AU5236298A - An apparatus for mounting electronics and a method of manufacturing such an apparatus - Google Patents

An apparatus for mounting electronics and a method of manufacturing such an apparatus

Info

Publication number
AU5236298A
AU5236298A AU52362/98A AU5236298A AU5236298A AU 5236298 A AU5236298 A AU 5236298A AU 52362/98 A AU52362/98 A AU 52362/98A AU 5236298 A AU5236298 A AU 5236298A AU 5236298 A AU5236298 A AU 5236298A
Authority
AU
Australia
Prior art keywords
manufacturing
mounting electronics
electronics
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU52362/98A
Inventor
Leif Roland Bergstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU5236298A publication Critical patent/AU5236298A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Reversible Transmitting Devices (AREA)
AU52362/98A 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus Abandoned AU5236298A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9604412A SE510980C2 (en) 1996-11-29 1996-11-29 Device for mounting a capsule on a mounting base and method for manufacturing such a device
SE9604412 1996-11-29
PCT/SE1997/001910 WO1998024279A1 (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus

Publications (1)

Publication Number Publication Date
AU5236298A true AU5236298A (en) 1998-06-22

Family

ID=20404813

Family Applications (1)

Application Number Title Priority Date Filing Date
AU52362/98A Abandoned AU5236298A (en) 1996-11-29 1997-11-13 An apparatus for mounting electronics and a method of manufacturing such an apparatus

Country Status (3)

Country Link
AU (1) AU5236298A (en)
SE (1) SE510980C2 (en)
WO (1) WO1998024279A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2345118T3 (en) * 2007-09-28 2010-09-15 EBERSPACHER CONTROLS GMBH & CO. KG DRIVING BAR WITH HEAT ELIMINATION.
JP2016025229A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939444A (en) * 1974-01-11 1976-02-17 Amp Incorporated Printed circuit mountable, self grounding, multiple filter module
JPS59191761U (en) * 1983-06-07 1984-12-19 日本電気株式会社 printed board
US4553114A (en) * 1983-08-29 1985-11-12 Amp Incorporated Encapsulated printed circuit board filter
FR2617650B1 (en) * 1987-07-03 1992-12-11 Orega Electro Mecanique METHOD FOR CONNECTING BETWEEN A PRINTED CIRCUIT AND A METAL SUBSTRATE
US4821005A (en) * 1987-12-22 1989-04-11 Amp Incorporated Electrical circuit component assembly for circuit boards
JPH066101A (en) * 1992-06-18 1994-01-14 Nec Corp Band pass filter mount base
FR2702594B1 (en) * 1993-03-12 1995-04-28 Thomson Csf Bipolar transistor connection mounting method.
EP0660649B1 (en) * 1993-12-22 2000-02-09 Murata Manufacturing Co., Ltd. Mounting structure for electronic component

Also Published As

Publication number Publication date
SE9604412L (en) 1998-05-30
WO1998024279A1 (en) 1998-06-04
SE9604412D0 (en) 1996-11-29
SE510980C2 (en) 1999-07-19

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