MY135326A - Resin molded product - Google Patents
Resin molded productInfo
- Publication number
- MY135326A MY135326A MYPI99005749A MYPI9905749A MY135326A MY 135326 A MY135326 A MY 135326A MY PI99005749 A MYPI99005749 A MY PI99005749A MY PI9905749 A MYPI9905749 A MY PI9905749A MY 135326 A MY135326 A MY 135326A
- Authority
- MY
- Malaysia
- Prior art keywords
- molded product
- resin molded
- electrically conductive
- conductive filler
- filler
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
- B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
A RESIN MOLDED PRODUCT IS PROVIDED WHICH EXHIBITS A HIGHER LEVEL OF ELECTRICAL CONDUCTIVITY AND PARTICULARLY A LOWER LEVEL OF SURFACE RESISTANCE THAN THOSE GENERALLY EXPECTED FROM THE CONTENT OF AN ELECTRICALLY CONDUCTIVE FILLER. THE RESIN MOLDED PRODUCT COMPRISES A MATRIX OF A RESIN MATERIAL AND AN ELECTRICALLY CONDUCTIVE FILLER DISPERSED IN THE MATRIX, WHEREIN A CONTENT OF THE ELECTRICALLY CONDUCTIVE FILLER IS LOWER THAN 20 WT%, AND THE RESIN MOLDED PRODUCT HAS BEEN SUBJECTED TO A VOLTAGE APPLICATION PROCESS EMPLOYING A VOLTAGE OF NOT LOWER THAN 20 KV AND LOWER THAN A DIELECTRIC BREAKDOWN VOLTAGE OF THE MATRIX. THE ELECTRICALLY CONDUCTIVE FILLER IS, FOR EXAMPLE, A FIBROUS FILLER SUCH AS A FIBROUS CARBON FILLER OR A FIBROUS GRAPHITE FILLER, AND HAS AN AVERAGE FIBER DIAMETER OF, FOR EXAMPLE, 0.002 TO 15 µM. THE RESIN MOLDED PRODUCT TYPICALLY CONTAINS A COLORING MATERIAL DISPERSED IN THE MATRIX TOGETHER WITH THE ELECTRICALLY CONDUCTIVE FILLER, AND EXHIBITS A COLOR CORRESPONDING TO THE COLORING MATERIAL.FIGURE 1
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37320398 | 1998-12-28 | ||
JP37327098 | 1998-12-28 | ||
JP9903027 | 1999-06-04 | ||
PCT/JP1999/006090 WO2000040642A1 (en) | 1998-12-28 | 1999-11-01 | Resin molded product |
Publications (1)
Publication Number | Publication Date |
---|---|
MY135326A true MY135326A (en) | 2008-03-31 |
Family
ID=27308828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI99005749A MY135326A (en) | 1998-12-28 | 1999-12-27 | Resin molded product |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3634752B2 (en) |
MY (1) | MY135326A (en) |
WO (1) | WO2000040642A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4503758B2 (en) * | 1999-07-23 | 2010-07-14 | 大阪瓦斯株式会社 | Conductive resin sheet and manufacturing method thereof |
JP2002121304A (en) * | 2000-10-12 | 2002-04-23 | Osaka Gas Co Ltd | Resin molding and its production method |
US8999200B2 (en) * | 2002-07-23 | 2015-04-07 | Sabic Global Technologies B.V. | Conductive thermoplastic composites and methods of making |
JP4746556B2 (en) * | 2004-11-08 | 2011-08-10 | 独立行政法人産業技術総合研究所 | Static elimination molded body |
JP2014051604A (en) * | 2012-09-07 | 2014-03-20 | Yuka Denshi Co Ltd | Electroconductive thermoplastic resin composition and molded article thereof |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56166039A (en) * | 1980-05-26 | 1981-12-19 | Toyota Central Res & Dev Lab Inc | Method of producing electrically-conductive plastic material |
JPH0725908B2 (en) * | 1990-04-13 | 1995-03-22 | 豊田合成株式会社 | Corona discharge treatment method |
JPH06215618A (en) * | 1993-01-12 | 1994-08-05 | Tokai Carbon Co Ltd | Manufacture of conductive resin composition containing tic whiskers |
JPH07268124A (en) * | 1994-03-30 | 1995-10-17 | Dai Ichi Kogyo Seiyaku Co Ltd | Method for improving electrical conductivity of resin molding |
JPH0873655A (en) * | 1994-09-07 | 1996-03-19 | Denki Kagaku Kogyo Kk | Electrically conductive resin composition and its production |
JPH08253606A (en) * | 1995-03-15 | 1996-10-01 | Dai Ichi Kogyo Seiyaku Co Ltd | Improvement of electroconductivity of resin molding and electrostatic coating |
JPH0987403A (en) * | 1995-09-25 | 1997-03-31 | Nippon Paint Co Ltd | Improvement of electroconductivity of resin molding and production of coated material made of resin |
-
1999
- 1999-11-01 WO PCT/JP1999/006090 patent/WO2000040642A1/en active Application Filing
- 1999-11-01 JP JP2000592348A patent/JP3634752B2/en not_active Expired - Fee Related
- 1999-12-27 MY MYPI99005749A patent/MY135326A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP3634752B2 (en) | 2005-03-30 |
WO2000040642A1 (en) | 2000-07-13 |
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