FR2675930A1 - Contactless integrated circuit card - Google Patents
Contactless integrated circuit card Download PDFInfo
- Publication number
- FR2675930A1 FR2675930A1 FR9205107A FR9205107A FR2675930A1 FR 2675930 A1 FR2675930 A1 FR 2675930A1 FR 9205107 A FR9205107 A FR 9205107A FR 9205107 A FR9205107 A FR 9205107A FR 2675930 A1 FR2675930 A1 FR 2675930A1
- Authority
- FR
- France
- Prior art keywords
- wiring
- base
- integrated circuit
- circuit card
- obverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
Abstract
Description
La présente invention se rapporte généralement à des cartes à circuit intégré sans contact et, plus particulièrement, à une carte à circuit intégré sans contact où les câblages d'un circuit résonnant pour la transmission/réception d'ondes électriques sont prévus sur deux surfaces d'une base. The present invention generally relates to contactless integrated circuit cards and, more particularly, to a contactless integrated circuit card in which the cables of a resonant circuit for the transmission / reception of electrical waves are provided on two surfaces d 'a base.
Les figures 6 et 7 montrent la structure d'une carte à circuit intégré sans contact conventionnelle de cette sorte. Un circuit intégré 2 pour contrôler les fonctions de cette carte à circuit intégré, des pièces électroniques 3 comme des condensateurs et des résistances et une pile 4 servant de source d'énergie sont montés sur l'avers la d'une base 1. Des enroulements de câblage 5a et 5b, utilisés comme antenne pour la transmission ou la réception d'ondes électriques par rapport à une unité externe (non représentée), sont formés sur des portions périphériques de l'avers et du revers la et lb de la base 1. La base 1, le circuit intégré 2, les pièces électroniques 3, la pile 4 et les câblages 5a et 5b sont enfermés dans une matière plastique 6. Figures 6 and 7 show the structure of a conventional contactless integrated circuit card of this kind. An integrated circuit 2 for controlling the functions of this integrated circuit card, electronic parts 3 such as capacitors and resistors and a battery 4 serving as an energy source are mounted on the obverse of a base 1. Windings of wiring 5a and 5b, used as antenna for the transmission or reception of electric waves with respect to an external unit (not shown), are formed on peripheral portions of the obverse and of the reverse 1a and 1b of the base 1 The base 1, the integrated circuit 2, the electronic parts 3, the battery 4 and the cables 5a and 5b are enclosed in a plastic material 6.
Le câblage 5b sur le revers lb de la base 1 que l'on peut voir à la figure 8 et le câblage 5a sur l'avers la de la base 1 sont connectés par un trou 7 qui est formé dans la base 1 pour former un long enroulement. Comme le montre la figure 9, les conducteurs du câblage 5a sur l'avers la et du câblage 5b sur le revers lb sont formés dans des positions telles qu'ils soient superposés, avec la base interposée entre eux. En d'autres termes, des deux surfaces de la base 1, les portions sur lesquelles les conducteurs de câblage se trouvent et les portions sur lesquelles il n'y a pas de conducteur de câblage coïncident. The wiring 5b on the reverse lb of the base 1 which can be seen in FIG. 8 and the wiring 5a on the obverse la of the base 1 are connected by a hole 7 which is formed in the base 1 to form a long winding. As shown in FIG. 9, the conductors of the wiring 5a on the obverse la and of the wiring 5b on the reverse lb are formed in positions such that they are superimposed, with the base interposed between them. In other words, of the two surfaces of the base 1, the portions on which the wiring conductors are located and the portions on which there is no wiring conductor coincide.
Pour cette raison, dans une carte à circuit intégré sans contact conventionnelle, la résistance de la base 1 à la flexion varie largement selon les positions dans lesquelles se trouvent les câblages 5a et 5b et les positions où il n'y a pas les câblages 5a et 5b. La base 1 est renforcée des deux côtés aux positions où il y a les câblages 5a et 5b afin d'être suffisamment résistantes à la flexion. Aux positions où il n'y a pas les câblages, la base 1 est faible.Par exemple, si un effort de flexion est appliqué à une portion périphérique de la base, comme cela est indiqué par la flèche sur la figure 10, pour déformer la base 1 de manière que le revers lb ait une portion convexe, il y a une possibilité de formation d'une fissure 8 telle que celle montrée à la figure 11 entre des portions adjacentes du conducteur du câblage 5b sur le revers lb de la base 1. For this reason, in a conventional contactless integrated circuit card, the resistance of the base 1 to bending varies widely according to the positions in which the cables 5a and 5b are located and the positions where there are no cables 5a. and 5b. The base 1 is reinforced on both sides at the positions where there are the cables 5a and 5b in order to be sufficiently resistant to bending. In positions where there are no cables, base 1 is weak; for example, if a bending force is applied to a peripheral portion of the base, as indicated by the arrow in Figure 10, to deform the base 1 so that the reverse lb has a convex portion, there is a possibility of forming a crack 8 such as that shown in FIG. 11 between adjacent portions of the wiring conductor 5b on the reverse lb of the base 1.
Si une telle fissure 8 est formée dans la base 1, cela réduit considérablement la fiabilité de la carte à circuit intégré. If such a crack 8 is formed in the base 1, this considerably reduces the reliability of the integrated circuit card.
Etant donné le problème ci-dessus décrit, la présente invention a pour objet de procurer une carte à circuit intégré sans contact qui résiste à une effort de flexion et qui ait une meilleure fiabilité. Given the problem described above, the object of the present invention is to provide a contactless integrated circuit card which resists bending stress and which has better reliability.
Afin d'atteindre l'objectif ci-dessus, selon la présente invention, on prévoit une carte à circuit intégré sans contact comprenant une base, un circuit intégré monté sur la base et un premier câblage et un second câblage qui sont respectivement formés sur des portions périphériques de l'avers et du revers de la base et qui sont électriquement connectés à leurs extrémités pour former une bobine pour la transmission des ondes électriques entre la carte à circuit intégré et un circuit externe, les premier et second câblages étant agencés de manière que le schéma du second câblage soit formé en une position correspondant à l'espace libre du schéma du premier câblage. In order to achieve the above objective, according to the present invention, there is provided a contactless integrated circuit card comprising a base, an integrated circuit mounted on the base and a first wiring and a second wiring which are respectively formed on peripheral portions of the obverse and the underside of the base and which are electrically connected at their ends to form a coil for the transmission of electrical waves between the integrated circuit card and an external circuit, the first and second wiring being arranged so that the diagram of the second wiring is formed in a position corresponding to the free space of the diagram of the first wiring.
L'invention sera mieux comprise, et d'autres buts, caractéristiques, détails et avantages de celle-ci apparaltront plus clairement au cours de la description explicative qui va suivre faite en référence aux dessins schématiques annexés donnés uniquement à titre d'exemple illustrant un mode de réalisation de l'invention, et dans lesquels
- la figure 1 est une vue en plan d'une carte à circuit intégré sans contact selon un mode de réalisation de la présente invention, montrant ses portions internes par enlèvement du plastique supérieur
- la figure 2 est une vue en coupe transversale de la carte à circuit intégré montrée à la figure 1
- la figure 3 est un diagramme du câblage au revers de la base, selon un mode de réalisation de l'invention
- la figure 4 est un schéma agrandi d'une portion A montrée à la figure 2
- la figure 5 est une vue en coupe transversale de l'état dans lequel la base du présent mode de réalisation est déformée par un effort de flexion
- la figure 6 est une vue en plan d'une carte à circuit intégré sans contact conventionnelle, montrant ses portions internes du fait de l'enlèvement du couvercle supérieur en plastique
- la figure 7 est une vue en coupe transversale de la carte à circuit intégré montrée à la figure 6
- la figure 8 est un schéma du câblage du revers de la base de la carte à circuit intégré montrée à la figure 6
- la figure 9 est un schéma agrandi d'une portion B montrée à la figure Y
- la figure 10 est une vue en coupe transversale de l'état dans lequel la base de la carte à circuit intégré montrée sur la figure 6 est déformée par un effort de flexion ; et
- la figure 11 est une vue en coupe transversale de l'état dans lequel la base de la carte à circuit intégré montrée sur la figure 6 est fissurée.The invention will be better understood, and other objects, characteristics, details and advantages thereof will appear more clearly during the explanatory description which follows, made with reference to the appended schematic drawings given solely by way of example illustrating a embodiment of the invention, and in which
- Figure 1 is a plan view of a contactless integrated circuit card according to an embodiment of the present invention, showing its internal portions by removing the upper plastic
- Figure 2 is a cross-sectional view of the integrated circuit card shown in Figure 1
- Figure 3 is a wiring diagram on the back of the base, according to one embodiment of the invention
- Figure 4 is an enlarged diagram of a portion A shown in Figure 2
- Figure 5 is a cross-sectional view of the state in which the base of the present embodiment is deformed by a bending force
- Figure 6 is a plan view of a conventional contactless integrated circuit card, showing its internal portions due to the removal of the upper plastic cover
- Figure 7 is a cross-sectional view of the integrated circuit card shown in Figure 6
- Figure 8 is a wiring diagram of the underside of the base of the integrated circuit card shown in Figure 6
- Figure 9 is an enlarged diagram of a portion B shown in Figure Y
- Figure 10 is a cross-sectional view of the state in which the base of the integrated circuit card shown in Figure 6 is deformed by a bending force; and
- Figure 11 is a cross-sectional view of the state in which the base of the integrated circuit card shown in Figure 6 is cracked.
Un mode de réalisation de la présente invention sera décrit ci-dessous en se référant aux dessins joints. An embodiment of the present invention will be described below with reference to the accompanying drawings.
En se référant aux figures 1 et 2, une carte à circuit intégré sans contact selon un mode de réalisation de la présente a une base Il ayant un avers lla où sont montés un circuit intégré 12 pour contrôler les fonctions de cette carte, des pièces électroniques 13 comme des condensateurs et des résistances et une pile 14 servant de source d'énergie. Les enroulements des câblages 15a et 15b utilisés comme antenne pour la transmission ou la réception d'ondes électriques par rapport à une unité externe (non représentée) sont formés sur des portions périphériques de l'avers et du revers lla et llb de la base 11. La base 11, le circuit intégré 12, les pièces électroniques 13, la pile 14 et les câblages 15a et 15b sont enfermés dans un plastique 16. Referring to Figures 1 and 2, a contactless integrated circuit card according to an embodiment of the present has a base II having an obverse lla where an integrated circuit 12 is mounted to control the functions of this card, electronic parts 13 such as capacitors and resistors and a battery 14 serving as an energy source. The windings of the cabling 15a and 15b used as an antenna for the transmission or reception of electric waves with respect to an external unit (not shown) are formed on peripheral portions of the obverse and the reverse 11a and 11b of the base 11 The base 11, the integrated circuit 12, the electronic parts 13, the battery 14 and the cables 15a and 15b are enclosed in a plastic 16.
Le câblage 15b au revers llb de la base ll que l'on peut voir à la figure 3 et le câblage 15a à l'avers lla de la base 11 sont connectés via un trou 17 qui est formé dans la base 11 pour former une longue bobine. Les conducteurs des deux câblages 15a et 15b sont disposés dans des positions sur la base 11 qui sont décalées dans une direction le long des surfaces de la base 11. En d'autres termes, comme le montre la figure 4, chaque portion du conducteur du câblage 15b sur le revers llb est placée sur le revers llb entre deux portions adjacentes du conducteur du câblage 15a sur l'avers lla. Plus particulièrement, dans ce mode de réalisation, la largeur Wl du conducteur et l'espace W2 entre des portions adjacentes du conducteur de chaque câblage 15a et 15b sont généralement égales et les axes des intervalles entre des portions adjacentes du conducteur du câblage 15a sur l'avers ila et du conducteur du câblage 15b coïncident généralement. The wiring 15b on the reverse llb of the base ll that can be seen in Figure 3 and the wiring 15a on the obverse lla of the base 11 are connected via a hole 17 which is formed in the base 11 to form a long coil. The conductors of the two cables 15a and 15b are arranged in positions on the base 11 which are offset in a direction along the surfaces of the base 11. In other words, as shown in FIG. 4, each portion of the conductor of the wiring 15b on the reverse side llb is placed on the reverse side 11b between two adjacent portions of the wiring conductor 15a on the obverse side 11a. More particularly, in this embodiment, the width Wl of the conductor and the space W2 between adjacent portions of the conductor of each wiring 15a and 15b are generally equal and the axes of the intervals between adjacent portions of the conductor of the wiring 15a on l obverse ila and the conductor of the wiring 15b generally coincide.
Cet agencement garantit l'effet suivant. Si, par exemple, un effort de flexion est appliqué à une portion périphérique de la base ll comme cela est indiqué par la flèche sur la figure 5, la flexion des portions de la base 11 correspondant aux intervalles du câblage 15a sur l'avers lla de la base 11 est limitée par le câblage 15b sur le revers llb et la flexion des portions de la base 11 correspondant aux intervalles du câblage 15b sur le revers llb est également limitée par le câblage 15a sur l'avers lita. En effet, la portion périphérique de la base 1 est renforcée de manière appropriée par les câblages 15a et 15b, ce qui l'empêche de se fissurer. This arrangement guarantees the following effect. If, for example, a bending force is applied to a peripheral portion of the base ll as indicated by the arrow in FIG. 5, the bending of the portions of the base 11 corresponding to the wiring intervals 15a on the obverse lla of the base 11 is limited by the wiring 15b on the reverse llb and the bending of the portions of the base 11 corresponding to the intervals of the wiring 15b on the reverse llb is also limited by the wiring 15a on the obverse lita. Indeed, the peripheral portion of the base 1 is appropriately reinforced by the cables 15a and 15b, which prevents it from cracking.
Dans le mode de réalisation ci-dessus décrit, comme la largeur W1 du conducteur de chaque câblage 15a ou 15b et l'intervalle W2 entre des portions adjacentes du conducteur sont généralement égaux, les schémas des câblages 15a et 15b sur l'avers et le revers de la base 11 sont disposés de façon à n'avoir sensiblement pas de portions se recouvrant. Cependant, la présente invention n'est pas limitée à cet agencement. Par exemple, dans le cas où la largeur du conducteur du câblage est plus grande qu'un intervalle, on peut obtenir un effet suffisant, même en disposant les schemas de câblage à l'avers et au revers pour qu'il y ait un peu de décalage des positions l'un par rapport à l'autre. In the embodiment described above, as the width W1 of the conductor of each wiring 15a or 15b and the interval W2 between adjacent portions of the conductor are generally equal, the diagrams of the wiring 15a and 15b on the obverse and the reverse of the base 11 are arranged so as to have substantially no overlapping portions. However, the present invention is not limited to this arrangement. For example, in the case where the width of the wiring conductor is greater than an interval, one can obtain a sufficient effect, even by arranging the wiring diagrams on the obverse and reverse so that there is a little offset positions relative to each other.
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095189A JPH04325293A (en) | 1991-04-25 | 1991-04-25 | Non-contact ic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2675930A1 true FR2675930A1 (en) | 1992-10-30 |
| FR2675930B1 FR2675930B1 (en) | 1993-12-17 |
Family
ID=14130810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9205107A Expired - Fee Related FR2675930B1 (en) | 1991-04-25 | 1992-04-24 | CONTACTLESS INTEGRATED CIRCUIT CARD. |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH04325293A (en) |
| FR (1) | FR2675930B1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0769759A2 (en) * | 1995-10-19 | 1997-04-23 | Junghans Uhren Gmbh | Contactless chip card |
| NL1001684C2 (en) * | 1995-11-17 | 1997-05-21 | Ronald Barend Van Santbrink | Chip card for identity and payment purposes, cheaply produced |
| EP0855674A2 (en) * | 1997-01-28 | 1998-07-29 | Hitachi, Ltd. | Contactless IC card |
| WO1999035691A1 (en) * | 1998-01-09 | 1999-07-15 | Microchip Technology Incorporated | An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor |
| EP1128326A2 (en) * | 2000-02-24 | 2001-08-29 | The Goodyear Tire & Rubber Company | Circuit module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62134780A (en) * | 1985-12-09 | 1987-06-17 | Hitachi Ltd | Non-contact ic card |
| FR2610754A1 (en) * | 1987-02-06 | 1988-08-12 | Toshiba Kk | DATA EXCHANGE TRANSDUCER FOR INTEGRATED CIRCUIT BOARD |
-
1991
- 1991-04-25 JP JP3095189A patent/JPH04325293A/en active Pending
-
1992
- 1992-04-24 FR FR9205107A patent/FR2675930B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62134780A (en) * | 1985-12-09 | 1987-06-17 | Hitachi Ltd | Non-contact ic card |
| FR2610754A1 (en) * | 1987-02-06 | 1988-08-12 | Toshiba Kk | DATA EXCHANGE TRANSDUCER FOR INTEGRATED CIRCUIT BOARD |
Non-Patent Citations (2)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 11, no. 358 (P-639)21 Novembre 1987 & JP-A-62 134 780 ( HITACHI LTD ) 17 Juin 1987 * |
| PATENT ABSTRACTS OF JAPAN vol. 14, no. 450 (M-1030)27 Septembre 1990 & JP-A-21 79 794 ( SONY CORP ) 12 Juillet 1990 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0769759A2 (en) * | 1995-10-19 | 1997-04-23 | Junghans Uhren Gmbh | Contactless chip card |
| EP0769759A3 (en) * | 1995-10-19 | 1998-09-23 | Junghans Uhren Gmbh | Contactless chip card |
| NL1001684C2 (en) * | 1995-11-17 | 1997-05-21 | Ronald Barend Van Santbrink | Chip card for identity and payment purposes, cheaply produced |
| EP0855674A2 (en) * | 1997-01-28 | 1998-07-29 | Hitachi, Ltd. | Contactless IC card |
| EP0855674A3 (en) * | 1997-01-28 | 2005-08-31 | Hitachi, Ltd. | Contactless IC card |
| WO1999035691A1 (en) * | 1998-01-09 | 1999-07-15 | Microchip Technology Incorporated | An integrated circuit (ic) package including accompanying ic chip and coil and a method of production therefor |
| EP1128326A2 (en) * | 2000-02-24 | 2001-08-29 | The Goodyear Tire & Rubber Company | Circuit module |
| EP1128326A3 (en) * | 2000-02-24 | 2001-10-10 | The Goodyear Tire & Rubber Company | Circuit module |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2675930B1 (en) | 1993-12-17 |
| JPH04325293A (en) | 1992-11-13 |
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