WO1998049875A1 - Procede de fixation d'objets metalliques sur une carte a circuits imprimes - Google Patents

Procede de fixation d'objets metalliques sur une carte a circuits imprimes Download PDF

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Publication number
WO1998049875A1
WO1998049875A1 PCT/US1998/004013 US9804013W WO9849875A1 WO 1998049875 A1 WO1998049875 A1 WO 1998049875A1 US 9804013 W US9804013 W US 9804013W WO 9849875 A1 WO9849875 A1 WO 9849875A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
flange
solder paste
metallic
Prior art date
Application number
PCT/US1998/004013
Other languages
English (en)
Inventor
Patrick Masterton
Original Assignee
Motorola Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc. filed Critical Motorola Inc.
Priority to BR9807963-8A priority Critical patent/BR9807963A/pt
Priority to JP54695498A priority patent/JP2001522532A/ja
Publication of WO1998049875A1 publication Critical patent/WO1998049875A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to soldering components, and more specifically, to soldering metallic objects to printed circuit boards.
  • PCB Printed Circuit Board
  • the soldering process of the prior art has at least two problems.
  • the first problem is that voids are created between the attaching surfaces of the metallic flange and the PCB.
  • the second problem is that, in order to properly solder the metallic flange and other components to the PCB, at least two steps of heating are required.
  • the first heating step only the flange is soldered to the PCB.
  • the second heating step other smaller components are soldered to the PCB with solder having a low melting temperature.
  • the low melting temperature of the solder in the second step allows application of heat to the PCB for a second time without reflowing the solder used in the first step. Nevertheless, the first application of heat at high temperature to the PCB burns a solder resist layer on the top layer of the PCB.
  • this second step is not only an excessive step, but is also inefficient and/or ineffective.
  • solder 1 is comprised of placing, between a flange 102 and a PCB 103, a thin layer of solder 101 which is performed to the actual shape and size of the flange. Next, heat is applied to flange 102 and PCB 103 until performed solder 101 is melted between the surfaces of PCB 103 and flange 102. When this soldering method is used, however, voids are created between PCB 103 and flange 102. Voids are created because a solder flux component of solder 101 converts to gas before a solder alloy in solder 101 melts. The created gas traps between the surfaces of PCB 103 and flange 102 and creates the voids. The end result is that a uniform solder attachment is prevented which gready compromises the electrical grounding properties and conduction of heat away from the power amplifier attached to flange 102.
  • FIG. 1 generally depicts the soldering process of the prior art.
  • FIG. 2 generally depicts attachment of a flange and a PCB having apertures, according to an embodiment of the present invention.
  • FIG. 3 generally depicts an aperture that has been filled with solder paste before the heating process, according to an embodiment of the present invention.
  • FIG. 4 generally depicts the aperture shown in FIG. 3 after the heating process, according to an embodiment of the present invention.
  • the Preferred Embodiment of the Present Invention is the Preferred Embodiment of the Present Invention
  • a single-step heating application for soldering a metallic flange and other components to a printed circuit board includes one or more through apertures where solder paste is dispensed, and is heated with the metallic flange and otiier components.
  • the apertures holding the solder paste have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where die surfaces of the flange and the printed circuit board are being soldered.
  • a printed circuit board having a first and second side and at least one aperture for holding solder paste and a metallic flange coupled to the second side of the printed circuit board by the solder paste which is flushed out of die aperture during heating of the printed circuit board and die flange.
  • the aperture of d e printed circuit board is covered with a non-metallic surface which allows the solder paste to be flushed out during heating.
  • the first side of the printed circuit board includes a rim around the aperture, the rim being comprised of a non-metallic material which prevents die solder paste from attaching to a component near the rim.
  • printed circuit board has a plurality of apertures which are circular, the apertures can either have substantially die same diameter or substantially different diameters.
  • a mediod of soldering a metallic flange to a printed circuit board includes the steps of dispensing solder paste into an aperture located on the printed circuit board, where the printed circuit board has a first and second side.
  • the flange is coupled to the second side of the printed circuit board and the printed circuit board and d e attached flange are dien heated such that the solder paste within the aperture is melted and wicked between die second side of the printed circuit board and die metallic flange.
  • the method further includes the step of coupling, prior to die step of heating, components to the first side of the printed circuit board with die solder paste such that die components are also attached to die printed circuit board after d e step of heating.
  • An apparatus is manufactured utilizing die steps of dispensing solder paste into an aperture located on die printed circuit board, where die printed circuit board has a first and second side.
  • the flange is coupled to the second side of the printed circuit board, and die printed circuit board and die attached flange are ien heated such diat die solder paste within die aperture is melted and wicked between d e second side of die printed circuit board and die metallic flange.
  • FIG. 2 generally depicts attachment of a metallic flange 202 and a printed circuit board (PCB) 201 having apertures 203 in accordance with the invention.
  • PCB 201 has several apertures 203 in the area where flange 202 is attached.
  • apertures 203 are circular and each have substantially die same diameter.
  • die apertures can be of substantially different diameters or can also be in any particular shape.
  • Apertures 203 have no metallic surfaces at ti eir rim or d e walls of dieir cavity and are drilled to penetrate PCB 201 from a first side 204 to a second side 205 to which metallic flange 202 is attached.
  • a solder resist is applied such that die solder is not attached to die rim or surrounding area, or to otiier components near apertures 203, during the heating process.
  • the process of attaching metallic flange 202 to PCB 201 begins by coupling flange 202 to PCB 201 through any number of processes, for example, either a clamp, press fit or a chemical attachment such as glue. Then, with reference to FIG. 3, apertures 203 are filled with solder paste 305. Solder paste 305 can be put into apertures 203 first, then PCB 201 can be coupled to metallic flange 202 in an alternate embodiment. Solder paste 305 essentially comprises a solder alloy and solder flux which melts before die solder alloy in solder paste 305. Heat is then applied such tiiat solder paste 305 melts and wicks into a gap 306 between PCB 201 and metallic flange 202. As shown in FIG.
  • solder paste 305 is essentially flushed from apertures 203.
  • solder paste 305 dispensed in apertures 203 is melted to flow down apertures 203 and move to gap 306 between flange 202 and PCB 201.
  • Any gas generated from flux escapes via the sides of PCB 201 or first side 204 of PCB 201 at apertures 203. As such, the gas from die flux is not trapped, and a uniform solder attachment is formed between PCB 201 and flange 202 as shown in FIG. 4 in accordance with die invention.
  • solder resist 304 on first side 204 of PCB 201 is placed at the rim of apertures 203 and the apertures 203 tiiemselves are covered witii a non-metallic surface which allows solder paste 305 to be flushed out during die heating process.
  • the dispensing of solder paste 305 is done at normal temperature and die melting of solder paste 305 begins without excessive heat application, which prevents a substantial rise in temperature above the melting point of solder paste 305. Therefore, other components, for example component 309, can be attached to first side 204 of PCB 201 by attaching component 309 with solder paste 305 and heating component 309, PCB 201 and metallic flange 202 with a single step in accordance with invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une application de chaleur en une seule opération permettant de souder une semelle métallique (202) et d'autres composants (309) sur une carte (201) à circuits imprimés. La carte (201) comprend un ou plusieurs orifices (203) de passage à travers lesquels une soudure en pâte (309) est appliquée et est chauffée avec la semelle métallique (202) et les autres composants (309). Les orifices (203) contenant de la soudure en pâte (305) présentent des parois à surfaces non métalliques où la soudure est repoussée pendant le chauffage de façon à ce que la soudure s'écoule vers une zone où les surfaces de la semelle métallique (202) et la carte (201) à circuits imprimés sont soudées.
PCT/US1998/004013 1997-04-30 1998-03-02 Procede de fixation d'objets metalliques sur une carte a circuits imprimes WO1998049875A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
BR9807963-8A BR9807963A (pt) 1997-04-30 1998-03-02 Aparelho e método de soldagem de um flange metálico a uma placa de circuito impresso
JP54695498A JP2001522532A (ja) 1997-04-30 1998-03-02 プリント回路板に金属物を取り付ける方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US84636197A 1997-04-30 1997-04-30
US08/846,361 1997-04-30

Publications (1)

Publication Number Publication Date
WO1998049875A1 true WO1998049875A1 (fr) 1998-11-05

Family

ID=25297695

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/004013 WO1998049875A1 (fr) 1997-04-30 1998-03-02 Procede de fixation d'objets metalliques sur une carte a circuits imprimes

Country Status (4)

Country Link
JP (1) JP2001522532A (fr)
CN (1) CN1254493A (fr)
BR (1) BR9807963A (fr)
WO (1) WO1998049875A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027632C2 (nl) * 2004-12-01 2006-06-02 Electrische App Nfabriek Capax Drager voor elektrische componenten met aangesoldeerd koellichaam.
EP1671524A2 (fr) * 2003-10-02 2006-06-21 Motorola, Inc. Appareil a circuit electrique, et procede d'assemblage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10126655A1 (de) * 2001-06-01 2002-12-05 Endress & Hauser Gmbh & Co Kg Leiterplatte mit mindestens einem elektronischen Bauteil
CN104741725B (zh) * 2013-12-27 2017-03-22 博世汽车部件(苏州)有限公司 一种焊接工具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492311A (ja) * 1990-08-06 1992-03-25 Fujikura Ltd 予備はんだ付きフラットケーブル及びその製造方法
JPH06152092A (ja) * 1992-11-10 1994-05-31 Murata Mfg Co Ltd 表面実装型基板アセンブリ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0492311A (ja) * 1990-08-06 1992-03-25 Fujikura Ltd 予備はんだ付きフラットケーブル及びその製造方法
JPH06152092A (ja) * 1992-11-10 1994-05-31 Murata Mfg Co Ltd 表面実装型基板アセンブリ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1671524A2 (fr) * 2003-10-02 2006-06-21 Motorola, Inc. Appareil a circuit electrique, et procede d'assemblage
EP1671524A4 (fr) * 2003-10-02 2009-08-05 Motorola Inc Appareil a circuit electrique, et procede d'assemblage
NL1027632C2 (nl) * 2004-12-01 2006-06-02 Electrische App Nfabriek Capax Drager voor elektrische componenten met aangesoldeerd koellichaam.
WO2006059907A2 (fr) * 2004-12-01 2006-06-08 Electrische Apparatenfabriek Capax B.V. Support pour composants electriques sur lequel un corps de refroidissement est brase
WO2006059907A3 (fr) * 2004-12-01 2006-11-30 Capax Bv Electrische Apparatenfabriek Support pour composants electriques sur lequel un corps de refroidissement est brase

Also Published As

Publication number Publication date
JP2001522532A (ja) 2001-11-13
BR9807963A (pt) 2000-03-08
CN1254493A (zh) 2000-05-24

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