Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
  • C09K3/1012—Sulfur-containing polymers, e.g. polysulfides
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/04—Non-macromolecular organic compounds
  • C09K2200/0441—Carboxylic acids, salts, anhydrides or esters thereof
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
  • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09K2200/0617—Polyalkenes
  • C09K2200/062—Polyethylene
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
  • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09K2200/0622—Polyvinylalcohols, polyvinylacetates
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
  • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09K2200/0625—Polyacrylic esters or derivatives thereof
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
  • C09K2200/0615—Macromolecular organic compounds, e.g. prepolymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
  • C09K2200/0635—Halogen-containing polymers, e.g. PVC
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
  • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
  • C09K2200/0687—Natural resins, e.g. rosin

Definitions

• the invention relates to a process for elastifying and extending polymers with EVA copolymers, PVC or PVC copolymers in gel form and the use of compositions prepared in this way.
• Molding compounds or joint sealing compounds based on mixtures of acrylate copolymer dispersions with fillers, pigments and plasticizers have only a limited degree of elastic properties. the stickiness of the molding compositions produced from these mixtures increases with increasing proportion of plasticizers.
• Such molding compounds or joint sealing compounds are only suitable for a total deformation of approx. 10%, so that, despite their favorable price, they are not suitable for sealing numerous joints in building construction.
• Moisture-curing one-component molding and sealing compounds based on so-called MS polymers are also known. These sealing compounds contain, as prepolymers, the aforementioned MS polymers, which can be crosslinked by atmospheric moisture and which are compounds having silyl end groups with at least one hydrolyzable substituent on the silicon atom. Such prepolymers and molding and sealing compounds produced therefrom are known from DE-A-40 19 074 and DE-A-38 16 808. In the latter document, molding and sealing compounds produced from these MS polymers are described in detail under Described with reference to other publications. Reference is hereby made in full to the disclosure of the two aforementioned documents.
• Molding and sealing compounds based on MS polymers react to the ingress of moisture from the air into elastomers, the surface very often showing considerable stickiness. Therefore, the use of such masses is not possible wherever dust contamination occurs or is to be feared.
• the invention was therefore based on the object of reducing this surface stickiness of molding and sealing compounds in such a way that, upon contact with different types of dust, contamination with a permanent character is excluded.
• the solution to this problem according to the invention can be found in the patent claims. It consists essentially in the fact that the above-mentioned molding and sealing compositions are a gel based on an ethylene-vinyl acetate copolymer (EVA), a polyvinyl chloride homopolymer (PVC) or a vinyl chloride / vinyl acetate copolymer (PVC copolymer) and a plasticizer and Wax is added.
• EVA ethylene-vinyl acetate copolymer
• PVC polyvinyl chloride homopolymer
• PVC copolymer vinyl chloride / vinyl acetate copolymer
• JP 07197010 A / 95 describes a two-component sealant composition consisting of a component containing isocyanate groups and a low-molecular hydroxyl-functional acrylate copolymer which contains vinyl acetate as a comonomer. This sealant has little stickiness on the surface.
• Use of an ethylene vinyl acetate gel is not disclosed.
• JP-A-87/64881 describes a non-tacky contact adhesive containing a thermoplastic resin and a plasticizer, where the thermoplastic resin can be an ethylene-vinyl acetate copolymer, among others.
• EP-A-295 727 describes latices from interpolymers of vinyl acetate. Ethvlen and a vinyl ester of a tertiary aliphatic carboxylic acid in which the carboxylic acid component contains 9 carbon atoms. These films are characterized by low stickiness.
• a method for the elasticization and extension of polymer compositions from the group of acrylate copolymer dispersions, reactive polyurethane polymers, MS polymers, polysulfides or silicone rubbers by adding EVA gels is not mentioned in any of the aforementioned documents.
• a gel is first made from EVA, PVC or PVC copolymer, plasticizer and wax and, if appropriate, benzoyl chloride or additive TI (manufacturer Bayer).
• EVA EVA
• PVC or PVC copolymer and wax added with stirring.
• This mixture is then heated to about 125 ° C. with stirring and continued to be stirred until a clear, homogeneous solution is obtained. Then stirring is continued for 30 minutes at this temperature. Subsequently, 0.1% by weight of benzoyl chloride or additive TI are added.
• this gel is filled into an airtight container, after which the intermediate product is cooled to room temperature.
• the gel produced in this way is then mixed with the other constituents of the molding or sealing compound in a planetary dissolver Homogeneity mixed.
• These constituents of the molding and sealing compounds usually contain polymer compositions selected from the group of MS polymers (Kaneka) or acrylate copolymer dispersions. however, polyurethane polymers can also be used. Polysulfide polymers or silicone rubbers can be used. Suitable MS polymers are described in DE-A-40 19 074 and in DE-A-38 16 808 with reference to other publications. Reference is hereby made in full to the disclosure of the latter two publications.
• the molding and sealing compounds also contain inorganic fillers such as carbon black, calcium carbonate and pigments such as titanium dioxide and the like, and plasticizers, in particular phthalic acid esters such as diisononyl phthalate or alkyl sulfonic acid esters of phenol such as Mesamoll (Bayer) or phosphoric acid esters such as tricresyl phosphate.
• the masses can contain conventional UV stabilizers and anti-aging agents as well as organofunctional silanes such as.
• the moisture-reactive one-component compositions contain organometallic tin compounds to accelerate the hardening and moisture scavengers such as carboxylic acid chlorides, for example benzoyl chloride or the additive TI (Bayer).
• organometallic tin compounds to accelerate the hardening and moisture scavengers such as carboxylic acid chlorides, for example benzoyl chloride or the additive TI (Bayer).
• the molding and sealing compounds based on MS polymers show a considerable reduction in the surface tack when using the gels according to the invention; this tack decreases with an increasing proportion of EVA copolymers, PVC or PVC copolymers despite the associated high proportion of plasticizer.
• a significant Economic advantage achieved because up to 45% of the original MS polymer content can be substituted by the cheaper gel.
• molding compounds based on acrylate copolymer dispersions with EVA, PVC or PVC copolymer gels are significantly cheaper, with the other properties such as modulus of elasticity, Total deformation and aging resistance are comparable.
• EVA gel was produced from 77 parts of Mesamoll, 12 parts of EVA polymer (vinyl acetate content 40%) and 11 parts of micro wax.
• EVA polymer vinyl acetate content 40%
• micro wax 11 parts of micro wax.
• the entire plasticizer was placed in a stirred kettle, after which EVA polymer and wax were added with stirring.
• the mixture was then heated to about 125 ° C. and stirred until a clear, homogeneous solution was achieved. This temperature was then maintained for 30 minutes and stirring continued. Finally 0.1% by weight of additive TI was added and the mixture was poured into an airtight container and allowed to cool to room temperature.
• the commercially available sealant Terostat 930 (total content of MS polymers and plasticizers 42.25% by weight) was modified with the EVA gel described above in such a way that the polymer content of MS polymers was proportional to the EVA gel according to the invention by 5% by weight, 10% by weight and 15% by weight, respectively.
• Comparative tests 2 and 3 were carried out to check the possible effects of the wax in the EVA gel.
• a wax mixture consisting of 23 parts of wax and 77 parts of Mesamoll was used instead of the EVA gel; in comparative experiment 3, the EVA gel was replaced by an additional plasticizer portion of 10 parts. In both cases, considerable surface stickiness is observed according to the ball test.
• Example 2 Analogously to Example 1, a gel was produced from 88 parts of diisobutyl phthalate (DIBP), 3 parts of EVA polymer (vinyl acetate fraction 28%) and 9 parts PVC copolymer (vinyl acetate fraction 5%). At the end there was no addition of additive T1
• this sealant was modified in such a way that the dispersion content was increased by 6% and the chalk / pigment content by 20% by adding the gel according to the invention. was substituted.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Sealing Material Composition (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Processes Of Treating Macromolecular Substances (AREA)

Priority Applications (5)

Applications Claiming Priority (2)

Publications (1)

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Cited By (3)

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Citations (1)

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• 1997
  • 1997-11-10 DE DE19749554A patent/DE19749554A1/de not_active Withdrawn
• 1998
  • 1998-10-30 ES ES98959816T patent/ES2190616T3/es not_active Expired - Lifetime
  • 1998-10-30 WO PCT/EP1998/006890 patent/WO1999024494A1/de not_active Ceased
  • 1998-10-30 US US09/554,061 patent/US6593405B1/en not_active Expired - Fee Related
  • 1998-10-30 JP JP2000520499A patent/JP2001522913A/ja active Pending
  • 1998-10-30 DK DK98959816T patent/DK1030875T3/da active
  • 1998-10-30 DE DE59806890T patent/DE59806890D1/de not_active Expired - Lifetime
  • 1998-10-30 EP EP98959816A patent/EP1030875B1/de not_active Expired - Lifetime

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