WO1997037261A1 - Procede d'integration hybride d'au moins un composant optoelectronique et d'un guide d'ondes, et dispositif electro-optique integre - Google Patents

Procede d'integration hybride d'au moins un composant optoelectronique et d'un guide d'ondes, et dispositif electro-optique integre Download PDF

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Publication number
WO1997037261A1
WO1997037261A1 PCT/EP1997/001693 EP9701693W WO9737261A1 WO 1997037261 A1 WO1997037261 A1 WO 1997037261A1 EP 9701693 W EP9701693 W EP 9701693W WO 9737261 A1 WO9737261 A1 WO 9737261A1
Authority
WO
WIPO (PCT)
Prior art keywords
waveguide
connector piece
process according
substrate
opto
Prior art date
Application number
PCT/EP1997/001693
Other languages
English (en)
Inventor
Peter Martin Cyriel De Dobbelaere
Johan Eduard Van Der Linden
Peter Paul Van Daele
Original Assignee
Akzo Nobel N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel N.V. filed Critical Akzo Nobel N.V.
Priority to AU25084/97A priority Critical patent/AU715381B2/en
Priority to EP97916434A priority patent/EP0892934A1/fr
Priority to JP9534951A priority patent/JP2000507713A/ja
Publication of WO1997037261A1 publication Critical patent/WO1997037261A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Definitions

  • the invention pertains to a process for the hybrid integration of at least one optoelectronic component and a waveguide provided on a substrate.
  • Such a process can be used to inco ⁇ orate semiconductor components, such as LEDs, laser diodes, and VCSELs (Vertical Cavity Surface Emitting Laser Diodes), as well as detectors into an integrated structure containing polymers or glass in which light is transported and, optionally, modulated.
  • semiconductor components such as LEDs, laser diodes, and VCSELs (Vertical Cavity Surface Emitting Laser Diodes)
  • detectors into an integrated structure containing polymers or glass in which light is transported and, optionally, modulated.
  • These integrated structures have a number of important applications in the field of optical telecommunications (e.g., external modulation of light emitted by a laser diode, routing in interconnection networks, optical amplifiers, monitoring of signals, wavelength division multiplexing, etc.), high-speed interconnections in computers (optical backplane), optical sensors, etc., as well as being easier to use and handle than electro-optical structures composed of separate, unintegrated components.
  • optical telecommunications
  • alignment of the semiconductor component and the waveguide structure in transversal direction i.e., the direction perpendicular to the substrate of the waveguide, also known as the z- direction
  • alignment in lateral direction i.e., the direction parallel to the edge of the waveguide
  • Alignment in longitudinal direction is determined by the accuracy of the pick-and-place apparatus for the arrangement of the semiconductor component.
  • the invention attains this objective by means of the process as described in the opening paragraph and providing one or more optoelectronic components on a connector piece, which connector piece is placed on the substrate and moved up to the edge of the waveguide, with the shape of the waveguide and the shape of the connector piece being wholly or largely complementary, and the connector piece when it abuts against the edge of the waveguide having only one degree of freedom in the plane of the substrate.
  • the connector piece When the connector piece is placed on the substrate, it has three degrees of freedom in the plane of the substrate (one rotation and two translations). Because of its complementary, clearing shape, the connector piece when abutting against the waveguide can be moved in just a single direction, i.e. straight away from the waveguide. Because of this complementary, clearing shape the connector piece can be moved easily up to the edge of the waveguide to take up its exact envisaged position. Such a shape permits passive (and thus inexpensive and rapid) alignment.
  • the connector piece makes for greater freedom in selecting the sequence of the various process steps required to obtain an integrated electrooptical device.
  • the optoelectronic component (or components) can be provided on the connector piece before coupling to the waveguide takes place. This results in a ready-made module which is easy to move up against the waveguide and mount.
  • the optoelectronic component can be mounted on the connector piece after it has been moved up against the edge of the waveguide.
  • the opto-electronic component preferably is mounted on the connector piece using the so-called flip-chip technique (familiar to the skilled person), since this technique permits accurate positioning of the chip vis-a-vis the connector piece.
  • the flip-chip technique are solder bump flip- chip and Au-Au thermocompression.
  • the connector piece will have to be provided with a reflecting surface to enable optical signals emitted by the waveguide to be coupled into the opto- electronic component or components (when the opto-electronic component is a detector), or vice versa (when the opto-electronic component is a source).
  • any heat which may be generated by the opto-electronic component will be rapidly dissipated.
  • the waveguide may take the form of a planar, preferably polymeric, waveguide; alternatively, it may comprise a row of parallel optical fibres (fibre ribbon) arranged, e.g., in grooves in the substrate.
  • Planar waveguides generally consist of one or more layers of polymeric material provided on a substrate.
  • the waveguide may be a complete waveguide, in which case it will commonly comprise a bottom deflection layer, a core layer (in which the waveguide channels are defined), and a top deflection layer, but the structure may equally well be incomplete and be made up, say, of just a bottom deflection layer and a core layer.
  • the polymeric material can be provided on a substrate in the form of, say, a polymer solution, preferably by means of spincoating, followed by evaporation of the solvent.
  • a polymer solution preferably by means of spincoating, followed by evaporation of the solvent.
  • the polymer can also be moulded, injection moulded, or cast using other processing techniques known as such.
  • Suitable substrates include silicon wafers or synthetic laminates, e.g., on the basis of a reinforced or unreinforced epoxy resin. Suitable substrates are known to the skilled person. The substrate is not essential for carrying out the process according to the present invention. Preference is given to the planar waveguide (over fibre ribbons) because its edge (at least at the point where it is complementary to the connector piece) can easily be made complementary to the connector piece by the removal of waveguide material. A further advantage of planar waveguides over optical fibres consists in that as regards the direction in which they extend, the waveguide channels in a planar waveguide are not dependent on the substrate on which the waveguide has been provided.
  • Optical fibres are usually fixed in V-grooves, and the direction of such V- grooves, which is almost invariably obtained by wet-chemical etching, is dictated by the crystal lattice of the substrate (generally silicon).
  • the waveguide material (at least where it is complementary to the connector piece) may be removed by means of any suitable etching technique, e.g., those known from the manufacture of integrated circuits (ICs).
  • etching technique e.g., those known from the manufacture of integrated circuits (ICs).
  • Techniques that come to mind in this case are wet-chemical etching techniques, e.g., with use being made of organic solvents or strong bases.
  • photolithographic etching techniques such as sputter etching (non-reactive plasma etching), laser ablation, reactive ion etching (RIE) or reactive plasma etching.
  • RIE reactive ion etching
  • etching can be performed mechanically, e.g., by grinding, cutting, drilling, or through bombardment with sanding particles such as alumina, silica, and, more particularly, pumice.
  • sanding particles such as alumina, silica, and, more particularly, pumice.
  • the skilled person is expected to be able to select an appropriate etchant for the polymer in question without undue experimentation.
  • the polymeric material be so removed by etching as to give a smooth surface (facet). Furthermore, the surface subjected to etching should not exhibit any foreign substances or roughnesses.
  • a mask is applied to cover those parts which should remain free from attack by the etchant. These masks, the chief prerequisite of which is that they be resistant to the action of the etchant, are known, int. al., from IC technology. Such a mask may be preformed and made up, e.g., of metal or synthetic material; alternatively, it can be made by applying a photosensitive resin (photoresist) and subsequently exposing and developing said resin in accordance with the desired pattem.
  • photosensitive resin photoresist
  • the waveguide channels can be provided, int. al., by removing portions of the flat waveguide, e.g., with the aid of wet-chemical or dry etching techniques, and filling the thus formed cavities with a material having a lower index of refraction (thus forming a channel of core layer material enclosed on all sides by deflection layer material).
  • a material having a lower index of refraction thus forming a channel of core layer material enclosed on all sides by deflection layer material.
  • photosensitive material which can be developed after irradiation; for instance, a negative photoresist, that is to say, material which is resistant to a particular solvent (developer) after being irradiated.
  • the developer in that case may be used to remove non- irradiated material.
  • a positive photoresist on the other hand, it is the irradiated portion which is removed by the developer.
  • a core material in which a waveguide pattern can be provided without any material being removed by etching.
  • core layer materials which are chemically converted into materials with a different index of refraction under the influence of heat, light or UV irradiation.
  • the treated material can be used as core material. This may take the form of carrying out the treatment using a mask, with the holes in the mask being identical with the desired waveguide pattern. If, on the other hand, a reduction of the index of refraction is involved, the treated material will be suited for use as cladding material.
  • the treatment in question in that case may be carried out using a mask of which the closed portions are identical with the desired waveguide pattem.
  • a planar waveguide of which the core layer comprises a polymer bleachable under the influence of irradiation is a particular type of light- or UV-sensitive core layer material.
  • irradiation preferably generally using blue light, lowers the index of refraction of such a material without essentially affecting the remaining physical and mechanical properties.
  • the flat waveguide is provided with a mask covering the desired pattern of channels, so that the surrounding core layer material can have its index of refraction lowered ("be bleached") by means of irradiation.
  • waveguide channels are formed which are enclosed on all sides by material having a lower index of refraction (the bottom and top deflection layers and the surrounding bleached core layer material).
  • Such bleachable polymers have been described in EP 358476.
  • the channels can be defined either before or after the connector piece is contacted with the waveguide. In actual practice, however, it is easiest to define the channels before the connector piece is contacted with the waveguide.
  • each of the waveguide channels in planar waveguides as well as in optical fibres
  • these oblique angles can be photolithographically defined together with the shape of the edge of the waveguide which is to connect to the connector piece. In that case a single mask will suffice for both purposes.
  • One very efficient way of shaping the connector piece such as to render it suitable for use in the process according to the invention is by etching a rectangular hole in it.
  • the connector piece is made of a single crystal, a hole with three bevelled edges will be formed.
  • the opto-electronic component(s) is (are) provided on the connector piece, one of these edges may serve as the aforementioned reflecting surface if so desired.
  • connector pieces can be made simultaneously from a single wafer by etching square or rectangular holes in the wafer and then cleaving it. This will be eludidated in greater detail in the example.
  • the invention further pertains to an integrated electro-optical device which can be obtained by the above-described process among others.
  • the opto-electronic component or components
  • the connector piece comprises a mirror capable of coupling optical signals from the opto- electronic component or components into the waveguide and vice versa. Because of the use of the mirror the invention is not restricted to components detecting or emitting laterally, but also allows for the use of detectors (and sources) which are surface-detecting (emitting).
  • angle of the mirror to the substrate of the waveguide is smaller than 40 degrees or greater than 50 degrees, back reflections on the end face of the waveguide channels or on the surface of the opto-electronic component can be reduced or avoided.
  • the invention pertains to a module comprising a connector piece suitable for use in the invention with at least one opto-electronic component mounted thereon and to the connector piece itself.
  • the connector piece is on its underside provided with one or more grooves (this embodiment will be discussed in detail in the Example below).
  • EP 420 029 A1 discloses a device for reflecting and focusing light emitted by a laser chip. The light is coupled into a silicon body and reflected from an angled surface in this body in the direction of a focusing device. No mention is made of the silicon body and the laser chip being aligned.
  • EP 607 524 describes a device comprising a silicon body provided with a V-groove in which is placed an optical fibre. Light emitted by the optical fibre is coupled into the silicon body and reflected from an angled surface in this body in the direction of a receiver element.
  • This document fails to describe opto-electronic components integrating with waveguides provided on a substrate.
  • preference is given to embodiments in which the light is reflected onto, not coupled into, the connector piece.
  • the coupling in as such results in additional losses and reflections.
  • the connector piece material (say, silicon) is always transparent in a restricted wavelength range only.
  • Fig. 1 shows a top view of a silicon wafer in which several square holes have been etched.
  • Fig. 2 shows a side view of a cross-section of an integrated electro-optical device according to the invention.
  • Fig. 3 shows a top view of the integration of a connector piece on which a detector array has been mounted with a planar waveguide.
  • Fig. 4 shows a view in perspective of an embodiment according to the invention.
  • Fig. 5 also shows a view in perspective of an embodiment according to the invention.
  • Example A double-side polished Si (silicon of the crystal type indicated as (100)) wafer 1 is coated on both sides with a layer of SiNx (250 nm thick) by means of PECVD (Plasma Enhanced Chemical Vapour Deposition).
  • a metal (Au) pattem is provided (electric paths 7; Fig. 3).
  • This metal pattern is thickened by means of electrolytic deposition, after which a second layer of SiNx is coated over said metal pattem.
  • the SiNx is removed (by RIE) in conformity with holes 2 and lines 4 and 5.
  • the wafer 1 is then immersed in a hot KOH-IPA solution, resulting in the anisotropic removal by etching of the exposed silicon. Once the silicon has been removed to a sufficient degree (it will have disappeared completely from sites 2), the wafer 1 is taken out of the bath and rinsed thoroughly.
  • the SiNx is removed by RIE.
  • the central side wall 3 (which because of the nature of the Si (100) crystal is at angle of 54.7 degrees to the bottom face of the wafer 1) is coated with a layer of Au to optimise its reflective properties (Au being a good reflector for IR light).
  • a detector array 9 provided with eight detectors is mounted on the connector piece 6, and each of the detectors 10 is electrically connected to one of the paths 7.
  • the other ends of the paths 7 can be electrically connected to other electric components via Tape Automated Bonding.
  • the wafer 1 in which the connector pieces 6 were realised is broken along lines 4 and 5 to form small individual connector pieces.
  • a number of waveguide channels 14 are realised in a known manner in a planar waveguide structure comprising two deflection layers 11 and a core layer 12 provided on a substrate 13.
  • the RIE process is used to remove a portion of the planar waveguide, with a portion complementary to the shape of the connector piece 6 being provided on the edge of the waveguide.
  • the end faces of each of the waveguide channels 14 are defined such as to be at an angle of 10 degrees to the optical axes of said channels.
  • the waveguide channels 14 run through the planar waveguide at a slight angle. Because of said angle of 10 degrees the optical signal is very slightly deflected on egress. This can be counterbalanced by having the waveguide channels themselves run at an angle.
  • the module (connector piece 6 provided with array 9) is provide on the substrate 13 of the waveguide, fitted smoothly against the waveguide, and fastened with glue.
  • Fig. 5 shows shows a special embodiment of the device according to the invention in which a connector piece 15 is provided on its underside with grooves 16 (e.g., through sawing or etching) for letting through the waveguide channels 17.
  • the waveguide channels 17 have branches 18, which open into cavities 19 in the waveguide structure matching the sections of the underside of the connector piece 15 between the grooves 16.
  • the waveguide structure has comparatively large cavities 20, into which fits the remaining part of the underside of the connector piece 15.
  • the surface area of the cavities (19 and 20) preferably is slightly larger than the surface area of the underside of the connector piece 15, enabling easy and rapid insertion of this connector piece.
  • the connector piece 15 Part of a signal travelling through one of the waveguide channels 17 will reach the connector piece 15 via the corresponding branch 18 and be reflected to an opto-electronic component (not shown).
  • the connector piece according to the invention can be used to monitor the status of one or more waveguides, and so to rapidly find and localise breakdowns.
  • the value of the optical component or optical network of which this component is part will be greatly enhanced as a result. For, such a control mechanism is highly desirable for high-grade components and networks (and probably for all networks in the future).

Abstract

L'invention porte sur un procédé d'intégration hybride d'au moins un composant opto-électronique (9) et d'un guide d'ondes (14) à un substrat (13). Dans ledit procédé, un ou plusieurs composants opto-électroniques sont placés sur un élément de connexion (6), qui est lui-même placé sur le substrat (13), puis déplacé en remontant le long du bord du guide d'ondes (14), la forme du guide d'ondes et celle de l'élément de connexion (6) étant totalement ou largement complémentaires, et l'élément de connexion (6), lorsqu'il bute sur le bord du guide d'ondes, n'a qu'un seul degré de liberté dans le plan du substrat (13). Ledit procédé est un moyen facile de production de dispositifs électro-optiques intégrés.
PCT/EP1997/001693 1996-04-01 1997-04-01 Procede d'integration hybride d'au moins un composant optoelectronique et d'un guide d'ondes, et dispositif electro-optique integre WO1997037261A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU25084/97A AU715381B2 (en) 1996-04-01 1997-04-01 Process for the hybrid integration of at least one opto-electronic component and a waveguide, and an integrated electro-optical device
EP97916434A EP0892934A1 (fr) 1996-04-01 1997-04-01 Procede d'integration hybride d'au moins un composant optoelectronique et d'un guide d'ondes, et dispositif electro-optique integre
JP9534951A JP2000507713A (ja) 1996-04-01 1997-04-01 少なくとも１つの光電子素子および１つの導波路をハイブリッド集積する方法、並びに集積された電気―光学デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1002752A NL1002752C2 (nl) 1996-04-01 1996-04-01 Werkwijze voor de hybride integratie van ten minste één opto- electronische component en een golfgeleider, en een geïntegreerde electro optische inrichting.
NL1002752 1996-04-01

Publications (1)

Publication Number Publication Date
WO1997037261A1 true WO1997037261A1 (fr) 1997-10-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1997/001693 WO1997037261A1 (fr) 1996-04-01 1997-04-01 Procede d'integration hybride d'au moins un composant optoelectronique et d'un guide d'ondes, et dispositif electro-optique integre

Country Status (8)

Country Link
EP (1) EP0892934A1 (fr)
JP (1) JP2000507713A (fr)
KR (1) KR20000004926A (fr)
CN (1) CN1215480A (fr)
AU (1) AU715381B2 (fr)
CA (1) CA2250517A1 (fr)
NL (1) NL1002752C2 (fr)
WO (1) WO1997037261A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001021769A (ja) * 1999-06-29 2001-01-26 Robert Bosch Gmbh 光電的な構成部材を取り付けるための支持体ならびにこの支持体を製造する方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100770853B1 (ko) * 2006-02-09 2007-10-26 삼성전자주식회사 광 모듈
KR200480731Y1 (ko) 2015-06-19 2016-06-30 주식회사 이엘텍 발포성 단열 소재를 이용한 중장비 캐빈용 일체형 냉방 덕트
KR20200000633U (ko) 2018-09-12 2020-03-20 주식회사 이엘텍 장축 실외기를 이용한 중장비 캐빈용 일체형 에어컨
KR20200000650U (ko) 2018-09-17 2020-03-25 주식회사 이엘텍 지게차 배터리를 동력원으로 하는 전동 지게차용 에어컨

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0596613A2 (fr) * 1992-10-14 1994-05-11 Fujitsu Limited Modules de couplage à fibre optique
EP0607524A1 (fr) * 1992-11-25 1994-07-27 Robert Bosch Gmbh Dispositif de couplage des fins des guides d'ondes lumineuses avec des éléments d'émission ou de réception
EP0617303A1 (fr) * 1993-03-19 1994-09-28 Akzo Nobel N.V. Procédé d'intégration d'un composant semi-conducteur avec un composant guide d'onde optique polymère, et dispositif électro-optique avec une structure intégrée ainsi obtenu

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0596613A2 (fr) * 1992-10-14 1994-05-11 Fujitsu Limited Modules de couplage à fibre optique
EP0607524A1 (fr) * 1992-11-25 1994-07-27 Robert Bosch Gmbh Dispositif de couplage des fins des guides d'ondes lumineuses avec des éléments d'émission ou de réception
EP0617303A1 (fr) * 1993-03-19 1994-09-28 Akzo Nobel N.V. Procédé d'intégration d'un composant semi-conducteur avec un composant guide d'onde optique polymère, et dispositif électro-optique avec une structure intégrée ainsi obtenu

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001021769A (ja) * 1999-06-29 2001-01-26 Robert Bosch Gmbh 光電的な構成部材を取り付けるための支持体ならびにこの支持体を製造する方法

Also Published As

Publication number Publication date
CA2250517A1 (fr) 1997-10-09
JP2000507713A (ja) 2000-06-20
AU715381B2 (en) 2000-02-03
NL1002752C2 (nl) 1997-10-02
KR20000004926A (ko) 2000-01-25
AU2508497A (en) 1997-10-22
EP0892934A1 (fr) 1999-01-27
CN1215480A (zh) 1999-04-28

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