WO2000040642A1

WO2000040642A1 - Resin molded product

Info

Publication number: WO2000040642A1
Application number: PCT/JP1999/006090
Authority: WO
Inventors: Hiroya Kakegawa
Original assignee: Osaka Gas Co., Ltd.
Priority date: 1998-12-28
Filing date: 1999-11-01
Publication date: 2000-07-13
Also published as: JP3634752B2; MY135326A

Abstract

A resin molded product exhibiting a higher conductivity than that which can ordinarily be expected of the content of a conductive filler, especially a low surface resistance. This resin molded product contains a matrix of a resin material and a conductive filler dispersed in the matrix. The content of the conductive filler is set to less than 20 wt. %, and a voltage of 20 kV or higher and lower than a breakdown voltage of the matrix is applied. The conductive filler is made of fibers such as carbon fibers or graphite fibers having an average diameter of 0.002 to 15 microns, for example. This resin molded product usually contains a coloring agent dispersed in the matrix together with the conductive filler and presents a color according to that coloring agent.

Description

Resin molding

Technical field

The present invention, moldings, in particular, _c relates to a resin molded product

Background art

Molded bodies made of resin materials are widely used in the field of electrical and electronic components because they generally exhibit excellent electrical insulation properties. However, writing the resin material itself

Electric and electronic component materials obtained by molding are generally easily charged due to their high electrical insulation properties, and are liable to damage electronic components such as integrated circuits due to adhesion or discharge of dust. is there. For this reason, a resin molded body used in the semiconductor manufacturing field or the like is usually given weak conductivity by various methods.

As a simplest method for imparting conductivity to a resin molded body, a method of applying a surfactant solution to the resin molded body is known. In this method, a surfactant solution is separately applied to the already manufactured resin molded body in a separate step, so the surfactant solution is applied in addition to the resin material molding step. An additional process is required. In addition, the conductivity of the resin molded body obtained by such a method is easily affected by humidity, and exhibits the required conductivity under conditions where the surface of the resin molded body is easily wet (that is, in a high humidity state). Although it is easy, it does not easily exhibit the required conductivity under conditions where the surface is hardly wet (ie, dry). Furthermore, in the resin molded body obtained by this method, the applied surfactant is often absorbed into the molded body or removed from the surface by friction, so that a decrease in conductivity over time is avoided. Absent. For this reason, such a resin molded body maintains conductivity for a long time. As difficult as possible, the surfactants removed can cause contamination in the semiconductor manufacturing process.

Therefore, recently, attempts have been made to impart conductivity to the resin molded article itself from the beginning instead of the above-described method of imparting conductivity later by applying a surfactant solution. Here, a resin molded body having conductivity is realized by adding a conductivity-imparting material to a resin material in advance, mixing or kneading the resin material, and molding such a resin material into a required shape. are doing. The conductivity-imparting material used at this time is usually an antistatic agent such as a surfactant, or a conductive filler such as a metal material or a carbon material.

Here, when an antistatic agent such as a surfactant is selected as the conductivity-imparting material, the antistatic agent gradually migrates from the inside of the resin molded product to the surface, so that the resin molded product becomes conductive. It takes a long time to develop. In addition, since the effect of the antistatic agent differs depending on the type of resin material, it is necessary to select an antistatic agent suitable for the resin material, taking into account the glass transition temperature, crystallinity, and compatibility with the resin material. There is. Furthermore, the antistatic agent that has migrated to the surface of the resin molded body is often removed by friction, as in the case of the above-described coating method, and as a result, contamination can occur in the semiconductor manufacturing process and the like. There is also.

On the other hand, the conductive filler can quickly impart conductivity to the resin molded article only by mixing an appropriate amount with the resin material. Unlike the case of the antistatic agent, the conductive filler is not compatible with the resin material. Because there is no need to consider combinations (ie, because it has versatility for various resin materials), it is easier to achieve stable conductivity for molded products than when using an antistatic agent. Can be granted.

Incidentally, as a resin molded product containing a conductive filler, Japanese Patent Application Laid-Open No. 63-53017 discloses a resin molded product having a volume of 64 to 80 volumes. / ₀ resin and 36 to 20% by volume of conductive material It describes a resin molded product obtained by molding a resin composition containing the resin composition, wherein a desired resistance value is achieved by applying a voltage of 1,000 V or less. The conductive substance used here is a particle or fiber of a good electrical conductor such as a metal, a metal oxide, and carbon, or a mixture thereof, and the specific gravity thereof is generally considered to be 1 or more. It is considered that the resin molding contains at least 20% by weight of the conductive substance.

Also, Japanese Patent Application Laid-Open No. 62-110117 discloses that a linear body (core) formed of a polymer (a resin material) containing a conductive substance is coated with an insulating polymer. It describes a conductive composite linear body obtained by subjecting a composite linear body on which layers are arranged to a treatment with a high voltage of 10 kV or less, that is, a resin molded body. The conductive substance used here is, for example, carbon black, and its use amount is, for example, 20 to 200% by weight based on the weight of the polymer.

However, the conductive filler is more expensive than the resin material. For example, the prices in Japan of polypropylene resin and modified polyphenylene oxide resin, which are widely used for producing resin molded articles, are approximately 100 yen / kg and 1.0 yen, respectively, at the time of filing the present application. The price of pitch-based carbon fiber and carbon black used as conductive materials in Japan during the same period was approximately ¥ 3,000 / kg and ¥ 500 / kg, respectively. , 000 yen / kg. Therefore, all of the resin molded articles described in the above-mentioned publications have a large amount of conductive filler mixed with the resin material, and thus can have the required conductivity, but are extremely expensive. In particular, when it is necessary to impart conductivity close to that of a metal to the resin molded body and to enhance the shielding property against electromagnetic waves, the amount of conductive filler to be added to the resin material becomes large. Such a resin molded product is significantly more expensive than other products. Also, in this case, a large amount of conductive filler contained in the resin molded body depends on the resin material. There is a possibility that various properties originally attained may be impaired, and the conductive filler may easily fall off from the resin molded article, which may cause contamination.

Furthermore, since the resin molded article described in the above-mentioned Japanese Patent Application Laid-Open No. 63-53017 contains a large amount of conductive filler, its color tone is strongly affected by the color of the conductive filler. In particular, since the resin molded body described in the examples of this publication contains a large amount of carbon fiber or graphite powder as the conductive filler, the color naturally becomes black, and the desired color itself is obtained. It is extremely difficult to grant freely. On the other hand, the molded article described in Japanese Patent Application Laid-Open No. Sho 62-1100917 has such a structure as to the core in order to realize a color that is in harmony with other non-conductive fibers. As a result of arranging the coating layer for realizing the color, the structure becomes complex with a two-layer structure of the core and the coating layer.

An object of the present invention is to increase the conductivity of a resin molded body while suppressing the amount of a conductive filler to be added, and particularly to reduce the surface resistance.

Another object of the present invention is to realize a resin molded body which exhibits high conductivity, particularly low surface resistance, and is provided with a color despite the addition amount of the conductive filler being suppressed. . Disclosure of the invention

The resin molded article according to the present invention includes a matrix made of a resin material and a conductive filler dispersed in the matrix, the conductive filler content is less than 20% by weight, and 20 k A voltage application process of V or more and less than the dielectric breakdown voltage of Matritus has been performed. The content of the conductive filler is, for example, not less than 1.0% by weight and not more than 16% by weight. Further, where a conductive filler to be used, for example, the filler group electrical resistance 1 0 ⁵ Ω cm or more 1 0- ² Ω cm or less belongs to. The conductive 14 filter is, for example, a fibrous material. In this case, the average fiber diameter of the conductive filler is, for example, not less than 0.02 μm and not more than 15 μm. The average residual flux ratio of the conductive filler in the resin molded body is, for example, 10 or more and 100 or less. Further, the resin molded article of the present invention further includes, for example, a coloring material dispersed in a matrix together with a conductive filler. In this case, the conductive filter is, for example, at least one of a carbon fiber and a graphite fiber. Further, in this case, a concealing material for concealing the color of the conductive filler, which is dispersed in the matrix together with the conductive filler and the coloring material, may be further included.

The surface resistance of the resin molded article of the present invention as described above, is usually less than 1 0 ⁵ Ω / mouth least ¹ 0 1 ² ΩΖ port.

Since the resin molded article of the present invention has been subjected to a predetermined voltage application treatment, it can exhibit higher conductivity, especially small surface resistance, than other resin molded articles containing the same amount of conductive filler. In other words, the resin molded body can exhibit higher conductivity than expected normally from the content of the conductive filler contained therein, in particular, small surface resistance. In addition, since the content of the conductive filler is regulated in the above range, the resin molded body may exhibit a color according to the color of the coloring material when the coloring material is dispersed in the matrix. .

A resin molded article according to another aspect of the present invention includes a matrix made of a resin material, and a conductive filler dispersed in the matrix, wherein the content of the conductive filler is less than 20% by weight. In addition, the surface resistance after heat treatment of the resin material at the softening point and cooling to room temperature is 100 times or more the surface resistance before heat treatment. The content of the conductive filler is, for example, not less than 1.0% by weight and not more than 16% by weight. In addition, the surface resistance of this resin molded body, when subjected to a heat treatment followed by a voltage application of 2 OkV or more and less than the dielectric breakdown voltage of the matrix, is usually The surface resistance before application processing is 1 Z 100 or less.

The resin molded body further contains, for example, a coloring material dispersed in a matrix together with a conductive filler. In this case, the resin molded body may further include a concealing material for concealing the color of the conductive filler dispersed in the matrix together with the conductive filler and the coloring material, for example.

The resin molded article according to these aspects has a lower surface resistance and can exhibit higher conductivity than other resin molded articles containing the same amount of conductive filler. In addition, since the amount of the conductive filler to be added is regulated in the above-described range, the resin molded body can exhibit a color according to the color of the coloring material when the coloring material is dispersed in the matrix. .

The method for producing a resin molded article according to the present invention includes the steps of: preparing a molding material containing a resin material and a conductive filler, wherein the content of the conductive filler is set to less than 20% by weight; The method includes a step of molding the molding material into a predetermined shape, and a step of applying a voltage of 20 kV or more and less than the dielectric breakdown voltage of the resin material to the molded molding material. Here, the content of the conductive filler in the molding material is set to, for example, 1.0% by weight or more and 16% by weight or less. The molding material further includes, for example, a coloring material. Further, in this case, the molding material may further include a concealing material for concealing the color of the conductive filler.

In such a production method of the present invention, since a predetermined voltage is applied to a molded material containing a conductive filler and is molded, the same amount of a conductive filler is used by a conventional production method. It is possible to realize a resin molded body having higher conductivity as compared with a manufactured one, particularly, a small surface resistance. In addition, in this method, the content of the conductive filler in the molding material is regulated to a certain amount or less. Therefore, when the molding material contains a coloring material, the color according to the coloring material is changed to a resin molding. Can be provided. The processing apparatus of the present invention is a resin composition containing a conductive filler in a proportion of less than 20% by weight. A voltage application section for applying a voltage of 20 kV or more and less than the dielectric breakdown voltage to the resin molded article, and a resin molded article directed to the voltage application section. And a transport unit for transporting.

A processing apparatus according to another aspect of the present invention is also for increasing the conductivity of a resin molded product containing a conductive filler in a proportion of less than 20% by weight, An electrode for applying a voltage of 0 kV or more and less than the dielectric breakdown voltage, and a transport means for transporting the resin molded body toward the electrode so that the electrode and the resin molded body are opposed to each other with a space therebetween. Provided, and the transportation means is grounded.

Here, the electrode is an electrode group including, for example, a plurality of needle-shaped electrodes. In this case, the processing device further includes, for example, an interval adjusting device for adjusting an interval between the electrode and the resin molded body. On the other hand, the transfer means can, for example, transfer a large number of resin molded articles to the electrodes sequentially and continuously.

The apparatus for treating a resin molded article according to the present invention can convey the resin molded article toward the voltage applying section by the conveying means, and apply a predetermined voltage to the resin molded article there. Thus, it is possible to easily increase the conductivity of a resin molded body containing only a small amount of a conductive filler of a certain amount or less, and particularly to easily lower the surface resistance.

Other objects and advantages of the present invention will become apparent from the following detailed description.

FIG. 1 is a schematic configuration diagram of a voltage application device used for manufacturing the resin molded article of the present invention. FIG. 2 is a diagram showing the results of thermogravimetric analysis performed on an example of a resin molded body. FIG. 3 is a diagram showing a thermogravimetric analysis result of the disk obtained in Example 1. FIG. 4 is a diagram showing a thermogravimetric analysis result of the disk obtained in Example 2. FIG. 5 is a diagram showing a thermogravimetric analysis result of the disk obtained in Example 3. FIG. 6 is a graph showing the relationship between the content of the fiber group and the surface resistance of the disk obtained in Example 14 before and after the voltage application treatment. Detailed description of the invention

The resin molded body of the present invention mainly includes a matrix and a conductive filler dispersed in the matrix.

The matrix is made of a resin material and is formed into a desired shape. The resin material used here is not particularly limited, and is a known thermoplastic resin or thermosetting resin.

Here, examples of the thermoplastic resin include general-purpose plastics such as polyethylene resin, polypropylene resin, polystyrene resin and polyacrylstyrene resin, acrylic-butadiene-styrene resin (ABS), polyphenylether resin, polyacetal resin, and polycarbonate resin. , Polybutylene terephthalate resin, polyethylene terephthalate resin, engineering plastics such as nylon 6 and nylon 6,6, as well as polyether ether ketone resin, polyamide resin, polyimide resin, polysulfone resin, and 4-fluoroethylene-ethylene Polymer resin, polyvinylidene fluoride resin, 4-fluoroethylene-perfluoroalkylvinyl ether copolymer resin, polyetherimide resin, polyether resin Examples include super engineering plastics such as a sulfone resin, a polyphenylene sulfide resin, a modified polyphenylene oxide resin, a polyphenylene ether resin, and a liquid crystal polymer. Examples of the thermosetting resin include a phenol resin, an epoxy resin, a polyimide resin, and an unsaturated polyester resin.

On the other hand, the conductive filler dispersed in the matrix is not suitable for the resin molding. Metal material, a carbon material, an organic material coated with a metal material, an inorganic material coated with a metal material, an inorganic material coated with carbon, or graphite. It is a coated inorganic material, or a mixture of two or more arbitrarily selected from these groups.

Here, examples of the metal material include silver, copper, nickel, iron, aluminum, stainless steel and tin oxyacid. Examples of the carbon material include carbon, carbon black, acetylene black, ketjen black, and graphite obtained by firing a carbon precursor such as polyacrylonitrile resin, pitch, kainol resin, rayon, and lignin. Examples of the organic material coated with a metal material include a nickel-coated resin. Examples of the inorganic material coated with a metal material include nickel-coated glass, silver-coated glass, aluminum-coated glass, nickel-plated glass, and nickel-plated carbon. Examples of the inorganic material coated with carbon include potassium titanate coated with carbon. An example of the inorganic material coated with graphite is a titanate rim coated with graphite.

In addition, the above-mentioned conductive fillers are various kinds such as a granular form, a flake form, a whisker form, and a fiber form, or an arbitrary mixture thereof, and the shape is not particularly limited. For example, as the granular material, silver powder, copper powder, nickel powder, iron powder, and tin oxide powder are used as the metal material, and silver-coated glass beads are used as the inorganic material coated with the metal material. Further, carbon black, acetylene black and ketjen black can be cited as those made of carbon materials. Examples of the flakes include aluminum flakes and nickel methanol. Further, as the whiskers, potassium titanate whiskers coated with carbon as a carbon-coated inorganic material Graphite whiskers can be cited as examples of the car made of carbon material. Further, the fibrous materials include long fibers and short fibers such as aluminum, copper, and stainless steel as those made of a metal material, and aluminum-coated glass fibers made of an inorganic material coated with a metal material. Or nickel-plated glass fiber, furthermore, nickel-coated resin fiber as an organic material coated with a metal material, and polyacrylonitrile-based carbon fiber, isotropic pitch-based carbon fiber as a carbon material. And carbon fibers such as anisotropic pitch-based carbon fiber, force-inol resin-based carbon fiber, rayon-based carbon fiber and lignin-based carbon fiber, and graphite fiber.

In addition, a preferable conductive film used in the present invention is that the required electric conductivity, particularly a small surface resistance can be realized in a resin molded body with a smaller amount of use. ⁵ Omega cm above 10- ² Omega cm following are more preferably not more than 10 ⁴ Omega cm above 10- ² Ω cm. Here, the group of electrical resistance values of the filler is not the electrical resistance value of the individual pieces of the conductive filler contained in the resin molded product, but the electrical resistance value of the conductive filler group (aggregate). It means something that is required as follows. First, an electric insulator having a through hole with a diameter of 0.8 cm in the center is prepared, and one end of the through hole is sealed with a copper electrode. Then, a group of conductive fillers of 0.5 g is filled in the through-hole, a copper push rod is inserted from the other end of the through-hole, and a pressure of 20 kgf Zcm ² is applied to raise the group of conductive fillers to a height X. Mold into a column of cm. In this state, a measuring instrument is connected between the electrode and the push rod, and the electric resistance value of a group of the conductive filler compressed in the through hole is measured. FILLER group electric resistance, the area of the end face of the molded body of the conductive fillers groups measured electrical resistance value (i.e., 0. 4 ^² 7u cm ²⁾ multiplied by and dividing the value by the height X cm volume It can be obtained as the resistance value (Ω cm). The measuring instrument used to measure the electrical resistance value of a group of conductive fillers is blank It is preferable to be able to cancel the electric resistance of the electrode, that is, the electric resistance when the electrode and the push rod are brought into direct contact. For example, a digital multimeter "R6552" manufactured by Advantest Co., Ltd. be able to. Hereinafter, the term “filler group electric resistance value” refers to the volume resistance value of the aggregate of the conductive fillers thus determined.

Also, the conductive filler is preferably a fibrous one, particularly an ultrafine fibrous one having an average fiber diameter of not less than 0.02 μπι and not more than 15 zm. When such a fibrous conductive filler is used, the required conductivity, particularly a small surface resistance, can be realized in the resin molded body with a smaller amount of use, and the desired coloring material described later can be used. It becomes easy to freely impart a color, particularly a vivid color, to the resin molded product. When an ultrafine fibrous conductive filler having an average fiber diameter of 0.002 μm or more and 2 μm or less is used, it is assumed that the conductive filler is carbon fiber or graphite fiber made of a black carbon material. Even if a coloring material described below is used alone, that is, a clear color can be easily imparted to the resin molded body without using a concealing material described later.

An example of the ultrafine fibrous conductive filler having an average fiber diameter of about 0.02 μm is Hyperion (a trade name of Hyperion), which is a kind of carbon fiber.

When the fibrous material as described above is used as the conductive filler, the resin molded product of the present invention has an average residual factor ratio of the conductive filler of 10 or more and 100, 0 or more. It is preferably manufactured so as to be not more than 00, more preferably not less than 15 and not more than 100,000. If the average residual factor ratio becomes less than 10 in the manufacturing process, the desired conductivity, particularly a small surface resistance, may not be achieved unless the amount of the conductive filler added is increased. Conversely, the average residual aspect ratio of the conductive filler exceeds 100,000 Resin moldings are generally difficult to manufacture. The residual aspect ratio here is not the above-described aspect ratio of the conductive filler before mixing with the resin material, but after mixing with the resin material and molding the resin material. Means the aspect ratio (fiber length / fiber diameter) of the conductive filler. Incidentally, this residual factor ratio is determined by, for example, thermally decomposing or dissolving the resin material constituting the resin molded body in a solvent to separate the conductive filler from the resin molded body. When the average length and average diameter of 100 pieces are measured with an optical microscope or a scanning electron microscope, it can be determined based on those values.

Further, the resin molded article of the present invention may further include a coloring material dispersed in a matrix together with the above-mentioned conductive filler. This coloring material is for imparting a desired color to the molded article of the present invention, and is not particularly limited as long as it is non-conductive. It is an inorganic pigment. Specific examples of organic pigments that are preferably used include azo pigments such as naphthol red, condensed azo yellow and condensed azo red, phthalocyanine pigments such as copper phthalocyanine blue and copper cap cyanine green, and dianthraquinolyl red. And condensed polycyclic pigments such as thioindigo, verinone orange, beryllen scarlet, quinatari domagenta, isoindolinone yellow, quinophthalone yellow, and pyrrolinore red. Specific examples of inorganic pigments preferably used include zinc oxide, titanium oxide, red iron oxide, oxide pigments such as chromium oxide, cobalt darine, and cobalt blue; sulfide pigments such as cadmium yellow and force red; and ultramarine blue. Silicate pigments, such as calcium carbonate, and phosphate pigments, such as manganese biorete. It is preferable that these coloring materials are appropriately selected and used in consideration of compatibility with the resin material to be used, and they may be appropriately mixed and used to achieve a desired color. Further, when the resin molding of the present invention contains the above-mentioned coloring material, the resin molding further contains a concealing material for concealing the color of the conductive filler, which is dispersed in a matrix together with the conductive filler and the coloring material. Is also good. The concealing material used here suppresses the color of the resin molded body given by the colorant from being influenced by the color of the conductive filler, and makes the resin molded body exhibit a vivid color by the colorant. Usually, a non-conductive white granular material is preferable. Specifically, for example, titanium oxide, My power, talc, and calcium carbonate are used. In the resin molded article of the present invention, the content of the above-mentioned conductive filler is less than 20% by weight, preferably from 0.01% by weight to less than 20% by weight, more preferably from 0.1% by weight to 1% by weight. It is set so as to be 8% by weight or less, more preferably 1.0% by weight or more and 16% by weight or less. If the content is 20% by weight or more, the resin molded product may become expensive and the conductive filler may fall off from the resin molded product to cause contamination. In addition, the color of the resin molded body is strongly affected by the color of the conductive filler, and it is difficult to set the resin molded body to a desired color corresponding to the color of the coloring material even when a concealing material is used. become. Further, when the conductive boiler is granular, the mechanical strength of the resin molded article may be reduced. On the other hand, when the conductive filler is fibrous, easily warped molded resin, also increases the surface roughness of the resin molding, there fear force ^s surface smoothness is impaired.

Further, the content of the coloring material and the concealing material in the matrix is not particularly limited, and can be arbitrarily set according to the saturation and lightness of the color to be applied to the resin molded product. However, it is preferable to set such that the various characteristics of the resin molded body provided by the resin material constituting the matrix are not hindered. Specifically, the colorant is preferably set to be 0.1% by weight or more and 5.0% by weight or less of the weight of the resin molded body, and more preferably 0.2% by weight or more and 2.0% by weight or less. It is more preferable to set it below. Also, the concealing material is based on the weight of the resin molding.

It is preferably set to be 0.1% by weight or more and 10% by weight or less, and more preferably set to be 0.2% by weight or more and 5.0% by weight or less.

Incidentally, since titanium oxide used as a coloring material or a concealing material can function as a photo-oxidation catalyst, a resin molded article containing a large amount of it tends to be oxidized and deteriorated under light irradiation. Therefore, when titanium oxide is used as a coloring material or a concealing material, its content is preferably kept as small as possible, specifically, about 0.1 to 2.0% by weight of the resin molded body.

The resin molding of the present invention has been subjected to a voltage application treatment. This application process is a process for a matrix made of the above-described resin material, which contains the conductive filler and, if necessary, the coloring material and the concealing material, and is formed.

The voltage applied in this process is usually 20 kV or more, and the matrix of the resin molded body, that is, less than the dielectric breakdown voltage of the resin material constituting the matrix, preferably 20 kV or more and 50 kV Set to V or less. When the applied voltage is less than 20 kV, the conductivity of the resin molded article of the present invention may not be increased to a level higher than the conductivity of ¾fe depending on the content ratio of the conductive filler. Even if the conductivity can be improved in some cases, there is a problem in its reproducibility. Conversely, if the applied voltage is higher than the dielectric breakdown voltage of the matrix (resin material), the resin molded article may be damaged. The above-mentioned dielectric breakdown voltage is a value specific to each resin material and is described in various handbooks and other documents, and such description can be referred to. Incidentally, the dielectric breakdown voltage shown in various documents is usually expressed in units of MVZm, and is a value for a molded product having a thickness of lm formed using a resin material. It is preferable to appropriately calculate a dielectric breakdown voltage value according to the thickness of the molded body.

Although the time required for this processing is not particularly limited, it is usually 1 About 600 seconds, preferably about 5 to 60 seconds. Even if a voltage is applied for more than 600 seconds, the conductivity of the resin molded body does not increase beyond a certain level, which is rather uneconomical. Next, a method for producing the resin molded article of the present invention will be described.

First, a molding material is prepared by mixing the above-described resin material, conductive filler, and if necessary, a coloring material and a concealing material. Here, the mixing amount of the conductive filler is such that the proportion in the molding material is less than 20% by weight, preferably from 0.01% by weight to less than 20% by weight, more preferably from 0.1% by weight to 18% by weight. % By weight, more preferably from 1.0% by weight to 16% by weight. When a coloring material is used, its mixing amount in the molding material is from 0.1% by weight to 5.0% by weight, preferably from 0.2% by weight to 2.0% by weight. /. Set as follows. Further, when the concealing material is used, the mixing amount is set so that the proportion in the molding material is 0.1% by weight or more and 10% by weight or less, preferably 0.2% by weight or more and 5.0% by weight or less. .

The method of mixing the resin material and the conductive filler is not particularly limited.For example, a method of kneading the resin material by supplying a conductive filler using various known feeders or the like is employed. can do. At this time, the viscosity of the resin material may be adjusted in advance as needed in order to enhance the dispersibility of the conductive filler.

When the molding material contains a coloring material and a concealing material, these can be mixed with the conductive filler and the resin material by the above-described method at the same time. In this case, the coloring material and the concealing material are dispersed in the resin material together with the conductive filler, and the molding material is colored in a color corresponding to the type of the coloring material used.

Next, the obtained molding material is molded into a desired shape, for example, a plate shape or a fibrous shape, to obtain a resin molded body. Here, various known molding methods such as a pressure molding method, an injection molding method, and an extrusion molding method can be employed. If the molding material contains a coloring material, The resin molded body obtained here will exhibit a color according to the coloring material used. In particular, when the molding material contains a concealing material, it effectively covers the color of the conductive filler, so that the resin molded body exhibits a vivid color according to the coloring material used. become.

Next, a voltage application process is performed on the obtained resin molded body. Here, the resin molded body is usually grounded, an electrode is arranged above the resin molded body, and an AC voltage or a DC voltage is applied to the electrode. Incidentally, when an AC voltage is applied, when this frequency is 1 MHz or less, the effect of improving conductivity, particularly the effect of lowering the surface resistance, tends to increase. On the other hand, when a DC voltage is applied, the polarity of the voltage applied to the electrode may be either positive or negative.However, setting it to positive generally improves the conductivity, especially the surface resistance. easy.

FIG. 1 shows a schematic configuration of an example of a voltage applying device used in this case, that is, an example of a resin molded body processing device according to the present invention. In the figure, a voltage applying device 1 mainly includes a voltage applying section 2 and a conveying device 3 for a resin molded body M, that is, a conveying means.

The voltage applying unit 2 mainly includes an electrode unit 4 and a high-voltage generator 6 connected to the electrode unit 4. The electrode section 4 includes a housing 5 having an opening on the side of the transfer device 3, and an electrode group 5 a including a plurality of needle-like electrodes provided downward in the housing 5. The housing 5 can be moved up and down by an elevating device 5b, so that the distance between the resin molded body M and the tip of the electrode group 5a can be adjusted. In the housing 5, an air suction device connected to an ozone removing device (not shown) is arranged.

The high-voltage generator 6 is an AC or DC high-voltage generator having an overcurrent prevention function, has a built-in slidac or thyristor regulator, and is configured to be able to adjust a voltage value that can be generated. On the other hand, the transfer device 3 is for continuously transferring and supplying a large number of resin moldings M below the electrode portion 4 and is configured as a belt conveyor having an endless belt 7. The endless belt 7 is, for example, a metal belt or a conductive resin belt, and is grounded (earthed). Further, the endless belt 7 is set so as to be driven in a direction indicated by an arrow in the figure by, for example, a stepping motor 8 which operates at a constant interval for a constant time. 1 to 600 seconds, preferably about 5 to 60 seconds). The operation timing of the stepping motor 8 is set to be changeable in accordance with the time during which voltage application processing should be performed on the resin molding M. Further, the stepping motor 8 is connected to the high voltage generator 6 of the voltage applying unit 2 via the controller 9. The control device 9 sends an electric signal (control signal) to the voltage applying unit 2 when the stepping motor 8 transfers the resin molded body M below the electrode unit 4, and operates the high-voltage generator 6 for a certain period of time. It is set as follows.

When applying a voltage application process to the resin molded body M using such a voltage application device 1, first, the high voltage generator 6 of the voltage application unit 2 is operated, and the slide duck or thyristor regulator there is operated. Operate to set the generated voltage, that is, the voltage applied to the compact M. The voltage value set here is 20 kV or more and less than the dielectric breakdown voltage of the resin material constituting the resin molded body M, as described above, and preferably 20 kV or more and 50 kV or less.

Further, the stepping motor 8 of the transfer device 3 is operated to transfer a large number of the resin moldings M placed on the endless belt 7 continuously and sequentially below the electrode unit 4. When the resin molded body M is transferred below the electrode section 4 by the operation of the stepping motor 8, the controller 9 sends an operation command to the high-voltage generator 6. As a result, the resin molded body M disposed below the electrode section 4 has a predetermined high voltage. The high voltage from the pressure generator 6 is applied by the electrode group 5a for a fixed time, that is, during the above-mentioned stop time of the stepping motor 8. Ozone generated when the voltage is applied is sucked from the housing 5 by an air suction device, and is processed by an ozone removing device.

When the stepping motor 8 is operated next time, the molded body M to which the voltage is applied is transferred to the outside of the electrode unit 4 (to the right in the figure) by the endless velvet 7, and is moved below the electrode unit 4. , A resin molded body M located next to the processed resin molded body M is continuously arranged. Thus, the voltage applying device 1 can apply a voltage application process to a large number of the resin moldings M continuously and sequentially.

During the voltage application process described above, the distance between the tip of the electrode group 5a and the resin molding M is adjusted by adjusting the vertical position of the housing 5 by the lifting device 5b. It is preferable to set appropriately according to the environment, the applied voltage value, the type and shape of the resin molded body, and the type and amount of the conductive filler contained in the resin molded body. For example, when a voltage of 30,000 V is applied in the air, the interval is usually set in the range of 20 to 100 mm, preferably 30 to 50 mm. If this interval is less than 2 O mm, overcurrent may easily flow. Conversely, if it exceeds 10 O mm, there is a possibility that the effect of the voltage application process hardly appears.

The above-described voltage applying device 1 uses an electrode group 5a for applying a voltage to the resin molded body M, which includes a large number of needle-like electrodes. A hemispherical electrode or a plurality of plate-like electrodes may be arranged. Also, in the case where a single plate-like electrode according to the shape (size) of the resin molded body M is used instead of the electrode group 5a, the voltage application processing can be similarly performed.

In the voltage applying device 1 described above, the endless belt 7 side is grounded, thereby A voltage is applied from the electrode group 5a to the resin molding M, but a pair of electrodes connected to the high voltage generator 6 and formed between a pair of flat electrodes or a plurality of needle-like electrodes. The present invention can be implemented in the same manner even when the resin molded body M conveyed by the endless belt 7 is sandwiched between the groups in a non-contact state.

Further, the high voltage generator 6 of the voltage applying device 1 can be configured by diverting a high voltage pulse generator, an impact voltage generator, or the like, for example.

The resin molded article of the present invention obtained through the above-described process has a smaller amount of the conductive filler contained therein when compared with other resin molded articles in which a conductive filler is dispersed in a matrix made of a resin material. It exhibits high conductivity, which is usually difficult to achieve, and particularly low surface resistance. That is, the resin molded article of the present invention, despite containing chromatic amount of the conductive filler is suppressed to be less than 2 0%, 1 0 ⁵ 07 b or is sought generally Te semiconductor manufacturing field odor 1 0 ^{1 2} Omega / mouth the range surface resistance of, or 1 0- ² Omega / mouth least 1 0 ^{1 3} may indicate ΩΖ port following surface resistance. Specifically, for example, If you store the products for a long using polyacrylonitrile-based carbon short fibers as the conductive filler, the conductive few weight percent content than that of the filler (usually 3-5 wt. / ₀ approximately) often resin It can exhibit the same conductivity or surface resistance as the molded article.

Generally, the higher the probability that the conductive fillers can come into contact with each other, the higher the conductivity of the resin molded body, and the lower the content of the conductive filler, the lower the probability. Nevertheless, the reason why the resin molded article of the present invention exhibits the above-described high conductivity as compared with a normal molded article can be considered, for example, as follows. In a resin molded body in which conductive fillers are dispersed in a matrix made of a resin material, a large number or an infinite number of capacitors composed of the conductive fillers and a matrix (that is, a resin material) interposed therebetween. It is considered that the aggregate is formed inside. Since the resin molded body of the present invention is subjected to a voltage application process, such a capacitor is constituted. It is presumed that the matrix dielectric breakdown occurred between the conductive filters, and as a result, a current path was formed to increase the conductivity.

Therefore, the resin molded article of the present invention can exhibit high conductivity that cannot be normally achieved with such an added amount of the conductive filler while suppressing the amount of the expensive conductive filler to be added. In other words, the resin molded body can exhibit higher conductivity than can normally be expected from the content of the conductive filler. Therefore, this resin molded body can be provided at a lower cost than other resin molded bodies exhibiting the same conductivity.

As a result of the resin molded article of the present invention exhibiting such a specific effect, it is possible to realize an electric resistance value that is difficult to achieve with a conventional resin molded article including a conductive filler. For example, when carbon fiber is used as the conductive filler, if the amount added to the luster material is gradually increased, the resin molded product has a surface resistance of 1 to a certain amount. ^{^{0 1 4 ~ 1 0 1 5}} Ω / but be about mouth maintains the electric insulation, exceeds a certain amount in the conductive resin molding just added amount is changed very slightly sex will increasingly extreme (i.e., cause the surface resistance is summer extremely ^{^{small), 1 0 5 ~1 0 1}} 2 Ω / mouth about the surface resistance of the resin molding Te semiconductor manufacturing field smell is demanded in general It is known that it is extremely difficult to set the range. In the resin molded article of the present invention, even when a conductive filler such as carbon fiber that exhibits such a phenomenon is used, the addition of the conductive filler within a range in which the relationship between the added amount and the conductivity gradually changes. in addition to setting the amount Runode can achieve normal higher conductivity than conductive achievable by the addition amount of its, surface resistance ¹ 0 ⁵ ~1 0 1 ² ΩΖ opening degree range or 1, 0 _ ^2-1 to set the range of 0 1 ³ ΩΖ opening becomes relatively easy.

Since the resin molded article of the present invention is provided with conductivity by the conductive filler as described above, the resin molded article is required to have an antistatic property and a dust prevention property. It can be used for various purposes such as body manufacturing jigs, IC trays, and carriers. In this case, since the resin molded body can be given various colors by the coloring material as described above, the use and the type can be distinguished by the color. For example, there are cases where a variety of IC trays having different surface resistances are prepared depending on the purpose of use. This makes it possible to easily identify, based on colors, necessary components from among various types in the manufacturing process of electric and electronic components. Further, the resin molded article of the present invention can be recycled and recycled again to a similar resin molded article. That is, when the resin molded article of the present invention is formed into a desired shape again after pulverization and further subjected to a voltage application process under the above-described conditions, it can be regenerated into a similar resin molded article having a small surface resistance. . Incidentally, when the resin molded body is given a color by the coloring material, a similar color can be reflected on the resin molded body after the reproduction. It should be noted that a conventional resin molded body subjected to a voltage application treatment, in particular, a resin molded body according to Japanese Patent Application Laid-Open No. Sho 62-119117, Since it has a two-layer structure, it is substantially difficult to recycle and regenerate a similar resin molded article.

The above-described voltage applying apparatus 1 used for manufacturing the resin molded article of the present invention is used for treating an existing resin molded article made of a resin material containing a conductive filler in a proportion of less than 20% by weight. Can also. That is, the above-described voltage application processing to the existing resin molded body using the voltage application device 1 can be a processing method for increasing the conductivity of the existing resin molded body. In this case, the existing resin molded body is transported by the transport device 3, and the same applied voltage as described above at the electrode section 4 of the voltage applying section 2, that is, 2 OkV or more, the resin material constituting the resin molded body The applied voltage is applied to the resin molded body at an applied voltage lower than the dielectric breakdown voltage, preferably at an applied voltage of 20 kV or more and 50 kV or less. As a result, the existing The resin molded body will exhibit higher conductivity than that before treatment, especially low surface resistance.

Since the resin molded article of the present invention does not differ from other resin molded articles in appearance and the like, it is difficult to distinguish it from other resin molded articles based on the appearance. For example, it can be distinguished from other resin molded articles by the following method. (Method 1)

A thermogravimetric analysis is performed on the resin molded body whose surface resistance has been measured in advance, and the amount and type of the conductive filler contained in the resin molded body are analyzed. The amount of the conductive filler determined from the result of the thermogravimetric analysis is less than 20% by weight, and the surface resistance of the resin molded body measured in advance is a level that cannot be normally achieved with the amount of the conductive filler. In this case (that is, when the surface resistance is smaller than the normally achievable surface resistance), the resin molded body can be determined to be the resin molded body of the present invention.

When performing thermogravimetric analysis on a resin molded product, the resin molded product is usually heated from room temperature to 1000 ° C. in air at a rate of about 10 ° C. Examine the change in weight. When the resin matrix after heating does not leave carbon, heating of the resin molded body during thermogravimetric analysis can be performed in an inert gas such as nitrogen.

In Figure 2, 15 weight. / Including ₀ and carbon fibers and 1 5 wt% of the non-conductive inorganic material, the front surface resistance 1. 4 chi 1 0 ³ consists ΩΖ port of polysulfone resin (resin leaving the carbon after heat treatment) molded resin 2 shows the results of thermogravimetric analysis of the sample. The non-conductive inorganic substance is a mixture of several kinds of inorganic substances including titanium oxide used as a concealing material. The numerical value shown in% in FIG. 2 indicates the weight loss between the inflection points. In the figure, a weight loss of 14.4% was observed in the range of 637.6 to 763.5 ° C, which is almost the same as the amount of carbon fibers contained in the resin molded product. I know You. In addition, the residual at 800 ° C. was approximately 15%, which indicates that it substantially coincides with the amount of the non-conductive inorganic substance contained in the resin molded product. From the results of the thermogravimetric analysis, it is understood that the resin molded article to be analyzed contains about 15% by weight of the carbon material-based conductive filler and about 15% by weight of the non-conductive inorganic material.

Incidentally, the weight loss of 29.5% in the range of 549.5 to 6377.6 ° C is due to the carbonization of the polysulfone resin constituting the matrix of the resin molded product, and the combustion rate is lower than that of carbon. Since it is significantly faster than fibers and other carbon-based conductive fillers, it can be easily determined that the problem is not caused by carbon fibers, which are conductive fillers.

When the conductive filler contained in the resin molded body is of a metal material type, an increase in weight due to oxidation of the conductive boiler is observed. Therefore, when a weight increase is observed in the thermogravimetric analysis results, it can be assumed that the resin molded body contains a metallic material-based conductive filler.

In this method, instead of thermogravimetric analysis, analysis using ESCA (Electron Spectroscopy for Chemical Analysis) or EPMA (Electron Probe Microanalyzer) is carried out, and the conductive filler contained in the resin molded product is analyzed. In the case where the type and amount of are estimated, it can be carried out similarly.

(Method 2)

The resin molded body is heated to the softening point or higher of the resin material constituting the resin molded body, then cooled to room temperature, and the surface resistance of the resin molded body is measured. In the resin molded article of the present invention or the resin molded article treated by the method of the present invention, a dielectric breakdown portion is cured by such a heat treatment, and the surface resistance after the heat treatment is smaller than the surface resistance before the heat treatment. It becomes bigger. More specifically, in the resin molded article of the present invention, the surface resistance after the heat treatment is usually 100 times or more the surface resistance before the heat treatment. On the other hand, a resin molded body different from that of the present invention, Since the resin molded body having no history of the application treatment does not have a dielectric breakdown portion, the surface resistance does not easily increase even if the above-described heat treatment is performed.

When the resin molded body of the present invention that has been subjected to the heat treatment as described above is further subjected to a voltage application process under the above-described conditions, the surface resistance becomes 1/1000 of that before the voltage application process. It can be:

(Method 3)

In the case where the resin molded body has a color other than black series, it is substantially uniformly appeared its colors over the entire cross-section of Kitsuki effect moldings, moreover its surface resistance of 1 0 ^5-1 0 ^{1 2} ΩΖ opening degree range or ¹ 0- ² ~1 0 1 ³ Ω is Noro If, the resin molded article is likely resin molding of the present invention. Incidentally, since the resin molded body containing 20% by weight or more of the carbon material-based conductive filler used in the present invention has a black color as a whole, even if the coloring material is contained, It cannot exhibit the appropriate color. Further, when color is given only to the surface portion of the resin molded body (for example, in the case of the resin molded body described in Japanese Patent Application Laid-Open No. 62-110177). However, a uniform color cannot appear over the entire cross section of the resin molded body.

(Method 4)

Wash the resin molded article sufficiently with acetone or water and compare the surface resistance before and after washing. Although the surface resistance of the resin molded article of the present invention hardly changes before and after washing, other resin molded articles, particularly resin molded articles to which conductivity is imparted by using a surfactant, have a surface resistance after washing. Is significantly higher. Therefore, by measuring the surface resistance of the resin molded body before and after washing, it can be determined whether or not the resin molded body is the resin molded body of the present invention.

Hereinafter, the present invention will be described in more detail based on examples.

Example 1 It consists of short polyacrylonitrile-based carbon fibers with an average fiber diameter of 7 μπι and an average aspect ratio of 857 (trade name “Paiguchi Fill” of Mitsubishi Rayon Co., Ltd.). Fiber group (conductive filler) was prepared.

Next, for the resin material, polyphenylene oxide resin (trade name “Noryl P PO 534” of Nippon General Electric Co., Ltd.), the above-mentioned fiber group and yellow colorant (trade name of Toyo Kasei Co., Ltd.) CB 116 "), concealment material titanium oxide (trade name" CR60 "of Ishihara Sangyo Co., Ltd.) and talc (trade name"# 1000 "of Fuji Talc Co., Ltd.) are supplied and mixed using a feeder. Then, a pellet (molding material) composed of a resin material including a fiber group, a coloring material and a concealing material was prepared. The mixing ratio of the fiber group was set so as to be 6.0% by weight in the pellet. Further, coloring materials, Sani匕titanium and the mixing ratio of talc, their respective 1.0 wt ^_0/0, was set to be 0.2 wt% and 3.0 wt%. The pellets had a yellow color due to the coloring material.

The pellet was molded using a PROM AT injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. at a resin temperature of 240 ° C, an injection pressure of 1,200 kg / cm ² and a mold temperature of 60 ° C. A yellow disk having a diameter of 50 mm and a thickness of 3 mm, that is, a resin molded body was obtained. A pair of electrodes was formed using silver paste on the surface of the obtained disk, and the electrical resistance between the electrodes was measured to determine the surface resistance (Ωb) of the disk. As a result, 4 × 10 ¹⁵ Ω / Was the mouth. Hereinafter, the term “surface resistance” refers to the resistance measured in this manner.

The average residual ratio of the polyacrylonitrile-based carbon fibers in the disc was 28.6. Incidentally, this average residual aspect ratio was determined by dissolving a disk in methylene chloride, separating polyacrylonitrile-based carbon short fibers, and measuring the average length and average diameter of 400 of them using an optical microscope. It is calculated. Next, the obtained disk was placed on a grounded plate, and an electrode group including a large number of needle-like electrodes was arranged above the disk. The distance between the plate and the electrode group was set to 4 Omm so that the electrode group did not directly touch the disk. Then, a DC voltage of 30,000 V was applied to the electrode group for 10 seconds so that the polarity became positive. The surface resistance of the disc (resin molded body according to the present invention) subjected to the voltage application treatment in this manner is 1 × 10 ¹² ports, which is significantly lower than that before the voltage application treatment. It was confirmed that. Also, the color of the disc did not change even after the voltage application process.

Fig. 3 shows the results of thermogravimetric analysis of this disk. The results of the thermogravimetric analysis were obtained by using the TG / DTA32 brand name of Seiko Instruments Inc. as a thermogravimetric analyzer. The analysis conditions were as follows: measurement temperature range = 20 to 1,000 ° C; = 10 ° C / min and an air flow rate of 20.0 ml / z, respectively, and the percentage value is the residual rate of weight. The thermogravimetric analysis results show that the weight of the fiber group in the disk is 5.8% by weight, which is almost consistent with the mixing ratio of the fiber group used in manufacturing the disk. ing. In addition, this result indicates that 5.3% by weight of non-combustible residue remains, which is considered to be derived from the concealing material and the like.

Example 2

Polyacrylonitrile-based carbon short fiber (Mitsubishi Rayon Co., Ltd.) with an average fiber diameter of 7 μηι and an average aspect ratio of 857 compared to polypropylene resin (product name “Novatec BC3B” of Nippon Polychem Co., Ltd.) A group of fibers with an electrical resistance of 0.06 Q cm, consisting of a fiber group consisting of “Paiguchi Fill” (trade name of Co., Ltd.), yellow coloring material (trade name “CB 1 16” of Toyo Kasei Co., Ltd.), concealment Titanium oxide (trade name “CR60” of Ishihara Sangyo Co., Ltd.) and My Power (trade name of Kuraray Co., Ltd. “200HK”) as in Example 1 And mixed to obtain a pellet. The mixing ratio of the fiber group was set so as to be 5.0% by weight in the pellet. The mixing ratios of the coloring material, titanium oxide and my strength were 0.6% by weight, 0.2% by weight and 1.0% by weight, respectively. / ₀ was set. The pellets had a bright yellow colorant. A disc was manufactured from the obtained pellets through the same forming process as in Example 1. This disk had a bright yellow color. The average residual aspect ratio of the polyacrylonitrile-based carbon short fibers in the disc was 51.1. The average residual aspect ratio was determined in the same manner as in Example 1 except that hot decalin was used as a solvent for dissolving the disc.

The surface resistance of the obtained disk was measured before and after applying a voltage. The conditions for applying the voltage were set in the same manner as in Example 1 except that an AC voltage of 30 kV was used. The surface resistance of the disc was 2.6 × 10 ¹⁴ Ω before the voltage application, but decreased to 3.3 × 10 ⁵ Ω / cm after the voltage application. The color of the disc did not change even after the voltage application process. Figure 4 shows the results of thermogravimetric analysis performed on the disc before the voltage application process. The results of the thermogravimetric analysis were obtained by using the product name “TGZDTA32” of Seiko Instruments Inc. as a thermogravimetric analyzer, and analyzing the analysis conditions at a measurement temperature range of 20 to 1,000 ° C and a heating rate of 10 ° C. These values were obtained by setting ° CZ and air flow rate to 200.0 ml / min, respectively, and the numerical value shown in% is the residual ratio of weight. The thermogravimetric analysis result shown in Fig. 4 shows that the weight of the fiber group in the disk is 4.9% by weight, which is the value of the fiber group used in manufacturing the disk. It turns out that it is almost in agreement with the ratio. In addition, this result shows that 2.1% by weight of the non-combustible residue remains, which is considered to be derived from the shielding material and the like.

Example 3 The mixing ratio of the fiber group and the colorant was changed to 6.0% by weight and 1.0% by weight, respectively, and in the same manner as in Example 2 except that titanium oxide and my power were not used. A yellow disk was produced. The average residual aspect ratio of the polyacrylonitrile-based carbon short fibers in the disk was 52.3. After measuring the surface resistance of the disk, a voltage application process was performed on the disk under the same conditions as in Example 2. The surface resistance of the disk was 8 × 10 ¹³ Ω square before the voltage application treatment, but decreased to 4 × 10 ⁵ Ω square after the voltage application treatment. The color of the disc did not change even after the voltage application process.

In addition, FIG. 5 shows the results of thermogravimetric analysis performed on the disc before the voltage application treatment in the same manner as in Example 2. The thermogravimetric analysis results shown in FIG. 5 indicate that the weight of the fiber group in the disk is 6.1% by weight, which is the value of the fiber group used in manufacturing the disk. It turns out that it is almost in agreement with the mixing ratio. In addition, this result indicates that 0.5% by weight of the non-combustible residue remains, which is considered to be due to impurities contained in the disc.

Example 4

Compared to polyphenylene oxide resin (trade name “Noryl No. 0534” of Nippon General Electric Co., Ltd.), a pitch-based carbon fiber with an average fiber diameter of 12μπι and an average aspect ratio of 250 A fiber group consisting of fibers (trade name “Xy 1 us GCA03 J 431” of Osaka Gas Co., Ltd.) with a resistance value of 6080 Ωcm, a green coloring material (trade name “NO. 41 "), and titanium oxide (trade name" CR 60 "of Ishihara Sangyo Co., Ltd.) and my strength (Kuraray Co., Ltd. name" Kuraray Mai Riki 200HK "), which are concealing materials, were mixed in the same manner as in Example 1. Then, a pellet was obtained. The mixing ratio of the fiber group was set to 16% by weight in the pellet, and the mixing ratios of the coloring material, titanium oxide, and my strength were 1.0% by weight, 1.0% by weight, and 1.0% by weight, respectively. And 5.0% by weight. The obtained pellet had a green color due to the coloring material.

A disc was manufactured from the obtained pellets through the same forming process as in Example 1. This disk had a green color due to the coloring material. The average residual aspect ratio of the pitch carbon short fibers in the disc was 18.8. This average residual factor ratio was determined in the same manner as in Example 1. Further, the surface resistance of this disc was measured before application of voltage and after application of voltage in the same manner as in Example 1, and it was 3 × 10 ¹⁰ Ω and 5 × 10 ⁸ Ω, respectively. Was. The color of the disc did not change even after the voltage application treatment.

Examples 5 to 12

Polyacrylonitrile-based short carbon fibers (Mitsubishi Rayon Co., Ltd.) with an average fiber diameter of 7 μπι and an average aspect ratio of 857 were compared to polypropylene resin (Nova Tech BC3B, trade name of Nippon Polychem Co., Ltd.). The fiber group consisting of the product name "Pyrofil"), the fiber group having an electrical resistance of 0.06 Ω cm, a red coloring material (trade name of Toyo Kasei Co., Ltd. "CB 328"), and a titanium oxide concealment material ( Pellets were obtained by mixing Ishihara Sangyo Co., Ltd. product name "CR60") and talc (Fuji Talc Co., Ltd. product name "# 1000") in the same manner as in Example 1. The mixing ratio of the fiber groups was set as shown in Table 1 in the pellet. Further, the mixing ratio of the coloring material and the oxidized titanium oxide talc was set to be 1.0% by weight, 0.2% by weight and 3.0% by weight, respectively, in each of the examples.

A disk was manufactured from the obtained pellets through the same forming process as in Example 1, and the surface resistance was measured. Then, after applying a voltage to the obtained disc under the conditions shown in Table 1, the surface resistance was measured. The voltage application processing conditions shown in Table 1 are as follows. Table 1 shows the results. The circle obtained in each example The plate exhibited a bright red colorant, and its color did not change even after the voltage application process.

(Conditions for applying voltage)

Condition A:

A pair of electrode groups consisting of a large number of needle-like electrodes extending in the vertical direction were arranged vertically at intervals of 35 mm, and the lower electrode group was grounded. Then, a disk was placed on the lower electrode group, and a DC voltage of +30 kV was applied between the electrode groups for 30 seconds.

Condition B:

A pair of electrode groups consisting of a large number of needle-like electrodes extending in the vertical direction were arranged vertically at intervals of 35 mm, and the lower electrode group was grounded. Then, a disk was placed on the lower electrode group, and a DC voltage of 130 kV was applied between the electrode groups for 30 seconds.

Condition C:

A pair of electrode groups consisting of a large number of needle-like electrodes extending in the vertical direction were arranged vertically at an interval of 30 mm, and the lower electrode group was grounded. Then, several cylindrical supports were vertically arranged on the lower electrode group side, and the disk was placed horizontally on the supports. Thus, the disk was horizontally arranged between the pair of electrode groups, and a DC voltage of +50 kV was applied between the electrode groups for 30 seconds.

Condition D:

A pair of electrode groups consisting of a large number of needle-like electrodes extending in the vertical direction were arranged vertically at intervals of 30 mm, and the lower electrode group was grounded. Then, several cylindrical supports are vertically arranged on the lower electrode group side, and the disk is placed horizontally on the support. Thus, the disk is placed between the pair of electrode groups. They were placed horizontally and a DC voltage of 150 kV was applied between the electrode groups for 30 seconds. table 1

Example 13

With respect to the disk obtained in Example 2 after the voltage application treatment, the surface resistance after the heat treatment was examined. Here, the disk was heated at the temperature shown in Table 2 for 30 minutes, and then subjected to four heating-cooling cycles at each temperature for cooling to room temperature over 10 minutes, and then the surface resistance was measured. Table 2 shows the results. When the range of the heat treatment temperature was 95 to 165 ° C, the surface resistance after the heat treatment was almost the same as before the heat treatment, and no significant change was observed. It can be seen that after the heat treatment at 175 ° C, which is the softening point of the resin, the surface resistance has risen significantly to the level before the voltage application treatment. Table 2

Example 14

Using only the same polypropylene resin and fiber group as those used in Example 2, a disk was manufactured in the same manner as in Example 2. Here, six types of discs were manufactured with the fiber group content set to 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt% and 10 wt%, respectively. Figure 6 shows the results of measuring the surface resistance of each disk. Next, the same voltage application processing as in Example 2 was applied to the disks in which the content of the fiber group was set to 5% by weight, 6% by weight, 7% by weight, and 8% by weight, respectively. Then, the surface resistance was measured. Fig. 6 shows the results.

Comparative Example 1

In Example 1, the mixing ratio of the fiber group, the coloring material and the titanium oxide was changed to 20% by weight, 3.0% by weight and 1.0% by weight, respectively, and 5.0% by weight instead of talc. A pellet was prepared in the same manner as in Example 1 except that a My power of / ₀ (Kuraray Co., Ltd., trade name "Kuraray My power 200H K") was used. When a disk was manufactured using this pellet in the same manner as in Example 1, the disk was dark gray, and the color of the coloring material added to the pellet was not reflected. In addition, this disk had a surface resistance of 2.0 × 10 ² Ω / port before applying the voltage application treatment.

Comparative Example 2

67% by weight of the same polypropylene resin as used in Example 2, 20% by weight of carbon black (trade name of “Ketjen Black EC” by Axo Co.), red coloring material (trade name of Toyo Kasei Co., Ltd.) CB 328 ") 3.0% by weight, titanium oxide

(Ishihara Sangyo Co., Ltd. product name "CR60") 5.0 weight. / ₀ and talc (trade name of Fuji Talc Co., Ltd. "# 1000") 5.0% by weight was mixed in the same manner as in Example 1 to obtain pellets. A disk was obtained in the same manner. The obtained disk was black, and the color of the coloring material was not reflected. The surface resistance of this disk was already 4 Ω before the voltage was applied. The present invention may be embodied in various other forms without departing from its spirit or essential characteristics. Therefore, the above embodiments are merely mere in all respects. It is merely an example and should not be construed as limiting. The scope of the present invention is defined by the appended claims, and is not restricted by the description. Furthermore, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

Claims

The scope of the claims

1. Matrix made of resin material,

Comprising a conductive filler dispersed in the matrix,

The content of the conductive filler is 20% by weight. /. A resin molded body having a voltage of less than 20 kV and a voltage lower than the dielectric breakdown voltage of the matrix.

2. The resin molded article according to claim 1, wherein the content of the conductive filler is from 1.0% by weight to 16% by weight.

3. The conductive FILLER scratch, the FILLER group electrical resistance 1 0 ⁵ Omega cm or 1

^2. The resin molded article according to claim 1, which has a diameter of 0 to ² Ωcm or less.

4. The resin molded article according to claim 1, wherein the conductive filler is fibrous.

5. The resin molded article according to claim 4, wherein the average fiber diameter of the conductive filler is from 0.02 μm to 15 μm.

6. The resin molded article according to claim 5, wherein an average residual aspect ratio of the conductive filler is 10 or more and 100 or less.

7. The resin molded article according to claim 1, further comprising a colorant dispersed in the matrix together with the conductive filler.

8. The resin molded article according to claim 7, wherein the conductive filler is at least one of a carbon fiber and a graphite fiber.

9. The resin molded article according to claim 8, further comprising a concealing material for concealing the color of the conductive filler, dispersed in the matrix together with the conductive filler and the coloring material.

1 0. a surface resistance of less than 1 0 ⁵ ΩΖ port least 1 0 ^{1 2} Omega / mouth, to claim 1, wherein The resin molded article according to the above.

1 1. A matrix made of resin material,

Comprising a conductive filler dispersed in the matrix,

The content of the conductive filler is less than 20% by weight, and the surface resistance after heating to the softening point of the resin material and cooling to room temperature is 100% of the surface resistance before the heating treatment. More than twice,

Resin molding.

12. The resin molded article according to claim 11, wherein the content of the conductive filler is from 1.0% by weight to 16% by weight.

13. After the heat treatment, the surface resistance when further applying a voltage of 20 kV or more and a voltage less than the dielectric breakdown voltage of the Matritus is 1 Z 1 of the surface resistance before applying the application treatment. 12. The resin molded article according to claim 11, which is not more than 00.

13. The resin molded article according to claim 13, further comprising a coloring material dispersed in the matrix together with the conductive filler.

15. The resin molded article according to claim 14, further comprising a concealing material for concealing the color of the conductive filler, dispersed in the matrix together with the conductive filler and the coloring material.

16. A step of preparing a molding material containing a resin material and a conductive filler, and the content of the conductive filler is set to less than 20% by weight;

Molding the molding material into a predetermined shape,

Applying a voltage of 20 kV or more and less than the dielectric breakdown voltage of the resin material to the molded material,

A method for producing a resin molded article comprising:

17. The production of the resin molded product according to claim 16, wherein the content of the conductive filler in the molding material is set to be 1.0% by weight or more and 16% by weight or less. Method.

18. The method for producing a resin molded article according to claim 16, wherein the molding material further contains a coloring material.

19. The method for manufacturing a resin molded product according to claim 18, wherein the molding material further includes a concealing material for concealing the color of the conductive filler.

A processing apparatus for increasing the conductivity of a resin molded body containing a conductive filler in a proportion of less than 20.20% by weight,

A voltage applying unit for applying a voltage of 20 kV or more and less than the dielectric breakdown voltage to the resin molded body,

And a conveying unit for conveying the resin molded body toward the voltage applying unit.

A processing apparatus for increasing the conductivity of a resin molded article containing a conductive filler in a proportion of less than 21.2% by weight,

An electrode for applying a voltage of 20 kV or more and less than the dielectric breakdown voltage to the resin molded body,

And a transport unit for transporting the resin molded body toward the electrode so that the electrode and the resin molded body face each other with a space therebetween,

The conveying means is grounded;

Processing equipment for resin moldings.

22. The apparatus for processing a resin molded product according to claim 21, wherein the electrode is an electrode group including a plurality of needle-shaped electrodes.

23. The processing apparatus for a resin molded product according to claim 22, further comprising an interval adjusting device for adjusting an interval between the electrode and the resin molded product.

22. The apparatus for processing a resin molded body according to claim 21, wherein the transporting means is capable of sequentially and continuously transporting a large number of the resin molded bodies toward the electrode.