WO1998000244A1 - Formulation amelioree de nettoyage de plaquettes apres calcination au plasma - Google Patents

Formulation amelioree de nettoyage de plaquettes apres calcination au plasma Download PDF

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Publication number
WO1998000244A1
WO1998000244A1 PCT/US1997/012421 US9712421W WO9800244A1 WO 1998000244 A1 WO1998000244 A1 WO 1998000244A1 US 9712421 W US9712421 W US 9712421W WO 9800244 A1 WO9800244 A1 WO 9800244A1
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WO
WIPO (PCT)
Prior art keywords
acid
water
nmp
group
blo
Prior art date
Application number
PCT/US1997/012421
Other languages
English (en)
Inventor
William A. Wojtczak
George Guan
Stephen A. Fine
Daniel N. Fine
Original Assignee
Advanced Chemical Systems International, Inc.
Kloffenstein, Thomas, J.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chemical Systems International, Inc., Kloffenstein, Thomas, J. filed Critical Advanced Chemical Systems International, Inc.
Publication of WO1998000244A1 publication Critical patent/WO1998000244A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/264—Aldehydes; Ketones; Acetals or ketals
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/267—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H01L21/31138—Etching organic layers by chemical means by dry-etching
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen

Definitions

  • the present invention relates generally to chemical formulations used in semiconductor wafer fabrication and particularly to chemical formulations that are utilized to remove residue from wafers following a resist plasma ashing step.
  • the prior art teaches the utilization of various chemical formulations to remove residue and clean wafers following a resist ashing step.
  • these prior art chemical formulations include strong reagents such as strong acids, strong bases and/or highly reactive amine containing compounds. Such strong reagents can cause unwanted further removal of metal or insulator layers remaining on the wafer and are therefore undesirable in many instances.
  • a particular problem with strippers containing both amine component(s) and water is corrosion of metal, particularly aluminum and aluminum-copper alloys. There is therefore a need for chemical formulations which effectively remove residue following a resist ashing step which do not attack and potentially degrade delicate structures which are meant to remain on a wafer.
  • a semiconductor wafer cleaning formulation for use in post plasma ashing semiconductor fabrication comprising the following components in the percentage by weight ranges shown: chelating agent 2 - 98% solvent 2 - 98%
  • the chelating agent is selected from the group consisting of 2,4-Pentanedionc, Malonic acid, Oxalic acid, p-Toluenesulfonic acid, and Trifluoroacetic acid and the solvent is selected from the group consisting of Water, Ethylene glycol, N-Methylpyrrolidone (NMP), Gamma butyrolactone (BLO), and Butyl carbitol.
  • Typical steps in the fabrication of semiconductor wafers involve the creation of a metalized layer having a patterned resist layer formed thereon. Such a wafer may then be exposed to a metal etching plasma (such as a halogen based plasma) to remove exposed metal. Thereafter, a plasma ashing step often is conducted (typically using an oxygen based plasma) in which the remaining resist is removed from the wafer. The result is a patterned metalized layer.
  • a metal etching plasma such as a halogen based plasma
  • the residue following the plasma ashing step is predominantly composed of inorganic compounds such as metal halides and metal oxides.
  • Various chemical formulations are currently used to remove the inorganic compound residues. These formulations are generally holdovers from older semiconductor fabrication wet chemical resist removal processes that were used prior to the introduction of the resist plasma ashing technology.
  • the prior formulations thus typically contain strong acids or strong bases or highly reactive amine compounds to remove residues (hat remained following the wet chemical resist removal step.
  • the present invention comprises chemical formulations for the removal of inorganic compound residues, where the formulations do not contain strong acids, strong bases and/or reactive amine compounds of the prior art formulations.
  • the general formulation of the present invention has two or three components that are present in the following ranges (where the percent (%) given is percent by weight): Organic Chelating Agent 1 - 15%
  • a preferred general formulation is created where the organic chelating agent is Catechol (1, 2-dihydroxybenzene) and the polar organic solvent is Gamma butyrolactone (BLO).
  • Catechol 1 - 15%
  • a first included series of formulations exists where there is zero BLO (BLO 0%). That is, a formulation of Catechol 1-10% and water 90-99% Within these parameters a preferred formulation comprises:
  • a preferred three component formulation within the range of parameters is: Catechol 7 - 12%
  • a first example of the present invention involved wafers having 3-layer metal lines containing a top layer of titanium nitride (1200A thick), a middle layer of aluminum (99.5%) copper (0.5%) alloy (10,000A thick), and a bottom layer of Titanium/Tungsten alloy (1500A thick).
  • the substrate was silicon oxide and the width of metal lines was approximately 0.8 microns.
  • the wafers were metal-etched with a chlorine-containing plasma which was followed by an oxygen plasma ashing of the resist. This was followed by immersion of the wafers in a bath of the present invention containing catechol 10%, water 50% and BLO 40% at 60°C for 30 minutes followed by washing with deionized water. Further testing has demonstrated that effective residue removal is obtained in a temperature range of 45° to 75°C, and with wafer exposure times in a range of 15 to 60 minutes. Additionally, rather than utilizing wafer immersion techniques, the solutions could be sprayed onto the wafers using automated spray tools followed by a water rinse.
  • Example II Example II
  • Catechol-related chelating agents would include derivatives of benzene, naphthalene, and aromatic heterocyclic compounds having at least two hydroxyl (OH) groups on adjacent carbon atoms.
  • NMP N- Methylpyyrolidone
  • PMA Propylene glycol monomethylether acetate
  • Ethylene glycol and propylene glycol and Dimethylsulfoxide.
  • Additional formulations have been developed for stripping wafer residues which originate from plasma metal etching followed by ashing. The additional formulations utilize the following components (percentages are by weight):
  • the preferred chelating agent compounds are: 2,4-Pentanedione 0-98%
  • the preferred polar organic solvents are:
  • NMP N-Methylpyrrolidone
  • Preferred solvent formulations that are utilized in the specific cleaning formulations set forth below are:
  • a significant feature of the new formulations is the use of a chelating agent in a solvent solution which does not contain any amine or strong base.
  • Specific cleaning formulations include:
  • R is either a hydrogen atom or an alkyl group
  • non-amine polar organic solvents are expected to be suitable either along or when mixed with water.
  • the four via and metal line structures were:
  • One micron diameter, two-layer vias comprised of a top layer of silicon oxide (7000 Angs. thick) and a middle layer of titanium nitride (1200 Angs. thick) on top of a silicon substrate.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

L'invention concerne une formulation de nettoyage de plaquettes à semi-conducteurs destinée à la fabrication de semi-conducteurs avec calcination ultérieure au plasma comprenant les composants suivants classés en pourcentage en poids: agent chélatant 2-98 %; solvant 2-98 %. Dans le mode de réalisation préféré, l'agent chélatant est sélectionné dans le groupe formé par le 2,4-pentanedione, l'acide malonique, l'acide oxalique, l'acide p-toluène-sulfonique, et l'acide trifluoroacétique; et le solvant est sélectionné dans le group formé par l'eau, l'éthylène glycol, le N-méthylpyrrolidone (NMP), le gamma butyrolactone (BLO), et le Butylcarbitol.
PCT/US1997/012421 1996-07-03 1997-07-03 Formulation amelioree de nettoyage de plaquettes apres calcination au plasma WO1998000244A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/675,500 1996-07-03
US08/675,500 US6323168B1 (en) 1996-07-03 1996-07-03 Post plasma ashing wafer cleaning formulation

Publications (1)

Publication Number Publication Date
WO1998000244A1 true WO1998000244A1 (fr) 1998-01-08

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US (1) US6323168B1 (fr)
WO (1) WO1998000244A1 (fr)

Cited By (10)

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Publication number Priority date Publication date Assignee Title
EP0939344A1 (fr) * 1998-02-27 1999-09-01 Kanto Kagaku Kabushiki Kaisha Composition liquide pour le décapage de films de photoréserves
WO2003035797A1 (fr) * 2001-10-23 2003-05-01 Advanced Technology Materials, Inc. Composition de nettoyage aqueuse, contenant un inhibiteur de corrosion specifique du cuivre, destinee au nettoyage de residus inorganiques sur un substrat semi-conducteur
US6755989B2 (en) 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
KR100506699B1 (ko) * 2001-08-17 2005-08-09 인테베프, 에스.에이. 나프타의 수소전환을 위한 촉매 시스템
US7012051B2 (en) 2000-04-12 2006-03-14 Ekc Technology, Ltd. Inhibition of titanium corrosion
US7534752B2 (en) 1996-07-03 2009-05-19 Advanced Technology Materials, Inc. Post plasma ashing wafer cleaning formulation
US7671001B2 (en) 2003-10-29 2010-03-02 Mallinckrodt Baker, Inc. Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
US7781510B2 (en) 2002-10-17 2010-08-24 Dow Global Technologies Inc. Highly filled polymer compositions
WO2019145312A1 (fr) * 2018-01-25 2019-08-01 Merck Patent Gmbh Compositions d'élimination de photorésine
US11994803B2 (en) 2019-07-11 2024-05-28 Merck Patent Gmbh Photoresist remover compositions

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BR9916463A (pt) * 1998-12-04 2002-02-05 Farrow System Ltd Método para remover revestimentos de superfìcies
ATE434033T1 (de) 2002-04-25 2009-07-15 Fujifilm Electronic Materials Nicht korrodierende reinigungsmittel zur entfernung von ätzmittelrückständen
US20100112728A1 (en) * 2007-03-31 2010-05-06 Advanced Technology Materials, Inc. Methods for stripping material for wafer reclamation
SG10201508015RA (en) 2010-10-06 2015-10-29 Entegris Inc Composition and process for selectively etching metal nitrides
JP5933950B2 (ja) 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド 銅または銅合金用エッチング液
WO2013123317A1 (fr) 2012-02-15 2013-08-22 Advanced Technology Materials, Inc. Elimination post-cmp à l'aide de compositions et procédé d'utilisation
TW201406932A (zh) 2012-05-18 2014-02-16 Advanced Tech Materials 用於自包含氮化鈦之表面脫除光阻劑之組成物及方法
WO2014089196A1 (fr) 2012-12-05 2014-06-12 Advanced Technology Materials, Inc. Compositions pour nettoyer des matériaux semiconducteurs iii-v et procédés pour les utiliser
EP2964725B1 (fr) 2013-03-04 2021-06-23 Entegris, Inc. Compositions et procédés pour graver sélectivement du nitrure de titane
KR102338550B1 (ko) 2013-06-06 2021-12-14 엔테그리스, 아이엔씨. 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법
EP3027709A4 (fr) 2013-07-31 2017-03-29 Entegris, Inc. Formulations aqueuses pour l'élimination des masques métalliques durs et des résidus de gravure présentant une compatibilité cu/w
SG11201601158VA (en) 2013-08-30 2016-03-30 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
TWI654340B (zh) 2013-12-16 2019-03-21 美商恩特葛瑞斯股份有限公司 Ｎｉ：ＮｉＧｅ：Ｇｅ選擇性蝕刻配方及其使用方法
WO2015095726A1 (fr) 2013-12-20 2015-06-25 Entegris, Inc. Utilisation d'acides forts non oxydants pour l'élimination de photorésine implantée par des ions
WO2015103146A1 (fr) 2013-12-31 2015-07-09 Advanced Technology Materials, Inc. Formulations de gravure sélective de silicium et de germanium
WO2015116818A1 (fr) 2014-01-29 2015-08-06 Advanced Technology Materials, Inc. Formulations de post-polissage chimico-mécanique et méthode d'utilisation associée
WO2015119925A1 (fr) 2014-02-05 2015-08-13 Advanced Technology Materials, Inc. Compositions post-cmp sans amine et leur méthode d'utilisation

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US5334332A (en) * 1990-11-05 1994-08-02 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates

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US7671001B2 (en) 2003-10-29 2010-03-02 Mallinckrodt Baker, Inc. Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors
WO2019145312A1 (fr) * 2018-01-25 2019-08-01 Merck Patent Gmbh Compositions d'élimination de photorésine
US11365379B2 (en) 2018-01-25 2022-06-21 Merck Patent Gmbh Photoresist remover compositions
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