WO1999031948A1 - A component placement system - Google Patents

A component placement system Download PDF

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Publication number
WO1999031948A1
WO1999031948A1 PCT/IE1998/000109 IE9800109W WO9931948A1 WO 1999031948 A1 WO1999031948 A1 WO 1999031948A1 IE 9800109 W IE9800109 W IE 9800109W WO 9931948 A1 WO9931948 A1 WO 9931948A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
head
camera
controller
heads
Prior art date
Application number
PCT/IE1998/000109
Other languages
English (en)
French (fr)
Inventor
Joseph O'keefe
Kevin Keane
William Diggan
James O'kelly
John O'halloran
Original Assignee
Pentus Research Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pentus Research Limited filed Critical Pentus Research Limited
Priority to AU16807/99A priority Critical patent/AU1680799A/en
Priority to EP98961339A priority patent/EP1040740A1/en
Priority to JP2000539691A priority patent/JP2002509366A/ja
Publication of WO1999031948A1 publication Critical patent/WO1999031948A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0478Simultaneously mounting of different components

Definitions

  • the invention relates to a system for placing components in an automated production process.
  • An example is placement of electronic components in a surface mount technology (SMT) process.
  • SMT surface mount technology
  • the invention is directed towards providing a component placement system which operates more efficiently than as heretofore been the case. Another object is that the system provides greater versatility by virtue of being capable of handling a wider range of different component feeding and placement configurations.
  • Another object is to achieve improved accuracy.
  • a component placement system comprising a component feeder, a component-carrying head, a drive means for moving the head between picking and placing positions, and a controller comprising means for controlling component picking and placing by the head, characterised in that, the system comprises a plurality of feeders, a plurality of independent heads, and the controller comprises means for controlling the drive means and the heads to simultaneously pick a plurality of components .
  • the system may adapt to picking according to a variety of picking configurations in a versatile manner. For example, there may be a bank of feeders and a different subset of the bank is required for each successive batch. Because the heads are independent, there may be simultaneous picking from different subsets of the bank of feeders.
  • the drive means comprises means for moving at least two heads with respect to each other in a two-dimensional plane, and for controlling simultaneous placement of at least two components at different locations in the two- dimensional plane.
  • the drive means comprises a gantry system having a beam on which the heads are mounted at a carriage.
  • the gantry system comprises means for causing both translational and rotational motion of the beam whereby heads move with respect to each other in a two-dimensional plane.
  • the gantry system comprises means for moving a head independently in a direction different to that of the axis of the gantry beam.
  • the drive means comprises a linear motor mounted to cause movement of a head with respect to a caniage on the gantry beam.
  • the gantry beam comprises at least two drive rails, and wherein caniages of alternate heads are on different rails so that the carriages can overlap in the direction of the beam axis to provide additional freedom of movement.
  • the drive rails are linear motor magnetic rails
  • the beam comprises a common encoding strip for all heads on a beam.
  • the system comprises an inspection system having a camera and associated controller, a camera drive means for moving the camera to track a head for component inspection as the component is being conveyed to a placement position, and an image processor.
  • the camera and the head are mounted on a common gantry beam.
  • the camera is mounted on the opposite side of the gantry beam to the head, and the inspection system further comprises a light guide to provide an optical path from a component to the camera underneath the beam.
  • the light guide comprises a beam splitter mounted to allow the camera view a component on the head, or below the head on a substrate.
  • the inspection system further comprises a proximity sensor to detect the head and the camera controller comprises means for triggering an image grab when the head is detected.
  • system further comprising a mapping means comprising:-
  • controller comprises:-
  • the inspection system comprises a plurality of light sources directed to impinge light on a component for component inspection, wherein the light sources generate light of different wavelengths, one of which is reflected by the head surface and the other of which is not reflected by the surface to provide either backlight or front-light illumination inspection by selection of a light source.
  • the surface may have a colour other than red, one light source emits infra red light which is reflected, and another light source emits red light which is not reflected.
  • the inspection system comprises means for inspecting component local fiducials to determine location and orientation of components after placement.
  • the image processor comprises means for providing a captured image as a background and for superimposing representations of components to emulate an actual image of components on a substrate.
  • the controller comprises means for sensing position of components ready to be picked and for controlling an adjustment means to adjust the component positions before picking to improve picking accuracy.
  • the camera may be used to sense the component positions.
  • each feeder comprises means for detecting its physical position in the system and for signalling position information to the system controller.
  • the location identification means comprises means for detecting a voltage level on a voltage ladder extending across the feeders.
  • the controller comprises means for sensing pressure in a component nozzle and placement force in real time to provide control for picking and placing.
  • the heads are electrically connected to the controller by cables which slide on overhead caniages to avoid cable strain.
  • a group of cables is bundled in a sleeve having an elongate fastener to allow opening and closing of the sleeve.
  • the system is an electronic component placement system. 99/31948
  • the system comprises a bank of component feeders on each transverse side of a substrate conveying direction
  • the gantry system comprises a beam associated with each feeder whereby the system is substantially symmetrical about the substrate conveying direction.
  • the controller comprises means for directing heads of one beam to pick at the same time as heads of the other beam are placing.
  • the invention provides a component placement system comprising a component feeder, a component-carrying head, a drive means for moving the head between picking and place positions, and a controller comprising means for controlling component picking and placing by the head, wherein the system further comprises an inspection system having a camera and associated controller, a camera drive means for moving the camera to track a head for component inspection as the component is being conveyed to a placement position, and an image processor.
  • the camera and the head are mounted on a common gantry beam.
  • the camera is mounted on the opposite side of the gantry beam to the head, and the inspection system further comprises a light guide to provide an optical path from a component to the camera underneath the beam.
  • the light guide comprises a beam splitter mounted to allow the camera view a component on the head, or below the head on a substrate.
  • the inspection system comprises a plurality of light sources directed to impinge light on a component for component inspection, wherein the light sources generate light of different wavelengths, one of which is reflected by the head surface and the other of which is not reflected by the surface to provide either backlight or frondight inspection by selection of a light source.
  • the head has a surface with a colour other than red, one light source emits infra red light which is reflected for backlight component illumination, and another light source emits red light which is not reflected for frondight component illumination.
  • the invention provides a component placement system comprising a component feeder, a component-carrying head, a drive means for moving the head between picking and place positions, and a controller comprising means for controlling component picking and placing by the head and an image processor, wherein the image processor comprises means for providing a captured image as a background and for superimposing representations of components to emulate an actual image of components on a substrate.
  • the invention provides a component placement system comprising a plurality of component feeders, a component-carrying head, a drive means for moving the head between picking and place positions, and a controller comprising means for controlling component picking and placing by the head, wherein each feeder comprises means for detecting its physical position in the system and for signalling position information to the system controller.
  • the detecting means comprises means for detecting position on a voltage ladder extending across the feeders.
  • Fig. 1 is a front view of a component placement system of the invention
  • Fig. 2 is a side view of the system
  • Fig. 3 is a perspective view showing a gantry system of the placement system
  • Fig. 4 is a perspective view showing parts of heads to illustrate the manner in which they are connected to a gantry beam;
  • Fig. 5 is a diagrammatic front view showing movement of a pair of heads illustrating their freedom of movement
  • Fig. 6 is a plan view of the gantry system
  • Fig 7 is a diagrammatic cross-sectional side view of a beam showing the manner in which a camera is connected to the gantry beam for on-the-fly component inspection;
  • Fig. 8 shows an underneath perspective and underneath plan views of a head nozzle
  • Fig. 9 is a diagrammatic view showing frondight illumination of a component
  • Fig. 10 is a diagrammatic view showing backlight illumination
  • Fig. 11 is a perspective view of a component feeder
  • Fig 12 is a diagrammatic side view showing component feed micro adjustment
  • Fig. 13 is a more detailed perspective view showing a micro adjustment mechanism
  • Fig. 14 is a detailed plan view showing a beam coupler to allow rotational and sliding motions of the gantry beam
  • Figs. 15 and 16 are diagrammatic plan views showing two dimensional placement
  • Fig. 17 is a diagrammatic plan view showing component position inspection.
  • Fig 18 is a representation of a PCB showing components for enhanced reality.
  • a component placement system 1 As is clear from Fig. 1, the system 1 is generally symmetrical about a longitudinal conveying path (through the plane of the page) for substrates onto which components are placed by the system 1. In this embodiment, the system 1 is for placing surface mount components on a printed circuit board.
  • the system 1 comprises a frame 2 which is generally symmetrical about the conveying direction.
  • the path for printed circuit boards is indicated generally by the numeral 3 and it comprises a conveyor controlled to convey a circuit board into the system 1 , leave it stationary for a required time period, and to subsequently move it to a solder reflow oven.
  • the system 1 operates to place the components on the board, and to perform limited in-line quality control.
  • the frame 2 supports a base table 4 mounted over a system controller 5 comprising rack-mounted circuits.
  • the controller 5 has a display terminal 6.
  • a drive means for moving the component- carrying heads comprises a gantry system 7 having a pair of fixed rails 8 extending perpendicular to the conveying direction of the circuits, refened to in this specification as the Y direction.
  • Each of the fixed rails 8 comprises a linear motor track 9 on which runs two linear motor carnages each connected by a coupling 11 to a gantry beam 12.
  • the coupling 11 allows rotational and also transverse movement of a pivot axis between it and d e beam. This is to allow the beam to be skewed so that heads may move in a two-dimensional plane formed by the X direction (direction of the beam) and the Y dire ⁇ ion (direction of the fixed rails) with respect to each other.
  • die system controller 5 controls heads on one beam to pick components while simultaneously controlling heads on the other beam to place components to achieve a high efficiency.
  • the heads are indicated by the numeral 15, and each comprises a nozzle 16 which comprises a vacuum conduit for picking and placing a component.
  • Each head 15 also comprises a base 17 and a casing 18 which contains circuits for decoding controller signals.
  • Each head 15 is driven by a linear motor 19 running on a linear motor track 20 on the beam 12.
  • the head 15 runs on a pair of linear bearings 21 engaging rails 22. Signals from the controller 5 control the motor 19, and an encoder head 23 running on an encoding strip 24 feeds back positional information to the controller to complete a position control loop.
  • Each beam 12 comprises a pair of parallel linear motor tracks 20, one above the other.
  • alternate heads 15 have motors 19 on different tracks. This allows the motors 19 to overlap as shown in Fig. 5 so that there is a greater degree of freedom of movement of each head and the minimum pitch for heads is much smaller than would otherwise be the case.
  • an encoding head 23 of each head engages a common encoding strip 24 for the beam. This allows relatively simple control signalling anangements to be used despite the fact that there are two motor tracks.
  • the heads 15 are connected to the controller 5 by cable looms 28.
  • the looms 28 are connected to carriages 29 which run on overhead rails to avoid cable strain.
  • Each bundle of cables is held together by a sleeve which has a zip fastener extending along its length to allow easy opening and closing for addition, replacement, or repair of cables.
  • the system 1 also comprises an inspection system comprising a camera 30 mounted on each beam 12, a light guide 31 for directing light to the camera via an optical path and an image processor connected to the system controller for processing images captured by the camera 30.
  • the light guide 31 comprises a head minor 32 at an angle of 45° to horizontal, a camera minor 32 also at an angle of 45° a to horizontal, and a beam splitter 34 between the head and camera minors.
  • the head mirror 33 is located underneath the line of movement of the nozzles 16 on the same beam.
  • the camera 30 is mounted on a pair of linear bearings 21, one of which is underneath the beam 12. It is driven by a linear motor 19 in a manner similar to the heads 15.
  • the controller drive the camera to pass the minor 32 under selected heads for inspection of various components according to an inspection strategy.
  • the beam splitter 34 also allows the camera to inspect components underneath the optical path such as on the substrate. This provides excellent versatility.
  • the optical path includes two light sources to illuminate the nozzle during inspection.
  • Each nozzle 16 comprises a planar disc-shaped base 36 above a suction conduit 37.
  • the base 36 has an absorbent green coating, which reflects infrared light, but not red light.
  • the light guide comprises a pair of IR sources 39 on splayed sides of the guide 31 on each side of the head minor 32. It also comprises a pair of red light sources 40 located on each side of the optical path to direct red light at a component via the minor 32.
  • the guide 31 also comprises a white light source 41 for the beam splitter 34.
  • Fig. 9 shows frondight illumination
  • Fig. 10 shows backlight illumination for a component 42.
  • Image grabs by the camera 30 are triggered by a proximity sensor 43 mounted on the camera 30 to detect a protruding tongue 44 of the target head.
  • the sensor is connected to die camera and light controller, to cause the camera to capture an image. This is a very simple anangement for triggering image grabs as it avoids the need for using computational resources.
  • the image grab occurs as the camera and the head move relative to each other.
  • components are fed by tape feeders 45, each of which supplies components from reels 46 by virtue of feeding mechanisms 47.
  • the system controller is programmed to perform fine adjustment within a step range to adjust the position of a component before picking.
  • the camera 30 detects position of components in the feeding mechanisms 47 before picking and in response the controller controls the adjustment mechanism to ensure that all components are in a conect position. This provides for faster picking and it also helps to ensure that the position of the component with respect to the nozzle is more predictable. Another major advantage is that very small components (in the region of 0.5 x 0.25 mm to 2.0 x 2.0 mm) may be accurately picked. Placement quality is also improved for the larger components.
  • feeders 45 include electrical contacts which engage with a resistor ladder when in position at the system 1.
  • a controller in the feeder 45 monitors the voltage level of the contact and transmits a signal to the system controller 5 indicating its position in response to the sensed voltage.
  • Each feeder position has a unique voltage level on the resistor ladder and this allows automatic notification of the position of each feeder. This is very important for control purposes.
  • the voltage detectors are at the front of the feeding mechanisms 47.
  • the system 1 set-up is changed by the heads 15 automatically picking a desired nozzle 16 from a rack 50 mounted alongside the conveyor path 3. This is achieved by simply moving a nozzle coupler downwardly until it snap-fits with the desired nozzle 16 at a groove 38. The location of the nozzles is shown most clearly in Figs. 6, 15, and 16. This can be performed in a single efficient cycle by bringing a beam into line over a rack 50.
  • Figs. 14, 15, and 16 illustrate the manner in which the heads 15 may simultaneously pick up to six components at one time from the selected feeding mechanisms 47. Also, simultaneous placement is achieved by virtue of skewing the beam 12 as shown in Figs. 15 and 16.
  • the coupler 11 between the beam 12 and the fixed rail allows rotation and sliding of the beam with respect to the rail so that the heads may move with respect to each other in the X direction (axis of the beam) and in the Y direction perpendicular to this.
  • Rotary motors on the heads rotate the nozzles to orientate the components correctly if the beam has been skewed. This is important as it compensates for the effect of skewing and achieves conect alignment of the components on the substrate. It will be appreciated that by skewing the beam 12 as shown in Figs. 15 or 16, the invention achieves not only simultaneous picking, but also simultaneous placement of two or more components.
  • Two-dimensional relative movement may be achieved also by each head being mounted on a ca iage via an individual drive to provide movement in a direction having a Y component .
  • This drive is controlled to provide the individual head additional movement direction.
  • Such an anangement may be instead of or in addition to skewing of the beam to achieve multiple simultaneous placement.
  • the drive may be a linear motor drive .
  • the head comprises only the nozzle 16 and associated connectors and moves relative to a casing much like the casing 22.
  • the beam may comprise two spaced-apart parallel rails, and the drive is connected between them and moves on carriages on the rails. The head is mounted on the drive,
  • the degree of movement required for this direction is under 30mm.
  • additional programming is required to control the head movement although the nature of the control is similar i.e. motor actuation and encoding feedback forming a position control loop.
  • the system is capable of automatically mapping the placement workspace. It does this by means of a laser source which is mounted to direct a collimated beam in a linear direction across the workspace.
  • a 45° minor is mounted below the camera 30.
  • the controller moves the camera 30 in the linear direction so that the camera should continuously see a spot. Deviations in position of this spot are monitored by the controller and are used to map the workspace. These deviations arise from mechanical inconsistencies in the bearings, in the beam, and general alignment.
  • a target may be used. The target being viewed by the camera.
  • the controller performs quality control automatically by moving the camera 30 to selected component positions after placement and taking an image which contains both the component and substrate local fiducials in the same field of view.
  • the controller then computes X, Y and orientation offsets with respect to the reference position.
  • the diagram of Fig. 17 shows a component 60, local fiducials 61, and a reference position 62 for the component. With this deviation data, the controller calculates statistical parameters, including d e standard deviation and CPK in each direction for the full system and for each head 15.
  • Another aspect of the system is that it generates enhanced reality images of a complete PCB resembling images actually captured. This allows the user to check the product, the component locations, component value marks, and polarity marks without producing the product. It also allows the user to perform random checks of manufactured product without stopping the system as the images are generated off line.
  • a method is provided to check the component orientation and location. This enables the programmer to determine if the program data is conect As the program is being generated.
  • An image of a PCB is obtained such as by the camera 30 taking images and the controller consolidating them or by scanning. The image is sized and is used as a background for the programming environment.
  • As component data is entered, an icon representing the component is superimposed over the image at the programmed location and orientation.
  • An example 70 is shown in Fig. 18.
  • the system may capture actual images of components from the feeders or elsewhere and use these instead of representations.
  • the final image generated is of the PCB with images of the programmed components at the desired locations, orientations, polarities, values and so may be used to check a prototype before starting production, or to check that the production is still producing product according to the master document.
  • controller 5 monitors nozzle vacuum pressure for holding a component and the linear motor drive current for moving the nozzle down for placement to achieve improved placement control in real time.
  • the process is as follows:-
  • the controller 5 also performs a control method for ensuring accurate picking of a component from a feeder using real time measurement of the placement force and the vacuum at the nozzle tip. This is as follows :-
  • the system therefore achieves much improved placement as it is independent of component type, its variations from specification, substrate levelling and warping.
  • the conect vacuum levels per component are reached before proceeding to the next step.
  • the system also achieves much improved picking as it accommodates variations in feeder position, height, tape position and in the tape. It also ensures that the conect vacuum levels per component are reached before proceeding to the next step.
  • the invention is not limited to the embodiments described, but may be varied in construction and detail within the scope of the claims. For example, it may have only one head per beam at the expense of not providing simultaneous picking or placing. However, the benefits of on-the-fly inspection, backlight/ frondight illumination switching, feeder position detection, and enhanced reality image processing are still achieved.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/IE1998/000109 1997-12-18 1998-12-18 A component placement system WO1999031948A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU16807/99A AU1680799A (en) 1997-12-18 1998-12-18 A component placement system
EP98961339A EP1040740A1 (en) 1997-12-18 1998-12-18 A component placement system
JP2000539691A JP2002509366A (ja) 1997-12-18 1998-12-18 部品配置システム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IES970896 1997-12-18
IES970898 1997-12-18
IE970896 1997-12-18
IE970898 1997-12-18

Publications (1)

Publication Number Publication Date
WO1999031948A1 true WO1999031948A1 (en) 1999-06-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IE1998/000109 WO1999031948A1 (en) 1997-12-18 1998-12-18 A component placement system

Country Status (4)

Country Link
EP (1) EP1040740A1 (ja)
JP (1) JP2002509366A (ja)
AU (1) AU1680799A (ja)
WO (1) WO1999031948A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1227711A1 (en) * 1999-09-27 2002-07-31 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1330152A2 (de) * 2002-01-22 2003-07-23 Siemens Aktiengesellschaft Bestückkopf und Bestückverfahren zum Bestücken von Substraten mit Bauelementen
WO2010024679A1 (en) * 2008-09-01 2010-03-04 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Pick/place head assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050056215A1 (en) * 2003-03-11 2005-03-17 Shibaura Mechantronics Corporation Apparatus for applying paste and method of applying paste

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US5323528A (en) * 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH06216583A (ja) * 1993-01-20 1994-08-05 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JPH09181492A (ja) * 1997-01-27 1997-07-11 Yamaha Motor Co Ltd チップ部品装着装置
JPH09275299A (ja) * 1996-04-05 1997-10-21 Matsushita Electric Ind Co Ltd 電子部品装着装置

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JPH06216583A (ja) * 1993-01-20 1994-08-05 Matsushita Electric Ind Co Ltd 電子部品の実装方法
US5323528A (en) * 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
JPH09275299A (ja) * 1996-04-05 1997-10-21 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH09181492A (ja) * 1997-01-27 1997-07-11 Yamaha Motor Co Ltd チップ部品装着装置

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PATENT ABSTRACTS OF JAPAN vol. 98, no. 2 30 January 1998 (1998-01-30) *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1227711A1 (en) * 1999-09-27 2002-07-31 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1227711A4 (en) * 1999-09-27 2004-09-01 Matsushita Electric Ind Co Ltd COMPONENT ASSEMBLY METHOD AND DEVICE
US6842974B1 (en) 1999-09-27 2005-01-18 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1816906A1 (en) * 1999-09-27 2007-08-08 Matsushita Electric Industrial Co., Ltd. Component mounting method and component mounting apparatus
EP1330152A2 (de) * 2002-01-22 2003-07-23 Siemens Aktiengesellschaft Bestückkopf und Bestückverfahren zum Bestücken von Substraten mit Bauelementen
DE10202290A1 (de) * 2002-01-22 2003-07-31 Siemens Ag Bestückkopf und Bestückverfahren zum Bestücken von Substraten mit Bauelementen
EP1330152A3 (de) * 2002-01-22 2005-02-16 Siemens Aktiengesellschaft Bestückkopf und Bestückverfahren zum Bestücken von Substraten mit Bauelementen
WO2010024679A1 (en) * 2008-09-01 2010-03-04 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Pick/place head assembly

Also Published As

Publication number Publication date
JP2002509366A (ja) 2002-03-26
AU1680799A (en) 1999-07-05
EP1040740A1 (en) 2000-10-04

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