WO2000019397A1 - Verfahren zum herstellen eines bauelementes und bauelement - Google Patents
Verfahren zum herstellen eines bauelementes und bauelement Download PDFInfo
- Publication number
- WO2000019397A1 WO2000019397A1 PCT/DE1999/003083 DE9903083W WO0019397A1 WO 2000019397 A1 WO2000019397 A1 WO 2000019397A1 DE 9903083 W DE9903083 W DE 9903083W WO 0019397 A1 WO0019397 A1 WO 0019397A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- frame
- glass pane
- functional element
- main surface
- glass
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 239000011521 glass Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 25
- 230000005693 optoelectronics Effects 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 238000005476 soldering Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
- G01N33/483—Physical analysis of biological material
- G01N33/497—Physical analysis of biological material of gaseous biological material, e.g. breath
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
Definitions
- the invention relates to a method for producing a component from at least one optoelectronic functional element and a glass pane, the functional element being arranged in the region of an inner surface of the glass pane.
- the invention further relates to a component comprising at least one optoelectronic functional element and a glass pane, the optoelectronic functional element being arranged in the region of a main surface of the glass pane.
- the functional element is arranged between two glass panes aligned in parallel. Then the glass panes are glued together.
- the object of the invention is to overcome the disadvantages of the prior art.
- a method which can be carried out with as little effort as possible is to be created, with which a generic component can be produced in such a way that the functional element is protected as effectively as possible from external influences.
- this object is achieved in that the main surface of the glass pane forming an inner surface in the finished component is connected to a frame in such a way that the frame surrounds peripheral surfaces of the functional element in the finished state of the component.
- the invention provides for a frame to be applied to the glass pane. It is particularly advantageous to carry out the method according to the invention in such a way that the glass pane is first connected to the frame and that the functional element is then arranged in the region of the main surface of the glass pane.
- the conductor structure is applied to the main surface before the main surface is connected to the frame.
- the technology according to the invention is particularly suitable if the functional element contains at least one organic light-emitting diode (OLED).
- OLED organic light-emitting diode
- the material of the glass pane and the frame are expediently chosen so that their thermal expansion coefficients are largely matched to one another. Such an adjustment takes place, for example, by changing the chemical composition of the glass or by a suitable choice of the frame material.
- the glass pane is connected to the frame by soldering to a glass solder.
- the connection between the glass pane and the frame must be such that they have different thermal expansions compensates.
- Glass solders are those glasses which, due to the particularly low melting temperature, have a glass solder connection between the glass pane and the one to be connected to it
- the glass solder is selected so that sufficient flow and Wetting of the glass solder takes place at a temperature at which the glass pane does not yet show any disturbing deformations.
- the temperature for the soldering process corresponds essentially to the transformation temperature of the glass solder.
- Adapting the glass solder to the thermal expansion of the connection partner is important because the solder is the mechanically weaker connection partner.
- An expedient embodiment of this method is characterized in that at least part of the glass solder is applied to the glass pane and that the frame is then positioned opposite the glass pane.
- the glass solder is applied to the glass pane by screen printing or dispensing a strand.
- Another expedient embodiment of the method is characterized in that at least part of the glass solder is applied to the frame and that the frame is then positioned opposite the glass pane.
- the frame is connected to a cover.
- the drawing shows a cross section through an inventive component made of an optoelectronic Functional element 5 and a glass pane 10.
- the functional element 5 is located on a main surface 12 of the glass pane 10.
- the functional element 5 is a
- Display unit which consists of a plurality of light-emitting diodes (LED), in particular organic LEDs (OLED), arranged in a two-dimensional field.
- LED light-emitting diodes
- OLED organic LEDs
- the individual LEDs 15 have several functional layers, as described, for example, in the article by M. Schwoerer and H. v. Seggern: Electroluminescent Chromophores and Polymers for Organic LEDs and Displays, Siemens-Review Special; R & D, Fall 1996, pp. 20 ff.
- a pixel is a two-dimensional picture element, for example a square.
- the LEDs 15 consist of several functional layers and are located in the area of one of their main surfaces in direct contact with the glass pane 10. Between the LEDs 15 there are webs 20.
- the frame 25 consists, for example, of a suitable metal alloy or of a ceramic material.
- a glass solder 30 is located between the frame 25 and the main surface 12 of the glass pane 10.
- a cover 35 is located on the frame 25.
- the cover 35 consists, for example, of a suitable metal alloy.
- the component shown is preferably produced as follows:
- Conductor structures 14, for example in the form of conductor tracks, are formed on the main surface 12 of the glass pane 10 by the application of suitable materials. For this purpose, it is particularly expedient to use a cathode sputtering process.
- a glass solder for example the glass solder commercially available under the name DM 2700 P, is applied to the main surface 12 of the glass pane 10.
- Glass pane 10 are intended to be applied. Applying the glass solder 30 to the main surface 12 of the glass pane 10 has the advantage that it can be done in a single operation, for example by screen printing or dispensing the glass solder in the form of a strand.
- the frame 25 and the glass pane 10 are positioned relative to one another such that the frame is located exactly over surface areas on which the glass solder was previously applied. After the frame 25 has been positioned above the surface areas formed by the glass solder 30, the frame 25 is lowered onto these areas.
- the soldering process is then carried out by heating the glass solder to its transformation temperature.
- the glass solder used here has the particular advantage that it already flows at a temperature of 350 degrees Celsius, which is particularly low for soldering processes, and completely wets the surfaces to be connected. To ensure that the soldering process has been carried out completely, it is advantageous that the actual soldering process the soldering area is kept at the temperature of 350 degrees Celsius for about 10 minutes.
- the glass solder 30 wets not only the surfaces of the frame 25 facing the main surface 12, but also lower regions of side surfaces of the frame 25. The occurrence of this wetting process is detected by an optical check and thus enables the complete completion of the soldering process to prove.
- the functional element 5 is then applied to the main surface 12 of the glass pane 10 within the frame 25.
- the frame 25 is then firmly connected to a cover 35.
- This connection can be made, for example, by soldering or welding. If both the frame 25 and the cover 30 consist of a metal, welding is particularly expedient.
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Molecular Biology (AREA)
- Biomedical Technology (AREA)
- Urology & Nephrology (AREA)
- Biochemistry (AREA)
- Biophysics (AREA)
- Theoretical Computer Science (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Analytical Chemistry (AREA)
- Hematology (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/857,252 US6688933B1 (en) | 1998-09-30 | 1999-09-24 | Method for producing a component and corresponding component |
DE59903273T DE59903273D1 (de) | 1998-09-30 | 1999-09-24 | Verfahren zum herstellen eines bauelementes und bauelement |
JP2000572821A JP2002526884A (ja) | 1998-09-30 | 1999-09-24 | 構成エレメントを製造する方法および構成エレメント |
EP99955801A EP1118072B1 (de) | 1998-09-30 | 1999-09-24 | Verfahren zum herstellen eines bauelementes und bauelement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19845075.3 | 1998-09-30 | ||
DE19845075A DE19845075A1 (de) | 1998-09-30 | 1998-09-30 | Verfahren zum Herstellen eines Bauelementes und Bauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000019397A1 true WO2000019397A1 (de) | 2000-04-06 |
Family
ID=7882952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/003083 WO2000019397A1 (de) | 1998-09-30 | 1999-09-24 | Verfahren zum herstellen eines bauelementes und bauelement |
Country Status (7)
Country | Link |
---|---|
US (1) | US6688933B1 (de) |
EP (1) | EP1118072B1 (de) |
JP (1) | JP2002526884A (de) |
CN (1) | CN1132134C (de) |
DE (2) | DE19845075A1 (de) |
TW (1) | TW451173B (de) |
WO (1) | WO2000019397A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1359628A2 (de) * | 2002-05-03 | 2003-11-05 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19943149A1 (de) * | 1999-09-09 | 2001-04-05 | Siemens Ag | Verfahren zur Verkapselung von Bauelementen |
DE10005296A1 (de) | 2000-02-07 | 2001-08-16 | Infineon Technologies Ag | Vorrichtung für die Emission elektromagnetischer Strahlung und Verfahren zu deren Herstellung |
DE102004011734A1 (de) * | 2004-03-04 | 2005-09-22 | E.G.O. Elektro-Gerätebau GmbH | Elektrisches Haushaltsgerät |
DE102004049955B4 (de) * | 2004-10-13 | 2008-12-04 | Schott Ag | Verfahren zur Herstellung eines optischen Bauelements, insbesondere einer OLED |
US7977877B2 (en) * | 2007-03-02 | 2011-07-12 | Global Oled Technology Llc | Flat panel OLED device having deformable substrate |
US7973473B2 (en) * | 2007-03-02 | 2011-07-05 | Global Oled Technology Llc | Flat panel OLED device having deformable substrate |
DE102008030585B4 (de) * | 2008-06-27 | 2019-02-21 | Osram Oled Gmbh | Bauteil mit einem ersten Substrat und einem zweiten Substrat und Verfahren zu dessen Herstellung |
TWI457880B (zh) * | 2010-09-30 | 2014-10-21 | E Ink Holdings Inc | 曲面顯示模組與顯示裝置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4486499A (en) * | 1980-06-13 | 1984-12-04 | Futaba Denshi Kogyo Kabushiki Kaisha | Electroluminescent device |
US4849674A (en) * | 1987-03-12 | 1989-07-18 | The Cherry Corporation | Electroluminescent display with interlayer for improved forming |
US5804917A (en) * | 1995-01-31 | 1998-09-08 | Futaba Denshi Kogyo K.K. | Organic electroluminescent display device and method for manufacturing same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395244A (en) * | 1979-06-22 | 1983-07-26 | David Glaser | Method of making a display panel |
DE3235724A1 (de) | 1981-10-02 | 1983-04-21 | Futaba Denshi Kogyo K.K., Mobara, Chiba | Leuchtstoff-anzeigevorrichtung |
DE3522141A1 (de) * | 1985-06-21 | 1987-01-02 | Standard Elektrik Lorenz Ag | Anzeigevorrichtung |
JP2701629B2 (ja) * | 1991-11-01 | 1998-01-21 | カシオ計算機株式会社 | 液晶表示装置およびその製造方法 |
JP3212837B2 (ja) * | 1995-06-30 | 2001-09-25 | 富士通株式会社 | プラズマディスプレイパネル及びその製造方法 |
US5697825A (en) * | 1995-09-29 | 1997-12-16 | Micron Display Technology, Inc. | Method for evacuating and sealing field emission displays |
TW493096B (en) * | 1997-08-29 | 2002-07-01 | Toshiba Corp | Liquid crystal display device and method for manufacturing the same |
-
1998
- 1998-09-30 DE DE19845075A patent/DE19845075A1/de not_active Withdrawn
-
1999
- 1999-09-24 US US09/857,252 patent/US6688933B1/en not_active Expired - Lifetime
- 1999-09-24 DE DE59903273T patent/DE59903273D1/de not_active Expired - Lifetime
- 1999-09-24 CN CN998115932A patent/CN1132134C/zh not_active Expired - Lifetime
- 1999-09-24 EP EP99955801A patent/EP1118072B1/de not_active Expired - Lifetime
- 1999-09-24 WO PCT/DE1999/003083 patent/WO2000019397A1/de active IP Right Grant
- 1999-09-24 JP JP2000572821A patent/JP2002526884A/ja active Pending
- 1999-09-29 TW TW088116718A patent/TW451173B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4486499A (en) * | 1980-06-13 | 1984-12-04 | Futaba Denshi Kogyo Kabushiki Kaisha | Electroluminescent device |
US4849674A (en) * | 1987-03-12 | 1989-07-18 | The Cherry Corporation | Electroluminescent display with interlayer for improved forming |
US5804917A (en) * | 1995-01-31 | 1998-09-08 | Futaba Denshi Kogyo K.K. | Organic electroluminescent display device and method for manufacturing same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1359628A2 (de) * | 2002-05-03 | 2003-11-05 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter |
EP1359628A3 (de) * | 2002-05-03 | 2006-03-22 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter |
Also Published As
Publication number | Publication date |
---|---|
US6688933B1 (en) | 2004-02-10 |
CN1321293A (zh) | 2001-11-07 |
TW451173B (en) | 2001-08-21 |
DE59903273D1 (de) | 2002-12-05 |
EP1118072A1 (de) | 2001-07-25 |
JP2002526884A (ja) | 2002-08-20 |
EP1118072B1 (de) | 2002-10-30 |
DE19845075A1 (de) | 2000-04-13 |
CN1132134C (zh) | 2003-12-24 |
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