WO2000000929A3 - Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung - Google Patents
Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung Download PDFInfo
- Publication number
- WO2000000929A3 WO2000000929A3 PCT/DE1999/001744 DE9901744W WO0000929A3 WO 2000000929 A3 WO2000000929 A3 WO 2000000929A3 DE 9901744 W DE9901744 W DE 9901744W WO 0000929 A3 WO0000929 A3 WO 0000929A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- installation
- card carrier
- production
- semiconductor chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- Die Bonding (AREA)
Abstract
Ein Chipmodul (1) zum Einbau in einen Chipkartenträger weist einen Halbleiterchip (5) sowie ein als Metallschicht ausgebildetes Leadframe (2) auf. Zwischen Metallschicht und Halbleiterchip (5) ist eine Schicht aus Klebstoff (11) vorgesehen, der in nicht-erhärtetem Zustand fließfähig ist und sich aufgrund einer Kapillarwirkung ausbreitet. Der Halbleiterchip (5) ist mit einer sich vom Leadframe (2) aus erstreckenden Hotmelt-Klebstoffschicht (7) bedeckt.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19828653.8 | 1998-06-26 | ||
DE19828653A DE19828653A1 (de) | 1998-06-26 | 1998-06-26 | Chipmodul zum Einbau in einen Chipkartenträger sowie Verfahren zu dessen Herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000000929A2 WO2000000929A2 (de) | 2000-01-06 |
WO2000000929A3 true WO2000000929A3 (de) | 2000-03-16 |
Family
ID=7872189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/001744 WO2000000929A2 (de) | 1998-06-26 | 1999-06-15 | Chipmodul zum einbau in einen chipkartenträger sowie verfahren zu dessen herstellung |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19828653A1 (de) |
WO (1) | WO2000000929A2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2805639B1 (fr) * | 2000-02-29 | 2002-05-24 | Schlumberger Systems & Service | Procede de fixation d'un module a un corps de carte |
DE10016135A1 (de) * | 2000-03-31 | 2001-10-18 | Infineon Technologies Ag | Gehäusebaugruppe für ein elektronisches Bauteil |
DE10111028A1 (de) * | 2001-03-07 | 2002-09-19 | Infineon Technologies Ag | Chipkartenmodul |
DE10139395A1 (de) * | 2001-08-10 | 2003-03-06 | Infineon Technologies Ag | Kontaktierung von Halbleiterchips in Chipkarten |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4143456A (en) * | 1976-06-28 | 1979-03-13 | Citizen Watch Commpany Ltd. | Semiconductor device insulation method |
US5232962A (en) * | 1991-10-09 | 1993-08-03 | Quantum Materials, Inc. | Adhesive bonding composition with bond line limiting spacer system |
DE4325458A1 (de) * | 1993-07-29 | 1995-02-09 | Orga Bond Technik Gmbh | Trägerelement für einen IC-Baustein |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD214721A1 (de) * | 1983-04-15 | 1984-10-17 | Funkwerk Erfurt Veb K | Montage-anordnung fuer halbleiterbauelemente |
US5214307A (en) * | 1991-07-08 | 1993-05-25 | Micron Technology, Inc. | Lead frame for semiconductor devices having improved adhesive bond line control |
JP3825475B2 (ja) * | 1995-06-30 | 2006-09-27 | 株式会社 東芝 | 電子部品の製造方法 |
JP3689159B2 (ja) * | 1995-12-01 | 2005-08-31 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
DE19622684A1 (de) * | 1996-06-05 | 1997-12-11 | Siemens Ag | Verfahren zur Herstellung mechanisch fester Klebstoffverbindungen zwischen Oberflächen |
DE19651862A1 (de) * | 1996-12-13 | 1998-06-18 | Bosch Gmbh Robert | Verfahren zum Reflowlöten von mit SMD-Bauelementen bestückten Leiterplatten |
-
1998
- 1998-06-26 DE DE19828653A patent/DE19828653A1/de not_active Withdrawn
-
1999
- 1999-06-15 WO PCT/DE1999/001744 patent/WO2000000929A2/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4143456A (en) * | 1976-06-28 | 1979-03-13 | Citizen Watch Commpany Ltd. | Semiconductor device insulation method |
US5232962A (en) * | 1991-10-09 | 1993-08-03 | Quantum Materials, Inc. | Adhesive bonding composition with bond line limiting spacer system |
DE4325458A1 (de) * | 1993-07-29 | 1995-02-09 | Orga Bond Technik Gmbh | Trägerelement für einen IC-Baustein |
Also Published As
Publication number | Publication date |
---|---|
WO2000000929A2 (de) | 2000-01-06 |
DE19828653A1 (de) | 2000-01-05 |
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