MY135326A - Resin molded product - Google Patents

Resin molded product

Info

Publication number
MY135326A
MY135326A MYPI99005749A MYPI9905749A MY135326A MY 135326 A MY135326 A MY 135326A MY PI99005749 A MYPI99005749 A MY PI99005749A MY PI9905749 A MYPI9905749 A MY PI9905749A MY 135326 A MY135326 A MY 135326A
Authority
MY
Malaysia
Prior art keywords
molded product
resin molded
electrically conductive
conductive filler
filler
Prior art date
Application number
MYPI99005749A
Inventor
Hiroya Kakegawa
Original Assignee
Osaka Gas Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Gas Co Ltd filed Critical Osaka Gas Co Ltd
Publication of MY135326A publication Critical patent/MY135326A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

A RESIN MOLDED PRODUCT IS PROVIDED WHICH EXHIBITS A HIGHER LEVEL OF ELECTRICAL CONDUCTIVITY AND PARTICULARLY A LOWER LEVEL OF SURFACE RESISTANCE THAN THOSE GENERALLY EXPECTED FROM THE CONTENT OF AN ELECTRICALLY CONDUCTIVE FILLER. THE RESIN MOLDED PRODUCT COMPRISES A MATRIX OF A RESIN MATERIAL AND AN ELECTRICALLY CONDUCTIVE FILLER DISPERSED IN THE MATRIX, WHEREIN A CONTENT OF THE ELECTRICALLY CONDUCTIVE FILLER IS LOWER THAN 20 WT%, AND THE RESIN MOLDED PRODUCT HAS BEEN SUBJECTED TO A VOLTAGE APPLICATION PROCESS EMPLOYING A VOLTAGE OF NOT LOWER THAN 20 KV AND LOWER THAN A DIELECTRIC BREAKDOWN VOLTAGE OF THE MATRIX. THE ELECTRICALLY CONDUCTIVE FILLER IS, FOR EXAMPLE, A FIBROUS FILLER SUCH AS A FIBROUS CARBON FILLER OR A FIBROUS GRAPHITE FILLER, AND HAS AN AVERAGE FIBER DIAMETER OF, FOR EXAMPLE, 0.002 TO 15 µM. THE RESIN MOLDED PRODUCT TYPICALLY CONTAINS A COLORING MATERIAL DISPERSED IN THE MATRIX TOGETHER WITH THE ELECTRICALLY CONDUCTIVE FILLER, AND EXHIBITS A COLOR CORRESPONDING TO THE COLORING MATERIAL.FIGURE 1
MYPI99005749A 1998-12-28 1999-12-27 Resin molded product MY135326A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP37320398 1998-12-28
JP37327098 1998-12-28
JP9903027 1999-06-04
PCT/JP1999/006090 WO2000040642A1 (en) 1998-12-28 1999-11-01 Resin molded product

Publications (1)

Publication Number Publication Date
MY135326A true MY135326A (en) 2008-03-31

Family

ID=27308828

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI99005749A MY135326A (en) 1998-12-28 1999-12-27 Resin molded product

Country Status (3)

Country Link
JP (1) JP3634752B2 (en)
MY (1) MY135326A (en)
WO (1) WO2000040642A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4503758B2 (en) * 1999-07-23 2010-07-14 大阪瓦斯株式会社 Conductive resin sheet and manufacturing method thereof
JP2002121304A (en) * 2000-10-12 2002-04-23 Osaka Gas Co Ltd Resin molding and its production method
US8999200B2 (en) * 2002-07-23 2015-04-07 Sabic Global Technologies B.V. Conductive thermoplastic composites and methods of making
JP4746556B2 (en) * 2004-11-08 2011-08-10 独立行政法人産業技術総合研究所 Static elimination molded body
JP2014051604A (en) * 2012-09-07 2014-03-20 Yuka Denshi Co Ltd Electroconductive thermoplastic resin composition and molded article thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56166039A (en) * 1980-05-26 1981-12-19 Toyota Central Res & Dev Lab Inc Method of producing electrically-conductive plastic material
JPH0725908B2 (en) * 1990-04-13 1995-03-22 豊田合成株式会社 Corona discharge treatment method
JPH06215618A (en) * 1993-01-12 1994-08-05 Tokai Carbon Co Ltd Manufacture of conductive resin composition containing tic whiskers
JPH07268124A (en) * 1994-03-30 1995-10-17 Dai Ichi Kogyo Seiyaku Co Ltd Method for improving electrical conductivity of resin molding
JPH0873655A (en) * 1994-09-07 1996-03-19 Denki Kagaku Kogyo Kk Electrically conductive resin composition and its production
JPH08253606A (en) * 1995-03-15 1996-10-01 Dai Ichi Kogyo Seiyaku Co Ltd Improvement of electroconductivity of resin molding and electrostatic coating
JPH0987403A (en) * 1995-09-25 1997-03-31 Nippon Paint Co Ltd Improvement of electroconductivity of resin molding and production of coated material made of resin

Also Published As

Publication number Publication date
JP3634752B2 (en) 2005-03-30
WO2000040642A1 (en) 2000-07-13

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