WO1998050809A1 - Dispositifs d'injection et d'extraction pour guides d'ondes dans un reseau de telecommunication - Google Patents
Dispositifs d'injection et d'extraction pour guides d'ondes dans un reseau de telecommunication Download PDFInfo
- Publication number
- WO1998050809A1 WO1998050809A1 PCT/CH1998/000183 CH9800183W WO9850809A1 WO 1998050809 A1 WO1998050809 A1 WO 1998050809A1 CH 9800183 W CH9800183 W CH 9800183W WO 9850809 A1 WO9850809 A1 WO 9850809A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- coupling
- conductors
- diodes
- detector plate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
Definitions
- One-Z decoupling devices for radiation conductors in a communication network are provided.
- the invention relates to a method for producing a coupling / decoupling device according to the preamble of patent claim 1 and a coupling / decoupling device according to the preamble of patent claim 4.
- an input / output coupling device for radiation-physical connection conductors of a communication network is referred to as a fiber duplexer, which can have a different number of channels.
- the fiber duplexer has four channels.
- a fiber duplexer is thus understood to mean a coupling / decoupling device in radiation-physical communication, which allows coupling of a transmission signal onto a connecting conductor connecting the subscribers and coupling of the returning signals from the same conductor onto a photodetector.
- FIG. 1 shows a typical telecommunications structure for signal transmission between a control center 1 and a plurality of end points 3.
- control center 1 a transmission diode 5 and a passive splitter (coupler) 6 are used on a plurality of radiation conductors (single-mode or multimode conductors) 7a to 7n Signals for the corresponding end points 3a and 3b applied.
- the end points 3a and 3b shown here are only examples; other versions are of course possible.
- work is carried out at a wavelength of 1.3 ⁇ m.
- the center 1 has the transmitter diode 5 and a multi-channel fiber duplexer 9 with the channels 9a to 9n.
- Each channel 9a to 9n is connected to the transmitter diode 5 via a radiation conductor 7a to 7n.
- the output side A of the duplexer 9 is connected to the respective terminal 3 via transmission lines 11a to 11n.
- the end point 3 can now be designed, inter alia, as a reflecting modulator 3a or as an active duplexer 3b.
- terminal 3 the input signal from transmitter diode 5 is superimposed on the terminal signal and sent back towards the transmitter.
- the end position signal is then received by means of a photodiode via the relevant channel of the duplexer.
- These end point signals are each processed with an amplifier 13a to 13n assigned to a channel 9a to 9n of the multi-channel duplexer 9 and processed further in the control center 1.
- the amplifiers 13a to 13n can also be arranged outside the multi-channel duplexer.
- WO 96/00920 describes an optical unit for a single radiation conductor, from which a partial radiation is coupled out, which is detected with a photodiode.
- the decoupling element is a 45 ° separation point in the radiation conductor, from which the partial radiation passes through an intermediate layer as the radiation conductor.
- a photodiode for detection is then arranged on the intermediate layer.
- the intermediate layer is provided with a through hole, at the end of which the photodiode is located.
- the object of the invention is to demonstrate a manufacturing method which can be carried out simply and inexpensively, and to provide a radiation-physical multi-channel fiber duplexer which is compact and easy to use.
- the duplexer according to the invention is compactly constructed only from an extremely small number of components and no special adjustment handles are required during assembly; Also, no devices have to be used to check the correct adjustment of the built-in components.
- the invention allows an extremely compact structure, since the distance from the coupling element to the diodes is extremely small. Since the diodes are an integral part of the detector plate, the adjustment with regard to the coupling elements is also considerably simplified; only one component has to be adjusted. The adjustment is also greatly facilitated by positioning means of an embodiment variant. In contrast to WO 96/00920, in the invention, partial radiation is not guided by radiation coupling-in coupling elements through an intermediate layer to a photodiode.
- the partial radiation is guided directly into a detector plate in which the transmitting and / or receiving diodes are integrated.
- the invention therefore not only has one component less, the diodes are also significantly closer to the coupling element in question. It has been shown that the arrangement of WO 96/00920 can only be used for an arrangement with a single radiation conductor. If several radiation conductors are used, the arrangement of WO 96/00920 does not allow a compact structure, since otherwise the signals from neighboring radiation conductors are crosstalked.
- the invention allows an extremely compact structure, since only through it is a short distance from the coupling element to the transmitting and / or receiving diodes possible.
- the transmitting and / or receiving diodes are an integral part of the detector plate, the adjustment with regard to the coupling elements is also considerably simplified; only one component has to be adjusted. The adjustment is also greatly facilitated by positioning means of a performance variant.
- an oblique, end-side grinding of the ends of the radiation conductor, coating of at least one final grind and subsequent joining of the two ends creates a coupling-out element for part of the radiation coming from the end point.
- the arrangement according to the invention is designed in such a way that the partial radiation to be coupled out or coupled out from a radiation conductor hits the active region of the diodes integrated in the detector plate without additional imaging optics.
- the entire structure is selected such that only the ends of the radiation conductors that belong to one another are inserted in a marked location in guide grooves, pushed together and a detector plate provided with form-fitting adjusting elements has to be inserted into the corresponding adjusting elements of a base plate carrying the guide grooves under self-adjustment and then cast.
- a complex adjustment is no longer necessary. Since conductor bundles, the individual conductor fibers of which are arranged equidistantly and rigidly in position, are preferably used, there is an assignment of the individual radiation conductors to one another, which is not lost even after a grinding and coating process of the ends. Twisting the individual conductors is no longer possible.
- FIG. 1 is a block diagram of a typical telecommunications structure for signal transmission between a control center and several end stations
- FIG. 2 shows a longitudinal section along a radiation conductor longitudinal axis of a multi-channel duplexer for, for example, four radiation conductors
- FIG. 3 shows a cross section along the line III-III in FIG. 2
- FIGS. 2 and 3 shows a plan view of a base plate of the duplexer shown in FIGS. 2 and 3 without a radiation conductor and with the detector plate removed,
- FIG. 5 shows a top view of the top of the detector plate with four integrated photodiodes
- FIG. 6 shows a perspective sketch of three radiation conductors, the radiation coupling / decoupling elements of which are formed from a non-continuous incision with a filter inserted, and
- Fig. 7 shows a cross section through one of the coupling elements shown in Figure 7 with indicated beam and coupled out partial beam.
- FIG. 2 shows in longitudinal section and FIG. 3 in cross section a four-channel fiber duplexer 9.
- the conductors 7a to 7d single-mode or multimode fibers carrying the radiation come in as radiation conductors coming from the transmitter diode 5 this one.
- the transmission conductors 11a to 11d leave the control center 1 in the direction of the terminal 3.
- the conductors 7a to 7d and 11a to 11d each have the fiber protective sheath (primary or secondary coating) 15 or 16 immediately after entering the or before leaving the duplexer 9 removed.
- the fiber cladding 17 and 18 and the radiation-guiding fiber core (core) 19 and 20 of the conductors 7a to 7d and 11a to 11d are continued.
- the fiber jackets 17 and 18 are held laterally in guide grooves 21a to 21d of a base plate 23.
- the guide grooves 21a to 21d are clearly visible in cross section in FIG. 3 and in a plan view in FIG. 4.
- the guide grooves 21a to 21d are V-shaped for aligning the inlet and outlet conductors 7 and 11, respectively. They have equidistant lateral distances, which here are, for example, 0.25 mm.
- markings 25a to 25e are arranged on a straight line, approximately in their longitudinal central position.
- a positioning recess 26a and 26b is arranged on both sides for a detector plate 27 in the base plate 23.
- the positioning recesses 26a and 26b have prismoid-like side walls.
- the detector plate 27, as can be seen in particular in FIG. 5, is rectangular and has a bridge-like cross section with projections 29a and 29b projecting downwards.
- the dimensions of the lugs 29a and 29b are selected such that, as will also be explained below, they position the detector plate 27 exactly on the base plate 23 with respect to the markings 25a to 25e.
- four photodiodes 33a to 33d z. B. integrated by means of an epitaxial method. Their geometric centers are arranged along a straight line 32.
- the electrical conductors 34 for the photodiodes 33a to 33d run on the surface 31 and are guided laterally above the lugs 29a and 29b to a respective connection field 35a or 35b with the corresponding connection points 37.
- the connection points 37 are connected to the corresponding conductor tracks 42 on the base plate 23 via bonded or soldered wires 40.
- the base material of the detector plate 27 is transparent to the radiation guided in the conductors 7 and 11.
- the grinding surfaces 45a of the fiber jackets 17 and cores 19 and the grinding surfaces 45b of the fiber jackets 18 and cores 20 lie in a plane running perpendicular to the longitudinal axes of the conductors 7 and 11.
- One of the grinding surfaces 45a or 45b, here the grinding surface 45b, has an optical coating 49 which has a part 47 the radiation 48 arriving in the core 20 is reflected out of the latter.
- the radiation coming or passing from the end point 3a or 3b in the continuous radiation conductor is identified by 48 or 46.
- the coating is selected in such a way that about 50% of the radiation power comes out from the end point 3a or 3b; the same applies to the transmission signal.
- the ground conductor ends are joined at their connection point 50 such that the conductors 7a to 7d are aligned with the conductors 11a to 11d.
- the radiation coming from or reflected from the terminal 3 strikes the corresponding photodiodes 33a to 33d through the underside 43 of the detector plate 27 .
- the other 50% pass the junction 50 to the relevant terminal 3.
- the arrangement of the markings 25a to 25e and the positioning recesses 26a and 26b as well as the design of the detector plate 27 and its projections 29a and 29b as well as the locations of the diode integration in the detector plate 27 are selected such that the partial radiation coupled out through the contact surface 45b in each case active area of the photodiodes 33a to 33d, provided the upper end of the respective abutment surface 45a and 45b lies at the location of the respective marking 25a to 25e and the lugs 29a and 29b of the detector plate 27 are inserted into the positioning recesses 26a and 26b.
- an optical fiber duplexer 9 for four bundled transmission conductors 11a to 11d, for example, the ends of the bundled transmission conductors 11a to 11d to be combined in the duplexer and those of the likewise bundled conductors 7a to 7d, which lead to the transmitter diode 5, in the end region from Protective jacket 15 and 16 exempt.
- the cleared area is larger by a grinding and assembly tolerance than the distances of the markings 25a to 25e from the start of the guide grooves 21a to 21d.
- the bundled conductors 7a to 7d and 11a to 11d, freed from the protective sheath 15 and 16 in the end region, are glued to a grinding base with a detachable resin in order to give the conductor ends stability during the upcoming grinding process.
- the ends of the conductors 7a to 7d and 11a to 11d are now ground under the angle range listed above (between 40 ° and 50 °).
- the grinding of the conductor ends of the transmission conductors 11a to 11d is chosen in accordance with FIG. 2 such that the partial radiation 47 to be coupled out can be guided upwards into the detector plate 27.
- the resin is removed again and the grinding surfaces 45a and 45b cleaned.
- the grinding surfaces here for example the grinding surfaces 45b, are provided with a coating which, in the assembled and glued state, reflects (decouples) and transmits approximately 50% of the radiation 48 arriving from the terminal 3 as a partial beam 47.
- the portion reflected at the connection point 50 penetrates the base plate (if this consists of transparent material) and is absorbed by the absorber 36 on the rear side of the base plate 23.
- the ends of the conductors 7a to 7d and 11a to 11d are inserted or pushed into the guide grooves 21a to 21d in such a way that the contact surfaces 45a and 45b take into account the correct alignment, as already explained above, are at the location of the markings 25a to 25e. Inserting the conductor ends is made easier by the inlets 51 and 52 shown in FIG. The position is checked optically (microscope, stereo microscope, camera, ). The detector plate 27 is placed on the inserted conductor ends and everything is fixed with an adhesive (epoxy resin, UV-curing adhesive, ...) that is transparent to the radiation carried in the conductors. The conductor ends are pushed together in such a way that a gap remains which is sufficient for the adhesive to penetrate.
- an adhesive epoxy resin, UV-curing adhesive,
- the base plate 23 will preferably be made of silicon using the so-called "silicon motherboard” technology. It is a technology that is already well established in semiconductor manufacturing. Such a silicon base plate can also be used as a “master” for an injection molding process. This "master” can also be pressed into a thermoplastic material to produce the structures of a base plate.
- the detector plate consists of indium phosphide with epitaxially grown photodiodes made of indium gallium arsenide. An execution in the infrared radiation range is of course not mandatory; with a suitable choice of materials, it can also be worked in the visible.
- the (multi-channel) duplexer according to the invention is characterized in particular by its compact structure and inexpensive manufacture, which uses techniques which are already sufficiently known.
- the construction elements base plate 23, detector plate 27 with integrated diodes and the bevelled grinding of the conductor ends
- the construction elements are designed according to the invention in such a way that they no longer have to be actively adjusted. Everything is just put together (self-adjustment). After being plugged together, both the conductors and the beam splitters are precisely aligned with regard to the detectors 33a-33d for the partial radiation. All components can be easily fixed to each other with a single glue.
- duplexer for four incoming and four outgoing (mono or multimode) conductors, as is explained here for example, it can also be designed for more or fewer conductors. Since the conductors are arranged firmly to one another due to the bundling, fewer markings than the five shown in FIG. 4 are sufficient for identifying the position of the decoupling element (contact surfaces).
- the base plate would be two pieces instead of one.
- the exact joining of the two base plates could take place via aligned blind holes or further guide grooves on the surface of the base plates by means of dowel pins.
- soldering points can be arranged for self-adjustment on both adjacent surfaces.
- the detector plate When the solder becomes liquid, the detector plate then floats automatically into the desired position specified by the solder points on the base plate.
- the base plate 23 can be dispensed with if the guide grooves for the conductors are arranged directly on the detector plate.
- the conductor ends could only be glued directly to the detector plate.
- the adhesive point could also be covered with a cover plate. In this case, the markings will be placed on the detector plate.
- the detector plate with the photodiodes integrated in the top can also be mounted with this top down directly above the radiation conductors.
- the detector plate can consist of non-transparent material.
- both adjacent conductor ends can also be coated. It a decoupling that deviates from 50% can also be selected depending on the intended use.
- the coating can also be formed by a suitable selection of a layer ensemble in such a way that only certain wavelength ranges are coupled out or in. A certain polarization direction can also be preferred in this way.
- a structure can also be produced in a continuous conductor, for example as a lattice-like change in refractive index by UV radiation.
- This grid then carries out the appropriate coupling or decoupling. It can also be used to generate a decoupling element
- Groove 53 are sawn into the continuous conductor (multimode fiber), for example with a diamond saw.
- the continuous conductors are designated 55a to 55c in FIG.
- the "sawing angle" (cutting angle) to the conductor axis has a value slightly different from 45 ° in order to avoid back reflections.
- a correspondingly coated plate 57 (plate made of glass, plastic film,... With a thickness of ⁇ 30 ⁇ m) is then inserted into this groove 53, possibly using an adhesive to adjust the refractive index.
- the plate 57 is placed over the sawn-in conductors 55a to 55c of the conductor bundle 59, as indicated in FIG. 6.
- the plate 57 decouples only a part 60 of the beam cross-section 61 (FIG.
- a detector plate 63 with integrated diodes, of which only a 64 is shown, lies directly on the conductors 55a to 55c.
- the plate 57 can be coated in order to achieve a filter effect when coupling out the partial radiation.
- a filter sheet can also be inserted in addition to the plate.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Measurement Of Radiation (AREA)
- Light Receiving Elements (AREA)
Abstract
Dans la fabrication d'un dispositif d'injection/extraction (9) pour rayonnement guidé, ou à guider, dans un guide d'ondes (7a-7d; 11a-11d), destiné à un réseau de télécommunication, plusieurs guides d'ondes (7a-7d; 11a-11d) sont montés en parallèle. Suivant le nombre de guides d'ondes (7a-7d; 11a-11d), des diodes émettrices et/ou réceptrices (33a-33d) sont intégrées épitaxialement dans la plaque d'un détecteur (17), à distance mutuelle des guides d'ondes. Les guides d'ondes sont munis d'éléments d'injection/extracton (45a, 45b, 49) conformément aux positions des diodes, pour l'injection/extraction d'un rayonnement partiel (47) dans les diodes ou hors des diodes (33a-33d). La plaque du détecteur (27) présentant les diodes intégrées (33a-33d) est appliquée directement, sans couche intermédiaire d'un élément conducteur de rayonnement, sur les guides d'ondes (7a-7d, 11a-11d). L'invention permet d'obtenir une construction particulièrement compacte, du fait que la distance de l'élément d'injection (45a, 45b, 49) aux diodes (33a - 33d) est particulièrement faible. En outre, du fait que les diodes (33a-33d) font partie intégrante de la plaque du détecteur (17), l'ajustement des éléments d'injection (45a, 45b, 49) est notablement simplifié; un seul composant doit être ajusté. L'ajustement est, par ailleurs, largement facilité grâce à des moyens de positionnement (29a) prévus dans une variante d'exécution.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1057/97 | 1997-05-06 | ||
CH105797 | 1997-05-06 |
Publications (1)
Publication Number | Publication Date |
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WO1998050809A1 true WO1998050809A1 (fr) | 1998-11-12 |
Family
ID=4201445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CH1998/000183 WO1998050809A1 (fr) | 1997-05-06 | 1998-05-06 | Dispositifs d'injection et d'extraction pour guides d'ondes dans un reseau de telecommunication |
Country Status (1)
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WO (1) | WO1998050809A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001004671A2 (fr) * | 1999-07-12 | 2001-01-18 | Harting Elektro-Optische Bauteile Gmbh & Co. Kg | Ensemble optoelectronique, composants pour cet ensemble et procede de fabrication dudit ensemble |
Citations (10)
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FR2436404A1 (fr) * | 1978-09-18 | 1980-04-11 | Siemens Ag | Element de derivation, notamment pour systemes de transmission optique d'informations |
DE3008051A1 (de) * | 1980-03-03 | 1981-09-10 | Siemens AG, 1000 Berlin und 8000 München | Optischer baustein fuer multiplexer/demultiplexer |
FR2509479A1 (fr) * | 1981-07-10 | 1983-01-14 | Thomson Csf | Dispositif d'emission-reception d'energie radiante et systeme de liaison bidirectionnelle par fibre optique comprenant un tel dispositif |
FR2525777A1 (fr) * | 1982-04-21 | 1983-10-28 | Renault | Coupleur lateral ou transversal pour fibres optiques |
EP0292331A2 (fr) * | 1987-05-22 | 1988-11-23 | The Furukawa Electric Co., Ltd. | Elément à fibres optiques multiples et son procédé de fabrication |
US4881789A (en) * | 1988-05-26 | 1989-11-21 | Finisar Corporation | Integrated optical coupler and connector |
US5199966A (en) * | 1988-04-29 | 1993-04-06 | At&T Bell Laboratories | Optical coupler method |
EP0611975A1 (fr) * | 1988-03-03 | 1994-08-24 | AT&T Corp. | Sous-assemblage pour éléments optoélectroniques |
WO1996000920A1 (fr) * | 1994-06-30 | 1996-01-11 | The Whitaker Corporation | Boitier opto-electronique et emetteur-recepteur optique bidirectionnel s'utilisant a l'interieur de celui-ci |
US5555333A (en) * | 1993-07-12 | 1996-09-10 | Ricoh Company, Ltd. | Optical module and a fabrication process thereof |
-
1998
- 1998-05-06 WO PCT/CH1998/000183 patent/WO1998050809A1/fr active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2436404A1 (fr) * | 1978-09-18 | 1980-04-11 | Siemens Ag | Element de derivation, notamment pour systemes de transmission optique d'informations |
DE3008051A1 (de) * | 1980-03-03 | 1981-09-10 | Siemens AG, 1000 Berlin und 8000 München | Optischer baustein fuer multiplexer/demultiplexer |
FR2509479A1 (fr) * | 1981-07-10 | 1983-01-14 | Thomson Csf | Dispositif d'emission-reception d'energie radiante et systeme de liaison bidirectionnelle par fibre optique comprenant un tel dispositif |
FR2525777A1 (fr) * | 1982-04-21 | 1983-10-28 | Renault | Coupleur lateral ou transversal pour fibres optiques |
EP0292331A2 (fr) * | 1987-05-22 | 1988-11-23 | The Furukawa Electric Co., Ltd. | Elément à fibres optiques multiples et son procédé de fabrication |
EP0611975A1 (fr) * | 1988-03-03 | 1994-08-24 | AT&T Corp. | Sous-assemblage pour éléments optoélectroniques |
US5199966A (en) * | 1988-04-29 | 1993-04-06 | At&T Bell Laboratories | Optical coupler method |
US4881789A (en) * | 1988-05-26 | 1989-11-21 | Finisar Corporation | Integrated optical coupler and connector |
US5555333A (en) * | 1993-07-12 | 1996-09-10 | Ricoh Company, Ltd. | Optical module and a fabrication process thereof |
WO1996000920A1 (fr) * | 1994-06-30 | 1996-01-11 | The Whitaker Corporation | Boitier opto-electronique et emetteur-recepteur optique bidirectionnel s'utilisant a l'interieur de celui-ci |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001004671A2 (fr) * | 1999-07-12 | 2001-01-18 | Harting Elektro-Optische Bauteile Gmbh & Co. Kg | Ensemble optoelectronique, composants pour cet ensemble et procede de fabrication dudit ensemble |
WO2001004671A3 (fr) * | 1999-07-12 | 2002-10-24 | Harting Elektrooptische Bauteile Gmbh & Co Kg | Ensemble optoelectronique, composants pour cet ensemble et procede de fabrication dudit ensemble |
US6813418B1 (en) | 1999-07-12 | 2004-11-02 | Harting Elektro-Optische Bauteile Gmbh & Co. Kg | Optoelectronic assembly, components for same and method for making same |
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