WO2000073712A3 - Verfahren und vorrichtung zur gestaltung von thermoschenkeln mit schaumstrukturanteilen - Google Patents
Verfahren und vorrichtung zur gestaltung von thermoschenkeln mit schaumstrukturanteilen Download PDFInfo
- Publication number
- WO2000073712A3 WO2000073712A3 PCT/DE2000/001728 DE0001728W WO0073712A3 WO 2000073712 A3 WO2000073712 A3 WO 2000073712A3 DE 0001728 W DE0001728 W DE 0001728W WO 0073712 A3 WO0073712 A3 WO 0073712A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermobranches
- thermoelectric
- foam structure
- thermoelectrical
- strips
- Prior art date
Links
- 239000006260 foam Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 abstract 3
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000012072 active phase Substances 0.000 abstract 1
- 239000006262 metallic foam Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 abstract 1
- 239000011148 porous material Substances 0.000 abstract 1
- 230000003362 replicative effect Effects 0.000 abstract 1
- 230000005619 thermoelectricity Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00945576A EP1144920A2 (de) | 1999-06-01 | 2000-05-30 | Verfahren und vorrichtung zur gestaltung von thermoschenkeln mit schaumstrukturanteilen |
AU59630/00A AU5963000A (en) | 1999-06-01 | 2000-05-30 | Method and device for forming thermobranches containing a foam structure |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19925960.7 | 1999-06-01 | ||
DE19925960A DE19925960A1 (de) | 1998-12-04 | 1999-06-01 | Thermoschenkel mit Schaumstrukturanteil |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000073712A2 WO2000073712A2 (de) | 2000-12-07 |
WO2000073712A3 true WO2000073712A3 (de) | 2001-08-23 |
Family
ID=7910458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/001728 WO2000073712A2 (de) | 1999-06-01 | 2000-05-30 | Verfahren und vorrichtung zur gestaltung von thermoschenkeln mit schaumstrukturanteilen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1144920A2 (de) |
AU (1) | AU5963000A (de) |
WO (1) | WO2000073712A2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114315353A (zh) * | 2021-12-30 | 2022-04-12 | 吉林大学 | 一种P型(Bi,Sb)2Te3基多孔热电材料的可控制备方法 |
CN115188877A (zh) * | 2022-07-27 | 2022-10-14 | 武汉理工大学 | 一种制备强织构和高热电性能柔性热电薄膜的方法 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0339715A1 (de) * | 1988-04-27 | 1989-11-02 | Theodorus Bijvoets | Thermoelektrische Anordnung |
JPH02106079A (ja) * | 1988-10-14 | 1990-04-18 | Ckd Corp | 電熱変換素子 |
EP0455051A2 (de) * | 1990-04-20 | 1991-11-06 | Matsushita Electric Industrial Co., Ltd. | Vakuumisolierter thermoelektrischer Halbleiter bestehend aus einer porösen Struktur und thermoelektrisches Bauelement |
JPH043475A (ja) * | 1990-04-20 | 1992-01-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH04199858A (ja) * | 1990-11-29 | 1992-07-21 | Matsushita Electric Ind Co Ltd | 電子冷却パネル |
US5275001A (en) * | 1991-10-07 | 1994-01-04 | Matsushita Electric Industrial Co., Ltd. | Thermoelectric cooling device |
US5411599A (en) * | 1993-09-20 | 1995-05-02 | The United States Of America As Represented The Secretary Of The Army | Thermoelectric device utilizing nanoporous material |
US5525162A (en) * | 1995-06-26 | 1996-06-11 | The United States Of America As Represented By The Secretary Of The Army | Thermal conductivity enhancement technique |
JPH08335721A (ja) * | 1995-06-08 | 1996-12-17 | Isuzu Motors Ltd | ポーラス状熱発電素子の製造方法 |
JPH0969653A (ja) * | 1995-08-31 | 1997-03-11 | Isuzu Motors Ltd | 熱電材料及びその製造方法 |
JPH1041556A (ja) * | 1996-07-25 | 1998-02-13 | Mitsubishi Heavy Ind Ltd | 多孔質熱電半導体及びその製造方法 |
-
2000
- 2000-05-30 EP EP00945576A patent/EP1144920A2/de not_active Withdrawn
- 2000-05-30 AU AU59630/00A patent/AU5963000A/en not_active Abandoned
- 2000-05-30 WO PCT/DE2000/001728 patent/WO2000073712A2/de active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0339715A1 (de) * | 1988-04-27 | 1989-11-02 | Theodorus Bijvoets | Thermoelektrische Anordnung |
JPH02106079A (ja) * | 1988-10-14 | 1990-04-18 | Ckd Corp | 電熱変換素子 |
EP0455051A2 (de) * | 1990-04-20 | 1991-11-06 | Matsushita Electric Industrial Co., Ltd. | Vakuumisolierter thermoelektrischer Halbleiter bestehend aus einer porösen Struktur und thermoelektrisches Bauelement |
JPH043475A (ja) * | 1990-04-20 | 1992-01-08 | Matsushita Electric Ind Co Ltd | 電子部品 |
JPH04199858A (ja) * | 1990-11-29 | 1992-07-21 | Matsushita Electric Ind Co Ltd | 電子冷却パネル |
US5275001A (en) * | 1991-10-07 | 1994-01-04 | Matsushita Electric Industrial Co., Ltd. | Thermoelectric cooling device |
US5411599A (en) * | 1993-09-20 | 1995-05-02 | The United States Of America As Represented The Secretary Of The Army | Thermoelectric device utilizing nanoporous material |
JPH08335721A (ja) * | 1995-06-08 | 1996-12-17 | Isuzu Motors Ltd | ポーラス状熱発電素子の製造方法 |
US5525162A (en) * | 1995-06-26 | 1996-06-11 | The United States Of America As Represented By The Secretary Of The Army | Thermal conductivity enhancement technique |
JPH0969653A (ja) * | 1995-08-31 | 1997-03-11 | Isuzu Motors Ltd | 熱電材料及びその製造方法 |
JPH1041556A (ja) * | 1996-07-25 | 1998-02-13 | Mitsubishi Heavy Ind Ltd | 多孔質熱電半導体及びその製造方法 |
Non-Patent Citations (6)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 014, no. 320 (E - 0950) 10 July 1990 (1990-07-10) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 146 (E - 1188) 10 April 1992 (1992-04-10) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 530 (E - 1287) 30 October 1992 (1992-10-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 04 30 April 1997 (1997-04-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 06 30 April 1998 (1998-04-30) * |
Also Published As
Publication number | Publication date |
---|---|
WO2000073712A2 (de) | 2000-12-07 |
EP1144920A2 (de) | 2001-10-17 |
AU5963000A (en) | 2000-12-18 |
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