WO2000003575A1 - Fadenbearbeitungssystem - Google Patents
Fadenbearbeitungssystem Download PDFInfo
- Publication number
- WO2000003575A1 WO2000003575A1 PCT/EP1999/004820 EP9904820W WO0003575A1 WO 2000003575 A1 WO2000003575 A1 WO 2000003575A1 EP 9904820 W EP9904820 W EP 9904820W WO 0003575 A1 WO0003575 A1 WO 0003575A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- processing system
- thread processing
- housing
- extension
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H51/00—Forwarding filamentary material
- B65H51/30—Devices controlling the forwarding speed to synchronise with supply, treatment, or take-up apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H51/00—Forwarding filamentary material
- B65H51/20—Devices for temporarily storing filamentary material during forwarding, e.g. for buffer storage
- B65H51/22—Reels or cages, e.g. cylindrical, with storing and forwarding surfaces provided by rollers or bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H54/00—Winding, coiling, or depositing filamentary material
- B65H54/70—Other constructional features of yarn-winding machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/53—Auxiliary process performed during handling process for acting on performance of handling machine
- B65H2301/5305—Cooling parts or areas of handling machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/31—Textiles threads or artificial strands of filaments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Definitions
- the invention relates to a thread processing system according to the preamble of patent claim 1.
- Thread processing systems could not only be thread delivery devices, but also, for example, thread processing accessories that supply textile machines such as weaving or knitting machines with thread, which have at least one electrically driven component and a control circuit associated therewith.
- these can be thread impregnators or thread oilers, controlled thread brakes and thread tensioners, thread slip conveyors, rotary drives for thread supply spools, and the like.
- the control circuit can be located in the housing of the thread delivery device or the accessory device, or in a separate housing of the thread delivery device or the accessory device, or in a separate housing which is nevertheless to be regarded as part of the thread processing system.
- the control circuit of the drive motor has effect traistors as the semiconductor component.
- the control circuit is usually arranged in the housing, the effect transistors being positioned on the printed circuit board.
- the semiconductor components generate heat, which leads to a relatively high heat level during extended operation, which affects the service life of the control circuit, in particular the semiconductor components.
- the contact with the heat-conducting body takes place at some distance from the warmest area of the semiconductor components, which is usually close to the contacts and thus radiates a lot of heat into the environment that is not absorbed by the heat-conducting body.
- the inexpensive, so-called "surface mounting" of these semiconductor components cannot therefore be used.
- semiconductor components are fastened horizontally with one of their surfaces on an adhesive surface of the printed circuit board, either in addition to the contacts or even to produce contacting or grounding.
- the invention has for its object to provide a thread processing system of the type mentioned, in which a low temperature level can be achieved in the control circuit in a structurally simple, inexpensive manner and in a space-saving manner, possibly even when using the surface mounting technology for the semiconductor components.
- Heat generated by the semiconductor component is dissipated with good efficiency through physical heat conduction through the printed circuit board into the housing or the housing part.
- the projection can be easily formed in the housing when it is shaped.
- the semiconductor component is particularly expediently cooled in the vicinity of the contacts, that is to say close to the point of origin of the heat, because the extension can reach the point of origin through the printed circuit board.
- a heat build-up between the semiconductor component and the printed circuit board is also avoided because a physical heat conduction path is created from the semiconductor component into the housing. In this way, the temperature of the semiconductor component and in the control circuit can be considerably reduced, which increases operational reliability and stability. time the control circuit benefits.
- the housing can be the housing of the thread delivery device or an accessory device, or a separate housing for the control circuit.
- An intermediate material expediently at least somewhat elastic, inserted between the semiconductor component and the extension improves the heat dissipation. Full-surface contact between hard or metallic surfaces can be difficult to achieve.
- the intermediate material is able to compensate for manufacturing or thermal defects between the heat-dissipating surfaces.
- the intermediate material is expediently an electrically insulating cushion (e.g. gap pad) made of a good heat-conducting material, an adhesive or filler application (e.g. silicon plastic) or a flexible carrier impregnated with an adhesive (e.g. self-adhesive insulating tape) (claim 3).
- an electrically insulating cushion e.g. gap pad
- an adhesive or filler application e.g. silicon plastic
- a flexible carrier impregnated with an adhesive e.g. self-adhesive insulating tape
- the semiconductor component to be cooled can be conveniently attached to the printed circuit board using the so-called surface mounting technique, i.e. in an automatic assembly device and / or with assembly robots (claim 4).
- the extension is expediently passed through a specially shaped opening or a cutout of the printed circuit board (claim 5), the extension engaging in the opening or the cutout relatively precisely or with play on all sides. In the case of large semiconductor components, several extensions could cool together.
- the semiconductor component is advantageously acted upon by an abutment on the side opposite the extension.
- the abutment can be non-positively against the Semiconductor component pressing extension generate a force balance, so that the connection area of the semiconductor component with the circuit board or the contacts are not subject to undesirable loads.
- the contact pressure between the extension and the semiconductor component can be set by means of the abutment.
- the circuit board can also be positioned and secured in the housing or a housing part, so that the number of fastening points for the circuit board can be reduced or no further fastening points are required at all.
- the abutment can be a form-fitting positioning member for the semiconductor component.
- the abutment can be a spring element (claim 8), preferably with an adjustable pressing force, in order to be able to carry out the aforementioned force balance and also to secure the position of the printed circuit board.
- the spring element is fixed against its holding block against the stop, so that the hold-down force can be precisely predetermined.
- the extensions with the abutment define a circuit board holding device, so that further fastening points and assembly steps when fixing the circuit board are unnecessary as soon as the assembly steps for cooling have been carried out.
- the extensions are, for example, block-like or pin-like and in one piece with the housing or housing part.
- the extensions can already be realize in the shaping of the housing or housing part, which considerably simplifies subsequent assembly (claim 11).
- the end faces of the extensions should be machined (claim 12).
- the end faces may even be adapted to the contours of the semiconductor components in the contact area.
- a plurality of extensions of the housing which serve for cooling could be connected to one another by connecting webs or contained in a common base (claim 13) in order to be able to use the largest possible mass for cooling or heat distribution.
- FIG. 1 shows a partial section of a conventional cooling structure (prior art)
- Fig. 2 shows a section through an embodiment of the invention
- Cooling structure for a thread processing system e.g. for a thread delivery device
- FIG. 3 is a schematic front view of the thread delivery device
- FIG. 4 shows an enlarged detail section of the embodiment of a cooling structure according to the invention, and 5 is a top view of FIG. 4.
- Fig. 1 illustrates a conventional cooling structure for a thread processing system F, as can be found in thread delivery devices F on the market.
- the thread delivery device F has a housing G made of metallic material (light metal, light metal alloy, die casting, zinc die casting or the like), which e.g. is composed of a basic housing G1 and a covering housing part G2.
- a printed circuit board B equipped at least with semiconductor components C (effect transistors, processors or the like) is fixed to bearings 1 of the housing part G2 with fastening elements 2.
- the semiconductor components C are connected near the edge region of the printed circuit board B with contacts 3, but are mounted in such a way that their bodies 4 protrude from the printed circuit board B.
- a strip-shaped heat transfer body W e.g. made of metal, fixed with fasteners 6, so that a physical heat dissipation takes place between the heat-conducting body W and the housing part G2.
- the bodies 4 of the semiconductor components C are clamped in contacting manner with fastening elements 7 against the heat-conducting body W in order to transfer occurring heat into the heat-conducting body W.
- FIG. 2 illustrates a section through a cooling structure according to the invention for semiconductor components C (effect transistors, processors or the like) of a control circuit 5 of a thread delivery device F of a thread processing system.
- the printed circuit board B equipped with the semiconductor components C is mounted on the housing part G2 of the housing G.
- the control circuit S could also be arranged in a housing separate from the thread processing device and equipped with this cooling structure.
- Each semiconductor component C is connected via its contacts 3 to conductor tracks of the printed circuit board B (not shown) and lies with one (13) of its surfaces adjacent to or on the printed circuit board W.
- the printed circuit board B is provided with a through opening 10 (or with a cutout open to the edge area, not shown), in which an extension P formed in one piece with the housing part G2 (for example in the form of a pin, block, truncated cone or truncated pyramid) engages in such a way that its end face 12 directly contacts the surface 13 of the semiconductor component C. contacted, or as shown, with the intermediation of a good heat-conducting intermediate material Z.
- the intermediate material Z is, for example, an electrically insulating, good heat-conducting cushion (for example a gap pad), or an application of adhesive or filler or an elastic carrier impregnated with an adhesive.
- the intermediate material Z can have a certain elasticity and expediently adhesive properties to both surfaces 12, 13 in order to improve the heat transfer.
- Holding extensions P ' are also integrated in the housing part G2.
- One of the holding extensions P ' serves to fix an abutment A, which presses the semiconductor components C against the contact pressure of the extensions P in a positive and / or non-positive manner.
- the abutment A can be a spring element 14, which acts on several semiconductor components C together with a plurality of end regions 15 and is fixed in a fastening region 16 by means of a fastening element 17 on the extension P '.
- the elastic pressure force of each end region 15 is adjustable, for example by tensioning the fastening region 16 against the stop with the holding extension P '.
- the holding extension P ' also passes through an opening in the printed circuit board B.
- the abutment A can also be a positive positioning stop for one or more semiconductor components D.
- Another holding projection P 'of the housing part G2 can also be used to fix the printed circuit board B, for example in the vicinity of a connector body 22, mainly because when using the connector body 22 (connecting or loosening an electrical connection) Forces can be introduced into the circuit board B, which then receives the holding extension P '.
- the extensions P, at least one holding extension P ', and the abutment A can together define a mounting device for the printed circuit board B, so that no further fastening devices are required, but the printed circuit board B is properly secured as soon as the structural requirements for the cooling of the semiconductor components C were created.
- the circuit board B can be mounted either in the housing part G2 or in the housing part G1.
- the semiconductor components C on the printed circuit board B in the housing part G2 can point to the housing part G1, and on the printed circuit board B in the housing part G1 can point to the housing part G2.
- the extensions P each reach through the printed circuit board B for cooling.
- the motor M contained in the housing part G1 is also indicated by dashed lines and is controlled by the control circuit arranged on the printed circuit board B.
- the respective circuit board B could also be arranged upright or at an angle in the housing G. Even then at least one extension in each case reaches through the circuit board to the semiconductor component to be cooled. If the control circuit S (not shown) is contained in its own housing, the cooling structure is integrated in this housing.
- Fig. 2 it is indicated that the semiconductor components C are mounted on the circuit board B according to the so-called "surface mounting technique".
- 4 and 5 illustrate a variant of this assembly technique, which can be used inexpensively in largely automated or robotic assembly devices.
- a flat adhesive area 20 (made of metal) is attached to the printed circuit board B, which is either only required for an adhesive function of the semiconductor component C, or also for establishing a contact (e.g. grounding or another contact equivalent to the contact 13 with the conductor track 18).
- the Semiconductor component C has on its surface 13 a metallic layer 19 which, in order to fix the semiconductor component C on the printed circuit board B (in addition to the contact 3), is connected to the adhesive area 20 when the printed circuit board B is assembled. A further attachment of the semiconductor component C is then no longer necessary.
- the opening 10 through the printed circuit board B which is intended for the engagement of the extension P as a heat-conducting body W, extends either up to the adhesive area 20, or for manufacturing reasons through the adhesive area 20, so that the end face 12 of the extension P then directly the metal layer 19 is applied to dissipate heat. If necessary, an intermediate material Z shown in FIG. 2 is provided between the end surface 12 and the metal layer 19 on the surface 13 in order to improve the heat transfer.
- the abutment A lies with its end region 25 on the upper side of the semiconductor component C facing away from the extension P.
- JJI Fig. 5 extends the adhesive area 20 over e.g. square outer contour of the semiconductor component C to the outside. Since the opening 10 is a round bore, and the extension P also has a round end surface, there are sufficiently large areas in corner regions 21 for the semiconductor component C to adhere in the adhesion region 20 (surface mounting), and nevertheless become effective near the surface 13 in the semiconductor component C heat generated dissipated through the circuit board B.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Textile Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020007014814A KR20010071607A (ko) | 1998-07-08 | 1999-07-08 | 방적사 처리 시스템 |
US09/720,835 US6519152B1 (en) | 1998-07-08 | 1999-07-08 | Yarn processing system |
DE59905338T DE59905338D1 (de) | 1998-07-08 | 1999-07-08 | Fadenbearbeitungssystem |
EP99932856A EP1095547B1 (de) | 1998-07-08 | 1999-07-08 | Fadenbearbeitungssystem |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19830576A DE19830576A1 (de) | 1998-07-08 | 1998-07-08 | Fadenbearbeitungssystem |
DE19830576.1 | 1998-07-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000003575A1 true WO2000003575A1 (de) | 2000-01-20 |
Family
ID=7873386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1999/004820 WO2000003575A1 (de) | 1998-07-08 | 1999-07-08 | Fadenbearbeitungssystem |
Country Status (6)
Country | Link |
---|---|
US (1) | US6519152B1 (de) |
EP (1) | EP1095547B1 (de) |
KR (1) | KR20010071607A (de) |
CN (1) | CN1178568C (de) |
DE (2) | DE19830576A1 (de) |
WO (1) | WO2000003575A1 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1345265A2 (de) * | 2002-03-15 | 2003-09-17 | Delphi Technologies, Inc. | Elektronische Anordnung mit verbesserter Wärmesenke |
DE102009051632A1 (de) * | 2009-11-02 | 2011-05-05 | Beru Ag | Leiterplatte mit Kühlkörper |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100555546B1 (ko) * | 2004-01-08 | 2006-03-03 | 삼성전자주식회사 | 집적회로소자 냉각장치 및 이를 구비하는 디스크 드라이브 |
US6982877B2 (en) * | 2004-02-20 | 2006-01-03 | Hewlett-Packard Development Company, L.P. | Heat sink having compliant interface to span multiple components |
US9631128B2 (en) * | 2007-02-09 | 2017-04-25 | Ngk Insulators, Ltd. | Bonding material and semiconductor supporting device |
JP5574172B2 (ja) * | 2010-07-14 | 2014-08-20 | 株式会社ジェイテクト | 制御装置 |
JP6287659B2 (ja) * | 2014-07-22 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
JP6287815B2 (ja) * | 2014-12-24 | 2018-03-07 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2651857A1 (de) * | 1976-10-28 | 1978-05-03 | Sulzer Ag | Durch einen fadenfuehler gesteuerter antrieb fuer eine aufwickelvorrichtung |
EP0116396A2 (de) * | 1983-01-06 | 1984-08-22 | Crystalate Electronics Limited | Elektrischer Zusammenbau |
US5812375A (en) * | 1996-05-06 | 1998-09-22 | Cummins Engine Company, Inc. | Electronic assembly for selective heat sinking and two-sided component attachment |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
GB2173349B (en) * | 1985-03-29 | 1988-12-07 | Gec Avionics | Electric circuit module arrangement |
WO1992002117A1 (en) * | 1990-07-26 | 1992-02-06 | Fujitsu Limited | Heat dissipating structure of semiconductor device |
DE59406013D1 (de) * | 1993-06-07 | 1998-06-25 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
US5461541A (en) * | 1994-02-22 | 1995-10-24 | Dana Corporation | Enclosure for an electronic circuit module |
-
1998
- 1998-07-08 DE DE19830576A patent/DE19830576A1/de not_active Withdrawn
-
1999
- 1999-07-08 DE DE59905338T patent/DE59905338D1/de not_active Expired - Fee Related
- 1999-07-08 EP EP99932856A patent/EP1095547B1/de not_active Expired - Lifetime
- 1999-07-08 KR KR1020007014814A patent/KR20010071607A/ko not_active Application Discontinuation
- 1999-07-08 WO PCT/EP1999/004820 patent/WO2000003575A1/de not_active Application Discontinuation
- 1999-07-08 US US09/720,835 patent/US6519152B1/en not_active Expired - Fee Related
- 1999-07-08 CN CNB998083909A patent/CN1178568C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2651857A1 (de) * | 1976-10-28 | 1978-05-03 | Sulzer Ag | Durch einen fadenfuehler gesteuerter antrieb fuer eine aufwickelvorrichtung |
EP0116396A2 (de) * | 1983-01-06 | 1984-08-22 | Crystalate Electronics Limited | Elektrischer Zusammenbau |
US5812375A (en) * | 1996-05-06 | 1998-09-22 | Cummins Engine Company, Inc. | Electronic assembly for selective heat sinking and two-sided component attachment |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1345265A2 (de) * | 2002-03-15 | 2003-09-17 | Delphi Technologies, Inc. | Elektronische Anordnung mit verbesserter Wärmesenke |
EP1345265A3 (de) * | 2002-03-15 | 2005-05-11 | Delphi Technologies, Inc. | Elektronische Anordnung mit verbesserter Wärmesenke |
DE102009051632A1 (de) * | 2009-11-02 | 2011-05-05 | Beru Ag | Leiterplatte mit Kühlkörper |
Also Published As
Publication number | Publication date |
---|---|
CN1308840A (zh) | 2001-08-15 |
KR20010071607A (ko) | 2001-07-28 |
US6519152B1 (en) | 2003-02-11 |
EP1095547B1 (de) | 2003-05-02 |
DE19830576A1 (de) | 2000-01-13 |
CN1178568C (zh) | 2004-12-01 |
DE59905338D1 (de) | 2003-06-05 |
EP1095547A1 (de) | 2001-05-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102008033465B4 (de) | Leistungshalbleitermodulsystem und leistungshalbleitermodul mit einem gehause sowie verfahren zur herstellung einer leis- tungshalbleiteranordnung | |
DE102009002992B4 (de) | Leistungshalbleitermodulanordnung mit eindeutig und verdrehsicher auf einem Kühlkörper montierbarem Leistungshalbleitermodul und Montageverfahren | |
EP0154719A2 (de) | Elektrisches Schaltgerät | |
DE19709911B4 (de) | Verfahren zum Ultraschallbonden eines Leiters eines Anschlußrahmens und Anschlußrahmenklemme zum Klemmen eines Anschlußrahmens beim Bonden | |
DE102015115122B4 (de) | Leistungshalbleitermodul mit zweiteiligem Gehäuse | |
WO1997008750A1 (de) | Kühlkörper für elektronische bauelemente | |
DE10129788A1 (de) | Kunststoffrahmen zur Montage eines elektronischen Starkstrom-Steuergeräts | |
WO2008083999A1 (de) | Montageanordnung zur fixierung übereinander angeordneter leiterplatten in einem gehäuse | |
DE4031051A1 (de) | Modul mit mindestens einem halbleiterschaltelement und einer ansteuerschaltung | |
DE3627372C2 (de) | ||
DE3331207A1 (de) | Baugruppe fuer elektronische steuergeraete | |
EP1095547A1 (de) | Fadenbearbeitungssystem | |
DE10341560B4 (de) | Leistungs-Halbleitervorrichtung | |
DE3903615C2 (de) | ||
DE102008039071B4 (de) | Beleuchtungsvorrichtung für Fahrzeuge | |
DE3614086C2 (de) | Vorrichtung zur Wärmeableitung von einer elektronische Komponenten enthaltenden Baueinheit und Verfahren zum thermischen Koppeln einer elektronische Komponenten enthaltenden Baueinheit | |
DE10123198A1 (de) | Anordnung aus einem Gehäuse und einem Schaltungsträger | |
EP0652694B1 (de) | Steuergerät für ein Kraftfahrzeug | |
WO2008083878A1 (de) | Fixierungselement für leiterplatten | |
DE19609929A1 (de) | Leistungshalbleitermodul | |
DE3628556C1 (en) | Semiconductor device | |
DE102017117667B4 (de) | Leistungshalbleitermodul mit einer auf eine Schalteinrichtung einwirkenden Druckeinrichtung | |
DE102015213916A1 (de) | Leistungshalbleitermodulanordnung | |
EP0465693B1 (de) | Elektrisch isolierender Schaltungsträger mit integrierten Kühlmitteln | |
EP1020910A2 (de) | Kühlkörperbefestigung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 99808390.9 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN KR US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020007014814 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1999932856 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 09720835 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1999932856 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020007014814 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 1999932856 Country of ref document: EP |
|
WWR | Wipo information: refused in national office |
Ref document number: 1020007014814 Country of ref document: KR |