SE9604412D0 - Procedure and apparatus for mounting electronics - Google Patents

Procedure and apparatus for mounting electronics

Info

Publication number
SE9604412D0
SE9604412D0 SE9604412A SE9604412A SE9604412D0 SE 9604412 D0 SE9604412 D0 SE 9604412D0 SE 9604412 A SE9604412 A SE 9604412A SE 9604412 A SE9604412 A SE 9604412A SE 9604412 D0 SE9604412 D0 SE 9604412D0
Authority
SE
Sweden
Prior art keywords
circuit board
earth
carrier
legs
circuit
Prior art date
Application number
SE9604412A
Other languages
Swedish (sv)
Other versions
SE9604412L (en
SE510980C2 (en
Inventor
Leif Bergstedt
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE9604412A priority Critical patent/SE510980C2/en
Publication of SE9604412D0 publication Critical patent/SE9604412D0/en
Priority to AU52362/98A priority patent/AU5236298A/en
Priority to PCT/SE1997/001910 priority patent/WO1998024279A1/en
Publication of SE9604412L publication Critical patent/SE9604412L/en
Publication of SE510980C2 publication Critical patent/SE510980C2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

The invention relates to an apparatus for achieving good contact between earth legs (11b, 11d) of a microwave circuit (1) against a corresponding earth connection on a circuit board (3). Earth connection areas (15a, 15b) are shaped directly from a carrier (5) of the circuit board (3), said carrier (5) being manufactured of an electrically conducting material, such as brass or copper, at the location on the circuit board (3) where the microwave circuit (1) is mounted, so that the earth connection areas (15a, 15b) protrude up above the top side (13) of the carrier. The microwave circuit (1) is mounted against the circuit board (3) at the intended location by connecting its legs (11a, 11b, 11c, 11d) to the intended connection area on the circuit board (3), the earth legs (11b, 11d) of the microwave circuit being connected against the shaped earth connection areas (15a, 15b). A method for manufacturing the above apparatus is described.
SE9604412A 1996-11-29 1996-11-29 Device for mounting a capsule on a mounting base and method for manufacturing such a device SE510980C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9604412A SE510980C2 (en) 1996-11-29 1996-11-29 Device for mounting a capsule on a mounting base and method for manufacturing such a device
AU52362/98A AU5236298A (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus
PCT/SE1997/001910 WO1998024279A1 (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9604412A SE510980C2 (en) 1996-11-29 1996-11-29 Device for mounting a capsule on a mounting base and method for manufacturing such a device

Publications (3)

Publication Number Publication Date
SE9604412D0 true SE9604412D0 (en) 1996-11-29
SE9604412L SE9604412L (en) 1998-05-30
SE510980C2 SE510980C2 (en) 1999-07-19

Family

ID=20404813

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9604412A SE510980C2 (en) 1996-11-29 1996-11-29 Device for mounting a capsule on a mounting base and method for manufacturing such a device

Country Status (3)

Country Link
AU (1) AU5236298A (en)
SE (1) SE510980C2 (en)
WO (1) WO1998024279A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2345118T3 (en) * 2007-09-28 2010-09-15 EBERSPACHER CONTROLS GMBH & CO. KG DRIVING BAR WITH HEAT ELIMINATION.
JP2016025229A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939444A (en) * 1974-01-11 1976-02-17 Amp Incorporated Printed circuit mountable, self grounding, multiple filter module
JPS59191761U (en) * 1983-06-07 1984-12-19 日本電気株式会社 printed board
US4553114A (en) * 1983-08-29 1985-11-12 Amp Incorporated Encapsulated printed circuit board filter
FR2617650B1 (en) * 1987-07-03 1992-12-11 Orega Electro Mecanique METHOD FOR CONNECTING BETWEEN A PRINTED CIRCUIT AND A METAL SUBSTRATE
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
JPH066101A (en) * 1992-06-18 1994-01-14 Nec Corp Band pass filter mount base
FR2702594B1 (en) * 1993-03-12 1995-04-28 Thomson Csf Bipolar transistor connection mounting method.
DE69422968T2 (en) * 1993-12-22 2000-06-29 Murata Manufacturing Co Mounting arrangement for electronic component

Also Published As

Publication number Publication date
SE9604412L (en) 1998-05-30
SE510980C2 (en) 1999-07-19
AU5236298A (en) 1998-06-22
WO1998024279A1 (en) 1998-06-04

Similar Documents

Publication Publication Date Title
MY113889A (en) Dual substrate package assembly for being electrically coupled to a conducting member
TW342580B (en) Printed circuit assembly and method of manufacture therefor
EP0110285A3 (en) Interconnection of integrated circuits
AU1930000A (en) Printed circuit board and method for fabricating such board
CA2122508A1 (en) Apparatus for interconnecting electrical contacts
TW344176B (en) Method and apparatus for coupling signals
EP0394588A3 (en) Solder terminal
AU2002316910A1 (en) Circuit board with at least one electronic component
HK1042200A1 (en) An electrical component, a connecting means and a device comprising an electrical circuit module andat least one electrical component
EP1168481A3 (en) High frequency signal switching unit
AU2966399A (en) Electric conductor with a surface structure in the form of flanges and etched grooves
EP0817266A3 (en) Mounting structure for an integrated circuit
TW326587B (en) Shielded board mounted electrical connector(1)
ES273365U (en) Electronic component assembly
WO2002060004A3 (en) An integrated antenna system
EP0893945A4 (en) Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board
EP0075890A3 (en) Arrangement to prevent damage of the components or conductors on a circuit board
SE9604412D0 (en) Procedure and apparatus for mounting electronics
SE9900962D0 (en) Method and device for component contacting
EP0737382A1 (en) Component-module-adapted oscillating circuit arrangement
DE59814230D1 (en) RF coaxial connector part
WO2000004585A3 (en) Chip carrier device and method for the production of a chip carrier device with an electrical test
EP0763843A3 (en) Electrical element, preferably relay, and method for mounting the same on a printed circuit board
CA2091100A1 (en) Printed circuit board carried inside a cam-operated timer
WO1988003356A3 (en) Method and apparatus for producing a stamped substrate

Legal Events

Date Code Title Description
NUG Patent has lapsed