WO1999035691A1 - An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor - Google Patents
An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor Download PDFInfo
- Publication number
- WO1999035691A1 WO1999035691A1 PCT/US1999/000438 US9900438W WO9935691A1 WO 1999035691 A1 WO1999035691 A1 WO 1999035691A1 US 9900438 W US9900438 W US 9900438W WO 9935691 A1 WO9935691 A1 WO 9935691A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- package
- coil
- chip
- substrate layer
- conductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53642299A JP2001515661A (en) | 1998-01-09 | 1999-01-08 | Integrated circuit (IC) package including accompanying IC chip and coil and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US506098A | 1998-01-09 | 1998-01-09 | |
US09/005,060 | 1998-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1999035691A1 true WO1999035691A1 (en) | 1999-07-15 |
Family
ID=21713950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/000438 WO1999035691A1 (en) | 1998-01-09 | 1999-01-08 | An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2001515661A (en) |
KR (1) | KR20000075883A (en) |
WO (1) | WO1999035691A1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2796760A1 (en) * | 1999-07-23 | 2001-01-26 | Gemplus Card Int | Production of electronic tag for identification and tracking of objects involves attachment of large-area, thin integrated circuit to substrate and attaching communications antenna to contact pads |
WO2002056245A2 (en) * | 2000-12-01 | 2002-07-18 | Microchip Technology Incorporated | Radio frequency identification tag on a single layer substrate |
EP1562272A2 (en) * | 2004-01-14 | 2005-08-10 | Dehn + Söhne Gmbh + Co. Kg | Arrangement for checking and recording of the status of an overvoltage protection device, particularly for installation in low-voltage networks or information systems |
KR100746635B1 (en) | 2006-03-21 | 2007-08-06 | 삼성전기주식회사 | Tag of rfid system, and manufacturing method thereof |
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7578053B2 (en) | 2004-12-03 | 2009-08-25 | Hallys Corporation | Interposer bonding device |
US8025086B2 (en) | 2005-04-06 | 2011-09-27 | Hallys Corporation | Electronic component manufacturing apparatus |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US8941541B2 (en) | 1999-09-20 | 2015-01-27 | Fractus, S.A. | Multilevel antennae |
TWI587475B (en) * | 2015-11-16 | 2017-06-11 | 台灣積體電路製造股份有限公司 | Integrated circuits |
US9929087B2 (en) | 2015-11-16 | 2018-03-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Enhancing integrated circuit density with active atomic reservoir |
CN110010509A (en) * | 2018-01-05 | 2019-07-12 | 光宝新加坡有限公司 | Double lead frame magnetic coupling encapsulating structure and its manufacturing method |
US10950540B2 (en) | 2015-11-16 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Enhancing integrated circuit density with active atomic reservoir |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101038490B1 (en) * | 2004-02-23 | 2011-06-01 | 삼성테크윈 주식회사 | Semiconductor package having RFID antenna |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2675930A1 (en) * | 1991-04-25 | 1992-10-30 | Mitsubishi Electric Corp | Contactless integrated circuit card |
JPH07176646A (en) * | 1993-12-20 | 1995-07-14 | Toshiba Corp | Semiconductor package |
EP0692770A1 (en) * | 1994-06-22 | 1996-01-17 | Gemplus Card International | Manufacturing process of a contactless card by overmoulding and contactless card obtained by such process |
JPH091970A (en) * | 1995-06-20 | 1997-01-07 | Hitachi Chem Co Ltd | Ic card and manufacture thereof |
WO1997026621A1 (en) * | 1996-01-17 | 1997-07-24 | Gemplus S.C.A. | Contactless electronic module for a card or label |
EP0786357A1 (en) * | 1994-09-22 | 1997-07-30 | Rohm Co., Ltd. | Non-contact type ic card and method of manufacturing same |
-
1999
- 1999-01-08 KR KR1019997007962A patent/KR20000075883A/en not_active Application Discontinuation
- 1999-01-08 JP JP53642299A patent/JP2001515661A/en active Pending
- 1999-01-08 WO PCT/US1999/000438 patent/WO1999035691A1/en not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2675930A1 (en) * | 1991-04-25 | 1992-10-30 | Mitsubishi Electric Corp | Contactless integrated circuit card |
JPH07176646A (en) * | 1993-12-20 | 1995-07-14 | Toshiba Corp | Semiconductor package |
US5710458A (en) * | 1993-12-20 | 1998-01-20 | Kabushiki Kaisha Toshiba | Card like semiconductor device |
EP0692770A1 (en) * | 1994-06-22 | 1996-01-17 | Gemplus Card International | Manufacturing process of a contactless card by overmoulding and contactless card obtained by such process |
EP0786357A1 (en) * | 1994-09-22 | 1997-07-30 | Rohm Co., Ltd. | Non-contact type ic card and method of manufacturing same |
JPH091970A (en) * | 1995-06-20 | 1997-01-07 | Hitachi Chem Co Ltd | Ic card and manufacture thereof |
WO1997026621A1 (en) * | 1996-01-17 | 1997-07-24 | Gemplus S.C.A. | Contactless electronic module for a card or label |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 095, no. 010 30 November 1995 (1995-11-30) * |
PATENT ABSTRACTS OF JAPAN vol. 097, no. 005 30 May 1997 (1997-05-30) * |
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001008091A1 (en) * | 1999-07-23 | 2001-02-01 | Gemplus | Electronic label and method for making same |
FR2796760A1 (en) * | 1999-07-23 | 2001-01-26 | Gemplus Card Int | Production of electronic tag for identification and tracking of objects involves attachment of large-area, thin integrated circuit to substrate and attaching communications antenna to contact pads |
US8976069B2 (en) | 1999-09-20 | 2015-03-10 | Fractus, S.A. | Multilevel antennae |
US9761934B2 (en) | 1999-09-20 | 2017-09-12 | Fractus, S.A. | Multilevel antennae |
US9362617B2 (en) | 1999-09-20 | 2016-06-07 | Fractus, S.A. | Multilevel antennae |
US9240632B2 (en) | 1999-09-20 | 2016-01-19 | Fractus, S.A. | Multilevel antennae |
US9054421B2 (en) | 1999-09-20 | 2015-06-09 | Fractus, S.A. | Multilevel antennae |
US10056682B2 (en) | 1999-09-20 | 2018-08-21 | Fractus, S.A. | Multilevel antennae |
US9000985B2 (en) | 1999-09-20 | 2015-04-07 | Fractus, S.A. | Multilevel antennae |
US8941541B2 (en) | 1999-09-20 | 2015-01-27 | Fractus, S.A. | Multilevel antennae |
WO2002056245A2 (en) * | 2000-12-01 | 2002-07-18 | Microchip Technology Incorporated | Radio frequency identification tag on a single layer substrate |
WO2002056245A3 (en) * | 2000-12-01 | 2003-02-20 | Microchip Tech Inc | Radio frequency identification tag on a single layer substrate |
US10644405B2 (en) | 2002-11-07 | 2020-05-05 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US9761948B2 (en) | 2002-11-07 | 2017-09-12 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10056691B2 (en) | 2002-11-07 | 2018-08-21 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US9077073B2 (en) | 2002-11-07 | 2015-07-07 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US7463199B2 (en) | 2002-11-07 | 2008-12-09 | Fractus, S.A. | Integrated circuit package including miniature antenna |
US10320079B2 (en) | 2002-11-07 | 2019-06-11 | Fractus, S.A. | Integrated circuit package including miniature antenna |
EP1562272A3 (en) * | 2004-01-14 | 2009-03-04 | Dehn + Söhne Gmbh + Co. Kg | Arrangement for checking and recording of the status of an overvoltage protection device, particularly for installation in low-voltage networks or information systems |
EP1562272A2 (en) * | 2004-01-14 | 2005-08-10 | Dehn + Söhne Gmbh + Co. Kg | Arrangement for checking and recording of the status of an overvoltage protection device, particularly for installation in low-voltage networks or information systems |
US8330259B2 (en) | 2004-07-23 | 2012-12-11 | Fractus, S.A. | Antenna in package with reduced electromagnetic interaction with on chip elements |
US7578053B2 (en) | 2004-12-03 | 2009-08-25 | Hallys Corporation | Interposer bonding device |
US8025086B2 (en) | 2005-04-06 | 2011-09-27 | Hallys Corporation | Electronic component manufacturing apparatus |
KR100746635B1 (en) | 2006-03-21 | 2007-08-06 | 삼성전기주식회사 | Tag of rfid system, and manufacturing method thereof |
TWI587475B (en) * | 2015-11-16 | 2017-06-11 | 台灣積體電路製造股份有限公司 | Integrated circuits |
US9818694B2 (en) | 2015-11-16 | 2017-11-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Active atomic reservoir for enhancing electromigration reliability in integrated circuits |
US9929087B2 (en) | 2015-11-16 | 2018-03-27 | Taiwan Semiconductor Manufacturing Co., Ltd | Enhancing integrated circuit density with active atomic reservoir |
US10312189B2 (en) | 2015-11-16 | 2019-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Enhancing integrated circuit density with active atomic reservoir |
US10950540B2 (en) | 2015-11-16 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Enhancing integrated circuit density with active atomic reservoir |
CN110010509A (en) * | 2018-01-05 | 2019-07-12 | 光宝新加坡有限公司 | Double lead frame magnetic coupling encapsulating structure and its manufacturing method |
CN110010509B (en) * | 2018-01-05 | 2023-10-20 | 光宝新加坡有限公司 | Double-lead-frame magnetic coupling packaging structure and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
KR20000075883A (en) | 2000-12-26 |
JP2001515661A (en) | 2001-09-18 |
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