SE9604412D0 - Förfarande och anordning vid montering av elektronik - Google Patents
Förfarande och anordning vid montering av elektronikInfo
- Publication number
- SE9604412D0 SE9604412D0 SE9604412A SE9604412A SE9604412D0 SE 9604412 D0 SE9604412 D0 SE 9604412D0 SE 9604412 A SE9604412 A SE 9604412A SE 9604412 A SE9604412 A SE 9604412A SE 9604412 D0 SE9604412 D0 SE 9604412D0
- Authority
- SE
- Sweden
- Prior art keywords
- circuit board
- earth
- carrier
- legs
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Reversible Transmitting Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604412A SE510980C2 (sv) | 1996-11-29 | 1996-11-29 | Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning |
PCT/SE1997/001910 WO1998024279A1 (en) | 1996-11-29 | 1997-11-13 | An apparatus for mounting electronics and a method of manufacturing such an apparatus |
AU52362/98A AU5236298A (en) | 1996-11-29 | 1997-11-13 | An apparatus for mounting electronics and a method of manufacturing such an apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9604412A SE510980C2 (sv) | 1996-11-29 | 1996-11-29 | Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9604412D0 true SE9604412D0 (sv) | 1996-11-29 |
SE9604412L SE9604412L (sv) | 1998-05-30 |
SE510980C2 SE510980C2 (sv) | 1999-07-19 |
Family
ID=20404813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9604412A SE510980C2 (sv) | 1996-11-29 | 1996-11-29 | Anordning för montering av en kapsel på ett monteringsunderlag samt förfarande för tillverkning av dylik anordning |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5236298A (sv) |
SE (1) | SE510980C2 (sv) |
WO (1) | WO1998024279A1 (sv) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2043412B1 (de) * | 2007-09-28 | 2010-05-19 | Eberspächer Controls GmbH & Co. KG | Stromschiene mit Wärmeableitung |
JP2016025229A (ja) * | 2014-07-22 | 2016-02-08 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3939444A (en) * | 1974-01-11 | 1976-02-17 | Amp Incorporated | Printed circuit mountable, self grounding, multiple filter module |
JPS59191761U (ja) * | 1983-06-07 | 1984-12-19 | 日本電気株式会社 | プリント板 |
US4553114A (en) * | 1983-08-29 | 1985-11-12 | Amp Incorporated | Encapsulated printed circuit board filter |
FR2617650B1 (fr) * | 1987-07-03 | 1992-12-11 | Orega Electro Mecanique | Procede de connexion entre un circuit imprime et un substrat metallique |
US4821005A (en) * | 1987-12-22 | 1989-04-11 | Amp Incorporated | Electrical circuit component assembly for circuit boards |
JPH066101A (ja) * | 1992-06-18 | 1994-01-14 | Nec Corp | 通過帯域ろ波器取付基板 |
FR2702594B1 (fr) * | 1993-03-12 | 1995-04-28 | Thomson Csf | Procédé de montage de connexion de transistor bipolaire. |
DE69422968T2 (de) * | 1993-12-22 | 2000-06-29 | Murata Mfg. Co., Ltd. | Montageanordnung für elektronisches Bauteil |
-
1996
- 1996-11-29 SE SE9604412A patent/SE510980C2/sv not_active IP Right Cessation
-
1997
- 1997-11-13 WO PCT/SE1997/001910 patent/WO1998024279A1/en active Application Filing
- 1997-11-13 AU AU52362/98A patent/AU5236298A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU5236298A (en) | 1998-06-22 |
WO1998024279A1 (en) | 1998-06-04 |
SE510980C2 (sv) | 1999-07-19 |
SE9604412L (sv) | 1998-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NUG | Patent has lapsed |