WO1998024279A1 - Appareil de montage d'electronique et procede de production de cet appareil - Google Patents

Appareil de montage d'electronique et procede de production de cet appareil Download PDF

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Publication number
WO1998024279A1
WO1998024279A1 PCT/SE1997/001910 SE9701910W WO9824279A1 WO 1998024279 A1 WO1998024279 A1 WO 1998024279A1 SE 9701910 W SE9701910 W SE 9701910W WO 9824279 A1 WO9824279 A1 WO 9824279A1
Authority
WO
WIPO (PCT)
Prior art keywords
earth connection
carrier
capsule
topside
legs
Prior art date
Application number
PCT/SE1997/001910
Other languages
English (en)
Inventor
Leif Roland Bergstedt
Original Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson (Publ) filed Critical Telefonaktiebolaget Lm Ericsson (Publ)
Priority to AU52362/98A priority Critical patent/AU5236298A/en
Publication of WO1998024279A1 publication Critical patent/WO1998024279A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Definitions

  • the present invention relates to an apparatus for creating good earth connec- 5 tions for microwave circuits mounted on circuit boards, and a method for manufacturing such an apparatus.
  • Circuit capsules i.e. capsules which enclose electronic circuits and which are 0 provided with legs are fixed in accordance with known technology on a mounting substrate by connecting the capsule legs, which are fixed to the circuit capsules, to corresponding connecting surfaces on the mounting substrate.
  • Connecting surfaces on the mounting substrate can consist of an earth connec- 5 tion or a strip conductor on the mounting substrate.
  • Strip conductors are etched out of an upper layer in the mounting substrate. This upper layer is made of an electrically conducting material, such as copper. The strip conductors connect circuits to each other on the mounting substrate.
  • the circuit capsule also called the capsule, is connected by its legs to other circuits on the mounting substrate.
  • capsules containing microwave circuits also called microwave 30 capsules, which work at high frequencies, e.g. microwave transistors.
  • a known method of providing good contact to an earth connection is to manually mount a holder through a through-hole in a mounting substrate. The holder is fixed to the underside of the mounting substrate with a nut. The holder is thereby earthed against the carrier which is made of brass. The opposite portion of the holder, which protrudes somewhere from the top of the mounting substrate, consists of an earth connection. The microwave capsule is mounted with its corresponding legs against the earth connection of the holder.
  • Another known method is based on a carrier of brass, a protruding mounting surface for the microwave capsule being milled on the carrier.
  • a layer of PTFE PolyTetra-FluoroEthylene is laminated onto the carrier around the mounting surface, and the microwave capsule is mounted with its corresponding legs against the mounting surface, or the so-called earth connection area.
  • a disadvantage of this method is that it is complicated to apply and encompasses many work steps. Another disadvantage is that it is not possible to use a mounting substrate comprising a PTFE-layer prelaminated on the carrier, since the mounting surface must be exposed by milling on the carrier before the PTFE-layer is laminated on. DESCRIPTION OF THE INVENTION
  • the present invention addresses a problem of obtaining good contact between a leg, intended to be connected to an earth connection, of a microwave circuit capsule to a corresponding earth connection on a mounting substrate.
  • Another problem is, with a simple and reliable process, to mount a microwave circuit capsule on a mounting substrate so that the above mentioned good contact is obtained.
  • a purpose of the present invention is thus, with a simple and reliable device, to create a good contact between a leg of a microwave circuit capsule, also called a microwave capsule, against a corresponding earth connection on the mounting substrate.
  • An additional purpose is to achieve a process for manufacturing the device according to the above.
  • the present invention utilizes the shaping of surfaces from the lowermost layer in the mounting substrate, the so-called carrier, which is made of an electrically conducting material.
  • An apparatus comprises a microwave capsule mounted on said mounting substrate.
  • the mounting substrate comprises a car- rier made of an electrically conducting material, such as brass or copper, with an intermediate layer being fixed to the topside of the carrier.
  • a circuit recess is arranged through the intermediate layer, and the bottom of the circuit recess consists of a portion of the top-side of the carrier.
  • Earth connection areas are shaped from the carrier and protrude up through the circuit recess.
  • the micro- wave capsule is placed on top of the circuit recess and each of the legs of the microwave capsule, which are to be connected to an earth connection on the mounting substrate, are connected to a correspondingly shaped earth connection area.
  • the method involves milling a circuit recess in the mounting surface at the location where the microwave capsule is to be placed.
  • the bottom of the circuit recess consists of a portion of the top of the carrier.
  • the earth connection areas are shaped from the carrier so that they protrude up through the circuit recess.
  • the microwave capsule is thereafter mounted on the mounting substrate by connecting each of the legs of the microwave capsule to the corresponding connection area on the mounting substrate.
  • the legs which are to be connected to an earth connection on the mounting substrate are connected to a correspondingly shaped earth connection area.
  • One advantage of the present invention is that it always provides good contact between the legs of the microwave capsule and the earth connection areas, since the earth connection areas consist of the same material as the carrier and since they protrude up from the carrier.
  • Another advantage is that the manufacturing process is simple to apply and inexpensive as well, since the invention makes possible automatic mounting of the micro-wave capsule on the mounting substrate while maintaining good contact between the legs of the microwave capsule and the earth connection areas, and since no extra components, such as holders, are required to be used.
  • the invention makes possible the use of a mounting substrate made with a PTFE-layer prelaminated on the brass carrier.
  • Figure 1 shows a schematic view from above of a microwave capsule according to the prior art
  • Figure 2 shows a schematic view from above of a microwave capsule mounted on a circuit board according to the invention
  • Figure 3 shows in cross-section the microwave capsule mounted on the circuit board according to the invention
  • Figure 4 shows a cross-section of the circuit board according to the inventive method
  • Figure 5 shows a cross-section of the circuit board comprising a circuit recess according to the inventive method
  • Figure 6 shows a cross-section of the circuit board with shaped earth connection areas in accordance with the inventive method.
  • FIG. 1 shows an example of a microwave circuit capsule 1, also called a microwave capsule, according to the prior art, comprising an underside, to which two pairs of mutually opposing legs 11 a, 11 c and 1 lb,l Id are fixed, as can be seen in the figure.
  • connection areas on the mounting substrate can be earth connection areas, or so-called strip conductors, which are etched out of a circuit layer and which connects circuits to each other on the mounting substrate.
  • one pair of legs on the microwave capsule 1 are two signal legs 1 la,l lc, which are to be connected to strip conductors on the mounting substrate, and these signal legs 11a, l ie function as the connecting link for the microwave capsule 1 to the other circuits on the mounting substrate.
  • the other pair of legs on the microwave capsule 1 are two earth legs 1 lb, 1 Id, which are to be connected to earth connection areas on the mounting substrate.
  • All of the pairs of legs 11 a, 11 c and l ib, l id are placed symmetrically about the center of the microwave capsule, as can be seen in the figure.
  • the number of legs l la,l lb,l lc,l l d is not limited to four but can rather be more or less than four. Nor do the legs 1 la, 1 lb.l lc,l Id need to be symmetri- cally placed about the center of the microwave capsule.
  • the microwave capsule 1 consists, for example, of microwave transistors.
  • the mounting substrate can consist of a circuit board onto which circuits can be mounted.
  • the microwave capsule 1 is to be mounted on the circuit board 3 so that the microwave capsule 1 has good contact with the corresponding earth connection areas on the circuit board 3.
  • Figure 2 shows a view from above of the microwave capsule 1 mounted on the circuit board 3.
  • the circuit board 3 comprises a carrier 5, an intermediate layer 7 and a circuit layer which is more clearly shown below in Figure 3.
  • the intermediate layer 7 is fixed on the carrier 5 and is plated with the circuit layer.
  • the circuit layer comprises two etched out strip conductors 9a,9b, as shown in Figure 2, and these strip conductors 9a,9b have no contact with a circuit recess 17 described below.
  • the microwave capsule 1 is placed above a circuit recess 17 with its two signal legs 1 1a, l ie connected to the strip conductors 9a,9b, respectively, and its two earth legs l lb,l ld are connected to correspondingly shaped earth connection areas in the form of two raised portions 15a,15b, as shown in Figure 2.
  • the circuit recess 17 and the earth connection areas will be described in more detail below with reference to Figure 3.
  • Figure 2 shows one example of the placement of the strip conductors 9a,9b on the circuit board 3.
  • the number of strip conductors 9a,9b is not limited to the number shown in the figure.
  • Figure 3 shows a section along the line A-A in Figure 2 through the microwave capsule 1 and the circuit board 3 according to the invention.
  • the lowermost layer in the circuit board 3 is the carrier 5 made of a suitable conducting material, e.g. brass or copper.
  • the carrier 5 has, in accordance with the invention, on its topside 13 two earth connection areas 15a,15b shaped from the carrier 5. These areas 15a,15b protrude from the top 13 of the carrier.
  • the earth connection areas 15a, 15b are circularly shaped from the carrier 5 so that they have a diameter d.
  • the earth connection areas 15a, 15b are not limited to being circular. Rather they can also have other shapes.
  • the number of earth connection areas 15a,15b is equal to the number of earth legs 1 lb,l Id on the corresponding microwave capsule 1.
  • the intermediate layer 7 is fixed to the top 13 of the carrier and, in accordance with the invention, is preferably a layer of a PTFE (PolyTetraFluoroEthylene)- material but other materials as similar to PTFE can be used.
  • PTFE PolyTetraFluoroEthylene
  • the intermediate layer 7 is, as described above, plated on a topside 19 with the circuit layer (not shown in Figure 3), the circuit layer being made of an electrically conducting material, e.g. copper.
  • a circuit recess 17 is, in accordance with the invention, placed through the in- termediate layer 7 and the circuit layer.
  • the bottom of the circuit recess is a portion of the topside 13 of the carrier including the two earth connection areas 15a, 15b, shaped as described above.
  • the earth connection areas 15a, 15b protrude up through the circuit recess 17 and the earth connec- tion areas 15a, 15b protrude up so that they are essentially level with the top of the circuit layer.
  • the circuit recess 17 can be made in a number of different manners, e.g. circu- lar, rectangular etc.
  • One example is shown above in Figure 2, where the circuit recess 17 is rectangular.
  • the length 1 of the circuit recess 17 is greater than the sum of the distance a between the earth connection areas 15a, 15b and twice the diameter d of the earth connection areas.
  • the width b of the circuit recess 17 is greater than the diameter d of the earth connection areas.
  • Various processes can be used to shape the earth connection areas 15a, 15b from the carrier 5, e.g. stamping or shearing.
  • the circuit recess 17 must be sufficiently large to create room for the stamping or shearing tool.
  • the earth legs 1 lb,l Id of the microwave capsule are, as described above, arranged directly against the earth connection areas 15a, 15b shaped from the carrier 5.
  • the earth connection areas 15a.15b are made of the same material as the carrier 5 and since they protrude up from the carrier 5. there is achieved according to the invention very good contact between the earth legs 1 lb,l Id of the microwave capsule and the corresponding earth connection areas 15a, 15b.
  • the following example describes a method according to the invention for mounting the microwave capsule 1, comprising the two single legs 11 a, 11 c and the two earth legs l ib, l id, on the circuit board 3 so that the microwave capsule 1 has good contact with the corresponding earth connection areas on the circuit board 3, according to the example described above.
  • the method will be described with reference to Figures 2 and 3 discussed above and to Figures 4-6.
  • FIG 4 A cross section of the circuit card 3 is shown in Figure 4, the circuit board 3 ) comprising a carrier 5, an intermediate layer 7 and a circuit layer 8.
  • the carrier 5 is, as described above, made of a suitable electrically conducting material, e.g. brass or copper.
  • the intermediate layer 7 consists, according to the invention, of a PTFE-material but other materials can also be used.
  • the intermediate layer 7 is fixed to a topside 13 of the carrier 5 and is plated with the circuit layer 8.
  • the method starts from the circuit board 3 shown in Figure 4.
  • the strip con- ductors 9a,9b are etched in the circuit layer 8, as described in the preceding example.
  • the next step in the manufacturing process is to mill out a circuit recess 17 through the intermediate layer 7 and the circuit layer 8, as shown in Figure 5. 0 the bottom of the circuit recess being a portion of the top 13 of the carrier.
  • Two earth connection areas 15a, 15b are then shaped from that portion of the carrier 5 which makes up the bottom of the circuit recess 17. so that the earth connection areas 15a, 15b protrude up through the circuit recess 17 so that they 5 are essentially level with the top (not shown in Figure 5) of the circuit layer 8.
  • These earth connection areas 15a, 15b can be circularly shaped so that they have a diameter d as shown in the figure.
  • the distance a between the earth connection areas 15a,15d is also marked in the figure.
  • the milled out circuit recess 17 can, for example, be circular or rectangular. In connection with Figure 2 there has been described above an example of the dimensions of the circuit recess 17, but the circuit recess 17 can also have other dimensions.
  • Different methods can be used to shape the earth connection areas 15a, 15b from the carrier 5, e.g. stamping or shearing. What is required is that the circuit recess 17 be sufficiently large to provide room for the stamping or shearing tool.
  • the plated details on the circuit board 3 and the top of the earth connection areas 15a, 15b can be surface-treated with a suitable material, e.g. tin, lead or gold, to protect the parts against corrosion and to provide solderable surfaces.
  • a suitable material e.g. tin, lead or gold
  • the microwave capsule 1 is placed on top of the circuit recess 17, so that the two signal legs 1 la,l lc of the microwave capsule are connected to the strip conductors 9a,9b. and each of the earth legs 1 lb,l Id of the microwave capsule is connected to the corresponding earth connection areas, i.e. one of the two raised portions 15a, 15b.
  • a cross-section of the circuit board 3 and the microwave capsule 1 mounted on the circuit board 3 has been shown in Figure 3.
  • the earth legs 1 lb,l Id of the microwave capsule are arranged directly against the earth connection areas 15a, 15b formed from the carrier 5.
  • the signal legs l la,l lc and the earth legs l ib, l id of the microwave capsule are connected to the desired connection surfaces by soldering, for example.
  • the carrier 5 and the intermediate layer 7 in the example above can be manufactured separately.
  • a carrier 5 is used, as described above, manufactured in a suitable electrically conducting material, e.g. brass or copper.
  • the intermediate layer 7 is plated with the circuit layer 8 and consists, for example, of a PTFE-material.
  • the method is initiated by shaping two earth connection areas 15a, 15b from the portion of the carrier 5 over which the microwave capsule 1 is to be placed on the circuit board 3, so that the earth connection areas 15a, 15b protrude up above the top 13 of the carrier (see Figure 6, where in this case the intermediate layer 7 has still not been applied).
  • Different methods can be used to shape the earth connection areas 15a, 15b from the carrier 5, e.g. stamping or shearing, as described above.
  • the next step in the manufacturing process is to separately mill out a circuit recess 17 through the plated intermediate layer 7.
  • circuit recess 17 milled out as above can be made as described above in connection with Figure 2 but other alternatives are also possible.
  • the plated intermediate layer 7 is thereafter fixed to the top 13 of the carrier so that the earth connection areas 15a.15b protrude up through the circuit recess 17.
  • the circuit connection areas 15a,15b are then essentially level with the top of the circuit layer 8.
  • the fixing can be done by lamination, for example. See Figure 6. Strip conductors 9a,9b are etched in the circuit layer 8, as described in the preceding example.
  • the microwave capsule 1 is placed above the circuit recess 17 in the same manner as described above, and the two signal legs 1 1a, l ie of the microwave capsule are connected to corresponding strip conductors 9a,9b, and the two earth legs l ib, l id of the microwave capsule are connected to correspondingly shaped earth connection areas in the form of two raised portions 15a, 15b.
  • a cross-section through the circuit board 3 and the microwave cap- sule 1 mounted on the circuit board 3 is shown in Figure 3.

Abstract

L'invention concerne un appareil permettant d'obtenir un bon contact entre des branches (11b, 11d) de mise à la masse d'un circuit hyperfréquence (1) contre une connexion de mise à la masse correspondante d'une plaquette de circuit (3). Les zones (15a, 15b) de connexion à la masse sont façonnées directement à partir d'un support (5) de la plaquette de circuit (3), ledit support (5) étant constitué d'un matériau électroconducteur, tel que du laiton ou du cuivre, à l'endroit, sur la plaquette de circuit (3), où le circuit hyperfréquence (1) est monté, de manière que les zones (15a, 15b) de connexion à la masse dépassent vers le haut au-dessus de la face supérieure (13) du support. Le circuit hyperfréquence (1) est monté contre la plaquette de circuit (3) à l'endroit voulu par connexion de ses branches (11a, 11b, 11c, 11d) à la zone de connexion voulue sur la plaquette de circuit (3), les branches (11b, 11d) du circuit hyperfréquence étant connectées contre les zones (15a, 15b) de connexion à la masse façonnées. Un procédé de fabrication de l'appareil précité est également décrit.
PCT/SE1997/001910 1996-11-29 1997-11-13 Appareil de montage d'electronique et procede de production de cet appareil WO1998024279A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU52362/98A AU5236298A (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9604412-8 1996-11-29
SE9604412A SE510980C2 (sv) 1996-11-29 1996-11-29 Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning

Publications (1)

Publication Number Publication Date
WO1998024279A1 true WO1998024279A1 (fr) 1998-06-04

Family

ID=20404813

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1997/001910 WO1998024279A1 (fr) 1996-11-29 1997-11-13 Appareil de montage d'electronique et procede de production de cet appareil

Country Status (3)

Country Link
AU (1) AU5236298A (fr)
SE (1) SE510980C2 (fr)
WO (1) WO1998024279A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2043412A1 (fr) * 2007-09-28 2009-04-01 catem DEVELEC GmbH & Co. KG Rails conducteurs dotés d'une dissipation de chaleur
JP2016025229A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939444A (en) * 1974-01-11 1976-02-17 Amp Incorporated Printed circuit mountable, self grounding, multiple filter module
EP0130410A2 (fr) * 1983-06-07 1985-01-09 Nec Corporation Structure de circuit imprimé pour une enceinte métallique contenant un composant haute fréquence
US4553114A (en) * 1983-08-29 1985-11-12 Amp Incorporated Encapsulated printed circuit board filter
EP0298855A1 (fr) * 1987-07-03 1989-01-11 Thomson Grand Public Procédé de connexion entre un circuit imprimé et un substrat métallique
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
DE4405224A1 (de) * 1993-03-12 1994-09-15 Thomson Csf Verfahren zum Anschließen eines bipolaren Transistors
EP0660649A2 (fr) * 1993-12-22 1995-06-28 Murata Manufacturing Co., Ltd. Structure de montage pour composant électronique
US5448452A (en) * 1992-06-18 1995-09-05 Nec Corporation Circuit board for mounting a band-pass filter

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939444A (en) * 1974-01-11 1976-02-17 Amp Incorporated Printed circuit mountable, self grounding, multiple filter module
EP0130410A2 (fr) * 1983-06-07 1985-01-09 Nec Corporation Structure de circuit imprimé pour une enceinte métallique contenant un composant haute fréquence
US4553114A (en) * 1983-08-29 1985-11-12 Amp Incorporated Encapsulated printed circuit board filter
EP0298855A1 (fr) * 1987-07-03 1989-01-11 Thomson Grand Public Procédé de connexion entre un circuit imprimé et un substrat métallique
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
US5448452A (en) * 1992-06-18 1995-09-05 Nec Corporation Circuit board for mounting a band-pass filter
DE4405224A1 (de) * 1993-03-12 1994-09-15 Thomson Csf Verfahren zum Anschließen eines bipolaren Transistors
EP0660649A2 (fr) * 1993-12-22 1995-06-28 Murata Manufacturing Co., Ltd. Structure de montage pour composant électronique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2043412A1 (fr) * 2007-09-28 2009-04-01 catem DEVELEC GmbH & Co. KG Rails conducteurs dotés d'une dissipation de chaleur
JP2016025229A (ja) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 回路構成体

Also Published As

Publication number Publication date
SE9604412L (sv) 1998-05-30
AU5236298A (en) 1998-06-22
SE510980C2 (sv) 1999-07-19
SE9604412D0 (sv) 1996-11-29

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