

  In addition, the waste treatment system of the present invention includes an airtight container for holding waste in which resin and copper are integrated, temperature adjusting means for adjusting the temperature in the airtight container, and oxygen concentration in the airtight container. Oxygen concentration adjusting means for adjusting, and control means for controlling the temperature and oxygen concentration in the hermetic container so that the resin is selectively thermally decomposed while maintaining the copper not to be substantially oxidized. It is characterized by that.

  If it is less than 673K, thermal decomposition such as carbonization / oilification of the resin portion is insufficient. By heating at a temperature of 673-923K, the resin can be vaporized and oil carbonized, and copper can be recovered in a metallic state.

  More preferably, the pressure in the hermetic container is reduced to about 10 @ -2 Torr or less, or a gas such as N2 Ar is introduced to adjust the oxygen concentration and heat. More preferably, the heating temperature is 823 to 873K.

  It is another object of the present invention to provide a processing apparatus for processing an object containing a metal such as shredder dust and a resin while suppressing the generation of dioxins.

  In addition, the present invention separates electronic components and circuit boards from objects such as circuit boards on which electronic components are mounted while suppressing the generation of dioxins, and separates and collects harmful metals such as lead and metals such as copper. It aims at providing the processing device which performs.

  In order to solve such a problem, the treatment apparatus of the present invention is connected to the first thermal decomposition means for thermally decomposing an object containing a resin and a metal at a first temperature, and to the thermal decomposition means. A reforming means for reforming the gaseous emission generated from the object at a second temperature at which dioxins decompose, and a reforming means connected to the reforming means at a second temperature. A cooling means for cooling the gaseous effluent to a third temperature so that an increase in the dioxin concentration in the modified gaseous effluent is suppressed, and a residue generated by thermal decomposition of the object, It is characterized by comprising a reduced pressure heating means for heating under reduced pressure so that the metal contained in the residue is vaporized, and a condensing means for condensing the metal vaporized from the residue.

  The treatment apparatus of the present invention includes a first pyrolysis means for pyrolyzing an object containing a resin and a metal at a first temperature, and a gas generated from the object, connected to the pyrolysis means. A second pyrolysis means for thermally decomposing the effluent at a second temperature higher than the first temperature, and the gaseous state disposed in connection with the pyrolysis means and pyrolyzed at the second temperature In order to suppress an increase in the dioxin concentration in the discharge, a cooling means for cooling the gaseous discharge to a third temperature, and a residue generated by thermal decomposition of the object is converted into a metal contained in the residue. It is characterized by comprising a reduced pressure heating means for heating under reduced pressure so as to evaporate, and a condensing means for condensing metal evaporated from the residue.

  The processing apparatus of the present invention is connected to the first thermal decomposition means for thermally decomposing an object containing the resin, the first metal, and the second metal at the first temperature, and the first thermal decomposition means. A reforming means for reforming the gaseous emission generated from the object at a second temperature at which dioxins decompose, and a reforming means connected to the reforming means at a second temperature. A cooling means for cooling the gaseous effluent to a third temperature so that an increase in the dioxin concentration in the modified gaseous effluent is suppressed, and a residue generated by thermal decomposition of the object, The first metal contained in the residue is vaporized and the second metal is retained so that the second metal is heated under reduced pressure, and the first reduced pressure heating means is connected to the first reduced pressure heating means. Condensing means for condensing the first metal vaporized from the residue, and the first metal vaporized The second metal may be provided with a second pressure reducing heating means for heating under reduced pressure to melt contained in Kizan渣.

  Further, the second reduced pressure heating means of the treatment apparatus of the present invention heats under reduced pressure so that the second metal contained in the residue obtained by vaporizing the first metal melts and aggregates due to its surface tension. You may do it.

  The processing apparatus of the present invention includes a resin and a metal as a part of a constituent material, and an object having a first part and a second part joined by a joining metal is held in the joining metal and is thermally decomposed. And a reforming means arranged to be connected to the pyrolysis means and reforming the gaseous emission generated from the object at a second temperature at which dioxin decomposes, and the reforming Means for cooling the gaseous effluent to a third temperature so as to suppress an increase in dioxin concentration in the reformed gaseous effluent, wherein the object is disposed in connection with the means; You may make it comprise the reduced pressure heating means which heats the residue produced by thermal decomposition of this under reduced pressure so that the said joining metal may vaporize.

  Such a thermal decomposition means of the processing apparatus of the present invention may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration. Further, the cooling means may cool down to the third temperature in the shortest possible time, preferably within about 10 seconds.

  Moreover, the processing apparatus of the present invention may further include a neutralizing unit that is disposed in connection with the cooling unit and neutralizes the cooled gaseous emission.

  The treatment method of the present invention includes a first pyrolysis step of thermally decomposing an object containing a resin and a metal at a first temperature, and a second method in which dioxin decomposes gaseous emission generated from the object. A reforming step for reforming at a temperature of, a cooling step for cooling the gaseous exhaust to a third temperature so as to suppress an increase in dioxin concentration in the reformed gaseous exhaust, It is characterized by comprising a reduced pressure heating step for heating a residue generated by thermal decomposition of an object under reduced pressure so that a metal contained in the residue is vaporized, and a condensation step for condensing the metal evaporated from the residue. To do.

  The treatment method of the present invention includes a first pyrolysis step in which an object containing a resin and a metal is pyrolyzed at a first temperature, and a gaseous emission generated from the object is second higher than the first temperature. A second pyrolysis step in which pyrolysis is performed at a temperature of the gas, and the gaseous exhaust is treated as a third so that an increase in the dioxin concentration in the gaseous exhaust pyrolyzed at the second temperature is suppressed. A cooling step for cooling to a temperature, a reduced pressure heating means for heating the residue generated by thermal decomposition of the object under reduced pressure so that the metal contained in the residue is vaporized, and a condensation for condensing the metal evaporated from the residue Means.

  The treatment method of the present invention includes a first pyrolysis step in which an object containing a resin, a first metal, and a second metal is pyrolyzed at a first temperature, and gaseous emission generated from the object is dioxin. A reforming step for reforming at a second temperature that decomposes the gas, and the gaseous emission so that an increase in the dioxin concentration in the gaseous emission reformed at the second temperature is suppressed. And cooling means for cooling to a third temperature, and the residue generated by thermal decomposition of the object is heated under reduced pressure so that the first metal contained in the residue is vaporized and the second metal is retained. A first decompression heating step, a condensation step for condensing the first metal vaporized from the residue, and a second metal contained in the residue vaporized from the first metal under reduced pressure so as to melt. And a second reduced pressure heating step for heating.

  In the treatment method of the present invention, in the second reduced pressure heating step, heating is performed under reduced pressure so that the second metal contained in the residue obtained by vaporizing the first metal melts and aggregates due to the surface tension. It is characterized by.

  The treatment method of the present invention is an object having a resin and a metal as a part of a constituent material, and an object having a first part and a second part joined by a joining metal, and holding and thermally decomposing the joining metal. A decomposition step, a reforming step of reforming the gaseous emission generated from the object at a second temperature such that dioxins decompose, and an increase in the dioxin concentration in the modified gaseous emission is suppressed A cooling step for cooling the gaseous emission to a third temperature, and a reduced pressure heating step for heating the residue generated by thermal decomposition of the object under reduced pressure so that the bonding metal is vaporized; It is characterized by comprising.

  The treatment method of the present invention may further comprise a neutralization step for neutralizing the gaseous effluent cooled by the cooling means.

  The pyrolysis step may be performed in a non-oxidizing atmosphere or a reducing atmosphere by controlling the oxygen concentration. In addition, it is preferable that the cooling step is performed within about 10 seconds if it can be performed to the third temperature in the shortest possible time. The first temperature is preferably set to about 250 to about 500 ° C. It is also preferred that the second temperature be set at a temperature of at least about 800 ° C., more preferably at least higher than 1000 ° C., and even more preferably higher than 1200 ° C. The third temperature is preferably set to a temperature lower than at least 150 ° C., more preferably a temperature lower than at least 100 ° C., and even more preferably a temperature lower than 35 ° C.

  In this way, the gaseous effluent discharged from the object to be treated is reformed and pyrolyzed at a high temperature at which dioxins decompose, and the residence time in the temperature range where dioxins are generated and re-synthesized from this state is minimized. Then, the dioxin concentration in the gaseous emission is greatly reduced by cooling to a third temperature at which dioxins are not generated and re-synthesized. In addition, the first pyrolysis, the second pyrolysis, or the reforming is performed in two stages of the first temperature and the second temperature, and simultaneously performed in a reducing atmosphere, so that the source concentration of dioxin is greatly increased. Reduced to

Here, the second temperature is a temperature at which dioxins are decomposed, and not only dioxins but also other compounds contained in the gaseous emission are decomposed. Therefore, in the present invention, not only dioxins but also halogenated hydrocarbons, PCBs,
Coplanar PCB etc. can also be decomposed and rendered harmless.

  That is, the present invention provides a means for decomposing a resin, a means for further thermally decomposing gaseous effluent generated from the object to be treated, and a dioxin for treating an object having resin and metal as components. Is provided with cooling means for cooling so as not to be synthesized, and means for recovering the metal from the thermal decomposition residue by vaporizing or liquefying under reduced pressure. Here, the resin may be a synthetic resin, a natural resin, or a mixture thereof. Further, here, the metal is a generic name of metals contained in the object to be treated unless otherwise described, and is not limited to a specific metal element.

  The first pyrolysis means thermally decomposes at a first temperature at which the object to be treated is pyrolyzed under oxygen concentration control. For example, gaseous waste is extracted from shredder dust, waste circuit boards, and the like. To do. Here, the gaseous emission basically consists of exhaust gas, but does not exclude the case where it contains solid particulates, liquid particulates, etc. mixed in the exhaust gas.

  As the temperature adjusting means for adjusting the first temperature of the first thermal decomposition means, a heating means and a temperature measuring means may be used. As the heating means, various convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber. Further, the gas discharged from the resin or the like of the object to be treated is reformed, rendered harmless and neutralized, and then reused as a fuel gas as a heat source for the treatment apparatus of the present invention including the first thermal decomposition means. It may be. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator to be converted into electric power, and this electric power is used for the operation of the processing apparatus of the present invention including the first thermal decomposition means. It may be.

  Various temperature sensors may be used as the temperature measuring means. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. However, as will be described later, the source of dioxins is set in multiple stages. In order to cut off, it is preferred to keep the first pyrolysis means in reducing conditions. For example, when an aromatic hydrocarbon compound containing chlorine is thermally decomposed under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, the generation of dioxins is suppressed.

  Unless otherwise specified in the present invention, polychlorinated dibenzopara-dioxins (PCCDs), polychlorinated dibenzofurans (PCDFs), and homologues having different chlorine numbers and substitution positions are generic names. It is called dioxin. Also included are compounds in which chlorine is replaced by other halogens.

  Therefore, the first thermal decomposition means is preferably maintained in a reducing atmosphere so that the metal contained in the object to be treated is not substantially oxidized, and therefore includes a temperature adjustment means and an oxygen concentration adjustment means. Is preferred.

  In general, when the object to be treated is complex, the object to be treated may be partially oxidized during the treatment, but the first thermal decomposition means only needs to be maintained in a reducing atmosphere as a whole. . As the oxygen concentration adjusting means, for example, an oxygen concentration sensor which is an oxygen concentration measuring means and a carrier gas introduction system may be used.

  For example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used as the oxygen concentration sensor, or absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, GC-MS may be used, and may be selected or used in combination as necessary.

  For example, a rare gas such as Ar may be used as the carrier gas. Further, the carrier gas not only adjusts the oxygen concentration in the first thermal decomposition means, but also can efficiently lead the gas to the reforming means or the second thermal decomposition means. Furthermore, you may make it serve as a pressure adjustment means.

  Moreover, you may make it provide a shredder in the front | former stage of a 1st thermal decomposition means. The object to be treated brought in from the outside of the apparatus may be introduced into the first thermal decomposition means after being crushed and separated with a shredder, or may be introduced into the first thermal decomposition means without being crushed. Good. When the object to be treated is a waste circuit board, it is preferable to introduce it into the first thermal decomposition means without crushing.

  In the first thermal decomposition means in which the object to be treated is introduced, the state of the metal in the object to be treated is not oxidized as much as possible, and the chlorine combined with the organic compound is made as inorganic as possible when the resin is thermally decomposed. Thus, the temperature / oxygen concentration conditions may be adjusted. The temperature and oxygen concentration conditions may be set in advance, or the measured values of the temperature and oxygen concentration may be fed back to the heating means, the oxygen concentration adjusting means, and controlled. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor or the like may be used.

  Further, the pressure in the chamber of the first thermal decomposition means may be controlled. For example, when the inside of the first thermal decomposition means is depressurized, the oxygen concentration is also reduced and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, even when the resin is decomposed, almost no oxygen is generated. Furthermore, the decomposition product of the resin is easily vaporized.

  On the other hand, when the pressure is reduced, the thermal conductivity in the hermetic region decreases. However, if the inside of the first thermal decomposition means is a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or pressure. Therefore, if the inside of the first thermal decomposition means is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

  Here, a gaseous emission processing system for processing the gaseous emission discharged from the object to be treated will be described.

  The gaseous emission treatment system processes the gaseous emission discharged from the object to be treated by the first thermal decomposition means, and the main part from the reforming means or the second thermal decomposition means and the cooling means. Is configured. The gaseous effluent treated by the cooling means is used as clean fuel gas by performing post-treatment such as neutralization, filtration, and washing as necessary.

  The reforming means is disposed in connection with the first heating means, and the gaseous discharge discharged from the object to be treated in the first pyrolysis means is converted to a second temperature higher than the first temperature. It is to be modified with. Here, reforming refers to changing the hydrocarbon compound contained in the gaseous effluent discharged from the object to be treated to lower molecular hydrogen, methane, carbon monoxide, or the like. In addition, hydrorefining or the like may be performed. It is preferable to modify the system under reducing conditions from the viewpoint of cutting off the source of dioxins as described above. If the inside of the reforming means is maintained in a reducing atmosphere, a small amount of air may be introduced into the reforming means. As the reforming means, not only the thermal reforming means but also a catalytic reforming means using a catalyst, for example, may be provided. As the catalyst, for example, various ceramics, a solid acid such as silica / alumina or zeolite (aluminosilicate), and a metal such as Pt, Re, Ni, and V may be supported and used.

  Further, instead of the reforming means, a second pyrolysis means connected to the first pyrolysis means for pyrolyzing the gaseous effluent in a reducing atmosphere may be provided.

  By separating the reforming means and the second thermal decomposition means from the first thermal decomposition means, the gaseous emission from the object to be treated can be treated at a second temperature higher than the first temperature, Gaseous emission reforming and chlorine mineralization are carried out effectively.

  It is desirable that the reforming means or the second thermal decomposition means maintain conditions such that dioxins derived directly or indirectly from the object to be treated are decomposed as much as possible. For example, considerable dioxins can be decomposed by setting the second temperature to about 800 ° C. Further, by setting the second temperature to 1000 ° C. or higher, more preferably 1200 ° C. or higher, dioxins can be decomposed more effectively. Since this reforming means is performed at a second temperature at which dioxins are decomposed, thermal decomposition of the gaseous effluent occurs at the second temperature at the same time.

  Hydrocarbon compounds contained in the gaseous effluent discharged from the object to be treated are reduced in molecular weight by being reformed by the reforming means and by being thermally decomposed by the second thermal decomposition means. Changes to hydrogen, methane, carbon monoxide, etc. In addition, when dioxins are contained in the gaseous emission, most of the dioxins are decomposed. Furthermore, organic chlorine is mineralized and dioxin resynthesis is suppressed.

  For example, the reforming means or the second pyrolysis means introduces a gaseous effluent from the first pyrolysis means and a small amount of air into a chamber filled with coke, thereby reducing the reducing atmosphere and the dioxin. A temperature condition that decomposes may be formed.

  Further, as described above, the fuel gas and air are combusted to heat the chamber to a temperature at which dioxins are decomposed, and gaseous exhaust from the first thermal decomposition means is introduced into the chamber. Also good.

  Further, a catalytic cracking means such as a catalyst as described above may be provided in the chamber.

  Further, if necessary, the reforming means or the second thermal decomposition means may be provided with a temperature adjusting means and an oxygen concentration measuring means for adjusting the temperature and oxygen concentration in the system. As the oxygen concentration adjusting means, the oxygen concentration sensor and the carrier gas introduction system as described above may be used. Further, a hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

  In this way, the gaseous effluent contained in the gaseous effluent discharged from the object to be treated is reduced in molecular weight by the reforming means or the second thermal decomposition means, and changed to hydrogen, methane, carbon monoxide or the like. . The first pyrolysis means, the reforming means or the second pyrolysis means, and the cooling means contain chlorine in the gaseous emission. In this case, the vessel and piping are corroded by chlorine gas, so the equipment is necessary. Depending on the case, Hastelloy or titanium alloy may be used instead of stainless steel.

  In the treatment apparatus of the present invention, the gaseous emission disposed in connection with the reforming means or the second thermal decomposition means and reformed or pyrolyzed at the second temperature is contained in the gaseous emission. In order to suppress an increase in the dioxin concentration, a cooling means for cooling to the third temperature is provided.

  That is, in the reforming means or the second thermal decomposition means, the dioxin concentration in the gaseous effluent reformed or pyrolyzed at the second temperature is such that the second temperature decomposes the dioxin. In addition, the halogen of the hydrocarbon compound that is decomposed or modified at this temperature is extremely low because it is mineralized by a reducing atmosphere. Therefore, in order to prevent generation and resynthesis of dioxins from this state, cooling is performed to the third temperature so that the increase in the dioxin concentration in the gaseous emission is suppressed as much as possible. The third temperature may be set to a temperature at which dioxin production reaction does not occur.

  For example, it is 150 ° C. or less, preferably from a gaseous emission in a state in which dioxin is decomposed (the temperature may be such that dioxin is decomposed even if it is not the same as the temperature in the reforming means or the second thermal decomposition means) Is suppressed to 100 ° C. or lower, more preferably 50 ° C. or lower, so that generation and resynthesis of dioxins are suppressed. At this time, it is preferable to cool the gaseous emission to the third temperature in the shortest possible time. This is because dioxins are easily generated and re-synthesized at about 200 ° C. to about 400 ° C., and the time during which the gaseous effluent is cooled to the third temperature to stay in a temperature range where dioxins are easily generated and re-synthesized is reduced. By shortening, the dioxin density | concentration in gaseous emission can be suppressed more effectively.

  Therefore, the cooling of the gaseous effluent in the cooling means is preferably carried out rapidly within about 10 seconds.

  As such a cooling means, a coolant such as water or cooling oil may be directly injected into the gaseous discharge to cool the contact. At this time, if alkaline powder such as lime powder is sprayed onto the gaseous emission, the gaseous emission is neutralized. In addition, for example, HCl in the gaseous effluent is diffused to the solid surface in contact with the lime powder, so that generation and resynthesis of dioxins can be suppressed.

  As described above, the first thermal decomposition means, the reforming means or the second thermal decomposition means, and the cooling means change the gaseous emission from the object to be treated into hydrogen, methane, carbon monoxide, etc. The dioxin concentration in gaseous emissions is also greatly reduced.

  In the present invention, the decomposition of the object to be treated and the decomposition of the gaseous emission from the object to be treated are processed in a plurality of stages of the first thermal decomposition means and the reforming means or the second thermal decomposition means, and By keeping such a decomposition means under reducing conditions, the generation of dioxins is suppressed.

  When the gaseous effluent cooled by the cooling means contains halide, SOx, NOx, etc., the gaseous effluent may be cleaned and desulfurized by the cleaning means, the desulfurization means, etc. . Furthermore, you may make it provide the filter means using activated carbon.

  Further, the gaseous effluent cooled by the cooling means may be introduced into a neutralization reaction filtering means such as a bag filter. Between the cooling means and the neutralization reaction filtering means, slaked lime, filter aids (eg, particles with high porosity such as zeolite and activated carbon), etc. may be blown into the gas exhaust gas stream by dry venturi or the like. .

  The gaseous exhaust discharged from the object to be processed thus processed may be used as a heat source for heating the first thermal decomposition means, or supplied to a gas turbine generator to obtain electric power. May be. Further, this electric power may be used as a heat source for the processing apparatus of the present invention.

  Next, processing of the thermal decomposition residue of the object to be processed thermally decomposed by the first thermal decomposition means will be described.

  The processing apparatus of the present invention is provided with means for decomposing and recovering the above-mentioned resin and means for separating and recovering the metal in order to process an object having resin and metal as part of the constituent material. The reduced pressure heating means is means for separating and recovering the metal from the residue of the object to be treated that has been thermally decomposed by the first thermal decomposition means. Such processing may be performed by the processing apparatus of the present invention including a tube and an airtight door.

  The resin component of the object to be treated is almost decomposed by the first thermal decomposition means, and the gaseous emission is treated as described above. Further, the oxygen concentration is controlled in the first thermal decomposition means, and the metal in the object to be treated is held by the object to be treated without being substantially oxidized and hardly vaporized. On the other hand, most of the resin of the object to be treated remains as a carbide as a result of thermal decomposition. In the present invention, the object to be treated treated by the first thermal decomposition means is transferred from the first thermal decomposition means to the reduced pressure heating means.

  The reduced pressure heating means provided in the processing apparatus of the present invention includes a first temperature decomposition means and a pressure adjustment means for selectively vaporizing metal in an object separated by a first thermal decomposition means and an openable / closable partition wall. And a first recovery means for recovering the vaporized metal from the object connected to the first hermetic region. As such a recovery means, a configuration combining an airtight door and a pipe as described above may be adopted.

  As described above, according to the present invention, when the tube is inserted into the first opening, the hermetic door is formed by the region between the second opening and the third opening on the side surface of the tube. Shielded from the first hermetic chamber. For this reason, it is possible to prevent the gaseous emission from condensing or adhering to the hermetic door. Further, for example, even when a packing made of resin or the like is disposed on the seal portion of the hermetic door, the seal portion of the hermetic door can be prevented from being damaged by the heat of the gaseous emission. Therefore, the sealing performance of the hermetic door can be maintained. Thus, in the processing apparatus of the present invention, the interface from the first hermetic chamber to the outside is realized by the hermetic door and the pipe.

  In the processing apparatus of the present invention, even when the second hermetic chamber is opened and the pipe is taken out, the airtightness of the hermetic door is maintained, so that the outside air can be prevented from leaking into the first hermetic chamber. . Therefore, the tube can be taken out while maintaining the temperature condition and pressure condition in the first hermetic chamber. Conventionally, in order to take out the condensate to the outside, the processing apparatus must be stopped, which hinders the productivity of the processing. In the present invention, the processing apparatus can be continuously operated, and the productivity of processing can be improved.

(Embodiment 1)

  FIG. 1 is a perspective view schematically showing an example of the processing apparatus of the present invention. A part was cut away to show the inside.

  This processing apparatus 100 is capable of processing a processing target object 150 having resin and metal as constituent materials. From the purge chamber 101, the first hermetic chamber 102, the second hermetic chamber 103, and the cooling chamber 104, It is configured.

  These chambers are separated by a door 105 which is a partition wall that can be opened and closed. That is, the outside of the apparatus and the purge chamber 101 are provided by the door 105a, the purge chamber 101 and the first airtight chamber 102 are provided by the door 105b, and the first airtight chamber 102 and the second airtight chamber 103 are provided by the door 105c. The second hermetic chamber 103 and the cooling chamber 104 are separated by a door 105d, and the cooling chamber 104 and the outside of the apparatus are separated by a door 105e.

  The door 105 that separates the chambers is provided with airtightness retaining properties and heat insulation properties, and the chambers are thermally and pressureally separated. Since the thermal load applied to the doors 105a and 105b is small, it is sufficient that the airtightness can be maintained.

  An exhaust system 106 is connected to the purge chamber 101. The exhaust system 106 includes an oil diffusion pump 106a, a booster pump 106b, and a rotary pump 106c. Valves (not shown) are arranged between the purge chamber 101 and the exhaust system 106 and between the respective vacuum pumps. This is the same unless otherwise specified.

  A trap 107 is disposed between the purge chamber 101 and the exhaust system 106 to remove moisture, hydrogen gas, and the like discharged from the object to be processed 150 due to reduced pressure in the purge chamber 101 or the like. Therefore, even if moisture or hydrogen gas is discharged from the object to be processed 150 in the purge chamber, the exhaust system 106 is not adversely affected. This trap 107 may be provided as necessary. In addition, for example, when processing objects to be treated such as soil containing organic halides such as dioxins, incineration fly ash, etc., an exhaust gas treatment system capable of decomposing or trapping dioxins as described below is provided instead of traps. What should I do? As the trap, a wet filter such as an oil film filter, a liquid ring pump, or the like may be used.

  The pressure in the purge chamber 101 is adjusted by the exhaust system 106 and a vacuum gauge which is a pressure sensor (not shown). As a vacuum gauge, a Bourdon tube, a Pirani gauge or the like may be used as necessary.

  The purge chamber 101 is connected to a carrier gas introduction system for replacing gas in the purge chamber 101, and 108 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas, but a rare gas such as Ar may be used.

  Further, the purge chamber 101 may be provided with a heating means so that the object to be processed 150 is preheated.

  The pressures in the purge chamber 101 and the first hermetic chamber 102 are made substantially equal, the door 105 b is opened, and the object to be treated 150 is moved to the first hermetic chamber 102 by the pusher 130. Even if not specifically described hereinafter, the door 105 may be opened and closed by balancing the pressures on both sides. When a plurality of hermetic chambers are provided, the chambers may be arranged in an L shape for transporting the object to be processed.

  The first hermetic chamber 102 is a processing chamber for selectively thermally decomposing the constituent resin while maintaining the oxidation state of the constituent metal of the object to be processed 150.

  The first hermetic chamber 102 includes an electric heater 109 as a heating means. Here, a radiant tube is used as the heating means. However, it is not limited to such an electric heater 109, but may be selected or combined as necessary. For example, gas, oil or the like may be burned, or dielectric heating may be performed. Further, gas or oil which is a thermal decomposition product of the constituent resin of the object to be processed 150 may be burned.

  The temperature in the first hermetic chamber 102 is adjusted by the electric heater 109, a temperature sensor (not shown), and a control means (not shown) that controls the electric heater based on a measured value from the temperature sensor. For example, the control means may be configured to use a program that inputs a measurement value or a measurement voltage from a temperature sensor and outputs a signal or a voltage that changes the input power to the electric heater in an electronic computer. Good.

  Such control may be performed by an analog circuit, or an operator may operate the heating unit according to the measured temperature.

  In the processing apparatus illustrated in FIG. 1, the temperature in the first hermetic chamber 102 is not only the pressure and oxygen concentration in the first hermetic chamber 102 described later, but also the purge chamber 101, the second hermetic chamber 103, Along with various conditions in the cooling chamber 104, opening and closing of the partition wall 105, and transfer of the object to be processed 150, control is integrally performed by control means (not shown). For example, this control means may be implemented by mounting a control program on an electronic computer.

  An exhaust system 110 is also connected to the first hermetic chamber 102. The configuration of this exhaust system is the same as that of the exhaust system 110 of the purge chamber 101.

  The pressure in the first hermetic chamber 102 is adjusted by the exhaust system 110 and a vacuum gauge which is a pressure sensor (not shown). As the vacuum gauge, a Bourdon tube, a Pirani gauge or the like may be used as necessary. A carrier gas introduction system for adjusting the oxygen concentration in the chamber is connected to the first hermetic chamber 102, and 112 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown).

  Here, N2 is used as the carrier gas, but a rare gas such as Ar or air may be used.

  By appropriately operating the exhaust system 110 and the carrier gas introduction valve 112, the first hermetic chamber can be depressurized or pressurized. The pressure adjusting means of this apparatus can adjust the pressure in the system from 10 @ -3 Torr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the carrier gas may be further pressurized by preloading.

  The oxygen concentration in the first hermetic chamber 102 is adjusted by a carrier gas introduction valve 112 and an oxygen concentration sensor (not shown). For example, a zirconia sensor may be used as the oxygen concentration sensor. When the temperature in the first hermetic chamber 102 is low for the zirconia sensor, for example, the gas extracted from the first hermetic chamber 102 may be adjusted to about 773K and measured.

  In addition to the zirconia sensor, for example, the oxygen concentration may be measured by infrared spectroscopy of the gas in the system.

  The oxygen concentration in the first hermetic chamber 102 may be adjusted not by introducing a carrier gas such as N2, but by the total pressure in the system.

  When the thermal decomposition of the constituent resin of the object 150 to be processed starts, the atmosphere of the decomposition product gas of the resin is dominant in the first hermetic chamber 102. Therefore, if the inside of the first hermetic chamber 102 is depressurized and the oxygen concentration is sufficiently lowered before the thermal decomposition of the resin is started, combustion of the object to be processed 150 and oxidation of the constituent metals of the object to be processed 150 are prevented. be able to.

  As described above, the pressure and oxygen concentration in the first hermetic chamber 102 may be controlled in the same manner as the temperature. For example, a program that outputs a signal or voltage for controlling the valve of the exhaust system 110 and the carrier gas introduction valve 112 as an output is input to the electronic computer as a control means. You may make it use.

  An exhaust gas treatment system 111 is disposed between the first hermetic chamber 102 and the exhaust system 110 for treating a gaseous emission containing a decomposition product gas of a constituent resin of the object to be treated 150. The first hermetic chamber 102 and the exhaust gas treatment system 111 are separated by an airtight door 111b that can be opened and closed. When the hermetic door 111b is opened, the retort 111c is inserted from the exhaust gas treatment system 111 side. At this time, the hermetic door 111b is shielded from the first hermetic chamber 102, and the first hermetic chamber 102 and the exhaust gas treatment system 111 are hermetically communicated by the retort 111c. By adopting such a configuration, in the processing apparatus of the present invention, it is possible to prevent the gaseous emission from adhering to the hermetic door 111b. Further, the seal portion of the hermetic door 111b is shielded from the heat from the first hermetic chamber 102. For this reason, the seal part of an airtight door is protected and airtightness can be improved.

  In the exhaust gas treatment system, exhaust gas is made harmless and valuables are recovered by condensing the exhaust gas, decomposing it with a catalyst or plasma glow discharge, or adsorbing it with an adsorbent. For example, the gas generated by the selective thermal decomposition of the object to be treated 150 may be condensed by an exhaust gas treatment system and recovered as oil or tar such as light oil or heavy oil. The oil recovered as described above may be used as a heating means.

  Further, when a gas such as halogen or organic halide is contained in the decomposition product gas of the constituent resin of the object to be processed 150, it may be decomposed using, for example, a catalyst or plasma.

  In order to prevent harmful gas discharged from the object to be processed 150 from leaking out of the apparatus, a multi exhaust gas chamber (not shown) may be provided in the subsequent stage of the exhaust systems 106, 110, 114, and 115 connected to each chamber.

  The temperature, pressure, and oxygen concentration in the first hermetic chamber 102 are controlled as described above. Therefore, the constituent resin of the object to be processed 150 can be selectively thermally decomposed without almost oxidizing or vaporizing the constituent metal. And the gaseous emission produced by the thermal decomposition of the constituent resin is treated by the exhaust gas treatment system 111 exhaust gas treatment system. It is not necessary to completely carbonize the constituent resin of the object to be treated in the first hermetic chamber 102, and if the second hermetic chamber 103 in the subsequent stage can be selectively thermally decomposed so as not to interfere with the separation and recovery of the metal. Good.

  When the processing in the first hermetic chamber 102 is completed, most of the constituent resin remaining in the processing target object 150 exists as carbide.

  In the processing apparatus 100 of the present invention, since the object to be processed 150 heated in the first hermetic chamber 102 is transferred to the second hermetic chamber 103 without cooling, the thermal efficiency is very high.

  The second hermetic chamber 103 is a processing chamber for selectively vaporizing and collecting the constituent metal of the processing target object 150 from the processing target object 150.

  The second hermetic chamber 103 includes an electric heater 109 similar to the first hermetic chamber as a heating means. The heating means is not limited to the electric heater 109, and may be selected or combined as necessary.

  As described above, the temperature in the second hermetic chamber 103 is controlled in the same manner as in the first hermetic chamber 102 by the electric heater 113 and a temperature sensor (not shown). That is, the temperature in the second hermetic chamber 103 is not only the pressure and oxygen concentration in the second hermetic chamber 103, but also the conditions of the purge chamber 101, the first hermetic chamber 102, the cooling chamber 104, and the partition wall 105. As well as opening and closing, the control means (not shown) is controlled in an integrated manner.

  An exhaust system 114 is also connected to the second hermetic chamber 103. The configuration of the exhaust system is the same as that of the exhaust system 114 of the purge chamber 101.

  The pressure in the second hermetic chamber 103 is adjusted by the exhaust system 114 and a vacuum gauge (not shown) which is a pressure sensor. As the vacuum gauge, a Bourdon tube, a Pirani gauge or the like may be used as necessary. A carrier gas introduction system for adjusting the oxygen concentration in the chamber is connected to the second hermetic chamber 103, and 112 is a carrier gas introduction valve. The carrier gas introduction system is connected to a carrier gas reservoir (not shown). Here, N2 is used as the carrier gas, but a rare gas such as Ar may be used.

  By appropriately operating the exhaust system 114 and the carrier gas introduction valve 112, the first hermetic chamber can be depressurized or pressurized. In this apparatus, the pressure in the system can be adjusted from 10 @ -3 Torr to about 4.times.10@3 Torr. The pressure may be further reduced by changing the capacity and capacity of the exhaust system. Further, the carrier gas may be further pressurized by preloading.

  Since the vapor pressure (boiling point) of the constituent metal of the object to be processed 150 decreases with the pressure reduction in the second hermetic chamber 103, the metal can be vaporized at a lower temperature.

  Therefore, what is necessary is just to change the capability of the heating means and exhaust means with which the 2nd airtight chamber 103 is provided according to the kind of metal isolate | separated from the process target object 150, and collect | recovered.

  For example, dielectric heating means may be provided to heat the inside of the second hermetic chamber 103 to a higher temperature. Further, for example, in order to depressurize the second hermetic chamber 103 to a higher vacuum, a vacuum pump having a higher capacity and a larger displacement may be provided. Depending on the capacity in the second hermetic chamber 103, a higher vacuum may be obtained using an ion getter pump, a turbo molecular pump, or the like.

  The oxygen concentration in the second hermetic chamber 103 is sufficiently low even if it is not particularly adjusted because the system is sufficiently decompressed. Therefore, it is not necessary to positively adjust, but when an oxygen concentration adjusting means is provided, it may be the same as the first hermetic chamber 102.

  Moreover, although the processing apparatus 100 shown in FIG. 1 illustrated the structure provided with the 2nd airtight chamber 103, you may make it provide the 2nd airtight chamber 103 with two or more. By providing a plurality of second hermetic chambers 103 having different internal temperature and pressure conditions, a plurality of metals having different vapor pressures can be vaporized and recovered from the object to be treated 150.

  Further, when it is not necessary to separate and collect the metal from the processing target object 150 for each element, a plurality of metals may be vaporized from the processing target object 150 and recovered. For example, when removing the Pb—Sn alloy from the object to be treated, the pressure in the second hermetic chamber 103 is heated to a temperature at which Pb and Sn are vaporized, and Pb and Sn are recovered. Good. Of course, Pb and Sn may be selectively vaporized and recovered as separate fractions.

  Between the second hermetic chamber 103 and the exhaust system 114, a recovery chamber 115 for recovering gas state metal vaporized from the object to be processed 150 is disposed. This recovery chamber cools and condenses the metal vaporized in the chamber below the melting point. The second hermetic chamber 103 and the recovery chamber 115 are separated by an airtight door 115b that can be opened and closed. When the hermetic door 115b is opened, a retort (or piping) 115c is inserted from the collection chamber 115 side. At this time, the hermetic door 115b is shielded from the second hermetic chamber 103 and the recovery chamber 115, and the second hermetic chamber 103 and the recovery chamber 115 are in airtight communication with the retort 115c. By adopting such a configuration, in the processing apparatus of the present invention, it is possible to prevent evaporation from the object to be processed from condensing and adhering to the hermetic door 115b. Further, the seal portion of the hermetic door 115 b is shielded from the heat from the second hermetic chamber 103. For this reason, the sealing part of the airtight door 115b is protected, and airtightness can be improved.

  Further, the recovery chamber 115 can be separated from the second hermetic chamber 103 by retracting the retort 115c toward the recovery chamber 115 and closing the airtight jump t et al. 115b. In this state, the recovery chamber 115 can be opened from the outside to replace the retort 115c. Therefore, in the processing apparatus of the present invention, condensate once evaporated from the object to be processed can be taken out while maintaining conditions such as the temperature and pressure in the second hermetic chamber 103. For this reason, continuous operation of the processing apparatus becomes possible, and the productivity of processing is greatly improved. The configuration of the recovery chamber will be described in detail separately.

  The retort 115c disposed in the recovery chamber 115 may have a counterflow structure or a spiral structure. Whether the vaporized metal is continuously condensed and recovered, or when it is condensed and recovered by batch processing, the recovery efficiency increases if the residence time of the vaporized metal in the recovery chamber 115 is increased. Between the recovery chamber 115 and the exhaust system 114, a valve, a partition wall that can be opened and closed, and a filter that captures evaporate and condensate that cannot be recovered by the retort 115c may be provided.

  Further, N2 or rare gas may be introduced into the second hermetic chamber 103 as a carrier gas. The vaporized metal is efficiently introduced into the recovery chamber by the carrier gas.

  A plurality of collection chambers 115 may be provided in the second hermetic chamber 103. The same metal may be recovered in the plurality of recovery chambers 115, or the temperature and pressure in the second hermetic chamber 103 may be adjusted stepwise to selectively vaporize the plurality of metals, thereby The recovery chamber 115 may be switched to recover.

  The temperature, pressure, and oxygen concentration in the second hermetic chamber 103 are controlled as described above. Therefore, the constituent metal of the object to be processed 150 can be vaporized according to the vapor pressure and recovered in the metal state in the recovery chamber 115.

  Depending on the degree of thermal decomposition of the constituent resin of the object to be processed 150 in the first hermetic chamber, the constituent resin may discharge decomposition product gas and the like. Such decomposition product gas may be processed by connecting the subsequent stage of the recovery chamber 115 to the exhaust gas processing system exhaust gas processing system 111 or a multi exhaust gas chamber (not shown).

  Thus, in the second hermetic chamber 103, a predetermined metal can be vaporized and recovered from the object to be processed.

  If the processing target object 150 is directly taken out of the apparatus 100 from the second hermetic chamber 103, the processing target object 150 may be rapidly oxidized. Moreover, the inside of the second hermetic chamber 103 must be returned to the atmospheric pressure, which is inconvenient from the viewpoint of maintaining the airtightness in the second hermetic chamber 103. For this purpose, the processing apparatus 100 illustrated in FIG. 1 includes a cooling chamber 104 subsequent to the second hermetic chamber 103.

  This cooling chamber includes pressure adjusting means similar to the purge chamber 101, the first hermetic chamber 102, and the second hermetic chamber 103, and oxygen concentration adjusting means. That is, the same exhaust system 116 and carrier gas introduction valve 117 as those described above are provided.

  The object to be processed 150 from which the predetermined metal is separated in the second hermetic chamber 103 is transferred to the cooling chamber 104 and cooled in a state where the pressure and the oxygen concentration are adjusted. The carrier gas functions not only for adjusting the oxygen concentration but also as a cooling gas for the object 150 to be processed.

  A trap 118 may be disposed between the cooling chamber 104 and the exhaust system 116 for removing gas discharged from the object to be processed by preheating.

  When the object to be processed 150 is sufficiently cooled in the cooling chamber 104, it is taken out of the apparatus.

  Such a processing apparatus of the present invention processes a processing target object that may generate organic halides such as dioxins, and a processing target object (for example, soil, incineration fly ash) containing organic halides. Even if it works effectively. This is because the heat treatment of the object to be treated is performed under reduced pressure, so that the partial pressure of the organic halide or the component having an organic halide generating ability in the atmosphere gas coexisting with the object to be treated is suppressed to be extremely small. It is. By cooling the heated residue of the object to be treated in such a gas that is substantially free of organic halides and does not have the ability to generate organic halides, the concentration of dioxins contained in the finally discharged residue is reduced. can do. The introduction and removal of the processing target object 150 from the processing apparatus 100 and the transfer of the processing target object 150 between the chambers may be performed by the pusher 130 and the drawer 131.

  The operation of the pusher 130 and the drawer 131 may be performed by the control means (not shown) as well as opening and closing of the partition wall 105.

  FIG. 2 is a diagram schematically showing the processing apparatus of the present invention illustrated in FIG. A pressure sensor 202a in the purge chamber 101, a temperature sensor 201a in the first hermetic chamber 102, a pressure sensor 202b, an oxygen concentration sensor 203, and a temperature sensor 201c in the second hermetic chamber 103 are not shown in FIG. The signals from the pressure sensor 202c and the pressure sensor 202d in the cooling chamber 104 are transmitted to the control panel 200 constituting the control means. The control means may be configured by installing a program in an electronic computer. The control means may control the heating means, pressure adjusting means, and oxygen concentration adjusting means in accordance with the state of each room in the apparatus. In addition, the control unit may open and close the partition wall 105 and transfer the processing target object 150 by the pusher 130 and the drawer 131. Reference numeral 210 denotes a monitor that indicates to the operator the temperature, pressure, oxygen concentration, etc. of each room, the opening / closing state of the partition wall 105, and the like. Reference numeral 211 denotes a multi-exhaust gas treatment apparatus.

  Embodiment 2)

  FIG. 3 is a diagram schematically showing another example of the processing apparatus of the present invention. A part was cut away to show the inside. This processing apparatus 300 is also capable of processing a processing target object 350 having resin and metal as constituent materials.

  The processing apparatus 300 includes a purge chamber 301, an airtight chamber 302, and a cooling chamber 303. The hermetic chamber 302 has the functions of the first hermetic chamber 102 and the second hermetic chamber 103 of the processing apparatus 100 illustrated in FIG. That is, first, the constituent resin of the object to be treated 350 is selectively thermally decomposed in the hermetic chamber 302, and then the metal is separated and recovered in the same hermetic chamber 302. In particular, when a desired metal is isolated by selective thermal decomposition of the resin, it is not necessary to vaporize the constituent metal of the object 350 to be processed.

  The airtight chamber 302 includes a temperature adjusting means, a pressure adjusting means, and an oxygen concentration adjusting means, but the oxygen concentration may be adjusted by the total pressure in the airtight chamber 302 as described above.

  The temperature in the hermetic chamber 302 may be adjusted by the electric heater 309 and a temperature sensor (not shown).

  The pressure in the hermetic chamber 302 may be adjusted by the exhaust systems 310 and 314, the carrier gas introduction system, and a pressure sensor (not shown). 312 is a carrier gas introduction valve.

  Between the hermetic chamber 302 and the exhaust system 310, an exhaust gas treatment system 311 for treating a gaseous emission containing decomposition product gas of the constituent resin of the object to be treated 350 is disposed.

  In addition, a recovery chamber 315 for condensing constituent metal gas evaporated from the object to be processed 350 is disposed between the hermetic chamber 302 and the exhaust system 314. The configuration of the recovery chamber 315 is the same as described above. When it is not necessary to vaporize the constituent metal of the object to be treated, a plurality of exhaust gas treatment systems 311 may be provided.

  The purge chamber 301, the cooling chamber 303, the partition 305, the carrier gas introduction system, the pusher 330, and the drawer 331 are the same as those in the processing apparatus 100 illustrated in FIG. Moreover, what is necessary is just to prepare similarly about a control means.

  As described above, the processing apparatus of the present invention basically comprises a portion that selectively thermally decomposes the constituent resin of the object to be processed so as not to oxidize the constituent metals as much as possible. By combining the structure in which the constituent metal is vaporized from the object to be processed and separated and collected in this part, the category of objects that can be processed is greatly expanded.

  For example, in the treatment of resin-coated aluminum foil or the like, aluminum can be recovered in a metallic state by selectively thermally decomposing the resin portion in a controlled atmosphere.

  In addition, the processing of the mounting substrate or the like in which the electronic component is mounted on the substrate may be performed by vaporizing and collecting the solder alloy and separating the substrate and the electronic component.

  Embodiment 3)

  FIG. 4 is a diagram schematically showing another example of the processing apparatus of the present invention.

  The processing apparatus 400 includes a first hermetic chamber 401 and a second hermetic chamber 402. The first hermetic chamber 401 includes temperature adjusting means (not shown), and is connected to the exhaust system 403 and the exhaust gas treatment system 404. The second hermetic chamber includes temperature adjusting means (not shown), and is connected to the exhaust system 405 and the recovery chamber 406. In addition, a carrier gas introduction system 407 is connected to the first hermetic chamber 401 and the second hermetic chamber 402 so that the oxygen concentration in the hermetic chamber can be adjusted and pressurized. Reference numeral 408 denotes a carrier gas reservoir. The first hermetic chamber 401 and the exhaust gas treatment system 404 are separated by an airtight door 404b. When the hermetic door 404b is open, the retort 404c is inserted into the opening of the first hermetic chamber 401, shields the hermetic door 404b from the first hermetic chamber 401 and the exhaust gas treatment system 404, and also the first hermetic chamber 401. And the exhaust gas treatment system 404 are communicated substantially in an airtight manner. Similarly, the second hermetic chamber 402 and the recovery chamber 406 are separated by a hermetic door 406b. When the hermetic door 406b is open, the retort 406c is inserted into the opening of the second hermetic chamber 402 to shield the hermetic door 406b from the second hermetic chamber 402 and the recovery chamber 406, and The collection chamber 406 is in airtight communication.

  In this example, the constituent resin of the object to be treated having resin and metal is selectively thermally decomposed in the first hermetic chamber 401, and the decomposition product gas is detoxified in the exhaust gas treatment system 404. At this time, the resin is selectively thermally decomposed while maintaining the state of the constituent metal of the object to be treated by adjusting the temperature, pressure, and oxygen concentration in the first hermetic chamber 401 by the control means described above. do it. Further, the configuration of the exhaust gas treatment system 404 may be similar to that of the recovery chamber 406 to condense the evaporated material from the object to be treated.

  Further, a reforming unit 409 for reforming gaseous emission is disposed on the exhaust gas treatment system 404 side in the first hermetic chamber 401. In this example, the reforming unit 409 is provided with heating means such as a radiant tube, and the gaseous effluent is heated from about 700 ° C. to about 1200 ° C. to perform cracking under reduced pressure. For example, a gas generated by thermal decomposition of an organic substance such as a resin constituting the object to be treated is reformed when passing through the reforming unit 409. Therefore, the gas treatment at the subsequent stage is facilitated. Further, by performing the reforming under reduced pressure, it is possible to suppress the regeneration of organic halides such as dioxins from the gaseous emission. The reforming unit 409 may perform not only cracking of the gaseous emission by heating, but also reforming by glow discharge or plasma discharge, or reforming by a catalyst.

  When reforming the gaseous emission by the reforming unit 409, the inside of the system is first exhausted by the exhaust system, the reforming unit 409 reaches the reforming temperature, and (the reforming by heating is performed). If). Thereafter, it is preferable to heat the object to be treated by adjusting the temperature of the first hermetic chamber 401. Even when the reforming unit 409 performs reforming by glow discharge or plasma discharge, or reforming by a catalyst, the object to be treated may be heated after reaching a state where reforming can be performed. With such a configuration, it is possible to reliably reform the gaseous emission during the temperature rising process of the object to be treated. For example, when treating soil contaminated with organic halides such as dioxins or incineration fly ash, dioxins (solid, liquid, gas) are extracted or synthesized in the temperature rising process from room temperature to about 500 ° C. Or According to the treatment apparatus of the present invention, it is possible to reliably reform the gaseous emission generated in such a temperature raising process.

  In the second hermetic chamber 402, the internal temperature and pressure are adjusted to vaporize the constituent metal of the object to be processed and condense in the recovery chamber 406. The temperature and pressure in the second hermetic chamber 402 may be adjusted by the same control means as in the first hermetic chamber 401. As described above, the purge chamber may be disposed in the front stage of the first hermetic chamber 401 or in the rear stage of the second hermetic chamber 402. Further, the second hermetic chamber may be provided with a reforming unit similar to the first hermetic chamber.

  Embodiment 4)

  FIG. 5 is a diagram schematically showing another example of the processing apparatus of the present invention.

  The processing apparatus 500 is an apparatus capable of processing an object to be processed having resin and metal as constituent materials, and includes a purge chamber 501, a first hermetic chamber 502, a second hermetic chamber 503, and a third hermetic chamber. 504 and a cooling chamber 505 are provided.

  The purge chamber 501 is connected to a trap 506 and an exhaust system 507. The first hermetic chamber 502 is connected to the exhaust gas treatment system 508 and the exhaust system 509 via the hermetic door 508b. The second hermetic chamber 503 is connected to the recovery chamber 510 and the exhaust system 511 via the hermetic door 510b. The third hermetic chamber 504 is connected to the recovery chamber 512 and the exhaust system 513 through the hermetic door 512b. The cooling chamber 505 is connected to a trap 514 and an exhaust system 515. The first hermetic chamber 502, the second hermetic chamber 503, and the third hermetic chamber 504 are provided with temperature adjusting means (not shown). Reference numeral 516 denotes a carrier gas introduction system, and 517 denotes a carrier gas reservoir.

  The first hermetic chamber 502 is provided with an oxygen concentration sensor (not shown) so that the oxygen concentration in the system can be adjusted independently of the total pressure.

  That is, the processing apparatus 500 includes a plurality of processing chambers for vaporizing constituent metals of the processing target object. Even when the object to be processed has a plurality of constituent metals, the second hermetic chamber 503 and the third hermetic chamber 504 can be selectively vaporized and collected.

  Embodiment 5)

  FIG. 6 is a diagram schematically showing another example of the processing apparatus of the present invention.

  The processing apparatus 600 is an apparatus capable of processing a processing target object having resin and metal as constituent materials. In this processing apparatus 600, a plurality of recovery systems are connected to one airtight container 601, and processing is performed by switching the recovery systems according to the temperature, pressure, and oxygen concentration inside the airtight container 601. Also in this example, the airtight container 601 and the exhaust gas treatment system 602 are separated by the airtight door 602b as described above. The airtight container 601 and the collection chamber 605 are also separated by an airtight door 605b.

  Embodiment 6)

  FIG. 7 is a diagram schematically showing a configuration of a control system 610 that adjusts the temperature, pressure, and oxygen concentration in the hermetic container 601. As described above, all or part of the control unit 611 may be mounted on an electronic computer as a control program, for example, to control the apparatus.

  A plurality of exhaust gas treatment systems 602 for collecting decomposition product gases of the constituent resin of the object to be treated are connected to the airtight container 601, and each exhaust gas treatment system 602 is connected to the exhaust system 603. In general, since a large amount of the decomposition product gas of the resin is discharged, by providing a plurality of exhaust gas treatment systems as described above, the state control in the hermetic container is facilitated, and the burden on the exhaust system is reduced.

  The exhaust system 603 is provided with an exhaust gas treatment device 604 that renders harmful substances contained in the exhaust gas harmless, non-bromide, and smokeless. For example, dioxins, SOx, NOx, and the like that have passed through the exhaust system 603 are processed by the exhaust gas treatment device 604 to be equal to or lower than the emission standard value and are discharged. The exhaust gas treatment device 604 may include, for example, a wet filter such as an oil film filter or a bag filter, an activated carbon filter, or the like.

  The airtight container 601 is connected to a plurality of collection chambers 605 for collecting the constituent metal of the object to be processed vaporized in the airtight container 601, and each of the collection chambers is connected to an exhaust system 606.

  A plurality of collection chambers 605 connected to the airtight container 601 may collect the same metal. Further, a plurality of metals having different vapor pressures (boiling points) may be recovered by switching according to the temperature and pressure conditions in the hermetic container 601.

  A carrier gas introduction system is connected to the hermetic container 601. Reference numeral 607 denotes a carrier gas reservoir. By introducing a carrier gas such as N2 or Ar, the oxygen concentration in the hermetic vessel 601 can be adjusted independently of the total pressure. Further, the inside of the airtight container 601 may be pressurized by introducing a pre-pressurized carrier gas. By depressurizing the object to be treated in a non-oxidizing atmosphere, the decomposition efficiency of the constituent resin is improved.

  Further, the oxygen concentration in the airtight container 601 may be adjusted by the total pressure.

  Embodiment 7)

  8 and 9 are diagrams schematically showing an example of the configuration of the recovery chamber of the processing apparatus of the present invention illustrated in FIGS. 1 and 2. FIG. 8 shows a state in which the retort 115c is retracted into the recovery chamber 115 and the hermetic door 115b is closed. FIG. 9 shows a state in which the retort 115c moves forward and is inserted into the opening 103b of the second hermetic chamber 103, and the hermetic door 115b is opened. Here, the collection chamber will be mainly described, and the other portions are not shown.

  A collection chamber 115 separated by a hermetic door 115 b that can be opened and closed is disposed adjacent to the second hermetic chamber 103. The recovery chamber 115 is provided with temperature adjusting means (not shown). A carrier gas introduction system and a cooling gas introduction system may be connected to the recovery chamber 115. A recovery chamber 115 is provided between the second hermetic chamber 103 and the exhaust system 114. An airtight door 115b is provided between the second hermetic chamber 103 and the recovery chamber 115 so that the second hermetic chamber 103 and the recovery chamber 115 can be separated. A retort 115 c is accommodated in the recovery chamber 115. The retort 115c is a replaceable pipe-like cassette for recovering the evaporated material from the object to be processed. In this example, it has a hollow cylindrical shape having a second opening 115 f on the surface facing the second hermetic chamber 103 and a third opening 115 d on the side surface on the exhaust system 114 side. The gas flowing from the second hermetic chamber 103 toward the exhaust system 114 enters the retort 115c through the second opening 115f of the retort, and is guided to the exhaust system 114 through the opening 115d on the side surface of the retort. A metal net or the like may be provided inside the retort 115c so that the evaporated material from the object to be processed is easily condensed. In any case, the shape of the retort 115c may be designed as necessary so as to match the opening 103b of the second recovery chamber 103. Moreover, what is necessary is just to design the internal structure of a collection | recovery retort as needed. Further, the recovery chamber 115c has a water-cooled jacket structure, and can be maintained at a temperature lower than the temperature at which the evaporant condenses in the chamber.

  The retort 115 c can be taken out and loaded into the recovery chamber 115 by opening the recovery chamber 115 in a state separated from the second hermetic chamber 103 and the exhaust system 114.

  The recovery chamber 115 is provided with a mechanism for moving the retort 115c back and forth. In this example, the retort 115c moves forward and backward in the collection chamber 115 by the expansion and contraction of the cylinder 115d. The recovery retort 115c is inserted into the opening 103b of the second hermetic chamber 103 at the forward movement position. A plurality of cylinders may be provided for forward movement and backward movement. In this example, the cylinder is covered with a bellows-like cover in order to prevent evaporation from adhering to the cylinder 23. In the collection chamber 115, a mechanism for guiding the reciprocating operation of the retort 115c is provided. As such a guide mechanism, a guide rail, a guide roller, or the like may be used as necessary. This guide mechanism helps heat transfer between the recovery chamber 115 and the retort 115c. For this reason, the guide mechanism may be made of a metal having good heat conduction.

  Here, the operation of the processing apparatus of the present invention having such a recovery system will be described. First, the hermetic door 115b is opened, the retort 115c is advanced, and inserted into the opening 103b of the second hermetic chamber 103 (see FIG. 9). The hermetic door 115b is separated from the second hermetic chamber 103 and the recovery chamber 115 by a recovery retort 115c. By adopting such a configuration, it is possible to prevent evaporation from the object to be processed from adhering to the hermetic door 115b. The hermetic door 115 b is shielded from the radiant heat of the second hermetic chamber 103. For this reason, the seal part of the airtight door 115b is protected, and the airtightness of the system can be improved.

  If the retort 115c is inserted into the opening 103b of the second hermetic chamber 103, the temperature and pressure in the second hermetic chamber 103 are adjusted to be equal to or higher than the boiling point of the desired metal in the object to be treated, and the metal is removed. Evaporate. The evaporant from the object to be treated passes through the retort 115c and is cooled toward the exhaust system 114, and is condensed in the retort 115c. A filter for trapping evaporant that cannot be condensed in the retort 115 c may be interposed between the recovery chamber 115 and the exhaust system 114. Thereby, it is possible to prevent the evaporated material from the object to be processed from reaching the vacuum pump. At this time, the hermetic door 115b is shielded from the hot gas flow containing the evaporated material from the object to be treated by the retort 115c. For this reason, it is possible to prevent the evaporated metal from the object to be processed from condensing on the seal portion of the hermetic door 115b. Moreover, even when resin is used for the seal portion of the hermetic door 115b, the seal portion can be protected.

When the evaporation process of a desired component from the object to be processed is completed, the retort 115c is retracted into the recovery chamber 115 and the hermetic door 115b is closed (see FIG. 8).
Further, the valve between the recovery chamber 115 and the exhaust system 114 is closed to separate the recovery chamber 115 from the exhaust system 114. In this state, an airtight door (not shown) provided in the recovery chamber 115 is opened, and the retort 115c is taken out. Since the condensate in the retort 115c is in a metal state or in an unstable state with a large specific surface area, a gas such as nitrogen dioxide, inert gas, or the like is introduced before the recovery chamber 115 is opened. It is preferable to cool the condensate. Thereafter, another retort is loaded into the collection chamber 115 and the same operation is repeated. If such a recovery chamber 115 is provided, various conditions such as the temperature, pressure, oxygen concentration, etc. of the second hermetic chamber 103 and the recovery chamber 115 can be controlled independently. Therefore, the operational efficiency of the apparatus is improved. Such a recovery chamber may of course be applied to each recovery chamber of the processing apparatus of the present invention as shown in FIGS. 3, 4, 5, 6, and the like. The same configuration can be adopted not only for the recovery chamber but also for the connection between the exhaust gas treatment system and the airtight chamber. By adopting such a configuration, in the treatment apparatus of the present invention, even when the heating furnace is depressurized or pressurized, the evaporated substance from the object to be treated while continuously operating without stopping the furnace, Thermal decomposition products such as gaseous emissions can be recovered. For this reason, the productivity of processing can be greatly improved. Therefore, the processing cost can be reduced.

  Embodiment 8)

  10, FIG. 11 and FIG. 12 are diagrams schematically showing an example of the configuration of the processing apparatus of the present invention. FIG. 10 shows a state in which the retort is loaded in the recovery chamber, FIG. 11 shows a state in which the retort is inserted into the hermetic chamber, and FIG. 12 shows a state in which the recovery chamber is opened to replace the retort. In this example, the processing apparatus of the present invention shown in FIGS. 1 and 2 will be described as an example. However, the configuration of the recovery system can be similarly applied to other processing apparatuses of the present invention.

  As described above, the second hermetic chamber 103 is separated from the recovery chamber 115 by the hermetic door 115b that can be opened and closed. The recovery chamber 115 is connected to the exhaust system 114 through the opening 17. Reference numeral 14 is a storage chamber that is accommodated when the hermetic door 115b is opened, and 15 is a cylinder for opening and closing the hermetic door 115b. A retort 115 c is accommodated in the recovery chamber 115. The retort 115c is a replaceable pipe-like cassette for recovering the evaporated material from the object to be processed. In this example, it has a hollow cylindrical shape having an opening (115d) on the surface facing the second hermetic chamber 103 and the side surface on the exhaust system 114 side. The recovery chamber 115 is provided with a mechanism for moving the retort 115c back and forth. In this example, the retort 115 c moves forward and backward in the collection chamber 115 by the expansion and contraction of the cylinders 23 and 31. The recovery retort 115c is inserted exactly into the opening 103b of the second hermetic chamber 103 in the forward movement position. A plurality of cylinders may be provided for forward movement and backward movement. In this example, the cylinder is covered with a bellows-like cover 30 in order to prevent evaporation from adhering to the cylinder 23. In the collection chamber 115, a mechanism for guiding the reciprocating operation of the retort 115c is provided. As such a guide mechanism, a guide rail, a guide roller, or the like may be used as necessary.

  FIG. 11 shows a state in which the hermetic door 115 b is opened, the retort 115 c is moved forward, and inserted into the opening 103 b of the second hermetic chamber 103. The hermetic door 115b is separated from the second hermetic chamber 103 and the recovery chamber 115 by a recovery retort 115c. By adopting such a configuration, it is possible to prevent evaporation from the object to be processed from adhering to the hermetic door 115b. The hermetic door 115 b is shielded from the radiant heat of the second hermetic chamber 103. For this reason, the seal part of the airtight door 115b is protected, and the airtightness of the system can be improved. In this state, the temperature and pressure in the second hermetic chamber 103 are adjusted to be equal to or higher than the boiling point of the desired metal in the object to be treated, and the metal is evaporated. The evaporant from the object to be treated passes through the retort 115c and is cooled toward the exhaust system 114, and is condensed in the retort 115c. At this time, the hermetic door 115b is shielded from the hot gas flow containing the evaporated material from the object to be treated by the retort 115c. For this reason, it is possible to prevent the evaporated metal from the object to be processed from condensing on the seal portion of the hermetic door 115b. Moreover, even when resin is used for the seal portion of the hermetic door 115b, the seal portion can be protected.

When the evaporation process of a desired component from the object to be processed is completed, the retort 115c is retracted into the recovery chamber 115 and the hermetic door 115b is closed (see FIG. 10).
Further, the valve between the recovery chamber 115 and the exhaust system 114 is closed to separate the recovery chamber 115 from the exhaust system 114. In this state, the hermetic door 33 provided in the recovery chamber 115 is opened, and the retort 115c is taken out (FIG. 12). In the present invention, since the hermetic door 115b is shielded from the second hermetic chamber 103 during the collection of the evaporate from the object to be treated, adhesion of condensate to the hermetic door 115b is prevented. Further, damage due to heat of the seal portion of the hermetic door 115b is also prevented. Therefore, it is possible to prevent the outside air from leaking into the second hermetic chamber 103 even if the recovery chamber 115 is opened. Thereafter, another retort is loaded into the collection chamber 115 and the same operation is repeated. By adopting such a configuration, in the present invention, regardless of whether the heating furnace is depressurized or pressurized, evaporate and gaseous discharge from the object to be treated while continuously operating without stopping the furnace. Thermal decomposition products such as products can be recovered. For this reason, the productivity of processing can be greatly improved. Therefore, the processing cost can be reduced.

  FIG. 12 is a diagram schematically illustrating an example of a configuration of an exhaust gas processing apparatus that processes exhaust gas that is discharged from the object to be processed and not recovered by an exhaust gas processing system, a recovery chamber, or the like. A multi-exhaust gas treatment filter 1201, a smokeless filter 1202, and a non-bromide filter 1203 are connected to the subsequent stage of the recovery system such as an exhaust gas processing system or a recovery chamber. In addition to this, for example, an alkali trap for recovering halogen gas, a halogenated hydrocarbon decomposition apparatus using a catalyst, or the like may be provided.

  As described above, the processing apparatus of the present invention selectively treats an object to be treated having resin and metal as constituent materials, the constituent resin is selectively pyrolyzed (vaporized, oiled, carbonized), and the constituent metal is vaporized to treat the object to be treated. Can be separated and recovered.

  Embodiment 9)

  Next, a processing system for removing lead from an object having lead as a constituent material will be described.

  This processing system targets an object in which lead and resin are used for at least a part of the constituent materials. For example, it is possible to remove lead from electronic devices such as Pb—Sn-based solder alloys that use lead-containing alloys and automobile electronic components.

  In this processing system, first, a resin portion is selectively thermally decomposed such as vaporization, oilization, and carbonization, and then lead is vaporized and separated from an object to be processed. The vaporized lead may be recovered. As the apparatus, the processing apparatus of the present invention as described above may be used.

  First, the constituent resin is selectively thermally decomposed so that lead of the object to be treated is not substantially oxidized.

  The resin begins to melt from about 323K, and when kept at about 453-873K, mainly C1-C8 hydrocarbon gases are discharged by thermal decomposition. Such a decomposition product gas of the resin may be recovered by an exhaust gas treatment system or the like.

  The selective thermal decomposition step of the resin is preferably performed with the oxygen concentration adjusted. By adjusting the oxygen concentration, the recovery efficiency of the resin decomposition product gas is improved. Also, lead oxidation can be prevented. Since lead oxide evaporates at a temperature lower than that of lead, it is possible to prevent lead from being scattered by adjusting the oxygen concentration, and to recover lead more actively in the subsequent process.

  Then, lead is vaporized from the object to be treated by adjusting the temperature and pressure. When the object to be treated contains a metal such as iron, copper, aluminum, or tin other than lead, each metal may be selectively vaporized due to the difference in vapor pressure.

  The temperature at which lead vaporizes varies depending on the pressure in the hermetic container. Under atmospheric pressure, for example, the vapor pressure of lead when heated to 1673 K is 84 mmHg, whereas the vapor pressure of iron, copper, and tin does not reach 1 mmHg. Therefore, only the lead vapor can be selectively generated from the object by heating the object to about 1673K.

  Further, under atmospheric pressure, for example, the vapor pressure of lead when heated to 2013K is 760 mmHg, whereas the vapor pressure of tin does not reach 15 mmHg, and the vapor pressure of copper does not reach 3 mmHg. Therefore, only the lead vapor can be selectively generated from the object by heating the object to about 1673K.

  Further, by heating the object to be treated under reduced pressure, lead in the object to be treated can be vaporized at a lower temperature.

  If the pressure is adjusted to 10-1 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 1100K.

  Further, if the pressure is adjusted to 10 <-3> Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 900K.

  Furthermore, if the pressure is adjusted to 10 @ -4 Torr, only lead vapor can be selectively generated from the object to be treated by heating to about 700K.

  The lead vapor thus selectively generated may be recovered as metallic lead using, for example, a recovery device cooled to a melting point of lead or lower.

  FIG. 13 is a graph showing the relationship between the vapor pressure of lead and the temperature. It can be seen that the boiling point of lead decreases when the pressure in the hermetic container is reduced.

  Based on this graph, for example, the heating temperature may be adjusted according to the pressure in the hermetic container. Further, for example, this relationship may be installed in a computer as a program and used as the control means of the processing apparatus of the present invention described above.

  Embodiment 10)

  Here, as an example of an object having lead and resin as constituent materials, an example will be described in which a mounting board in which various electronic components are mounted on a circuit board with a solder alloy containing Pb is processed as an object to be processed.

  FIG. 14 is a view schematically showing such a mounting substrate 1300.

  An electronic component 1304 is mounted on a circuit board 1303 in which a copper foil 1301 and a resin 1302 are laminated. The electronic component 1304 is packaged with a resin 1305. A connection terminal 1306 of an electronic component made of a Cu alloy and a copper foil are joined with a Pb—Sn solder alloy 1307. Although the surface of the connection terminal 1306 of the electronic component may be plated with a solder alloy, it can be treated in the same way.

  First, the mounting substrate 1300 is heated by adjusting the oxygen concentration in an airtight container, and the resins 1302 and 1303 are selectively thermally decomposed. The constituent resin of the printed circuit board is generally a thermosetting resin and is mostly carbonized, but still generates a large amount of decomposition product gas. The same applies to the packaging resin 1303 for electronic components.

  FIG. 15 is a diagram schematically showing a mounting substrate 1300 in which constituent resins are selectively thermally decomposed.

  In this state, much of the constituent resin of the mounting substrate is carbonized. Moreover, lead is not scattered by adjusting the oxygen concentration.

  Next, the temperature and pressure in the hermetic container are adjusted to selectively vaporize lead in the object to be treated. The temperature and pressure may be determined based on FIG. It is preferable to reduce the pressure in the hermetic container. This is because lead is vaporized at a low temperature, so that input energy is reduced, and lead and other constituent metals of the object to be treated whose oxygen concentration is small are not substantially oxidized. When the constituent metal of the object to be treated is likely to be oxidized, a carrier gas such as N2 or Ar may be introduced to adjust the oxygen concentration in the hermetic container.

  The more the pressure is reduced in the airtight container, the more the lead is vaporized at a lower temperature. FIG. 16 is a diagram schematically showing a state in which lead 1308 is vaporized in a metal state. By adjusting the temperature and pressure in the hermetic container, only lead can be selectively vaporized. If the object to be treated contains a metal having a boiling point lower than that of lead, such a metal may be vaporized first.

  Thus, lead can be removed from the mounting substrate 1300 that is the object to be processed. In addition, by processing a large number of mounting boards such as waste electronic devices held by society, it can be processed as general waste and does not pollute the environment due to elution of lead. Moreover, separation of constituent metals other than lead becomes easy and can be used as a resource. The constituent resin can also be recovered as valuable oil or as carbide. You may make it utilize this carbide | carbonized_material as a fertilizer or activated carbon.

  Here, description has been made up to the point where lead is removed from the mounting substrate 1300, but the temperature and pressure in the hermetic container may be further adjusted to vaporize constituent metals other than lead of the object to be treated.

  For example, the circuit board 1303 and the electronic component 1304 can be separated by vaporizing tin constituting the solder alloy.

  FIG. 17 is a diagram schematically illustrating a state in which tin is vaporized and the circuit board 1303 and the electronic component 1304 are separated.

  Thus, by removing lead or separating the circuit board 1303 and the electronic component 1304, the complexity of the object to be processed is reduced, and subsequent processing becomes easy. In other words, the entropy of the object to be processed is reduced, and the value of the object can be increased.

  Furthermore, by adjusting the temperature and pressure in the hermetic container, the circuit board 1303 and the electronic component 1304 include, for example, Au, Ag, Pt, Bi, In, Ta, Ni, Cr, Cu, Al, W, Mo, Metals such as Co and Pd may be vaporized and recovered. It is more efficient to perform such collection separately after the circuit board 1303 and the electronic component 1304 are separated.

  18, 29, and 30 are graphs showing boiling point (vapor pressure) pressure dependence of various metals. This figure is shown as an example of a recoverable metal, and a metal not shown can also be recovered.

  FIG. 19 is a diagram showing the temperature dependence of the free energy of formation of oxide. The elements shown in FIG. 19 are shown as an example, and data relating to other elements can be easily calculated or obtained from a database. 18, 19, 29, and 30 are used together with the relationship between the boiling point (vapor pressure) of lead and the pressure shown in FIG. 13, for example, temperature, pressure, and oxygen concentration in an airtight container Should be controlled.

  Further, for example, this relationship may be installed in a computer as a program and used as the control means of the processing apparatus of the present invention described above.

  Embodiment 11)

  FIG. 20 is a view schematically showing an example of an apparatus used for removing lead from an object to be treated having lead and resin of the present invention as constituent materials. The apparatus is not limited to the apparatus illustrated in FIG. 20, and the processing apparatus of the present invention as described above may be used.

  The processing apparatus 2000 includes a first hermetic chamber 2001 and a second hermetic chamber 2002. The first hermetic chamber 2001 includes an oxygen concentration control device 2003 and a heating device such as a burner (not shown). And it is comprised so that it may hold | maintain for a predetermined time at predetermined temperature by the control part which abbreviate | omitted illustration.

  The hydrocarbon-based gas discharged from the constituent resin by heating the object to be treated 2004 is cooled by the oil recovery recovery device 2005 and recovered as oil. An exhaust gas cleaning device 2006 is connected to an alkaline water shower cleaning device or the like in this example, and the halogen gas in the exhaust gas is reduced to an environmental standard or less.

  The second hermetic chamber 2002 is a vacuum heating furnace and includes a lead recovery chamber 2007 and an exhaust device 2008.

  The object to be processed is sequentially sent to the first hermetic chamber 2001 and the second hermetic chamber 2002 by transfer means 2009 such as a conveyor.

  The residence time, heating temperature, pressure, and oxygen concentration of these objects to be treated in the first hermetic chamber 2001 and the second hermetic chamber 2002 are respectively controlled by a control unit (not shown).

  In addition, after passing through the second hermetic chamber 2002, it is sent to the residue receiver 2010.

  In the first hermetic chamber 2001, the object to be processed 2004 is heated to and maintained at a temperature of about 473K to 873K, for example, and the resin component that is a part of the constituent material of the object to be processed 2004 is thermally decomposed, for example, C1 to It is discharged as C8, C8-C16 hydrocarbon gas.

  The discharged decomposition product gas of the resin is condensed and recovered by the exhaust gas treatment system 2005. Unrecovered gas is removed by the exhaust gas cleaning device 2006, and is detoxified, smokeless, and brominated.

  Next, the object to be processed 2004 is sent to the second hermetic chamber 2002, where the pressure is reduced to, for example, about 10 −5 Torr and the temperature is set to about 700K, and this state is maintained. Lead in the object to be treated is released from the object to be treated as vapor lead. A gas discharge part is provided in the upper part of the second hermetic chamber 2002, and vapor lead released from the object to be treated is condensed as metallic lead by a decrease in vapor pressure. Crystallized metallic lead is deposited and recovered in a lead recovery chamber 2005. In addition, in order to efficiently send vapor lead from the second hermetic chamber 2002 to the lead recovery chamber 2005, an inert gas such as N2 or Ar is introduced from a carrier gas introduction part provided in the second hermetic chamber 2002, Vapor lead is fed into the lead recovery chamber 2005 along with the carrier gas.

  A gas discharge part is provided in the upper part of the first hermetic chamber, and the decomposition product gas of the discharged resin is sent to the exhaust gas treatment system 2005.

  The exhaust gas treatment system 2005 is mainly composed of heavy oil when the cooling temperature is 523 to 423K, a mixture of heavy oil and light oil when it is 423 to 323K, and light oil when it is 323K to room temperature. The recovered oil is guided to a recovery tank (not shown) and can be reused as fuel or raw material.

  The gas discharged from the exhaust gas treatment system 2005 is guided to the exhaust gas cleaning device 2006 through the gas delivery unit 15. In this example, alkaline water shower cleaning or the like is connected, and the halogen gas in the exhaust gas is reduced to below the environmental standard.

  Embodiment 12)

  Next, an example in which an electronic apparatus including solder as a processing target object is processed using the processing apparatus 2000 having the above configuration will be described.

  The electronic device that is the processing target object 2004 may be crushed by preprocessing. Here, the electronic component was roughly crushed to about 10 cm square with a biaxial crusher. The roughly crushed electronic device was put into the first hermetic chamber.

  The first hermetic chamber 2001 was maintained at a furnace temperature of about 773 K and an oxygen concentration of about 5%, and the electronic equipment was retained for about 30 minutes. The constituent resin occupying about 40% of the electronic equipment was selectively thermally decomposed in the first hermetic chamber 2001 and discharged as hydrocarbon gas or carbonized.

  Further, no chemical change occurred in the first hermetic chamber 2001 between the metals such as iron, copper, and aluminum, which account for about 50% of the composition ratio, and the mounting substrate, which account for about 10% of the composition ratio. That is, the oxidation state and the phase equilibrium state were substantially maintained.

  The electronic device obtained by selectively thermally decomposing the constituent resin was transferred to the second hermetic chamber 2002 without being cooled. The second hermetic chamber 2002 was maintained at a pressure of about 10 −3 Torr and a temperature of about 900 K, and the electronic equipment was retained for about 30 minutes.

  For a mounting board that occupies about 10% of electronic equipment, an alloy is used that is about 5 to 10% of the weight of the board. Further, about 40 wt% of this solder alloy is lead.

  That is, 0.2 to 0.4% of lead is used as a part of the constituent material in electronic equipment. This lead was vaporized as evaporated lead in the second hermetic chamber 2002, and sent to the lead recovery chamber 2005 together with the carrier gas, and recovered as metallic lead.

  In order to improve the lead recovery rate, it is preferable to make the residence time of the lead vapor inside the lead recovery chamber 2005 as long as possible. In this example, the lead recovery rate was 98%. The recovered lead had few impurities and could be reused as a valuable metal.

  The hydrocarbon gas discharged by thermal decomposition in the first hermetic chamber 2001 was sent to the exhaust gas treatment system 2005 and cooled in a condensing unit cooled with circulating water of about 300K. In this example, 40% of electronic devices are made of resin. Although the oil conversion rate varies depending on the components of the constituent resin, about 90% of the weight ratio was recovered as oil, and about 10% remained as a residue mainly composed of carbide.

  The recovered oil could be reused as fuel or raw material. In addition, the gas component that passed through the exhaust gas treatment system 2005 was discharged into the atmosphere as exhaust gas below the environmental standard by being cleaned by the exhaust gas cleaning device 2006. In addition, metals such as iron, copper, and aluminum, which account for about 50% of the electronic equipment, are hardly oxidized in the first hermetic chamber 2001 and the second hermetic chamber 2002, but rather reduced to metal. Since it can be recovered as a high value, it has a high reuse value.

  In this example, the residues discharged to the residue receiver 30 are mainly carbide residues of iron, copper, aluminum and resin.

  FIG. 21 schematically shows an example of an openable / closable partition 2101 that maintains the airtightness and heat insulation between the first airtight chamber 2001 and the second airtight chamber 2002 of the processing apparatus 2000 illustrated in FIG. 20, for example. It is. The partition 2101 is operated by the wire 2102 and the hoist 2103.

  You may make it provide a vacuum door and a heat insulation door separately in the position of each partition 2101. FIG. For example, the partition 2101b may be a vacuum door, and a heat insulating door that can be opened and closed may be disposed on the first and second airtight chambers 2001 and 2002 of the door.

  Next, a processing system will be described in which various electronic devices, automobiles, precision devices, stationery, pharmaceutical / food packaging, and other waste containing resin and metal, which are used in large quantities, are taken as objects to be treated. As the apparatus, the processing apparatus of the present invention described above may be used.

  Embodiment 13)

  Such waste containing resin and metal is generally incinerated and landfilled because it is difficult to separate and recover. In the treatment system of the present invention, the constituent resin of the waste is selectively thermally decomposed (vaporization, oilification, carbonization) and the constituent metals are vaporized and recovered in a metal state in the same apparatus. In particular, waste containing resin has a problem in practical use because the temperature rise during heating is slow under reduced pressure, but this problem is solved by adjusting the oxygen concentration in the present invention.

  In the treatment system of the present invention, first, waste containing resin and metal is put into an airtight container. Then, the oxygen concentration is adjusted to recover the resin portion, and heated to a pressure of several atmospheres. Next, pressure reduction and heating are performed for vaporizing and recovering the metal.

  FIG. 22 is a diagram schematically showing an example of the processing apparatus of the present invention that can be used in this processing system.

  A waste containing resin and metal is accommodated in an airtight container 2201, and a charging shelf 2202 made of metal having high temperature rise efficiency and high heat resistance is provided in the airtight container. Reference numeral 2203 denotes a door for opening and closing the airtight container 2201. A heating device 2204 such as a sheathed heater is provided in the hermetic container and is operated by the control panel 2205 together with the pressure and oxygen concentration in the hermetic container. Reference numeral 2206 denotes a sensor that transmits the temperature, pressure, and oxygen concentration in the hermetic container 2201 to the control panel 2205 as signals.

  The hermetic container 2201 is connected to the exhaust device 2208. Between the hermetic container 2201 and the exhaust device 2208, a resin recovery system 2209 that is a recovery device for the decomposition product gas of the waste constituent resin and a metal recovery system 2210 that is a recovery device for the constituent metal of the waste are disposed. Has been. The resin recovery system 2209 may be provided with an exhaust gas treatment system, for example. For example, the metal recovery device may be provided with a cyclone separator.

  Waste is put into a loading shelf 2202 provided in an airtight container 2201, the door 2203 is closed and sealed, and heating (400 ° C.) and pressurization (3 atm) are started with the recovery system closed at first.

  In this case, the temperature raising efficiency is better than heating in a reduced pressure state, which contributes to the temperature raising efficiency at the time of reduced pressure heating at the time of subsequent metal recovery.

  The gas generated by the thermal decomposition of the constituent resin of the waste is recovered by a plurality of recovery devices according to the type of gas. If the waste contains polyvinyl chloride resin, it may be heated first at normal pressure to generate chlorine gas. This chlorine gas is recovered as iron chloride by contacting it with high-temperature heated iron. Alternatively, ammonia may be added and recovered as ammonium chloride. In this case, since the corrosion of the container, piping and the like by chlorine gas is severe, the apparatus may use Hastelloy, titanium alloy or the like instead of stainless steel as necessary. Note that exhaust gas such as unrecovered gas may be made harmless by burning at high temperature.

  Part of the resin is carbonized and can be reused as fertilizer, fuel, and the like. Carbide that has been subjected to vacuum heat treatment is excellent in performance of fertilizer, fuel, deodorant and the like. Next, the resin recovery system 2209 is closed and the pipe of another pipe of the metal recovery system 2210 is opened. The inside of the airtight container 2201 is depressurized to a pressure of about 10 −3 Torr by an exhaust device, heated above the boiling point of the alloy according to the type of metal, evaporated by the condensation means disposed in the middle of the metal recovery system 2210 to recover. In this case, since the evaporation temperature of the metal is lower than the normal pressure, a relatively low heating temperature is sufficient, and since it is difficult to oxidize, the recovery efficiency is good.

  Thus, according to the processing system of the present invention, the thermal efficiency is good and the processing cost is low. Further, by performing heating and pressurization, the recovery efficiency of oil having a relatively small molecular weight is good, and the recovery rate of high purity metal is high by vacuum heating.

  Embodiment 14)

  Next, a processing system will be described in which wastes of mounting boards in which various electronic components are mounted on circuit boards that are used in large quantities, such as various electronic devices, automobiles, and precision devices, are taken as objects to be processed. As the apparatus, the processing apparatus of the present invention described above may be used.

  This processing system efficiently separates and collects electronic components from a mounting board on which various electronic components such as ICs, LSIs, resistors, and capacitors are mounted. In addition, this is a system that separates and collects the constituent resin and constituent metal of the mounting substrate made up of circuit boards, electronic components, etc., and turns them into resources.

  Such mounting board waste is difficult to separate electronic components from the circuit board, and the mounting board is an object in which different materials are integrated in a complex manner, and its processing is difficult. For this reason, landfill processing, incineration processing, etc. were common.

  In this processing system, first, the waste of the mounting substrate is put into an airtight container. In order to increase the temperature raising efficiency, the resin is heated to a temperature at which the resin is not oxidized much under normal pressure or pressure, and then the pressure is reduced. This is because the thermal conductivity in the hermetic container is reduced under reduced pressure.

  The resin is selectively thermally decomposed (vaporized, oiled, carbonized) as described above, and the decomposition product gas is recovered.

  When processing the component resin of the mounting board, in order to increase the temperature rise efficiency in the airtight container, after heating to a temperature (200 ° C) where the resin does not oxidize much, the object to be processed while adjusting the pressure and oxygen concentration by the exhaust system The mounting board which is an object is heated. In this case, the constituent resin is thermally decomposed selectively at a temperature corresponding to the degree of vacuum, and the higher the degree of vacuum, the lower the temperature, so that the sealed decompression vessel is not damaged.

  The package resin of the electronic component is also thermally decomposed and becomes very brittle, so that it can be easily separated from the elements in the package.

  The gas generated by thermal decomposition of the resin is recovered by a plurality of recovery devices according to the type of generated gas. For example, hydrogen gas may be recovered by a substance that adsorbs the gas, and in the case of chlorine gas, it may be recovered as iron chloride by bringing it into contact with iron heated at high temperature.

  In addition, exhaust gas etc. may be made harmless by burning at high temperature. Further, the temperature, pressure, and oxygen concentration in the airtight container are adjusted according to the metal to be recovered (see FIGS. 13, 18, 19, 29, and 30), and the alloy that joins the circuit board and the electronic component. (For example, Pb—Sn alloy) is vaporized. From the viewpoint of recycling, it is preferable that the alloys are selectively vaporized by vapor pressure and separated.

  When the alloy joining the circuit board and the electronic component is vaporized, the electronic component is separated from the circuit board.

  Vaporizes various metals such as Zn, Sb, Au, Pt, Ni, Cr, Cu, Al, Mo, W, and Ta contained in the mounting board as well as the bonding alloy that bonds the circuit board and the electronic component. May be separated and recovered. Since the metal can be recovered in a metal state without being converted into an oxide, the utility value is high.

  When the solder alloy is vaporized, in order to increase the temperature raising efficiency, after heating to a temperature at which the solder alloy does not oxidize much (for example, about 200 ° C.), the inside of the hermetic container is depressurized by the exhaust means and further heated (for example, about 400 ° C. And condensing by condensing means provided in the middle of the recovery path.

  According to this system, as shown in FIG. 17, the solder alloy of the mounting board is completely removed, and the solder of the lead terminal portion of IC, LSI, resistor, capacitor, etc. is also completely removed. For this reason, not only can the electronic component be separated from the substrate, but also the subsequent circuit board and electronic component can be easily recycled to increase the value.

  The constituent resin of the mounting substrate is vaporized, carbonized, or becomes an intermediate product and can be effectively used.

  The constituent metal of the solder alloy evaporates according to the degree of vacuum in the hermetic vessel, and the higher the degree of vacuum, the lower the temperature, so that the furnace wall of the processing apparatus is not damaged.

  When the mounting substrate is landfilled, harmful metals such as Pb and Sb in the solder alloy are eluted by acid rain and the like, and soil and rivers are contaminated. In addition, most of the resins are not decomposed naturally and there is a problem from the viewpoint of environmental protection as well as a semi-permanent remaining treatment site. According to the processing system of the present invention, these problems can be solved.

  Furthermore, various metals contained in circuit boards and electronic components can be separated and recovered and recycled. These metals include metals that may be depleted of resources and rare metals that have a small abundance of crust elements. Therefore, the recovery of these metals greatly increases the solution of the resource and energy problems facing the mass consumer society.

  Embodiment 15)

  Next, a processing system will be described by taking a circuit board on which a copper foil and a resin are laminated as an object to be processed.

  The circuit board may be a so-called copper-clad laminate, a flexible board, or a TAB (Tape Automated Bonding) film carrier. Moreover, you may make it process the cut-off part of the copper clad laminated board which arises in the manufacturing process of a circuit board. Further, as described above, a circuit board in which an electronic component and a bonding alloy are separated from a mounting board may be processed.

  In addition, although a circuit board will be described here for explanation, an object having copper and resin as constituent materials can be similarly processed.

  The separation of the solder alloy and the electronic component from the mounting substrate is as described above. The thermal decomposition of the constituent resin of the mounting board is also as described above. Here, paper may be included in a part of the resin. The same applies to other parts of the present invention.

  In this processing system, in order to efficiently separate the copper foil and the resin, the circuit board is heated under reduced pressure or non-oxidizing conditions, and the constituent resin of the circuit board is thermally decomposed into gas, oil, carbide and the like. Copper foil is almost recovered as pure metal. Impurities such as carbide adhering to copper may be subjected to methods such as washing, vibration, and mixing and rotation with fine sand as necessary. The processing apparatus of the present invention may be used as the apparatus.

  FIG. 23 is a diagram schematically showing a circuit board 2300 that is a processing target object. The circuit board 2300 is a two-layer board, and a copper foil 2301 and a resin 2302 are laminated in one body.

  The circuit board 2300 is introduced into the hermetic container, and the resin 2302 is selectively thermally decomposed (vaporized, oiled, carbonized) by adjusting the temperature, pressure, and oxygen concentration in the hermetic container so that the copper 2301 is not substantially oxidized. ) The decomposition product gas of the resin 2302 may be recovered by an exhaust gas treatment system or the like.

  At this time, the resin 2302 may be heated to a temperature at which the resin 2302 is not very oxidized (for example, 200 ° C.), and then the reduced pressure or the oxygen concentration partial pressure may be decreased, and the temperature may be further increased (for example, 400 to 650 ° C.). This is to increase the temperature raising efficiency.

  FIG. 24 is a diagram schematically showing the circuit board 2300 after the constituent resins are pyrolyzed. Many of the resins exist as carbides.

  The carbonized resin 2302 in this state may be mechanically separated.

  When the temperature in the hermetic container or the oxygen concentration is adjusted and the temperature is heated to a temperature several tens of degrees higher than the melting point of copper, the liquid copper 2301 becomes granular copper 2301b due to surface free energy (surface tension). (FIG. 25). If cooled in this state, copper can be separated and recovered more easily. For example, the melting point of copper at 760 Torr is 1080 ° C., but by heating the temperature in the airtight container to about 1150 ° C. (in the case of 760 Torr), the copper can be collected in a granular form.

  Thus, by heating the circuit board under reduced pressure or in a non-oxidizing atmosphere, the copper foil can be recovered with little oxidation. If necessary, impurities such as carbide adhering to the surface may be removed by washing or the like.

  Thus, according to the processing system of the present invention, copper can be separated and recovered in a metallic state from an object in which resin and copper are integrated. The resin can also be recovered as oil or carbide.

  Embodiment 16)

  Next, a processing system will be described by taking a resin-coated aluminum foil in which an aluminum foil and a resin are laminated as an object to be processed.

  Such resin-coated aluminum foils are widely used in retort food packaging containers such as potato chips bags and curries, food and pharmaceutical packaging containers, and heat insulating materials.

  Such a resin-coated aluminum foil is difficult to process because the resin and the aluminum foil are integrated, and is processed by landfill or incineration. When incinerated, aluminum becomes an oxide, and its value as a resource is significantly reduced.

  A great deal of energy is invested in the scouring of aluminum, and it is a waste of energy not to recycle.

  In the present invention, resin-coated aluminum foil is heated in an airtight container while adjusting the oxygen concentration, whereby the constituent resin is selectively thermally decomposed (vaporized, oiled, carbonized while substantially maintaining the oxidized state of aluminum. ) That is, in order to efficiently separate the aluminum foil and the resin, the resin-coated aluminum foil is heated under reduced pressure or non-oxidizing conditions, and the resin is decomposed and recovered into gas, oil, carbide, and the like. Aluminum foil is recovered almost as a pure metal. Impurities such as carbide adhering to the aluminum may be subjected to methods such as washing, vibration, and mixing and rotation with fine sand as necessary.

  In this treatment system, the resin-coated aluminum foil is heated to a temperature at which the resin is not very oxidized to increase the temperature raising efficiency, and then the pressure is reduced or the oxygen partial pressure is lowered. It is decomposed and recovered into carbide and the like. The aluminum foil is separated from the resin as a substantially pure metal.

  FIG. 26 is a view schematically showing a resin-coated aluminum foil 2600. Resin 2601 and aluminum foil 2602 are integrated.

  First, the resin-coated aluminum foil 2600 that is the object to be processed is introduced into the processing apparatus of the present invention.

  Next, in order to increase the temperature raising efficiency of the hermetic container, the resin-coated aluminum foil 2600 is heated to 400 to 650 ° C. while controlling the temperature and pressure conditions after heating to a temperature at which the resin 2601 is not oxidized much (for example, 200 ° C.). (See FIGS. 18, 19, 29, and 30).

  Since the thermal decomposition of the constituent resin is insufficient at a temperature lower than 400 ° C. and the aluminum foil melts at a temperature higher than 650 ° C., such a temperature range is determined.

  More preferably, the resin is selectively thermally decomposed at a heating temperature of 550 to 650 ° C. under a pressure of 10 −2 Torr or less (or a non-oxidizing atmosphere).

  FIG. 27 is a diagram schematically showing the state of the resin-coated aluminum foil after the component resin 2601 is selectively pyrolyzed, and the carbide 2602b, which is a thermal decomposition product of the resin, is attached to the aluminum foil 2601 in the metal state. It is in a state of being. In this state, the carbide 2602b is easily peeled off from the aluminum foil only by light contact. Therefore, the aluminum foil can be easily recovered in a metallic state (see FIG. 28).

  Further, the decomposition product gas generated by the thermal decomposition of the resin is recovered according to the type of gas by a plurality of recovery devices. A catalyst may be used. For example, the hydrogen gas may be recovered by being adsorbed by, for example, a hydrogen gas adsorbing substance. The chlorine gas may be trapped with an alkaline solution such as NaOH and neutralized, or may be recovered as iron chloride by contacting with iron heated to a high temperature.

  The exhaust gas such as unrecovered gas may be burned at a high temperature to render it harmless. Part of the resin is recovered as carbide or oil. Generally, the constituent resin of the resin-coated aluminum foil is a thermoplastic resin, and a large portion can be recovered by vaporizing and oiling. The carbide of the constituent resin could be easily separated from the aluminum foil. In addition, aluminum retained its metallicity.

  As described above, by heating the resin-coated aluminum foil under reduced pressure or in a non-oxidizing atmosphere, aluminum can be recovered with almost no oxidation. If necessary, impurities such as carbide adhering to the surface may be removed by washing or the like.

  (Embodiment 17)

  FIG. 31 is a diagram schematically showing an example of the processing apparatus of the present invention.

  FIG. 32 is a diagram schematically showing the configuration of the processing apparatus of the present invention illustrated in FIG.

  The treatment apparatus 10 is connected to the thermal decomposition furnace 20 as a first thermal decomposition means for thermally decomposing an object to be processed containing a resin and a metal at a first temperature, and the thermal decomposition furnace 2. A gas decomposer 30 that reforms or thermally decomposes the gaseous emission generated from the object to be treated at a second temperature at which dioxins decompose, and a gas decomposer 30 that is connected to the gas decomposer 30. A cooling tower 40 which is a cooling means for cooling the gaseous emission to the third temperature so that an increase in the dioxin concentration in the gaseous emission modified at the temperature is suppressed, and the heat of the object to be treated A reduced-pressure heating furnace 50 that heats the residue generated by decomposition, solids separated from the gaseous emission, etc. under reduced pressure so that the metal contained in the residue is vaporized, and recovery that condenses the metal vaporized from the residue And a chamber 60.

  That is, the treatment apparatus of the present invention introduces a treatment target object containing a resin and a metal into a pyrolysis furnace and thermally decomposes, and the gaseous emission discharged from the treatment target object is mainly from a gas decomposer and a cooling tower. It is made harmless by using a gaseous emission treatment system that consists of parts, converted into clean gas fuel, and the pyrolysis residue of the object to be treated that has discharged the gaseous emission is introduced into a reduced pressure heating furnace to separate and recover the metal Is.

  The pyrolysis furnace 20 pyrolyzes at a first temperature at which the object to be treated is pyrolyzed under oxygen concentration control, and extracts gaseous emissions from, for example, shredder dust, waste circuit boards, and the like. Here, the gaseous emission basically consists of exhaust gas, but does not exclude the case where it contains solid particulates, liquid particulates, etc. mixed in the exhaust gas.

  FIG. 33 is a diagram schematically showing an example of the structure of the pyrolysis furnace 20. The pyrolysis furnace 20 includes a pyrolysis chamber 21 that pyrolyzes an object to be treated and a combustion chamber 22 that heats the pyrolysis chamber 21. The fuel gas introduced from the fuel gas pipe 23 is combusted in the combustion chamber 24. The inside of the pyrolysis chamber 21 is heated by this combustion heat.

  The pyrolysis furnace 20 is provided with a temperature adjusting means and an oxygen concentration adjusting means (not shown), and the oxygen concentration is maintained so that the pyrolysis chamber 21 is maintained at the first temperature and the pyrolysis is performed in a reducing atmosphere. Is adjusted.

  As the temperature adjusting means for adjusting the first temperature of the pyrolysis furnace 20, a heating means and a temperature measuring means may be used. As the heating means, various convection heating, radiant heating, and the like may be selected as necessary or used in combination. For example, resistance heating such as a sheathed heater may be used, or gas, heavy oil, light oil, or the like may be burned outside the chamber. Further, the gas discharged from the resin or the like of the object to be treated is reformed, detoxified, neutralized and then reused as a fuel gas as a heat source of the treatment apparatus of the present invention including the pyrolysis furnace 20. Also good. Further, for example, the clean fuel gas obtained as described above is introduced into a gas turbine generator and converted into electric power, and this electric power is used for the operation of the treatment apparatus of the present invention including the pyrolysis furnace 20. Also good.

  Various temperature sensors may be used as the temperature measuring means. The first temperature may be set so that the resin of the object to be treated is thermally decomposed and the metal of the object to be treated is not oxidized as much as possible. However, as will be described later, the source of dioxins is set in multiple stages. In order to cut off, it is preferred to keep the pyrolysis furnace 20 in reducing conditions. For example, when an aromatic hydrocarbon compound containing chlorine is thermally decomposed under reducing conditions, chlorine in the aromatic hydrocarbon compound is decomposed into HCl or the like. Therefore, the generation of dioxins is suppressed.

  In the pyrolysis furnace 20, the object to be treated is pyrolyzed in a temperature range of about 250 ° C. to about 600 ° C., more preferably about 400 to 550 ° C. The first temperature may be adjusted as necessary according to the nature and configuration of the object to be processed. By setting the first temperature of the pyrolysis furnace 20 to a relatively low temperature, vaporization of heavy metal or the like of the object to be processed can be prevented. Separation and recovery can be performed more efficiently in the subsequent reduced pressure heating furnace 50. Moreover, the load of the pyrolysis furnace 20 is also reduced, the service life can be extended, and the processing cost can be reduced. In addition, you may make it the processing system of a gaseous emission process the gaseous emission from a pressure reduction heating furnace. Moreover, you may make it use a reduced pressure heating furnace as a pyrolysis furnace.

  As the oxygen concentration adjusting means, for example, an oxygen concentration sensor which is an oxygen concentration measuring means and a carrier gas introduction system may be used. In the example of FIG. 31, the pyrolysis furnace 20 is configured separately from the reduced pressure heating furnace. For example, the first hermetic chamber 102 of the processing apparatus of the present invention shown in FIGS. 1 and 2 is used as the pyrolysis furnace. You can also

  For example, a so-called zirconia sensor employing zirconia (zirconium oxide) may be used as the oxygen concentration sensor, or absorption of CO and CO2 may be measured by infrared spectroscopy. Furthermore, GC-MS may be used, and may be selected or used in combination as necessary.

  For example, a rare gas such as Ar may be used as the carrier gas. Further, the carrier gas not only adjusts the oxygen concentration in the pyrolysis furnace 20 but also allows the gas to be efficiently guided to the gas decomposer 30. Furthermore, you may make it serve as a pressure adjustment means.

  The pyrolysis furnace 20 only needs to be able to thermally decompose the object to be treated under oxygen concentration control. For example, a rotary kiln may be used.

  Moreover, you may make it provide the shredder 25 in the front | former stage of the pyrolysis furnace 20 (refer FIG. 40). The object to be treated brought in from the outside of the apparatus may be introduced into the pyrolysis furnace 20 after being crushed and separated with a shredder, or may be introduced into the pyrolysis furnace 20 without being crushed. When the object to be treated is a waste circuit board, it is preferable to introduce it into the pyrolysis furnace 20 without crushing.

  In the pyrolysis furnace 20 into which the object to be treated is introduced, the state of the metal in the object to be treated is not oxidized as much as possible, and the chlorine combined with the organic compound is made as mineralized as possible when the resin is thermally decomposed. The temperature and oxygen concentration conditions may be adjusted. The temperature and oxygen concentration conditions may be set in advance, or the measured values of the temperature and oxygen concentration may be fed back to the heating means, the oxygen concentration adjusting means, and controlled. When it is necessary to measure the oxygen concentration, for example, a zirconia sensor or the like may be used.

  Further, the pressure in the pyrolysis chamber 21 of the pyrolysis furnace 20 may be controlled. For example, when the pressure in the pyrolysis chamber 21 is reduced, the oxygen concentration is also reduced, and the object to be treated is not rapidly oxidized by heating. Further, a large amount of decomposition product gas is generated from the resin by heating, but generally, even when the resin is decomposed, almost no oxygen is generated. Furthermore, the decomposition product of the resin is easily vaporized.

  On the other hand, when the pressure is reduced, the thermal conductivity in the pyrolysis chamber 21 decreases. However, if the inside of the pyrolysis furnace 20 is a non-oxidizing atmosphere, the object to be treated is not oxidized even under atmospheric pressure or pressure. Therefore, if the inside of the pyrolysis chamber 21 is a non-oxidizing atmosphere, pressurization is possible and the thermal conductivity in the system is improved.

  The gaseous discharge discharged from the object to be treated is introduced into the gas decomposer 30 through the piping. In the processing apparatus 10 illustrated in FIG. 31, a cyclone separator 29 that separates solid effluent such as dust in the gaseous effluent is disposed between the pyrolysis furnace 20 and the gas decomposer 30. The cyclone separator 29 may be provided as necessary.

  The gas decomposer 30 thermally decomposes or reforms the gaseous effluent discharged from the object to be treated at a second temperature higher than the first temperature. Here, the thermal decomposition or reforming means that the hydrocarbon compound contained in the gaseous emission discharged from the object to be treated is changed to lower molecular hydrogen, methane, carbon monoxide or the like. Further, hydrorefining treatment or the like may be performed. It is preferable to modify the system under reducing conditions from the viewpoint of cutting off the source of dioxins as described above. Further, if the gas decomposer 30 is maintained in a reducing atmosphere, a small amount of air may be introduced into the gas decomposer 30. In addition to thermal decomposition, the gas decomposer 30 may also perform catalytic decomposition using, for example, a catalyst. As the catalyst, for example, a metal such as Pt or Re may be supported on a solid acid such as silica / alumina or zeolite (aluminosilicate).

  By providing the gas decomposer 30 separately from the pyrolysis furnace 20, the gaseous emission from the object to be treated can be treated at a second temperature higher than the first temperature, and the gaseous emission can be modified. Quality and mineralization of chlorine can be performed effectively.

  It is desirable for the gas decomposer 30 to maintain conditions such that dioxins derived directly or indirectly from the object to be treated are decomposed as much as possible. For example, considerable dioxins can be decomposed by setting the second temperature to about 800 ° C. Further, by setting the second temperature to 1000 ° C. or higher, more preferably 1200 ° C. or higher, dioxins can be decomposed more effectively. Since the gas decomposer 30 is set to a second temperature at which dioxins are decomposed, thermal decomposition of hydrocarbons in the gaseous emission also occurs at the second temperature.

  Hydrocarbon compounds contained in the gaseous effluent discharged from the object to be treated are reformed and thermally decomposed by the gas decomposer 30 to be reduced in molecular weight to hydrogen, methane, carbon monoxide, etc. To do.

  In addition, when dioxins are contained in the gaseous emission, most of the dioxins are decomposed. Furthermore, organic chlorine is mineralized and dioxin resynthesis is suppressed.

  FIG. 34 is a diagram schematically showing an example of the structure of the gas decomposer 30.

  The gas decomposer illustrated in FIG. 34 (a) thermally decomposes the gaseous emission by introducing the gaseous emission from the pyrolysis furnace 20 and a small amount of air into the coke-filled chamber. In addition to reforming, a reducing atmosphere and a temperature condition that decomposes dioxins are formed.

  The gas decomposer illustrated in FIG. 34B burns fuel gas and air to heat the chamber to a temperature at which dioxins decompose, and introduces gaseous exhaust from the pyrolysis furnace 20 into the chamber. Thus, it is thermally decomposed and reformed.

  The chamber of the gas decomposer 30 may be provided with a catalytic decomposition means such as a catalyst as described above.

  Further, if necessary, the gas decomposer 30 may be provided with temperature adjusting means and oxygen concentration measuring means for adjusting the temperature and oxygen concentration in the chamber. As the oxygen concentration adjusting means, the oxygen concentration sensor and the carrier gas introduction system as described above may be used. Further, a hydrogen gas reservoir may be connected, or an inert gas reservoir such as Ar may be connected.

  In this way, the gaseous effluent contained in the gaseous effluent discharged from the object to be treated is reduced in molecular weight by the gas decomposer 30 or the second thermal decomposition means, and changed to hydrogen, methane, carbon monoxide or the like. To do.

  The gaseous emission pyrolyzed and reformed by the gas decomposition means 30 is introduced into the cooling tower 40.

  The cooling tower 40 is disposed in connection with the gas decomposer 30 so that the gaseous emission reformed or thermally decomposed at the second temperature is suppressed from increasing the dioxin concentration in the gaseous emission. In addition, it is cooled to the third temperature.

  That is, in the gas decomposer 30 or the second thermal decomposition means, the dioxin concentration in the gaseous emission reformed or thermally decomposed at the second temperature is such that the second temperature decomposes the dioxin. In addition, the chlorine of hydrocarbon compounds that are decomposed or reformed at this temperature is extremely low because it is made inorganic by a reducing atmosphere. Therefore, the dioxin is cooled to the third temperature so that the increase in the dioxin concentration in the gaseous emission is suppressed as much as possible so that dioxins are not generated and re-synthesized from this state. The third temperature may be set to a temperature at which dioxin production reaction does not occur.

  For example, from a gaseous emission in a state where dioxins are decomposed (if it is not the same as the second temperature in the gas decomposer 30, it may be higher than a temperature at which dioxins are decomposed), preferably 150 ° C. or less. Can be suppressed to 100 ° C. or lower, more preferably 50 ° C. or lower, and most preferably 35 ° C. or lower, to suppress the formation and resynthesis of dioxins.

  At this time, it is preferable to cool the gaseous emission to the third temperature in the shortest possible time. This is because dioxins are easily generated and re-synthesized at about 200 ° C. to about 400 ° C., and the time during which the gaseous effluent is cooled to the third temperature to stay in a temperature range where dioxins are easily generated and re-synthesized is reduced. By making it as short as possible, the dioxin concentration in the gaseous emission can be more effectively suppressed.

  Therefore, it is preferable to cool the gaseous effluent in the cooling tower 40 within about 10 seconds.

  Such a cooling tower 40 may be cooled by contact by directly injecting a refrigerant such as water or cooling oil to the gaseous emission. At this time, if alkaline powder such as lime powder is sprayed onto the gaseous emission, the gaseous emission is neutralized. In addition, for example, HCl in the gaseous effluent is diffused to the solid surface in contact with the lime powder, so that generation and resynthesis of dioxins can be suppressed.

  FIG. 35 is a diagram schematically showing an example of the structure of the cooling tower 40.

  FIG. 35 (a) has a structure in which the gaseous emission introduced from the decomposer 30 is rectified, and a coolant such as cooling water or cooling oil is directly injected to cool the gaseous emission to the third temperature. . In FIG. 35 (b), a neutralizer such as lime powder is injected together with the refrigerant to neutralize the gaseous emission, and at the same time, the chlorine in the gaseous emission is fixed and the source of dioxin is the gaseous emission. It is structured to be removed from.

  Further, the cooling tower 40 is provided with a temperature sensor (not shown) in the gaseous emission introducing section and the cooling gas discharging section, and the cooling rate management means for the introduced gaseous emission, for example, the flow rate / temperature adjustment of the refrigerant Means are provided, and the cooling rate of the gaseous effluent is controlled so that dioxin formation and resynthesis are suppressed.

  The gaseous emission discharged from the object to be treated in the pyrolysis furnace 20 is pyrolyzed or reformed at a temperature at which the dioxin is decomposed by the gas decomposer 30, and the cooling tower 40 generates and regenerates dioxins. By cooling so as not to cause synthesis, it is changed to hydrogen, methane, carbon monoxide or the like, and the dioxin concentration in the gaseous emission is greatly reduced.

  Thus, in the processing apparatus of the present invention, the decomposition of the object to be processed and the decomposition of the gaseous emission from the object to be processed are processed in a plurality of stages of the thermal decomposition furnace 20 and the gas decomposer 30, and this By maintaining such a decomposition means in a reducing atmosphere, generation of dioxins can be suppressed.

  By setting the second temperature to 800 ° C. and the third temperature to 150 ° C., the dioxin concentration in the gaseous effluent could be reduced to 0.1 to 0.5 TEQng / Nm 3.

  Further, by setting the second temperature to 1150 ° C. and the third temperature to 50 ° C., the dioxin concentration in the gaseous emission could be reduced to 0.1 TEQng / Nm 3 or less.

  The gaseous emission cooled in the cooling tower 40 may be washed and desulfurized as necessary.

  Further, the gaseous emission cooled in the cooling tower 40 may be introduced into a neutralization reaction filtration means such as a bag filter. Between the cooling tower 40 and the neutralization reaction filtration means, slaked lime, filter aids (eg, high porosity particles such as zeolite and activated carbon, Tesisorb, Shirasu balloon), etc., are made into a gaseous exhaust stream by dry venturi or the like. You may make it blow.

  FIG. 36 is a diagram showing a part of the configuration of the gaseous emission treatment system in which the bag filter 70 is connected to the rear stage of the cooling tower 40.

  Solid discharge such as heavy metal fine particles condensed in the cooling tower 40, solid discharge discharged from the bag filter 70, etc. are introduced into the reduced-pressure heating furnace 50 and processed, so that lead, tin, Even when metals such as arsenic and cadmium are contained, they can be separated and recovered.

  The gaseous exhaust discharged from the object to be processed thus processed may be used as a heat source for heating the pyrolysis furnace 20, or may be supplied to a gas turbine generator to obtain electric power. Good. Further, this electric power may be used as a heat source for the processing apparatus of the present invention.

  On the other hand, the thermal decomposition residue of the object to be treated that has discharged the gaseous emission in the thermal decomposition furnace 20 is introduced into the reduced pressure heating furnace 50. Since the organic component of the object to be treated is almost decomposed in the pyrolysis furnace 20 as the first pyrolysis means, the pyrolysis residue is mainly composed of metal and carbide or glass.

  The reduced pressure heating furnace 50 that separates and recovers metal from the thermal decomposition residue that is the object to be treated includes a purge chamber 51, a first hermetic chamber 52, and a cooling chamber 53, and each chamber can be opened and closed. 54. Further, the first hermetic chamber of the pyrolysis furnace 20 and the reduced pressure heating furnace 50 may be connected via the purge chamber 51.

  In the reduced pressure heating furnace 50 of the processing apparatus illustrated in FIG. 31, the object to be processed is introduced into the purge chamber 51 by opening the partition wall 54a. After the partition wall 54a is closed and the inside of the purge chamber 51 is roughed by an exhaust system (not shown), the partition wall 54b is opened and the object to be treated is moved to the first hermetic chamber 52.

  The partition wall 54b is closed, and the pressure and temperature are controlled so that the metal in the object to be treated is vaporized under reduced pressure in the first hermetic chamber 52. The metal vaporized from the object to be treated is condensed in the collection chamber 60 and collected. The configuration of the recovery chamber may be the same as that illustrated in FIGS. 8, 9, 10, 11, and 12, for example. 55 is an exhaust system. The exhaust gas from the exhaust gas treatment system of the pyrolysis furnace 50 may be introduced into the cracker 30.

  After vaporizing the desired metal, the partition wall 54c between the cooling chamber 53 and the pressure reduced by an exhaust system (not shown) is opened, and the object to be processed is moved to the cooling chamber 53.

  The partition 54c is closed to cool the object to be processed, and when the object to be processed becomes stable even in the atmosphere, the cooling chamber 53 is leaked and the partition 54d is opened to take out the object to be processed.

  The object to be treated is composed of carbide and metal that has not been vaporized, but the metal can be easily separated from the carbide.

  As described above, according to the present invention, the object to be treated having a resin and a metal can be highly recycled, and the generation of dioxins can be prevented.

  (Embodiment 18)

  FIG. 37 is a diagram schematically showing another example of the processing apparatus of the present invention.

  FIG. 38 is a diagram schematically showing the configuration of the processing apparatus of the present invention illustrated in FIG. In this processing apparatus, the acidic component in the gaseous effluent cooled by the cooling tower 40 is neutralized by the neutralization washing tower 61 and desulfurized by the desulfurization tower 62 so that it can be used as clean fuel gas. This fuel gas is sent to the combustion chamber 23 of the pyrolysis furnace 20 to be used as heating fuel for the pyrolysis furnace, and is filtered by the activated carbon filter 63 before being sent to the gas turbine generator 64 to be converted into electric power. . The exhaust gas that has heated the pyrolysis furnace 20 and the exhaust gas from the gas turbine generator 64 are released from the chimney 66 to the atmosphere after monitoring the components and concentration by GC-MS or the like and confirming safety.

  By adopting such a configuration, the processing apparatus of the present invention can process the processing target object more efficiently.

  For example, detoxified and exhausted gaseous emissions are used to heat the pyrolysis furnace as a clean fuel gas, and the decompression furnace is operated or sold with electric power obtained from the gas generator. Thus, the running cost of the apparatus can be suppressed extremely low.

  Further, since the first temperature in the first pyrolysis means is as low as 600 ° C. or less, the service life of the pyrolysis furnace is long, and maintenance can be facilitated.

  FIG. 39 is a diagram schematically showing an example in which the treatment method of the present invention is applied to waste treatment. In other words, waste is pyrolyzed, gaseous exhaust discharged from the waste is turned into clean fuel gas in the gaseous waste treatment system, and the pyrolysis residue is introduced into a reduced pressure heating furnace as heavy metal, useful metal, activated carbon, etc. It can be recovered.

  FIG. 40 is a diagram schematically showing an example of the configuration of a shredder apparatus that can be provided in the preceding stage of the processing apparatus of the present invention. Here, a shredder device for processing a scrap car is illustrated.

  Waste cars are crushed by shredders, and iron, non-ferrous metals, non-metals, etc. are separated by magnetism, wind power, etc. Such separation residue is shredder dust. Shredder dust contains various metals including resin (including fiber and paper), glass, and heavy metals. By adopting the above-described configuration, the present invention can safely and efficiently treat such shredder dust for which a conventional treatment technique has not been established.

  The shredder dust is put into the pyrolysis furnace 20 and thermally decomposed at 400 to 500 ° C., and the gaseous waste discharged from the resin component or organic component of the shredder dust is led to the gas decomposer 30, and dioxin or the like is introduced. In order to decompose and detoxify harmful substances, the second temperature was 1100 ° C. or higher (more preferably 1150 ° C. or higher) for thermal decomposition. Immediately thereafter, dioxin generation is suppressed to 0.1 TEQng / Nm 3 or less by quenching within 10 sec in the cooling tower 40 in which the third temperature is set to 100 ° C. or less (preferably 50 ° C. or less). did it. Cyanide, sulfide, nitride, etc. were removed from the gaseous emission from the object to be treated in this way using a gas cleaning (neutralization) device and desulfurization device, and a clean fuel gas could be obtained. .

  The fuel gas is used as a heating heat source for the pyrolysis furnace 20, and is generated by a gas turbine generator and converted into electric power, and the reduced pressure heating furnace 50 is operated.

  Further, the thermal decomposition residue of the object to be treated is introduced into a reduced pressure heating furnace 50 and heated under a reduced pressure of 10 <-1> to 10 <-3> Torr, and metals such as Pb, Sb, As, Cd, Sn, Zn are 99% or more. It was possible to separate and recover with a yield of. The object to be treated treated in the reduced pressure heating furnace 50 was able to reduce Pb, Sb, As, Cd, Sn, and Zn to the 0.1 ppm level.

  Iron remaining in the object to be treated treated in the reduced pressure heating furnace 50 was separated and collected by a specific gravity selection method, an electric magnet or the like, and finally harmless and high purity carbide was obtained. This carbide may be used in the activated carbon filter 63 or may be used as an effective soil improver.

  Thus, according to the present invention, household electrical appliances, automobiles, precision equipment, etc., or shredder dust of these wastes are pyrolyzed by controlling the oxygen concentration, and the gaseous emission treatment system and pyrolysis residue treatment By processing in the system, the gaseous emission can decompose and detoxify harmful substances such as dioxins to make clean gas fuel. This gas fuel can also be used as a heating heat source by guiding a combustion chamber such as a pyrolysis furnace. Furthermore, it is possible to generate power using this gas fuel. Shredder dust is abundant and low-priced resources compared to hydropower generation methods where water is scarce during the drought season and it is difficult to supply power constantly. Power generation. In addition, since the processing apparatus of the present invention has a modular configuration, it can be used in accordance with a wide range from a small scale to a large scale and according to the application.

  On the other hand, the pyrolysis residue can be separated and recovered from various metals in a high purity metal state by vacuum heating. The carbide is also free from heavy metals and can be used effectively. Moreover, the reduced pressure heating furnace is smaller than the melting furnace, requires less installation cost, installation location, etc., and can efficiently deal with municipal waste disposal.

  In this way, a large amount of waste that contains harmful substances or their raw materials and generates dioxins and other harmful substances when burned can be reused without releasing harmful substances, heavy metals, etc. into the environment. Can be recovered in a high purity state.

  In addition, the processing apparatus and processing method of the present invention easily separates circuit boards from various ICs, resistors, capacitors, and other electronic components from mounted substrate waste without generating harmful gases, and at the same time, solder alloys, etc. Can be separated and recovered.

First, the mounting substrate is introduced into the pyrolysis furnace 20 without being crushed, and the first temperature is set to 250 to 500 ° C. and pyrolyzed. At this time, the inside of the pyrolysis furnace may be decompressed. In order to suppress the generation of harmful substances such as dioxins, the gaseous emission generated by the thermal decomposition of the mounting substrate is led to the gas decomposer 30 and thermally decomposed at 800 ° C. or higher and then cooled to 100 ° C. or lower by the cooling tower 40. . The pyrolysis residue was introduced into a reduced pressure heating furnace 50, depressurized to about 10-3, and heated up to 350 to 700 ° C in order to evaporate the constituent metal of the solder alloy. Therefore, the circuit board is separated from various ICs, resistors, capacitors, and other electronic components, and at the same time, the evaporated lead and other metals are collected by an aggregating means provided in the collection path.

  By such a method, the electronic component and the circuit board could be separated almost completely. Moreover, harmful low melting point metals such as Pb were also almost completely removed (0.1 ppm level). The concentration of harmful substances in the gaseous effluent generated from the resin part was also extremely low. For example, dioxin could be reduced to 0.1 to 0.5 TEQng / Nm3. The circuit board from which the electronic components were released and the bonding metal was removed was carbonized and contained copper for wiring. Metals such as Pb and Sb that are harmful from various electronic parts such as ΙC, resistors, capacitors, etc. are removed, resin parts such as mold resin are carbonized, and some metals such as Si, Αu, Νi, W, and Mo are removed. It was in a state that included.

  Next, the carbonized circuit board containing copper was further heated (1050 to 1200 ° C.) in the reduced-pressure heating furnace 50, and the copper foil was semi-melted to be agglomerated into several spheres.

  By performing such treatment, separation and recovery from copper carbide became easy. The circuit board made of this carbide and metallic copper was washed with an aqueous calcium carbonate solution or the like, and high purity copper could be recovered.

  As described above, according to the present invention, it is possible to remove the hazardous substance from the mounting board waste, to remove the harmful substance, and to easily separate the circuit board and the various electronic components without human intervention. At the same time, various metals including the constituent metal of the solder alloy can be evaporated and separated and recovered. In addition, metals such as copper that have not evaporated can be recovered with high purity. According to the present invention, it is possible to recover a reusable substance in a high purity state without releasing harmful substances, heavy metals, etc. into the environment from wastes such as mounting substrates, for which no effective treatment technology has been established. Can do.

  (Embodiment 19)

  FIG. 41 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the retort 115c is directly connected to the exhaust system through the third opening 115d. The space between the third opening 115d and the exhaust system is hermetically sealed by packing 115p. The packing may be made of, for example, asbestos. Further, instead of the packing, a pipe for connecting the third opening 115d and the exhaust system when the retort is inserted into the first opening may be provided. By adopting such a configuration, it is possible to prevent gaseous effluent from the object to be processed from entering the space between the retort 115 c and the recovery chamber 115. This is because the pressure in the second hermetic chamber 103 is lower than the pressure in the space between the retort 115 c and the recovery chamber 115.

  Furthermore, a carrier gas introduction system 115n may be provided to supply an inert carrier gas such as nitrogen gas to a space between the retort 115c and the recovery chamber 115. This carrier gas is introduced into the retort 115c through the second hermetic chamber 103, and is guided to the exhaust system through the third opening 115d of the retort. Therefore, the space between the retort 115c and the recovery chamber 115 is sealed from the second hermetic chamber 103 by pressure. Since the space between the retort 115c and the recovery chamber 115 is also connected to the space accommodated when the hermetic door 115b is open, the evaporant from the object to be processed condenses to the hermetic door, particularly its seal portion 115q. Can be prevented. Furthermore, by adopting such a configuration. The fitting margin between the retort 115c and the sleeve 103s is increased. For this reason, it is possible to prevent the retort 115c and the sleeve 103s from engaging with each other and becoming unable to come off. Further, the driving means for the retort 115c such as the cylinder 23 can be made small or unnecessary.

  FIG. 42 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the third opening 115d of the retort 115c is connected to the exhaust system via the pipe 116. The pipe 116 moves up and down to open and close the connection between the exhaust system and the retort. Further, the elastic deformation of the packing 116q connects both the pipe 116 and the seal surface 115m of the recovery chamber and the pipe 116 and the third opening 115d of the retort 115c in an airtight manner. When the retort 115c is inserted into the first opening 103b, the third opening 115d of the retort and the exhaust system are hermetically connected by the pipe 116. When the retort is removed and the hermetic door 115b is closed, the pipe 116 is moved to the retracted position by the cylinder 23b.

  In this example, the carrier gas introduction system 115n includes a pressure gauge g that detects the pressure in the space between the retort 115c and the recovery chamber 115, and controls the flow rate of the carrier gas by opening and closing the valve according to the detected pressure. is doing. For example, the pressure in the second hermetic chamber 103 may be detected and adjusted so that the pressure in the space between the retort 115 c and the recovery chamber 115 is slightly higher than this pressure. By doing in this way, even if there is a gap between the retort 115c and the sleeve 103s, the gaseous emission from the object to be treated can be guided into the retort.

  In this example, the hermetic door 115b employs a double structure. The hermetic door 115b is opened and closed by a cylinder. The joint 115 converts the force of the cylinder when closing to a direction substantially perpendicular to the pushing direction of the cylinder. By adopting such a structure, the seal 115q of the hermetic door is pressed more firmly against the recovery chamber. The region where the packing 115q of the hermetic door of the recovery chamber 115 contacts is preferably cooled by water cooling or the like.

  FIG. 43 is a diagram showing another example of the configuration of the processing apparatus of the present invention. In this example, the opening surface of the third opening 115d of the retort 115b is aligned with the second opening surface 115f. Thus, the cylinder 23 can simultaneously perform the insertion operation of the retort 115c and the connection operation between the retort 115c and the exhaust system. In order to facilitate the condensation of the evaporate from the object to be treated, a wire net or a dry filter may be provided inside the retort 115c. Such a dry filter may be made of the same material as the condensate. For example, when evaporating zinc from a galvanized steel sheet, if the dry filter or the retort itself is made of zinc, post-treatment after collection becomes easy. 44 and 45 are diagrams for explaining an example of a guide mechanism that guides the reciprocating operation of the retort 115c. 44 shows a cross-sectional view in a direction parallel to the second opening of the retort 115c, and FIG. 45 shows a cross-sectional view in a direction parallel to the advancing / retreating direction of the retort. In this example, a guide roll 115g is disposed on the inner surface of the recovery chamber 115 along the retort advance / retreat direction. Such a guide mechanism can make the retort advance and retreat more reliably. The guide roll is made of metal and plays a part in heat conduction between the retort 115 c and the recovery chamber 115. Thereby, the temperature of a retort can be adjusted more effectively.

FIG. 46 is a diagram showing a cross-sectional structure of a wet filter provided in the processing apparatus of the present invention.
In the oil film filter 711, a vacuum pump oil 711o having a small vapor pressure is accumulated in the casing 711a, and the lower part of the cloth 711c whose upper and lower openings are hermetically fixed to the casing 711a is immersed in the oil 711o. Yes. The oil forms a film along the surface of the cloth 711c by capillary action. Dust that cannot be captured by the collection chamber 115 or other filter means is trapped by the oil film of the cloth 711c.

  In the processing apparatus of the present invention, such an oil film filter 711 is preferably provided between the recovery chamber 115 and the exhaust system as described above. This is because the evaporant that cannot be condensed by the retort 115 or the like, or the fine particles once condensed are prevented from reaching the exhaust system. Thereby, the exhaust performance of the vacuum pump can be maintained. Moreover, the lifetime of a vacuum pump and the period until the next maintenance can be lengthened.

  Embodiment 20)

  The present invention was applied to process shredder dust.

  A shredder dust from a moving vehicle was prepared as a sample. This sample consists of the following 6 types of fractions. Minicars (Mitsubishi Motors Co., Ltd.) were used as automobiles.

  (1) Vinyl chloride (10wt%)

  (2) Polypropylene (10wt%)

  (3) Polyurethane (10wt%)

  (4) Rubber (10wt%)

  (5) Polyurethane (10wt%)

(6) Others (50wt%)
The fraction (6) was pressed.
Such shredder dust was treated by atmospheric pyrolysis (600 ° C, 800 ° C) and reduced pressure pyrolysis (600 ° C, 800 ° C), and the concentration of dioxin contained in the pyrolysis residue was measured. .

  FIG. 47 is a diagram for explaining the thermal decomposition processing conditions. In the case of 600 ° C., the temperature was raised from room temperature to 600 ° C. in 2 hours, kept at 600 ° C. for 2.5 hours, and then cooled. In the case of 800 ° C., the temperature was raised from room temperature to 800 ° C. in 2.5 hours, kept at that temperature for 2.15 hours, and then cooled.

  In the case of cooling by reduced pressure pyrolysis, the reduced pressure substitution of the present invention is applied, but in the case of cooling by atmospheric pressure pyrolysis, air cooling was performed without applying the present invention. Furthermore, the pyrolysis residue at 800 ° C normal pressure in which dioxin remained was further pyrolyzed under reduced pressure at 800 ° C, and the concentration of dioxin contained in the pyrolysis residue was measured (800 ° C pyrolysis in the figure). B fraction).

  FIG. 48 shows the measurement results. Measurement was performed separately for PCDDs and PCDFs, and the sum of these was used as the dioxin concentration (ng / g). In the figure, n. d. (Not detected) indicates that no dioxin was detected.

  Thus, according to the present invention, dioxins in the heating residue can be significantly reduced. In particular, in the thermal decomposition at normal pressure, dioxin remains even after treatment at 800 ° C., but when this residue is reprocessed under reduced pressure, dioxin can be removed. Although the example of processing using shredder dust as the object to be processed has been described here, similar results can be obtained for soil, incinerated ash, sludge, and the like. The present invention may be a manual type suitable for a small amount processing for a general factory as a waste processing apparatus or a continuous processing furnace suitable for a large amount processing such as a local government, and can be combined according to the processing cost.

  In the present invention, heavy metals such as lead, cadmium, mercury and zinc contained in the soil could be separated from the soil by vaporizing under reduced pressure. Separation and recovery of these heavy metals from the object to be processed could be performed by the above-described processing apparatus of the present invention. The concentration of phosphorus and cyanide in the soil could be reduced below the environmental standard value.

  Embodiment 21)

  49, 50, and 51 are diagrams schematically showing another example of the configuration of the processing apparatus of the present invention.

  49, 50, and 51, there are two heat treatment chambers, a dry distillation chamber 701 for atmospheric pressure pyrolysis and a vacuum evaporation chamber 702 for reduced pressure pyrolysis. In addition, a cooling chamber 703 for cooling the heated residue is disposed in the subsequent stage. These processing chambers are separated by a vacuum door so as to be opened and closed.

  49, FIG. 50, and FIG. 51, an object to be treated such as soil is introduced into a dry distillation heating chamber 701 and thermally decomposed, and then introduced into a vacuum evaporation chamber 702, for example, arsenic, cadmium, lead, etc. Heavy metals are removed by evaporation. The heated residue of the object to be treated is introduced into the cooling chamber 703 and cooled in an atmosphere free of organic halides and having no ability to generate organic halides as described above. Exhaust in the system is performed by booster pumps 705 and 712 and rotary pumps 706 and 713. The processing of the gaseous emission of the object to be processed is performed by the gas processing apparatus as described above. The gaseous effluent from the dry distillation heating chamber 701 is introduced into the gas processing device 714 via a gas cracking device 707 and a condenser 708 for condensing and recovering the evaporated material in the gaseous effluent. The gaseous effluent from the vacuum heating chamber 702 is introduced into the gas processing device 714 through the recovery chamber 709 provided with the retort 115 c and the oil film filter 711. The gas processing device 714 includes a gas cracking device 715, a jet scrubber 716, an activated carbon filter, and an exhaust blower 718. In the example of FIG. 51, the gas cracking device 715 is omitted from the gas processing device 714. Further, instead of the jet scrubber 716, a gas combustion apparatus for burning the gaseous emission may be provided with an alkaline shower for performing alkaline cleaning of the gaseous emission instead of the activated carbon filter 717.

  49 and 51, the loading chamber 704 and the dry distillation heating chamber for introducing the object to be processed into the dry distillation heating chamber 701 are made common, but they may be provided separately. In FIG. 51, an oil jet scrubber 708b is provided as a gas processing device, and the oil content in the gaseous emission is collected here, but a capacitor 708 may be provided.

  (Embodiment 22)

  The present invention relates to a vacuum evaporation recovery apparatus, and more particularly to a high-efficiency vacuum evaporation recovery apparatus that does not require lowering the temperature of the vacuum furnace when recovering metal from the evaporated material generated by the vacuum heat treatment in the vacuum furnace. It is.

  In the conventional vacuum evaporative recovery device, when recovering metal from the evaporated material generated by the vacuum heat treatment in the vacuum furnace, the furnace temperature of the vacuum furnace is lowered, the metal recovered material is taken out, and then the furnace temperature is raised again to perform the vacuum heat treatment. I had to follow the procedure of doing. This is because the evaporated metal adheres to the seal portion of the vacuum door existing between the vacuum furnace and the metal recovery device, so that the vacuum seal is not performed completely, and as a result, air flows into the vacuum heating furnace during metal recovery. This is because the collection operation cannot be performed.

  As described above, in the conventional vacuum evaporative recovery apparatus, it is necessary to cool the vacuum furnace when recovering the evaporate and raise the furnace temperature again after the recovery. Day)), there is a problem that the operation of the vacuum furnace must be stopped.

  Therefore, the present invention does not have such a problem, that is, it is not necessary to change the furnace temperature when recovering the evaporate, so that continuous operation is possible, the working efficiency is greatly improved, and the vacuum is advantageous in terms of cost. It is an object to provide an evaporative recovery apparatus.

  The present invention also provides a vacuum evaporation recovery apparatus in which the powdered evaporate reaches the vacuum valve and the vacuum pump, thereby preventing the vacuum seal performance of the vacuum valve from being hindered and causing a failure of the vacuum pump. Is an issue.

  The present invention is provided with a cooling and vacuum purge chamber having a cooling function via a vacuum door in a vacuum furnace, and the chamber is advanced and retracted in the cooling and vacuum purge chamber, and when moving forward, the vacuum door passes through the vacuum door. An evaporative recovery retort that faces the inside of the vacuum furnace and escapes from the vacuum purge chamber when retreating is provided, and a vacuum evaporative recovery device configured to be detachable from a shaft of a cylinder that advances and retracts the recovery retort. Settled.

  The present invention also provides a vacuum evaporative recovery characterized in that a cooling and vacuum purge chamber is installed in a vacuum furnace through a vacuum door, and a vacuum valve and a vacuum pump are installed in the cooling and vacuum purge chamber through a filter. The above-mentioned problem has been solved by using an apparatus. The filter in this case is preferably a combination of a solid filter (dry filter) and a liquid filter (wet filter).

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 52 is an overall configuration diagram of the apparatus according to the present invention. This apparatus is connected to the vacuum furnace 1 through the vacuum furnace 1, the vacuum double door 2 installed at the evaporant outlet of the vacuum furnace 1, and the vacuum double door 2. A cooling / vacuum purge chamber 3 connected in series, a solid powder recovery filter 4 and a liquid powder recovery filter 5 connected to a gas passage from the cooling / vacuum purge chamber 3, and a vacuum valve 6 and a vacuum pump 7. Consists of.

  A recovery retort 21 that is advanced and retracted by the action of the insertion cylinder 23 is inserted into the cooling and vacuum purge chamber 3. The insertion cylinder 23 is provided with a vacuum door 32 for vacuum-sealing the end opening of the cooling / vacuum purge chamber 3 and connected to the cylinder shaft of the moving cylinder 31. The recovery retort 21 is drawn out of the cooling and vacuum purge chamber 3 along with the extending operation of the moving cylinder 31.

  FIG. 53 shows the details of the vacuum double door 2 and the cooling / vacuum purge chamber 3. The vacuum double door 2 includes a vacuum furnace 1 surrounded by a heat insulating material 10 and a cooling / vacuum connected thereto. It is installed between the purge chamber 3. The vacuum double door 2 is a double door including a heat insulating vacuum door 12 disposed on the vacuum furnace 1 side and a vacuum door 13 disposed on the opposite side, and an open / close cylinder 15 installed on a door case 14. As a result, the passage to the cooling and vacuum purge chamber 3 is closed in an airtight state. An unrecovered evaporative stream outlet 17 is installed in the cooling and vacuum purge chamber 3, and a solid powder recovery filter 4 is installed in a gas passage extending from the unrecovered evaporative stream outlet 17.

  A cylindrical collection retort 21 for collecting metal evaporates is inserted from the cooling and vacuum purge chamber 3 through the open vacuum double door 2 to reach the vacuum furnace 1. The recovery retort 21 has an open front end facing the heating portion of the vacuum furnace 1, and the evaporated gas generated in the vacuum furnace 1 can enter the recovery retort 21 from there. An opening is provided in the side surface of the rear end of the recovery retort 21, and a metal net 22 is stretched on the opening to allow ventilation inside and outside the retort. In addition, it is preferable to provide a heat exchange function by making the peripheral wall of the cooling and vacuum purge chamber 3 double and allowing cooling water to flow therethrough.

  A cylinder shaft 24 of an insertion cylinder 23 for allowing the recovery retort 21 to advance from the cooling and vacuum purge chamber 3 into the vacuum furnace 1 is detachably attached to the rear end surface of the recovery retort 21. As the engaging means, as illustrated in FIG. 55, a mounting plate 27 provided with a long hole 26 having a width in which the cylinder shaft 24 can move on the rear end face of the recovery retort 21 is provided between the rear end face and the rear end face. A configuration is conceivable in which an engaging portion 29 larger than the width of the long hole 26 is provided at the tip end portion of the cylinder shaft 24 while being held and attached.

  In this case, if the recovery retort 21 is operated with a hoist or the like being lifted, and the locking portion 29 is inserted into the gap 28 and the cylinder shaft 24 is shifted into the long hole 26, the locking portion 29 becomes the long hole 26. The cylinder shaft 24 is engaged with the rear end surface of the recovery retort 21 via the mounting plate 27 so that the recovery retort 21 can move in the horizontal direction following the movement of the cylinder shaft 24. It becomes. The cylinder shaft 24 is provided with a bellows cover 30.

  The insertion cylinder 23 is fixed to a cylinder support block 33 that reciprocates on the gantry 18 by the action of the moving cylinder 31 through a vacuum door 32 attached to the insertion cylinder 23, and accordingly, on the gantry 18 as the cylinder support block 33 moves. To move. That is, the cylinder support block 33 has a roller 34 and is installed on a moving table 36 configured to be movable on the table 35 of the gantry 18, and the moving cylinder 31 is arranged below the table 35 in the gantry 18. The cylinder shaft is fixed to the moving table 36.

  As shown in FIG. 54, the vacuum door 32 is fixed to the flange portion of the insertion cylinder 23, the vacuum seal 32 a is provided in the insertion portion of the cylinder shaft 24, and the packing is in close contact with the end flange 3 a of the cooling and vacuum purge chamber 3. 32b, and thus the cooling and vacuum purge chamber 3 is vacuum-sealed.

  After the closing operation of the vacuum double door 2, the insertion cylinder 23 reaches the rear end (right end in FIG. 53) of the gantry 18 at the extending end of the moving cylinder 31. (This position is hereinafter referred to as “first stop point”). The new recovery retort 21 is attached to the cylinder shaft 24 of the insertion cylinder 23 by, for example, the engaging means as described above. When the installation work of the new recovery retort 21 is completed, the moving table 36 moves forward by the contraction operation of the moving cylinder 31 (moves leftward in FIG. 53).

  Accordingly, the recovery retort 21 enters the cooling and vacuum purge chamber 3 and stops at the contraction operation end of the moving cylinder 31 and waits. At this standby position, the front surface of the recovery retort 21 is located immediately before the vacuum double door 2 that closes the cooling and vacuum purge chamber 3 (hereinafter this position is referred to as “second stop point”), and the vacuum The door 32 is in close contact with the end flange 3a of the cooling and vacuum purge chamber 3 and vacuum-seals it.

  Next, the operation of the apparatus having the above configuration will be described in detail. As described above, the new recovery retort 21 is attached to the cylinder shaft 24 of the insertion cylinder 23 when the moving table 36 reaches the end of the gantry 18 by the extending operation of the moving cylinder 31 (first stop point). Then, the recovery retort 21 advances in the cooling and vacuum purge chamber 3 as the moving cylinder 31 is contracted, and the forward end of the moving table 36, in other words, the front opening surface of the recovery retort 21 is the vacuum double door 2. It stops when it reaches just before (second stop point). At that time, the vacuum double door 2 is closed.

  When the recovery retort 21 reaches the second stop point, the cooling and vacuum purge chamber 3 is kept airtight by the action of the vacuum door 32, and then the vacuum valve 6 is opened and the vacuum pump 7 is operated to The degree of vacuum in the vacuum purge chamber 3 is set to the same level as in the vacuum furnace 1. Thereafter, the open / close cylinder 15 is operated to open the vacuum double door 2, and the insertion cylinder 23 is operated to bring the opening of the recovery retort 21 into the vacuum furnace 1. In the vacuum furnace 1, the processed material is appropriately heat-treated under a vacuum degree to generate a metal evaporated material, but the evaporated material flows into the recovery retort 21 without going to the vacuum double door 2. Therefore, it is possible to avoid the occurrence of a situation in which the evaporant adheres to the vacuum double door 2 and impairs and deteriorates the vacuum sealing performance.

  After the collection of the evaporated material is completed, the collection retort 21 is pulled out to the second stop point by the action of the insertion cylinder 23, and then the vacuum double door 2 is closed by the action of the opening / closing cylinder 15. Therefore, an inert cooling gas such as a nitrogen gas is supplied into the cooling and vacuum purge chamber 3, and the recovered metal is cooled to a temperature at which it does not oxidize and burn. Thus, in the apparatus according to the present invention, after the vacuum furnace 1 and the cooling / vacuum purge chamber 3 are shut off by the vacuum double door 2, the inside of the vacuum furnace 1 is maintained at a high temperature and the cooling / vacuum purge chamber 3 is maintained. Since only the inside is cooled, useless time for cooling the vacuum furnace 1 as in the conventional case can be saved.

  After the recovered metal is sufficiently cooled, nitrogen gas or the like is further supplied into the cooling and vacuum purge chamber 3 and the pressure in the chamber is adjusted to be the same as the external pressure. After the pressure adjustment is completed, the vacuum door 32 is opened with the movement of the moving cylinder 31, and the recovery retort 21 is pulled out to the first stop point. Therefore, the recovery retort 21 is removed from the insertion cylinder 23, and the evaporated metal is separately recovered. Thereafter, the above procedure is repeated.

  Next, the configuration of the path from the cooling and vacuum purge chamber 3 to the vacuum pump 7 will be described. In the apparatus according to the present invention, the powder evaporated in vacuum in the vacuum furnace 1 passes through the recovery retort 21 and flows into the evaporative distribution outlet 17 and enters the seal portion of the vacuum valve 6 and the vacuum pump 7 to be vacuum sealed. In order to prevent the sealing performance from being hindered or to cause a failure of the vacuum pump 7, a hand throw is taken. That is, a metal net 22 is stretched at the evaporant outlet of the recovery retort 21, and a solid type and a liquid type filter are doubled between the evaporative flow outlet 17 and the vacuum valve 6.

  The solid filter 4 is composed of a wire mesh filter, a ceramic ball, or the like. If the absorption capacity of the vacuum pump 7 is not so strong, the solid filter 4 alone is sufficient. However, if the suction force becomes stronger than a certain level, the powder passes through the solid filter 4 and the vacuum valve 6 or the vacuum pump 7. It will reach to. Therefore, in the present invention, the liquid filter 5 is disposed after the solid filter 4. The liquid filter 5 collects powder by introducing it into a liquid or liquid film.

  When the amount of powder is small, only the liquid filter 5 may be used without using the solid filter 4, but when the amount of powder is large or the particles are large, the solid filter 4 and the liquid are used. It is necessary to use the filter 5 together.

  The present invention is as described above, and after the recovery retort that recovered the vacuum evaporates is drawn from the vacuum furnace into the cooling and vacuum purge chamber, the vacuum furnace and the cooling and vacuum purge chamber are shut off by the vacuum door, and then cooled. Since only the vacuum purge chamber is cooled, it is possible to omit a long-time operation of cooling the vacuum furnace and heating it again. Therefore, the work can be performed with high efficiency and at low cost, and there is an effect that contributes to energy saving.

  In addition, since the recovery retort contacts the furnace body surface of the vacuum furnace through the vacuum door, most of the evaporant generated in the vacuum furnace enters the recovery retort, and the evaporant adheres to the vacuum door and its vacuum sealing performance. There is an effect that there is no risk of obstructing.

  In the present invention, it is possible to prevent the powdered evaporate from reaching the vacuum valve and the vacuum pump, thereby preventing the occurrence of a situation in which the vacuum sealing performance of the vacuum valve is hindered or the vacuum pump is broken. effective.

  In the present invention, since the vacuum door is double, even if there is an abnormality in one of the vacuum doors, only the other vacuum door can play a role and the operation can be continued as it is. is there.

  Embodiment 23)

  Diffusion of organic halides such as dioxin, PCB, coplana PCB, etc. into the environment and its influence has become a major social problem. For example, harmful organic halides such as dioxins remain in the heating residue (ash, char, carbon) obtained by burning and pyrolyzing waste. In addition, for example, high concentrations of dioxins have been detected in the surrounding soil of garbage incineration plants and industrial waste disposal sites, and there are serious concerns about adverse health effects on residents. Organic halides are also contained in soil and sludge.

  As described above, there are many cases in which organic halides such as dioxins, heavy metals, or the like remain in waste residues from heating, solids such as soil and sludge under special conditions, and liquids.

As a method of removing harmful substances including these organic halides or heavy metals, the object to be treated containing organic halides is heated at a high temperature or melted at a high temperature of about 1500 ° C. A technique for reducing this has been proposed. However, such a method has problems such as expensive and large-scale equipment and high running costs. Furthermore, there is a problem that dioxins generated from room temperature to the decomposition temperature of dioxins cannot be dealt with. An effective treatment technique has not been established for soils in which organic halides such as dioxin, As, Hg, Cd, Pb, Cr ^+6, etc. are poured, such as around incineration facilities.

  Moreover, when municipal waste etc. are processed by combustion (incineration) etc., if it can burn completely, the production | generation of an organic halide can be reduced. However, it is very difficult to completely burn an object to be treated that is large in quantity and inhomogeneous. Even if complete combustion is possible, harmful organic halides such as dioxins are produced before reaching a predetermined temperature.

  Organic halides such as dioxins remain in the heating residue, which is the residue of the heat treatment of the object to be treated such as incineration and thermal decomposition, and the concentration of the organic halide remaining in the heating residue is reduced and removed. There is a need to establish technology.

  By the way, in order to generate dioxins, it is necessary that a reactive chlorine atom that bonds to carbon of the benzene nucleus and oxygen that bonds the benzene nucleus exist. In order to suppress the formation of dioxins during pyrolysis, it is considered effective to control the amounts of these reactive chlorine atoms and oxygen in the pyrolysis furnace. However, no suitable pyrolysis furnace has been proposed in order to prevent the generation of dioxins from such a viewpoint. In particular, the formation of organic halides such as dioxins and coplanar PCBs at a relatively low temperature (room temperature to 500 ° C.) in the temperature rising process up to a predetermined heating temperature, and the organic halogen remaining in the heating residue such as residual ash A technology for realizing decomposition of a compound at a low temperature has not been established yet.

  An object of the present invention is to provide a soil production method and a soil treatment apparatus for producing clean soil from soil contaminated with an organic halide such as dioxin.

  In addition, the present invention removes dioxins safely and reliably from dioxins contained in heated residues such as residual ash, residual liquid, dust, etc. from soil incineration facilities and factories of local governments, soil contaminated with these, sludge, etc. It is an object of the present invention to provide a processing method and a processing apparatus that can be used.

  In order to solve such problems, the present invention employs the following configuration. The method for producing a soil of the present invention produces a second soil containing the organic halide at a second concentration lower than the first concentration from the first soil containing the organic halide at a first concentration. In the method for producing soil, the first soil is introduced into an airtight region, and the first soil is heated under reduced pressure to thermally decompose at least a part of the organic halide. . The object to be treated is heated above the decomposition temperature of the organic halide or above the boiling point. Examples of the organic halide include dioxins, PCB, and coplana PCB.

  Furthermore, you may make it further have the process of reducing the halogen concentration in the gaseous effluent produced by the thermal decomposition of the said soil. Thereby, the possibility that organic halides are generated and regenerated in the gaseous effluent can be reduced.

  The pyrolysis residue of the first soil may be cooled after substituting the inside of the hermetic zone with a replacement gas that is substantially free of organic halides and has no ability to generate organic halides. Thereby, it is possible to prevent organic halides such as dioxin from being fixed in the residue with cooling.

  The form of the substitution gas which is substantially free of the organic halide and does not have the ability to form an organic halide is selected from the group consisting of helium, neon, argon, krypton, xenon, nitrogen, and hydrogen, for example. Examples thereof include at least one gas, a mixed gas thereof, and a gas mainly composed of these gases or mixed gases.

  The pyrolysis step may be performed while controlling the oxygen concentration in the hermetic zone. As a result, regardless of the non-uniformity of the object to be treated, partial combustion, etc., it is possible to suppress fluctuations in the generation amount of the gaseous emission and to perform the treatment of the gaseous emission more reliably and efficiently. In addition, dioxin generation can be prevented by suppressing the oxygen concentration and the halogen concentration.

  The method for producing a soil of the present invention produces a second soil containing the organic halide at a second concentration lower than the first concentration from the first soil containing the organic halide at a first concentration. In the method for producing soil, the first soil is heated so that at least a part of the organic halide evaporates or decomposes, the heated residue of the soil is introduced into an airtight region, and the interior of the airtight region is substantially increased. In addition, the heating residue of the soil is cooled after replacement with a replacement gas that is free of organic halides and does not have the ability to form organic halides.

  The soil production method of the present invention is characterized by thermally decomposing soil containing an organic halide under reduced pressure. Under reduced pressure, the mean free path of molecules is long, and the inside of the system is kept in a non-oxidizing atmosphere, so that generation and regeneration of organic halides such as dioxins can be prevented. Further, since the partial pressure of the organic halide itself is low under reduced pressure, the concentration of dioxin remaining in the heating residue can be reduced.

  For example, dioxins are effective by heat-treating soil containing heated dioxins from waste disposal facilities, factories, etc., heated residues, steamed baked goods, residual ash, residual liquid, dust, etc. while reducing the pressure from normal pressure and raising the temperature. Can be processed automatically. Moreover, you may make it reduce the halogen concentration of the gaseous effluent produced by the thermal decomposition of the said soil.

  The soil treatment apparatus of the present invention is a soil treatment apparatus for treating soil containing organic halides or capable of producing organic halides by heating, and means for heating the soil, an airtight region, and the soil Means for introducing the heating residue into the hermetic zone, means for substituting the inside of the hermetic zone with the organic halide-free (organic halide-free) substitution gas, and cooling the heating residue. And means for carrying out the above. In the present invention, regardless of combustion, pyrolysis, or reduced pressure pyrolysis, the soil that is the object to be treated is heated and then purged and cooled in the airtight region. The replacement means may introduce the replacement gas after decompressing the inside of the airtight region.

  Further, the apparatus further comprises a halogen removing means in which a metal that forms a compound with halogen contained in the gaseous effluent generated by heating the soil or an adsorbent that adsorbs the halogen in the gaseous effluent is disposed. It may be.

  Further, reforming means for reforming the gaseous effluent generated by heating the soil at a first temperature at which dioxin decomposes, and an increase in the dioxin concentration in the reformed gaseous effluent are suppressed. And a cooling means for cooling the gaseous effluent to a second temperature. The cooling means may be cooled rapidly by injecting oil into the gaseous emission.

  That is, the treatment method of the present invention is characterized by thermally decomposing an object to be treated containing an organic halide under reduced pressure. If the object to be treated, such as soil and incineration fly ash, contains not only organic halides but also heavy metals, etc., the organic metal halides are treated and the temperature and pressure are adjusted in the system to evaporate these heavy metals. Let The evaporated metal may be condensed and recovered by the recovery chamber as described above. Moreover, what is necessary is just to make it introduce | transduce into a processing system by the same method also about the gaseous emission which arises by pressure reduction or heating of process target objects, such as soil and incineration fly ash.

  Further, the processing apparatus of the present invention is a processing apparatus for processing an object to be processed that contains an organic halide or can generate an organic halide by heating, a means for heating the object to be processed, an airtight region, Means for introducing the heated residue into the hermetic zone; means for replacing the inside of the hermetic zone with a substitution gas that is substantially free of organic halides (deficient in organic halide); and cooling the heated residue. And means for carrying out the above.

  Examples of the heating means include a combustion furnace that burns the object to be treated, a pyrolysis furnace that thermally decomposes the object to be treated, a reduced pressure pyrolysis furnace that thermally decomposes the object to be treated under reduced pressure, and the like.

  The treatment apparatus of the present invention passes through a furnace in which the pyrolysis temperature can be controlled or a plurality of decompression furnaces having different pyrolysis temperatures when the object to be treated is pyrolyzed (steamed) while reducing the pressure from normal pressure. It is characterized by that. For example, the furnace pressure may be processed substantially constant, and the object to be processed may be thermally decomposed while changing the temperature.

  In addition, a furnace capable of controlling the pyrolysis temperature for pyrolyzing the object to be treated is provided, and the inside of the furnace is changed from normal pressure to a predetermined vacuum degree so that the degree of vacuum can be maintained. And For example, the temperature inside the furnace may be kept substantially constant, and the object to be treated may be thermally decomposed while changing the pressure.

  Further, an atmospheric pressure furnace and a plurality of decompression furnaces for pyrolyzing the object to be treated may be connected in series, and the pyrolysis temperature in each furnace may be set to increase as it goes to the subsequent stage.

  A metal that is arranged in connection with the reduced pressure furnace and forms a compound with halogen contained in a gaseous emission generated by thermal decomposition of the object to be treated, or an adsorbent that adsorbs a halogen in the gaseous emission Further, a halogen removing means for holding the inside is further provided. The portion of the halogen removing means loaded with, for example, a metal that traps halogen or a catalyst that decomposes is maintained at a substantially constant temperature in the range of room temperature to about 1000 ° C., more preferably in the range of about 400 ° C. to about 1000 ° C. It may be. The portion that adsorbs halogen is preferably kept at a low temperature.

  Moreover, in this invention, you may make it process, heating and depressurizing the heating residue containing the residual dioxin which arises from a refuse disposal facility, a factory, etc. In addition, steamed ware, residual ash, residual liquid, dust, etc. containing residual dioxins from garbage disposal facilities, factories, etc. may be processed while reducing the pressure from normal pressure and raising the temperature.

  In the present invention, the gaseous emission is decomposed and reduced by introducing the gaseous emission into the reducing means in a heated state disposed at the gas outlet of the heat-sealable pyrolysis furnace, and the downstream side of the reducing means is reduced. It is also possible to measure the concentration of at least one of oxygen, oxide gas, chlorine, and chloride gas, and to control the temperature, pressure, oxygen concentration, etc. in the pyrolysis furnace according to the measured value.

  In the present invention, the organic halide includes dioxins, PCB, coplana PCB, DDT, trichloroethylene, trihalomethane, and the like (see FIG. 6).

    In the present invention, unless otherwise specified, polychlorinated dibenzoparadioxins (PCDDs), polychlorinated dibenzofurans (PCDFs), and homologues having different chlorine numbers and substitution positions are generically named. It is called dioxin. Furthermore, compounds obtained by substituting chlorine in dioxin with other halogens such as fluorine and bromine are also included in the organic halide referred to in the present invention.

  In order to reduce the concentration of organic halides such as dioxins, PCB, and coplanar PCB in the heated residue of the object to be treated, the object to be treated is set at a temperature at which at least a part of the organic halide is decomposed. In addition to heating, it is important to cool the object to be treated in an atmosphere having a low concentration of the organic halide and the organic halide-producing substance as much as possible.

  On the other hand, it is preferable to reduce the concentration of dioxins, for example, the concentration of a substance capable of generating dioxins such as halogen, as much as possible for gaseous effluents generated by heating the object to be treated.

  If an organic halide coexists in the cooling atmosphere when the object to be treated is cooled, the organic halide is fixed in the object to be treated. In addition, if a material that can generate an organic halide coexists when the object to be treated is cooled, the organic halide is synthesized or re-synthesized during the cooling process, and the organic halide remains in the residue. It will end up.

  Therefore, in the present invention, in processing an object to be treated that contains an organic halide or generates an organic halide by heating, after heating such as combustion and thermal decomposition, the heating residue is treated with the organic halide. And cooling in a state where the concentration of the substance having the ability to form an organic halide is reduced. Therefore, the heating residue may be cooled, for example, in an atmosphere purged with a cooling gas not containing an organic halide material. Therefore, as the cooling gas, it is preferable to use a gas that does not contain halogen, oxygen, or an organic compound. For example, a rare gas such as argon, nitrogen, or the like can be used.

  Examples of objects to be treated include municipal garbage, municipal incineration ash, soil contaminated with organic halides such as dioxin and PCB, sludge, agricultural products, marine products, shredder dust, waste home appliances, various wastes, etc. Can do.

  The treatment method of the present invention is a treatment method for treating a treatment target object capable of generating an organic halide by heating, wherein the treatment target object is heated, the heating residue is introduced into an airtight region, and the inside of the airtight region is substantially increased. In particular, the heating residue is cooled by substituting with a replacement gas that is free from the organic halide and does not have the ability to form an organic halide.

  Further, the treatment method of the present invention is a treatment method for treating an object to be treated capable of generating an organic halide by heating, heating the object to be treated, introducing the heating residue into an airtight region, The heating residue is cooled by substituting with a substitution gas substantially free of the organic halide (the organic halide is deficient). Here, “organic halide-free” means that the organic halide is deficient. Examples of the replacement gas include noble gas, nitrogen, hydrogen, or a mixed gas thereof. In addition, air can be used as a replacement gas as long as the oxygen concentration does not matter.

  Examples of the heating method of the object to be treated include combustion and thermal decomposition. Such heating may be performed while adjusting the oxygen concentration. Further, the thermal decomposition may be performed while adjusting the pressure in the hermetic region such as reduced pressure or increased pressure. The introduction of the replacement gas into the airtight region may be performed after the inside of the airtight region is depressurized.

  Further, the gaseous emission generated by heating the object to be treated is also subjected to a treatment for reducing the concentration of organic halide such as dioxin.

  As such a treatment, for example, the gaseous emission is reformed at a first temperature at which dioxins are decomposed, and an increase in the dioxin concentration in the modified gaseous emission is suppressed. The gaseous effluent may be cooled to a second temperature.

  The gaseous emission generated by heating the object to be treated may be cooled by jetting oil onto the gaseous emission. As a result, resynthesis of the organic halide can be suppressed, and hydrocarbons and the like in the reformed gaseous emission can be trapped.

  Further, the gaseous effluent cooled by jetting oil may be reheated to such a high temperature that organic halides such as dioxins are decomposed again, and then cooled rapidly by jetting cooling water. This cooling water may be made alkaline.

  Further, the concentration of halogen such as chlorine contained in the gaseous effluent generated by heating the object to be treated may be reduced. For example, you may make it arrange | position the halogen removal apparatus etc. which remove the halogen in gaseous emission at the back | latter stage of a pyrolysis furnace. As a form of the halogen removing device, for example, a chamber is filled with a metal such as iron that reacts with chlorine in the gaseous effluent to form a chloride, a compound such as dairy powder and / or calcium hydroxide. . In addition, a halogen fixing reaction in the gaseous effluent and a catalyst for promoting the decomposition of the organic halide in the gaseous effluent may be loaded in the chamber. Further, an adsorbent that adsorbs halogen contained in the gaseous emission may be loaded. You may make it combine two or more structures of these halogen removal apparatuses.

  When an adsorbent such as zeolite is used for halogen removal, it is preferable to keep the adsorbent as low as possible in order to improve the adsorption efficiency. In this case, the gaseous effluent is cooled in a chamber loaded with an adsorbent, and this cooling is a time during which the temperature of the gaseous effluent stays within the regeneration temperature range of organic halides such as dioxins. Is preferably carried out rapidly so as to be as short as possible.

  The above-described various treatments for reducing the concentration of organic halides such as dioxin in the gaseous emission may be used in combination.

  As the processing apparatus of the present invention that realizes such processing, for example, an airtight region that can hold an object to be processed airtight, means for adjusting the temperature of the airtight region, and gas in the airtight region are used. A replacement means for replacing and a cooling means for cooling the heating residue of the object to be processed may be provided. Further, the inside of the airtight region may be decompressed.

  The replacement means may not only simply replace the gas in the hermetic zone, but also introduce the replacement gas after evacuating the inside of the hermetic zone. This exhaust system can also be used for pressure reduction in an airtight region other than gas replacement.

  Furthermore, you may make it provide the moving means for moving a process target object within an airtight area | region. As the moving means, a rotary kiln, a screw conveyor, a tray pusher, a drawer, a roller house, or the like may be provided.

  A gas circulation device that circulates the gas inside the hermetic zone while adjusting the temperature may be provided. As the gas circulation device, for example, a bypass connected to an airtight region (chamber) is provided, and the bypass is provided with a circulation pump, a temperature control device or a heat exchanger, filter means for removing dust, mist, and the like contained in the gas flow. What should I do? You may make it arrange | position these in order of a filter, a temperature control apparatus, and a circulation pump. In particular, the filter is preferably disposed upstream of the circulation pump and the temperature control device. For example, an oil film may be used as the filter. The treatment method and treatment apparatus of the present invention as described above can be applied to treatment in a heating furnace such as an incinerator or a normal pressure pyrolysis furnace, without being limited to a reduced pressure pyrolysis furnace.

  For example, the treatment apparatus of the present invention can be attached to the subsequent stage of a conventional incinerator or atmospheric pressure pyrolysis furnace. Therefore, organic halides such as dioxins can be safely and effectively removed from incineration residues generated in large quantities in the incinerator.

  Diffusion of toxic organic halides into the environment is a serious problem, and rebuilding an incineration facility to a new treatment facility requires enormous costs and time, and also handles waste that is generated daily. There must be. The present invention can also be applied as an incidental facility to a current incineration facility. Therefore, it is possible to process the object to be processed having the organic halide generating ability while using the current equipment.

  The method for producing a soil of the present invention produces a second soil containing the organic halide at a second concentration lower than the first concentration from the first soil containing the organic halide at a first concentration. In the method for producing soil, the step of introducing the first soil into an airtight region, and the step of thermally decomposing at least part of the organic halide by heating the first soil under reduced pressure, It is characterized by having.

  It is preferable that the pyrolysis residue of the first soil is cooled after replacing the inside of the hermetic zone with a replacement gas that is substantially free of organic halides and has no ability to generate organic halides.

  This is because, as described above, when an organic halide coexists in the cooling atmosphere when the object to be treated is cooled, the organic halide is fixed in the heating residue in the object to be treated. In order to remove the organic halide from the heated residue of the object to be treated, where the organic halide is evaporated by heating or the organic halide is formed, the heating atmosphere gas containing the organic halide is replaced or reduced pressure is used. It is important to cool the heating residue in a state where the concentration of the organic halide and the substance having the ability to form organic halide is reduced. Therefore, by cooling the pyrolysis residue of the first soil in a state where the concentration of the organic halide or the substance having the ability to form the organic halide is reduced, the second heat residue of the first soil is obtained. The concentration of organic halides remaining in the soil can be reduced and removed.

  In addition, it is preferable to perform the thermal decomposition of the first soil while controlling the oxygen concentration in the airtight region. For example, the oxygen concentration in the airtight region may be measured, and the oxygen concentration in the airtight region may be adjusted according to the measured oxygen concentration. The oxygen concentration may be controlled by introducing a reducing carrier gas or a reducing agent into the airtight region.

  As described above, by actively controlling the oxygen concentration in the hermetic region, even when the object to be treated is inhomogeneous, it can be thermally decomposed in a stable state. Further, by performing thermal decomposition while keeping the inside of the airtight region in a reducing atmosphere, it is possible to suppress the formation of organic halides such as dioxins. Further, by reducing the pressure in the hermetic region, the mean free process between molecules becomes longer, and the generation probability of organic halides such as dioxins can be reduced.

  Moreover, when metals, such as a heavy metal, are contained in the above-mentioned 1st soil, this soil may be heated and pressure-reduced and metal may be vaporized and collect | recovered. In this way, even when the soil is contaminated with mercury, cadmium, zinc, lead, arsenic, etc., such a metal can be separated and recovered from the soil. Hexavalent chromium and the like can be reduced to trivalent chromium, for example. Such metal recovery can be recovered using the recovery chamber described above. The present invention is not limited to contaminated soil, but can be similarly applied to treatment of incinerated ash, sludge, waste liquid, agricultural products, marine products and the like. Since the soil treated according to the present invention contains many inorganic components such as porous carbon, it can be used not only as soil but also as an effective soil improver. Further, for example, it may be used by mixing with organic matter such as humus and compost.

(Embodiment 24)
56 and 57 are diagrams showing examples of the configuration of the processing apparatus of the present invention. In this processing apparatus, for example, soil containing organic halides such as dioxins, incinerated ash, or the like can be processed.

  In this processing apparatus, a reforming unit 72 and a recovery unit 73 are provided between the reduced pressure heating furnace 71 and the exhaust system. The exhaust system includes a booster pump 74, a water ring pump 75 having a seal liquid circulation system capable of adjusting pH, and a rotary pump 76. An exhaust gas treatment system for treating exhaust gas from the exhaust system is disposed at the rear stage of the exhaust system (FIG. 57).

  The reduced pressure heating furnace 71 can heat the object to be treated while reducing the pressure in the system by the exhaust system. The reduced pressure heating furnace 71 controls the flow rate of the chamber 71a for storing the object to be processed, the heater 71b for heating the chamber 71a, the vacuum gauge 71c for measuring the pressure in the chamber, the thermocouple 71d for measuring the temperature in the chamber, and the flow rate of the carrier gas. A flow meter 71e is provided. As the carrier gas, for example, nitrogen, rare gas, hydrogen or the like may be used as necessary. The oxygen concentration in the system may be adjusted by the flow rate of these carrier gases. These carrier gases are also used as an organic halide-free cooling gas for the heating residue of the object to be treated. The chamber 72a of the reforming unit 72 is heated by the heater 72b, and the gaseous emission of the object to be processed flowing through the chamber 72a can be cracked. This high temperature reforming also decomposes harmful substances such as dioxins, PCBs, coplanar PCBs, etc. contained in the gaseous emission. In the treatment apparatus of the present invention, such a gaseous emission reforming section is provided between the reduced pressure heating furnace and the exhaust system, whereby the gaseous emission can be reformed under reduced pressure. In this example, the chamber 72a is loaded with a catalyst 72c that decomposes organic halides, promotes decomposition, or suppresses synthesis. Here, a catalyst in which nickel is impregnated on a support made of alumina or ceramic is used, but the type of catalyst may be used as necessary. The reduced pressure heating furnace 71 and the reforming unit 72 are connected by a pipe 71f that is kept warm so that the gaseous emission does not condense. In the present invention, it is preferable that the object to be treated is heated after the reforming unit 72 reaches a predetermined operating condition. For example, when reforming is performed by heating, the object to be treated may be heated in the reduced pressure heating furnace 71 after the temperature in the reforming unit reaches a set temperature for reforming the gaseous emission. For this reason, you may make it provide the means to detect the temperature of a reforming unit, and the means to heat the said pressure reduction heating furnace according to the detected temperature. Further, a means for holding a set value such as a reforming temperature in the reforming unit (for example, a memory), a means for detecting the temperature of the reforming unit, and the detected temperature are compared with the set value, and the comparison result is obtained. Accordingly, a means for heating the inside of the reduced pressure heating furnace may be provided. The gaseous emission reformed by the reforming unit 72 is introduced into the recovery unit 73.

The recovery unit 73 includes a recovery chamber 73a in which a tubular retort is loaded.
And a hermetic door 73b that separates the chamber 72a and the recovery chamber 73a of the reforming unit 73 so as to be openable and closable. The hermetic door 73b is opened and closed by a cylinder 73c. The configuration of this collection unit is the same as that shown in FIGS. 8, 9, 42, and 43, for example. That is, when the airtight door 73b is open, the retort is inserted from the collection chamber 73c to the chamber 72a side. The hermetic door 73b is shielded and protected by the inserted retort. When replacing the retort, the retort is pulled out to the collection chamber 73a side, the hermetic door 73b is closed, and the valve between the collection chamber and the exhaust system is closed. Thereby, while maintaining the state of the reduced pressure heating furnace 71 and the reforming unit 72, the retort can be taken out and the condensate can be recovered. In the present invention, the metal contained in the object to be processed can also be separated from the object to be processed and recovered by this recovery unit. For example, even when heavy metals such as lead, zinc, and cadmium are contained in contaminated soil and incinerated fly ash, they are vaporized by heating to a boiling point or higher under reduced pressure in a reduced pressure heating furnace 71 and recovered in a metallic state by a recovery unit 73 can do. The metal condensed in the retort is preferably taken out after introducing a non-oxidizing gas such as nitrogen into the recovery chamber and cooling it.

  The recovery chamber 73a is cooled by a coolant such as cooling water. This cooling not only condenses the metal, but also functions as a means for quenching the gaseous effluent reformed by the reforming unit. Thereby, it is possible to suppress resynthesis of organic halides such as dioxins in the gaseous emission.

  An oil film filter 711 is disposed between the recovery unit 73 and the booster pump 74. The oil film filter 711 prevents gaseous emissions, dust, condensed metal fine particles, and the like that could not be condensed in the recovery unit from reaching the exhaust system.

  A water ring pump 75 and a rotary pump 76 are connected in parallel to the subsequent stage of the booster pump 74. These exhaust systems can be switched and used in accordance with the processing sequence. For example, when soil is treated, moisture, oil, etc. are contained in the gaseous effluent at the initial stage of heating. In such a case, the booster pump 74 is preferably bypassed and exhausted by the liquid ring pump 75. Water and oil in the gaseous discharge are trapped in the liquid seal pump. In this apparatus, an alkaline aqueous solution is used for the sealing liquid of the liquid sealing pump. With this sealing liquid, nitrogen oxides, sulfur oxides and the like in the gaseous emission can be neutralized. When the treatment has progressed and the amount of water and oil in the gaseous emission has decreased, the exhaust system is switched to the rotary pump 76 and the booster pump 74. Thereby, the pressure in a processing system can be made lower. In this state, for example, metals such as zinc and lead are evaporated from the object to be treated and condensed into the retort in the recovery chamber. The switching of the exhaust system is not limited to the above example, and may be performed as necessary.

An exhaust gas neutralization unit 77 for neutralizing the exhaust gas, an activated carbon filter 78, and an exhaust blower 79 are disposed downstream of the exhaust system in order to treat the exhaust gas from the exhaust system.
The exhaust gas from the exhaust system is showered with an alkaline aqueous solution in the spray tower 77. The aqueous solution for cleaning the exhaust gas is sent again to the spray tower 77 through the neutralization tank 77a and the circulation pump 77c. Further, the pH of the aqueous solution is monitored by a pH meter, and the aqueous alkaline solution is supplied from the alkaline reservoir 77e, so that the pH of the circulating water is kept alkaline. This aqueous solution is also supplied to the sealing liquid circulation system of the liquid sealing pump 75. The exhaust gas washed with the alkaline aqueous solution is filtered through the activated carbon filter 78 and then exhausted out of the system by the exhaust blower 79. In this example, an analytical sample recovery unit 80 is provided in order to monitor the concentration of substances in the gaseous emission or exhaust gas. Quantitative analysis of components contained in gaseous emissions can also be performed online. By doing so, it becomes possible to adjust the processing temperature, pressure, oxygen concentration, reforming temperature of the gaseous emission, etc., of the processing object according to the detection result.

The perspective view which shows roughly the example of the processing apparatus of this invention. The figure which shows typically the processing apparatus of this invention illustrated in FIG. The figure which shows another example of the processing apparatus of this invention roughly. The figure which shows another example of the processing apparatus of this invention typically. The figure which shows another example of the processing apparatus of this invention typically. The figure which shows another example of the processing apparatus of this invention typically. The figure which shows typically the structure of the control system which adjusts the temperature of the processing apparatus of this invention, a pressure, and oxygen concentration. The figure which shows typically the collection | recovery system containing the collection | recovery chamber connected to the processing apparatus of this invention. The figure which shows typically the collection | recovery system containing the collection | recovery chamber connected to the processing apparatus of this invention. The figure which shows schematically the example of the structure of a collection | recovery chamber. The figure which shows schematically the example of the structure of a collection | recovery chamber. The figure which shows schematically the example of the structure of a collection | recovery chamber. The graph which shows the temperature dependence of the boiling point (vapor pressure) of lead. The figure which shows typically the mode before a process of the mounting substrate which is a process target object. The figure which shows typically the mode of the mounting substrate by which the constituent resin was thermally decomposed. The figure which shows a mode that lead vaporizes. The figure which shows a mode that the circuit board and the electronic component isolate | separated. The graph which shows the pressure dependence of the boiling point (vapor pressure) of various metals. The graph which shows the formation free energy and its temperature dependence of various oxides. The figure which shows the example of the processing apparatus of this invention typically. The figure which shows typically the partition of the processing apparatus of this invention. The figure which shows the example of the processing apparatus of this invention typically. The figure which shows typically the mode before a process of the circuit board which is an example of a process target object. The figure which shows typically the mode of the circuit board by which the constituent resin was thermally decomposed. The figure which shows typically a mode that copper gathers in a granular form by surface tension. The figure which showed typically the mode before the process of the resin coating aluminum foil which is a process target object. The figure which shows typically the mode of the resin-coated aluminum foil by which the constituent resin was thermally decomposed. The figure which shows typically the aluminum foil isolate | separated from the resin-coated aluminum foil. The graph which shows the relationship between the vapor pressure and temperature of various metals. The graph which shows the relationship between the vapor pressure and temperature of various metals. The figure which shows the example of the processing apparatus of this invention roughly. The figure which shows typically the structure of the processing apparatus of this invention illustrated in FIG. The figure which shows the example of the structure of a pyrolysis furnace typically. The figure which shows the example of the structure of a gas decomposer typically. The figure which shows the example of the structure of a cooling tower typically. The figure which shows a part of structure of the gaseous emission treatment system which connected the bag filter to the back | latter stage of the cooling tower. The figure which shows another example of the processing apparatus of this invention roughly. The figure which shows typically the structure of the processing apparatus of this invention illustrated in FIG. The figure which shows typically the example which applied the processing method of this invention to waste disposal. The figure which shows typically the example of a structure of a shredder apparatus schematically. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the example of a structure of a wet filter roughly. The figure for demonstrating the process conditions of a process target object. The figure which shows the measurement result of the residual dioxin density | concentration of a heating residue. The figure which shows schematically the example of a structure of the processing apparatus of this invention. The figure which shows schematically the example of a structure of the processing apparatus of this invention. The figure which shows schematically the example of a structure of the processing apparatus of this invention. The schematic block diagram of the vacuum evaporation collection | recovery apparatus which concerns on this invention. The detailed sectional view of the cooling and vacuum purge chamber portion of the vacuum evaporation recovery apparatus according to the present invention. The figure which shows the connection method of the collection | recovery retort in the vacuum evaporation collection | recovery apparatus which concerns on this invention, and its forward / backward drive cylinder. The figure which shows the connection method of the collection | recovery retort in the vacuum evaporation collection | recovery apparatus which concerns on this invention, and its forward / backward drive cylinder. The figure which shows the structure of the processing apparatus of this invention roughly. The figure which shows the structure of the processing apparatus of this invention roughly.

Explanation of symbols

DESCRIPTION OF SYMBOLS 0 ... Processing apparatus 20 ... Pyrolysis furnace 30 ... Gas decomposer 40 ... Cooling tower 50 ... Decompression heating furnace 51 ... Purge chamber 52 ... 1st airtight chamber 53 ... Cooling chamber 54a, 54b, 54c, 54d ... Partition 55 ... Exhaust System 71 ... Depressurizing heating furnace 72 ... Reforming unit 73 ... Recovery unit 100 ... Processing device 101 ... Purge chamber 102 ... First airtight chamber 103 ... Second airtight chamber 103b ... First opening 104 ... Cooling chamber 106 ... Exhaust system 115 ... recovery chamber 115b ... airtight door 115c ... retort (pipe)
115d ... third opening 115f ... second opening 711 ... oil film filter

Claims (17)

A first hermetic chamber having a first opening;
A tube which is arranged to be insertable into the first opening, has a second opening at the end in the insertion direction, and has a third opening on the surface;
The first opening can be opened and closed outside the first hermetic chamber, and the second opening and the third opening when the tube is inserted into the first opening. And a hermetic door that is shielded from the first hermetic chamber by the tube,
An exhaust port, and when the tube is inserted into the first opening, the exhaust port and the third opening face each other, and the second opening and the third opening And an exhaust system for exhausting the first hermetic chamber through the exhaust port and the exhaust port. The processing apparatus according to claim 1,
The processing apparatus, wherein the first hermetic chamber is maintained in a vacuum state when the hermetic door closes the first opening. The processing apparatus according to claim 1 or 2,
The processing apparatus further comprising means for cooling the pipe when the pipe is inserted into the first opening. The processing apparatus according to any one of claims 1 to 3, wherein
The processing apparatus further comprising means arranged along the tube insertion direction to guide the tube insertion operation. The processing apparatus according to any one of claims 1 to 4, wherein:
The processing apparatus according to claim 1, wherein the first hermetic chamber has a plurality of the first openings, and the pipe and the hermetic door are disposed for each of the first openings. The processing apparatus according to any one of claims 1 to 5,
The processing apparatus according to claim 1, wherein the first hermetic chamber is provided in a plurality of rows with a partition wall that can be opened and closed. The processing apparatus according to any one of claims 1 to 6,
A second hermetic chamber adjacent to the first hermetic chamber is further provided via the hermetic door, and the tube is inserted from the second hermetic chamber into the first opening of the first hermetic chamber. A processing apparatus. The processing apparatus according to claim 7, comprising:
The processing apparatus according to claim 1, wherein the exhaust system is connected to the first hermetic chamber via the second hermetic chamber. The processing apparatus according to any one of claims 1 to 8,
When the pipe is inserted into the first opening, the third opening and the exhaust port are hermetically connected. The processing apparatus according to claim 7, comprising:
Means for adjusting the pressure in the space between the tube and the second hermetic chamber to be higher than the pressure in the first hermetic chamber when the tube is inserted into the first opening. The processing apparatus further comprising: The processing apparatus according to claim 7, comprising:
When the tube is inserted into the first opening, the pressure in the first hermetic chamber is lower than the pressure in the space between the tube and the second hermetic chamber, and in the tube A processing apparatus further comprising means for adjusting the pressure to be higher than the pressure. The processing apparatus according to claim 10 or 11,
The processing apparatus according to claim 1, wherein the means for adjusting the pressure includes means for supplying a carrier gas to a space between the pipe and the second hermetic chamber. The processing apparatus according to any one of claims 10 to 12,
The processing apparatus further comprising a filter unit disposed between the second hermetic chamber and the exhaust unit. The processing apparatus according to claim 13, comprising:
The processing apparatus, wherein the filter means includes at least a wet filter. The processing apparatus according to any one of claims 10 to 14,
2. The processing apparatus according to claim 1, wherein the pipe is disposed so as to be replaceable, and the second hermetic chamber has a hermetically openable door for exchanging the pipe.
The processing apparatus according to any one of claims 10 to 14, The processing apparatus according to any one of claims 10 to 15,
The processing apparatus further comprising means for adjusting the temperature of the second hermetic chamber. The processing apparatus according to any one of claims 10 to 16, wherein
The processing apparatus further comprising means for supplying a non-oxidizing gas to the second hermetic chamber.

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