WO2000041452A1 - Dispositif de mise en place de composants electriques sur des substrats - Google Patents

Dispositif de mise en place de composants electriques sur des substrats Download PDF

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Publication number
WO2000041452A1
WO2000041452A1 PCT/DE2000/000008 DE0000008W WO0041452A1 WO 2000041452 A1 WO2000041452 A1 WO 2000041452A1 DE 0000008 W DE0000008 W DE 0000008W WO 0041452 A1 WO0041452 A1 WO 0041452A1
Authority
WO
WIPO (PCT)
Prior art keywords
chassis
devices
transport
positioning arm
transport path
Prior art date
Application number
PCT/DE2000/000008
Other languages
German (de)
English (en)
Inventor
Johannes Werner
Georg Ketzer
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000041452A1 publication Critical patent/WO2000041452A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • a mounting device has become known in which the mounting head is held at the end of a pivotable articulated arm. This is mounted on a swivel arm which is mounted on a vertical, fixed pivot bearing of the mounting device.
  • the outline of the outline of the chassis is adapted to the travel range of the placement head.
  • US Pat. No. 4,910,859 also describes a mounting device with a horizontally movable first mounting head, which is fixed to a swivel articulated arm.
  • a second placement head is attached to a second swivel articulated arm and is used to feed the electrical components from peripheral pick-up locations to a transfer location, at which the components are picked up by the first placement head.
  • two adjacent automatic placement machines are also arranged along a continuous transport path for the printed circuit boards in a changing orientation.
  • the stations are arranged as kon ⁇ centered about a rotary table, the stepwise to the loading stuck circuit boards transported from station to station.
  • the circuit board transport is carried out under the swivel axis hm-, so that the supply modules for the components can be arranged on both sides of the transport. It is customary to line up such devices in the longitudinal direction of the circuit board transport in an assembly line, so that circuit boards with a large variety of components can be produced.
  • the invention has for its object to provide a mounting device that can be strung together with other mounting devices of similar design in a compact arrangement.
  • a long leg is formed on the side opposite the pivot axis, along which a correspondingly large number of components can be provided.
  • the swivel drive of the positioning arm can be as with start the mentioned patent application in the peripheral area, so that a high positioning accuracy is achieved.
  • the devices may be strung together in such a way that in each case adjacent side walls are arranged m closely spaced parallel to one another ⁇ .
  • the devices can have a different orientation, which results in differently extending transport routes corresponding to the sloping rare walls, which can be optimally adapted to the local conditions.
  • the positioning arm is transverse to the transport path of the circuit board and the transport path runs between the two rare walls.
  • a subsequent device can now be added in such a way that its adjacent side wall runs at a close distance from the adjacent side wall of the preceding device.
  • the side walls do not have to be designed as straight surfaces. They can have projections and depressions. However, these must be designed in such a way that they mesh with one another in the lined-up state.
  • the device according to claim 3 there is a mutual overlap of the individual devices with a small pitch, so that a very short assembly with a variety of devices can be formed. Almost the entire length of the assembly line is available on both sides of the transport route for the feeding of components.
  • the same devices are combined to form a compact circular arrangement. These circuit boards can be fed in and out on the same side of the arrangement.
  • the devices can also be strung together in a S-shape in semicircular segments. The devices can thus m their Optimally adapt the configuration to the conditions of the placement operation
  • the printed circuit boards lie alternately across or along the respective transport direction.
  • FIG. 1 shows a side view of a device for equipping substrates with electrical components
  • FIG. 2 shows a top view according to FIG. 1
  • FIG. 3 shows a top view of several linearly arranged devices according to FIG. 2
  • FIG. 4 shows a top view of several of the devices according to FIG. 1
  • FIG. 2 in a circular arrangement
  • FIG. 5 is a plan view of circular arrangements similar to FIG. 4.
  • a device for equipping substrates 1 with electrical components 2 has a chassis 3 on which a linear transport path 4 for the component carriers 1 designed as printed circuit boards is attached. Also attached to the chassis 3 is a carrier 5, on which sen top em fixed pivot bearing 6 is attached for a längli ⁇ chen positioning arm 7. The axis of rotation of the rotary bearing 6 is perpendicular to the plane of the transport path 4 on which the substrate 1 rests. On the underside of the positioning arm 7 facing this em placement head 8 is arranged, which can be moved along the positioning arm 7 according to the horizontal movement arrows.
  • the positioning arm 7 can be pivoted parallel to the substrate plane about the rotary bearing 6 by means of a linear motor which is formed from a coil part 9 fastened to the positioning arm 7 and stationary magnetic parts 10. These extend concentrically to the pivot bearing 6 along the travel path of the coil part 9 and are fastened to a part-shaped support part 11 which is anchored to the chassis 3 by means of two holders 12.
  • the positioning arm can be pivoted by means of the linear motor to such an extent that the placement head 8 can cover the entire placement field of the substrate 1.
  • the linear motor can be moved with a high degree of accuracy in accordance with the curved movement arrows. After reaching a selected angular position, the linear motor is electromagnetically fixed in its position. The positioning arm 7 is thus held in the area of both ends, as a result of which harmful bending vibrations are largely avoided.
  • the chassis 3 has an essentially triangular shape in which the pivot bearing is 6 m from one of the corners.
  • feed modules 13 are strung together.
  • the transport path 4 extends parallel to this outside.
  • the two other outer sides of the chassis form mutually V-shaped side walls 14 through which the transport path is passed for 4 hours.
  • several of the devices 15 m alternately opposite orientation are lined up in such a way that there is a straight through transport route 4.
  • Two side walls 14 facing each other run a small distance parallel to each other, so that there is a small pitch between the individual devices 15 and a small overall length of the system.
  • the feed modules 13 are now arranged alternately on both sides of the transport path 4.
  • the devices 15 are circularly strung together, the pivot bearings 6 being arranged on the same side of the transport route. According to the V-shaped taper of the side walls at an angle of e.g. At 60 ° there is a very compact circular arrangement of the devices 15. However, these are not combined into a full circle. Instead of a place for one of the devices, feed and discharge devices are provided here for the substrates 1, which connect to the first or last transport section 4.
  • the feed modules 13 are all on the outside of the system and are accordingly easily accessible.
  • a right angle is provided between the two rare walls 14 of the modified device 15.
  • the individual transport routes 4 of the devices 15 are now at right angles to one another.
  • the rectangular substrates can now be transferred from one transport 4 to another without twisting, although the substrate 1 is alternately oriented longitudinally or transversely to the transport direction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif (15) présentant un châssis triangulaire (3) sur lequel un bras de positionnement (7) est placé de manière à pouvoir pivoter autour d'un coussinet de pivotement (6). Plusieurs dispositifs (15) peuvent être juxtaposés de sorte que les parois latérales de châssis consécutives soient parallèles les unes aux autres. Les coussinets de pivotement de deux dispositifs consécutifs (15) peuvent être placés sur le même côté ou sur des côtés opposés du tronçon de transport, de façon à créer différentes directions de transport. On obtient ainsi un agencement compact desdits dispositifs (15).
PCT/DE2000/000008 1999-01-07 2000-01-03 Dispositif de mise en place de composants electriques sur des substrats WO2000041452A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19900288A DE19900288C1 (de) 1999-01-07 1999-01-07 Vorrichtung zum Bestücken von Substraten mit elektrischen Bauelementen
DE19900288.6 1999-01-07

Publications (1)

Publication Number Publication Date
WO2000041452A1 true WO2000041452A1 (fr) 2000-07-13

Family

ID=7893689

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/000008 WO2000041452A1 (fr) 1999-01-07 2000-01-03 Dispositif de mise en place de composants electriques sur des substrats

Country Status (2)

Country Link
DE (1) DE19900288C1 (fr)
WO (1) WO2000041452A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10060205A1 (de) * 2000-12-04 2002-06-13 Siemens Production & Logistics Vorrichtung zum Bestücken von Substraten mit elektrischen Bauteilen

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630178A1 (de) * 1986-09-04 1988-03-17 Preh Indausruestung Gmbh Rechnergesteuerte montageeinrichtung
DE3805781A1 (de) * 1987-02-24 1988-09-08 Alliance Automation Systems Teile-zufuehreinrichtung fuer eine automatische leiterplatten-bestueckungsmaschine
US4910859A (en) * 1984-04-06 1990-03-27 Holcomb Gregory W Circuit assembly system
EP0377248A1 (fr) * 1989-01-06 1990-07-11 Koninklijke Philips Electronics N.V. Procédé et dispositif pour placer des composants sur un support
WO1996013143A1 (fr) * 1994-10-19 1996-05-02 Siemens Aktiengesellschaft Machine a plateau circulaire pour implanter des composants sur des substrats

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4910859A (en) * 1984-04-06 1990-03-27 Holcomb Gregory W Circuit assembly system
DE3630178A1 (de) * 1986-09-04 1988-03-17 Preh Indausruestung Gmbh Rechnergesteuerte montageeinrichtung
DE3805781A1 (de) * 1987-02-24 1988-09-08 Alliance Automation Systems Teile-zufuehreinrichtung fuer eine automatische leiterplatten-bestueckungsmaschine
EP0377248A1 (fr) * 1989-01-06 1990-07-11 Koninklijke Philips Electronics N.V. Procédé et dispositif pour placer des composants sur un support
WO1996013143A1 (fr) * 1994-10-19 1996-05-02 Siemens Aktiengesellschaft Machine a plateau circulaire pour implanter des composants sur des substrats

Also Published As

Publication number Publication date
DE19900288C1 (de) 2000-04-20

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