EP1144920A2 - Method and device for forming thermobranches containing a foam structure - Google Patents

Abstract

The invention relates to novel thermobranches (7) containing a foam structure and to novel assemblies resulting from the same in thermoelectrical strips (28) which have a foamed boundary layer, in pressure-contacted thermoelectrical strips (32) and to conventional types of connections which involve thermobranches (11) having a foam structure throughout, assembled thermobranches (12) and integrated active-passive thermobranches (14). Said assemblies and connections enable the optimised use of the thermoelectric potential of already conventional semiconductor materials and of semiconductor materials which have hitherto not been able to be used as thermoelectric materials (3) and provide a high degree of thermoelectric efficiency. The entire content of the foam structure is provided with homogenous or differentiated portions of an active phase and is capable of minimising the waste thermal currents (8) which reduce the degree of efficiency. The invention also relates to accompanying and replicating methods, effective in this field, for optimising the thermoelectric active phases (30) in closed pore structures consisting of non-metallic foams (31) or a sinter structure which are in the process of being formed or hardened. The invention can be used both for generating thermoelectricity and in Peltier technology.

Description

Method and device for the design of thermo-legs with foam structure parts area performance and efficiency of continuously dense thermo-legs (7) made of various thermoeletrics (3) according to the prior art

A solar primary supply of approx. 800 watts per square meter is still deprived of approx. 750 watts by the heat losses (8) and radiating recombination heat of current, commercially available thermoelectric modules (1) and about 50 watts are supplied by a square meter of sunlit area on the potential rails of the electricity supplying overall system. In the meantime, thermoelectric, high specific area performances with efficiencies up to almost 7% are achieved with the latest thermocouples with non-focused solar radiation. A module measuring 23 cm x 13 cm x 8 cm with a throughput of 75 ml / s throughput of a thermally delivering, fluid thermal exchange medium flowing in at 250 degrees Celsius and 38 ml of a thermally dissipating thermal exchange medium flowing in at 20 degrees Celsius generate a maximum of 175 watts Continuous power generated at 15.2 volts working voltage. The efficiency is 5.5%. This would require 3182 watts of solar power, i.e. an approx. 2 x 2 m large solar irradiation surface, with which heat-trapping technology could be used to achieve over 250 degrees Celsius. Inlet temperatures of 200 degrees Celsius enable 125 watts of power with a lower required flow rate of the thermal exchange media. Despite the high energy density, the efficiency is only 3.7%.

State of the art in terms of heat loss reduction in continuously sealed thermo-limbs (7) with multiphase alloys made from bismuth-antimony tellurides

Worldwide developments have brought new thermoelectrics (3) with higher values of the figure of merit and corresponding effects. This was achieved by modifying the thermoelectrics (3) of the basic bismuth / antimontelluride / selenide variants, to which other metal and semimetal components were added in such proportions and changed doping, that thermoelectric multiphase alloys were formed, which are the result of disordered and disordered grain boundaries between many matrix crystallites with some electrically highly conductive transition phases in these grain boundary areas. These new, structured structures of the alloy components bring about a substantial reduction in the thermal conductivity with some determined, detailed proportions, with little reduced, the same, in rare cases improved values of the electrical conductivities and / or differential thermal forces. The resulting improved values of the "figure of merit" (quality factor of the thermoelectric conversion), which can be adjusted to certain operating temperature ranges, are consequently a fundamental result of the "calibrated" disorder that the Franz-Wiedemann law of close correlation of electrical and thermal conductivity in limited its dominant effect. However, these thermoelectrics (3) are heavier than average and very expensive. This affects the price of the finished modules accordingly. According to the new state of the art, thermo-electric arrangements with thermo-limbs (7), which are composed of a central, foamed passive leg part (4) with 2 terminal active leg parts (2). The foamed passive leg parts (4) are specified foamed structures that, starting from natural carbon matrix (charcoal) or from cold-start coked, organic compounds, obtained through metal foaming up to electrically conductive plastic foam structures - with varied contact types described below terminal active leg parts (2). Through thermal wood degassing producible, foamed passive leg parts (4) allow the omission of a real technologically controllable foaming process and are therefore an immensely inexpensive, inventive basic element in itself, which can also be advantageously combined with functional elements of the thermoelectric arrangements. Such carbon frameworks in stucco or as physical compression of the granulate / powder allow the varant-rich, final active leg contact to highly efficient vapor phase transport thin-layer technology on their surface. The final applied, active thermal parts (2) are alternating from the p- and n- Conductivity type and form thermoelectromechanically active p / n and n / p transitions directly against one another or via intermediate contacts. In this way, it is possible to arrange voltage-adding, electrically arranged in series and thermally parallel thermoelectric elements (6) to form flat modules that can be used as Seebeck or Peltier blocks made of suitable materials based on the powder-metallurgical model proposed. All porous and foam structures that can be obtained in this way and in a different manner, which reduce heat loss, can gradually have components of the lower layers near the surface that optimize electrical conductivity and / or such coatings on their surfaces up to the ability to form thermal EMF According to the state of the art, the active leg parts (2) can be anchored and anchored using technically professional application methods on these and partly in these structures of the passive leg parts. As a result of the high thermal insulation of the central passive leg part with the above-mentioned structures, thermoelectrics (3) with high thermal conductivity can be used for the thermal legs (7) to be manufactured. The following invention relates now to this new - and additional - state of the art to the basic, central insertion of a passive leg part in a new generation of thermal legs (7) and adheres to the final contacting of active leg parts (2), the structures of As an extension, passive leg parts primarily represent closed-cell, metallic and non-metallic foam structures. These are therefore referred to in the simplest form as foamed passive leg parts (4). Various foam processes for non-metallic foams (31) allow a varied, adaptable palette for the design of thermal legs (7) and special conductive lacquers allow the formation of dense active leg parts (2) and passive leg parts with differentiated foam structures and, consequently, different names. Foam-structured thermo-limbs (7) with a differentiated structure of the foam structure allow new types of thermoelectric arrangements which are described and described below in their structure.

Proposals for the design of thermo-limbs (7) with a foam structure component for efficiency-reducing heat loss. Comprehensive cost minimization for thermoelectics and weight reduction in thermoelectric arrangements. Metallic foams (10) offer the possibility of producing thermo legs (7) with a foam structure component. The laboratory-scale production of foamed aluminum was first achieved in a space staton and then also under normal gravity conditions. The production of metallic foams (10), which is also possible in series, permits the processing of thermoelectroactive metals. Their thermo-octave degree of goodness (figure of merit) is decisively improved because the throughput of heat losses (8) actually fails.

The so-called spattering on the surface of a solidifying silver casting after the melting phase has long been an unwanted side effect of escaping, dissolved oxygen and thus one of the first indications the possible manufacturability of metallic foam (10). The sparring can only be prevented by keeping air containing oxygen away during the melting phase. With metal foaming, it is necessary to keep gas bubbles in a homogeneous distribution in a metal liquid phase, at least briefly, until the solidification stabilizes a foam structure. This challenge is currently being tackled. From today's perspective, the now fully manageable regime of continuous metal foaming is a necessary starting point for a new generation of materials, which is important for example for crack-resistant, torsion-free lightweight car bodies, support, load-bearing and torsion-stressed elements for static and dynamic stresses. An essential aspect of metallic foams (10), in addition to their strength and lightness, is the optimization of a maintainable, high dielectric conductivity, which is claimed for thermoelectric applications and which is claimed in accordance with the invention, with the development of thermal currents in now highly heat-insulating metallic structures (see claim 1). In particular, highly closed-cell foamed metals, electrically conductive semimetals, semiconductors, intermetallic compounds or intermediate phases that already have high, differential thermal forces or even known thermoelectrics (3) must be taken into account for a significant increase in the efficiency of thermoelectric conversion that can be achieved by reducing heat loss. These thermoelectrics (3) have different suitabilities for the production of continuously foamed thermo-limbs (11) or composite thermo-limbs (12) or integrated active-passive thermo-limbs (14), which are defined below in terms of the method and the device (see claims 1 and 2). Continuously foamed thermal leg (11) (claim 4. Figure 1)

They are the simplest thermal legs (7) with a foam structure component, from which the more demanding forms of the integrated active-passive thermal legs (14) with differentiated foam structures are derived (see claim 8) and to which they can be added in part or in full, depending on suitability and cost of the thermoelectric material (3) which has already been foamed in the same cell size. The costs are reduced in the typical method for integrated active-passive thermo-limbs (14) with inductive and dielectric working components and a foamer (33) (see claim 8).

The simple forms consist of metallic foams (10) or structures obtained by sintering pre-inflated, electrically conductive particles with surface-encrusted thermoelectrics (3) or sufficiently porous coal framework structures, with or without oxidized carbonized celluloses, sugar or proteins, with previously distributed, afterwards zonally fixed, inner, thermoelectroactive grain sizes (17) form thermoelectroactive zones (34). Continuously foamed thermo-limbs (11), however, mostly consist of a previously compact thermoelectric (3), which was foamed in closed cells with the same cell size throughout and in this thermal process there are difficulties with regard to component-differentiated foaming (27) due to the formation of poorly conductive or brittle, intermetallic intermediate layers or others property deteriorating processes would result. In addition, there are effective formulation recipes for non-metallic foams (31), which, however, only result in correctly structured conductance-optimized, possibly even density-differentiated foam structures in a homogeneous material composition via dielectric heating - with layer-differentiated addition of certain necessary active phase components for component-differentiated foaming (27) however, there would be very negative segregation or internal corrosion zones. It is left to professional action to find out which formulation recipes are suitable for which type of foaming. For the purpose of obtaining geometrical installation shapes from continuously foamed Thermos legs (11) in thermoelectric modules (1) are obtained by suitable cutting of the finished foamed thermoelectric element (3). When the surface of the cut foam surface is properly contacted with other thermoelectrics (3), the temperature differences between separate, thermally parallel contact points additively increase Thermo-EMK developed The geometric shape comes from a suitable vertical cut, which in this type and composition is simply foamed - at most subsequently, superficially, density-modified foam structure surfaces (Ansintem metallic foams with flame arc or laser under protective gas) It is now possible to have open-pore modular toothing profiles on the surface (claim 14 , 4, FIG. 3b) are cut out mechanically or with a laser, which are then gently pore-smeared with indifferent conductive lacquer (18), and with the interposition of an indifferent metal foil ( 38) are pushed into one another. An external guide and a thermally optimized cross-sectional area reinforcement with an equally optimized thermal trapping surface yields an advantageous, functional warm-cold control device (21). According to the features of claims 1 and 4, these two types of contacting are used as cementing profile contacts (39) and thermal Guide profile contacting (40) with possible application for all thermal legs (7) in thermoelectric power generation plants and alternative Peltier plants designated and claimed (see claim 14, 4, Figure 3b)

There is another way of achieving electrically conductive structures that allow hardly any thermal compensation, by freeing ash-free organic substances as far as possible or in limited volumes.The allocation amount of volume within which the porosity or closed cell structure of the remaining coal structure can be graduated remains left to professional action. At least dense carbon surfaces and a more porous interior structure can be achieved - even subsequently by thermal surface treatment in rich gases

Possibilities of thermal or oxidative cold start coking (36) for the purpose of obtaining property-analogous coal framework structures for continuously foamed thermal bars! (11) (Claim 4) The oxidant cold start coking (36) uses a propellant-like burn-off of organic substances, the admixed oxygen supplier of which leaves no salts and which, in reduced admixture, only allows partial oxidation of the batch mixture to the effect that a degassed carbon scaffold remains. Since this is possible out of the "cold phase", for example by glow wire or stoppinundundiπg, the inventive name oxidant cold start coking (36) is chosen. The non-metallic foam (31) obtained by means of oxidative cold start carbonization (36) or thermal carbonization, because of its structure The possibility of component-differentiated training is a kind of foam-structured carbon skeleton, with the possibility of forming conductivity-optimized intermediate areas (35) and electrothermally active end zones (34). It can also be added to thermoelectric arrangements of Seebeck or Peltier blocks by cementing profile contacting (39) or thermal guide profile contacting (40) (See claims 4 and 14, FIG. 3b) There is also the possibility of building up a mosaic of large carbon skeleton blocks by means of joint coaling (41), in which coal structure segments (42) are joined with suitable carbonizable glues and an in ductile resistance heating or other suitable thermal input in the joints of the assembled structural segments (42) converts the glue-filled joint into a connecting intermediate carbon structure layer (43). Ultimately, current-carrying carbon fibers in the glue-pressed joints can gently effect thermal dissociation through localized resistance heating to form the intermediate carbon structure layer (43). Finally, a partial or continuous cementing with indifferent conductive varnish (18). The strengths of the carbon skeleton dressings required for thermoelectric modules (1) can be adequately varied, depending on the starting materials and professional action, to cement hard and hard. In the single rod version with metallic (10) and non-metallic foams (31), contacting bridge sink electrodes (13) convey the thermal current (5) through the entire series connection of the thermoelectric module (1). They can be seen in the end face-contacted, charge carrier-collecting, thermoelectrically indifferent collector hoods (15), which in this way implement the p / n and n / p transitions of the continuously foamed thermal legs (11) (see claims 4 and 5 in FIG. 1). According to its function, the indifferent collector hood (15) is primarily a suitably "comprehensively shaped" application hardened, non-positively cemented in the pores, indifferent conductive varnish (18), which is thermally and electrically highly conductive and electrically / thermally further contacting, connections for the preceding and subsequent ones End faces of continuously foamed thermo-legs (11) permitted. In this respect, the connection of single rod shapes is made possible by means of bridge electrodes (13) (FIG. 1) designed with this, optionally provided with conductive reinforcements (wires), or which permit direct connections of arched or angled shapes that can be achieved by means of conductive lacquer cementing (see claims 4 and 5) The collector hood (15) can be internally armored in accordance with the design with outstanding thermally-inserting hot-cold conduction devices (21) (see claims 4 and 5 in FIG. 1).

Active leg parts (2) (claims 6. 2. 7. Figure 3a)

They consist of primarily dense, conductively cemented disks or layers of Theπnoelektπka (3), which can be metals, intrinsically conducting element semiconductors, compound semiconductors, intermetallic compounds or intermediate phases, multi-phase alloys or other suitable ones or their suitable, so-called thermoelectroactive grain sizes (17) in an electrically conductive embedding made of hardened, thermoelectrically indifferent conductive varnish (18), this physical connection of the active leg part (2) receiving thermoelectical potential on the surfaces of the internal thermoelectroactive grain sizes (17), added to the thermoelectric arrangement and further contacted and therefore as a thermoelectric collector (19) ) from thermo-electroactive conductive varnish (16) is called Foamed passive leg parts (4) (claim 6. Figure 3a)

They are the middle to predominant part of thermo-legs (7) with the function of a substantial improvement in the efficiency of the entire thermoelectric arrangement as a block of Seebeck or Pelter elements. You contact the final active leg parts (2) They consist of thermoelectric, indifferent, primarily foamed, metallic and non-metallic material components with high electrical conductivity, in the form of metallic (10) or non-detailed foam (31), whereby a final density differentiation of the primarily closed foam structure is available The optimized foam structure of the foamed passive leg parts (4) provides a heat resistance value that is several times higher, with significantly less loss of electrical permeability and thus the ability to drastically reduce the heat losses (8). Assembled thermo-limbs (12) (see claim 7. FIG. 3a) consist of so-called, two end active leg parts (2) which contact a central, foamed passive leg part (4). The foamed, at the same time thermoelectrically, indifferent passive leg part (4) has the task of minimizing heat loss heat transfer, while maintaining the highest possible electrical conductivity. So it develops no or only very little of its own thermoelectric voltages. From Thermoelectrics (3) existing active leg parts (2) form n / p and p / n transitions with one another with the task of developing thermal currents (5) when exposed to temperature gradients suitably applied to them. They are as intervals or thin slices of natural or synthesized thermoelectrics (3), e.g. B. cut pyrite and Chalkopyπtscheiben with the end faces of the foamed passive leg parts (4) and on the other hand contacted. The homogeneous surface contact takes over gap-filling, hardening, indifferent conductive varnish (18). In order to achieve intensive heat input, the cut plastic discs of natural and or synthetic thermoelectrics (3) are connected to thermally concentrating end areas, accordingly thermally entering surfaces on the external plastic disc surface, which subsequently has a transition to bridge electrodes (13) (see FIG. 3a) these are shaped into surface-shaped warm-cold guide emulsions (21). The constructive solution of the thermal entry, which is made in the thermal guide profile contact (40) proposed according to the invention, can also be derived here in an exemplary manner (see claims 4, 14, FIG. 3b). There are further analogue further contacting methods, such as for continuously foamed thermo-legs (11), e.g. B. with thermoelectroactive collector hoods (19) as active leg parts (2) (see claim feature in claims 6 and 7)

Integrated active-passive thermo-limbs (14) result in density (23) and component-differentiated foaming (27) (claim 8, FIGS. 3b and 4)

For thermoelectric applications long recognized, because of their high thermal conductivity only partially suitable, therefore disregarded metals, can be used by the metal foam according to the inventive and procedural proposals as interesting and effective thermoelectrics (3) again. They are foamed in a suitably thick layer in such a way that in the end area in front of the two opposite surfaces of the formed layer of metallic foam (10) they pass into a substantially denser to foam-free state, which can be soldered, welded (also with ultrasound) or mechanical frictional contact. The denser structures close to the surface enable (see claim 14, claim feature contact anchor claw (22)). The density-differentiated foaming (23) of metals and non-metals is the result of a regime for microwave and induction alternating fields, the proportionate dielectric heating of non-conductive or resistance heating components in conductive cause the still dense green runs. A supplementary barometric and acoustic auxiliary regime may trigger the triggering and intermediate stabilization of the rising foam in the ready-to-blow, ready-to-hold phases. In claim 10, the components of the control regimes and their mechanisms of action are named and explained. With the same or modified technical apparatus, a reformation that is still in the hot phase is carried out because the foam structure cell walls can still be polarized active phases (see claim 15). Then the total layer of metallic foam (10) obtained by density-differentiated foaming (23) - in this differentiated, closed-line structure, as descriptive as it can be - is cut lengthways and crossways in active-passive thermo-limbs (1) integrated into so-called rod shapes, such as this is normally necessary for favorable current voltage behavior in thermoelectric arrangements. Accordingly, integrated active-passive thermo-limbs (14) that can be obtained from metallic foams (10) are characterized by 100% material content of thermoelectric material (3) - apart from drinking water deposits in open-pore penetration areas of cut contacting surfaces - predominantly as metal, which with a densifying closed-cell structure of the metallic foam (10) into a fine-pored, near-surface, denser until ductile phase under the The final cover areas are transferred to this. In addition, a step-by-step three-zone build-up of integrated thermal shells (14) is possible by attaching and foaming three-layer green base layers for non-metallic foam structures, which are characterized by a central, conductance-optimized intermediate area (35) with a responsible through-contacting active phase (26), which merges into top and bottom electrothermal end zones (34). According to the invention, this method is referred to as component-differentiated foaming (27) (see claim 11). It saves large amounts of thermoelectrics (3) in the series production of thermoelectric modules (1). The terminal top surfaces are contacted with the aforementioned electrical / mechanical cementing connection methods in a manner analogous to that of continuously foamed thermo-limbs (11) by means of indifferent collector hoods (15), conductive lacquer-bonded bridge electrodes (13) to p / n and n p transitions and with analog heat Cold guide devices (21) (see claim 5 derived from designs in Figures 1 and 3). For integrated active-passive thermo-limbs (14), straight or curved or angled shapes are claimed, as in the above-mentioned embodiments (see claim 7). An advantageously applicable contact into which the dense foam upper structures penetrate, non-positive and solderable contacting is that with pre-tinned contact anchor claws (22) in the case of metal-foamed integrated active-passive thermal limbs (14) (see claim 14, FIG. 4). The contact anchor claws (22) can also To be coated with a layer of titanium / silver / palladium that is indifferent in all respects. In the case of non-metallic foams (31), capillary penetrating, later hardening inductive conductive lacquer (18) takes over the role of tin. For this purpose, the foam structure surface with the contact anchor claw (22) is pre-pierced, wetted and then permanently clawed.

The differentiated boundary layer foam (29) for producing thermoelectric strands (28) (claims 13, 23, 27, FIG. 5)

According to the features of claim 13, a technically sophisticated, technically demanding method is proposed, which provides for an expansion of the dense differentiated foaming (23) to the differentiated boundary layer foaming (29) of thermoelectroactive metal pairings, which can be realized within the framework of controllable, technical push-through methods. that a dimensionally stabilized, dense strand of previously primarily ultrasonically welded, cemented, glued or pressure-contacted, prismatic or suitable cross sections of intervals of successive, metallic - or other suitable for this process - thermoelectrics (3) is pushed through suitable medium to high-frequency induction fields, which are of a high intensity - and frequency-regulating regime for induction-melt-foam hood, dielectric heating, pressure surrounding protective gas atmospheres and frequency shaking by at For example, mechanically guided sound frequencies from alternating current-applied, vibrating plungers in annular gaps are subject to strong permanent magnets. As a result of regime control for selectable foam structures - regarding the proportions of dielectric and inductive energy input - the strand to be pushed through, composed of the intervals of the thermoelectrics to be paired (3), under reckoning and diameter increase, finally, a continuous, gradually adjustable, density-differentiated foaming in such a way that optimal p / n and n / p transitions and their simultaneous connection in series result. If the extruded green sheet intervals for extrusion-linkable thermocouples (7) are applied according to the three-layer method, the strand to be foamed has the advantage of component-differentiated foaming (27) with conductance-optimized intermediate area (35) and thermoelectroactive end zones (34) (claims 13, 11 , Figure 5). The thermal entry for the p / n and n / p transitions of the strand-like arrangement is carried out by intermediate contacts tating, completely in the foam composite, fine-pored to dense, thermally electrically highly conductive, but indifferent zones, the strands laterally outwards - each offset by 180 degrees - in widening and extended warm-cold guiding devices (21) with Teflon coating (see claim 13, Figure 5). In FIG. 5, a purely thermally transmitting ring contact is shown for the thermal contacting of the indifferent zone, which mutually continues outward into the outer thermally inputting surface areas of the warm-cold conduction device (21) constructed in this way. The alternating arrangement carried out in this way can offer temperatures tap, convert in the thermocouple transitions to electrical power and offer at the strand ends of the so-called thermoelectric strand (28) over already noteworthy working voltages down to the ten-volt range. With a simple crafting method, adaptable cuts and flat series connections of any working voltages can be realized, which are possible with Pyπt / Chalkopyπt -Thermal pairs or galena-homojunctions with a few thermoelectric strands (28) reach the voltage values of car batteries.

Pressure-contacted thermoelectric strands (32) (claim 13 derived from Figure 5) They are basically the same in structure, but allow the replacement of various thermal legs (7) with and without a foam structure portion. They present a veritable modular system that can always be repacked and then pressure-contacted within a tube without interference. The indifferent, the p / n and n / p transitions between contacting, strangiπner surfaces of the warm-cold guide devices (21) are provided on both sides with thin layers of conductive rubber (37) or suitably designed, elastic, indifferent metal foils (38) , which give the axial pressure contact a taut resilient permanent component. Surface contacting of large cells. metallic foam (10Ϊ with impregnating alloy and contact anchor claws (claim 14 Figure 4)

If density-differentiated foaming (23) is not possible, but only homogeneously with the same cell size, the thermoelectrically indifferent Zmnbleilot or other easily flowing, thermoelectrically indifferent soft solder (silver-containing) can be introduced capillary into the flat-cut, open-pore cover surfaces of the finished cut blanks Blanks are accordingly already to be regarded as continuously foamed thermal legs (11), the ends of which only have to be made ductile and thus capable of contact by capillary tin solder receptacle. The thermal current (5) is carried on in addition to the types of contacting already mentioned and claimed, on the underside, non-positively into the tin-offset, end-flat foam structure three-dimensional or multi-dimensional penetrating, suitably shaped, pre-tinned contact anchor claws (22) which pass into a further strong wire suitable conductor material (mostly copper), which in conductive varnish a indifferent (15) or thermoelectroactive collector hoods (19) to be molded. A touch of silver, at least a gloss tinning is advantageous, since bare copper can develop all kinds of creeping signs of corrosion. The wafer-thin silver coating is ideal - but must be protected from air containing hydrogen sulfide before the conductive varnish bedding. In addition to simple, double-clawed contact anchor claws (22) as well as curved, possibly spiral, flexible bridge shapes, up to medium-sized heat sink shapes, perform an important multiple function in the extension with regard to the formation of the p / n and n / p transitions, full entry of thermal offers and flat, three-dimensional adaptability (see claim 14, FIG. 4). This type of tin-strengthening contact is therefore to be used for continuously foamed thermo-limbs (11) made of metallic (10) and non-metallic foams (31). Metal selection for the production of thermoelectroactive. metallic, cellular or density-differentiated foams (23) for continuously foamed thermal legs (11) with homogeneous active phase distribution and possible, dense embodiments of active leg parts (2) for composite thermal legs (12)

In contrast to current, conventional types according to the law, comparatively only extremely weak heat losses (8) can flow along the thermal legs (7) according to the invention with a foam structure component, since the foam structures oppose an extremely high thermal resistance compared to dense metals. They are approaching the K values of foam concrete because the cell walls can be made very thin - and based on this - very large inner surfaces. After all, the metallic foams (10) still have sufficiently high electrical conductivities. That makes them attractive thermoelectric applications again. These have so far failed due to the high heat losses (8) and the - sometimes modest - thermoelectric voltages. At the beginning of this century, for example, the Gülcher thermo column consumed 170 liters of illuminating gas per hour with an - albeit very reliable - continuous output of the 66 compact elements made of nickel / antimony alloy thermocouples of 12 watts at 4 volt working voltage. The connection in series resulted in a continuous short-circuit current of 6 amperes In addition, the device was able to noticeably heat up rooms, while electrical power requires a much smaller cross-section in the same way in order to be able to pass without loss. By removing the high thermal conductivities of ductile metals, excellent framework conditions remain for the thermoelectric use of the metallic foams (10). The following, long-proven metal pairings with the following thermal voltages (in millivolts) per 100 degrees Celsius temperature difference appear promising for the proposed embodiments of novel thermo-limbs (7) with a high percentage of foam structure:

Bismuth. . Constants. nickel

^' . 8.3. ,

11.5 11.3. • •

8.1. 5.2

6.7. 3.8

Titanium. . Antimony. .Iron

As a result of the thermoelectric modules (1) to be produced, the lengths of these continuously foamed thermal legs (11) can be selected to be significantly shorter (gain in electrical conductivity of the thermoelectric module) and thermal offers can be converted into electrical work with a high degree of efficiency. The contacting of the ends of the integrated active-passive thermal limbs (1) or of the other proposed variants with a metal foam structure component to form p / n and n / p transitions that generate thermostream can be carried out using the above-mentioned and all well-developed, conventional methods.

Electrical properties of ore grown, hydrothermally crystallized. natural compound semiconductors with regard to their use as thermo-electroactive grain sizes (171 as well as the intermetallic compounds and synthetic, semi-purifying elements and compounds These offer a huge selection of thermoelectrics (3) with far higher differential thermal forces. Metals have the highest concentrations of free electrons 10 ²² / cm ³ , but this is hardly temperature-dependent. There is little change in the amount of energy and speed of the electrons. Now, however, different energy, speed and concentration of the two charge carrier types - electrons and holes - are a strongly temperature-dependent characteristic of semiconducting compounds, which enable them far better than metals to form a potential between cold and hot contact points of the thermocouples made from them (see Figure 3a). For example, pyrite lumps with an effective charge carrier concentration of more than 10 ^ and a mobility of 200 cm ² / Vs or lumps of chalcopyrite or those made of galena (higher values) differentiate a strong, semiconductor-typical increase in their conductivities when heated. This is evidenced by the simple attempt to connect the shiny ore lumps (compound semiconductors) in series with a 12 volt car battery, a headlight bulb and some wire. The differential thermal force of a randomly selected pyrite lump in combination with normal copper wire was in the "actual" experiment described below on the intrinsic conductivities of differently crystallized pyrites and other diverse crystal forms of gravel, diaphragms and luster - in the range between 20 and 80 degrees Celsius at about twice that found below Table value of 130 microvolts / degrees Celsius. The conductivity test with a small crystalline, irregular chunk of pyrite now yields the following observation: When the circuit is closed, an initially weak current flows, which is sufficient only for the weak glow of a tungsten filament, but at the same time for the temperature of the surrounding, tip-contacted pyrite surface. Finally, the headlamp bulb suddenly burns brightly when the current conductivity zone of the ore-grown compound semiconductor has undergone a temperature rise of approx. 30 to 40 degrees Celsuis. The different degrees of heating were used for the measurement of the thermal voltage. The same experiment with a regular, cubic single crystal made of pyrite initially produces a bright beam of the tungsten filament, as is already possible with irregular chunks of chalcopyrite or arsenopyrite. It follows from this that disks made of this cubic single crystal are best suited for discrete active leg parts (2), since each direction in the crystal provides excellent conductivity and thus equally high thermal EMF. A warming of the through-grown octahedral chunks then results in significantly higher conductance values. These are sufficient to operate two light bulbs via a wire tip contact. Surface contacting of the pyrite thus eliminates any transition problems. The lead-luster crystals (PbS) included in the experiment and broken out of a dolomite overgrowth resulted in outstanding thermoelectric voltages and currents with solar-accessible temperature ranges and gradients, which due to their anisotropic properties can only be achieved if the wire tips are "correctly oriented" on certain surface parts of the crystal "were removable.

The simple test execution in summary clearly proves the long-known, semiconducting character of mineable orifices, glosses and gravel and thus their suitability for the extremely inexpensive manufacture of thermo-limbs (7), but better the foam structure part according to the invention. The inexpensive pyrite - as well as many other electrically semiconducting crystal structures that can be mined - can be used at comparatively low cost (compared to expensive synthetic thermoelectrics, such as bismuth tellurides) for the production of thermoelectric current. According to the proposals of the invention, divided fractions within thermoelectroactive collector hoods (19) or cut crystal wafers of larger, hydrothermally grown crystals of pyrite, chalcopyrite and others are similarly effective and suitable. Pyrite often occurs in sufficiently dimensioned cubic single crystals and can be processed with copper to high-performance thermoelectric modules (1) "out of the mountain", whereby many thin disks from a crystal produce exactly half as many thermoelectric individual elements - with considerably lower internal resistance and significantly flatter size - than the use of whole crystals allows. Even razor-thin layers are equally effective for the development of thermal EMF. The grains and dust of the ore-grown compound semiconductors which arise during the chipping of the ores can in turn be used in conductive lacquer embeddings for the production of thermoelectroactive collector hoods (19) or for the formation of thermoelectroactive end zones (34) (claims 4 and 6)

Improvements to the thermoelectric properties

Growing thin layers that can be deposited on amorphous substrates also allow for transporting or synthesizing vapor phase transport. Likewise, tempering, ordering re-installation with or without polarization fields is possible. The degrees of division - referred to as thermoelectro-active grain sizes (17) are given a field-like thermal effect by these fields in the resin-sensitive phases of paint base components Preferred direction in the later hardening composite (e.g. a thermoelectro-active conductive varnish (16)). Ion cleaning is also possible with Pyπtkπstall structures (see claim 15) causes of thermal stress on pyrite and galena

In the case of metals, element semiconductors, compound semiconductors, intermetallic compounds or intermediate phases, three thermo-voltage-forming components occur on the electron diffusion component or volume component, contact potential and phonon drag component. The latter relates to an interaction between electrons and phonons, in which phonons move from the warmer to the colder end Taking electrons along. This component only plays a part in the low temperature range.

A halving thermocouple (7) with a temperature gradient gets a much higher electron diffusion portion (electron pressure) at its hot end and the two differently tempered contact points of two such thermocouples (7) form a different, temperature-dependent contact potential at their differently tempered contact points sufficient thermal currents can flow, a sufficiently dimensioned, as thin as possible transition surface and a still sufficient charge carrier concentration in this thermoelectric element (3) formed into the layer is necessary. The fact that there is high thermal power in a thermocouple (3) that conducts electricity only moderately suggests that all non-electro-thermoactive sections of the thermal current path (9) be made of other indifferent, but electroconductive material - which should also be as heat-blocking as metallic foam . Thus, conductive varnish-bonded pyrite and chalcopyrite disks on plane-cut metal foam surfaces give the best solution for high, loss-minimized, thermoelectric conversion

For the highest developable thermal EMF, the use of the combination of a hole semiconductor with an electron semiconductor is to be provided. For permanent stress in thermoelectric modules (1) temperature resistance, a certain weathering resistance and anticorrosive behavior to contact materials are to be rated. For air-exposed thermocouples made of pyrite and chalcopoly discs and layers, a varnish coating is sufficient.

Immediate and indirect foaming of non-metallic thermoelectics (3) Only in a limited selection can semiconducting compounds do the process of hot foaming just as easily How to graduate metals In addition, there is a suitable selection that has to be post-treated to convert the foam structure from a non-conductive, glassy state into a permanently metallic bisector. A considerable part cannot be brought into a suitable, halving state with thermal aftertreatment without reducing or destroying the foam structure in its optimal structure. In the case of sulfidic, selenidic and arsenidic compound semiconductors, there are only a few meltable and therefore foamable ones - they suffer from pyrolysis without any way before over 800/900 degrees Celsius.

Indirect cold and warm foam with organic lacquer base components (see claims 9. 10. 11. 16, 17)

For their placement in a self-conductive foam structure, e.g. B. made of polyacetylene or in a conductive with conductivity (20) made conductive, is technically possible. The entirety of the differently selectable conductivity mediators (20) results in the through-contact active phase (26) anchored in the cell walls of the foam structure, to which the latter can be added if this is electrically intrinsically conductive. Doped polyacetylene shows metallic conductivity with a relative conductance as metals have. With electrodes made of polyacetylene, which are immersed in a paste-like electrolyte from a solution of tetra-butylammomumperchlorate in propylene carbonate, considerable amounts of ampere-hours can be stored in a new, metal-free type of battery. Instead of a film state, a suitable, electrically conductive foam structure of polyacetylene can now be achieved, which considerably improves the conductance of the through-contact active phase (26) of the embodiments of the thermal legs (7) proposed according to the invention with a foam structure component. The best metallic conductance is also promised by an active phase-improving foam structure made of poly-sulfurite CI2 (with n large 24). With increasing sulfur contents, the phases from liquid, plastic to solid can be realized and the electrical preference for these one-dimensional conductors can be carried out with dipole-canceling post-forming processes by means of static, electrical fields (see claim 15 - post-forming). This is promising for certain chain lengths, since it is only necessary to wait for resol states before polymerizing further and the subsequent polymerisation can be accompanied by a post-forming regime. A similarly slow-linkable one-dimensional conductor is polysulfurite with metallic conductivities from 1/10 ~ ⁶ to 1/10 ~ ⁷ x Ohmcm. The pure form of the composition (SN) _X obtains the highest conductance by bromine doping and has the composition (SNBr ₀ 4) _x (see claim 17)

Metallic and non-metallic conductivity mediators (20) for forming the through-contact active phase (26) in the dense or foamed structural composite (claims 4 and 6, 11, 17)

There are batch formulations for conductive lacquers which, according to the invention, can be sprayed with an added propellant component and, after exiting, can be made porous to form a closed-cell foam structure (see claim 16). It is within the scope of professional action to find the optimal compositions for certain ratios of electrical conductivity and to determine explainable K values. In terms of building materials, analog levels of hardness and stress can be achieved in the order of WD and WS if partially substitutable polyurethane components are incorporated to form a composite. Accordingly, equivalent K values can be achieved for the purpose of eliminating power-reducing heat losses (8). As a result, a grouting, puro foam-like, thermoelectroactive conductive lacquer (16) is proposed as a result, which contains suitable grain sizes or / and additionally reinforcing (possibly nozzle-compatible) fiber components from conductivity mediators (20) in suitable proportions. (Aluminum, copper, nickel, silver dust, carbon charcoal filter, hard charcoal sand or powder, metal oxides, nitrides, soils, special ion and supeπonenleiter or other suitable - as indifferent through-contacting active phase (26), in addition to appropriate amounts of thermoelectroactive grain sizes (17) intrinsically and externally conductive semiconductors, compound semiconductors or intermetallic compounds. The introduction of powdery, halving, gray alfa tin into thermoelectroactive end zones (34) or collector hoods (9) always appears to be interesting. It forms itself out of pure tin metal through the so-called tin plague, but still has a high metallic conductivity in addition to self-developed thermal EMF. The self-producing, thermoelectroactive grain size (17) (Baπdlucke 0.1 eV) occurs simultaneously as an efficient conductivity mediator (20) with a specific electrical resistance of one ten thousandth of an ohm / cm in conductive varnishes or cell wall structures of non-metallic foams (31) (see claim 3). The conductivity-imparting, medium-resistance sulfides of copper and silver occupy a middle position, of which Ag2S is a mixed electron conductor. Lithium nitride L13N has a high ion conductivity at room temperature and is therefore, from an application point of view, a component of the through-contacting active phase and within a hermetic paint base compound. 26) of interest. Density or foam structures had to be completely sealed against water, otherwise the reaction to ammonia and alkali would be totally resistant. Titanium nitride or lithium-doped titanium disulfide (see claims 3 and 17). All of these compounds are suitable in a hardened / solidified, dense or foamed lacquer base component to impart conductivity to be. The conductive lacquer base component which is also possible on a different chemical basis (up to hm too electrically self-conductive, for example based on polyacetylene, is offered for processing with compressed propellant in stock sprays according to the invention (see claim 16). The lacquer base component which forms the self-adhesive composite after foaming, indifferent foam conductive lacquer (24 ) or thermoelectroactive conductive foam (25) can be non-conductive, but it should be better because of higher thermal current densities (polyacetylene), the non-conductive base component then having to be supplemented with conductivity mediators (20) to form a through-contacting active phase (26), while the self-conductive with these can be supplemented (see claim 17), thermoelectric potential transfer to the through-contact active phase (26) and their types of charge carrier transport (claims 3 to 9)

The thermoelectroactive foam structure requires highly effective, thermoelectroactive grain sizes (17) and good "particle contacting" of all grain size components, including the through-contacting active phase (26), if it is to be cut, continuously foamed thermal legs (11) that give off higher electrical power densities. In thermoelectric end 34 ) the physical thermoelectroactive grain sizes (17) in turn take on a considerable part of the charge carrier transport. With their Thermo-EMF they accelerate this additionally. This increases the density of the thermal current (5). In order to compensate for this, conductivity mediators (20) are scattered in a surrounding, contacting manner. In the direction of the intermediate area (35) with optimized conductance, they take over the entire charge carrier transport, unless the material cell wall structure is involved in the transport. If this should become particularly solid, the active phases that hardly contribute to strength must not exceed a percentage share of the overall structure. Nonetheless, insulation panels, such as Styrodur, which are subject to greater use by users, can be replaced in shells of large-scale building shells by extensively thermoelectrically converting, but more strongly statically stressable surface units of thermoelectric modules (1). If foam structures that are to be heavily used only allow a reduced conductivity or so-called foam-stretching, through-contacting active phase (26), then extensive changes are made over the long night. As a result- a higher internal resistance of such thermoelectric modules (1) does not reduce their efficiency in the case of a longer conversion period. In the cell walls of the finished foam structures, thermoelectroactive foam conductive varnishes (25) are indifferent, only the charge carrier transport exclusively or with accepting conductivity mediators (20) of the through-contacting active phase (26 ) mainly metal puiver, but also metal oxides such as iron lilac oxide = hammer blow, nitrides and borides and possibly organic one-dimensional conductors such as polyacetylene, polysulfurite, polysulfur chloride and special super-ion conductors in particle form (sizes from 1 to 10 micrometers). Your "more extensive" line mechanisms are purely metallic and / or metallic ones with semiconducting or still involved ion lines with regard to directly touching particles of the conductivity mediators (20). In addition there is a certain portion of charge carrier transport through the technically so-called trap tunneling (see claim 9). For electrons this is the possibility of overcoming thin, but overall very poorly conductive to insulating zones, which slowly improve in "soft" or by using ion conduction beginning to form compounds (self-formation). The trap tunneling initially takes over organic varnish bases, the already hot-curing epoxy resins, but especially with the fat-containing ones, always part of the transport of the charge carriers. 'Softer' structure associations show, after a certain current flow time, an electromigration which increases the conductance, i.e. an optimizing migration effect of interconnect atoms, with one bridging, integrating effect for previously uninvolved, neighboring localized orbital atoms In glassy, hardened bandages, this automatic optimization of the conductance fails and can only be actively enforced during the cooling, all-plastic composite in the treatment program of a reformation and defined for a long time (see claim 15) accordingly, a differently decreasing and or remaining portion in dense, indifferent conductive varnishes (18) thermoelectroactive conductive varnishes (16) and the indifferent foam conductive varnishes (24) thermoelectroactive S. Foam conductive lacquers (25) and can be of considerable importance if, in high meltable glass fettings, glass phases with a thickness of approx. 0.1 micrometer are to be overcome between the metal particles present in chains and bushes. The persistence, as well as the fat foam temperatures, can be adjusted by reducing borax-alkali-soda (sodium carbonate) in front of potash (potassium carbonate). The silicons are the easiest to tunnel through sodium silicate layers. "The more" waterglass-like ", however, the supporting structure-forming component has to be, the more it has to be the load-bearing foam structure is hermetically sealed and surrounded by a sealing layer. The same should and can partially or completely make up the load-bearing shell structure of the entire thermoelectric module (1). A general improvement in the active phases, even in glass bandages, allows methods of accompanying, sometimes also subsequent formation (see claim 15 ).

The following is a proportionally variable / supplementable, electrically highly conductive silicate composite structure which is suitable for the construction of the thermal legs (7) according to the invention with a high proportion of foam structure: conductive silver / conductive copper

Silver powder 54.4 / 46.2 Cu powder Higher borosilicate components improve bismuth oxide 4.6 borosilicate strength, lower conductivity, Rosin 8.3 glass powder 2.7 Silver can be substituted by copper, nickel, aluminum turpentine 30.0 and non-metallic conductivity mediators (20). With a silver component of dusty copper dust or other suitable processes, an extremely thin, anti-corrosive silver coating results on the copper metal particles, with the result of a permanent increase in the conductance value, which is based more on the exclusion of the formation of impairing CU2O or other transition layers.

The transfer of the charge carriers charged with thermo-EMF from and to the thermoelectroactive grain sizes (17) from the intermediate transporting, through-contacting active phase (26) takes place via the same line mechanisms as within the through-contacting active phase (26) itself. The common term for the entirety and effect of the thermoelectroactive grain sizes (17) located in the thermal legs (7) is the thermoelectroactive active phase (30) (see claim 3). There are utilizable transition forms of conductivity mediators (20) that also have thermoelectroactive potentials develop certain partners, but remain indifferent to others. In view of this, conductivity-imparting particles must be checked professionally so that no randomly occurring opposite potentials inhibit the development of the actual thermal EMF. Semiconducting glasses (claims 3. 15)

The halving chalcogenide glasses with binary, temperature, quaternary thermoelectric systems made of S, Se, Tθ, As and Cd, Zn, Fe, Bi, Ti, Cu, Ag and such take an important position with regard to non-metallic, thermoelectroactive sealing and foam composites the base of some transition metal oxides - such as. B. CU2O and

Fβ2θ3 - a. Their properties have already been tested in detail with regard to their suitability for storage tasks (Ovonics). The main feature of the bisecting glazers are the highly controllable, reversible, abruptly occurring high and low-resistance states, which made them interesting for digital storage tasks for a certain period of time. The high-ohmic amorphous and the low-voltage, low-resistance, semi-conductive state are of extraordinary interest for the use and control of an optionally switchable, potential-forming, thermo-electroactive active phase (30) in all thermal legs (7) proposed according to the invention, since only one material-specific voltage pulse of nx (5 to 50) volts is sufficient to immediately generate a low-resistance thermoelectric element (3) from the amorphous foam glass phase of a z. B to make continuously foamed thermo leg (7) (see claim 4). This option allows the user to wait for high temperature gradients for thermoelectrical conversion after previous storage intervals and to deliver high power output to operator networks. Examples of low-melting, glass-like composite basic components of indifferent (18) and thermoelectroactive conductive lacquers (16) and foam conductive lacquers (24). (25). (Claims 18. 15)

Instead of the polyurethane composite basic component or other, up to hm suitable for the permanent build-up of indifferent (24) or thermoelectroactive foam conductive lacquers (25), which cure tightly or closed-celled without a thermal draw, the results so far have been the previous versions, in addition to the epoxy composite base components, which are already hot at 250 degrees Celsius according to the law, further proposed glass-filler-like basic components, which are known to have been developed for conductive pastes of burnable conductor runs for hybrid circuits on aluminum oxide or beryllium oxide ceramics. These have a glass composite, which is variable in terms of softening by the following and / or other addable melting components. The lowest softening melting temperatures (340 - 400 degrees Celsius) show so-called glass solders of the following possible combinations composition:

73.8% PbO with 11.2% B ₂ 0 _] 14.3% Sι0 ₂ , 0.2% Al ₂ 0 ₃ or 73.4% PbO with 20.0% B ₂ 0 ₃ , 6.6% Sι0 _2nd

Optimization of conductance and formation of the through-contact active phase (26). (Claim 15)

For glass phase fixation contacting possibly sensitive thermoelectro-active grain sizes (17), these must survive the melt-phase embedding and contacting process without impairment. The lowest temperature ranges should therefore be selected. In this connection, a conductivity-improving formation of the through-contacting active phase (26), in which the thermoelectroactive grain sizes (26) are significantly involved, is proposed (see claims 15, 18). The same is achieved in that the glass- or fat-containing, indifferent conductive varnishes (18), thermoelectroactive conductive varnishes (16), indifferent foam conductive varnishes (24) and thermoelectroactive foam conductive varnishes (25) cool from the hot phase under the influence of electric fields and / or directly applied electrical potentials, may be exposed to the influence of certain sound frequencies. During the cooling process, temperature maintenance ranges may have to be completed, but the foam structures obtained must not be endangered. Sufficiently high conductivity values that can be achieved without formation are of course not necessary. Glassy, electrically conductive foam structures are made from.

- Metal powder from single and multi-component systems as conductivity mediators (20)

- Thermoelectroactive grain sizes (17)

- Glass powder (glass fruit), mostly made of lead boron silicate

- Organic flux to adjust the viscosity

- Plasticizers for wetting and cleaning of metal reinforcements that can be inserted

- organic solvents

- propellant gasifying in the viscous glass state

After the pre-poured or dough-rolled green layers have dried at 100 to 150 degrees, they are baked to multiple layer thicknesses at temperatures between 350 to 500 degrees. Since the thermoelectric modules (1) exposed to solar temperature do not have to meet the strict tolerance ranges comparatively, such as electronic, filigree hybrid coatings on ceramic bases, the melt melting temperatures can be made selectively lower by graduated additions of alkali silicate, which reduces the choice of foaming agents, the controllability of the Foaming, as well as trap tunneling and beginning ion conduction of the through-contacting active phase (26) anchored in the glass phase up to their self-improvement when driving through higher working temperature ranges (see claim 18). According to claims 15 and 18, growth formation (46) of at least dense glass phase-fixed, large-sized, thermoelectroactive composites is possible if thin films to be drawn from the liquid retention phase with anisotropic thermoelectroactive grain sizes (17) seconds before their solidification on a low-temperature large volume, by a strong electric field penetrating the viscous glass film are polarized in the thermoelectrical preferred direction.

The foamer (33) can be a salt which gasses in the suitable temperature range without residues or organic matter - possibly with a defined carbon residue. The remaining one, in the Carbon scaffold component integrating the foam structure can act as an additional conductivity mediator (20) and further reduce the internal resistance of the thermoelectric series connection (see claim 4). Thermal stability of available, in particular minable, semiconducting compounds for crystal wafers and thermoelectroactive grain sizes (17) (claim 3. 15): inexpensive, easily removable thermoelectrics (3)

The thermoelectroactive grain sizes (17) must be selected in accordance with the foam foam temperatures. The incipient tempering temperature ranges of natural or synthetic compound semiconductors that attack the lattice grid must be taken into account. Pyrite reorientates itself from 400 degrees Celsius, and up to 550 degrees Celsius there are fundamental changes in the temperature of the barn. It disproportionates in pyrrothin and sulfur above 550 degrees Celsius (see vapor phase transport in claim 15). There are still hundreds of Pyntknstall structures of the same lattice constants that are suitable as thermoelectrics (3), with some of the elements involved, some of which have even higher temperature resistances, which are sufficiently anticorrosive when hot foaming of fats on boron-lead silicate base layer and do not blunt as regards their thermal forces true chemical binding partners for silicate binary, ternary and quatrenar complexes, the binding partners mentioned below also sometimes occur in bisecting glasses (claim 15). With FeS2 as

The following partners are possible with thermocouples and with each other, with various suitability to be found for embedding in a glass phase.

MA ₂ M ^M A ^A A ^A "" ^MAB MAM "BA ₂ MB ₂ MBB" where M and M "as copper, iron, nickel, cobalt, cadmium, zinc,

Ruthenium, manganese, mercury, osmium occur, where A and A "appear as sulfur, selenium, tellurium, where B and B" occur as phosphorus, arsenic, antimony, bismuth, with lead, tin and silver for themselves and with other metallic partners Examples of relative thermal stresses in different temperature ranges also lead to halving, but modified crystal lattices:

.Display and

Connection characteristic reference e 1/2 in microvolts / degrees Celsius substance of state .metall

Temp. 100 150 200 300 ° C.

Silicon green appearance. Kupe _1/2 260 260 270 290 carbide black fer eι ₂ . 0 -80 -160 -300

from 40/125 parts KupTemp. 100 300 400

Silicon Potassium fluorophore e- | / 2- ^ca - ⁵⁶⁰ -450 -330 silicate / Alumiπ microcrystalline Temp. -70 130 330 ° C i + B Defective Chromel Ohmcm.0.035 0.03 0.04 e-1/2 550 600 600

Temp. -70 130 330 ° C

Si + Al defect conductor Chromel Ohmcm 0.06 0.05 0.06 e1 _{/ 2} 300 300 350

Temp. -50 0 50 ° C

Cu ₂ 0 less copper e- _j / 2 1400 1110 1030 higher wdst e -, / 2.1660 1390 1250

(Copper oxide dipstick)

Pyrite crystal copper Between 20 and 80 cubic 129 microns / ° C

Temp -30 7 50 90 ° C

F ^β 2 20 ^ '0 80 ^< - ^l 4 single crystal copper

111 direction e1 / 2. 185 175 165 16

All in all, it should be noted for all thermoelectrics (3) that in all thermal and foam processes during the course of the process, the structure and surface contactability of the thermoelectric-active grain sizes (17) can only be impaired above the hot foam temperature level, so that they do not affect the development of the thermo-EMF To master the technological regime, however, there are overarching empirical values from the results of the baking technologies of the resistance paste systems for thick-film resistors, guideway thick-layer paste systems and conductive adhesives. With regard to the beginning risk of pyrolytic decomposition, there is comprehensive knowledge from the enamel industry, where at far higher temperatures coloring - actually more sensitive - semiconductors exist Temperatures can be stored in a compound, such as the cadmium selenide, which results in crimson cover enamel - at least 700 - 800 degrees Celsius ius baking temperature When hot foaming contains thermoelectroactive foam conductive varnishes (25), conductivity mediators (20) and thermoelectroactive grain sizes (17) are only homogeneously localized and contacted in the pore walls of the closed foam structure at temperatures above 350 degrees Celsius (see claim 18) get cut. At temperatures lower by 100 degrees Celsius, epoxy resins can be foamed, which have been used for decades as a dense conductive adhesive in electronics with a through-contact active phase (26) made of nickel powder or silver powder. Titanium nitride is an inexpensive to produce, golden-yellow to bronze-colored conductivity mediator (20) with considerable electrical conductivity and the highest chemical resistance (see claim 3). It can be used as a dominating, through-contacting active phase (26) in basic lacquer components, thermosets, thermoplastics, epoxies and feathers, in fact starting from normal temperature ranges up to hot temperature ranges (up to 800 degrees Celsius) are used equally. The condition is the absence of long acting superheated steam or free caustic alkalis during hot setting or blowing processes. The component-differentiated foam (27) (claim 11)

The most economical method for the consumption of Thermoelektnka (3), with a possible increase in electrical conductivity, is that of jointly foaming near-surface zones of predominant, thermoelectroactive grain sizes (17) with the exclusive participation of the conductivity mediators (18) in the rest, in particular the middle, of the layer thickness (see claim 11) For this purpose, corresponding paste or dough-like consistencies with different active phase components are applied in layers and foamed together. The result is a continuous, closed-cell composite with a thermoelectroactive active phase (30), which is primarily on the top and bottom sides. Specially modified conductive adhesives, conductance-optimized resistance paste systems or conductive thick-film paste are suitable for this purpose. Component-differentiated foaming (27) with density-differentiated foaming ( 23) to unite (all claims features and applications see claims 4, 8, 11, 12, 13)

The paste or dough layers of the green sheet to be inflated, which are to be blended, must be wetted cold beforehand in order to form common, mutually merging cell walls in the hot phase. As a result of such layer-by-layer differentiation, integrated active-passive thermal limbs (1) are immediately available during the cutting, which can be contacted with a thermally entering, indifferent collector hood (15) with an additional thermally well-contacting active phase (26) (see claim 5) or with contact anchor claws (22) (see Figure 4) In addition to this rod-shaped embodiment, the ends of the integrated active-passive thermocouple ends as well as an interconnecting and thermally inserting cemented profile contact (39) and guide profile contact (40) are angled or curved in a second vanante ) provided (see Figure 3b). This ensures their direct, leading p / n and n / p contacting for the realization of thermoactive transitions (13). When assembling thermoelectric modules (1), dense p- or n-type thermoelectroactive conductive coatings (16) are used. applied to the transition surfaces in a suitable layer thickness and then pressed together until hardening. Aspects of the material selection of intermetallic thermoelectroactive grain sizes (17) The most striking property of intermetallic compounds is the brittleness, which conflicts with their other technical use.Therefore, in the cintical, especially Grimm - Sommerfeldian phases responsible for thermoelectrics (3), there are only a few cuts for discrete active leg parts without Risk of breakage (CNSb). The brittleness could be alleviated in a number of important thermoelectrics (3) and not in others. According to the invention, the latter can also be used to form a thermoelectroactive active phase (30). The consistently metallic electrical conductance entitles the user to build up foam-stretched, thermoelectroactive active phases (30) that hardly need to be conductively used with through-contact active phases (26). Suitable thermoelectroactive grain sizes (17) of available intermetallic compounds with a suitable number and mobility of charge carriers are - besides not mentioned here - cadmium antmonide CdSb (400 microvolts / degree Kelvin), magnesium stannide Mg Sn (270

Microvolt degrees Kelvin), zinc antimonide SbZn (220 300) microvolts / degree Kelvin). The data are relative thermal forces of the stoichiometrically producible basic substances, which can be increased significantly by suitable doping (embossing of p-type and n-type). Bonded semiconductors of the zinc blende type For their use in thermoelectric arrangements, only rough, mechanical cleaning processes or selection of crystal types are required, since there are no calibrated microelectronic chips, but only thermoelectrical arrangements that fluctuate in terms of current fluctuations.

Procurement costs and technical effort for natural thermoelectics (3) in thermo legs (7) with foam structure

The cost of crystal cutting - especially for cutting processes - is low. Thermoelectro-active grain sizes (17) are mixed with indifferent conductive lacquer components in mixing drums, where wetting takes place to a paste-like consistency. Air-hardening pastes, thermoelectroactive pastes can be filled and stored. It corresponds to the past events and facts that the worldwide histonschθ and current lead extraction is largely from galena (lead gloss) (e), the automotive lead batteries are currently accumulating nationwide, but for an installed, thermoelectric power of 1 KW not even 10 kg of "lead ore" are required. The chemically pure accumulator lead with sulfur is suitable for the large-scale, hydrothermal direct synthesis of galena (lead sulfide). The brass-gold-shining pyrite was used for a certain time for the production of transistors and appears with sufficient properties interesting for optoelectronic applications. Uncleavable and hard, but can be cut into thin slices in its natural occurrence, it can be used immediately for thermoelectric pairing with the same-processable chalcopyrite or other natural or synthetic thermoelectrics (3). However, the pyrite itself, which is synthetically accessible, requires - like silicon - more complicated, more energy-intensive Crystal growing, which only delivers much smaller crystals. The waste of natural pyrite (S0 ₂ -environmentally polluting rust process for the production of FE2θ ₃ ) and the other highly efficient compound semiconductors is no longer justified.

Aligning pronounced anisotropic thermoelectrics (3) in the preferred thermoelectric direction (claim 1§1

In most cases, the crystalline forms - and of which the cubically crystallizing, isotropic (without thermoelectrical preference) - are preferred for the compound semiconductors that can be selected from ore deposits. Isotropic property means no preference for physical effects). Thus, a specifically equally well-contacted transition with finer-grained, octahedral galena (PbS = galena) only binds a part of the thermal current, like a properly selected, equally sized area on a single crystal, which can be in contact with a metal, compound semiconductor or other thermoelectric element ( 3) located. On the other hand, even large pyπ-cubes (with eg 5 cm edge length) show high conductance and equal differential thermal forces at every point on their surfaces - and even over the longest corner point connection. In this respect, grain sizes prepared from it always remain cubically crystallized pyrite granules or powder (even in a distributed state). Anisotropy is gradually pronounced. Thus, "disorderly" distributed weaker anisotropic thermoelectroactive grain sizes (17) produce higher thermostreams than "disordered" distributed strong anisotropic tables When specifying thermovoltage values for non-cubic systems, specifying the values for a temperature gradient perpendicular or parallel to the stallographic axis. A clear anisotropy flow can be determined with antimony, cadmium and bismuth. Galena is also considerably anisotropic and becomes dense or reforming foam structures with suitable fields during the hardening or cooling process, in that the surface-localized dipoles of a galena particle make this a body-absorbing substance Mandatory notify movement component according to the field flooding. It is within the scope of professional action to determine the layer thicknesses of the tough paint or glass phases for sufficient penetration. It can be static high-voltage fields or those that are still superimposed with a low-frequency field component. In the case of ferromagnetic crystals, permanent magnetic fields also do this. For example, pyrite can be statistically aligned by means of a permanent magnetic field over pyrrothin which has arisen in the meantime (see claim 15, vapor phase transport). When crushing, tearing, ultra-fast and hard impact impact or impact mills usually introduce property-destroying lattice defects or triboeffects that have a performance-reducing effect, the finer the grain sizes. However, lattice defects can in turn increase the electrical conductivity of semiconducting connections. As a result of the consideration of such processing-related aspects, the majority of mines that can be mined are numerous, hydrothermally crystallized compound semiconductors for solar temperature ranges as thermoelectroactive grain sizes (17) in thermoelectroactive conductive varnishes (16) or thermoelectroactive foam conductive varnishes (25) in a simple manner for regenerative energy generation (see claim 15, Formation).

Simple but efficient ways to increase. differential thermal forces through defect and excess treatment and impurity doping

Galena and pyrite are still possible with themselves in homojunction as a highly efficient, thermoelectrical pairing. The type and density of the charge carriers required for thermal currents to be generated can be set between approx. Plus 700 microvolts (defective conductor) and minus 500 microvolts (excess conductor) per degree Kelvin for lead-gloss PbS. For this purpose, the galena = PbS can be formed as a so-called defect semiconductor after the sulfur treatment or as an excess semiconductor by means of an extracting vacuum treatment.

A thermal pairing of the two is ideally suited for solar temperature offers and provides a thermal voltage of 120 millivolts even at a temperature gradient of 100 degrees Celsius, which means that a series connection of 100 individual thermoelectric elements already produces open-circuit voltages of 12 volts. The intrinsic conductance is high enough for strong thermal currents, although sufficient contact with the surface, for example with conductive rubber (37) or conductive varnish, is important. The temperatures that can be applied are above the uppermost temperature limit of non-focussing thermal solar technology that does work with heat trap devices. ^' With 264 connections in series, the expensive, tin-lead-soldered thermoelectrics (3) of the bismuth telluride series, which can be permanently loaded up to 60 degrees Celsius, achieve far less (test measurement) than "naturally pure" lead-gloss crystals exposed to the same temperature gradient. The advantage lies in solderability (after pretreatment) and great strength. The cleavage and lower hardness of the lead gloss only allow discrete crystal wafers to be used from a certain size. Pyrite is hard enough. It can also be designed as an excess or defect semiconductor for homojunctions. The natural forms have different, but always sufficient and much higher values of differential thermal power than the best metals used as a thermoelectric (3). It can be positively assumed that large amounts of compound semiconductors obtained at a site have relatively constant values. For the series connection of thermoelectric individual elements supplying different thermal voltages with regard to a direct current output power, this is irrelevant, since the voltages and currents fluctuate depending on the temperature anyway.

Direct foaming of non-metallic thermoelectrics (3) (Claim 9. 15) If the semi-metal selenium in foamed form after completion of temperature maintenance ranges above 72 degrees Celsius is brought into the black, metallic form, there is a highly active thermoelectric with differential thermal forces up to about 700 microvolts per degree Celsius in a range up to almost 200 degrees Celsius. The temperature resistance can be derived from conventional selenium rectifiers. Foamed metallic selenium, subsequently brought into hexagonal recrystallized (black) form, has a strength similar to that of foam glass and similar thermal insulation values to rigid polyurethane foam or Styrudor, and in a denser form with a suitable dopant additive at 239 degrees Kelvin, a comparable electrical conductivity of 8 MS / m approximately like the metal chrome (7.8 MS / m). With the self-conducting semiconductor selenium, after effective doping (because it can be introduced into the melt), many effective thermoelectric pairings are possible. Suitable doping results in an additional external conductivity component for the element semiconductor selenium and in the exposure to light a thousandfold conductivity of the undoped selenium.

The thermoelectroactive collector hood (19) - beneficial application for active leg parts (2) with semiconducting waste from semiconductor manufacturing and processing industries (6)

The application of the thermoelectroactive collector hood (19) offers significant opportunities to use different, semiconducting waste grain size classes of the same material in the semiconductor industry. Starting with wastes from the extraction of grown crystals, the production of wafers and their cutting, to wastes from solar cell production or chip production, fractions can be separated and used to produce this type of active leg parts (2) (see claim 6). What has been over-doped for the intermediate or end products of microelectronics, is outside of permissible measurement tolerances or is broken by contamination during further processing, such as the waste of polycrystalline or monocrystalline silicon in solar cell production - all of this is best suited for thermoelectroactive grain sizes (17). The starting triple solar cell production also offers valuable waste rates of gallium indium arsenide, gallium indium arsenophoside, (GalnAs), GalnAsP, indium phosphide (InP), or other compound semiconductors suitable for monolithic tandem solar cell production. What meets or no longer meets photovoltaic requirements - all of this is still mostly suitable for generating thermoelectric potentials. With granulated, dense metallic selenium, edge losses in silicon wafer production or primarily doped crystalline, optionally from aluminothermally obtained silicon (see claim 19), the aforementioned synthetic or mined compound semiconductors as contactable thermoelectroactive grain size (17) in an electrically conductive embedding are inexpensive thermoelectroactive Collector hoods (19) on foamed passive leg parts (4) in a form-fitting manner - can be applied for permanent contact over a wide area. Indifferent conductive varnish (18) serves as an embedding compound for all thermoelectroactive grain sizes, an intrinsically conductive laughter base component being advantageous. Thermoelectroactive collector hoods (19) constructed in this way thus functionally become active leg parts (2) which can be cemented on in an electrically conductive manner. These are now a voluminous to thin-layer hardening of a thermoelectroactive conductive lacquer (16) as previously described. Suitable thermoelectroactive grain sizes (17) are all thermoelectrics (3) which are anticorrosive in the conductive lacquer composite. Many thermoelectrics (3) are suitable for this, since there are hermetic, indifferent conductive varnishes (18) as a starting point. In this way, thermoelectric pairings with very high differential thermal forces can be achieved - from 400 to 200 microvolts per degree Kelvin. Thermal forces that would soon dull in the case of freely weathered thermoelectrics (3) - for example between silicon and lead, tellurium, selenium, silicon carbide, platinum, carbon, boron carbide and constantan. Silicon carbide can be modified with doping over a range of 7 powers of ten in terms of its electrical conductivity up to relatively low-resistance values and thus be made suitable for thermoelectric arrangements.

Porous penetrating, anchoring, rubber-like forms of thermoelectroactive collector hoods (19) can also be applied in a contacting manner as an active leg part on foamed passive leg parts (4). Active leg parts (2) designed in this way are dense, gradually composites, from softly clinging to hard consistency, of binding composites made from basic lacquer components of previously liquid, crosslinkable polyisocyanates and polyols or when setting trimerizing polyisocyanates. The property of gradual elasticity that can be added to different degrees of foaming makes the PUR lacquer basic component, after being offset with active phase components, for each type of thermal leg (7) proposed according to the invention with a foam structure component as one of the most important. It is important to know here that large-area thermoelectric converter units with expanded foam phases with non-intrinsically conductive phases Lacquer base component, with consequently lower specific thermal current densities, can nevertheless deliver impressive electrical performance in the high efficiency range. All the aforementioned semiconducting and intermetallic compounds with their approximate, high metallic conductivities, satisfactory to high differential thermal forces can be brought into an electrically conductive, soft-elastic to foam-like, jointing compound, which offers the best processing chances for large-area thermoelectric modules (1) in shells of building shells owns. Namely, the thermoelectroactive conductive lacquers (16), which are necessary for the structural, functional design of each individual thermoelectric element (6), can advantageously be integrated by means of chemically docking normal PUR lacquers. High temperature foaming of magnetite (claim 10)

The best suited for foaming (over 1500 degrees Celsius) is the compound semiconductor Fe ₃ 0 ₄ , which can be used as a thermoelectric (3), which becomes light in a foamed form and remains highly fireproof. Its use is inexpensive (see claim 10). Already as ore, it has considerable electrical conductivity (0.005 Ohmcm) and is as hard as pyrite

(Hard according to Mohs 5.5 - 6.5) and also pure and concentrated extractable z. B. from the highly exothermic erosion of Eisendrehspaneπ. Fe ₃ 0 ₄ is the resulting oxidation and waste product of every annealing treatment of steel and

Iron. He developed 5.5 millivolts against copper thin layers and over 12 millivolts per 100 degrees Celsius temperature difference against other compound semiconductors. It can be p- and n-doped, with peak values of +12 millivolts and -12 millivolts at a temperature difference of 100 degrees Celsius, i.e. 24 millivolts in a homojunction. Its conductivity is excellent for thermoelectric applications, as is the granite-like fire resistance and weatherability. Thermoelectric pairing with sulfidic, selenidic, arsenidic other compound semiconductors that can be mined as ore is possible. The strength of continuously foamed thermal legs (11) or integrated active-passive thermal legs (14) is close to that of slag cobblestones, which enables a load-bearing and sturdy use under sun-heated bitumen ceilings. Reinforcing and conductance-optimizing reinforcements in load-bearing foam structure associations (claim 10)

In addition, thin, electrically conductive, but also mechanically strengthening, fibrous reinforcements with a high functional content, but hardly any warming and lowering effect can be incorporated into the long structural structure of large-sized integrated active-passive thermo-legs (14) or continuously foamed thermo-legs (11). For example, high-strength carbon fibers (see claim 10). Selenium can be foamed in the amorphous phase and thermally above 72 degrees Celsius at up to 200 degrees Celsius persistent, black, metallic form are permanently formed (see claim 15). The strength of the thermoelectroactive foam structure is achieved with reinforcements made from selenium-offset, semiconducting glass fibers. A special form of a self-reinforcing, foam structure-like composite are heat-insulating, but current-conducting, porous grain sizes, such as hardwood charcoal or coke granules, which are coated with black selenium or other liquefiable thermoelectrics (3) and their previous, pore-penetrating surface incrustation by wetting with the liquid phase in Mixing drums took place and was subsequently converted into the crystallographic metallic form (see claim 4). The incrustation of the thermoelectrics may have been polarized in the preferred thermoelectric direction prior to solidification on the still free particles before their contact sintering (45) - in parallel with the introduction of a ferromagnetic subparticle (44) at one point of the crust. The thermoelectric preferred direction and the ferromagnetic subparticle (44) are arranged with respect to one another with simultaneously acting magnetic and electrical field components in such a way that an orientation to be carried out later before contact sintering (45) is only possible with the easier to implement, mostly more penetrating magnetic field component (see claim 15). In the accompanying formation, at least the dense superstructures of thermoelectroactive collector hoods (19) and the like can be produced in such a way that the polarizing fields acting on them only have to penetrate the tough layer thicknesses of the basic sets from a narrow slot nozzle. In addition to this, the emerging, monomeric bands with alternating 90 degree clipping can be layered endlessly to form a voluminous stack, which receives a complete directional characteristic through the piodic flooding of each newly applied layer, which photopolymerizes by immediately following doses of Ulf aviolet or blue light laser beams become. Instead of the stack layering, the winding of a glass band onto a cooling, elongated roll with periodic photopolymerization can also take place. Metal sintering or foaming

Metallic foams (10) occupy a large space in the production of the new thermal legs (7) according to the invention, since they have high electrical conductivities and the requirement for technological control of charge carrier transmission between thermoelectroactive (30) and through-contacting active phases ((26) as in Non-metallic foam structures are necessary - they can be made in a matter of seconds and then stored for any length of time. Modern metal foaming is contrasted by the long-established powder metallurgical sintering processes, which may have been considered for suitably structured thermal legs (7). Certain regimes of controllable, beginning metal sintering or Pre-sintered porous granules with applied metal skins / layers can lead to reasonably usable large-pore structures in the construction of thermo-limbs (7), which are essential with an insignificant reduction in electrical conductivity show increased thermal insulation and noticeable weight savings (see claim 4, surface-encrusted, pre-baked particles). For electrically contacting caking - referred to as contact sintering (45) - of a thermoelectroactive surface layer, however, the pre-expanded particles in mixer drums can first be coated with a thinly viscous paste made of indifferent conductive lacquer (18) and, after drying / curing, again surrounded with a layer of thermoelectrically active conductive lacquer (16) become. Pyrotechnics offers analog, sophisticated processes with processing the same consistencies, where instead of indifferent (18) and thermoelectroactive conductive lacquers (16) similar batch consistencies for black powder bark are built up on stem tablets and spheres. This would be a special form of sintering with thermoactive success and a high K value. Bef effs result Assessment of the design of continuous thermo-limbs (7) from sintered qualities of never-before-processed metals / alloys / intermetallic phases / introductory element semiconductors / compound semiconductors derives a compelling level of knowledge from powder metallurgical processes in the manufacture of thermoelectrics (3). The most differentiated manufacturing technologies for sintered composites for thermoelectric applications have long been mastered here. The results indicate that even the highest thermal emf has not yet been able to be used properly, because sintered composites of thermal legs always allow high amounts of heat loss (8) to pass through. Although there is the contributing phonon drag component of the overall thermal EMF, according to which the phonon movement of the waste heat current (8) from the hot to the cold end mif ices, this addable component is calculated at room temperature: thermal component of the Phonon drag component is e = proportional 1 / T.

Firstly, powder metallurgical processes for pure metals do not lead to the expectation of a high level of thermal insulation in order to be able to build high-performance thermoelectric modules (1) with the relatively low thermal-EMF, and secondly, sintering, due to its grain boundary defects, impairs the high metallic conductivity, which is intended to compensate for the increased outlay in series connection . Since the causation of the latter is conducive to an understanding of the nature of thermoelectric mechanisms of action and the insight into the advantages of foam structures which can be introduced alternatively, it will be discussed below. In particular for the thermoelectrics (3) of the thermoelectric conversion taking place in low-temperature ranges, detailed knowledge was obtained for the component milling, pressing and sintering with regard to the continuous design of thermal legs (7) of the bismuth-antimony-lead telluride series according to the prior art (see above), as well as for medium and high temperature Thermoelektπka (3), which are less suitable for non-focusing, thermal solar technology. What are the comparative and positive aspects for foaming? Quite apart from minimal energy expenditure for the short-term foaming, compared to that for the sintering of metals lasting several hours, considerable qualitative differences regarding the achievable structures and their properties can be determined. Strongly porous sintered metals show noticeably increased thermal resistance values compared to homogeneous, dense metallic blocks. However, the sintered composite still produces too dense, again "collapsed packing densities" of the sintered particles - with only limited thermal insulation, but with emerging disadvantages. They hang together with the cemented, merged boundary surfaces of the sintered particles. These transition zones have become impure - show a decrease in concentration or crystallization of internal metal particles or new substances taken in during the long sintering period. Transition zones can even become barrier layers. Foamed metals, on the other hand, have the highest achievable degree of inner surface, or the least use of compact metal for extractable foam volume, with the same purity as the compact metal. Energy and time are negligible compared to sintering. The metallic foams that can be obtained have heat resistance values that are several times higher. The metal walls of the closed structure remain in the short foaming phase of fine, pure metal with correspondingly high electrical conductivities. In this respect, there is an excellent suitability for the production of loss-insulating thermal legs (7) of thermoelectric converters. The foaming, which only lasts for up to ten seconds, does not permit any material-changing, unwanted installation processes, current-blocking shifts in concentration, contaminating metal attendants or the introduction of foreign matter (e.g. oxidants and the like). Therefore, metallic foams (10) are a novelty and the best starting point for heat loss reduction in thermal power generation in the Comparison to the heterogeneous structures of porous sintered metals or thermal electronics (3). The sintering of known, highly efficient thermoelectrics (3), which leads to dense structures and is controlled by a complicated technical regime, reaches the highest, hitherto unmatched efficiency ranges thanks to interposed metal foam structures, and the entire regenerative thermoelectric generation of electricity reaches a completely new level.

Description of the graphic representations

FIG. 1 shows continuously foamed thermal legs (11) with a homogeneous active phase distribution in the form of a thermoelectric pairing of metallic foams made of tin-doped β-zinc antimonide and bismuth antimony alloy as the thermoelectrics used (3). The thermal limb ends are contacted by indifferent collector hoods (15) and themselves represent a hardening of indifferent conductive lacquer (18) containing the bridge electrodes (13). The most suitable arrangement of the alloys from cheap base metals develops in the solar temperature range approx. 30 millivolts per 100 degrees Celsius Temperature difference with high electrical conductivity. The thermal insertion into the p / n and n / p transitions which form the black, indifferent collector hoods (15) is best carried out by means of incident, recombining solar radiation or otherwise.

FIG. 2 shows field-effective straightening processes that have already taken place for the pre-cut particles provided for contact sintering (45) with thermoelectroactive coating. In the same, the ferromagnetic subparticles (44) can be seen, the white areas of which have been arranged under the influence of a magnetic field, while an simultaneously acting electrical field component detects the thermoelectroactive grain sizes 17) polarized in the resin-flow phase in the thermoelectrical preferred direction. The upper part of the drawing shows three pre-bended, layered particles in this prepared phase, in mechanically induced positional disorder. The middle part shows the re-alignment of a loosely poured total of these particles only under the influence of a magnetic field due to the directional effect of the ferromagnetic subparticles before the start of sintering. In the lower part, the three upper, now exactly positioned, pre-biased particles and the total of the particles that have been arranged in this way are Thermoelectric preferred direction of the thermoelectroactive grain sizes (17) can be seen, which are then contact sintered (in the case of a field-effective regime below the Curie temperature of the material of the ferromagnetic subparticles (44)

FIG. 3a shows assembled thermal legs (12) using cut folding discs as thermoelectric (3) for corresponding active leg parts (2) - for example pyrite FeS2 and chalcopyrite CuFeS2-

These are applied in a homogeneously contacting manner with indifferent conductive lacquer (18) to plane-cut blocks of metallic (10) or or non-metallic foam (31). In the same way, the bridge electrodes (13) are contacted with the tops of the folding washers, whereby subtracting thermal stresses are to be avoided. At the top left of the illustration, a separate warm / cold guide device (21) is indicated - on the right, the direct deposit of a solar offer. As shown, the foamed passive leg parts (4) take up the largest part of the volume in the case of assembled thermos legs. These are generally only through-contacting and not capable or provided for the formation of thermal voltages. On the basis of the drawing, a metallic foam (10) made of copper against Pynt produced very significant, usable thermal stresses, which also made applications possible in this direction. If non-metallic foam structures with non-intrinsically conductive basic lacquer components are used, then conductivity mediators (20) must be provided in order to implement a through-contact active phase (26).

FIG. 3b shows geometrical installation forms of bridge electrodes (13) and integrated active passive thermal limbs (14) which, according to the graphical representation of the cementing profile contacting (39) or the leading profile contacting (40), can be added as a result of the side-by-side arrangement of the shown series connections of the foamed thermocouples (7), which differ in density and component ) is a thermally absorbing, if necessary efficient thermal storage in the layer of the bridge electrodes (13), but overall warm insulating shell, for example a building shell, which allows gentle thermal compensation to the other side only by developing thermal currents (5). The thermoelectrically active end zones (34) are bonded with the indifferent metal foil (38), which is hatched in parallel hatching, and in this case are not directly contacted, but rather with intermediate contacting bridge electrodes (13). These can also be hardened with a conductive varnish or press-fit with an intermediate layer made of conductive rubber (37), which means a double screwing (not shown here) or anchoring of the possibly thermally storing, voluminous bridge electrodes into the rigid foam-structured connecting segments of the electrical insulation (48 ) was necessary. The graphically illustrated geometric fitting profiles of the bridge electrodes (13) have, for example, copper or aluminum sheet cladding over their metallic or non-metallic foam structures - which are with or without a through-contacting active phase (26) - as mechanically solidifying hot-cold guiding devices (21) - and the whole can the cell volume is mixed with latent storage means,

FIG. 4 shows a thermo-electrically contacted, flexible, thermoelectric arrangement with integrated active-passive thermal limbs (14) by means of contact anchor claws (22). The contact anchor claws (22) are, as shown, a type of pliers with claws, which are adjustable in their angular position to the warm-cold guiding devices (21) via the force effect that can be adjusted via the pivot point of the bedding wire (47) that emerges from them Allow variable positions and further arrangements of the thermal legs (7). The bedding wire (47) transports thermal offers from the heat sinks and is therefore like this part of the warm-cold control device (21). The cross-section and surface of the pierced claws tell the potion plumbing layer shown or a conductive lacquer layer with copper or silver powder portions in the outermost region of the thermoelectroactive end zones (34) that the heat sources absorb the external thermal supply. In the integrated active passive thigh muscles (14), for example, thermoelectroactive grain sizes (17) each contain pyπt and chalcopyrite in the electrothermal active end zones (34), which, with good (ore) quality with a 100 degree temperature difference, approx. 60 millivolts per thermoelectric single element (6) provide. For the purpose of good warm-cold discharge, bedding wire (47) and contact anchor claws (22) are made of copper, the pierced claw parts of which have a compensating covering made of Cu / Al or tin or titanium-palladium-silver, in order to avoid the copper's own thermal stresses against pyπtkπstall-like compound semiconductors. In arrangements with similar design and construction, contact armature claws (22) made of bare copper can also be used to generate thermal current if corrosion problems are mastered (copper / pyrite = 66 millivolts per 100 degree temperature difference).

In Figure 4, the concerns of a heat trap technology and prevention of heat loss paths have not been dealt with in detail.

FIG. 5 shows a thermoelectric strand (28) made of non-metallic foam (31), which was produced using the push-through method and by means of the differentiated boundary layer foam (29). Here, the features of density-differentiated foaming (23) and component-differentiated foaming (27) are formed for each of the boundary layer-foamed thermal legs (7), which leads to the characteristics for integrated active-passive thermal legs (14) with regard to the individual strand-connected thermal legs (7). Shown is a pressing, only thermal encirclement of the heat-cold guiding device (21) which widens outward into the cooling body or other suitable forms, the annular inner part of which is in a semicircular, peripheral, circumferential groove Boundary layer between the thermal legs (7). Thanks to the groove-lining, foil-like layer of electrical insulation (48), the overall arrangement of the warm-cold guide device (21) is kept potential-free, but an intensive, thermal contact to the p / n and n / p transitions is established, which ultimately the central, thermally-electrically inter-contacting, indifferent zone mediated In the pressure-contacted thermoelectric strands (32), which are not shown specifically here, the indifferent zone is formed by indifferent metal foils (38) and conductive rubber (37) of the same size as segments (claim 14). The conductance-optimized, indifferent zone is therefore very dense, contains hardly any pores and is also functionally equivalent to the indifferent metal foils (38) in the cemented profile contacting (39), which optimizes the cross section in certain variants of the thermal guide profile contacting (40) (starting from FIG. 3) can also continue to the outside in suitably shaped warm-cold guiding devices (21).

Reference list

(1) thermoelectric module (39) cementing profile contact

(2) Active leg part (40) thermal guide profile contact

(3) Thermoelektπkum (41) Conductivity-connecting joint carbonization

(4) foamed passive leg part (42) carbon structure segment

(5) Thermal current (43) Carbon structure intermediate layer

(6) thermoelectric single element (44) ferromagnetic subparticle

(7) Thermocouple (45) Contact sintering

(8) Loss heat flows (46) Wax formation

(9) Thermal current path (47) Bedding wire

(10) metallic foam (48) electrical insulation

(11) continuously foamed thermal leg

(12) composite thermal leg

(13) Bridge electrodes

(14) integrated active-passive thermal leg

(15) indifferent collector hood

(16) thermoelectroactive conductive lacquer

(1) thermoelectro-active grain sizes

(18) indifferent conductive varnish

(19) thermoelectroactive collector hood

(20) conductivity broker

(21) Warm-cold guidance

(22) Contact anchor claws

(23) density differentiated foaming

(24) indifferent conductive foam

(25) thermoelectroactive conductive foam

(26) through-contact active phase

(27) Component-differentiated foam

(28) thermoelectric strand

(29) differentiated boundary layer foam

(30) thermoelectroactive active phase

(31) non-metallic foam

(32) pressure contacted thermoelectric string

(33) Schaumer

(34) thermoelectroactive end zone

(35) Conductivity-optimized intermediate area

(36) oxidative cold start coking

(37) Conductive rubber

(38) indifferent metal foil

Claims

claims

I. Processes and devices for the design of thermal limbs with foam structure components, characterized in that, according to the method according to the invention, thermal limbs (7) with a suitably dimensioned foam structure component for primary reduction of the heat losses (8) are manufactured in order to significantly increase the thermoelectric efficiency of thermoelectric modules (1), to achieve which thermal offers convert into electrical work by

-Layers of indifferent, metallic foams (10) or non-metallic foams (31) of sufficient electrical conductance are electrically contacted on the top and bottom sides by suitably compact or thin layers of suitable thermoelectrics (3), so that a suitable vertical cut of this flat-like overall composite of geometric and functional components for thermal legs (7) with high electrical and low thermal conductivity,

- Metallic foams (10) and possibly non-metallic foams (31) with the ability to develop their own sufficiently thermoelectric EMF (thermoelectromotive force), with suitable geometric dimensions and contact ability as geometrically adaptable and functional active components for thermo-limbs (7),

- Foamed to dense, non-metallic, electπsch conductive to non-conductive organic compounds, partially or fully with thermoelectrics (3) in suitable multiple composite structures equally to thermo legs (7) are formed

2. The method and apparatus of claim 1, g e k e n n z e i c h n e t d a d u r c h, d a ß

- Thermal limbs (7) with a foam structure portion are to be classified and assessed according to their proportions with regard to a thermoelectroactive active phase (30) and that of a through-contacting active phase (26) responsible for charge carrier transport, the former forming the thermoelectronic EMF, which is in the through-contacting Active phase (26) moving charge carriers is impressed,

- the totality of special, in part different, particulate conductivity mediators (20) in dense or foam structures of the thermal legs (7) form the through-contact active phase (26) and primarily ensure the charge carrier transport or electrical conductivity,

- suitably particulate grain sizes of a p-type thermoelectric element (3) form dense or suitably particulate grain sizes of an n-type thermoelectric element (3) within dense or foam structures of the thermal legs (7), the n-type thermoelectric active phase (30),

- The thermoelectroactive active phase (30) can partially take over the tasks of load bearing transport, up to the complete replacement of special conductivity mediators (20).

- from this a production-related classification with regard to geometric shapes and contacting joining techniques

- continuously foamed thermo legs (11)

- with homogeneous,

- with differentiated phase distribution,

- thermoelectric strand (28), - composite thermo legs (12),

- Pressure-contacted thermoelectric strand (32),

- Integrated active passive leg (14) results.

3. The method and apparatus according to claims 1 and 2, g e k e n n z e i c h n e t d a d u r c h, d a ß

- For the thermoelectroactive active phase (30) to be introduced into dense and foamed structures of thermal legs (7), each and primarily a single, existing population of thermoelectrofactor grain sizes of suitably divided intrinsically or externally conducting element semiconductors, compound semiconductors of naturally mineable occurrences of orifices, glosses and pebbles or intermetallic compounds, intermediate phases or special, synthetically developed thermoelectrics (3) with optimized figure of merit, which can also be obtained synthetically via chemical processes and crystal growth, as well as obtainable or representable, primarily also only with a high product of differential thermal power and electrical conductivity - in question come,

- For the through-contacting active phase (26) to be emitted into dense and foamed structures of thermo-limbs (7), a multi-faceted population of particulate, corpuscularly dispersed distributed conductivity mediators (20) are used, which do not corrode each other, and which gradually divided them appropriately Metals, metal oxides, metal nitrides, metal exchange, low-resistance non-metal floors and metal ions made by suitable doping, metal sulfides, ion and super ion conductors, such as copper, copper sulfide, tin, silver, silver sulfide, aluminum, nickel, titanium, titanium mfid, lithium-doped titanium disulfide Magnetite are

- Semiconducting chalcogenide glasses with binary, tare, quaternary bisecting silicate systems with

Sulfur, selenium, tellurium, arsenic and cadmium, zinc, iron, bismuth, titanium, copper, silver and those based on some transition metal oxides such as Cu ₂ 0 and Fe ₂ θ and other conductivity levels that can be triggered by leaps and bounds with a once-resistant, thermo-electroactive and on the other hand a high-resistance characteristic show and the unlimited change between the two levels with regard to thermoelectroactive low-resistance with voltage surges of high 50 volts, with regard to high-resistance can be achieved with adapted current surges,

- The degree of division of the through-contacting active phase (26) is mostly greater than that of the thermoelectroactive active phase (30),

- gray, always normal powdery, halving, cubic micro-stable alfa - tin for the design of the thermoelectroactive active phase (30) thermoelectroactive end zones (34), mainly in intrinsically conductive, also made conductive structures of non-metallic foam (31), or in dense intrinsically conductive or Conducted basic paint componentπ for the manufacture of moldable thermoelectroactive collector hoods

(19).

- The cubic gray alfa tin is produced by cooling pure powdered gamma tin at about -48 degrees Celsius with the greatest rate of formation and the formation of easily pulverizable, rhombic gamma tin is carried out by heating ductile, pure beta tin to over 162 degrees Celsius ,

- to design the through-contacting active phase (26) conductivity-optimized intermediate areas (35) with 0.5% bismuth or antimony-alloyed tin in powder form is used,

- elastic, conforming special shapes for through-contact (26) and thermo-electroactive phases (30) can be produced by vulcanization of conductivity mediators (20) and thermoelectroactive grain sizes (17) in rubber, butadiene or diorgaopoysiloxanes, or by polymerization into trimerizing polyisocyanates.

4. The method and devices according to claims 1, 2 and 3, e c e n n z e i c h n e t d a d u r c h, d ß:

- The generic long-term foamed thermal legs (11) relate to those with homogeneous active phase distribution and those with differentiated active phase distribution,

- Thoroughly homogeneously foamed thermo-limbs (1 1) with homogeneous active phase distribution primarily from a previously compact portioning of a respective n-type or p-type thermoelectric element (3) are foamed in closed cells and in the simplest case continuously foamed cells of the same size, especially in the case of metallic foam structures have possibly completed a density-differentiated foaming (23) before final shaping or have obtained non-metallic foams (31) or metallic foams (10) by cutting them out of recoverable, density-differentiated foam structures,

- To the continuously foamed thermo-limbs (11) with a homogeneous and differentiated active phase fraction, depending on the design, those can be added, which are designed as a sintered composite of pre-foamed particles with thermoelectron (3) surface-encrusted particles and that the end face p / n and n / p- Transitions of the continuously foamed thermo-limbs (11) are intercontacted in this way with indifferent collector hoods (15) connected via bridge electrodes (13) or by means of cemented profile contacting (39) or thermal conductive profile contacting (40),

- The cemented profile contact (39) with an intermediate layer of indifferent metal foil (38) or the thermal guide profile contact (40) for connecting p-type and n-type foam structures of all types of continuously foamed thermal legs (11) are used,

- A continuous, sufficiently firm, homogeneous through-contacting active phase (26), which can be adapted to any internal hollow shape by foaming pressure carbonization of organic substances, in the form of a carbon structure by oxidative cold start carbonization (36) (with an oxidant component) or by hot coking, which leads to electrically conductive, highly heat-insulating Leads to structures whose suitable cutting leads to continuously foamed thermo-limbs (11) with homogeneous active phase distribution,

- a possible thermal aftertreatment of every degree of surface-density-differentiated foaming (23) of the carbon structure by cracking fat hydrocarbon gases with surface-compacting carbon deposits,

- thermoelectrics are sputtered or evaporated onto the surface of the carbon structure,

- in a way similar continuous foamed thermal limb (11) can be prepared with ^'carbon skeleton and contained therein differentiated action phase distribution by a previously divided suitably into the compacted organic approach substances such as Dichtzellluose, starches, sugars and proteins added is suitable differentiated distributed amount thermoelectromotive active grain sizes (17), subsequently leads to the formation of thermoelectroactive Eπdzones (34) in the remaining carbon skeleton, which can be formed into p / n and n / p transitions by means of plane or contour grinding and cementing of conductive lacquer contact,

- The conductance-connecting joint coaling (41) of coal structure segments (42) represents the possibility of practicing a mosaic-like cubic jointing technique, with the large carbon framework blocks for correspondingly large ones Various variants of thermo-limbs (7) can be achieved technically by joining the carbon structure segments (42) with suitable charcoal glues and by means of internal heating in the joints of the composite carbon structure segments (42) by inductive whirling, electrolytically current-conducting or other suitably caused internal heating Fuge converts into an electrostatic-connecting carbon structure intermediate layer (43),

- In the glue-pressed joints of the prefabricated carbon structure segments (42), parallelized carbon fibers allow a gentle formation of the carbon structure intermediate layer (43) by means of a resistance heating which can be generated in the joints in a localized manner and triggered by the flow of electrical currents,

- Partial or continuous gluing or cementing of the carbon structure segments with large carbon skeleton blocks or subsequent functional contacting elements can be carried out by means of an indifferent conductive varnish (18) and this indifferent conductive varnish (18) is task-oriented, optimized in terms of composition - with regard to thermal insulation that cannot be reduced manufacturing thermo leg (7),

- In the case of continuously foamed thermo-limbs (11) with differentiated active phase distribution, the feature of density-differentiated foaming (23) can be replaced or supplemented by that of component-differentiated foaming (27), with regard to a zone-like distribution of the predominant thermoelectroactive active phase (30) in terminal thermoelectroactive end zones (34 ) which go to a central, mass-dominant, indifferent, exclusive conductance-optimized intermediate area of the foam structure and that this more demanding zone structure leads to the so-called, integrated passive passive thermal muscles (14) according to the invention,

- Continuously foamed thermal limbs (11), optionally with the inventive method of differentiated boundary layer foam (29) in one go and with the formation of p / n and n / p transitions as a series connection, in the form of so-called thermoelectric strand (28), can be obtained ,

- The feature of density-differentiated foam (23) in the strand-connecting differentiated boundary layer foam (29) thermoelectric strand (28) for reasons of the constructive introduction of warm-cold guidance devices (21) primarily that of the component-differentiated foam (27) for possible reasons for saving Thermoelectrics (3) are to be used with regard to the thermal legs (7) to be foamed,

5. The method and apparatus according to claims 3 and 4 g e k e n n z e i c h n e t d a d u r c h, d a ß

- The indifferent collector hoods (15) are homogeneously end-surface contacting, charge bearing collecting and exchanging, extensive applications that can be hardened, are frictionally cemented, indifferent conductive lacquer (18) in the surface-open pores of the foam structure and are accordingly only capable of further electrical contact, but no ability Develop thermal EMF,

- The p / n-intercontacting, series-connected arrangements of indifferent collector hoods (15) with bridge electrodes (13) engaging in them contacting by using thermally - electrically, highly conductive, indifferent conductive varnish (18) and shaping the bridge electrodes (13) to increase the surface area Warm-cold conduction devices (21) are designed to be thermally well-receiving and have a forwarding design, and thus result in the functional hot and cold contact points of the thermal legs (7), which are enabled in this embodiment to form a maximum thermal EMF.

6. The method and device according to claim 2 and preceding characterized by:

- For the conductance-optimized construction of thermo-limbs (7) with a foam structure, there are variants without technological application intermediates (pull-through method), but in particular also those with procedural steps of joining thermo-limb parts, which results in their latter functional division into thermo-emf-developing active limb parts (2) and requires the thermal current (5) to pass on, foamed passive leg parts (4),

- In particular active leg parts (2) depending on the availability, deformability and most effective usability of the original thermoelectrics (3) either discreetly from compact themed elements (3) or their suitable distribution in previously adaptable, then cement-hard, putty-like or elastically soft, electro-thermal contacting embedding materials exist, which in turn require dividing types of trouble-free contact to the foamed passive leg parts (4) and to themselves,

- Concentrated thermoelectroactive grain sizes (17) in natural rubber, synthetic or silicone rubber of different elasticity can form sufficient, homogeneous, area-like contacts to foamed passive leg parts (4) and with each other by permanent pressure components,

- Active leg parts (2) directly or indifferently inter-contacted, form the p / n and n / p transitions required for thermoelectric conversion and, in the case of their temperature differences, the thermo-EMF and, primarily, dense, welded, glued, electrically conductive on both sides, cemented, optionally frictionally contacted disks or thinner layers of thermoelectrics (3), which can be metals, element semiconductors, naturally occurring or synthetic compound semiconductors, intermetallic compounds, intermediate phases and modern, synthetic multi-phase alloys with optimized figure of merit,

- For the purpose of intensive, thermal entry, the cut wrinkle discs of natural or synthetic thermoelectrics (3) are connected to thermally concentrating end areas, accordingly, thermally entering surfaces on their outer crystal disc surfaces and accordingly subsequently have a transition to bridge electrodes (13), which are accordingly surface-shaped for thermal insertion and thus perform the function of a warm Kaite guide device (21),

- The constructive solution of the thermal guide profile contact (40) is exemplary for thermal integration into the p / n and n / p transitions of discrete disc and layered thermoelectrics (3) in the case of active leg parts (2) designed in this way,

- The thermoelectrics (3) described in this way as suitably particulate, so-called thermoelectroactive grain sizes (17) in a similarly shaped, contacted, hardened embedding made of indifferent conductive varnish (18) to the extent that they result in equally discrete active leg parts (2) which are functional and in accordance with the device are further referred to as thermoelectroactive collector hoods (19),

- The thermoelectroactive collector hood (19) accordingly a dense composite of the thermoelectroactive active phase (30) in the form of thermoelectroactive grain sizes (17) with the through-contacting active phase (26) in the form of the surrounding hardening of an indifferent conductive lacquer (18), the thermal emf on the contactable surface contours of the thermoelectroactive collector hood (19) can be tapped,

- Foamed passive leg parts (4) the central to predominant part of thermo-limbs (7) between each two of them are flat at the end - homogeneously contacted active leg parts (2), with the function of an essential Significant improvement in the efficiency of the thermoelectric conversion by largely blocking the heat loss currents (8) that are available from the active leg parts (2), which is why the foam structure is primarily a closed-cell, metallic foam (10) or non-metallic foam (31) with sufficient electrical against external influences Conductivity and contactability without the need for a self-developed thermal EMF

- With regard to improved contactability of the end faces of foamed passive leg parts (4) are the same result of a previous density-differentiated foam (23), which produces higher densities near the end face of the foam structure there

7. Device according to the preceding claims, g e k e n n z e i c h n e t d a d u r c h, d a ß

- Composite thermal leg (12) according to claim 4, each consisting of two terminal active leg parts (2) and a central, foamed passive leg part (4), the latter having a conductance-optimized foam structure in such a way that it combines a minimum of thermal conductivity with a maximum of electrical conductivity and this optimization of the conductance ensures that the thermal supply for thermoelectric conversion, which is hardly reduced by waste heat currents (8), is left to the semiconducting transitions (2) which are adjacent on both sides,

- Composed thermal legs (12) in the form of single rods with indifferent collector hoods (15) contacted by bridge electrodes (13) are contacted with regard to their p / n and n / p transitions, provided that compact panes or layers of thermoelectrics (3) are processed,

- the compact panes or layers of thermoelectrics (3) are cemented onto the end faces of the foamed passive leg parts (4) with gap-filling, indifferent conductive lacquer (18),

- Thermoelectroactive Kollektorhaubeπ (19) with bridge electrodes (13) as Aktvschenkelteile (2) in one go on the final cover surfaces of the foamed passive leg parts (4) molding and cementing or afterwards as a finished form joint cementing with indifferent conductive varnish (18),

- Arc shapes and angle shapes are cemented at the end with indifferent conductive varnish (18) for the purpose of contacting the p / n and n / p transitions

- These types of connections for single-rod, curved or angled shapes for thermal trapping can be optimized with reinforcements of warm-cold guiding devices (21) recessed into them and protruding beyond their surfaces

8. The method and device according to claim 6 and the preceding, characterized in that ß integrated active-passive thermo-limbs (14) have a continuous, obtained in one process, closed-cell structure made of metallic (10) or non-metallic foam (31) with respect to electrical Conductivity, formation of a thermal EMF, thermal insulation and inherent strength is optimized, which is at least the result of a density-differentiated (23), but primarily introduced component-differentiated foam (27)

- With the features of the sufficient presence of a purely through-contacting active phase (26) in the foam structure, which is partially substituted and or supplemented in the two end-of-the-range areas of the top surfaces of the leg pairs to be contacted by a sufficient proportion of a potential-forming thermoelectroactive active phase (30),

9. The method and apparatus of claim 1, g e k e n n z e i c h n e t d a d u r c h, d a ß

- Metallic foams (10) and non-metallic foams (31) are the result of foaming from solid, a defined liquid or with different consistencies and viscosities, multi-component, specially prepared phase, which when foamed into a density- and component-defined - possibly - differentiated closed-state foam structure is brought, possibly with subsequent completion of formation processes in a still hot or tough phase and afterwards for cooling to normal temperature,

- An incrusting one- or two-layer structure creates the condition of an electrically conductive base with a thermoelectroactive layer applied thereon on pre-milled particles of foam granulate or carbon framework structures - for later contact sintering (45) leads to foam-like volume-forming cutting and sayable or in the sintering structure process, which leads to the same process in the sintering process.

- The incrustation-applied layers are produced by introducing the initially new, electrically intrinsically conductive or non-conductive particles in mixer drums, in which, in the case of non-existent intrinsic conductivity, the addition of a suitably viscous paste of indifferent conductive varnish (18) takes place in a first step and that after drying in a second mixer drum, a layer of thermoelectroactive conductive lacquer (16) is applied in the same way,

the sintering is carried out by suitable pressing, extrusion of the incrusted particles, which are still wet or gradually predried, in the outer layer, with the end result of multiple partial contacting transition zones between the particles in the foam structure-like composite,

metallic foams (10) are the result of a differentiated heating of metals, in which the closed-cell structure of the foam structure is the result of an impact-like, metallic vapor phase of these metals, the metals themselves being the foamer (33),

- Metallic foams (10) are the result of a sudden energy input in their stored liquid phase, which contains a legally lower-boiling metal than Foamer (33) in a suitable proportion, which spontaneously evaporates due to the heating shock and thus the closed-cell structure of the metallic foam (10 ) builds up

metallic foams (10) are the result of a sudden introduction of energy into the dense liquid phase of metals which contain a particulate foam body (33), which is kept dispersed and swirled around the body, and which evaporates when heated,

non-metallic foams (31) can be produced from electrically conductive, pure substance or composite, definable flowable elements or connections using the same method,

- Electrically conductive, non-metallic foams (31) optionally with a purely through-contacting active phase (26) and or with a thermoelectroactive active phase (30) with a starting basis of pasty consistencies of conductive thick film pastes, electrically conductive-maximized resistive paste systems with thermally limited, organic lacquer basic components and their auxiliaries , are dissociative decay of a foamer (33), which takes place below the temperature level, beginning to take notice of the sensitive overall composite systems and their active components, such as conductivity mediators (20) and thermoelectroactive grain sizes (17), and provides indifferent cell gases that remain in the Cells of the foam structure behave in an anti-corrosive and indifferent manner and accordingly require sensitive, dielectric heating in accordance with professional judgment to foam such composite systems,

- Non-metallic foams (31) with a base of organic and inorganic, already electπsch conductive basic lacquer components, such as polyacetylene, polysulfurite, or suitable organic chain connections with polarizing side chains accordingly get a cell wall structure that is already conductive without embedded conductivity mediators (20),

- Non-metallic foams (31) with fπtteπ made of low-melting glass components (at 320 - 480) degrees Celsius with the addition of conductivity mediators (20) and or thermoelectroactive grain sizes (17) lead to electπsch conductance-optimized and thermoactive dense, glass-like or foamed cell wall structures of a closed cell structure, where part of the load forwarder is transported by trap tunneling,

10. The method of claim 9, g e k e n n z e i c h n e t d a d u r c h d a ß

- The production of density differentiated foams (23) of metals and non-metals or suitable foamable, multi-component composite systems by acting low to medium frequency induction fields with an intensity and frequency regulating regime for induction currents to be generated and field-penetrating dielectric heating triggering microwaves, depending on the nature of the foam to be foamed Components, in particular with regard to their electrical conductivity, the energetic emission component of the induction eddy currents acting via resistance heating in a melt foam hood and the energetic input component of the high-frequency microwave fields acting via dielectric heating are mutually varied and coordinated in a chronologically suitable sequence or simultaneity,

an optimization of the dilute heating necessary for melting and foaming is achieved only by means of a right-value-adjusted setting of the microwave field intensity within a microwave broadband spectrum and then with a frequency-changing regime within the broadband,

- An optimization of the induction currents for foamable conductive components with an intensity and frequency-influencing regime is carried out according to professional, metallurgical basic experience values as well as preliminary test series for the foaming of special metals and semiconductors as well as one-dimensional or Supeπonenleiter,

- The technical apparatus for inductive foaming is a modified melting hood, with the basic concept of a single-layer cylinder coil and that in it a determined, pre-liquefied, dense phase with a constantly swirling foamer (33) by means of the introduction of a targeted energy surge with spontaneous purely physical evaporation of the foamer (33 ) is foamed, whereby the foamer (33) can be a lower-boiling metallic or non-metallic component

- a distribution state of a previously particulate, subsequently chemically disintegrating, gaseous dissociative foamer (33) in the retained, determined liquid phase, which is due to the sustained induction eddy currents, becomes spontaneous gasification and thus leads to spontaneous gasification and thus to a large volume-increasing, homogeneous foam

- For the production of metallic foams Metallgπese or powder or their weakly sintered agglomerations soaked with a solvent with foamer (33) and after outgassing the Solvent vapor, the components metal and foamer (33), which have been intimately mixed in this way, are foamed from the solid phase by an energy shock,

- Microwave fields, which suitably transfer non-conductive components via dielectric heating with a foamer (33) into a foam structure, analogously first of all create a precisely and homogeneously tempered holding phase of the still dense, paste-like, viscous to viscous population of all components, which then create via entry of an analog energy surge such an amount of dielectric heating in the preheated lead phase that its spontaneous foaming occurs through the thermally dissociative foamer (33),

- If necessary, an expanding, controllable, pressurizing, barometric and acoustic auxiliary regime for the production of metallic (10) and non-metallic foams (31) is called, which is also enabled by broadband characteristics to trigger, accelerate or achieve special physical, latent processes for components that build up the foam structure to fix and stabilize, such as constant pressure-negative pressure states in the not yet fully foamed phase and fixation of the finished foam structure by means of permanent negative pressure,

- A sophisticated, gradually gradable, density-differentiating foaming (23) can be achieved by subsequent, longitudinal zone-differentiated, inductive loading or microwave exposure analogous to the crucible-free zone melting process with prefabricated, foam-structured coarse molds,

- A near-surface, density-differentiated foaming (23) with infrared deep irradiation takes place with regard to improved strength and contactability,

- Surface reliefs and structuring for contacting by laser can be designed on the near-surface foam structure.

- Reinforcements in the form of carbon fibers and or metal fibers are introduced to optimize the strength and conductance of non-metallic foams (31) stretched in the active phase,

- A high temperature foaming of magnetite with and without the addition of a dispersed foamer (33) can take place.

11. The method according to claims 10 and 9, g e k e n n z e i c h n e t d a d u r c h, d a ß:

- A component-differentiated foaming (27) for the gradation of through-contacting (26) and thermoelectroactive active phase (30) in the longitudinal course of thermo-limbs (7) is carried out within a continuous foam structure, by applying prepared, differentiated content-related conductive film thick-layer pastes, in triple layers Resistance pastes with an organic lacquer base or on a pigment base or the like modified modified conductive adhesives or conductive lacquers a common foaming process is carried out,

- the differentiation of the contents of the three batch layers is such that the middle phase only contains the through-contact active phase (26), but the upper and lower primarily contain the thermo-electroactive active phase (30),

- Accordingly, a foamed overall layer is formed in the form of a continuous, closed-cell foam structure after foaming, which has near-surface areas that can be designed for p / n and n / p junctions, thermo-electroactive end zones (34), and in intermediate surface areas only intermediate values (35) that are optimized for conductance .

12. The device according to claims 9 and 10, characterized by:

- Foamed passive leg parts (4), continuously foamed thermal legs (11), composite thermal legs (12), integrated active-passive thermal legs (14) thermoelectric strands (28) as well as the possible strand-assemble thermo legs (7) with a foam structure component for pressure-contacted thermoelectric strands (32 ) can be produced according to claim characteristics with regard to density-differentiated foaming (23),

- With the exception of the simple shapes of continuously foamed thermo-limbs (11) made of continuously identical, metallic foam (10) and in addition to those with a homogeneously distributed active phase in non-metallic foam structures, all of the above-mentioned thermo-limbs (7) in their manufacturing process continuously or subsequently also the process of component-differentiated foaming can complete.

13. The method and apparatus according to claims 9, 10 and 12, g e k e n n z e i c h n e t d a d u r c h, d a ß.

- Thermoelectric strands (28) are the result of foams in series of layers that can be produced as a preliminary thermoelectric series connection of thermocouples (7) with a foam structure component according to the invention and the method according to the endless push-through method, by a dimensionally stabilized, dense, even tougher or predried, in the axial direction additionally defines pressure-contacted, glued, cemented or ultrasonically welded strand from intervals of thus prepared, portioned compositions of thermocouples (7) passes through technical apparatus for inductive and / or dielectric heating, the regime of which, according to the preceding features of claim 10, for density-differentiated (23) and component-differentiated foaming 27 ) is adapted to the specific compositions of the portioned intervals of the strand,

- The leading to behind-connected p / n and n / p transitions, gradually differentiable foaming to thermoelectric strands (28) is referred to procedurally as differentiated boundary layer foam (29)

- The foamed, closed-cell merging intervals of the thermocouple (7) each with their p- and n-type electrothermal active zone (34) in a narrow, fine-pored to dense, thermally, electrically highly conductive, but indifferent zone, which pass along the side with thermal ring contact outwards, suitably lengthening and widening, into a warm-cold guiding device (21) which only receives thermal flow, the collector-like extensions being alternately offset by 180 degrees in order to incorporate the thermoelectrical principle of thermal parallel connection for hot-side receiving and cold-side receiving heat. To realize Kaite-Leiteinπchtungen (21) with electrical series connection of the p / n and n / p transitions of the thermoelectric strand (28),

- Thermoelectric strands can be produced from metallic foams (10) and or non-metallic foams (31), can be completely hermetically sealed and are highly heat-insulating, and can be foam-coated in a simple, handcrafted manner, in any number of selectable lengths to form large-area connections of high voltages and powers, with excellent thermal insulation function can be connected in series at the same time, since a thermoelectric strand (28) can already supply working voltages in the ten-volt range if suitable thermoelectrics (3) are selected,

the thermally-entering surfaces of the heat-cold guide devices (21) emerging on the street side, electrically safe insulating, highly resistant coatings made of Teflon, Hostafion or similarly anticorrosive, have unassailable and thermally stable polymers or other plastics,

- Pressure-contacted thermoelectric strands (32) deviating from the permanently fixed thermoelectric strands (28) made of thermo-limbs (7) with foam structure components up to 100% and or tight thermo-limbs (7) are otherwise made in the same structure, with the difference that from the ends of the pressure-contacted thermoelectric strand (32) acting axial pressure components take over the adequate contacting of the p / n and n / p transitions and thin elastic layers made of thermally-electrically conductive conductive rubber (37) or indifferent metal foils (38) on the inner surfaces of the strand - Segmented Warm-Kalteleit Einichtungen (21) implement the pressure components in a homogeneous surface contact.

14. The method and apparatus according to claim 4 and the preceding, g e k e n n z e i c h n e t d a d u r c h d a ß

- In order to obtain geometrical installation forms of continuously foamed thermo-limbs (11) for thermoelectric modules (1) the cementing profile contacting (39) is used according to the process by.

- These are foamed by suitable cutting, each p-type and n-type thermoelectric material (3), to the extent that surface open-ended, modular-type, interlocking toothing profiles of both types are mechanically or laser-cut smoothly, with indifferent conductive lacquer (18) at the joint surfaces are fully pore-smeared and pushed into each other with the interposition of an indifferent metal foil (38) and the sequence of the thermocouples (7) for tapped working voltages is realized in the sequence of this structure,

- In extension of which the thermal guide profile contact (40) is used by

an external guidance and thermally / electrically optimized cross-sectional reinforcement of the indifferent metal foil (38) with likewise thermally optimized capture surface advantageously provides the additional functional function of a functional warm / cold device (21),

- additionally non-positive, solder or conductive varnish-connected end surface contacts of the cut structures of metallic (10) and non-metallic foams (31) by means of clawing, tin-plated contact anchor claws (22) in cells soaked with potion solder or a suitable conductive varnish, the outstanding, continuously being realized Part that passes through the bedding wire (47), if applicable, active leg parts (2) galvanically and / or solely purely thermal, warm-cold guide devices (21) with electrical insulation (48),

- Suck in structures of non-metallic foams (31) instead of a solder joint and puddle, an initially thin, later hardening, electrically highly conductive component of an indifferent conductive varnish (18) on its surface from less than a few millimeters deep to capillary and then a density close to the surface under normal temperatures, for the same time form pierced contact anchor claws (22) non-positive lower layer,

- Double-clawed contact anchor claws (22) or such, double-sided, with spiral-arched intermediate extensions replace normal bridge electrodes (13) and thereby allow the construction of flat three-dimensionally archable thermoelectric modules (1),

- The spirally curved intermediate extensions of the double contact anchor claws (22) have a thermally contacting, frictional passage through the cooling body protrusion with suitable surface designs and accordingly provide thermal entry for the electrothermal active end zones (34) of the thermal legs (7) and provide the end position digs into the foam structures of the thermo-limbs (7), the formation of p / n and n / p

Passed over

15. The method according to claims 9 and 10, g e k e n n z e i c h n e t d a d u r c h, d a ß:

- An active phase formation with regard to electrical conductivities and embossing for maximum development of thermo-EMF in dense, in foam structures and similar, with regard to the initial thermoelectrics (3)

- Outside - and inside, with regard to the conductivity mediator (20) only after their localization in dense or foam-structured parts of thermo-limbs (7) is carried out in order to be a powerful thermoelectric-active

(30) and / or through-contact active phase (26) and accordingly, prior, accompanying or subsequent formation takes place as required,

- Accordingly, conductivity mediators (20) are formed with and / or in them to form an efficient through-contacting active phase (26) when fixation begins and has taken place in dense and foam structures,

- A re-formation of the foam structures of non-metallic foams which are still in the hot / warm phase

(31) is carried out by sending Sföme of certain strength through the still hot foam structures through the application of suitable voltages, which achieve an improvement in the through-contacting active phase (26) via mechanisms of electro-migration and integration of previously uncontacted, atomically localized leading atoms ,

- Likewise, a reformation in the still hot / warm phase is achieved by directing, so-called permanent polarization, which can be carried out by appropriate static electric fields, possibly those that are overlaid with a frequency field component of a suitable proportion, anisotropic thermoelectroactive grain sizes (17) ,

- In the hot / warm phase, such a re-formation of the thermoelectroactive active phase (30) can be carried out in just-nested foam structures or the not yet set or hardened conductive lacquer compounds, and in particular with polarizing, electrical fields, anisofopic, thermo-electroactive grain sizes (17) can be aligned in the thermoelectric preferred direction ,

- Bleiglanzkπstalle, nichtkubisch crystallized pyrite and similar anisofope crystal forms, in particular wirteliger systems sufficient Zerteilungsgrades within lacquer base components yet sufficiently harzahnlicher consistency, an outwardly directing polarization in ^'the thermoelectric (kristallachsenoπente) preferential direction are subjected by means of electrical fields, with simultaneous strombeauflagender, electric Leitwertoptimierung by electromigration ,

- A crystallographic thermoforming which improves the thermal EMF and is possible for various natural compound semiconductors can be used within hot glass phases by sufficient degrees of division of non-oriented, non-cubic-pyπ-like or exclusively anisotropic, temperable compound semiconductors or intermetallic compounds in heat-resistant, glass-like embedding types before cooling or the hot foam to foam-glass, thermoelectroactive structures at a viscous-entering consistency are subject to a crystal-encasing, field-applied tempering process with internal crystallographic and external preferential polarization, whereby in the case of a rapid expansion process the field strength is removed and immediately afterwards the just-finished, still hot foam structure is undiminished, if necessary intensified until complete cooling,

- An unlimited number of abruptly triggerable reversible formations between low-resistance semiconducting and high-resistance states of thermoelectroactive active phases (30) are possible, which consist of semiconducting

Chalcogenide glasses exist which are binary, ternary and quaternary systems made of S, Se, Te, As and Cd, Zn, Fe, Bi.Ti, Cu, Ag and those based on some transition metal oxides such as e.g. B. Cu ₂ 0 and Fe2θ ₃ and that, these

Switching states corresponding to conductivity levels with regard to the semiconducting low-resistance core to be achieved with voltage pulses of high 50 volts and the reversal into the high-resistance state can be achieved with adapted foam pulses,

ion cleaning and re-doping are used on crystal surfaces of natural compound semiconductors such as screens, glosses and gravel in order to improve their thermoelectric and electrical properties,

- A modification-converting, primarily thermal post-formation of meltable and foamable, non-metallic thermoelectrics (3) with regard to the formation of electrical conductivity and the ability to develop a thermo-EMF (against other thermoelectrics (3)) is carried out and accordingly thermoelectrics (3) with properties like this meltable and foamable selenium, which immediately after foaming in a glassy-amorphous state and after tempering in a suitable temperature-maintaining range, changes into a semi-metallic, electrically conductive, with pronounced thermoelectrical properties - undergoes this thermal reforming,

- Sulphidic compound semiconductors, such as galena, pyrite, chalcopyrite (gravel of sulfur) and other transition metal chalcogenides with suitable pyrite structures, are subjected to a thermochemical treatment which takes place under a thermal regime and produces a physical improvement in terms of purity, crystallinity and stoichiometry, one improving the thermoelectric properties Doping of thermoelectrically active grain sizes (17) with a suitable degree of division from these compound semiconductors can also be carried out,

- hydrothermally or otherwise formed, ore-like apertures, glosses and gravel, if necessary, complete the process of ion cleaning and subsequent doping, if high differential thermal forces that can be achieved justify this,

- On suitably density-differentiated, solidified surfaces of special metallic foams (10) or specially surface-pretreated, by means of transferring or synthesizing vapor phase fsports with addition of dopants via the intermediate stage of primary pyrrothin crystal synthesis, thermoelectrically preferred-oriented, doped polykstaller-oriented, initially magnetically aligned, suitable, magnetite layers are aligned, then the magnetite layers are appropriately aligned, then suitable for use in doped polykπstalline pyrite layers grow as orienting pyrrhotin layers or crystals and convert them into preferentially oriented pyrite layers under temperature reduction,

- The transferring vapor phase transport to suitable or pretreated metal foam, magnetite, carbon or silicon carbide or titanium nitride growth surfaces with the addition of dopants and 5.2 g bromine / liter of a highly diluted protective gas atmosphere made of hydrogen / argon within a magnetically flowable autoclave, each for p -conducting or n-conducting pyrite - absorbs undoped pyrite at approx. 800 degrees Celsius in a closed autoclave that can be flooded with magnetic fields and at approx. 550 degrees Celsius on the surface of the metallic foam (10) or the aforementioned growth areas of pyrrothin in doped, preferred-oriented form separates and finally through a suitable, reversing temperature regime Pyrite with high differential thermal power is formed and with the same sequence but milder conditions with iodine,

_*

- the more aggressive vapor phase transport with chlorine different kind of pretreatment of the surfaces of this still suitable metallic foams (10), required power or a chlorine-resistant, obtained by Laseraufsinterung or ^'thin Titannitπdzwischenenlage growth method on the metal foam,

the synthesizing vapor phase transport with iron pentacarbonyl or dieisen nonacarbonyl and hydrogen sulfide can take place under sensitive conditions in reactions below 200 degrees Celsius without simultaneous doping entry,

- The synthesizing vapor phase transport under robust conditions at over 300 degrees Celsius with iron (II) - chlorine or iron (II) bromide or particularly gentle on the substrate with iron (II) iodide and hydrogen sulfide or from 450 degrees Celsius with sulfur and the above-mentioned iron halides with doping effect from the Vapor phase can take place

- for p-line type doping with elements of the V. Main group or VII. Subgroup and doping with elements of VII. Main group or VIII. Subgroup are to be used for n-conduction type,

- With regard to stochiometry, in particular in the case of cheap pyrite and galena, in addition to other glosses, a sulfur treatment leads to the defect semiconductor and a vacuum treatment to the excess semiconductor and thus leads to the possibility of an immense increase in thermal EMF in an advantageous homojunction of these compound semiconductors with itself,

- In the incrustation for contact sintering (45) provided, still freely movable, pre-expanded particles in front of the same, the superficial embedding of a ferromagnetic subparticle (44) takes place at any point on the still resin-tough crust, the thermoelectric preferred direction being coordinated with a magnetic orientation of the Weiss areas the ferromagnetic subparticle (44), which transfers the same to the entire particle and that the overall alignment of the thermoelectroactive active phase of the particle, which is forced by magnetic and electrical field components, is formed in a free floating phase,

- After drying / hardening of the oriented particles, vibrate them with a vibration and an easily producible penetrating magnetic Fe component in a layering and aligning manner in ceramic hollow molds, after which they enter the contact sintering (45) under a flexible initial pressure,

- A total volume, homogeneous, tnermoelektπsch preferential, continuous wax-up (46) at least the dense structures of some variants of large-sized, thermoelectroactive collector hoods (19) or certain, at its outer end in a compressed state, thermoelectroactive end zones (34), and in particular thermoactive surfaces for direct p / n and n / p transitions can be achieved with the method of photopolymerization, in that polarizing electric fields only flood and orient thin thin, tough, monomeric green film of thermoelectroactive pastes emerging from a slot nozzle, which at the same time emerge from one Regimes of penetrating, ultraviolet or blue laser piles are started in a photopolymerizing process, with the external solidification of the chains and crosslinking of the molecules of the base lacquer component only ending after the process of layering or winding up the green body films.

16. Device according to claims 9 and 2, g e k e n n z e i c h n e t d a d u r c h, d a ß:

- A propellable thermoelectroactive foam conductive lacquer (25) under propellant pressure is stored in sprays, with all components suitable for spraying with regard to the thermoelectively active grain sizes (17), conductivity mediator (20), up to hm to fibrous reinforcements, which values for increasing conductivity and strength

Nozzle emerges immediately through the non-metallic foam (31) that builds up automatically, the blowing agent being the foamer (33),

17. Device according to claims 3, 2, 9, 10, 11 and 15, g e k e n n z e i c h n e t d a d u r c h, d a ß: for indifferent conductive lacquers (18) and indifferent foam conductive lacquers (24) the following approach for a plated-through hole

Active phase (26) is used in addition to other suitable ones: optionally or in equivalent proportions

Silver powder 54.4 / copper powder 46.2

Bismuth oxide 4.6, borosilicate 2.7

Rosin 8.3 turpentine and blowing agent total 30.0,

- Copper or silver in the same component batches can be substituted by nickel, aluminum and titanium and tin

- Use as further conductivity mediators (20) in modifiable batches with epoxy resin or borosilicate titanium nitride, lithium-doped titanium disulfide, silver sulfide, copper sulfide, magnetite and hard coal powder.

- One-dimensional conductors such as polyacetylene, doped and undoped poly-sulfurite, poly-sulfur chloride and other suitable, as highly intrinsically conductive basic lacquer components for indifferent (18) and thermoelectroactive θ

Conductive varnishes (16) provide the basis for self-conducting, dense structures and 'foam structures which, if possible, orientate an accompanying reforming regime in the preferred electrical direction.

- The remaining in the dense phase or closed-cell foam structures with the forming basic lacquer component indifferent and thermoelectroactive conductive lacquers (18), (16), and the indifferent and thermoactive foam conductive lacquers (24), (25) themselves can be electrically non-conductive - but due to better development of the active phases and of a higher electrical conductivity, which affects the dense or foamed structures as a whole, are to be chosen primarily electrically self-conductive - whereby in the case of a lack of intrinsic conductivity, sufficient conductivity mediators (20) must be added, whereas an intrinsically conductive basic lacquer component can be supplemented with these.

18. The method and apparatus according to claims 3, 9, 10, 11 and 15 g e k e n n z e i c h n e t d a d u r c h, d a ß:

- For a glass phase fixation of the through-contacting active phases (26) or the thermoelectrically active phases

(30) in dense structures or foam structures glass or frit components as a gentle, low-melting

Borosilicate bases of the following type of composition come into question:

73.8% PbO with 11.2% B ₂ 0 ₃ , 14.3% Si0 ₂ , 0.2% Al ₂ 0 ₃ or 73.4% PbO with 20.0% B ₂ 0 ₃ , 6.6% Si0 ₂

- After drying processes, pre-cast, viscous spread or pasty-rolled green sheets of the selected compositions of

- Metal powder from single and multi-component systems as conductivity mediators (20)

- thermoelectroactive grain sizes (17)

- glass powder - lead / borosilicate - Organic flux to adjust the viscosity

- Plasticizers for wetting and cleaning of insertable metallic warm-cold-guiding devices (21) or other reinforcements at 100 to 150 degrees Celsius then a homogeneously tempered liquid retention phase is generated and held at 350 to 500 degrees, which is spontaneously closed with inductive - dielectric energy shock The structure of a non-metallic foam (31) is formed and, if necessary, reformed until it cools down by flooding re-forming fields and the same influencing galvanic currents.

- A wax-up formation according to claim 15 with the omission of laser light in an analogous manner with thin films to be drawn from the liquid retention phase and thus the formation of unlimitedly large, preferably aligned thermoelectroactive volumes which, at any conceivable perpendicularly executed interface, have qualities for n / p and p / deliver n-transitions,

- The possibly reformed, dense, cooled phase is a highly heat-resistant indifferent or thermoelectroactive (18) conductive varnish (16) and the curved, cooled phase is accordingly a highly heat-resistant, indifferent (24) or thermoelectroactive foam conductive varnish (25) based on glass or feathers ,

- Alkali - in particular sodium silicate additive facilitates the formation of trap tunneling at normal temperature with transfer to the beginning of ion conduction at temperatures of 200 degrees Celsius - as well as a self-developing conductivity reforming if such working temperature ranges were briefly passed through under voltage,

- Special forms of glass-like structures can be formed with semiconducting chalcogenide glasses according to claim 15, which are inherently a thermoelectroactive active phase (30) which can be switched on by means of voltage surges of high 50 volts and can be switched off by means of adapted current surges.

19. The method and apparatus according to claims 3, 6 and preceding, g e k e n n z e i c h n e t d a d u r c h, d a ß:

- Microcrystalline silicon from aluminothermic process with raw materials pure - aluminum casting, potassium fluorosilicate or contamination-free quartz dust as an efficient thermoelectroactive grain size (17) for thermoelectroactive collector hoods (19), thermoelectroactive conductive lacquers (16), thermoelectronic foam conductive coatings (25) or as pulverized powder (25) ) is won,

- The aluminothermic reduction of a mixture of 125 parts of aluminum powder and 40 parts of pure potassium fluorosilicate leads to pure crystallized silicon which can be used in thermoelectrical arrangements and by heating a mixture hermetically sealed against the outside atmosphere to 700 degrees Celsius, cooling the reaction product and washing it out with pure hydrochloric acid and distilled water is available, the crystal fraction being given improved thermoelectric properties by heating with dopants in the absence of air,

- a small, well-distributed amount of boron trioxide, borosilicate or boric acid is to be taken into account for p-doping in aluminum inothermic batches, a small, well-distributed amount of aluminum orthophosphate, aluminum diphosphate or aluminum metaphosphate is to be taken into account for n-doping,

Borohydrides for subsequent p-doping, red phosphorus, yellow solid phosphorus hydrogen for subsequent n-doping of the microcrystalline silicon obtained by the reduction process are suitable, the requirements of a seal before the thermal aftertreatment in the temperature range 900-1100 degrees Celsius, a high degree of distribution, the correct amount of distribution and then the stabilization of the protective gas atmosphere that is formed during the process, while the finished doped batch is being cooled, must be ensured by expert action,

aluminothermic reduction of quartz dust and aluminum in compression and the same reduction of quartz dust with magnesium in compression leads to silicon, an excess of quartz dust which is to be measured professionally or an addition of magnesium oxide preventing the formation of silicon-consuming magnesium silicide,

the reduction of quartz with coal in the electric furnace to technically pure, the reductone of silicon tetrachloride, bromide and iodide leads to very pure silicon,

- The alumimothermic and quartz-carbon reduction silicon qualities in their thermoelectric properties can still be improved by dissolving in liquid aluminum with subsequent re-installation, whereby a distinctly larger crystal type is available which is of much greater purity.

20. The apparatus of claim 14, g e k e n n z e i c h n e t d a d u r c h, d a ß the cells contained with latent storage means of the foam structure of the bridge electrode (13) in the cementing

Profile contacting (39) and the thermal guide profile contacting (40) to save thermal offers and to be able to deliver them again for sustainable thermoelectric conversion.