EP2502105A2 - Procédé de fabrication d'un ensemble optique, ensemble optique et cascade de séparateurs - Google Patents

Procédé de fabrication d'un ensemble optique, ensemble optique et cascade de séparateurs

Info

Publication number
EP2502105A2
EP2502105A2 EP10785338A EP10785338A EP2502105A2 EP 2502105 A2 EP2502105 A2 EP 2502105A2 EP 10785338 A EP10785338 A EP 10785338A EP 10785338 A EP10785338 A EP 10785338A EP 2502105 A2 EP2502105 A2 EP 2502105A2
Authority
EP
European Patent Office
Prior art keywords
optical
splitter
outputs
cascade
output
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10785338A
Other languages
German (de)
English (en)
Inventor
Ludwig Ross
Stefan Kufner
Maria Kufner
Wolfgang Foss
Marco Bock
Frank BÄTZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Kabel GmbH
Original Assignee
Leoni Kabel Holding GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leoni Kabel Holding GmbH filed Critical Leoni Kabel Holding GmbH
Publication of EP2502105A2 publication Critical patent/EP2502105A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Definitions

  • the invention relates to a system and a method for producing an optical assembly with an optical component, in particular a passive component, such as a splitter.
  • the invention further relates to such an optical assembly and in particular a so-called splitter cascade, that is, a number of matched splitter.
  • splitters When distributing an optical data signal to a plurality of consumers, so-called splitters are used as passive optical components. These divide the optical signal fed into the component via an optical waveguide to a plurality of outputs at which it is fed back into outgoing optical waveguides.
  • One application is, for example, the distribution of an optical signal or a fiber optic cable in the area of the end user to several households. In particular, it is often provided that at the same time a residual signal is looped through and fed to a further splitter in which a further splitting then takes place to supply further end consumers.
  • splitter cascade In the case of a plurality of splitters connected in this manner, in which a part of the outputs are designed as consumer outputs and one of the outputs is provided for looping through the residual signal to the following splitter, this is referred to as a splitter cascade.
  • optical components are sometimes referred to as "chips" based on the name for electrical components.
  • an optical waveguide structure is usually applied to a carrier substrate, in particular to a specially suitable glass. This is done, for example, by masking with other
  • CONFIRMATION COPY closing ion exchange process so that in the uncovered areas to generate the optical tracks ions penetrate into the glass substrate.
  • Other deposition techniques such. B. CVD (chemical vapor deposit- on) can also be used.
  • the chips formed as planar components typically have a length, for example in the range between 10 mm and 60 mm.
  • the individual tracks on the output side are usually arranged in a predetermined grid to one another, wherein the grid is, for example, 125 pm (more precisely 127 pm) or 250 pm or a multiple thereof.
  • the coupling of the input side and the output side optical fiber is associated with great effort and make up a large part of the manufacturing costs.
  • the invention is therefore based on the object to enable the most efficient production of an optical assembly with such an optical component.
  • the object is solved by the independent claims.
  • claim 1 it is provided in the production of the optical assembly that in a first step on a common wafer (carrier substrate) in particular several components are formed simultaneously and in this case the respective optical conductor pattern of the device are generated.
  • this is usually a branching track which branches from an input on an input side to at least two, and preferably several, outputs on an output side.
  • the optical fibers are then coupled to the respective inputs and / or outputs simultaneously to a plurality of components, preferably all of the components formed on the common wafer, before the individual components are finally separated from one another in a third step.
  • the coupling of the optical fibers does not take place to the individual components but to the entirety of the interconnected components, so that in each case only for a plurality of connections between the individual outputs and / or the inputs and the fibers to be connected a coupling process is provided.
  • the individual printed conductors on the wafer are aligned with high precision on account of the preferably lithographic structuring and thus simultaneous simultaneous coupling of the optical fibers is made possible.
  • the optical fibers are located in a common connection carrier, the so-called input or output fiber array.
  • the fibers for positionally accurate arrangement in longitudinal grooves, in particular arranged in so-called V-notches.
  • This connection carrier is furthermore expediently designed in two parts, that is to say it has a division plane.
  • the longitudinal grooves are incorporated on an upper side and are covered by means of a second part, a cover part.
  • the fibers are usually fixed in the grooves by an adhesive introduced into the remaining free space.
  • the connection carrier has a planar connection side with which it is coupled in a planar manner to a likewise planar common connection side of the components.
  • the connection carrier is a total of cuboid, for example.
  • the optical fibers are coupled to opposite end faces of the components by means of a respective connection carrier. Both on the input and the output side, optical fibers are therefore coupled in this preferred embodiment.
  • a 3-inch wafer is used with a diameter of about 7.5 cm, on the same time several optical components are formed.
  • connection carrier Before the coupling of the input or output fiber array (connection carrier), the wafer is preferably treated so that a flat input-side connection side and a flat output-side connection side are formed.
  • the input fiber array or the output fiber array is then coupled to these flat connection sides. This is done for example by gluing with a suitable adhesive.
  • the juxtaposed end faces on the one hand of the wafer and on the other hand of the connection carrier are preferably polished for the best possible coupling.
  • the components are designed in particular as splitter and the conductor pattern has one or more input-side conductor tracks, which, for example, first combine to form a common conductor track and then branch off into a plurality of output-side conductor tracks.
  • the conductor track pattern is designed in such a way that the overall intensity of an optical signal applied during operation on the input side is defined, that is, it is divided according to a desired, set ratio onto the output-side conductor tracks. In particular, an equal distribution is provided.
  • the splitters are generally designed as MxN splitters, where M is the number of inputs and N is the number of outputs.
  • a plurality and preferably all of the optical components on the wafer are matched to one another in order to form a splitter cascade together.
  • the patterning and production of the printed conductors on the individual components takes place in such a way that a defined distribution of the intensity of an optical signal applied during operation takes place, in particular in such a way that the consumer output gene respectively the same optical intensity of the signal is applied.
  • the splitter are therefore preferably formed asymmetrically.
  • asymmetric design is meant that the intensity distribution from the input to the outputs is asymmetrical to provide a loop-through output adjacent to consumer outputs.
  • Y-branches are usually formed. At the first branch, the signal is branched asymmetrically onto a conductive loop trace and a consumer trace. The signal of the consumer track is then preferably divided symmetrically by further subsequent Y branches.
  • the total number of outputs is odd.
  • an even number of consumer outputs are therefore preferably provided, for example two or four.
  • several loop-through outputs can be provided. Only in the last splitter of the splitter cascade is preferably no loop-through output provided, but only consumer outputs.
  • the asymmetrical distribution of the intensity (at the first branch point) is effected by a corresponding configuration of the geometrical dimensions of the printed conductors produced, i. the asymmetrical intensity distribution is such that the two outgoing interconnects of the Y branch have a different diameter.
  • the intensity ratio also referred to as the split ratio, can be set during operation.
  • this intensity ratio (split ratio at the first branch point) is set such that, for a given splitter cascade with a predetermined number of splits and a predetermined number of subscriber / consumer outputs, the split ratio in each splitter is different, and preferably such, the same optical intensity is present at each subscriber output (in each case the same percentage of the input intensity at the first splitter).
  • an optical assembly having the features of claim 12.
  • This comprises an optical component element, in particular a splitter to which a connection carrier with optical fibers is coupled on at least one connection side.
  • the optical component and the connection carrier have two opposite, common cut edges, ie the two opposite, parallel side edges of the optical assembly are formed as cut surfaces according to the manufacturing method described above.
  • the side surfaces of the connection carrier are aligned with those of the optical component and form with them a continuous planar surface.
  • the optical module on the output side has a particularly standardized multifiber plug. This is preferably coupled to the connection carrier. This facilitates the installation of such an optical assembly on site, since the contact can be made easily via a standardized connector.
  • a plurality of such optical assemblies are combined into a splitter cascade according to claim 15.
  • FIG. 1A shows a wafer on which a plurality of optical components are formed and on the input side and output side in each case a connection carrier is coupled, which forms a fiber array
  • FIG. 1B shows a number of optical assemblies made by separating the wafer shown in FIG. 1A with terminal beams along the cut marks shown therein;
  • FIG. 2 shows a representation similar to FIG. 1A, wherein the optical components are rotated alternately by 180 °,
  • Fig. 3 is a simplified representation of a splitter cascade with a total of four designed as splitter optical components and a total of sixteen consumer outputs (subscriber outputs), and
  • FIG. 4 shows an optical subassembly with an optical component designed as a splitter in which fiber coupling takes place only on a single end face and an optical deflecting element, in particular designed as a gradient lens, is arranged on the opposite end face.
  • a multiplicity of optical components designed as splitter 4 in the exemplary embodiment are first produced on a planar wafer 2, that is to say on a carrier substrate, in particular glass. These are also referred to as "chips" (planar optical waveguide chips). For this purpose, in each case one printed conductor pattern 6 is produced on the wafer 2 for each splitter 4. This is done in a manner known per se.
  • the structuring of the printed conductor pattern 6 preferably takes place via lithography via a masking process
  • the region of the printed conductor pattern 6 is doped with special ions, ie ions penetrate into the carrier substrate .
  • Wafer 2 is usually a planar wafer. so that a total of planar optical waveguide structures are formed.
  • a wafer 2 is formed with a plurality of monolithically integrated chips 4. These are lined up with each other.
  • the splitter 4 extend in each case in a longitudinal direction in which the conductor track pattern 6 extends.
  • the conductor pattern 6 extends from an input-side terminal side 8A to an output-side terminal side 8B.
  • the conductor track pattern 6 has an input-side conductor track which branches off at a first branch point into a loop-through track and a supply track, the supply track subsequently branching off via further branch points onto a plurality of consumer tracks, which then lead to consumer outputs 12A.
  • the loop-through conductor ends on the output side at a loop-through output 12B.
  • the branch points are each Y branches.
  • the ratio between the loop-through conductor and the supply conductor track set at the first branching point is referred to below as the split ratio. This therefore indicates the ratio as to how the intensity I of an input signal coupled to the optical signal is distributed on the loop-through conductor on the one hand and the consumer printed conductors on the other hand.
  • the wafer 2 forms on the connection sides 8A.8B in each case a completely plane and rectilinearly extending plane. This is done in particular by a special processing of the wafer 2, for example by cutting and / or polishing.
  • a wafer 2 thus prepared with the integrated multiple splitter 4 is coupled, at least on one connection side 8A.8B, preferably on both connection sides 8A.8B, to a common connection carrier 16 for all splitter 4, for example by gluing with a suitable adhesive.
  • the common connection carrier 16 in each case has optical waveguide fibers 18 on, which are positioned in the connection carrier 16 in such a way that they are aligned exactly aligned with the associated outputs 12A.12B and inputs 10 of all splitter 4.
  • the fibers 18 are arranged in the same pitch as the inputs 10 and outputs 12A.B on the wafer 2.
  • connection supports 16 for example also made of glass or plastic, are preferably formed in two parts and separated in a horizontal dividing plane into two halves.
  • V-shaped grooves or notches are preferably incorporated in one of these two parts, into which the fibers 18 are respectively inserted.
  • the two mold halves of the connection carrier 16 are connected to each other by inserting the fibers 18, for example by gluing.
  • connection carrier 16 is fastened to a wafer 2 with a multiplicity of chips 4 on the opposite connection sides 8A.8B, so that the optical components Fibers 18 are coupled.
  • this unit is separated to form individual optical assemblies 20 along cut marks 22, for example by means of a laser or a wafer saw, etc.
  • the individual optical assemblies 20 are obtained, as shown in FIG. 1B. Their long edges are therefore formed as cut edges 23, so the result of the separation process.
  • the particular advantage of this manufacturing method is the fact that with a common connection carrier 16 for a plurality of optical components (splitter 4) takes place in a cost-effective and simple manner, the coupling of the optical fibers 18 with high precision.
  • the design and arrangement of the individual splitter 4 on the wafer 2 can be selected within wide ranges. It is crucial that the optical Components are arranged such that only a maximum of two connection carrier 16 on opposite terminal sides 8A, 8B are required to couple all inputs 10 and outputs 12A, B to fibers 18.
  • Splitter 4 of a splitter cascade 24, as shown by way of example in FIG. 3, is preferably formed with this method. For the sake of simplicity, only the splitter 4 without connection carrier 16 are shown here in each case.
  • the intensity I present at the input 10 of the first splitter 4 is generally divided into a plurality of consumer outputs 12 A provided by a plurality of splitter 4 of the splitter cascade 24.
  • four splitter 4 are exemplified. In principle, more or fewer splinters can also be combined to form a splitter cascade 24.
  • the embodiment of Fig. 3 is a 1x5 splitter, i. an input 10 is split into five outputs 12A.12B, respectively. Only the last splitter has only four consumer outputs 12A. As can be seen, the respective loop-through output 12B is connected to the input 10 of the subsequent splitter 4.
  • the first branch point in the respective splitter 4 defines the split ratio.
  • the individual split ratios of the splitter 4 are given by way of example in each case. In the embodiment of FIG. 3, these split ratios are selected such that all the consumer outputs 12A are supplied in operation with the same proportion of the total intensity ⁇ - ⁇ of the optical signal applied to the input 10 of the first splitter 4. In the exemplary embodiment, a total of sixteen consumer outputs 12A are provided, so that each consumer output 12A accounts for one-sixteenth of the total intensity. To achieve this, the split ratios in the individual splitter 4 are chosen differently.
  • the split ratio can also be chosen differently.
  • the split ratios are set such that the same intensity is present at each consumer output 12A of the entire splitter cascade 24.
  • all splinters 4 of a splitter cascade 24 are formed on a common wafer 2 in the manufacturing process and formed with the connection carriers 16 and the optical fibers 18 contained therein.
  • the optical fibers 18 extend through the respective connection carrier 16 and exit at its end opposite the splitter 4 as a fiber bundle (on the output side) or as a single fiber (on the input side).
  • the fiber 18 present at the loop-through output 12B is connected in a splinter cascade 24 to the input 10 of the following splitter 4, in particular via its input-side connection carrier 16.
  • the optical assembly 20 has a connection carrier 16 with optical fibers 18 both on the input side and on the output side.
  • a connection carrier 16 is provided on only one side. This is primarily for a particularly compact design of the optical assembly 20 is advantageous.
  • connection carrier 16 opposite end of the here also formed as a splitter 4 optical component instead of a provided with fibers 18 connection carrier, in particular designed as a lens deflection element 26 is provided. This is preferably a so-called gradient lens. All coupled to fibers 18 inputs 10 and outputs 12A are applied only to one end face of the optical device 4, so that only on one side of a one-sided fiber coupling is required.
  • a multifiber plug 28 is additionally coupled to the connection carrier 16, which is standardized in terms of its properties, such as pitch, connector technology, etc.
  • the multi-fiber plug 28 allows the connection of a fiber bundle via a likewise standardized connector designed for this purpose. In that regard, a simple connection of an entire fiber bundle is possible.
  • the multi-fiber plug 28 forms, together with the optical component 4, the connection carrier 16 and the deflecting element 26, the optical assembly 20, which is arranged as such in a housing 30.
  • the multi-fiber plug 28 is accessible from an outside to allow a connector. In the housing 30, a plurality of such optical assemblies 20 may be arranged, which are each connected via a separate multi-fiber plug 28.
  • the method described here for producing an optical assembly 20 is used in particular for the cost-effective production and design of branching components in fiber-optic transmission systems, which replace more and more conventional copper-wire-based transmission systems in the future. Therefore, the Verzweigerkomponenten needed in ever-increasing quantities, which requires a rational and cost-effective production. There is also the associated requirement of a compact design and low installation costs.
  • the branching components are typically placed near the end users, for example, comparable to power distribution boxes in the power supply.
  • a prefabricated optical subassembly 20 which is inexpensive to produce is provided as a splitter component (splitter 4 or splitter cascade 24) which can be used locally at the distribution point (distribution box) with only minimal assembly effort.
  • splitter 4 or splitter cascade 24 splitter 4 or splitter cascade 24
  • the majority of the optical components 4 are formed on a common wafer 2 and adjusted to each other with high (lithographic) accuracy. With a common connection carrier 16 (preferably both input and output side) all optical components 4 are simultaneously coupled at one time.
  • all necessary for a splitter cascade 24 splitter 4 are arranged on a common wafer 2.
  • each splitter 4 inserted in the splitter cascade 24 has a different asymmetrical split ratio.
  • these are formed within the connection carrier 16 in a V-pit array.
  • the V-pits in the connection carrier 16 are formed continuously in accordance with the grid dimension of the tracks of the optical component 4, wherein only the V-groups are occupied, to which an input 10 or an output 12A.12B is assigned.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L'invention vise à fabriquer à faible coût un ensemble optique (2), conçu notamment comme élément séparateur et comportant par conséquent un séparateur (4) en tant que composant optique passif. A cet effet, dans une première étape, plusieurs séparateurs (4) sont créés sur une plaquette commune (2) par formation d'une figure de pistes conductrices (6) correspondante, dans une deuxième étape, des fibres optiques (18) sont simultanément couplées aux faces de connexion (8A,8B) de chaque séparateur (4) au moyen d'un support de connexion (16), enfin, dans une troisième étape, les séparateurs (4) individuels avec les supports de connexion (16) raccordés sont séparés les uns des autres. Une seule opération de couplage commune est nécessaire pour une pluralité de séparateurs (4). Les séparateurs (4) forment de préférence une cascade de séparateurs (24).
EP10785338A 2009-11-16 2010-11-15 Procédé de fabrication d'un ensemble optique, ensemble optique et cascade de séparateurs Withdrawn EP2502105A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009053056 2009-11-16
PCT/EP2010/006930 WO2011057811A2 (fr) 2009-11-16 2010-11-15 Procédé de fabrication d'un ensemble optique, ensemble optique et cascade de séparateurs

Publications (1)

Publication Number Publication Date
EP2502105A2 true EP2502105A2 (fr) 2012-09-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP10785338A Withdrawn EP2502105A2 (fr) 2009-11-16 2010-11-15 Procédé de fabrication d'un ensemble optique, ensemble optique et cascade de séparateurs

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US (1) US9069134B2 (fr)
EP (1) EP2502105A2 (fr)
WO (1) WO2011057811A2 (fr)

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Publication number Priority date Publication date Assignee Title
US20140153870A1 (en) * 2012-12-05 2014-06-05 MiMetrix Design Group, L.L.C. Monolithic splitter assembly
DE102013013071B3 (de) 2013-08-06 2014-10-09 Leoni Kabel Holding Gmbh Optischer Koppler
US9557498B2 (en) 2014-12-19 2017-01-31 Commscope Technologies Llc Dust caps having coding system for facilitating installing a fiber optic network
EP3482241A1 (fr) 2016-07-08 2019-05-15 CommScope Connectivity Belgium BVBA Séparateur de fibres et module de connexion
JP7070244B2 (ja) * 2018-08-27 2022-05-18 日本電信電話株式会社 光通信システム及び光通信方法
EP3736613B1 (fr) * 2019-03-04 2022-11-30 Huawei Technologies Co., Ltd. Puce de diviseur optique, ensemble diviseur optique, dispositif de diviseur optique et enveloppe de fibre optique
US12019288B2 (en) 2021-04-30 2024-06-25 Huawei Technologies Co., Ltd. Optical power distribution system
US20230063481A1 (en) * 2021-09-01 2023-03-02 Mellanox Technologies, Ltd. Intelligent Wafer-Level Testing of Photonic Devices

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US6236784B1 (en) * 1998-08-10 2001-05-22 Hitachi, Ltd. Y branching optical waveguide and optical integrated circuit
US7391954B1 (en) * 2007-05-30 2008-06-24 Corning Cable Systems Llc Attenuated optical splitter module
WO2008092825A1 (fr) * 2007-01-31 2008-08-07 Ccs Technology, Inc. Diviseur optique asymétrique

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US4953935A (en) * 1989-03-27 1990-09-04 United Technologies Corporation Integrated optic star coupler
JP3970350B2 (ja) * 1996-02-23 2007-09-05 株式会社フジクラ 光分岐デバイス
US20030059158A1 (en) * 2001-09-26 2003-03-27 Jonathan Lacey Broadcast network using multi-fiber cable
US8447157B2 (en) * 2005-06-24 2013-05-21 3M Innovative Properties Company Optical device with cantilevered fiber array and method

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Publication number Priority date Publication date Assignee Title
US6236784B1 (en) * 1998-08-10 2001-05-22 Hitachi, Ltd. Y branching optical waveguide and optical integrated circuit
WO2008092825A1 (fr) * 2007-01-31 2008-08-07 Ccs Technology, Inc. Diviseur optique asymétrique
US7391954B1 (en) * 2007-05-30 2008-06-24 Corning Cable Systems Llc Attenuated optical splitter module

Also Published As

Publication number Publication date
US9069134B2 (en) 2015-06-30
WO2011057811A3 (fr) 2011-07-07
WO2011057811A2 (fr) 2011-05-19
US20120237161A1 (en) 2012-09-20

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