WO2001001341A1 - Support element for an integrated circuit module - Google Patents

Support element for an integrated circuit module Download PDF

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Publication number
WO2001001341A1
WO2001001341A1 PCT/DE2000/002018 DE0002018W WO0101341A1 WO 2001001341 A1 WO2001001341 A1 WO 2001001341A1 DE 0002018 W DE0002018 W DE 0002018W WO 0101341 A1 WO0101341 A1 WO 0101341A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier element
adhesive
carrier
pressure
module
Prior art date
Application number
PCT/DE2000/002018
Other languages
German (de)
French (fr)
Inventor
Roland Isberner
Original Assignee
Orga Kartensysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh filed Critical Orga Kartensysteme Gmbh
Priority to EP00951232A priority Critical patent/EP1105838A1/en
Priority to AU64253/00A priority patent/AU6425300A/en
Publication of WO2001001341A1 publication Critical patent/WO2001001341A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a carrier element for an IC module for installation in a chip card with a plate-shaped support body, on the front flat side of which metallic contact surfaces are arranged and on the other rear flat side of which the IC module is arranged, from a protective layer covering the IC module a potting material and an adhesive surface applied to the back of the support body for fixing the carrier element to the chip card and a method for its production.
  • Carrier elements of the generic type are usually manufactured as mass components in the context of modular belts on which a large number of carrier elements are processed at the same time, equipped with the IC component and wired and then arranged in a separate operation on corresponding chip cards, the chip cards increasing Dimensions can be used in all areas of daily life, for example in the form of telephone cards, access authorization cards for mobile telephones, bank cards, etc.
  • the carrier elements used for the chip cards are inserted into the cards so that the front side of the plate-shaped carrier body with its metallic contact surfaces forms a contact field for connecting the IC component arranged on the carrier element to external data transmission or reading devices.
  • the IC component as
  • the computer module is protected on the back of the carrier body of the carrier element in a recess in the chip card.
  • the support body is designed in such a way that there is an adhesive surface on its back around the IC module.
  • the middle region of the carrier plate, in which the IC component and a protective layer covering it from a potting material are arranged, is kept free from the adhesive applied in the edge regions according to the prior art.
  • the application of the adhesive for fastening the support body within the chip card is usually carried out with the aid of an adhesive film for this purpose, holes are provided in a separate work step, in which the IC component and the potting material are to be arranged later.
  • Such a construction of the carrier element contains two serious disadvantages.
  • the carrier element is designed in such a way that the adhesive surface as a full-surface adhesive layer covers the entire rear surface of the carrier element.
  • the method according to the invention for producing a carrier element according to the main claim provides that the full-surface adhesive layer is fixed to the carrier element by a pressing process by means of a pressure device with a pressure surface made of an elastic material, the pressure surface being so flexible that the carrier element with its entire surface the IC module and the back covering covering it can dip into the pressure pocket.
  • the adhesive layer is designed as a multilayer laminate coating with at least one adhesive coating facing the carrier element and at least one carrier layer covering the adhesive coating on the side facing away from the carrier element.
  • the laminate coating reliably prevents adhesion between the pressure surface and the adhesive layer during the pressing process for the adhesive layer.
  • the outer shape of the pressure surface can be realized in different ways. It has proven to be advantageous to design the pressure surface as a pressure roller, which permits continuous transport of the module belt provided with the individual carrier elements and, under certain circumstances, can additionally support this continuous transport as a driven pressure roller.
  • the pressure roller used has a diameter of 10 to 40 mm. , 4th
  • FIG. 1 a cross section of a carrier element according to the invention
  • FIG. 2 the carrier element according to the invention from FIG. 1 installed in a chip card and
  • the carrier element designated 1 in its entirety in FIG. 1 has an inner plate-shaped support body 2 which has a plurality of metallic contact surfaces 5 on its front flat side. In their entirety, the metallic contact surfaces 5 form a contact field, the contact surfaces being separated from one another by gaps 17.
  • An IC module 3 is arranged on the rear side facing away from the front flat side of the supporting body 2. The circuits of this component 3 are connected to the contact surfaces 5 via a plurality of connecting wires 15. For this purpose, there are several bores 16 in the support body 2 through which the individual connecting wires 15 are guided.
  • the IC module 3 is covered with a protective layer 6 made of a potting material after being wired to the contact areas 5.
  • the protective layer 6 is in turn enclosed by an adhesive layer 7 which extends over the entire surface of the entire rear surface of the carrier element. Due to the design according to the invention, punching out the adhesive surface of the carrier element in the area of the protective layer 6 is now superfluous, as a result of which the production costs can be significantly reduced. In addition, according to the invention, the shape of the "hill" of the potting material covering the IC module 3 is no longer relevant, so that control measures before applying the adhesive layer 7 are unnecessary. It can also be seen from FIG. 1 that the adhesive layer 7 as a laminate is provided with an internal adhesive coating 9 facing the support body 2 and a carrier layer 8 applied to the outside of the adhesive coating 9.
  • the carrier layer 8 allows the adhesive layer 7 to be easily applied to the rear of the carrier element 1, as will be explained in detail in the description of the method.
  • FIG. 1 thus represents a single carrier element which is used as an overall component in a chip card.
  • a chip card 4 with the carrier element 1 inserted therein is shown in section in FIG. 2.
  • the carrier element 1 is placed in a step-shaped recess 14 within the chip card 4.
  • the recess 14 has an internal recess 18 and a stepped collar area 19 on which the edge of the support body 2 rests.
  • the adhesive bond between the support body 2 and the chip card 4 takes place exclusively in this collar region 19, since the depth 18 of the recess 18 is dimensioned such that a gap, albeit small, remains between the outer surface of the adhesive coating 9 and the bottom of the recess 18.
  • FIGS. 3 a and b it is shown schematically how a connection between the carrier element 1 or the protective layer 6 and the carrier body 2 and the adhesive layer 7 can be brought about with the aid of a pressure surface 20 by a pressing process.
  • the method for producing a carrier element of the type described above provides that the individual carrier elements are combined to form modular belts on which a large number of individual carrier elements are located at the same time.
  • the above-mentioned adhesive layer 7 is placed on the outside of the protective layer 6, and in such a way that the adhesive layer 7 consisting of the carrier layer 8 and the adhesive coating 9 faces with its adhesive side to the protective layer 6 or to the support body 2. Then with the help of an elastic material existing pressure surface brings about a permanent bond between the adhesive layer 7 and the carrier element 1. To implement this method step, it is necessary that the elastic material of the pressure surface is so flexible that the support element 1 with its back side provided with the IC module and the protective layer 6 covering it can be completely immersed in the pressure surface. Only through complete immersion is it ensured that the adhesive layer 7 is also connected to the supporting body material 2 in the depressions located between the individual “hills” of the modular belt.
  • the pressure surface 20 is shown as a pressure pad 21 which is pressed onto the module belt with a force F, a counter-holder 23 preventing the module belt from escaping in the direction of the direction of action of the force F.
  • the pressing force F is to be dimensioned such that a sufficient pressing force for permanent fixation between the support body 2 and the adhesive layer 7 is brought about even in the depressions located between the "hills" of the modular belt.
  • FIG. 3 b A further embodiment variant of the pressure surface 20 is shown in FIG. 3 b.
  • the pressure surface is designed as a circumferential pressure roller 22, a counter-holder 23 in turn preventing the module belt from escaping in the direction of the force F.
  • the distance from the center of the pressure roller 22 is dimensioned in this embodiment such that the lower areas between the support elements are also touched.
  • the configuration with a pressure roller 22 has the advantage that a continuous transport movement of the module belt with the individual support elements 1 can be carried out.
  • Foam and rubber with a correspondingly necessary softness are particularly suitable as advantageous material for the pressure roller 22 and the pressure pad 21.
  • the pressure device for the method according to the invention with special additional features.
  • Essential to the invention is the coordination of the material properties of the pressure roller or the pressure pad with regard to the material properties of the potting compound for the IC module in such a way that the pressure surface is softer than the potting compound.

Abstract

The invention relates to a support element for an integrated circuit module to be fitted in a chip card comprising: a plate-shaped support body on whose one front flat side metallic contact surfaces are arranged, and on whose rear flat side the integrated circuit module is arranged; a protective layer which covers the integrated circuit module and which is made of an encapsulating material, and; an adhesive surface which is applied to the rear of the support body and which is provided for fastening the support element to the chip card. According to the invention, the adhesive layer covers the entire rear surface of the support element as an all-over adhesive layer. This inventive embodiment enables the production costs of said support elements to be significantly reduced. The invention also relates to a method for producing such a support element in which the all-over adhesive layer is attached to the support element by a pressing process effected by a pressing device having a pressing surface that is made of an elastic material. The pressing surface is flexible enough to permit the support element to submerge, in an all-over manner with the rear thereof which is provided with the integrated circuit module and with the protective layer that covers the same, into the pressing surface.

Description

. . , ,
Beschreibung:Description:
Trägerelement für einen IC-BausteinCarrier element for an IC chip
Die Erfindung betrifft ein Trägerelement für einen IC-Baustein zum Einbau in eine Chipkarte mit einem plattenförmigen Tragkörper, an dessen einer vorderen Flach- seite metallische Kontaktflächen und an dessen anderer rückseitigen Flachseite der IC-Baustein angeordnet sind, einer den IC-Baustein überdeckenden Schutzschicht aus einem Vergussmaterial und einer an der Rückseite des Tragkörpers aufgebrachten Klebefläche zur Festlegung des Trägerelementes an der Chipkarte sowie ein Verfahren zu dessen Herstellung.The invention relates to a carrier element for an IC module for installation in a chip card with a plate-shaped support body, on the front flat side of which metallic contact surfaces are arranged and on the other rear flat side of which the IC module is arranged, from a protective layer covering the IC module a potting material and an adhesive surface applied to the back of the support body for fixing the carrier element to the chip card and a method for its production.
Trägerelemente der gattungsgemäßen Art werden als Massenbauteile üblicherweise in Rahmen von Modulbändern, auf denen eine große Anzahl von Trägerelementen gleichzeitig bearbeitet werden, gefertigt, mit dem IC-Baustein bestückt und verdrahtet und danach in einem separaten Arbeitsgang auf entsprechenden Chipkarten angeordnet, wobei die Chipkarten in zunehmendem Maße in allen Bereichen des tägli- chen Lebens, beispielsweise in Form von Telefonkarten, Zugangsberechtigungskarten für Mobilfunktelefone, Bankkarten usw. Verwendung finden. Die für die Chipkarten verwendeten Trägerelemente werden in die Karten so eingesetzt, daß die vordere Seite des plattenförmigen Tragkörpers mit seinen metallischen Kontaktflächen ein Kontaktfeld zur Verbindung der auf dem Trägerelement angeordneten IC-Baustein mit externen Datenübertragungs- oder Lesegeräten bildet. Der IC-Baustein alsCarrier elements of the generic type are usually manufactured as mass components in the context of modular belts on which a large number of carrier elements are processed at the same time, equipped with the IC component and wired and then arranged in a separate operation on corresponding chip cards, the chip cards increasing Dimensions can be used in all areas of daily life, for example in the form of telephone cards, access authorization cards for mobile telephones, bank cards, etc. The carrier elements used for the chip cards are inserted into the cards so that the front side of the plate-shaped carrier body with its metallic contact surfaces forms a contact field for connecting the IC component arranged on the carrier element to external data transmission or reading devices. The IC component as
Rechnermodul liegt hierbei an der Rückseite des Tragkörpers des Trägerelementes geschützt in einer Vertiefung der Chipkarte. Der Tragkörper ist hierbei so ausgebildet, daß auf dessen Rückseite rund um den IC-Baustein eine Klebefläche vorhanden ist. Der mittlere Bereich der Trägerplatte, in dem der IC-Baustein sowie eine diesen überdeckende Schutzschicht aus einem Vergussmaterial angeordnet sind, wird gemäß dem Stand der Technik von dem in den Randbereichen aufgetragenen Kleber freigehalten. Die Aufbringung des Klebers zur Befestigung des Tragkörpers innerhalb der Chipkarte wird üblicherweise mit Hilfe einer Klebefolie vorgenommen, die hierzu in einem separaten Arbeitsgang mit Löchern versehen wird, in denen später der IC-Baustein sowie das Vergussmaterial anzuordnen sind. Ein derartiger Aufbau des Trägerelementes beinhaltet zwei ernstzunehmende Nachteile. Zum einen ist wie oben erwähnt für die Vorbereitung der Aufbringung des Klebers auf den Tragkörper ein gesonderter Stanzvorgang für die Klebefolie notwendig, darüber hinaus ist eine genaue Überwachung der Positionierung der ausgestanzten Klebefolie beim anschließenden Aufbringen der Folie auf dem Modulband notwendig. Die Kontrolle der Positionierung erfolgt mittels optischer Sensoren und Wegaufnehmer, die den Vorschub des Modulbandes sowie der Klebefolie aufnehmen und steuern, was einen erheblichen Zusatzaufwand beim Herstellungsprozess bedingt. Wird die Klebefolie mit ihren ausgestanzten Löchern nicht richtig zu den Verguss-„Hügeln" des Modulbandes positioniert, liegt diese einerseits teilweise auf den „Hügeln", andererseits ergibt sich im eigentlichen Klebebereich eine nichtklebende Fläche, die die Festigkeit der Verbindung des Trägerelementes mit der Chipkarte mindert.In this case, the computer module is protected on the back of the carrier body of the carrier element in a recess in the chip card. The support body is designed in such a way that there is an adhesive surface on its back around the IC module. The middle region of the carrier plate, in which the IC component and a protective layer covering it from a potting material are arranged, is kept free from the adhesive applied in the edge regions according to the prior art. The application of the adhesive for fastening the support body within the chip card is usually carried out with the aid of an adhesive film for this purpose, holes are provided in a separate work step, in which the IC component and the potting material are to be arranged later. Such a construction of the carrier element contains two serious disadvantages. On the one hand, as mentioned above, a separate punching process for the adhesive film is necessary for the preparation of the application of the adhesive to the support body, moreover, precise monitoring of the positioning of the punched-out adhesive film when the film is subsequently applied to the modular belt is necessary. The positioning is checked by means of optical sensors and displacement transducers, which record and control the feed of the module tape and the adhesive film, which requires a considerable additional effort in the manufacturing process. If the adhesive film with its punched-out holes is not correctly positioned to the potting "hills" of the modular tape, this lies partly on the "hills" on the one hand, on the other hand there is a non-adhesive surface in the actual adhesive area, which strengthens the connection of the carrier element to the chip card decreases.
Aufgabe der vorliegenden Erfindung ist es daher, ein Trägereiement der eingangs geschilderten gattungsgemäßen Art so weiterzuentwickeln, daß dessen Herstellung einfacher und somit kostengünstiger durchgeführt werden kann und darüber hinaus ein Verfahren zu offenbaren, mit dem das erfindungsgemäß gestaltete Trägerelement hergestellt werden kann.It is therefore an object of the present invention to develop a carrier element of the generic type described at the outset in such a way that its manufacture can be carried out more easily and therefore more cost-effectively and, moreover, to disclose a method with which the carrier element designed according to the invention can be produced.
Diese Aufgabe wird erfindungsgemäß in Zusammenschau mit den gattungsbildenden Merkmalen durch die technische Lehre der offenbarten Ansprüche 1 und 6 gelöst.This object is achieved according to the invention in conjunction with the generic features by the technical teaching of the disclosed claims 1 and 6.
Gemäß der in diesen Ansprüchen beschriebenen technischen Lehre wird das Trägerelement so gestaltet, daß die Klebefläche als vollflächige Klebeschicht die ge- samte rückseitige Oberfläche des Trägerelementes bedeckt. Durch diese Maßnahme werden die oben geschilderten Nachteile des Standes der Technik beseitigt, insbesondere entfällt der bislang übliche und notwendige Ausstanzprozess für die verwendete Klebefolie und die Überwachung des Positioniervorganges der Klebeschicht auf dem Modulband. Darüberhinaus hat sich gezeigt, daß die Ausschußrate bei der Herstellung der Trägerelemente trotz fehlender Positionierkontrolle geringer ausfällt als beim aus dem Stand der Technik üblichen Herstellverfahren. . 3 .According to the technical teaching described in these claims, the carrier element is designed in such a way that the adhesive surface as a full-surface adhesive layer covers the entire rear surface of the carrier element. This measure eliminates the disadvantages of the prior art described above, in particular eliminates the previously customary and necessary punching process for the adhesive film used and the monitoring of the positioning process of the adhesive layer on the module tape. In addition, it has been shown that the reject rate in the manufacture of the carrier elements, despite the lack of positioning control, is lower than in the manufacturing process customary in the prior art. , 3rd
Das erfindungsgemäße Verfahren zur Herstellung eines Trägerelementes gemäß dem Hauptanspruch sieht vor, daß die vollflächige Klebeschicht durch einen Anpressvorgang mittels einer Andruckvorrichtung mit einer Andruckfiäche aus einem elastischen Material an dem Trägerelement festgelegt wird, wobei die Andruckfläche so nachgiebig ist, daß das Trägerelement vollflächig mit seiner mit dem IC-Baustein und der diesen bedeckenden Schutzschicht versehenen Rückseite in die Andruckfä- che eintauchen kann.The method according to the invention for producing a carrier element according to the main claim provides that the full-surface adhesive layer is fixed to the carrier element by a pressing process by means of a pressure device with a pressure surface made of an elastic material, the pressure surface being so flexible that the carrier element with its entire surface the IC module and the back covering covering it can dip into the pressure pocket.
Die Nachgiebigkeit der Andruckfläche gewährleistet, daß zum einen eine Beschädigung der den IC-Baustein bedeckenden Vergussmaterialschutzschicht verhindert wird, gleichzeitig jedoch eine vollflächige Verklebung sowohl im Bereich des Vergussmaterials als auch im um diesen angeordneten Klebeflächenbereich. Weitere spezielle Ausgestaltungen des Gegenstandes der Erfindung ergeben sich aus den in den Unteransprüchen 2 bis 5 offenbarten Merkmalen für das erfindungsgemäße Trägerelement sowie aus den in den Ansprüchen 7 bis 11 offenbarten Merkmalen für das erfiπdungsgemäße Verfahren zur Herstellung des Trägerelementes.The resilience of the pressure surface ensures that damage to the potting material protective layer covering the IC module is prevented, but at the same time full-surface gluing both in the area of the potting material and in the area of the adhesive area arranged around it. Further special configurations of the subject matter of the invention result from the features disclosed in subclaims 2 to 5 for the carrier element according to the invention and from the features disclosed in claims 7 to 11 for the method according to the invention for producing the carrier element.
Es hat sich insbesondere als vorteilhaft herausgestellt, daß die Klebeschicht als mehrschichtige Laminatbeschichtung mit mindestens einer dem Trägerelement zugewandten Klebebeschichtung und mindestens einer die Klebebeschichtung an der dem Trägerelement abgewandten Seite abdeckenden Trägerschicht ausgeführt ist. Die Laminatbeschichtung verhindert zuverlässig eine Adhäsion zwischen Andruckfläche und Klebeschicht während des Anpressvorganges für die Klebeschicht.It has proven particularly advantageous that the adhesive layer is designed as a multilayer laminate coating with at least one adhesive coating facing the carrier element and at least one carrier layer covering the adhesive coating on the side facing away from the carrier element. The laminate coating reliably prevents adhesion between the pressure surface and the adhesive layer during the pressing process for the adhesive layer.
Als Material für die Andruckfläche haben sich aufgrund ihrer speziellen elastischen Eigenschaften insbesondere Schaumstoff und Gummi als vorteilhaft erwiesen.Due to their special elastic properties, foam and rubber in particular have proven to be advantageous as the material for the pressure surface.
Die äußere Gestalt der Andruckfläche kann auf unterschiedliche Art und Weise reali- siert werden. Es hat sich als vorteilhaft erwiesen, die Andruckfläche als Andruckrolle auszugestalten, die einen kontinuierlichen Transport des mit den einzelnen Trägerelementen versehenen Modulbandes gestattet und als angetriebene Andruckrolle unter Umständen diesen kontinuierlichen Transport zusätzlich unterstützen kann.The outer shape of the pressure surface can be realized in different ways. It has proven to be advantageous to design the pressure surface as a pressure roller, which permits continuous transport of the module belt provided with the individual carrier elements and, under certain circumstances, can additionally support this continuous transport as a driven pressure roller.
Um eine ausreichende Andruckfläche bei Gestaltung von dieser als Andruckrolle zu gewährleisten, hat es sich als vorteilhaft herausgestellt, daß die verwendete Andruckrolle einen Durchmesser von 10 bis 40 mm aufweist. . 4 .In order to ensure a sufficient pressure surface when designed as a pressure roller, it has been found to be advantageous that the pressure roller used has a diameter of 10 to 40 mm. , 4th
Im folgenden werden sowohl das erfindungsgemäße Trägerelement als auch die speziellen Merkmale des zur Herstellung des Trägerelementes verwendeten Verfahrens anhand der beigefügten Zeichnungen näher erläutert.In the following, both the carrier element according to the invention and the special features of the method used to manufacture the carrier element are explained in more detail with reference to the accompanying drawings.
Es zeigt:It shows:
Figur 1 : ein erfindungsgemäßes Trägerelement im Querschnitt,FIG. 1: a cross section of a carrier element according to the invention,
Figur 2: das erfindungsgemäße Trägerelement aus Figur 1 eingebaut in eine Chipkarte undFIG. 2: the carrier element according to the invention from FIG. 1 installed in a chip card and
Figur 3 a und b: zwei Ausgestaltungen der für das erfindungsgemäße Verfahren der Herstellung des Trägerelementes verwendeten Andruckfläche.3 a and b: two configurations of the pressure surface used for the method according to the invention for producing the carrier element.
Das in der Figur 1 in seiner Gesamtheit mit 1 bezeichnete Trägerelement weist einen innen liegenden plattenförmigen Tragkörper 2 auf, welcher an seiner vorderen Flachseite mehrere metallische Kontaktflächen 5 besitzt. Die metallischen Kontaktflächen 5 bilden in ihrer Gesamtheit ein Kontaktfeld, wobei die Kontaktflächen durch Spalte 17 voneinander getrennt sind. An der der vorderen Flachseite des Tragkör- pers 2 abgewandten Rückseite ist ein IC-Baustein 3 angeordnet. Die Schaltkreise dieses Bausteines 3 sind über mehrere Anschlussdrähte 15 mit den Kontaktflächen 5 verbunden. Zu diesem Zweck befinden sich im Tragkörper 2 mehrere Bohrungen 16, durch die die einzelnen Anschlussdrähte 15 geführt sind. Im Rahmen des Herstellungsvorganges des Trägerelementes 1 wird der IC-Baustein 3 nach der Ver- drahtung mit den Kontaktflächen 5 mit einer Schutzschicht 6 aus einem Vergussmaterial abgedeckt. Erfindungswesentlich bei dem dargestellten Trägerelement 1 ist es, daß die Schutzschicht 6 wiederum von einer Klebeschicht 7 umschlossen ist, die sich vollflächig über die gesamte rückseitige Oberfläche des Trägerelementes erstreckt. Durch die erfindungsgemäße Gestaltung ist ein Ausstanzen der Klebefläche des Trägerelementes im Bereich der Schutzschicht 6 nunmehr überflüssig, wodurch die Produktionskosten nicht unwesentlich verringert werden können. Darüber hinaus ist gemäß der Erfindung die Gestalt des „Hügels" des den IC-Baustein 3 abdeckenden Vergussmaterials nicht mehr relevant, so daß sich Kontrollmaßnahmen vor der Aufbringung der Klebeschicht 7 erübrigen. Aus der Figur 1 ist ergänzend ersichtlich, daß die Klebeschicht 7 als Laminatausführung mit einer innenliegenden, dem Tragkörper 2 zugewandten Klebebeschichtung 9 sowie einer außen auf die Klebebeschichtung 9 aufgebrachten Trägerschicht 8 versehen ist.The carrier element designated 1 in its entirety in FIG. 1 has an inner plate-shaped support body 2 which has a plurality of metallic contact surfaces 5 on its front flat side. In their entirety, the metallic contact surfaces 5 form a contact field, the contact surfaces being separated from one another by gaps 17. An IC module 3 is arranged on the rear side facing away from the front flat side of the supporting body 2. The circuits of this component 3 are connected to the contact surfaces 5 via a plurality of connecting wires 15. For this purpose, there are several bores 16 in the support body 2 through which the individual connecting wires 15 are guided. In the course of the manufacturing process of the carrier element 1, the IC module 3 is covered with a protective layer 6 made of a potting material after being wired to the contact areas 5. It is essential to the invention in the carrier element 1 shown that the protective layer 6 is in turn enclosed by an adhesive layer 7 which extends over the entire surface of the entire rear surface of the carrier element. Due to the design according to the invention, punching out the adhesive surface of the carrier element in the area of the protective layer 6 is now superfluous, as a result of which the production costs can be significantly reduced. In addition, according to the invention, the shape of the "hill" of the potting material covering the IC module 3 is no longer relevant, so that control measures before applying the adhesive layer 7 are unnecessary. It can also be seen from FIG. 1 that the adhesive layer 7 as a laminate is provided with an internal adhesive coating 9 facing the support body 2 and a carrier layer 8 applied to the outside of the adhesive coating 9.
Die Trägerschicht 8 gestattet ein problemloses Aufbringen der Klebeschicht 7 auf die Rückseite des Trägerelementes 1 , wie dies im einzelnen bei der Beschreibung des Verfahrens noch erläutert wird.The carrier layer 8 allows the adhesive layer 7 to be easily applied to the rear of the carrier element 1, as will be explained in detail in the description of the method.
Die Figur 1 stellt somit ein einzelnes Trägerelement dar, welches als Gesamtbauteil in eine Chipkarte eingesetzt wird. Eine Chipkarte 4 mit dem darin eingesetzten Trä- gerelement 1 ist im Schnitt in der Figur 2 dargestellt. Zum Einsetzen des Trägerelementes 1 in die Chipkarte 4 wird die oben erwähnte Trägerschicht 8 vom Trägerelement 1 entfernt. Danach wird das Trägerelement 1 in einer stufenförmig ausgebildeten Aussparung 14 innerhalb der Chipkarte 4 piaziert. Die Aussparung 14 weist eine innenliegende Vertiefung 18 auf sowie einen abgesetzten Kragenbereich 19, auf dem der Rand des Tragkörpers 2 aufliegt. Die Verklebung zwischen Tragkörper 2 und Chipkarte 4 erfolgt ausschließlich in diesem Kragenbereich 19, da die Vertiefung 18 in ihrer Tiefenausdehnung so bemessen ist, daß zwischen der äußeren Oberfläche der Klebebeschichtung 9 und dem Boden der Vertiefung 18 noch ein wenn auch geringer Spalt verbleibt.FIG. 1 thus represents a single carrier element which is used as an overall component in a chip card. A chip card 4 with the carrier element 1 inserted therein is shown in section in FIG. 2. To insert the carrier element 1 into the chip card 4, the above-mentioned carrier layer 8 is removed from the carrier element 1. Thereafter, the carrier element 1 is placed in a step-shaped recess 14 within the chip card 4. The recess 14 has an internal recess 18 and a stepped collar area 19 on which the edge of the support body 2 rests. The adhesive bond between the support body 2 and the chip card 4 takes place exclusively in this collar region 19, since the depth 18 of the recess 18 is dimensioned such that a gap, albeit small, remains between the outer surface of the adhesive coating 9 and the bottom of the recess 18.
In der Figur 3 a und b ist schematisch dargestellt, wie mit Hilfe einer Andruckfläche 20 durch einen Anpressvorgang eine Verbindung zwischen dem Trägerelement 1 bzw. der Schutzschicht 6 sowie dem Tragkörper 2 und der Klebeschicht 7 herbeigeführt werden kann. Das Verfahren zur Herstellung eines Trägerelementes der oben beschriebenen Art sieht vor, daß die einzelnen Trägerelemente zu Modulbändern zusammengefaßt werden, auf der sich gleichzeitig eine große Anzahl einzelner Trägerelemente befinden. Nachdem auf dem jeweiligen Tragkörper 2 jeweils ein IC- Baustein 3 aufgebracht und angeschlossen worden ist und nachdem der IC-Baustein anschließend mit einer Schutzschicht 6 aus Vergussmaterial bedeckt worden ist, wird an der Außenseite der Schutzschicht 6 die oben bereits erwähnte Klebeschicht 7 plaziert, und zwar dergestalt, daß die aus der Trägerschicht 8 und der Klebebeschichtung 9 bestehende Klebeschicht 7 mit ihrer Klebeseite zur Schutzschicht 6 bzw. zum Tragkörper 2 weist. Danach wird mit Hilfe einer aus elastischem Material bestehenden Andruckfläche eine dauerhafte Verklebung zwischen Klebeschicht 7 und Trägerelement 1 herbeigeführt. Zur Realisierung dieses Verfahrensschrittes ist notwendig, daß das elastische Material der Andruckfläche so nachgiebig ist, daß das Trägerelement 1 vollflächig mit seiner mit dem IC-Baustein und der diesen bedek- kenden Schutzschicht 6 versehenen Rückseite vollständig in die Andruckfläche eintauchen kann. Nur durch das vollständige Eintauchen ist gewährleistet, daß sich die Klebeschicht 7 auch in den zwischen den einzelnen „Hügeln" des Modulbandes befindlichen Vertiefungen mit dem Tragkörpermaterial 2 verbinden.In FIGS. 3 a and b it is shown schematically how a connection between the carrier element 1 or the protective layer 6 and the carrier body 2 and the adhesive layer 7 can be brought about with the aid of a pressure surface 20 by a pressing process. The method for producing a carrier element of the type described above provides that the individual carrier elements are combined to form modular belts on which a large number of individual carrier elements are located at the same time. After an IC module 3 has been applied and connected to the respective support body 2 and after the IC module has subsequently been covered with a protective layer 6 made of potting material, the above-mentioned adhesive layer 7 is placed on the outside of the protective layer 6, and in such a way that the adhesive layer 7 consisting of the carrier layer 8 and the adhesive coating 9 faces with its adhesive side to the protective layer 6 or to the support body 2. Then with the help of an elastic material existing pressure surface brings about a permanent bond between the adhesive layer 7 and the carrier element 1. To implement this method step, it is necessary that the elastic material of the pressure surface is so flexible that the support element 1 with its back side provided with the IC module and the protective layer 6 covering it can be completely immersed in the pressure surface. Only through complete immersion is it ensured that the adhesive layer 7 is also connected to the supporting body material 2 in the depressions located between the individual “hills” of the modular belt.
In der Figur 3 a ist die Andruckfläche 20 als Andruckkissen 21 aufgeführt, welches mit einer Kraft F auf das Modulband gedrückt wird, wobei ein Gegenhalter 23 ein Ausweichen des Modulbandes in Richtung der Wirkrichtung der Kraft F verhindert. Die Andruckkraft F ist so zu bemessen, daß auch in den zwischen den „Hügeln" des Modulbandes befindlichen Vertiefungen eine ausreichende Andruckkraft zur dauerhaften Fixierung zwischen Tragkörper 2 und Klebeschicht 7 herbeigeführt wird.In FIG. 3 a, the pressure surface 20 is shown as a pressure pad 21 which is pressed onto the module belt with a force F, a counter-holder 23 preventing the module belt from escaping in the direction of the direction of action of the force F. The pressing force F is to be dimensioned such that a sufficient pressing force for permanent fixation between the support body 2 and the adhesive layer 7 is brought about even in the depressions located between the "hills" of the modular belt.
Eine weitere Ausgestaltungsvariante der Andruckfläche 20 ist in der Figur 3 b dargestellt. Hier wird die Andruckfläche als umlaufende Andruckrolle 22 ausgeführt, wobei ein Gegenhalter 23 wiederum ein Ausweichen des Modulbandes in Richtung der Kraft F verhindert. Der Abstand des Mittelpunktes der Andruckrolle 22 ist bei diesem Ausführungsbeispiel so zu bemessen, daß auch die tiefer liegenden Bereiche zwi- sehen den Tragelementen berührt werden. Gegenüber dem Ausführungsbeispiel der Figur 3 a hat die Ausgestaltung mit einer Andruckrolle 22 den Vorteil, daß eine kontinuierliche Transportbewegung des Modulbandes mit den einzelnen Tragelementen 1 durchgeführt werden kann. Als vorteilhaftes Material für die Andruckrolle 22 als auch das Andruckkissen 21 sind vor allem Schaumstoff und Gummi in entsprechend not- wendiger Weichheit geeignet.A further embodiment variant of the pressure surface 20 is shown in FIG. 3 b. Here, the pressure surface is designed as a circumferential pressure roller 22, a counter-holder 23 in turn preventing the module belt from escaping in the direction of the force F. The distance from the center of the pressure roller 22 is dimensioned in this embodiment such that the lower areas between the support elements are also touched. Compared to the embodiment of FIG. 3 a, the configuration with a pressure roller 22 has the advantage that a continuous transport movement of the module belt with the individual support elements 1 can be carried out. Foam and rubber with a correspondingly necessary softness are particularly suitable as advantageous material for the pressure roller 22 and the pressure pad 21.
Natürlich ist es denkbar, die Andruckvorrichtung für das erfindungsgemäße Verfahren mit speziellen zusätzlichen Merkmalen zu versehen. Erfindungswesentlich ist jedoch die Abstimmung der Materialeigenschaften der Andruckrolle bzw. des Andruckkissens im Hinblick auf die Materialeigenschaften der Vergussmasse für den IC-Baustein dahingehend, daß die Andruckfläche weicher ist als die Vergussmasse. Darüberhinaus ist es bei Verwendung einer Andruckrolle erforderlich, die Abmaße der Rolle den Abmessungen des Moduibandes, d. h. auf die Abmaße der zwischen den einzelnen „Hügeln" der einzelnen Trägerelemente liegenden Vertiefungen sowie auf die Geometrie der einzelnen Vergusshügel abzustimmen. Of course, it is conceivable to provide the pressure device for the method according to the invention with special additional features. Essential to the invention, however, is the coordination of the material properties of the pressure roller or the pressure pad with regard to the material properties of the potting compound for the IC module in such a way that the pressure surface is softer than the potting compound. In addition, when using a pressure roller, it is necessary to measure the dimensions of the roller to the dimensions of the modular belt, ie to the dimensions of the intermediate to match the individual "hills" of the individual support elements and the geometry of the individual casting hills.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
1 Tragelement1 support element
2 Tragkörper2 supporting bodies
3 IC-Baustein 4 Chipkarte3 IC module 4 chip card
5 Kontaktfläche5 contact surface
6 Schutzschicht6 protective layer
7 Klebeschicht7 adhesive layer
8 Trägerschicht 9 Klebebeschichtung8 carrier layer 9 adhesive coating
14 Aussparung14 recess
15 Anschlussdraht15 connecting wire
16 Bohrung16 hole
17 Spalt 18 Vertiefung17 gap 18 depression
19 Kragenbereich19 collar area
20 Andruckfläche20 pressure surface
21 Andruckkissen21 pressure pads
22 Andruckrolle 23 Gegenhalter 22 pressure roller 23 counter-holder

Claims

Patentansprüche claims
1. Trägerelement für einen IC-Baustein zum Einbau in eine Chipkarte mit einem plattenförmigen Tragkörper, an dessen einer vorderen Flachseite metallische Kontaktflächen und an dessen anderer rückseitigen Flachseite der IC-Baustein angeordnet sind, einer den IC-Baustein überdek- kenden Schutzschicht aus einem Vergußmaterial und einer an der Rückseite des Tragkörpers aufgebrachten Klebefläche zur Festlegung des Trägerelementes an der Chipkarte, dadurch gekennzeichnet, daß die Klebefläche als vollflächige Klebeschicht (7) die gesamte rückseitige Oberfläche des Trägerelementes (2) bedeckt.1. Carrier element for an IC module for installation in a chip card with a plate-shaped support body, on the front flat side of which metallic contact surfaces are arranged and on the other rear flat side of which the IC module is arranged, a protective layer covering the IC module from a potting material and an adhesive surface applied to the rear of the carrier body for fixing the carrier element to the chip card, characterized in that the adhesive surface covers the entire rear surface of the carrier element (2) as a full-surface adhesive layer (7).
2. Trägerelement für einen IC-Baustein nach Anspruch 1 , dadurch gekennzeichnet, daß die Klebeschicht (7) als mehrschichtige Laminatbeschichtung mit mindestens einer dem Trägerelement (2) zugewandten Klebebeschichtung (9) und mindestens einer die Klebebeschichtung (9) an der dem Trägerelement (2) abgewandten Seite abdeckende Trägerschicht (8) ausgeführt ist.2. Carrier element for an IC chip according to claim 1, characterized in that the adhesive layer (7) as a multilayer laminate coating with at least one of the carrier element (2) facing adhesive coating (9) and at least one of the adhesive coating (9) on the carrier element ( 2) carrier layer (8) facing away from the side.
3. Trägerelement für einen IC-Baustein nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Klebeschicht (9) aus einem Hot-Melt-Kleber aufgebaut ist.3. Carrier element for an IC chip according to claim 1 or 2, characterized in that the adhesive layer (9) is constructed from a hot-melt adhesive.
4. Trägerelement für einen IC-Baustein nach Anspruch 2, dadurch gekenn- zeichnet, daß die die Klebebeschichtung (9) abdeckende Trägerschicht4. Carrier element for an IC chip according to claim 2, characterized in that the carrier layer covering the adhesive coating (9)
(8) aus Silikon besteht. (8) is made of silicone.
5. Trägerelement für einen IC-Baustein nach Anspruch 2, dadurch gekennzeichnet, daß die die Klebebeschichtung (9) abdeckende Trägerschicht (8) aus Papier besteht.5. carrier element for an IC chip according to claim 2, characterized in that the adhesive coating (9) covering carrier layer (8) consists of paper.
6. Verfahren zur Herstellung eines Trägerelementes nach einem der An- sprüche 1 bis 5, dadurch gekennzeichnet, daß die vollflächige Klebeschicht (7) durch einen Anpreßvorgang mittels einer Andruckvorrichtung mit einer Andruckfläche (20) aus einem elastischen Material an dem Trägerelement (2) festgelegt wird, wobei die Andruckfläche (20) so nachgiebig ist, daß das Trägerelement (2) vollflächig mit seiner mit dem IC- Baustein (3) und der diesen bedeckenden Schutzschicht (6) versehenen6. A process for producing a carrier element according to one of claims 1 to 5, characterized in that the full-surface adhesive layer (7) is fixed to the carrier element (2) by a pressing process by means of a pressure device with a pressure surface (20) made of an elastic material is, the pressure surface (20) is so resilient that the support element (2) with its full surface with the IC module (3) and the protective layer covering this (6)
Rückseite in die Ändruckfläche (20) eintauchen kann.Back can dip into the print surface (20).
7. Verfahren nach Anspruch 6 zur Herstellung eines Trägerelementes, dadurch gekennzeichnet, daß die Andruckfläche (20) aus Schaumstoff hergestellt ist.7. The method according to claim 6 for the production of a carrier element, characterized in that the pressure surface (20) is made of foam.
8. Verfahren nach Anspruch 6 zur Herstellung eines Trägerelementes, dadurch gekennzeichnet, daß die Andruckfläche (20) aus Gummi hergestellt ist.8. The method according to claim 6 for producing a carrier element, characterized in that the pressure surface (20) is made of rubber.
9. Verfahren nach einem der Ansprüche 6 bis 8 zur Herstellung eines Trägerelementes, dadurch gekennzeichnet, daß die Andruckfläche (20) als Andruckkissen (21) gestaltet ist.9. The method according to any one of claims 6 to 8 for the production of a carrier element, characterized in that the pressure surface (20) is designed as a pressure pad (21).
10. Verfahren nach einem der Ansprüche 6 bis 8 zur Herstellung eines Trägerelementes, dadurch gekennzeichnet, daß die Andruckfläche (20) als Andruckrolle (22) gestaltet ist.10. The method according to any one of claims 6 to 8 for producing a carrier element, characterized in that the pressure surface (20) is designed as a pressure roller (22).
11. Verfahren nach Anspruch 10 zur Herstellung eines Trägerelementes, da- durch gekennzeichnet, daß die Andruckrolle (22) einen Durchmesser von 10 - 40 mm aufweist. 11. The method according to claim 10 for the production of a carrier element, characterized in that the pressure roller (22) has a diameter of 10-40 mm.
PCT/DE2000/002018 1999-06-29 2000-06-27 Support element for an integrated circuit module WO2001001341A1 (en)

Priority Applications (2)

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EP00951232A EP1105838A1 (en) 1999-06-29 2000-06-27 Support element for an integrated circuit module
AU64253/00A AU6425300A (en) 1999-06-29 2000-06-27 Support element for an integrated circuit module

Applications Claiming Priority (2)

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DE19929912.9 1999-06-29
DE19929912A DE19929912A1 (en) 1999-06-29 1999-06-29 Carrier element for an IC chip

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FR2826154B1 (en) * 2001-06-14 2004-07-23 A S K CHIP CARD WITHOUT CONTACT WITH AN ANTENNA SUPPORT AND CHIP SUPPORT OF FIBROUS MATERIAL
DE10147140A1 (en) * 2001-09-25 2003-04-17 Giesecke & Devrient Gmbh Chip card with display
DE10203827C2 (en) * 2002-01-31 2003-12-18 P21 Power For The 21St Century PCB arrangement and electrical component
DE10327746A1 (en) 2003-06-18 2005-01-05 Giesecke & Devrient Gmbh Method for fixing a coating on a carrier tape
EP3836010A1 (en) 2019-12-12 2021-06-16 Fingerprint Cards AB A biometric sensor module for card integration

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DE19929912A1 (en) 2001-01-18
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