WO1996000920A1 - Boitier opto-electronique et emetteur-recepteur optique bidirectionnel s'utilisant a l'interieur de celui-ci - Google Patents

Boitier opto-electronique et emetteur-recepteur optique bidirectionnel s'utilisant a l'interieur de celui-ci Download PDF

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Publication number
WO1996000920A1
WO1996000920A1 PCT/US1995/008402 US9508402W WO9600920A1 WO 1996000920 A1 WO1996000920 A1 WO 1996000920A1 US 9508402 W US9508402 W US 9508402W WO 9600920 A1 WO9600920 A1 WO 9600920A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical fiber
optoelectronic
hermetically sealed
endwall
optical transceiver
Prior art date
Application number
PCT/US1995/008402
Other languages
English (en)
Inventor
Robert Addison Boudreau
Terry Patrick Bowen
Ervin Herbert Mueller
Dale Dennis Murray
Narinder Kapany
Original Assignee
The Whitaker Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Whitaker Corporation filed Critical The Whitaker Corporation
Publication of WO1996000920A1 publication Critical patent/WO1996000920A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G02B6/4243—Mounting of the optical light guide into a groove
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail

Definitions

  • the present invention relates to a novel optoelectronic package and bidirectional optical transceiver for use therein, the entire module being usable in a bidirectional optical fiber network. More particularly, the present invention relates to a type of optoelectronic package which includes any type of optoelectronic device such as a hermetically sealed optical transceiver, including an optical fiber pigtail extending therefrom; a connector including a ferrule receiving an end of the optical fiber pigtail and a connector sleeve housing the ferrule; and an external casing housing the optoelectronic device and at least a portion of the connector.
  • a type of optoelectronic package which includes any type of optoelectronic device such as a hermetically sealed optical transceiver, including an optical fiber pigtail extending therefrom; a connector including a ferrule receiving an end of the optical fiber pigtail and a connector sleeve housing the ferrule; and an external casing housing the opto
  • the hermetically sealed optical transceiver is mounted on a support, with the mounting being preferably at an acute angle with respect to the split sleeve connector, and/or with the optical fiber pigtail being angled between the hermetically sealed optical transceiver and the ferrule to provide strain relief in the optical fiber pigtail.
  • the present invention is related to a bidirectional optical transmitter/receiver (transceiver) for use in the aforementioned optoelectronic package.
  • Optoelectronic packaging is the engineering science of how to provide protection, support, and connection to optical chips, such as semiconductor lasers, and their associated electrical chips so that the chips can provide their useful function.
  • Optoelectronic packaging is analogous to electrical packing, except that it is complicated by the addition of the considerable restraints associated with handling optics. The restraints include precise positioning of optical elements within the package and restrictions on where the optical paths can be placed. As telecommunications, data, and video services require greater bandwidth and higher speed transmission, there will be an ever-increasing need for OEP.
  • semiconductor lasers were introduced into long-haul telecommunications, their packages were largely based on handcrafting, and costs were high.
  • optical telecommunication networks employ high performance optoelectronic components, such as lasers and photo detectors, which are coupled optical fibers. Expansion of the optical fiber network into the local loop requires several optoelectronic and fiber components for each customer, the cost of which cannot be shared among thousands of customers as in long-haul optical networks. This situation imposes significant demands with regard to obtaining optoelectronic components that could be manufactured at a low cost.
  • TO transistor outline
  • a TO can is used to provide a hermetic capsule to protect a laser or detector chip while allowing light to pass through a tiny window. Tiny wire bonds connect to the leads that feed through the bottom of the can. Manufacturers of laser and detector chips frequently sell their chips and these cans, which are then used in larger packages where optical elements such as fibers, lenses, and electronics are added. The most expensive part . of OEP is the optical alignment.
  • optical-alignment position tolerance for multimode optical interconnections is about 5-10 micrometers ( ⁇ m) ; for single-mode interconnections, it is about l ⁇ m. If an optical fiber is lensed, it can achieve a higher coupling efficiency at the expense of even more sensitivity to position misalignment. However, applications requiring high speed data transmission of about 2 gigabits per second and above require a single-mode fiber, and a single-mode fiber may further be needed if the transmission distance is long. Packages requiring optical alignments with single-mode fibers are the most expensive.
  • Optical alignments can be performed both actively and passively.
  • An active alignment is where the laser detector device is operated and a fiber is manipulated in front of it until the optical signal is peaked. The fiber is then bonded to the package.
  • a passive alignment is where the alignment position of the fiber is determined by a mechanical or optical reference feature on the device being aligned and the fiber is bonded into position without the operating device. The passive alignment is intrinsically faster and simpler but requires a special package design. Active alignments are the most common and are required for all packages based on TO cans since there is no reference to locate the optical device within the device.
  • SWT silicon waferboard technology
  • an optoelectronic package comprising: an optoelectronic device, including an optical fiber pigtail extending therefrom; a connector including, a ferrule receiving an end of said optical fiber pigtail, and a connector sleeve housing said ferrule; and an external casing housing the optoelectronic device and at least a portion of the connector.
  • the objects of the invention are further fulfilled by providing an optoelectronic package wherein the optoelectronic device is a hermetically sealed optoelectronic circuit, which is mounted on a support, at an acute angle with respect to the split sleeve connector to provide for strain relief in the optical fiber pigtail.
  • the objects of the present invention are still further fulfilled by providing an optoelectronic package, wherein the optical fiber pigtail is angled between the hermetically sealed optical transceiver, or other optoelectronic device, and the ferrule to provide for strain relief from the optical fiber pigtail.
  • a hermetically sealed bidirectional optical transceiver for use in an optoelectronic package including a ferrule and a connector, housing the ferrule, mounted within the optoelectronic package, the hermetically sealed bidirectional optical transceiver comprising: first optical fiber, for transmitting optical signals therethrough, having an acutely angled endwall; second optical fiber, for transmitting and receiving optical signals therethrough, having an endwall proximate to the acutely angled endwall of the first optical fiber; light source for generating outgoing light; and detector for detecting incoming light, wherein the acutely angled endwall of the first optical fiber reflects at least a portion of the incoming light, passing from the second optical fiber to the detector, and passes at least a portion of the outgoing light to the second optical fiber.
  • Advantages of the optoelectronic package and hermetically sealed bidirectional optical transceiver for use in the optoelectronic package of the present invention include: (1) a device which is small in size and is therefore compact; (2) a device which can be constructed inexpensively and simply since silicon waferboard technology (SWT) may be employed, thereby eliminating parts because of the use of etched mechanical features and patterned depositions which replace separate submounts, wire bonds, standoffs and fiberblocks required in conventional devices and which do not utilize transistor outline (TO) cans or headers for the laser detector components for example; (3) a device which advantageously allows for passive-optical alignment assembly suitable for both multimode and single-mode fibers; (4) a device in which the electrical input/output from the connector module is flexible in design and can be specified by the customer; and (5) a device which utilizes minimal components by utilizing angled endwalls of at least one optical fiber for beamsplitting purposes thereby removing any need to employ conventional and expensively beamsplitting prisms or mirrors;
  • Fig. l is a perspective view of an embodiment of the optoelectronic package of the present invention.
  • Fig. 2 is a side view of the optoelectronic package of Fig. 1;
  • Fig. 3 is a perspective view of an embodiment of the hermetically sealed bidirectional optical transceiver for use in the optoelectronic package of Fig. 1;
  • Fig. 4 is a cutaway view illustrating the bidirectional beamsplitting junction (or beamsplitter) of optical fibers within the hermetically sealed directional optical transceiver of Fig. 3;
  • Fig. 5 is a top plan view, cut along the line A-A of Fig. 4, of a portion of the bidirectional optical transceiver of Fig. 3 for use in the optoelectronic package.
  • Fig. 1 illustrates an optoelectronic package 1 of a first embodiment of the present invention.
  • An optoelectronic device which may be a compact laser, a compact detector or a hermetically sealed bidirectional optical transceiver 3, is shown in Fig. 1. The specific use of a hermetically sealed bidirectional optical transceiver 3 will be further described in detail with regard to Fig. 4 of the present application.
  • Attached to the optoelectronic device 3 is an optical fiber 6. This optical fiber 6 may or may not be preattached to the optoelectronic device 3.
  • the optical fiber 6 is preferably bent at an angle as illustrated by element 7 in Fig. 1.
  • the optical fiber 6 is further preferably angled based on the fact that the optoelectronic device 3 can be mounted by soldering for example, or bonded with an epoxy, on a submount 5 at an angle as shown in 7 in Fig. 1. This angle, 7, and the angle in the optical fiber as shown by element 7 provides some stress or strain relief to the optical fiber itself.
  • the optical fiber 6 is connected or attached to ferrule 9.
  • the ferrule acts as a mounting aid for the optical fiber 6 and is the same as is used is known optical fiber connectors.
  • the ferrule is cylindrical and is a spring loaded ferrule as is shown by 9 in Fig. 1.
  • a connector sleeve 11 houses the ferrule 9.
  • this connector is a split sleeve connector which contracts on the ferrule 9 to hold it in place.
  • the nature of the electrical input/output connections from the connector module is flexible in design and can be specified by the customer. Electrical signals pass from the internal submodule 3 (the optoelectronic device) by first passing through an electrical vias at the base of the internal submodule 3 as will be discussed later with regard to Fig. 4 of the present application.
  • the connector assembly itself including split sleeve connector 11, further includes supports 13 which are attached to a base 15 which comprises part of the external casing of the optoelectronic package 1.
  • hermetically sealed optical transceiver 3 is also mounted to the base 15.
  • the aforementioned mounting may be achieved via soldering, or an epoxy may be used.
  • an external cover or casing 17 is connected to the base, and houses the optoelectronic device or submodule 3 (such as a hermetically sealed bidirectional optical transceiver 3) , the optical fiber 6, the ferrule 9, and at least a portion of the connector 11.
  • This casing 17 may be plastic or metal for example.
  • an optoelectronic package or connector is created which can house any type of pre-formed submodule 3 (such as a compact laser, a compact detector or an optical transceiver, separately formed and passively aligned, by a technology such as SWT) .
  • the inexpensive optoelectronic package 1 which houses its own optoelectronic submodule 3 (unlike known connector modules which had connectors bonded to the side of the optoelectronic package itself and had lasers or other optoelectronic devices external thereto) .
  • Fig. 2 illustrates a side cutaway view of the optoelectronic package 1.
  • Fig. 2 shows the optoelectronic submodule, the hermetically sealed bidirectional optical transceiver 3, with the optical fiber 6 extending therefrom, mounted on the support 5.
  • the optical fiber 6 is preferably a silica or glass fiber, but may be plastic.
  • Fig. 2 further illustrates the ferrule 9 receiving the optical fiber 6, and being mounted in split sleeve connector 11. Finally, supports 13 are shown for mounting the connector 11 to the base 15.
  • the external casing of the optoelectronic package 1 is further illustrated as including the base 15 and an external cover 17, connected to the base 15, housing the optoelectronic submodule (hermetically sealed bidirectional optical transceiver 3) , the optical fiber 6, the ferrule 9, and at least a portion of the connector 11.
  • Both Figs. 1 and 2 have been drawn to scale and a line designating the equivalent of one scaled centimeter is separately shown with regard to each of the Figs 1 and 2.
  • Fig. 3 illustrates a type of optoelectronic submodule, a hermetically sealed bidirectional optical transceiver 3, for use in the optoelectronic package 1 of the Fig. 1.
  • the hermetically sealed bidirectional optical transceiver 3 includes a light source 19 mounted to a substrate 29.
  • the light source 19 may be laser, such as a semiconductor laser, or a light emitting diode (LED) .
  • the light source is for generating outgoing optical signals, such as light of a first wavelength ⁇ ,.
  • a first optical fiber 21 is connected to the light source 19.
  • the optical fiber 21 is for transmitting optical signals therethrough.
  • the optical fiber 21 is mounted in a V-groove in substrate 29 as will be later described.
  • the optical fiber 21 then passes to a silicon bridge 23, and is also mounted in an inverse V- groove in silicon bridge 23 as will be described later.
  • Mounted within the silicon bridge is a beamsplitting junction 35 as will further be described with regard to Fig. 4 of the present application.
  • a detector 25 which is a light detector or photo detector
  • incoming optical signals such as optical signals of a second wavelength ⁇ 2 .
  • Extending from silicon bridge 23 is a second optical fiber 27 (also formed in the aforementioned V- grooves) , for outputting outgoing optical signals, such as those of a first wavelength ⁇ , from light source 19, and for providing incoming optical signals, such as those of a second wavelength ⁇ 2 to optical detector 25.
  • An electric vias 31 is further shown in Fig. 4, below substrate 29.
  • the electrical vias or contacts 31 abuts support 5 as shown in Fig. 1, and electrical signals pass to the internal submodule 3, such as the hermetically sealed bidirectional transceiver 3, and to the connector module including connector 11, by first passing from an external power source through connectors or fingers 32 (of Fig. 1) and through electrical vias 31 at the base of the substrate 29.
  • the vias 31 are merely electrical contacts which penetrate silicon substrate 19.
  • the optical transceiver 3 as shown in Fig. 3 is hermetically sealed by hermetic cover 33 which may preferably be formed of silicon, but which can also be metal or glass. Further, plastic can be used to form a pseudo hermetic seal (which may have a slow leak, which may not have an effect on the device over its usable life) .
  • the cover 33 may be sealed around its perimeter using solder of glass frit to provide hermeticity and further includes a vent hole that can be tipped off to capture an inert atmosphere, within if desired.
  • Fig. 4 is a cutaway view of the transceiver 3 of Fig. 3, and illustrates the beamsplitting aspect of the optical transceiver 3, which utilizes acutely angled endwalls of the optical fibers to pass outgoing beams, preferably of a first wavelength ⁇ , and to reflect incoming beams, preferably of a second wavelength ⁇ 2 .
  • the beamsplitter or beamsplitting junction 35 is housed by a silicon bridge 23.
  • the silicon bridge 23 incudes an inverse V-groove 38, in which fibers 21 and 27 forming the beamsplitter 35, are mounted.
  • the bridge 23 includes a hole 50. Above the hole 50 is a detector 25 mounted or bonded on bridge 23, such that the bridge 23 holds the detector 25 above and directly over beamsplitter 35.
  • the bridge 23 is then mounted on substrate 29 using mounting or alignment blocks 40.
  • the beamsplitting junction 35 includes a first optical fiber 21 for transmitting outgoing optical signals, preferably of a first wavelength ⁇ 1 , output from light source 19.
  • the endwall of a first optical fiber 21 is angled at an acute angle, ranging from 30°-60° and preferably 45°, with respect to the substrate 29.
  • this acutely angled endwall of the first optical fiber 21 is coated with a dichroic coating 41 composed of a multilayer dielectric coating of varying thicknesses such as ZnS, Al 2 0 3 or Ti0 2 for passing at least a portion of light of a first wavelength ⁇ and for deflecting at least a portion of light of a second wavelength ⁇ 2 .
  • the second optical fiber 27 also includes an endwall 39 which is acutely angled.
  • the second optical fiber 27 is acutely angled, the acute angle of optical fiber 27 being complementary to the acute endwall of optical fiber 21, as is shown in Fig. 5.
  • This acutely angled endwall 39 of optical fiber 27 also ranges from 30°-60°, and is preferably 45°.
  • Fig. 5 illustrates a top plan view of a portion of the hermetically sealed bidirectional optical transceiver 3 for use in the optoelectronic package 1 of the present application, cut along section A-A of Fig. 4.
  • Fig. 5 illustrates an optical fiber 21, silicon bridge 23, and detector 25, along with substrate or mounting block 29.
  • Fig. 5 further illustrates a V- shaped groove 36 and 38.
  • the V-shaped groove 38 for mounting optical fibers 21 and 27 (which is an inverse V-groove) is included on bridge 23.
  • a similar V-groove for mounting optical fiber 21 can be included in at least a portion of an additional mounting substrate near ferrule 9, to aid in the alignment of the optical fiber 21 with the ferrule 9 housed within connector 11.
  • Fig. 5 illustrates a beamsplitting junction 35.
  • Two optical fibers 21 and 27 have abutting endwalls 37 and 39, respectively, which are proximate to each other. At least one of the endwalls 37 and 39 is formed at an angel a as is shown in Fig. 5.
  • the abutting endwalls of 37 and 39 are each at an angle other than that perpendicular (30°- 60°) to the direction of optical signals having wavelengths ⁇ , and ⁇ 2 , which represent an outgoing signal and an incoming signal, respectively in one preferred embodiment of the present application. More preferably, at least one of the endwalls 37 and 39 is angled at an acute angle with respect to the substrate 29, which preferably can be 45°. Still more preferably, the other of the endwalls 37 and 39 is also angled at an acute angle ⁇ as shown in Fig. 5, which is complementary to the acute angle of the other endwall 37 and 39, which may also be 45°. As is further illustrated in Fig.
  • the optical outgoing signal generated by light source 19, of a wavelength ⁇ x for example is split into a first component 43 which passes through the junction 35, and into a second component 45.
  • the incoming optical signal having a wavelength ⁇ 2 differing from the generated wavelength ⁇ j for example is also split into a first portion 47 which is reflected at the junction 35, and a second component 49 which passes through the junction 35.
  • the abutting endwalls 37 and 39, or at least the endwall which is acutely angled, may additionally include coatings of a dichroic substance * (or dielectric) , so as to control the direction of light on a wavelength-sensitive basis.
  • the abutting endwalls 37 or 39 of the optical fiber, or alternately at least one endwall of one optical fiber can be coated with a dichroic substance which acts to pass at least a portion of light of a first wavelength ⁇ [ (i.e. outgoing light is generated by a light source 19) and which acts to reflect at least a portion of light of a second wavelength (i.e. incoming light generated by a light source of a remotely located optical transceiver) .
  • a dichroic substance which acts to pass at least a portion of light of a first wavelength ⁇ [ (i.e. outgoing light is generated by a light source 19) and which acts to reflect at least a portion of light of a second wavelength (i.e. incoming light generated by a light source of a remotely located optical transceiver) .
  • the incoming and outgoing light is of the same wavelength. This can occur in a situation where the speed of the data being transmitted is below 300 megabits/second, or more
  • the dichroic or dielectric coating 41 is unnecessary and can be removed. All that is necessary is the aforementioned acutely angled endwalls 37 and 39 of fibers 21 and 27, for passing at least a portion
  • the dichroic substance as illustrated by 41 in Fig. 4, allows for the passing of at least a portion of light beams less than or equal to a first wavelength
  • the first and second wavelengths being dependent upon the dichroic substance used.
  • the aforementioned wavelengths are merely exemplary and are not limitative of the present invention.
  • the angle of the abutting or at least proximate endwalls 37 and 39 of optical fibers 21 and 27 is constructed such that a significant component (preferably 50% of greater) of the incoming optical signal having wavelength ⁇ ,, for example, is reflected, as shown by component 47, through hole 50 to detector 25.
  • a significant component of the incoming optical signal having a wavelength ⁇ 2 for example, as shown by element 49 in Fig. 4 passes through the beamsplitting junction 35 from optical fiber 23 to optical fiber 21.
  • the angle of the abutting or at least proximate endwalls 37 and 39 is further constructed such that a significant component (preferably 50% or greater) of the outgoing optical signal having a wavelength ⁇ , for example, is transmitted past the junction 35 and to optical fiber 23.
  • an insignificant component as shown by element 45 in Fig. 4 of the outgoing optical signal is reflected in a direction away from the optical detector.
  • the angle of at least one of endwalls 37 and 39 is preferably an acute of 30°- 60°angle and is more preferably about 45°.
  • the angles of the endwalls of the first optical fiber 21 and the second optical fiber 27 are each preferably acutely angled (preferably at 45°) in an approximately complementary fashion.
  • Manufacture of the optoelectronic module 3 of the package 1 is preferably done using silicone waferboard technology (SWT) and a hermetic sealant, prior to encapsulation of the entire optoelectronic package.
  • SWT silicone waferboard technology
  • etched mechanical features and patterned depositions replace separate submounts, wire bond standoffs, and fiber blocks common in conventional packages.
  • some electronics can be incorporated in the silicon substrate using conventional integrated circuit processing techniques.
  • the optoelectronic module 3 such as a compact laser, a compact detector or a transceiver
  • the entire hermetically sealed bidirectional optical transceiver 3 for example, for use in the optoelectronic package 1 of the present invention, along with the above-described components, may be constructed using conventional silicone wafer technology.
  • the components such as the light source 19 and the silicone bridge 23 can be soldered or epoxy can be used to mount them to the substrate 29.
  • the optical fibers 21 and 27 are attached to the substrate 29 in a V-groove such as 36 shown in Fig.
  • Alignment pedestals 40 (Fig. 5) are used to align bridge 23 and similarly pedestals 34 (Fig. 5) are used to align laser 34.
  • the use of the aforementioned SWT technology including mounting of fibers in V-grooves and alignment of optoelectronic devices using pedestals to align bridge 23 and laser 19 are discussed in U.S.P. 5,163,108 and 5,182,782, which are hereby incorporated herein by reference.
  • the support 5 can also be mounted, via solder or epoxy to the external casing base 15.
  • supports 13 for supporting the connector 11 can also be soldered or epoxyed to the base 15.
  • an external cover 17 (preferably plastic or metal) is soldered or epoxyed to base 15 to form an external casing of the optoelectronic package 1.
  • the hermetic seal for the optoelectronic bidirectional transceiver 3 or other optoelectronic component can include initial passive alignment, placement of the cover and then sealing with solder or glass frit.
  • An overmolding or other low pressure encapsulants can be used to encapsulate some of the submodule. Silicon is a preferred hermetic cover, but metal and glass may be used (and even plastic) as discussed previously.

Abstract

Un boîtier opto-électronique (1) comporte un module opto-électronique, tel qu'un émetteur-récepteur optique bidirectionnel (3) scellé hermétiquement et d'où part un toron de raccordement de fibre optique (6), une ferrule (9) recevant une extrémité dudit toron de raccordement (6), et un manchon de raccordement fractionné (11) abritant la ferrule (9). L'émetteur-récepteur optique bidirectionnel (3) hermétiquement scellé est monté sur un support (5) et forme un angle aigu η avec le manchon de raccordement (11). Ainsi, le toron de raccordement de fibre optique (6) est incliné entre l'émetteur-récepteur optique bidirectionnel (3) et la ferrule (9), ce qui lui confère une relaxation de contrainte. D'autre part, l'émetteur-récepteur optique bidirectionnel (3) s'utilisant dans le boîtier opto-électronique (1) comprend une première fibre optique (21) permettant l'émission de signaux optiques et présentant une paroi terminale formant un angle aigu, une deuxième fibre optique (27) permettant l'émission et la réception de signaux optiques et présentant une paroi terminale voisine de la paroi terminale à angle aigu de la première fibre optique (21), une source de lumière (19) permettant de produire de la lumière d'une première longueur d'onde, et un détecteur (25) permettant de détecter de la lumière d'une deuxième longueur d'onde, différente de la première longueur d'onde. La paroi terminale à angle aigu de la première ou de la deuxième fibre optique réfléchit au moins une partie de la lumière de la deuxième longueur d'onde, transmise de la deuxième fibre optique (27) au détecteur (25), et transmet au moins une partie de la lumière de la première longueur d'onde à la deuxième fibre optique (27). Idéalement, la paroi terminale à angle aigu de la première ou de la deuxième fibre optique comporte un revêtement dichroïque.
PCT/US1995/008402 1994-06-30 1995-06-29 Boitier opto-electronique et emetteur-recepteur optique bidirectionnel s'utilisant a l'interieur de celui-ci WO1996000920A1 (fr)

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US26930694A 1994-06-30 1994-06-30
US08/269,306 1994-06-30

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WO1996000920A1 true WO1996000920A1 (fr) 1996-01-11

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012271A1 (fr) * 1995-09-29 1997-04-03 The Whitaker Corporation Sous-module de liaison bidirectionnel a diviseur de faisceaux holographique
WO1997034428A2 (fr) * 1996-03-13 1997-09-18 Northern Telecom Limited Architecture de commutation
WO1998050809A1 (fr) * 1997-05-06 1998-11-12 Ascom Tech Ag Dispositifs d'injection et d'extraction pour guides d'ondes dans un reseau de telecommunication
US5933551A (en) * 1995-09-29 1999-08-03 The Whitaker Corp. Bidirectional link submodule with holographic beamsplitter
EP1151454A1 (fr) * 1999-01-11 2001-11-07 Lightlogic, Inc. Ensemble opto-electronique
WO2002029464A1 (fr) * 2000-10-05 2002-04-11 Alcatel Structure interne a faible contrainte pour boitier optoelectronique
WO2004049022A2 (fr) * 2002-11-26 2004-06-10 Hymite A/S Boitier optique a lentille integree et ensembles optiques comprenant le boitier
WO2004072702A1 (fr) * 2003-02-12 2004-08-26 Fibre Optic Lamp Company Limited Composant d'affichage, lampe et son procede de production
WO2013059731A1 (fr) * 2011-10-19 2013-04-25 Cisco Technology, Inc. Couvercle de verre moulé pour conditionnement horizontal de tranche d'ensembles optoélectroniques

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FR2509479A1 (fr) * 1981-07-10 1983-01-14 Thomson Csf Dispositif d'emission-reception d'energie radiante et systeme de liaison bidirectionnelle par fibre optique comprenant un tel dispositif
FR2549243A1 (fr) * 1983-06-24 1985-01-18 Lyonnaise Transmiss Optiques Coupleur directif a composants associes pour ondes lumineuses
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WO1997012271A1 (fr) * 1995-09-29 1997-04-03 The Whitaker Corporation Sous-module de liaison bidirectionnel a diviseur de faisceaux holographique
US5933551A (en) * 1995-09-29 1999-08-03 The Whitaker Corp. Bidirectional link submodule with holographic beamsplitter
WO1997034428A2 (fr) * 1996-03-13 1997-09-18 Northern Telecom Limited Architecture de commutation
WO1997034428A3 (fr) * 1996-03-13 1997-11-06 Northern Telecom Ltd Architecture de commutation
WO1998050809A1 (fr) * 1997-05-06 1998-11-12 Ascom Tech Ag Dispositifs d'injection et d'extraction pour guides d'ondes dans un reseau de telecommunication
EP1151454A1 (fr) * 1999-01-11 2001-11-07 Lightlogic, Inc. Ensemble opto-electronique
EP1151454A4 (fr) * 1999-01-11 2005-02-16 Lightlogic Inc Ensemble opto-electronique
WO2002029464A1 (fr) * 2000-10-05 2002-04-11 Alcatel Structure interne a faible contrainte pour boitier optoelectronique
FR2815138A1 (fr) * 2000-10-05 2002-04-12 Cit Alcatel Structure interne a faible contrainte pour boitier optoelectrique
US6736554B2 (en) 2000-10-05 2004-05-18 Avanex Corp. Low-stress internal structure for optoelectronic housing
WO2004049022A3 (fr) * 2002-11-26 2004-08-12 Hymite As Boitier optique a lentille integree et ensembles optiques comprenant le boitier
WO2004049022A2 (fr) * 2002-11-26 2004-06-10 Hymite A/S Boitier optique a lentille integree et ensembles optiques comprenant le boitier
US6969204B2 (en) 2002-11-26 2005-11-29 Hymite A/S Optical package with an integrated lens and optical assemblies incorporating the package
CN100383574C (zh) * 2002-11-26 2008-04-23 许密特有限公司 带有集成透镜的封装和包括该封装的组件
WO2004072702A1 (fr) * 2003-02-12 2004-08-26 Fibre Optic Lamp Company Limited Composant d'affichage, lampe et son procede de production
WO2013059731A1 (fr) * 2011-10-19 2013-04-25 Cisco Technology, Inc. Couvercle de verre moulé pour conditionnement horizontal de tranche d'ensembles optoélectroniques
CN104220914A (zh) * 2011-10-19 2014-12-17 思科技术公司 用于光电组件的晶圆级封装的模制玻璃盖
US9052445B2 (en) 2011-10-19 2015-06-09 Cisco Technology, Inc. Molded glass lid for wafer level packaging of opto-electronic assemblies
US20150277068A1 (en) * 2011-10-19 2015-10-01 Cisco Technology, Inc. Molded glass lid for wafer level packaging of opto-electronic assemblies
US9575266B2 (en) 2011-10-19 2017-02-21 Cisco Technology, Inc. Molded glass lid for wafer level packaging of opto-electronic assemblies

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