WO1998009487A1 - Procede et dispositif d'amenee de flux - Google Patents

Procede et dispositif d'amenee de flux Download PDF

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Publication number
WO1998009487A1
WO1998009487A1 PCT/JP1997/003038 JP9703038W WO9809487A1 WO 1998009487 A1 WO1998009487 A1 WO 1998009487A1 JP 9703038 W JP9703038 W JP 9703038W WO 9809487 A1 WO9809487 A1 WO 9809487A1
Authority
WO
WIPO (PCT)
Prior art keywords
flux
discharge nozzle
filled
desired amount
electronic component
Prior art date
Application number
PCT/JP1997/003038
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Shimokawa
Kohei Tatsumi
Eiji Hashino
Original Assignee
Nippon Steel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corporation filed Critical Nippon Steel Corporation
Publication of WO1998009487A1 publication Critical patent/WO1998009487A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Definitions

  • the present invention relates to a flux supply method and apparatus suitable for supplying a precisely controlled desired amount of flux to electrodes of electronic components including a semiconductor chip and a printed circuit board. is there.
  • conductive balls solder balls
  • a flux is applied to each electrode portion, and the conductive balls are temporarily fixed by the adhesive force of the flux.
  • a method for supplying a flux to the electrode portion in the BGA As a specific example of a method for supplying a flux to the electrode portion in the BGA, a method disclosed in US Pat. No. 5,284,287 is conventionally known. According to this method, as shown in FIG. 5, a pick-up tool 100 for adsorbing the conductive ball 103 in the opening of the suction hole 102 connected to the vacuum source 101, and a flux bath 106 in the recess 105. Use the black plate 104 provided.
  • the conductive ball 103 adsorbed and held by the pick-up tool 100 is immersed to a predetermined depth X of the flux bath 106, and then pulled up from the flux bath 106. . Thereby, the flux is attached to a predetermined area of the conductive ball 103. Then, the conductive ball 103 is bonded to the electrode portion of the semiconductor device substrate via the attached flux. Disclosure of the invention
  • the present invention has been made in view of the above circumstances, and provides a flux supply method and a device capable of appropriately supplying a flux to an electrode portion of an electronic component including a semiconductor chip and a printed circuit board. Aim.
  • the flux supply method of the present invention provides a method for supplying a flux to an electrode portion of an electronic component including a semiconductor chip and a printed circuit board by ejecting the flux from a discharge nozzle.
  • the flux supply method of the present invention a part of the flux filled in the discharge nozzle is heated and expanded, and the flux is dropped from the discharge nozzle by the pressure due to the thermal expansion. And discharge it in the desired This is a method of attaching flux.
  • a part of the flux filled in the discharge nozzle is vibrated, and the flux is discharged in a droplet form from the discharge nozzle by the pressure generated by the vibration. This is a method of attaching a desired amount of flux to the electrode portion.
  • another flux supply method provides a method of injecting a flux from a discharge nozzle to form a flux on an electrode portion of an electronic component including a semiconductor chip and a printed circuit board.
  • the method is characterized in that a desired amount of the above-mentioned flux is attached to the electrode by controlling the jet direction by splitting and charging the uniform particles.
  • a flux supply device is a device for supplying a flux to an electrode portion of an electronic component including a semiconductor chip and a printed circuit board, wherein the flux is formed into droplets.
  • the device is provided with a discharge nozzle having a means capable of discharging by spraying, and ejects a droplet-like flux from the discharge nozzle to attach a desired amount to the electrode portion.
  • the flux supply device of the present invention is a device in which the discharge nozzle has a heating means capable of heating and expanding a part of the filled flux to form a droplet to discharge.
  • the flux supply device of the present invention is a device in which the discharge nozzle has a vibrating means capable of vibrating a part of the filled frattas to discharge in a droplet form. is there.
  • another flux supply device of the present invention ejects a flux from a discharge nozzle to apply the flux to an electrode portion of an electronic component including a semiconductor chip and a printed circuit board.
  • a device for supplying a flux, the discharge nozzle vibrating a part of the filled flux and An electrode unit comprising: a continuous vibrating means for discharging the continuous jet as a continuous jet; a splitting means for splitting the discharged continuous jet into a uniform particle row; and a charging means for charging the uniform particles to control the jet direction. This is a device that attaches a desired amount of flux to the surface.
  • a flux is ejected from a discharge nozzle and supplied to an electrode portion of an electronic component including a semiconductor chip and a printed circuit board.
  • a part of the flux filled in the discharge nozzle is heated or expanded or vibrated, and the pressure generated at this time causes the flux to be discharged from the discharge nozzle as droplets.
  • the amount of flux discharged from the discharge nozzle can be finely controlled, whereby a desired amount of flux can be appropriately attached to the electrode portion.
  • FIG. 1 is a perspective view showing a schematic configuration of a flux supply device according to an embodiment of the present invention.
  • FIG. 2 is a partial cross-sectional view showing a flash supply method in the embodiment of the present invention in the order of steps (A) to (E).
  • FIG. 3 is a partial cross-sectional view showing a main part configuration of a flux supply device configured using a piezoelectric element according to the embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a schematic configuration of an apparatus according to another flux supply method in the embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a schematic configuration of a conventional flux supply device.
  • Fig. 6 is a partial cross-sectional view showing the main configuration of a conventional flux supply device. It is. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 shows a schematic configuration of a flux supply device in this embodiment.
  • a flux is supplied to the electrode section 2 of the electronic component 1 for forming a BGA package or the like.
  • the electronic component is specifically a semiconductor chip or a printed circuit board.
  • the electrode portions 2 are set on the upper surface of the electronic component 1 in a predetermined arrangement pattern and pitch, as shown by the dashed line in the illustrated example. Further, the electronic component 1 is placed and fixed on the transport conveyor 3 so as to be sent at a predetermined speed.
  • a flux supply head 4 is supported so as to be movable in the width direction W of the conveyor 3.
  • the flux supply head 4 is provided with a discharge nozzle configured to discharge the flux 6 filled by the flux supply source 5 as described later. I have.
  • the flux supply head 4 is also driven in the width direction W by a head drive unit 7, and its position is detected by a sensor (not shown).
  • the control unit 8 controls the position of the flux supply head 4 via the head drive unit 7 and controls the discharge nozzle in the flux supply head 4.
  • FIG. 2 shows, in principle, a configuration example of the discharge nozzle 10 built in the flux supply head 4.
  • the nozzle body 11 is filled with the flux 6 from the flux supply source 5, and the flux 6 is dripped from the opening 11 a at the tip. And discharge .
  • the nozzle body 11 is attached to the flux supply head 4 such that the opening 11a of the nozzle body 11 faces downward.
  • a heater 12 as a heating means for heating and expanding a part of the filled flux 6 is provided at an appropriate position of the nozzle body 11.
  • the heater 12 is driven and controlled by the control unit 8 ⁇ , and generates heat instantaneously, thereby vaporizing some of the components of the flux 6 to generate bubbles.
  • flux 6 having a relatively low viscosity is used.
  • the flux 6 used is diluted with a predetermined solvent, and the viscosity of the flux 6 is increased after the flux 6 is attached to the electrode portion 2 of the electronic component 1 as described later.
  • the discharge can be easily performed from the discharge nozzle 10, and the discharge amount and the like can be accurately controlled.
  • a rosin-based flux and an activating agent-introduced gin-based flux can be used as the flux 6, a rosin-based flux and an activating agent-introduced gin-based flux can be used.
  • the droplet-like flux 6a discharged from the opening 11a in this manner is jetted toward the electrode section 2 of the electronic component substrate 1 as shown in FIG.
  • a quantity of flux 6 can be deposited.
  • the solvent in the flux 6 may be volatilized to increase the viscosity of the adhered flux 6.
  • the flux 6 having a diameter of 5 to 100 zm (diameter) can be supplied to the electrode portion 2 by one ejection from the ejection nozzle 10.
  • the flux 6 is ejected from the discharge nozzle 10 and supplied to the electrode unit 2 of the electronic component substrate 1.
  • a part of the flux 6 charged in the discharge nozzle 10 is heated and expanded by the heater 12, and the pressure generated at this time causes the flux 6 to be released from the discharge nozzle 10. Discharge in the form of drops.
  • the discharge amount of the flux 6 from the discharge nozzle 10 can be finely controlled by driving and controlling the heater 12 by the control unit 8, whereby the desired amount can be applied to the electrode unit 2 of the electronic component substrate 1. Flux 6 can be adhered properly.
  • a piezoelectric element as a vibration means for vibrating the filled flux 6 is provided in an appropriate place of the nozzle body 11 instead of the heater 12.
  • the schematic configuration in this case is, for example, as shown in FIG. 3, in which a cylindrical piezoelectric element 14 is mounted inside (an inner peripheral wall) of a cylindrical nozzle body 11.
  • a plurality of small piezoelectric elements 14 ′ may be arranged in line along the inner peripheral wall of the nozzle body 11 and arranged in an annular shape.
  • the driving of the piezoelectric element 14 is controlled by the control unit 8, and the piezoelectric element 14 vibrates toward the center of the nozzle body 11 so as to reduce the nozzle diameter.
  • the piezoelectric element 14 (14 ′) can also change the internal pressure of the flux 6 in the nozzle body 11, thereby discharging the flux 6 in a droplet form. Even when the piezoelectric element 14 (14 ') is used, a desired amount of flux can be adhered to the electrode portion 2 of the electronic component substrate 1.
  • Fig. 4 shows another example of the configuration of the flux supply head 4 in principle. Is shown. In this example, the flux 6 in the discharge nozzle 20 is vibrated and discharged as a continuous jet. By controlling the jet direction by charging, a desired amount of flux is attached to the electrode section 2 of the electronic component substrate 1.
  • the flux supply device splits into a uniform nozzle and a discharge nozzle 20 configured to excite the flux 6 and discharge the continuous jet 6b.
  • Means for charging the flux 21 and deflecting means 22 for controlling the jet direction of the charged flux particles 6c are provided.
  • an exciter composed of a piezo oscillator 23 is attached to the discharge nozzle 20, and the exciter splits spontaneously by this excitation action.
  • a knife edge 24 is disposed immediately after the deflecting means 22, so that only the uncharged flux particles 6d travel straight toward the electrode section 2 of the electronic component substrate 1. I have.
  • the flux 6 used is diluted with a predetermined solvent.
  • the flux 6 is pressurized to, for example, about 3 to 4 MPa, and is discharged as a continuous jet 6 b having an initial velocity of about 50 m / sec from a discharge nozzle 20 having an orifice diameter of 10 ⁇ m. .
  • the continuous jet 6 b splits into a uniform row of particles at a constant spontaneous particle frequency due to the effect of surface tension.
  • This division into flux particles is performed in synchronization with the excitation of the piezo oscillator 23.
  • the particle array of flux 6 is binary-controlled depending on whether or not it is attached to the electrode section 2 of the electronic component substrate 1. That is, the amount of the flux to be attached to the electrode section 2 is set in advance, and the splitting means 21 generates a control signal based on the amount of the flux.
  • the quantitative relationship between the charged flux particles 6c and the non-charged flux particles 6d is controlled by the control signal of the splitting means 21. Flux particles 6d are directed toward the electrode part 2 of the electronic component substrate 1. And go straight.
  • the continuous jet 6b ejected from the ejection nozzle 20 is divided into uniform particle rows, and the flux particles are charged to control the jet direction, whereby the electrode portion of the electronic component substrate 1 is formed. 2.
  • a desired amount of flux can be attached to 2.
  • the flux 6 of 5 to 100 m (diameter) can be supplied to the electrode portion 2 by one discharge from the discharge nozzle 20.
  • the present invention is not limited to those cases, and can be appropriately changed and the like within the scope of the present invention.
  • the present invention is effective for conductive balls having a small diameter of 500 m or less, particularly 300 / m or less, but can be similarly applied to balls of 500 m or more.
  • the flux supply head 4 may be provided with a plurality of discharge nozzles, so that the flux supply efficiency can be further improved.
  • a plurality of ejection nozzles are installed, for example, so that flux can be supplied at high speed in BGA frame units (4 to 8 units, connected in a strip shape). It can be applied to the specification. Industrial applicability
  • the present invention by discharging the flux from the discharge nozzle in the form of droplets, it is possible to form the flux on the electrode part of the electronic component including the semiconductor chip and the printed circuit board. Amount of flux can be adhered properly. By appropriately supplying an appropriate amount of flux to the fine area of the electrode in this way, even a BGA package using a small-diameter solder ball of 500 mm or less, especially 300 mm or less, can be efficiently used. To be able to produce well and to guarantee high joint reliability It has the advantage that it can be done.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

Cette invention se rapporte à un procédé et à un dispositif d'amenée de flux, au moyen desquels un flux (6) peut être amené de manière appropriée jusqu'à une section électrode (2) d'un composant électronique (1) contenant une puce à semiconducteur et une plaquette à circuit imprimé. Le dispositif présenté est pourvu d'une buse de décharge (10) ayant un moyen qui décharge le flux (6) en gouttelettes, et le flux (6) est déchargé en gouttelettes depuis la buse (10) et amené à adhérer à la section électrode (2) avec une force requise. La buse de décharge (10) d'un autre dispositif de cette invention est pourvue d'un moyen d'excitation en continu (23) qui décharge le flux (6) en un jet continu, tandis que le moyen (23) excite une partie du flux (6), un moyen de fractionnement (21) qui fractionne le jet continu déchargé en un train de particules uniformes et un moyen d'électrification (22) qui commande la direction du jet en électrifiant le train de particules uniformes, pour faire adhérer le flux (6) à la section électrode (2) avec une force requise.
PCT/JP1997/003038 1996-08-30 1997-08-29 Procede et dispositif d'amenee de flux WO1998009487A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24883696 1996-08-30
JP8/248836 1996-08-30

Publications (1)

Publication Number Publication Date
WO1998009487A1 true WO1998009487A1 (fr) 1998-03-05

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ID=17184152

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Application Number Title Priority Date Filing Date
PCT/JP1997/003038 WO1998009487A1 (fr) 1996-08-30 1997-08-29 Procede et dispositif d'amenee de flux

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TW (1) TW405152B (fr)
WO (1) WO1998009487A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430593A (ja) * 1990-05-28 1992-02-03 Matsushita Electric Works Ltd 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法
JPH07132599A (ja) * 1993-11-09 1995-05-23 Canon Inc 噴射記録方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430593A (ja) * 1990-05-28 1992-02-03 Matsushita Electric Works Ltd 接着剤塗布方法及びフラックス塗布方法及び半田ペースト塗布方法
JPH07132599A (ja) * 1993-11-09 1995-05-23 Canon Inc 噴射記録方法

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Publication number Publication date
TW405152B (en) 2000-09-11

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