WO2000028572A1 - Appareil pour produire un faisceau de particules chargees - Google Patents

Appareil pour produire un faisceau de particules chargees Download PDF

Info

Publication number
WO2000028572A1
WO2000028572A1 PCT/JP1999/006123 JP9906123W WO0028572A1 WO 2000028572 A1 WO2000028572 A1 WO 2000028572A1 JP 9906123 W JP9906123 W JP 9906123W WO 0028572 A1 WO0028572 A1 WO 0028572A1
Authority
WO
WIPO (PCT)
Prior art keywords
sample
particle beam
processing
charged particle
host computer
Prior art date
Application number
PCT/JP1999/006123
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Doi
Masashi Muramatsu
Hiroshi Matsumura
Toshiaki Fujii
Original Assignee
Seiko Instruments Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc. filed Critical Seiko Instruments Inc.
Publication of WO2000028572A1 publication Critical patent/WO2000028572A1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/302Controlling tubes by external information, e.g. programme control

Definitions

  • the present invention relates to a charged particle beam apparatus that performs processing such as observation and processing of a sample using a charged particle beam.
  • charged particle beam equipment that uses a charged particle beam from an electron source or ion source to perform sample observation, fine processing, etc. has been used for semiconductor failure analysis, manufacturing process monitoring, processing, etc. Used for
  • FIG. 2 is a general schematic configuration diagram of a focused ion beam device, which is a kind of a charged particle beam device.
  • the focused ion beam device includes an ion source 201, a condenser lens 202, a beam blanking electrode 203, a movable diaphragm 204, an astigmatism correction electrode 205, and an objective lens 206.
  • the ion beam focused from the ion source 201 is scanned over the sample 211 placed on the sample stage 210, and the secondary electrons generated by this are scanned by the secondary electron detector.
  • the data of the image (SIM image) of the sample 211 can be collected and observed, and the sample 211 can be observed, and the failure analysis of the sample 211 can be performed.
  • the sample 211 can be etched, and the gas from the gas gun 209 can be used to deposit the sample. It is possible to perform a process.
  • FIG. 3 is a block diagram of a conventional focused ion beam device.
  • the focused ion beam device includes a host computer 301 for inputting instructions when performing processing such as observation and processing of a sample, analyzing collected data, and displaying an image of the sample.
  • processing elements are condenser lens 202, beam blanking electrode 203, movable diaphragm 204, astigmatism correction electrode 205, objective lens 206, and scanning electrode 20 in Fig. 2.
  • the optical system controller 302 which controls the focus and the magnification by controlling the ion beam with an electric field by controlling 7, the axis of the ion source 201 arranged on the ion source stage (not shown)
  • the optical axis control unit 303 that adjusts and positions the movable aperture 204 using an actuator piezo element, the vacuum exhaust unit 304 that evacuates the sample chamber in which the sample is placed, and the sample Sample placed and moved to beam irradiation position Stage 3 0 5, and a sample transport apparatus 3 0 6 carrying a sample 2 1 1 on the sample stage 3 0 5.
  • Each of the processing elements includes a central processing unit (CPU).
  • the host computer 301 outputs an instruction signal to the evacuation unit 304 in response to the instruction input.
  • the evacuation unit 304 responds to the instruction signal from the host computer 301 and sets the spare sample chamber to the atmosphere and opens the door of the spare sample chamber.
  • the host computer 301 outputs an instruction signal to the sample transport device 303, and the sample transport device 303 responds to the instruction signal.
  • the sample into the spare sample room.
  • the host computer 301 outputs an instruction signal to the evacuation unit 304 when the above-mentioned processing of the sample transfer device 303 is completed, and the evacuation unit 304 responds to the instruction signal to perform standby.
  • the sample chamber is evacuated.
  • the host computer 301 outputs an instruction signal to the optical system control unit 302, and the optical system control unit 302 responds to the instruction signal.
  • the high voltage for optical control in the sample chamber is controlled to an off state in order to prevent the high voltage for optical control from being discharged due to the vacuum deterioration.
  • the host computer 301 outputs an instruction signal to the evacuation unit 304, and the evacuation unit 304 responds to the instruction signal. Then, the valve between the sample chamber and the spare sample chamber is opened, whereby the sample chamber and the spare sample chamber are connected.
  • the host computer 301 outputs an instruction signal to the sample stage 300, and the sample stage 300 responds to the instruction signal, To the delivery position.
  • the host computer 301 outputs an instruction signal to the sample transport device 300, and the sample transport device 303 responds to the instruction signal. Then, the sample is moved from the preliminary sample chamber to the sample stage 305 in the sample chamber.
  • the host computer 301 outputs an instruction signal to the sample stage 300 when the above-described processing of the sample transfer device 303 is completed, and the sample stage 300 moves in response to the instruction signal. As a result, the sample moves to the irradiation position of the ion beam.
  • the host computer 301 outputs an instruction signal to the evacuation unit 304, and the evacuation unit 304 responds to the instruction signal to output the sample. Close the valve between the This separates the sample chamber from the spare sample chamber.
  • the host computer 301 outputs an instruction signal to the optical system control unit 302, and the optical system control unit 302 responds to the instruction signal.
  • the high voltage for optical control in the sample chamber is restored, and the above-described series of sample setting processes is completed.
  • each of the processing elements is centrally controlled by the host computer 301, so that the host computer 301 performs processing with a heavy load, such as when processing image data of a sample.
  • a heavy load such as when processing image data of a sample.
  • An object of the present invention is to provide a charged particle beam device capable of performing smooth processing by reducing the load on a host computer. Disclosure of the invention
  • a charged particle beam apparatus includes: a host computer that outputs a processing start signal in response to an instruction input; a charged particle beam source that generates a charged particle beam for irradiating a sample; A plurality of processing elements for performing processing according to signals are provided, and the host computer and each of the processing elements are connected to a LAN. The host computer and each processing element are connected by LAN, and dispersion processing is performed on the sample.
  • the processing element may include an optical system control unit that performs focusing of the charged particle beam, and a vacuum exhaust unit that controls the sample chamber to a vacuum atmosphere.
  • Optical axis control to be performed A sample stage on which the sample is placed, and a sample transport device that transports the sample to the sample stage.
  • the phosphate Bok computer and the constituent in between the elements better c be configured to be connected to another LAN transmits and receives encrypted signals also the charged particle beam device, one focused ion beam It can be a device or a scanning electron microscope.
  • FIG. 1 is a block diagram of an embodiment of the present invention.
  • FIG. 2 is a schematic configuration diagram of a general focused ion beam apparatus.
  • FIG. 3 is a block diagram of a conventional focused ion beam device.
  • FIG. 1 is a block diagram of a charged particle beam device according to an embodiment of the present invention, showing an example of a focused ion beam device.
  • a focused ion beam device (FIB) 101 as a charged particle beam device is installed in a measurement room away from the factory, and a TCP (Local Area Network) 109 of the factory is used as another LAN.
  • the focused ion beam apparatus 101 is provided with a host computer 102 for inputting instructions when performing processing such as observation and processing of a sample, analyzing collected data or displaying an image of the sample, and the like.
  • processing such as observation and processing of a sample, analyzing collected data or displaying an image of the sample, and the like.
  • Power Optical system control unit 103 for controlling the magnification, optical axis control unit 104 for adjusting the position of movable diaphragm 204 using an actuator, etc.
  • Vacuum exhaust unit for setting the sample chamber in which the sample is placed to a vacuum atmosphere 105, a sample stage 106 for placing the sample and moving to the beam irradiation position, and a sample transfer device 107 for transferring the sample to the sample stage 106 are provided.
  • the optical system control section 103 and the vacuum exhaust section 105 for making the sample chamber in which the sample is placed a vacuum atmosphere are essential components, but other processing elements are necessary. It can be used at any time according to the requirements.
  • the optical axis control unit 104 also adjusts the axis of the ion source 201 disposed on the ion source stage (not shown) by using an actuator piezoelectric element as necessary. Monkey
  • Each processing element has a CPU and is connected to a bus line 108.
  • the CSMA / CD Carrier Sense Multiple Access with Collis on Detection
  • Connected by LAN Connected by LAN.
  • Each of the host computer 102 and each of the processing elements 103 to 107 is given a unique identification (ID) code, and the host computer 102 and each of the processing elements 1
  • ID code unique identification
  • Signals transmitted and received between 03 and 107 are configured to include the ID code, and by discriminating the ID code included in the signal on the bus line 108, the ID address is determined. Is determined.
  • a signal transmitted / received via the bus line 108 is encrypted so that it can be read only by the host computer 102 and each of the processing elements 103 to 107. I have.
  • Instruction computer for host computer 1 0 Enter in 2.
  • the host computer 301 outputs an instruction signal including the ID code of the evacuation unit 105 to the bus line 108 in response to the instruction input.
  • the evacuation unit 105 receives the instruction signal from the host computer 301 transmitted to the bus line 108, determines the ID code included in the signal, and sends the instruction signal addressed to itself. In response to this, the spare sample chamber is evacuated and the door of the spare sample chamber is opened.
  • the evacuation unit 105 Upon completion of the above-described processing, the evacuation unit 105 sends a signal including the ID code of the sample transfer device 107 to the bus in order to shift the process to the sample transfer device 107 which is responsible for the next processing step. Output to line 108.
  • the sample transfer device 107 receives the instruction signal from the vacuum exhaust unit 105 transmitted to the bus line 108, determines the ID code included in the signal, and uses the instruction signal addressed to itself. In response to this, the sample is loaded into the spare sample room.
  • the sample transport device 107 Upon completion of the above-described processing, the sample transport device 107 outputs a signal including an ID code of the vacuum evacuation unit 105 that performs the next processing step to the bus line 108.
  • each component determines whether or not the signal on the pass line 108 is a signal addressed to itself by an ID code, and if the signal is addressed to itself, performs processing. Upon completion, a signal containing the ID code of the component responsible for the next step is output to bus line 108.
  • the vacuum exhaust unit 105 In response to this, the preliminary sample chamber is evacuated, and when the above processing is completed, a signal including the ID code of the optical system controller 103 is output to the bus line 108.
  • the optical system control unit 103 receives the signal from the vacuum evacuation unit 105, and uses the high voltage to prevent the high voltage for optical control in the sample chamber from being discharged due to vacuum deterioration. The control process is performed to turn off, and when the process is completed, a signal including the ID code of the vacuum exhaust unit 105 is output to the bus line 108.
  • the evacuation unit 105 Upon receiving a signal from the optical system controller 103, the evacuation unit 105 opens the valve between the sample chamber and the preliminary sample chamber to connect the sample chamber to the preliminary sample chamber, and the above processing is completed. Then, a signal including the ID code of the sample stage 106 is output to the bus line 108.
  • the sample stage 106 Upon receiving a signal from the vacuum evacuation unit 105, the sample stage 106 moves to the sample transfer position. When the above processing is completed, a signal including the ID code of the sample transfer device 107 is transmitted to the bus line 1. 0 Output to 8.
  • the sample transfer device 107 Upon receiving the signal from the sample stage 106, the sample transfer device 107 moves the sample from the preliminary sample chamber to the sample stage 106 in the sample chamber, and when the above processing is completed, the sample stage 106 A signal including the ID code is output to the bus line 108.
  • the sample stage 106 Upon receiving a signal from the sample transfer device 107, the sample stage 106 moves, and the sample moves to the ion beam irradiation position. When the movement process is completed, the sample stage 106 outputs a signal including the ID code of the vacuum exhaust unit 105 to the bus line 108.
  • the evacuation unit 105 receives a signal from the sample stage 106 and closes a valve between the sample chamber and the preliminary sample chamber, thereby separating the sample chamber and the preliminary sample chamber. You. When the process of closing the valve is completed, the evacuation unit 105 outputs a signal including the ID code of the optical system control unit 103 to the bus line 108.
  • the optical system controller 103 receives the signal from the evacuation unit 105 to restore the high voltage for optical control in the sample chamber, and the host computer A signal including the ID code of 102 is output to the bus line 102. This completes a series of sample loading processes.
  • the host computer 102 since the processing elements 103 to 107 are processed in a distributed manner, the host computer 102 does not need to centrally control the processing elements. Therefore, the load is reduced, and while the host computer 102 performs a heavy load such as image data processing, the other processing elements 103 to 107 perform other processing such as the sample loading processing and the processing. Can be performed.
  • the signals transmitted and received by the host computer 102 and the processing elements 103 to 107 via the pass line 108 are the software included in the host computer 102 and the processing elements 103 to 107. It consists only of encoded signals that can be encoded and decoded. Since the device in the LAN 109 does not have a function of analyzing the encrypted signal, even if the signal is received, it cannot be decrypted, and the information is simply meaningless for the device.
  • the host computer 102 of the focused ion beam device 101 and the processing elements 103 to 107 are 1_ 1 ⁇ 1 Operates so that the 09 side signal is not accepted.
  • the LIN 109 and the focused ion beam device 101 do not affect each other because the signal systems used by each are different from each other. Therefore, even when various kinds of signals such as an instruction signal are output to the bus line 108 when the processing of the focused ion beam apparatus 101 shifts to the next control, the factory LAN 101 does not malfunction. .
  • the focused ion beam device 101 Even when signals such as commands used in the factory LA100 are transmitted to the focused ion beam device 101, the focused ion beam device It is possible to prevent 101 from malfunctioning. In addition, since it is possible to restrict access to the focused ion beam apparatus 101 from the LAN 109 side, a storage device such as a hard disk (not shown) disposed in the host computer 102 O Keep confidentiality of various data such as image data stored in
  • Those who have specific authority can use the factory LAN 109 by using a signal including a specific ID code that can be accepted by both the factory LAN 109 and the focused ion beam device 101. It is also possible to access the focused ion beam device 101 from the host computer, or vice versa, from the host computer 102 of the focused ion beam device 101 to the factory LAN 109 side.
  • the host computer 102 of the focused ion beam apparatus 101 and the processing elements 103 to 107 are connected to the LAN, the host computer 1 No. 2 does not require centralized control of each processing element 103 to 107, and the load is reduced. Therefore, while the host computer 102 performs heavy processing such as image data processing, the other processing elements 103 to 107 perform the sample loading processing, observation processing, processing processing, and the like. Other processing can be performed.
  • the signals transmitted and received by the host computer 102 and the processing elements 103 to 107 via the bus line 108 are encrypted so that only these can be decrypted, and the LAN 109 side.
  • the focused ion beam device 101 and the processing elements of the factory-side LAN 109 can be prevented from malfunctioning without affecting each other. .
  • the focused ion beam device 101 from the factory LAN 109 side can be restricted, it is installed in the host computer 102.
  • Confidentiality of various data such as image data stored in a storage device (not shown) such as a hard disk.
  • the present embodiment has been described with reference to the example of the focused ion beam apparatus, the present invention can be applied to a charged particle beam apparatus such as an electron microscope using an electron beam as a charged particle beam.
  • a process that constitutes a charged particle beam apparatus such as a process of collecting image data of the sample, a process of analyzing the image data, and a process of processing the sample
  • a process that constitutes a charged particle beam apparatus such as a process of collecting image data of the sample, a process of analyzing the image data, and a process of processing the sample
  • the load on the host computer can be reduced, and smooth processing can be performed.
  • the charged particle beam device and the other LAN are configured to transmit encrypted signals to each other within the charged particle beam device. It is possible to prevent malfunction without affecting each other.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

Afin d'assurer une commande répartie, un appareil (101) pour produire un faisceau d'ions focalisé est connecté à un réseau LAN (109) de la fabrique, et une ligne en bus (108) connecte un ordinateur hôte (102), un système de commande optique (103) commandant la focalisation et le grossissement du faisceau d'ions au moyen de champs électriques, ainsi qu'une commande (104) de l'axe optique destinée à positionner une source d'ions, une pompe à ions (105) destinée à évacuer une chambre d'échantillons, un étage d'échantillons (106) destiné à transporter un échantillon vers une position dans laquelle l'échantillon est éclairé par un faisceau, un convertisseur d'échantillons (107) destiné à transporter l'échantillon à l'étage d'échantillons (106).
PCT/JP1999/006123 1998-11-05 1999-11-02 Appareil pour produire un faisceau de particules chargees WO2000028572A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10314495A JP2000149854A (ja) 1998-11-05 1998-11-05 荷電粒子ビーム装置
JP10/314495 1998-11-05

Publications (1)

Publication Number Publication Date
WO2000028572A1 true WO2000028572A1 (fr) 2000-05-18

Family

ID=18053996

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/006123 WO2000028572A1 (fr) 1998-11-05 1999-11-02 Appareil pour produire un faisceau de particules chargees

Country Status (3)

Country Link
JP (1) JP2000149854A (fr)
TW (1) TW469713B (fr)
WO (1) WO2000028572A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126536A (ja) * 1985-11-27 1987-06-08 Nissin Electric Co Ltd イオン注入装置用制御装置
JPH0676784A (ja) * 1992-08-26 1994-03-18 Nissin Electric Co Ltd イオン注入制御装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126536A (ja) * 1985-11-27 1987-06-08 Nissin Electric Co Ltd イオン注入装置用制御装置
JPH0676784A (ja) * 1992-08-26 1994-03-18 Nissin Electric Co Ltd イオン注入制御装置

Also Published As

Publication number Publication date
JP2000149854A (ja) 2000-05-30
TW469713B (en) 2001-12-21

Similar Documents

Publication Publication Date Title
US7157703B2 (en) Electron beam system
TWI415162B (zh) 映像投影型電子線裝置及使用該裝置之缺陷檢查系統
JP2001068446A (ja) 半導体ウェーハの汚染物質の検出
KR20080112406A (ko) 로드록 제어
US7361600B2 (en) Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
WO2000028572A1 (fr) Appareil pour produire un faisceau de particules chargees
WO2018020649A1 (fr) Dispositif de rayonnement de particules chargées
JPH07122619A (ja) 半導体ウエハの搬送方法
JPH10134751A (ja) 環境制御型の走査型電子顕微鏡
WO2000028700A1 (fr) Systeme de reseau
US11398365B1 (en) Positioning samples for microscopy, inspection, or analysis
JP3265969B2 (ja) イオン注入制御装置
US20220254599A1 (en) Multiple landing energy scanning electron microscopy systems and methods
US6797067B1 (en) Implanter tool process parameter auto pre-setup system
TW201819753A (zh) 排氣閥系統
TW202105438A (zh) 具有單光束模式之多光束檢測設備
JP4229610B2 (ja) 荷電粒子ビーム装置、及びその制御方法
US20230178333A1 (en) Analysis system, analysis method, computer program product and sample holder
US20230326706A1 (en) Apparatus and method for directing charged particle beam towards a sample
EP4125111A1 (fr) Appareil et procédé d'orientation de faisceau de particules chargées vers un échantillon
JPH087824A (ja) イオン注入装置及び半導体装置の製造方法及びイオンビーム制御方法
JPH08138600A (ja) 荷電粒子光学系
JP2001242106A (ja) オージェ電子分光装置およびオージェ電子分光分析法
JPH0466119A (ja) 真空処理方法及び装置
JP2014120596A (ja) イオン注入装置

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP KR US

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)