WO1999056306A1 - Vorrichtung zum fixieren von substraten - Google Patents
Vorrichtung zum fixieren von substraten Download PDFInfo
- Publication number
- WO1999056306A1 WO1999056306A1 PCT/EP1999/002500 EP9902500W WO9956306A1 WO 1999056306 A1 WO1999056306 A1 WO 1999056306A1 EP 9902500 W EP9902500 W EP 9902500W WO 9956306 A1 WO9956306 A1 WO 9956306A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spring
- outer member
- inner hole
- end part
- wafer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 238000001035 drying Methods 0.000 claims description 9
- 230000000295 complement effect Effects 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 230000036316 preload Effects 0.000 claims 1
- 210000000078 claw Anatomy 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B19/00—Bolts without screw-thread; Pins, including deformable elements; Rivets
- F16B19/04—Rivets; Spigots or the like fastened by riveting
- F16B19/08—Hollow rivets; Multi-part rivets
- F16B19/10—Hollow rivets; Multi-part rivets fastened by expanding mechanically
- F16B19/1027—Multi-part rivets
- F16B19/1036—Blind rivets
- F16B19/109—Temporary rivets, e.g. with a spring-loaded pin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B17/00—Guiding record carriers not specifically of filamentary or web form, or of supports therefor
- G11B17/02—Details
- G11B17/022—Positioning or locking of single discs
- G11B17/028—Positioning or locking of single discs of discs rotating during transducing operation
- G11B17/0284—Positioning or locking of single discs of discs rotating during transducing operation by clampers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/0014—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form
- G11B23/0021—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture record carriers not specifically of filamentary or web form discs
- G11B23/0028—Details
- G11B23/0035—Details means incorporated in the disc, e.g. hub, to enable its guiding, loading or driving
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
Definitions
- IPC International Patent Classification
- the invention relates to a device for fixing substrates each having an inner hole with a housing and an element arranged in the housing and insertable into the inner hole.
- Such a device can be used, for example, at different stations in a device for bonding substrates, as is described, for example, in DE-A-197 18 471, which did not prepublish, and which is based on the same applicant.
- the device according to the invention is suitable for use in a device for drying substrates, as is described in DE 197 21 689, which did not prepublish and is based on the same applicant.
- the content of the above-mentioned applications is made the content of this application.
- substrates for specific treatment steps are each deposited on a support in order, for example, to bond two substrates or to dry substrates.
- the support surfaces do not provide any fixation of the substrates to be treated, so that the substrates can slip, in particular two substrates to be bonded can slip. This in turn affects the treatment process, which can lead to a loss of quality in the treated substrates.
- a device for gripping objects with a through opening has a gripper 12 consisting of a base body 4, a plunger 9 axially movable in the base body 4 and balls 6 arranged in the base body 4, which can be pushed outwards by an axial movement of the plunger within the base body over the outer circumference of the base body 4.
- a clamping device for pulling in and clamping a tool holder with a hollow taper shank in the tool holder of a work spindle is known.
- clamping claws for attaching the tool holder are spread on via a clamping mechanism which can be displaced relative to the clamping claws.
- DE-A-195 29 537 shows a device according to the preamble of claim 1.
- the invention is therefore based on the object of creating a device for fixing substrates having an inner hole each of the type mentioned at the outset, which, with simple technical means and simple handling of the device, enables the substrates to be fixed well in order to reduce reject rates and to enable better quality of the manufactured substrates.
- the insertable element in the inner hole has an axially movable relative to the housing outer member and an axially movable relative to the housing inner member, the outer member is expandable by a relative movement of the links.
- the widening of the outer member in the inner hole of a substrate firstly fixes the substrate and centers it with respect to the outer member.
- the two substrates are also well centered with respect to one another.
- the outer and / or inner member is advantageously cylindrical in order to achieve a simple configuration and to securely engage the inner hole of the substrate or the substrates.
- the outer member is elastically expandable, i. H. that it elastically returns to the unexpanded state after expansion and thus releases the engagement with the substrate or substrates.
- the outer member has a tapering inner diameter in the region of the slots, via which the expandability is achieved when the members move relative.
- the outer member can be axially pretensioned by a pretensioning device, so that it is pretensioned into a specific axial position in which the outer member is located in an inner hole of a substrate.
- a spring is provided as a particularly suitable pretensioning device.
- the inner member has a bevel on the outer circumference, which is advantageously complementary to the tapering inner diameter of the outer member, in order to widen the outer member with as little resistance as possible during a relative movement of the members.
- the inner member can advantageously be axially pretensioned into a position widening the outer member by means of a pretensioning device, in order to bring the inner member in a simple manner into a position in which the inner member expands the outer member.
- the biasing device is advantageously a spring.
- the pretensioning device for the inner member has a smaller spring constant than the pretensioning device for the outer member.
- the outer link preferably has a support surface for the pretensioning device of the outer and inner links.
- the outer and inner links can be axially pretensioned by a common pretensioning device, which is advantageously a spring.
- the number of parts forming the device can be reduced by using a common pretensioning device.
- the outer link In order to limit the relative movement of the links to one another and to avoid the links coming apart, the outer link has a shoulder in the inner circumference in an end region which cannot be expanded.
- the inner member has a protrusion that can be extended out of the outer member in order to allow relative movement between the members in a simple manner by pressure on the protrusion.
- this is the movable outer and inner members receiving housing stationary to form a fixed receiving device.
- the housing advantageously has a substrate contact surface.
- the housing advantageously has a bottom wall at one end in order to form a counter surface for the prestressing device that prestresses the outer and / or inner member.
- FIG. 1 shows a schematic illustration of a fixing device according to the invention in an expanded state, as is used in a drying device;
- FIG. 1 shows a schematic illustration of a fixing device 1 according to the invention, as is used in a drying device for semiconductor substrates 2, which is at least partially shown.
- the drying device 2 shown in FIG. 1 can be of the type described in DE 197 721 689, which is not prepublished and goes back to the same applicant. To avoid repetition, the content of this application is made the subject of the present application.
- the drying device has a lower part 4 and an upper part, not shown.
- the lower part 4 has a support plate 5 with a support glass plate 6 on which a substrate disk 8 is located.
- the support plate 5 is rotatable by rollers 9 and 10 and at the same time guided in its position. Although only two rollers 9, 10 are shown in FIG. 1, the drying device generally has three rollers, each offset by 120 ° to one another.
- the lower part 4 also has a central guide element 12 for receiving the fixing device 1 according to the invention.
- the fixing device 1 has a stationary housing 15 accommodated in the guide element 12.
- the housing 15 has a hollow cylindrical shape with an annular flange 16 at an upper end of the housing.
- the annular flange 16 projects beyond the outer circumference of the cylindrical housing 15 and forms a substrate contact surface 17 on the upper side.
- outer member 20 Within the cylindrical housing 15 there is concentrically a movably received outer member 20 with an upper, expandable end part 21 and one not expandable part 22.
- the outer member 20 is in turn hollow cylindrical with an inner circumference 24 which tapers upward in the region of the expandable part 21.
- three slots 23 are provided, as can best be seen in FIG. 4.
- the non-expandable part 22 of the outer member is closed at its lower end by means of a screwable plug 25.
- the outer member 20 is biased upwards by means of a spring 27, which is supported on the one hand on the plug 25 and on the other hand on the guide element 12.
- the guide element 12 has a centered guide projection 28 which extends into the spring 27, which as
- Compression spring is formed. This prevents the spring 27 from slipping and tilting to the side.
- the inner member 30 has a hollow cylindrical end part 32, a conically tapering middle part 30 and an end part 34 forming a projection.
- the hollow cylindrical end part 32 has a receiving cavity 36 in which a spring 37 is received.
- the spring 37 which is designed as a compression spring, is supported at one end on the plug 25 and at the other end on a wall of the inner member in order to bias it upward.
- the conically tapering central part 33 has an inclined outer peripheral surface 39 which is complementary to the conically tapering inner peripheral surface of the expandable end part 21 of the outer member 20.
- the cylindrical end part 34 forms a projection which can extend through the expandable end part 21, as shown in FIG.
- a so-called inner hole gripper 40 is shown in FIGS. 1 to 3 above the fixing device 1 according to the invention.
- This inner hole gripper 40 is axially movable by a mechanism, not shown. Furthermore, the inner hole gripper 40 has a spherical head-shaped end part 41 which can be inserted into an inner hole of a substrate 8 and which can be expanded within the inner hole in order to grip the substrate 8 and, if necessary, to transport it. Inner hole grippers of this type are known in the art, and the inner hole gripper is therefore not described further here.
- the outer member is biased upward by means of the spring 27 within the stationary housing 15.
- the outer member 20 extends through an inner hole of a substrate 8.
- the inner member 30 is biased upward by the spring 37 within the outer member 20.
- the bevel 39 comes into contact with the tapering inner circumference 24 of the expandable end part 21 and expands the expandable end part 21.
- the expandable end part 21 comes with its outer circumference firmly with the inner hole of the wafer 8 in
- the wafer is centered and fixed with respect to the fixing device 1.
- the cylindrical end part 34 extends axially out of the expandable end part 21 of the outer member 20.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Solid Materials (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000546386A JP2002513206A (ja) | 1998-04-24 | 1999-04-14 | 基板を位置固定するための装置 |
IL13888099A IL138880A0 (en) | 1998-04-24 | 1999-04-14 | Device for fixing substrates |
US09/674,140 US6612558B1 (en) | 1998-04-24 | 1999-04-14 | Apparatus for fixing substrates |
CA002329118A CA2329118A1 (en) | 1998-04-24 | 1999-04-14 | Device for fixing substrates |
AU36062/99A AU3606299A (en) | 1998-04-24 | 1999-04-14 | Device for fixing substrates |
EP99917978A EP1080486A1 (de) | 1998-04-24 | 1999-04-14 | Vorrichtung zum fixieren von substraten |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19818478.6 | 1998-04-24 | ||
DE19818478A DE19818478A1 (de) | 1998-04-24 | 1998-04-24 | Vorrichtung zum Fixieren von Substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999056306A1 true WO1999056306A1 (de) | 1999-11-04 |
Family
ID=7865746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1999/002500 WO1999056306A1 (de) | 1998-04-24 | 1999-04-14 | Vorrichtung zum fixieren von substraten |
Country Status (11)
Country | Link |
---|---|
US (1) | US6612558B1 (de) |
EP (1) | EP1080486A1 (de) |
JP (1) | JP2002513206A (de) |
KR (1) | KR100371014B1 (de) |
CN (1) | CN1298552A (de) |
AU (1) | AU3606299A (de) |
CA (1) | CA2329118A1 (de) |
DE (1) | DE19818478A1 (de) |
IL (1) | IL138880A0 (de) |
TW (1) | TW541273B (de) |
WO (1) | WO1999056306A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300373C (zh) * | 2004-03-24 | 2007-02-14 | 长春理工大学 | 半导体激光器腔面镀膜用柔性夹具 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8204690B2 (en) * | 2008-06-03 | 2012-06-19 | Los Alamos National Security, Llc | Analytical effective tensor for flow-through composites |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60239961A (ja) * | 1984-05-15 | 1985-11-28 | Hitachi Ltd | デイスク固定機構 |
US5000651A (en) * | 1990-01-29 | 1991-03-19 | Intelmatic Corporation | Disk gripper for use with a disk polisher |
US5080736A (en) * | 1989-05-26 | 1992-01-14 | Matsui Manufacturing Co., Ltd. | System for mounting a hub to an optical disk and a method therefor |
DE19529537A1 (de) | 1995-08-11 | 1997-02-13 | Leybold Ag | Vorrichtung zum Greifen und Halten eines flachen Substrats |
EP0790331A1 (de) * | 1996-02-15 | 1997-08-20 | Singulus Technologies GmbH | Vorrichtung zum Greifen und Halten von Substraten |
DE19618278A1 (de) | 1996-05-07 | 1997-11-20 | Schunk Fritz Gmbh | Spannvorrichtung |
US5698030A (en) * | 1995-01-31 | 1997-12-16 | Nobler Technologies, Inc. | Compact disc coating and handling system |
DE19644158A1 (de) | 1996-10-24 | 1998-04-30 | Grundig Ag | Verfahren und Vorrichtung zum Greifen von Gegenständen mit einer Durchgangsöffnung |
DE19718471A1 (de) | 1997-04-30 | 1998-11-05 | Steag Hamatech Gmbh Machines | Verfahren und Vorrichtung zum Verkleben von zwei Substraten |
DE19721689A1 (de) | 1997-05-23 | 1998-11-26 | Steag Hama Tech Gmbh Machines | Vorrichtung zum Trocknen von Substraten |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3139785A (en) * | 1961-08-30 | 1964-07-07 | Wedgelock Corp Of California | Axial load bearing anchoring means for fastener pins |
JPS55125587A (en) | 1979-03-16 | 1980-09-27 | Pioneer Video Corp | Clamping mechanism of information recording disk |
US4935695A (en) * | 1988-07-13 | 1990-06-19 | Hewlett-Packard Company | Board alignment system |
DE4338656C2 (de) * | 1993-11-12 | 1995-11-16 | Multiline International Europa | Vorrichtung zum Ausrichten von Leiterplatten und Bildträgern |
EP0922529B1 (de) * | 1997-12-11 | 2002-11-06 | Parotec AG | Einheit zum lösbaren Verbinden von Teilen einer Palettiervorrichtung und Palettiervorrichtung |
US6241228B1 (en) * | 1999-10-26 | 2001-06-05 | Charles Chupick | Free-floating hydraulic clamping device using expandable arbor |
-
1998
- 1998-04-24 DE DE19818478A patent/DE19818478A1/de not_active Withdrawn
-
1999
- 1999-04-14 CA CA002329118A patent/CA2329118A1/en not_active Abandoned
- 1999-04-14 AU AU36062/99A patent/AU3606299A/en not_active Abandoned
- 1999-04-14 CN CN99805310A patent/CN1298552A/zh active Pending
- 1999-04-14 WO PCT/EP1999/002500 patent/WO1999056306A1/de not_active Application Discontinuation
- 1999-04-14 US US09/674,140 patent/US6612558B1/en not_active Expired - Fee Related
- 1999-04-14 KR KR10-2000-7011842A patent/KR100371014B1/ko not_active IP Right Cessation
- 1999-04-14 IL IL13888099A patent/IL138880A0/xx unknown
- 1999-04-14 JP JP2000546386A patent/JP2002513206A/ja not_active Ceased
- 1999-04-14 EP EP99917978A patent/EP1080486A1/de not_active Withdrawn
- 1999-04-14 TW TW088105986A patent/TW541273B/zh not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60239961A (ja) * | 1984-05-15 | 1985-11-28 | Hitachi Ltd | デイスク固定機構 |
US5080736A (en) * | 1989-05-26 | 1992-01-14 | Matsui Manufacturing Co., Ltd. | System for mounting a hub to an optical disk and a method therefor |
US5000651A (en) * | 1990-01-29 | 1991-03-19 | Intelmatic Corporation | Disk gripper for use with a disk polisher |
US5698030A (en) * | 1995-01-31 | 1997-12-16 | Nobler Technologies, Inc. | Compact disc coating and handling system |
DE19529537A1 (de) | 1995-08-11 | 1997-02-13 | Leybold Ag | Vorrichtung zum Greifen und Halten eines flachen Substrats |
EP0790331A1 (de) * | 1996-02-15 | 1997-08-20 | Singulus Technologies GmbH | Vorrichtung zum Greifen und Halten von Substraten |
DE19618278A1 (de) | 1996-05-07 | 1997-11-20 | Schunk Fritz Gmbh | Spannvorrichtung |
DE19644158A1 (de) | 1996-10-24 | 1998-04-30 | Grundig Ag | Verfahren und Vorrichtung zum Greifen von Gegenständen mit einer Durchgangsöffnung |
DE19718471A1 (de) | 1997-04-30 | 1998-11-05 | Steag Hamatech Gmbh Machines | Verfahren und Vorrichtung zum Verkleben von zwei Substraten |
DE19721689A1 (de) | 1997-05-23 | 1998-11-26 | Steag Hama Tech Gmbh Machines | Vorrichtung zum Trocknen von Substraten |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 110 (P - 450) 24 April 1986 (1986-04-24) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300373C (zh) * | 2004-03-24 | 2007-02-14 | 长春理工大学 | 半导体激光器腔面镀膜用柔性夹具 |
Also Published As
Publication number | Publication date |
---|---|
EP1080486A1 (de) | 2001-03-07 |
CN1298552A (zh) | 2001-06-06 |
TW541273B (en) | 2003-07-11 |
KR20010042999A (ko) | 2001-05-25 |
KR100371014B1 (ko) | 2003-02-06 |
AU3606299A (en) | 1999-11-16 |
DE19818478A1 (de) | 1999-11-04 |
US6612558B1 (en) | 2003-09-02 |
JP2002513206A (ja) | 2002-05-08 |
IL138880A0 (en) | 2001-11-25 |
CA2329118A1 (en) | 1999-11-04 |
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