WO2000030210A1 - Module carte a microprocesseur et technique permettant de fixer des fils d'antenne sur celle-ci - Google Patents

Module carte a microprocesseur et technique permettant de fixer des fils d'antenne sur celle-ci Download PDF

Info

Publication number
WO2000030210A1
WO2000030210A1 PCT/US1999/023807 US9923807W WO0030210A1 WO 2000030210 A1 WO2000030210 A1 WO 2000030210A1 US 9923807 W US9923807 W US 9923807W WO 0030210 A1 WO0030210 A1 WO 0030210A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
groove
frame layer
antenna wire
module
Prior art date
Application number
PCT/US1999/023807
Other languages
English (en)
Inventor
Kiron Gore
Original Assignee
Motorola Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc. filed Critical Motorola Inc.
Publication of WO2000030210A1 publication Critical patent/WO2000030210A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to contactless smartcards and, more particularly, to a method of attaching antenna wires to such smartcards.
  • Contactless smartcards contain an antenna inlay sheet, with multiple sites per sheet, and a module attached to each site.
  • the inlay sheet is then laminated with two outer sheets.
  • the module is completely buried within the thickness of a 0.030 inch (+/- 0.003 inch) card.
  • the outer sheets could be pre-printed or left blank and printed as a single card.
  • the antenna could be embedded in, etched on or printed on a plastic inlay sheet. A cutout is punched in this inlay to make room for the smartcard module.
  • the ends of the antenna are then attached to the smartcard module.
  • the module contains an IC silicon that is glued and then wire bonded to a metal lead frame. This assembly is then over- molded to protect the IC silicon and its wire bonds.
  • FIGS. 1-3 show several conventional solutions. In each case, two ends of the antenna are attached to these two leads.
  • plastic material softens and tries to fill all voids. Large air gaps above the leads or around the module body cause a large dip in the plastic surface. This is shown in FIG. 4. This affects the single card printing operation, which requires the surface to be perfectly flat. If the outer sheets are pre-printed, a shadow of the module is seen through, because the topography of the plastic is disturbed when plastic flows in to fill the air gaps.
  • FIG. 1 depicts the result of dispensing filler material and trying to fill all the air gaps.
  • the problem with this technique is it requires a second sheet on the bottom to contain the liquid filler material. This adds to the total thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheets affects printing quality. Filler material choice is also a challenge. It needs to have low viscosity for dispensing, material needs to be compatible with plastic and have no volatile ingredients that may get trapped during lamination and cause blistering. The dispensed volume also needs to be accurately controlled.
  • FIG. 2 depicts the result of using two sheets with thickness that match the lead frame and the overmold. Each sheet also has different punch patterns that match the outline of the lead frame and over-mold.
  • the problem with this technique is the inaccuracy of aligning the two punched sheets. These inaccuracies require a large clearance between punched hole and the object within. This clearance results in large air gaps that will exhibit show through after lamination.
  • FIG. 3 depicts the result of adding a process step of pre-lamination where two thin plastic sheets are laminated to the inlay. Plastic material from these sheets acts as filler and smoothens out the surface profile. This process minimizes the module show through at final lamination. This additional process adds cost. It also increases the thickness of the inlay and reduces the thickness of the outer printed sheets. Reduced thickness on outer sheet affects printing quality.
  • FIG. 4 depicts the result of avoiding using high gloss finish on the cards after lamination. Using a "matte" finish plate during lamination will yield a rough looking surface that hides the shadow effect of the module showing through. This compromises aesthetics.
  • FIGS. 1-4 depict prior art.
  • FIG. 5A comprises top and cross-section views of a first embodiment of a smartcard module 600 arranged in accordance with the invention.
  • FIG. 5B is a top view of the smartcard module 600 of FIG. 5A with antenna wires 625 and 635 attached thereto.
  • FIG. 6 is an enlarged cross-section view of the smartcard module 600.
  • FIG. 7 is a block diagram of a smartcard 701 including the smartcard module 600.
  • a smartcard module 600 has a lead frame layer 621 , 631 , the lead frame layer having a lead frame layer surface 627, 637 with a groove 623, 633 formed therein.
  • the groove has a groove cross section extending inside the lead frame layer.
  • An antenna wire 625, 635 is mounted within the groove.
  • the antenna wire has an antenna wire cross section with a shape and thickness closely matching the groove cross section so that the uppermost portion of the antenna wire is substantially co-planar with the lead frame layer surface.
  • the smartcard module 600 includes a lead frame layer 621 , 631 , the lead frame layer having a lead frame surface 627, 637. Also shown is a silicon integrated circuit 601 coupled 603, 605 to the lead frame layer.
  • the lead frame layer 621 , 631 is disposed on an epoxy layer 607.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Ce module carte à microprocesseur (600) comporte une couche réseau de conducteurs (621, 631) dans la surface de laquelle a été creusée une gorge (623, 633). La section transversale de cette gorge s'étend à l'intérieur de la couche réseau de conducteurs. Un fil d'antenne (625, 635) est placé à l'intérieur de cette gorge. La forme et l'épaisseur de la section transversale de ce fil d'antenne correspondent du mieux à celles de la section transversale de la gorge, de sorte que la partie supérieure du fil d'antenne est sensiblement coplanaire de la surface de la couche réseau de conducteurs.
PCT/US1999/023807 1998-11-12 1999-10-13 Module carte a microprocesseur et technique permettant de fixer des fils d'antenne sur celle-ci WO2000030210A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10807398P 1998-11-12 1998-11-12
US60/108,073 1998-11-12
US25674299A 1999-02-24 1999-02-24
US09/256,742 1999-02-24

Publications (1)

Publication Number Publication Date
WO2000030210A1 true WO2000030210A1 (fr) 2000-05-25

Family

ID=26805496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/023807 WO2000030210A1 (fr) 1998-11-12 1999-10-13 Module carte a microprocesseur et technique permettant de fixer des fils d'antenne sur celle-ci

Country Status (1)

Country Link
WO (1) WO2000030210A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002061676A1 (fr) * 2001-02-02 2002-08-08 Schlumberger Systèmes Objet portable pourvu d'une puce et d'une antenne
WO2002095673A1 (fr) 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Configuration a grilles de connexion pour puces
WO2008141982A1 (fr) * 2007-05-21 2008-11-27 Gemalto Sa Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
WO2010052205A1 (fr) * 2008-11-05 2010-05-14 Tomtom International B.V. Appareil d'agencement d'antenne
WO2011054697A1 (fr) * 2009-11-09 2011-05-12 Feinics Amatech Teoranta Canaux de formation pour fil d'antenne d'un transpondeur
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412192A (en) * 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
US5896111A (en) * 1994-09-05 1999-04-20 Siemens Aktiengesellschaft Antenna coil
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5412192A (en) * 1993-07-20 1995-05-02 American Express Company Radio frequency activated charge card
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
US5896111A (en) * 1994-09-05 1999-04-20 Siemens Aktiengesellschaft Antenna coil
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
US5898215A (en) * 1996-12-16 1999-04-27 Motorola, Inc. Microelectronic assembly with connection to a buried electrical element, and method for forming same
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002061676A1 (fr) * 2001-02-02 2002-08-08 Schlumberger Systèmes Objet portable pourvu d'une puce et d'une antenne
FR2820548A1 (fr) * 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
WO2002095673A1 (fr) 2001-05-17 2002-11-28 Koninklijke Philips Electronics N.V. Configuration a grilles de connexion pour puces
US7245005B2 (en) 2001-05-17 2007-07-17 Nxp B.V. Lead-frame configuration for chips
WO2008141982A1 (fr) * 2007-05-21 2008-11-27 Gemalto Sa Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
US8359729B2 (en) 2007-05-21 2013-01-29 Gemalto Sa Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads
WO2010052205A1 (fr) * 2008-11-05 2010-05-14 Tomtom International B.V. Appareil d'agencement d'antenne
WO2011054697A1 (fr) * 2009-11-09 2011-05-12 Feinics Amatech Teoranta Canaux de formation pour fil d'antenne d'un transpondeur
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate

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