WO1997034258A1 - Dispositif et procede d'inspection utilisant un appareillement de motifs - Google Patents

Dispositif et procede d'inspection utilisant un appareillement de motifs Download PDF

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Publication number
WO1997034258A1
WO1997034258A1 PCT/JP1997/000831 JP9700831W WO9734258A1 WO 1997034258 A1 WO1997034258 A1 WO 1997034258A1 JP 9700831 W JP9700831 W JP 9700831W WO 9734258 A1 WO9734258 A1 WO 9734258A1
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WO
WIPO (PCT)
Prior art keywords
degree
reference pattern
matching
inspection
coincidence
Prior art date
Application number
PCT/JP1997/000831
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiko Nakakoji
Takehiro Sugimoto
Kenji Takahisa
Original Assignee
Komatsu Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd. filed Critical Komatsu Ltd.
Publication of WO1997034258A1 publication Critical patent/WO1997034258A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Definitions

  • the present invention relates to an apparatus and a method for inspecting defects such as IC leads by pattern matching.
  • the operator selects one of the many leads in the image by enclosing a single lead that seems to be the most standard with a rectangle, and uses this as the reference pattern. Register as Then, pattern matching is performed to match this reference pattern with other leads, and the similarity with the reference pattern is calculated as a score for each lead, and the validity as the reference pattern is determined.
  • the score of the selected reference pattern is lower than a certain reference, it is determined that the reference pattern is inappropriate, and another lead is selected as the reference pattern and registered again, or the reference pattern is changed. I had to edit and recreate it.
  • the present invention has been made in view of such a situation, and it is possible to reliably and quickly select and determine an optimal reference pattern to be a reference when performing pattern matching. It is an object of the present invention to provide an inspection apparatus and an inspection method by pattern matching that can perform the inspection with high accuracy and high work efficiency.
  • an inspection object is compared with a reference pattern of the inspection object, a degree of coincidence is calculated, and according to the calculated value of the degree of coincidence,
  • an inspection apparatus by pattern matching for determining the quality of the shape of the inspection object,
  • Imaging means for simultaneously imaging a plurality of the inspection objects
  • One inspection object in the image thus obtained is used as a temporary reference pattern, and the degree of coincidence between the temporary reference pattern and the other inspection objects in the image is sequentially calculated.
  • Each of the plurality of inspection objects in the imaging plane image is sequentially set as the temporary reference pattern, and the calculation unit is repeatedly performed.
  • the temporary reference pattern with the highest degree of total matching is selected as the reference pattern.
  • each of the plurality of inspection objects in the captured image is sequentially set as the temporary reference pattern, and the degree of total matching between the temporary reference pattern and all the other inspection objects in the image image is determined. Is repeated, and the total matching degree is obtained for each provisional reference pattern. As a result, the provisional reference pattern with the highest total matching degree is finally selected as the reference pattern. .
  • the optimal reference pattern to be used as a reference when performing pattern matching can be reliably and quickly selected and determined, thereby performing pattern matching inspection with high accuracy and high work efficiency.
  • FIG. 1 is a flowchart showing a processing procedure in an embodiment of an inspection apparatus or an inspection method using pattern matching according to the present invention.
  • Fig. 2 is a diagram showing a plurality of leads arranged on the side of one IC body.
  • Fig. 3 is a table showing the results of pattern matching using each lead shown in Fig. 2 as a temporary reference pattern. is there.
  • FIG. 4 is a diagram showing characters printed on each IC body.
  • FIG. 5 is a table showing the results of pattern matching using the characters on each IC body shown in FIG. 4 as a provisional reference pattern.
  • FIG. 2 shows a plurality of leads 1 to 5 arranged on the side of the IC body 10 to be inspected in this embodiment.
  • pattern matching is used to check for defects such as missing or bent leads and the quality of the lead pitch.
  • FIG. 1 is a flowchart illustrating a procedure for selecting and determining a reference lead pattern (hereinafter, referred to as a reference pattern) required for performing the pattern matching. It should be noted that all the leads 1 to 5 of the IC shown in FIG. 2 are used to select a reference pattern, and therefore all are assumed to be “good”.
  • steps 107, 109, 117, and 118 in FIG. 1 do not exist.
  • the positions of the leads 1 to 5 of the IC in the image image are detected (step 101).
  • a plurality of leads 1 to 5 of the IC mounted on the imaging table and mounted on the second table are simultaneously placed so that the non-defective IC does not tilt in the image image.
  • An image is captured by a camera (not shown), and is captured in a memory as an imaged image as shown in FIG.
  • a line ⁇ is drawn in the lead arrangement direction on the ⁇ ⁇ ⁇ image image, and the lightness distribution on the line A is obtained while the line A is sequentially moved in the longitudinal direction C of the lead. Then, from the light distribution on the line A when the line A is sequentially moved in the lead longitudinal direction C, it is determined that the line A is located at the tip of the leads 1 to 5.
  • the line A located at the tip of each of the leads 1 to 5 is defined as AO.
  • a line B is drawn in a direction perpendicular to the lead arrangement direction (lead longitudinal direction), and while this line B is sequentially moved in the lead arrangement direction D, the lightness distribution on the line B is calculated sequentially. Can be Then, from the light distribution on the line B when the line B is sequentially moved in the lead arrangement direction D, it is determined that the line B is located at the longitudinal center of the leads 1 to 5.
  • the line B located at the center in the longitudinal direction of the leads 1 to 5 is defined as B0.
  • each of the leads 1 to 5 is determined as the intersection of the line AO and the line B0 determined as described above (indicated as "ten" in FIG. 2) (step 10). 1), ⁇ Number of leads in the image (5; more than 5 in practice, there are many leads, but it is assumed that there are 5 in total for convenience of tax clarification) ) Is detected (step 102).
  • the following method may be employed in addition to the method described above.
  • the degree of coincidence between the lead tip and the temporary reference pattern that is, the content of the maximum value Sc ix of the similarity Sc.
  • the similarity Sc takes a value of 0 to 100, and the greater the value, the greater the degree of coincidence.
  • a value of 100 means “exact match”, while a value of 0 means “no match” at all and "pattern matching failed" (step 103).
  • the code i specifying the temporary reference pattern is initialized to 1 (step 104), and a temporary reference pattern P i is created.
  • a reference pattern P i for example, PI as an example, a predetermined size centered on the tip position of the lead 1 detected in step 101 (see + mark)
  • a rectangular portion is cut out on the image, and this is registered as a provisional reference pattern 1.
  • Each time i is incremented by +1 in step 116, similarly to lead 1, the other leads 2 to 5 are also read.
  • the corresponding provisional reference patterns P2 to P5 are created and registered (step 105).
  • a code j for identifying a lead to be matched with the provisional reference pattern obtained in step 105 is initialized to 1 (step 106).
  • pattern matching is performed to match the currently registered provisional reference pattern P i with the lead j, and as a result, the similarity Sc (i, j) power in this combination (i,; j); (Which is the number in FIG. 3) (step 108).
  • step 110 As long as the current lead j has not reached the number of leads (5) (NO in step 110), lead j is incremented by 1 (step 115), and steps 107 to 110 are the same. Is repeatedly executed. This As a result, in step 110, when lead j reaches the number of leads, pattern matching between the provisional base pattern P i and all leads 1 to 5 is completed, and the similarity Sc ( i, 1), Sc (i, 2), '' Sc (i, 5).
  • step 1 16 the new temporary reference pattern i and each lead j Are performed, Sc Ma is sequentially updated, and the code k of the reference pattern from which the updated Sc Max is obtained is sequentially updated (steps 105 to 112).
  • the minimum similarity Sc (“100J,“ 98 ”,“ 84 ”,“ 90 ”,“ 80 ”) obtained for the provisional reference pattern P1 is obtained. Since the value (lowest score) is “80”, the maximum value of the minimum score Sc Mix is “80” and the content of k is “1” (temporary reference) at the stage where all pattern matching using the provisional reference pattern P 1 has been completed. Pattern P 1) is assumed.
  • ScMax is compared with “80” (the lowest score “71” obtained at the end of the pattern matching by the provisional reference pattern P 2, and the current Sc ix “80” )
  • “82” the low score “82” obtained at the end of pattern matching with the provisional reference pattern ⁇ 3 is compared with the current ScMax “80 J”) and ⁇ 82, (the provisional reference pattern P
  • the lowest score “79” obtained at the end of pattern matching by Step 4 is compared with the current ScAiax “82”), and 32 ”(obtained at the end of pattern matching by the provisional reference pattern P5)
  • the lowest score “71” is compared with the current ScMax “82J” (Step 1 1 1).
  • the content of the final k is the minimum score “80 j, "71””82",”79j”,”71J Provisional group Daine SciVfax "82" is obtained
  • the “3” force indicating the quasi-pattern P 3; the content of k (step 1 12), and the second provisional criterion pattern P 3 is finally selected and determined as the ref- erence pattern (step 113).
  • the provisional reference pattern in which the pattern matching with all the leads 1 to 5 has been performed best is determined as the reference pattern. Then, as an evaluation value for evaluating that the pattern matching with all the leads has been successfully performed, the height of the lowest score among the similarities S c obtained for each of the leads 1 to 5 is employed. ing.
  • the present invention is not limited to this, and may be any evaluation value that can evaluate that the pattern matching with all the leads 1 to 5 has been performed best, for example, each of the leads 1 to 5
  • the average value of the similarities Sc obtained for each for example, in the case of the provisional reference pattern P1 in FIG. 3, "100”, “98", “84J”, "90”, " The average height of “80” is also used as the evaluation value.
  • each of the plurality of inspection objects 1 to 5 of the captured image ⁇ is sequentially set as the temporary reference pattern P l, ⁇ 25, and the temporary reference pattern ⁇
  • the Hama calculation for obtaining the total matching degree (minimum score) between 1 and all the inspection objects 1 to 5 in the image image is repeatedly performed, and the total matching degree is obtained for each provisional reference pattern.
  • the provisional reference pattern P3 that maximizes the total matching degree (lowest score) (a final updated value of Sc Max is obtained) is finally selected as the reference pattern. For this reason, the optimal pattern P3 that is used as a reference when performing the pattern matching is reliably and quickly selected and determined.
  • the inspection by pattern matching can be performed with good bran and with high work efficiency.
  • step 1 17 in FIG. 1 is added to the first embodiment.
  • the process proceeds to step 117, where the code i currently registered as the temporary reference pattern matches the code j of the lead to be matched with the temporary reference pattern.
  • the pattern matching processing for the combination where j ⁇ is omitted, and the arithmetic processing is performed at high speed.
  • steps 107 and 118 of FIG. 1 are added to the first embodiment.
  • step 107 where the code i currently registered as the temporary reference pattern is smaller than the code ⁇ of the lead to be matched with the temporary reference pattern. Is determined (step 107).
  • the pattern matching for the combination (i, j) has not been executed yet, so the pattern matching is performed in the next step 108. Is performed.
  • step 107 If the answer is NO in step 107, the process moves to the next step 118, and the value of the similarity S c (i, j) to be obtained is already obtained.
  • step 109 of FIG. 1 is added to the first embodiment.
  • step 109 it is determined whether or not the value of the similarity Sc (i, j) obtained in step 108 is smaller than the current value of Scrc ( Step 109).
  • step 109 If the determination result of step 109 is YES, the lowest score of the currently registered provisional reference pattern P i is no longer likely to exceed the current value of Sc Max. It is determined that there is no possibility that the provisional reference pattern P i is finally determined as the reference pattern, and the subsequent pattern matching by the currently registered provisional reference pattern P i is interrupted. Move the procedure to steps 1 1 3. As a result, the pattern matching is started for the new temporary reference pattern in which i is incremented by +1 or the pattern matching using all the temporary reference patterns is completed.
  • the pattern matching by 5) is omitted.
  • the similarity S c obtained as a result of performing the pattern matching falls below the current value of S c W x, it is possible to omit the subsequent pattern matching using the current provisional reference pattern P i.
  • the calculation can be performed at high speed.
  • the second to fourth embodiments are suitable! : Can be implemented in combination. Of course, it is also possible to implement all the second to fourth embodiments.
  • the reference pattern necessary for the inspection of the character “A” can be determined in the same manner as the processing shown in FIG. In other words, replace leads 1, 2, 3, 4, and 5 in Fig. 2 with IC main units A-1, A-2, A-3, A-4, and A-5 in Fig. 4, and do the same. Can be.
  • the shape of the character "A" to be inspected varies with a predetermined width ⁇ ⁇ ⁇ ⁇ due to a set of rubber for printing or the like. There are times when you want to judge. Therefore, as a limit sample, the shape of the character ⁇ AJ (the thickness and thickness of the line) is different within the above-mentioned predetermined width, respectively. As shown in A-2, A-3, A-4, A-5, multiple types are prepared.
  • these IC bodies are imaged one by one by the camera, stored as separate image images in the memory, and the position of the character “AJ” is detected for each IC body (step 1). 0 1).
  • one temporary reference pattern P 1, P 2,..., 5 is sequentially cut out from each image image, and these are temporarily extracted. 1, 2, 5 are registered sequentially (step 105, step 116: see E14).
  • the method (c) described above can be applied as a method for cutting out the temporary reference patterns # 1 to # 5.
  • the operator on one imaging screen, hands “Aj” on the IC body.
  • Dynamic operation enclose in a trowel rectangle and register it as a temporary reference pattern (for example, temporary reference pattern P 1 in FIG. 4).
  • a temporary reference pattern for example, temporary reference pattern P 1 in FIG. 4
  • the searched rectangular portions are set as provisional reference patterns P2 to P5. In this way, the provisional reference pattern can be directly obtained without detecting the position of the character "A” for each IC body in step 101.
  • the maximum value Scix of “7 2”, “6 6”, and “6 1” is set to “3” indicating the provisional reference pattern P 3 from which “7 2 J is obtained (step 1 12), This provisional reference pattern P3 is finally selected and determined as a reference pattern (determination YES in step 113, step 114).
  • the second to fourth embodiments may be appropriately adopted to perform the arithmetic processing at high speed.
  • the shape of the character ⁇ Aj '' to be subjected to pattern matching varies according to the degree of inclination of the IC body on the table or tray. If the variation in the degree of inclination is also within the predetermined range, it may be desirable to judge all of the products as “good” c. Therefore, as in the case of the IC bodies A-1 to A-5 in the fifth embodiment. Then, prepare a plurality of IC bodies having different degrees of inclination, and sequentially image the plurality of IC bodies: From this, similarly, the provisional reference patterns P1 to P5 are cut out, and these provisional reference patterns are extracted. Therefore, the reference pattern may be determined in the same manner.
  • each IC body was captured as a separate captured image.
  • the shape of the letter “A” to be matched may vary depending on the distance between the IC body on the table and the camera. In other words, different distances may result in different focuses and different sizes of characters to be imaged, and the shape of the character “A” may vary. If the variation in the distance between the camera and the IC body also differs within a predetermined width, it may be desirable to judge all of them as “good”. Therefore, as in the case of the IC bodies A-1 to A-5 of the fifth embodiment, a plurality of IC bodies having different distances from the camera to the IC body are prepared, and the plurality of IC bodies are sequentially imaged. Thus, the temporary reference patterns P1 to P5 may be cut out in the same manner, and a reference pattern may be similarly determined from among these temporary reference patterns.
  • the shape of the character “A” to be subjected to pattern matching may vary depending on the light applied to the character.
  • the intensity of light applied to the character differs depending on the lighting conditions such as weather and time, and the outline of the character to be imaged may vary, and the shape of the character "Aj" may vary. If the variation of the irradiated light also differs within a predetermined width, it may be desirable to judge all of them as “good”.
  • a plurality of IC bodies each having a different intensity of light emitted to the IC body are prepared.
  • the provisional reference patterns P1 to P5 may be cut out in the same manner, and a reference pattern may be determined in the same manner from among these reference patterns.
  • the fifth to eighth embodiments can be implemented in appropriate combinations. Of course, it is also possible to implement all of the fifth to eighth embodiments.
  • the processing contents of the first to eighth embodiments may be appropriately stored in a floppy disk, and distributed and distributed to a user or an operator who performs an inspection by pattern matching.
  • a storage medium to be distributed and distributed It may be a recording medium such as a hard disk, an IC card, or a CD-ROM other than a mouthpiece.
  • a mode of distribution not only a mode of distributing a portable storage medium as described above, but also a hardware using the software of the present embodiment and a software of the present embodiment
  • a mode may be adopted in which software is developed, a development computer containing the software is communicably connected to the computer for development via a public line or a network, and the computer is distributed via these networks.
  • an installer may be attached to distribute and distribute the software in order to install the software on hardware that uses the software (inspection equipment using pattern matching).
  • Compressed data may be distributed and distributed.
  • the inspection target is an IC (IC lead, a character on the IC body), but it is needless to say that the present invention is not limited to this and can be applied to any inspection target such as a connector pin. .

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)

Abstract

L'invention concerne un dispositif et un procédé d'inspection faisant appel à un appareillement de motifs de haute précision et de haute efficacité, par sélection et détermination rapide d'un motif de référence approprié, utilisé comme référence pour un appareillement de motifs. Plusieurs objets (1-5) à inspecter dans une image formée, sont utilisés chacun comme motif de référence temporaire (P1, P2, ... P5). Les calculs pour déterminer le degré d'accord complet (note minimale) entre le motif temporaire (P1) et au moins tous les autres objets (2-5) dans l'image, sont effectués de manière répétée. Le degré d'accord total est calculé pour chaque motif temporaire. Le motif temporaire (P3) avec le degré d'accord total le plus élevé (note minimale) est choisi finalement comme motif de référence.
PCT/JP1997/000831 1996-03-15 1997-03-17 Dispositif et procede d'inspection utilisant un appareillement de motifs WO1997034258A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8/59439 1996-03-15
JP8059439A JPH09251536A (ja) 1996-03-15 1996-03-15 パターンマッチングによる検査装置および検査方法

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WO1997034258A1 true WO1997034258A1 (fr) 1997-09-18

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TW (1) TW329472B (fr)
WO (1) WO1997034258A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090789A (ja) * 2005-09-30 2007-04-12 Hitachi Plant Technologies Ltd スクリーン印刷装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902121B2 (ja) * 2005-01-21 2012-03-21 ヤンマー株式会社 粒状物色彩選別機
JP4766008B2 (ja) * 2007-06-29 2011-09-07 富士ゼロックス株式会社 真偽判定装置及び真偽判定プログラム
JP5195096B2 (ja) * 2008-07-09 2013-05-08 Ｎｏｋ株式会社 画像処理検査方法及び画像処理検査システム
JP5947169B2 (ja) 2012-09-14 2016-07-06 株式会社キーエンス 外観検査装置、外観検査法およびプログラム
JP6833871B2 (ja) * 2016-12-09 2021-02-24 株式会社Ｆｕｊｉ 画像処理用部品データ作成方法及び画像処理用部品データ作成システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59226981A (ja) * 1983-06-08 1984-12-20 Fujitsu Ltd パタ−ンマツチング方法および装置
JPH06195520A (ja) * 1992-12-25 1994-07-15 Fujitsu Ltd 識別用辞書生成方法
JPH07334623A (ja) * 1994-06-13 1995-12-22 Omron Corp 画像処理方法およびその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59226981A (ja) * 1983-06-08 1984-12-20 Fujitsu Ltd パタ−ンマツチング方法および装置
JPH06195520A (ja) * 1992-12-25 1994-07-15 Fujitsu Ltd 識別用辞書生成方法
JPH07334623A (ja) * 1994-06-13 1995-12-22 Omron Corp 画像処理方法およびその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007090789A (ja) * 2005-09-30 2007-04-12 Hitachi Plant Technologies Ltd スクリーン印刷装置

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JPH09251536A (ja) 1997-09-22
TW329472B (en) 1998-04-11

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