WO2001005206A1 - Boitier de blindage pour circuit a micro-ondes - Google Patents

Boitier de blindage pour circuit a micro-ondes Download PDF

Info

Publication number
WO2001005206A1
WO2001005206A1 PCT/IB2000/001031 IB0001031W WO0105206A1 WO 2001005206 A1 WO2001005206 A1 WO 2001005206A1 IB 0001031 W IB0001031 W IB 0001031W WO 0105206 A1 WO0105206 A1 WO 0105206A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
chambers
housing
shielding housing
cover
Prior art date
Application number
PCT/IB2000/001031
Other languages
German (de)
English (en)
Inventor
Siegbert Martin
Andreas Fischer
Karlheinz Muth
Original Assignee
Marconi Communications Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Communications Gmbh filed Critical Marconi Communications Gmbh
Priority to AU58397/00A priority Critical patent/AU5839700A/en
Publication of WO2001005206A1 publication Critical patent/WO2001005206A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0056—Casings specially adapted for microwave applications

Definitions

  • the present invention relates to a shielding housing for microwave circuits, in which there are a plurality of chambers shielded from one another, in which circuit units are arranged which are to be electromagnetically decoupled from one another, with a substrate made of a on the inside of a cover closing the housing
  • Polymer with metal particles embedded therein is applied and webs are formed on the substrate, which form the partitions between the chambers when the lid is attached.
  • Such a shielding housing in which the partitions between the chambers are formed solely from the material of the substrate, is known from DE 197 28 839 C1.
  • the substrate made of a polymer with metal particles embedded therein has a certain damping effect on undesired resonance frequencies in the chambers. Nevertheless, microwaves are refected on the chamber walls, which leads to undesirable circuit instabilities, e.g. B. by feedback or other crosstalk, can lead within the chambers.
  • the invention is therefore based on the object of specifying a shielding housing of the type mentioned at the outset, which can be produced with as little effort as possible and with undesirable reflections within the
  • the stated object is achieved with the features of claim 1 in that the surfaces of the substrate forming the individual chambers are not smooth, as in the prior art, but are at least partially structured. These structured surfaces allow a better adaptation between the field wave resistance of the air and the field wave resistance of the substrate, which largely prevents reflections on the surfaces of the chambers.
  • the substrate preferably consists of a silicon compound filled with iron powder.
  • Figure 1 is an open shield housing with a view of the inside of the housing
  • Figure 2 shows the same shielding housing with a view of the inside of its cover. Description of an embodiment
  • a shielding housing 1 is shown in perspective in FIG. 1 with a view into the interior of the housing.
  • the shield housing has a single large chamber 2 which e.g. can be milled out of a metal block. This chamber 2 serves to accommodate microwave circuits which are to be shielded electromagnetically from the outside.
  • the housing 1 is closed with a cover 3.
  • a shielding housing there are several circuit units that have to be shielded from one another electromagnetically. For this reason, several chambers for accommodating individual circuit units to be decoupled electromagnetically from one another are implemented in the interior of the housing 1.
  • FIG. 2 shows how the chambers are formed in the shielding housing 1, in which a perspective view of the inside of the housing cover 3 is shown.
  • a substrate 4 which consists of a polymer with metal particles embedded therein, is applied to the inside of the cover 3.
  • the substrate 4 is preferably one with
  • the substrate 4 On the side facing the interior of the housing 1, the substrate 4 is provided with a plurality of webs 5, 6, 7, 8 which, when the cover 3 is in place, form the partitions between the individual chambers in the shielding housing.
  • the partitions therefore consist entirely of the material of the substrate 4.
  • the webs 5, 6, 1, 8 can have any desired complicated shape.
  • the substrate 4 with its webs 5, 6, 7, 8 can be poured onto the inside of the cover 3 in a simple manner in terms of production technology.
  • the webs 5, 6, 7, 8 are in a form-fitting manner on the bottom of the chamber 2 when the cover 3 is attached and can also be used
  • Bushings 9, 10 are provided for connecting lines between the individual circuit units.
  • the material of the substrate has a relatively high damping effect. Due to the large impedance differences between air and the substrate, however, the influence on the microwave behavior of the chambers is very small. A wave running towards the substrate is reflected, so that the damping property of the substrate comes into play only to a limited extent. This leads to undesirable instabilities - e.g.
  • Reflections within the chambers can be very strongly damped by the fact that, as shown in FIG. 2, the surfaces of the substrate in the individual chambers are at least partially structured.
  • the surface structure 11, 12 can be formed, for example, from knobs, as shown in FIG. 2, or it can consist of webs or longitudinal and / or transverse grooves.
  • the shape and dimensioning of the surface structure depends both on the physical properties ( ⁇ , ⁇ ) of the substrate material and on the chamber dimensions and on the operating frequencies of the circuit units.
  • both the bottom of the cover can be provided with a surface structure 11 and, as is illustrated on the web 8, the partition walls of the substrate 4 can be provided with a structure 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Boîtier de blindage pouvant être fabriqué facilement, pour un circuit à micro-ondes doté de plusieurs chambres blindées les unes par rapport aux autres. Ledit boîtier comporte sur la face interne d'un couvercle (3) fermant le boîtier (1) un substrat (4) constitué d'un polymère dans lequel sont encastrées des particules de métal. Le substrat (4) possède des barrettes saillantes (5, 6, 7, 8) qui forment les parois de séparation entre les chambres lorsque le couvercle (3) est en place. Pour amortir de la manière la plus large possible les réflexions à l'intérieur des chambres, les surfaces du substrat (4) sont au moins partiellement structurées.
PCT/IB2000/001031 1999-07-13 2000-07-13 Boitier de blindage pour circuit a micro-ondes WO2001005206A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU58397/00A AU5839700A (en) 1999-07-13 2000-07-13 Shielding housing for microwave circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19932544.8 1999-07-13
DE1999132544 DE19932544C1 (de) 1999-07-13 1999-07-13 Abschirmgehäuse für Mikrowellenschaltungen

Publications (1)

Publication Number Publication Date
WO2001005206A1 true WO2001005206A1 (fr) 2001-01-18

Family

ID=7914511

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2000/001031 WO2001005206A1 (fr) 1999-07-13 2000-07-13 Boitier de blindage pour circuit a micro-ondes

Country Status (3)

Country Link
AU (1) AU5839700A (fr)
DE (1) DE19932544C1 (fr)
WO (1) WO2001005206A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050061528A1 (en) * 2001-12-07 2005-03-24 Esen Bayar Shielding device, circuit assembly and method of manufacture
DE102012018055A1 (de) 2012-09-13 2014-03-13 Daimler Ag Abdichtung eines elektrische und/oder elektronische Komponenten aufnehmenden Gehäuses

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE19728839C1 (de) * 1997-07-05 1998-09-03 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen
US5814761A (en) * 1995-09-07 1998-09-29 Shakti Audio Innovations Passive EMI dissipation apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
US5814761A (en) * 1995-09-07 1998-09-29 Shakti Audio Innovations Passive EMI dissipation apparatus and method
DE19728839C1 (de) * 1997-07-05 1998-09-03 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen

Also Published As

Publication number Publication date
AU5839700A (en) 2001-01-30
DE19932544C1 (de) 2000-08-10

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