WO1998042167A3 - Verfahren und vorrichtung zum vermessen einer einrichtung zur herstellung von elektrischen baugruppen - Google Patents

Verfahren und vorrichtung zum vermessen einer einrichtung zur herstellung von elektrischen baugruppen Download PDF

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Publication number
WO1998042167A3
WO1998042167A3 PCT/DE1998/000759 DE9800759W WO9842167A3 WO 1998042167 A3 WO1998042167 A3 WO 1998042167A3 DE 9800759 W DE9800759 W DE 9800759W WO 9842167 A3 WO9842167 A3 WO 9842167A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical components
scales
measuring
producing electrical
markings
Prior art date
Application number
PCT/DE1998/000759
Other languages
English (en)
French (fr)
Other versions
WO1998042167A2 (de
Inventor
Stefan Huettner
Ekkard Mische
Werner Mueller
Original Assignee
Siemens Ag
Stefan Huettner
Ekkard Mische
Werner Mueller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Stefan Huettner, Ekkard Mische, Werner Mueller filed Critical Siemens Ag
Publication of WO1998042167A2 publication Critical patent/WO1998042167A2/de
Publication of WO1998042167A3 publication Critical patent/WO1998042167A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Abstract

Eine Testplatte (1) wird in einen Bestückautomaten zum Bestücken von Leiterplatten mit elektrischen Bauelementen an definierten Stellen mit transparenten Nachbildungen (4) solcher Bauelemente bestückt. Die Nachbildungen sind mit skalenartigen Markierungen (5) versehen. Die Testplatte weist zu diesen Skalen parallele Skalen von Referenzmarken (3) auf, die sich mit den Markierungen (4) überlappen. Die beiden noniusartigen Skalen ermöglichen ein genaues Ablesen der Skalenverschiebungen bei Abweichungen von der Ideallage.
PCT/DE1998/000759 1997-03-19 1998-03-13 Verfahren und vorrichtung zum vermessen einer einrichtung zur herstellung von elektrischen baugruppen WO1998042167A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19711480.6 1997-03-19
DE19711480 1997-03-19

Publications (2)

Publication Number Publication Date
WO1998042167A2 WO1998042167A2 (de) 1998-09-24
WO1998042167A3 true WO1998042167A3 (de) 1998-12-03

Family

ID=7823918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000759 WO1998042167A2 (de) 1997-03-19 1998-03-13 Verfahren und vorrichtung zum vermessen einer einrichtung zur herstellung von elektrischen baugruppen

Country Status (1)

Country Link
WO (1) WO1998042167A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602004008212T2 (de) * 2004-02-20 2007-12-20 Research In Motion Ltd., Waterloo Testplatte für die Oberflächenmontagetechnologie
US6888360B1 (en) 2004-02-20 2005-05-03 Research In Motion Limited Surface mount technology evaluation board having varied board pad characteristics
CN106660715B (zh) 2014-06-11 2020-07-24 环球仪器公司 用于建立、验证并/或管理准确性的测试装置
CN106769146B (zh) * 2016-12-26 2023-09-19 东莞市敏通三防化工科技有限公司 三防漆涂覆精度检测板及其检测方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776088A (en) * 1987-11-12 1988-10-11 The United States Of America As Represented By The United States Department Of Energy Placement accuracy gauge for electrical components and method of using same
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
EP0463457A2 (de) * 1990-06-22 1992-01-02 International Business Machines Corporation Verfahren und Vorrichtung zur Feinausrichtung von Gegenständen
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
DE4227667A1 (de) * 1992-08-21 1994-02-24 Dietrich Dr Ing Reuse Mittel zur meßtechnischen Erfassung der Bestückgenauigkeit
US5537204A (en) * 1994-11-07 1996-07-16 Micron Electronics, Inc. Automatic optical pick and place calibration and capability analysis system for assembly of components onto printed circuit boards

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4776088A (en) * 1987-11-12 1988-10-11 The United States Of America As Represented By The United States Department Of Energy Placement accuracy gauge for electrical components and method of using same
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
EP0463457A2 (de) * 1990-06-22 1992-01-02 International Business Machines Corporation Verfahren und Vorrichtung zur Feinausrichtung von Gegenständen
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
DE4227667A1 (de) * 1992-08-21 1994-02-24 Dietrich Dr Ing Reuse Mittel zur meßtechnischen Erfassung der Bestückgenauigkeit
US5537204A (en) * 1994-11-07 1996-07-16 Micron Electronics, Inc. Automatic optical pick and place calibration and capability analysis system for assembly of components onto printed circuit boards

Also Published As

Publication number Publication date
WO1998042167A2 (de) 1998-09-24

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