AU5963000A - Method and device for forming thermobranches containing a foam structure - Google Patents
Method and device for forming thermobranches containing a foam structureInfo
- Publication number
- AU5963000A AU5963000A AU59630/00A AU5963000A AU5963000A AU 5963000 A AU5963000 A AU 5963000A AU 59630/00 A AU59630/00 A AU 59630/00A AU 5963000 A AU5963000 A AU 5963000A AU 5963000 A AU5963000 A AU 5963000A
- Authority
- AU
- Australia
- Prior art keywords
- thermobranches
- forming
- foam structure
- foam
- thermobranches containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19925960A DE19925960A1 (en) | 1998-12-04 | 1999-06-01 | Process for structuring thermo-branches with foam structural parts comprises placing layers of indifferent metallic foams or non-metallic foams of sufficient electrical conductivity above and below compact or thin layers of a thermoelectric |
DE19925960 | 1999-06-01 | ||
PCT/DE2000/001728 WO2000073712A2 (en) | 1999-06-01 | 2000-05-30 | Method and device for forming thermobranches containing a foam structure |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5963000A true AU5963000A (en) | 2000-12-18 |
Family
ID=7910458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU59630/00A Abandoned AU5963000A (en) | 1999-06-01 | 2000-05-30 | Method and device for forming thermobranches containing a foam structure |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1144920A2 (en) |
AU (1) | AU5963000A (en) |
WO (1) | WO2000073712A2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114315353A (en) * | 2021-12-30 | 2022-04-12 | 吉林大学 | P type (Bi, Sb)2Te3Controllable preparation method of porous thermoelectric material |
CN115188877A (en) * | 2022-07-27 | 2022-10-14 | 武汉理工大学 | Method for preparing flexible thermoelectric film with strong texture and high thermoelectric performance |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8801093A (en) * | 1988-04-27 | 1989-11-16 | Theodorus Bijvoets | THERMO-ELECTRICAL DEVICE. |
JPH02106079A (en) * | 1988-10-14 | 1990-04-18 | Ckd Corp | Electricity heat conversion element |
JP2862998B2 (en) * | 1990-11-29 | 1999-03-03 | 松下電器産業株式会社 | Electronic cooling panel |
DE69130654T2 (en) * | 1990-04-20 | 1999-08-12 | Matsushita Electric Ind Co Ltd | Vacuum-insulated thermoelectric semiconductor consisting of a porous structure and thermoelectric component |
JP2936174B2 (en) * | 1990-04-20 | 1999-08-23 | 松下電器産業株式会社 | Electronic components |
US5275001A (en) * | 1991-10-07 | 1994-01-04 | Matsushita Electric Industrial Co., Ltd. | Thermoelectric cooling device |
US5834828A (en) * | 1993-09-20 | 1998-11-10 | The United States Of America, As Represented By The Secretary Of The Army | Nanoporous semiconductor material and fabrication technique for use as thermoelectric elements |
JPH08335721A (en) * | 1995-06-08 | 1996-12-17 | Isuzu Motors Ltd | Method of manufacturing porous thermal generator element |
US5525162A (en) * | 1995-06-26 | 1996-06-11 | The United States Of America As Represented By The Secretary Of The Army | Thermal conductivity enhancement technique |
JPH0969653A (en) * | 1995-08-31 | 1997-03-11 | Isuzu Motors Ltd | Thermoelectric material and its manufacturing method |
JPH1041556A (en) * | 1996-07-25 | 1998-02-13 | Mitsubishi Heavy Ind Ltd | Porous thermoelectric semiconductor and its manufacture |
-
2000
- 2000-05-30 AU AU59630/00A patent/AU5963000A/en not_active Abandoned
- 2000-05-30 WO PCT/DE2000/001728 patent/WO2000073712A2/en active Application Filing
- 2000-05-30 EP EP00945576A patent/EP1144920A2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1144920A2 (en) | 2001-10-17 |
WO2000073712A2 (en) | 2000-12-07 |
WO2000073712A3 (en) | 2001-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |