WO1997032458A1 - Materiau ecran electromagnetique transparent a la lumiere et procede pour le realiser - Google Patents

Materiau ecran electromagnetique transparent a la lumiere et procede pour le realiser Download PDF

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Publication number
WO1997032458A1
WO1997032458A1 PCT/JP1997/000626 JP9700626W WO9732458A1 WO 1997032458 A1 WO1997032458 A1 WO 1997032458A1 JP 9700626 W JP9700626 W JP 9700626W WO 9732458 A1 WO9732458 A1 WO 9732458A1
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WO
WIPO (PCT)
Prior art keywords
layer
metal layer
black
transparent
electromagnetic wave
Prior art date
Application number
PCT/JP1997/000626
Other languages
English (en)
Japanese (ja)
Inventor
Kanji Suyama
Tatsuo Ishibashi
Yoshihide Inako
Shuzo Okumura
Masayasu Sakane
Original Assignee
Nissha Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13596796A external-priority patent/JPH09298384A/ja
Application filed by Nissha Printing Co., Ltd. filed Critical Nissha Printing Co., Ltd.
Publication of WO1997032458A1 publication Critical patent/WO1997032458A1/fr

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel

Definitions

  • the present invention relates to a light-transmitting electromagnetic wave shielding material that functions to shield an electromagnetic wave and allows the opposite side of the material to be seen through, and a method for manufacturing the same.
  • electromagnetic shielding materials not only function to shield electromagnetic waves, but also, for example, can be used as front panels for displays and microwave oven windows so that they can be used as microwave oven windows. There is a translucent one that allows you to see behind. In particular, in the case of a front panel such as a display, the display screen is viewed through an electromagnetic wave shielding material.Therefore, a display screen with excellent visibility while maintaining the electromagnetic wave shielding property has been desired.
  • a conductive net As a light-transmitting electromagnetic wave shielding material that functions as a shield and can see through the other side of the material, 1) a conductive net is sandwiched between glass or transparent resin plates, And 2) a transparent conductive thin film such as gold or ITO formed on glass or a transparent resin plate by vapor deposition or sputtering.
  • a transparent conductive thin film such as gold or ITO formed on glass or a transparent resin plate by vapor deposition or sputtering.
  • the surface of the conductive net is dyed black to suppress the reflection on the net surface in order to enhance visibility.
  • an object of the present invention is to provide a translucent electromagnetic wave shielding material having excellent visibility and a high electromagnetic wave shielding effect, and a method for producing the same.
  • the light-transmitting electromagnetic wave shielding material of the present invention is characterized in that a metal layer and a black layer are present on a transparent substrate in no particular order, and the metal layer and the black layer are both aligned and patterned. It was configured as follows.
  • the translucent electromagnetic wave shielding material of the present invention has a structure in which a metal layer is laminated in a pattern on a transparent substrate, and a black resist layer in register with the metal layer is laminated on the metal layer. (1st invention).
  • the black resist layer is formed of a photoresist containing a black dye and pigment.
  • the method for producing a translucent magnetic shielding material according to the first invention includes a step of providing a metal layer on a transparent substrate, a step of providing a black resist layer on the metal layer in a pattern, and a portion not covered with the black resist layer. And a step of removing the metal layer by etching.
  • the step of providing the black resist layer in a pattern is such that a photosensitive resin containing a black dye is applied, exposed using a mask, and developed.
  • the translucent electromagnetic wave shielding material of the first invention has a metal layer provided on a transparent substrate. Providing a patterned release layer on the metal layer, providing a black resist layer on the metal layer and the release layer, removing the release layer with a release liquid to remove the black resist layer thereon, It can also be obtained by a step of removing the metal layer at the portion where the black resist layer has been removed by etching.
  • the release layer may be formed of a printing resist material / photoresist material. Further, the black resist layer may have a thickness of 0.1 / m to 10 m.
  • the stripper may be composed of water, an aqueous solution of sodium hydroxide, an aqueous solution of potassium hydroxide, acetone, or ethyl cellosolve acetate.
  • the translucent electromagnetic wave shielding material of the present invention is configured such that a metal layer is laminated in a pattern on a transparent substrate, and a black electrodeposition layer which is in register with the metal layer is laminated on the metal layer.
  • the black electrodeposition layer may be formed of a material containing black particles in an ionic polymer.
  • the black electrodeposition layer may be made of a black conductive polymer.
  • the black electrodeposition layer may be formed of an electric plating film having a black color tone.
  • an acrylic resin, a polyester resin, a polybutadiene resin, a maleic resin, an epoxy resin, a urethane resin, a polyamide resin or a modified product thereof can be aminated or carboxylated.
  • carbon black, titanium black, and aniline plastic can be used as the black particles.
  • a polymer of pyrrole, aniline, thiophene and a derivative thereof can be used as the conductive polymer.
  • the method for producing a translucent electromagnetic wave shielding material according to the second aspect of the present invention includes a step of laminating a metal layer in a pattern on a transparent substrate, and a step of forming the metal layer in a solution of an ionic polymer containing black particles in a previous step.
  • the laminated transparent substrate was immersed together with the counter electrode and energized to form a black electrodeposition layer on the metal layer.
  • the method for producing a translucent electromagnetic wave shielding material according to the second invention is characterized in that a metal layer is formed on a transparent substrate.
  • a transparent electrode on the metal layer by immersing the transparent substrate on which the metal layer was laminated in the previous step in a solution of the monomer of the conductive polymer together with the counter electrode, and applying an electric current to the transparent substrate. May be configured to include a step of laminating.
  • the method for producing a light-transmitting electromagnetic wave shielding material according to the second aspect of the present invention includes a step of laminating a metal layer on a transparent substrate in a turn pattern, and a plating solution for forming an electroplating film having a black color tone.
  • the transparent substrate on which the metal layer is laminated in the previous step may be dipped, and a current may be applied to the metal layer to laminate a black electrodeposition layer on the metal layer.
  • the translucent electromagnetic wave shielding material of the present invention may be configured such that the surface layer of the metal layer formed in a pattern on the transparent substrate is a metal compound exhibiting black (third invention). In this case, the black layer is integrated with the metal layer.
  • the method for producing a translucent electromagnetic wave shielding material according to the third aspect of the present invention is a metal compound that provides a metal layer on a transparent substrate in a pattern and then performs a chemical conversion treatment so that the surface layer of the metal layer exhibits a black color. It can be configured as follows.
  • the black dyed layer laminated on the transparent substrate is composed of a pattern-shaped bleached portion and other non-bleached portions, and is regarded as a non-bleached portion on the black stained layer.
  • the matching metal layer may be configured so as to be ridged (fourth invention).
  • the black dyed layer contains acryl-based resin, polyester-based resin, cellulose-based resin, polyolefin-based resin, polyvinyl alcohol-based resin, natural polymer-type resin or a copolymer of these, or a dye in the mixture. It may be composed of
  • the method for producing a translucent electromagnetic wave shielding material according to the fourth invention includes a step of providing a black dye layer on a transparent substrate, a step of providing a metal layer on the black dye layer, and forming a resist layer on the metal layer in a pattern.
  • the step of providing and the step of removing the metal layer in the portion not covered with the resist layer with an etchant are sequentially performed.
  • the black stain layer in the portion not covered with the patterned metal layer in the etching process is decolorized with the etchant. May be configured.
  • a black dyeing layer is provided on a transparent substrate.
  • the method for producing a light-transmitting electromagnetic wave shielding material according to the fourth invention includes a step of providing a black dye layer on a transparent substrate, a step of providing a metal layer on the black dye layer, and a step of providing a resist layer in a pattern on the metal layer.
  • a step of removing the metal layer in a portion not covered with the resist layer with an etchant is sequentially performed, and then, a step of peeling the resist layer with a stripper is performed.
  • a portion of the black dyed layer that is not covered with the metal layer may be decolorized with a stripping solution.
  • a step of providing a black dyeing layer on a transparent substrate, a step of providing a metal layer on the black dyeing layer, and a step of forming a resist layer on the metal layer The steps of removing the metal layer in the portion not covered with the resist layer with an etchant are sequentially performed, and then removing the black stained layer in the portion not covered with the patterned metal layer separately from the etchant. You may comprise so that the process of decoloring with a bleaching solution and the process of peeling off a resist layer with a stripping solution may be performed.
  • the method for producing a light-transmitting electromagnetic wave shielding material of the present invention may be configured so that, in the step of removing the resist layer, a portion of the black stained layer that is not covered with the patterned metal layer is decolorized with a stripping solution. Good.
  • a portion not covered with the patterned metal layer may be decolorized with an etchant.
  • the etching solution may be configured so that the main component thereof is aqua regia, an aqueous solution of ferric nitrate, an aqueous solution of ferric chloride, an aqueous solution of cupric oxide, or an aqueous solution of cerium nitrate.
  • the above decolorizing solution is used as an aqueous solution of a surfactant, an aqueous solution of sodium chlorite, an aqueous solution of sodium hypochlorite, an aqueous solution of hydrogen peroxide, an aqueous solution of sodium nitrate, and an aqueous solution of stannous chloride.
  • Liquid, aqueous solution of sodium formaldehyde sulfoxylate dihydrate, aqueous solution of thiourea dioxide, aqueous solution of sodium hydrosulfite, and aqueous solution of a colorless and transparent dye intermediate Liquid, aqueous solution of sodium formaldehyde sulfoxylate dihydrate, aqueous solution of thiourea dioxide, aqueous solution of sodium hydrosulfite, and aqueous solution of a colorless and transparent dye intermediate.
  • the above-mentioned stripping solution was constituted so that an alkaline aqueous solution, an organic solvent or a mixture thereof was used as a main component.
  • the alkaline aqueous solution may be composed of sodium hydroxide, 7 oxidizing rim, and the organic solvent may be composed of acetone, cellosolve acetate solvent, cellosolve solvent, or alcohol solvent.
  • the etching solution and / or the stripping solution may include a decoloring agent.
  • Decolorizing agents are surfactants, sodium chlorite, sodium hypochlorite, hydrogen peroxide, sodium nitrate, stannous chloride, sodium formaldehyde sodium sulfoxylate tonihydrate, thiourea dioxide, sodium hydrosulfite, It may be composed of a colorless and transparent dye intermediate.
  • the translucent electromagnetic wave shielding material of the present invention is an adhesive sheet in which a metal layer is provided in a pattern on a transparent first substrate made of a film, and a black resist layer registered with the metal layer is provided on the metal layer. May be bonded via an adhesive layer to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer (fifth invention).
  • the translucent electromagnetic wave shielding material family of the fifth invention has a metal layer provided on the entire surface of a transparent first base made of a film, a black resist layer provided on the metal layer in a pattern, and covered with a black resist layer.
  • the adhesive sheet produced by removing the metal layer in the non-existing part using an etchant is attached via an adhesive layer to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer. You may manufacture by combining.
  • the step of providing the black resist layer in a pattern may be a step of applying a photosensitive resin ink containing a black dye and pigment on the metal layer, exposing using a photomask, and developing. Further, the step of providing a black resist layer in a pattern form includes providing a patterned free layer on the metal layer, providing a black resist layer on the metal layer and the free layer, By removing the free layer with a removal solution, the black resist layer thereon may also be removed.
  • the translucent electromagnetic wave shielding material of the present invention comprises a transparent first substrate made of a film, a metal layer provided in a pattern, and a black electrodeposition layer registered with the metal layer provided on the metal layer.
  • a sixth invention a configuration may be adopted in which the sheet is bonded to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via a bonding sheet force and an adhesive layer.
  • the translucent electromagnetic wave shielding material of the sixth invention is that a metal layer is provided in a pattern on a transparent first substrate made of a film, and the metal layer is placed in a solution of an ionic polymer containing black particles in the previous step.
  • the transparent first substrate provided with the layer is immersed together with the counter electrode and energized, so that the adhesive sheet prepared by providing the black electrodeposition layer on the metal layer can be connected to a plate, a three-dimensional object, or a functional object through the adhesive layer. It may be manufactured by laminating on a transparent second substrate made of a film having a layer.
  • this material comprises a transparent first substrate made of a film, a metal layer provided in a pattern on a transparent first substrate, and a transparent first substrate provided with a metal layer in a solution of a monomer of a conductive polymer in a previous step.
  • the adhesive sheet prepared by providing black electrodeposits on the metal layer by immersion and energizing together with the adhesive layer is passed through an adhesive layer to form a transparent sheet made of a plate, a three-dimensional object, or a film having a functional layer. It may be manufactured by laminating on a substrate.
  • a metal layer is provided in a pattern on a transparent first substrate made of a film, and the metal layer is provided in a pretreatment in a plating solution for forming an electroplating film having a black color tone.
  • the adhesive sheet prepared by providing a black electrodeposition layer on the metal layer is converted into a plate, a three-dimensional object, or a functional object through the adhesive layer. It may be manufactured by laminating on a transparent second substrate composed of a film having a layer.
  • the translucent electromagnetic wave shielding material of the present invention is a metal compound in which a metal layer is provided in a pattern on a transparent first substrate made of a film, and a surface portion of the metal layer exhibits a black color.
  • a three-dimensional object or functional layers may be configured as being bonded to a second transparent substrate comprising a fill arm having a (seventh shot bright ⁇
  • a translucent electromagnetic wave shielding material is to provide a transparent first substrate made of a film, wherein a metal layer is provided in a pattern on a transparent first base material, and then subjected to a chemical conversion treatment so that a surface layer of the metal layer becomes a metal compound exhibiting black.
  • the adhesive sheet produced in this manner may be manufactured by attaching the adhesive sheet to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer.
  • the translucent electromagnetic wave shielding material of the present invention is provided with a black dyeing layer comprising a pattern-like bleached part and other non-bleached parts provided on a transparent first substrate made of a film.
  • An adhesive sheet provided with a metal layer strength 5 corresponding to the non-bleaching part on the upper side is attached to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer. (Eighth invention).
  • the translucent magnetic wave shielding material according to the eighth invention is characterized in that a black staining layer is provided on a transparent first substrate made of a film, a metal layer is provided on the black staining layer, and a resist layer is provided in a pattern on the metal layer.
  • the step of removing the metal layer in the portion not covered with the resist layer using an etchant is sequentially performed, and the portion of the black stained layer not covered with the metal layer patterned in the etching process is etched with the etchant.
  • the adhesive sheet produced by decolorization may be bonded to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer.
  • the translucent electromagnetic wave shielding material according to the eighth aspect of the present invention also provides a black dyeing layer on a transparent first base made of a film, a metal layer on the black dyeing layer, and a resist layer on the metal layer.
  • the steps of removing the metal layer in the area not covered with the resist layer using an etchant are sequentially performed, and then etching the S-stained layer in the area not covered with the patterned metal layer.
  • the sheet may be manufactured by laminating a sheet on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer.
  • the transparent electromagnetic wave shielding material of No. 8 is provided with a black dye layer on a transparent first substrate made of film, a metal layer on the black dye layer, and a resist layer on the metal layer.
  • the resist layer may be removed using a resist removing solution. Further, in the resist layer removing step, a portion of the black stained layer that is not covered with the patterned metal layer can be decolorized with a resist removing liquid. In the above-mentioned niching step, the portion of the black dyed layer that is not covered with the patterned metal layer may be decolorized with an etching solution.
  • the translucent electromagnetic wave shielding material of the present invention comprises a release layer, a metal layer provided in a pattern on the release layer, and a black register provided in register with the metal layer on the metal layer.
  • the transfer layer composed of a substrate and a transfer layer composed of a film having a plate, a solid or a functional layer is transferred via an adhesive layer such that the release layer is on the outer surface.
  • the light-transmitting electromagnetic wave shield material according to the ninth invention is such that a release layer is provided on the entire surface of the first substrate made of a film, a metal layer is provided on the release layer, and a black resist layer is provided on the association layer in a pattern. Then, the transfer sheet produced by removing the metal layer in the portion not covered with the black resist layer using an etchant is applied to a plate and a three-dimensional structure via an adhesive layer such that the first substrate is on the outer surface. Bonded on a transparent second substrate consisting of a product or a film having a functional layer After that, it can be manufactured by peeling off only the first substrate.
  • the step of providing the black resist layer in a pattern may be a step of applying a photosensitive resin ink containing a black dyeing face, exposing it using a photomask, and developing. Also, the step of providing a black resist layer in a pattern is to provide a buttered free layer on the metal layer, provide a black resist layer on the metal layer and the free layer, and remove the free layer with a free removal solution. May remove the black resist layer on it.
  • the translucent electromagnetic wave shielding material of the present invention comprises a release layer, a metal layer provided in a pattern on the release layer, and a black electric layer provided on the metal layer in register with the metal layer.
  • the transfer layer composed of the deposited layer is transferred via the adhesive layer onto the transparent second substrate composed of a plate, a solid or a film having a functional layer so that the release layer becomes the outer surface. (10th invention).
  • a translucent electromagnetic wave shielding material comprising: providing a peeling layer on the entire surface of a first substrate made of a film; providing a metal layer in a pattern on the peeling layer; A transfer sheet prepared by providing a black electrodeposition layer on a metal layer by immersing the first substrate provided with the metal layer in the previous step together with the counter electrode and energizing the first substrate through an adhesive layer, It can be manufactured by laminating on a transparent second substrate consisting of a plate, a three-dimensional object, or a film having a functional layer so that the outer surface becomes the outer surface, and then peeling off only the first substrate. it can.
  • the translucent electromagnetic wave shielding material of the tenth invention is characterized in that a stripping layer is provided on the entire surface of the first substrate made of a film, a metal layer is provided on the stripping bottle in a pattern, and a conductive polymer monomer is provided.
  • Metal in the previous process in the solution)! The transfer sheet prepared by immersing the first substrate provided with the counter electrode together with the opposing electrode and applying a current to the metal layer so that the black electrodeposition layer is provided on the metal layer via the adhesive layer so that the first substrate becomes the outer surface. It may be manufactured by laminating on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer, and then peeling off only the first substrate.
  • the light-transmitting electromagnetic wave shielding material of the tenth aspect of the present invention provides a light-transmitting electromagnetic wave shielding material, wherein a release layer is provided on the entire surface of the first substrate made of a film, and a metal layer is provided in a pattern on the release layer.
  • a transfer sheet prepared by providing a black electrodeposited layer on a metal layer by immersing the first substrate provided with the metal layer in the previous step in a plating solution for forming a film together with the counter electrode and passing a current through the adhesive layer, And then bonding the first substrate to a transparent second substrate composed of a plate, a three-dimensional object, or a film having a functional layer such that the first substrate is an outer surface, and then peeling off only the first substrate. You may.
  • a transfer layer including a release layer and a metal layer which is a metal compound which is provided in a pattern on the release layer and whose surface portion exhibits a black color, forms an adhesive layer.
  • a transparent second substrate made of a plate, a three-dimensional object, or a film having functionality, so that the release layer becomes the outer surface.
  • the translucent electromagnetic wave shielding material of the eleventh aspect of the present invention provides a translucent electromagnetic wave shielding material, comprising: providing a stripping layer on the entire surface of a first substrate made of a film; forming a metal layer on the stripping layer in a pattern; A transfer sheet prepared by using a metal compound exhibiting a black color on the surface layer portion is formed of a transparent film made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer such that the first substrate is an outer surface. It can be manufactured by laminating only the first substrate after laminating on the second substrate.
  • the translucent electromagnetic wave shielding material of the present invention may further include a release layer, a black dyed layer including a pattern-shaped bleached portion and another non-bleached portion provided on the release layer, and a black dyed layer.
  • a transfer layer consisting of a non-bleaching part and a metal layer provided in register with a register, a transparent sheet consisting of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer such that the release layer is on the outer surface. It may be configured to be transferred onto the second substrate (the 12th invention).
  • the light-transmitting electromagnetic wave shielding material includes a release layer provided on the entire surface of the first substrate made of a film, a black dye layer provided on the release layer, a metal layer provided on the black dye layer, To A step of providing a resist layer in a pattern and sequentially removing the metal layer in a portion not covered with the resist layer using an etching solution is performed, and a portion not covered with the metal layer patterned in the etching process is performed.
  • the transfer sheet prepared by decolorizing the black dyed layer of the above with an etching solution is passed through an adhesive layer so that the first substrate becomes an outer surface, a transparent plate or a three-dimensional object or a film having a functional layer. After bonding on the second substrate, it can be manufactured by peeling off only the first substrate.
  • the light-transmitting electromagnetic wave shielding material of the 12th invention is provided with a peeling layer on the entire surface of the first substrate made of a film, a black dye layer on the peel layer, and a metal layer on the black dye seed.
  • a resist layer is provided in a pattern on the metal layer, and a step of removing the metal layer in a portion not covered with the resist layer using an etchant is sequentially performed, and then a portion not covered with the patterned metal layer is performed.
  • a transfer sheet prepared by decolorizing the black dyed layer with a decolorizing solution different from the etching solution is applied to a plate, a three-dimensional object, or a functional layer via an adhesive layer such that the first substrate is on the outer surface. It can also be produced by laminating on a transparent second substrate made of a film having the film and then peeling off only the first substrate.
  • a release layer is provided on the entire surface of the first substrate made of a film, a black dye layer is provided on the release layer, a metal layer is provided on the black dye layer, ⁇ ⁇ A resist layer is provided on the layer in a pattern, and a step of removing portions of the metal layer that are not covered with the resist layer using an etchant is sequentially performed.Then, the resist layer is removed using a resist remover, In the resist layer removing step, the transfer sheet produced by decolorizing the black dyed layer of the portion not covered with the patterned metal layer with the resist removing liquid is applied to the outer surface of the first base via the adhesive layer. It can also be produced by laminating on a transparent second substrate composed of a plate, a three-dimensional object, or a film having a functional layer, and then peeling off only the first substrate.
  • the resist layer may be removed using a resist remover. Also, in the resist layer removal process, The part of the black dyed layer that is not covered with the metalized layer can be decolorized with a resist removing solution. Further, in the etching step, a portion of the black stained layer that is not covered with the patterned metal layer may be decolorized with an etchant.
  • a metal layer is laminated in a pattern on a transparent substrate, and a black resist layer which coincides with the metal layer except for a ground portion is laminated on the metal layer.
  • a configuration may be adopted (the thirteenth invention).
  • the light-transmitting electromagnetic wave shielding material includes a step of providing a metal layer on a transparent substrate, a step of providing a mask layer on a part of the metal layer, and a step of providing a black resist layer in a pattern on at least the metal layer. It can be obtained from a step of removing the metal layer in a portion not covered with the black resist layer by etching, and a step of removing the mask layer to make an exposed portion of the metal layer a ground portion.
  • the light-transmitting electromagnetic wave shielding material of the thirteenth invention comprises a step of providing a metal layer on a transparent substrate, a step of providing a black resist layer on the metal layer in a pattern, and a step of forming a black resist layer on the exposed metal layer. Forming a mask layer, removing the black resist layer and the portion of the metal layer not covered by the mask layer by etching, removing the mask layer and setting the exposed portion of the metal layer to a ground portion can do.
  • a step of providing a metal layer on a transparent substrate, a step of providing a black resist layer in a pattern on the metal layer, and etching away a portion of the metal layer not covered with the black resist layer are performed. And a step of removing a part of the black resist layer to make an exposed part of the metal layer a ground part.
  • the thirteenth invention also includes a step of providing a metal layer on the transparent substrate, a step of providing a mask layer on a part of the metal layer, a step of providing a patterned release layer on at least the metal layer, and at least the metal layer and the release.
  • Process to remove It may be obtained by a process of removing the mask layer and making the exposed portion of the metal layer a ground portion.
  • the thirteenth invention provides a step of providing a metal layer on the transparent substrate, a step of providing a patterned release layer on the metal layer, a step of providing a mask layer on a part of the exposed metal layer, And a step of providing a black resist layer on the peeling layer, a step of removing the peeling 11 with a peeling liquid to remove the black resist layer thereon, and not being covered with the black resist layer and the mask layer It may be obtained from a step of removing a portion of the metal layer by etching, or a step of removing the mask layer and setting an exposed portion of the metal layer to a ground portion.
  • a thirteenth invention provides a step of providing a metal layer on a transparent substrate, a step of providing a patterned resist on the metal layer, a step of providing a black resist layer on the metal layer and the release layer, Peeling off to remove the black resist layer on it by peeling off, etching off the metal on the part where the black resist layer was removed, and removing metal by removing part of the black resist layer It is also obtained in the process where the exposed part of S is used as the ground part.
  • a metal layer is formed in a pattern on a transparent substrate, and a black electrodeposition layer which is aligned with the metal layer except for a ground portion is laminated on the metal layer.
  • a configuration may be adopted (the 14th invention).
  • the light-transmitting electromagnetic wave shielding material includes a step of laminating a metal layer on a transparent substrate in a pattern, a step of forming a mask layer on a part of the metal layer, and black particles.
  • a transparent substrate, on which a metal layer and a mask layer are laminated in a previous step, is immersed together with a counter electrode in a solution of a conductive polymer, and a current is applied to the transparent substrate to thereby remove the black electrodeposition layer on the metal layer.
  • the exposed portion of the metal layer may be used as a ground portion.
  • the translucent electromagnetic wave shielding material according to the fourteenth aspect of the present invention comprises a step of laminating a metal layer in a pattern on a transparent substrate, and a step of laminating the metal layer in a solution of an ionic polymer containing black particles in a previous step.
  • black electricity It may be obtained by a step of laminating a deposited layer, and a step of removing a part of the black electrodeposited layer to make an exposed part of the metal layer a ground part.
  • the light-transmitting electromagnetic wave shielding material includes a step of laminating a metal layer on a transparent substrate, a step of laminating a positive resist layer on the metal layer in a pattern, and a step of laminating a positive resist layer.
  • Removing the uncovered metal layer by etching, exposing the positive resist layer by exposing and developing while leaving a part behind, and pre-processing in a solution of a macromolecular polymer containing black particles A step of immersing the transparent substrate, on which the metal layer and the positive resist layer are laminated, together with the counter electrode and energizing to deposit black electrodeposition on the metal layer, and removing the remaining positive resist layer to remove the metal
  • the exposed portion of the layer may be obtained as a grounding step.
  • the light-transmitting electromagnetic wave shielding material according to the fourteenth invention comprises a step of laminating a metal layer in a pattern on a transparent substrate, a step of laminating a mask layer on a part of the metal layer, and a step of forming a conductive polymer monomer.
  • a step of stacking a black electrodeposition layer on the metal layer by immersing the transparent substrate, on which the metal layer and the mask layer were stacked in the solution in the previous step, together with the counter electrode and applying a current, and removing the mask layer It may be obtained from the step of using the exposed part of the metal layer as the ground part.
  • a fourteenth invention is directed to a step of laminating a metal layer in a pattern on a transparent substrate, and the step of forming a transparent substrate in which a metal layer is deposited in a solution of a monomer of a conductive polymer in a previous step together with a counter electrode. Step of immersing the black electrodeposition layer on the metal layer by immersing and applying current. : It may be obtained from a process in which a part of the gas deposition layer is removed and the exposed part of the metal layer is used as a ground part.
  • a step of laminating a metal layer on a transparent substrate a step of laminating a positive resist layer in a pattern on the metal layer, and etching a metal layer in a portion not covered with the positive resist layer Removing the positive-type resist layer by exposing and developing it while leaving a part, facing the transparent substrate on which the metal layer and the bodi-type resist layer were laminated in the previous step in a solution of conductive polymer monomer Energize by immersing with electrodes
  • This may be obtained from a step of laminating a black electrodeposition layer on the metal layer, or a step of removing the remaining positive resist layer to make the exposed portion of the metal layer a ground portion.
  • the black electrodeposition layer may be an electroplated film having a black color tone (the fifteenth invention).
  • the translucent electromagnetic wave shielding material of the fifteenth invention has a step of forming a metal layer in a pattern on a transparent substrate, a step of laminating a mask layer on a part of the metal layer, and has a black color tone.
  • it may be obtained by removing the mask layer and using the exposed portion of the metal layer as a ground portion.
  • the fifteenth invention is also directed to a step of laminating a metal layer in a pattern on a transparent substrate, and a step of laminating the metal layer in a previous step in a plating solution for forming an electroplating film having a black color tone.
  • the fifteenth invention is directed to a step of laminating a metal layer on a transparent substrate, a step of laminating a positive resist layer on the metal layer in a pattern, and a step of forming a metal layer in a portion not covered with the positive resist.
  • Removing by etching and removing the positive resist layer by exposing and developing, leaving a part, forming an electroplating film having a black color tone metal layer and positive resist in the previous process by plating solution Immersing the transparent substrate with the ridged layer together with the counter electrode and applying a current to seed a black electrodeposition layer on the metal layer; removing the remaining positive resist layer to remove the exposed portion of the metal layer; It may be obtained from the process of forming a ground part.
  • the translucent magnetic wave shield material of the present invention may be a metal compound in which the surface layer of a metal layer formed in a pattern on a transparent substrate has a black color except for the ground portion ( first example).
  • the translucent electromagnetic wave shielding material of the 16th invention comprises a step of providing a metal layer in a pattern on a transparent substrate, a step of providing a mask layer on a part of the metal layer, and a chemical conversion treatment.
  • the metal layer may be obtained by a step of forming the surface layer portion of the metal layer into a metal compound exhibiting black, or a step of removing the mask layer and setting the exposed portion of the metal layer to a ground portion.
  • a step of providing a metal layer on a transparent substrate, a step of providing a positive resist layer in a pattern on the metal layer, and removing portions of the metal layer that are not covered with the positive resist layer by etching Exposing and developing the positive resist layer by exposing and developing a part of the metal layer; converting the surface layer of the metal layer to a black metal compound by performing a chemical conversion treatment; removing the remaining positive resist layer
  • the exposed portion of the metal layer may be used as a ground portion.
  • the translucent magnetic wave shielding material of the present invention has a black color in which a metal layer is provided in a pattern on a transparent first base made of a film, and the metal layer is aligned with the metal layer except for a ground portion on the metal layer.
  • An adhesive sheet provided with a resist layer is attached via an adhesive layer to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer, such that the black resist layer is on the outer surface.
  • the light-transmitting electromagnetic wave shielding material according to the seventeenth invention is characterized in that a metal layer is provided on the entire surface of a transparent first base made of a film, a mask layer is provided on a part of the metal layer, and at least on the metal layer and the mask layer.
  • a black resist layer is provided in a pattern, and the metal layer in the portion not covered with the black resist layer and the mask layer is removed using an etchant. The mask is removed and the exposed portion of the metal layer is used as a ground portion.
  • the adhesive sheet prepared as described above is applied to the transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so that the black resist layer becomes an outer surface through an adhesive layer. You may obtain by combining.
  • the seventeenth invention is directed to providing a metal layer on the entire surface of the transparent first substrate made of a film, providing a black resist layer in a pattern on the metal layer, and forming a mask layer on a part of the exposed metal layer.
  • the masking layer was removed using an etching solution to remove the metal layer in the area not covered with the black resist layer and the mask layer, and the mask layer was removed to make the exposed part of the metal layer a ground part.
  • the adhesive sheet may be obtained by laminating an adhesive sheet on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer such that the black resist layer becomes the outer surface.
  • a metal layer is provided on the entire surface of the transparent first substrate made of a film, a black resist layer is provided in a pattern on the metal layer, and a portion of the metal layer not covered with the black resist layer is etched.
  • the adhesive sheet prepared by removing the black resist layer using a liquid and removing the part of the black resist layer to make the exposed part of the metal layer a ground part, and the black resist layer is removed through the adhesive layer. It may be obtained by laminating on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so as to have a surface.
  • the translucent electromagnetic wave shielding material of the present invention is a black electrodeposition layer in which a metal is provided in a pattern on a transparent first substrate made of a film, and the metal electrode is aligned with the metal layer except for a ground portion. Is attached to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer such that the black electrodeposition layer is on the outer surface. (The 18th invention).
  • the light-transmitting electromagnetic wave shielding material provides a light-transmitting electromagnetic wave shielding material comprising: a metal layer provided in a pattern on a transparent first substrate made of a film; a mask layer provided on a part of the metal layer; A black electrodeposited layer is formed on the metal layer by immersing the transparent first substrate provided with the metal layer and the mask type in the previous step together with the counter electrode in a solution of the conductive polymer and energizing the same, and forming the mask layer on the metal layer.
  • the adhesive sheet produced by removing the exposed metal layer to serve as a ground part has a plate, a three-dimensional object, or a functional layer via an adhesive layer so that the black electrodeposition layer is the outer surface. It may be obtained by laminating on a transparent second substrate made of a film.
  • the eighteenth invention is directed to a method in which a metal layer is patterned on a transparent first substrate made of a film.
  • the transparent first substrate provided with the metal layer in the previous step is immersed in the solution of the ionic polymer containing the black particles together with the counter electrode, and a black electrodeposition layer is provided on the metal layer by energizing.
  • the adhesive sheet prepared by removing a part of the black electrodeposition layer and setting the exposed part of the metal layer as an earth part is placed on a plate such that the black electrodeposition layer becomes an outer surface via an adhesive layer.
  • it may be obtained by laminating on a transparent second substrate made of a film having a three-dimensional object or a functional layer.
  • a metal layer was provided on the entire surface of the transparent first substrate made of film, a positive resist layer was provided on the metal layer in a pattern, and was not covered with the positive resist layer.
  • the positive resist layer is removed by exposure and development except for a part, and the metal layer and the positive resist are added to the solution of the ionic polymer containing black particles in the previous step.
  • the transparent first substrate provided with the layer was boiled together with the counter electrode and energized to form a black electrodeposition layer on the metal, and the remaining positive resist layer was removed to expose the exposed metal layer.
  • the adhesive sheet produced by using the grounding portion is placed on a transparent second layer made of a plate, a three-dimensional object, or a film having a functional layer so that the black electrodeposition layer becomes the outer surface via the adhesive layer. May be laminated on the substrate
  • a metal layer is provided in a pattern on a transparent first substrate made of a film, a mask layer is provided on a part of the metal layer, and a solution of a monomer of a conductive polymer is added in a previous step.
  • the transparent first substrate provided with the metal layer and the mask layer is immersed in the electrode together with the counter electrode to conduct electricity, so that a black electrodeposition layer is provided on the metal layer, the mask layer is removed, and the exposed portion of the metal layer is grounded.
  • the adhesive sheet prepared by the above process is applied to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer so that the black electrodeposited layer becomes the outer surface. It may be pasted on.
  • the eighteenth invention is further directed to a transparent first substrate in which a metal layer is provided in a pattern on a transparent first substrate made of a film, and a metal layer is provided in a previous step by a solution of a conductive polymer monomer.
  • the body is immersed with the counter electrode * and a current is applied to form a black electrodeposition layer on the metal layer.
  • the adhesive sheet prepared by removing a part of the black electrodeposition layer and leaving the exposed metal layer as a ground part was placed on the plate so that the black electrodeposition layer became the outer surface via the adhesive layer.
  • it may be obtained by laminating on a transparent second substrate composed of a three-dimensional object or a film having a functional layer.
  • the eighteenth invention is directed to providing a metal layer on the entire surface of a transparent first substrate made of a film, providing a positive resist layer in a pattern on the metal layer, and covering a portion of the metal layer not covered with the positive resist layer.
  • the resist was removed by etching, the positive resist layer was removed by exposure and development except for a part, and the metal layer and the poly resist layer were provided in the previous step in a conductive polymer monomer solution.
  • a black electrodeposition layer is provided on the metal layer, the remaining positive resist layer is removed, and the exposed portion of the metal layer is used as a ground portion. Even if the prepared adhesive sheet is bonded to a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so that the black electrodeposited layer becomes the outer surface, it can be obtained by bonding. good.
  • a metal layer is provided in a pattern on a transparent first substrate made of a film, and a mask layer is provided on a part of the metal layer to form an electroplating film having a black color tone.
  • the transparent first substrate provided with the metal layer and the mask layer in the previous step was immersed in the plating solution together with the counter electrode, and a current was applied to the black first electrode to provide a black electrodeposition layer on the metal layer.
  • the adhesive sheet produced by using the exposed part of the layer as the ground part is made of a plate, a three-dimensional object, or a film having a functional layer via the adhesive layer so that the black electrodeposition layer is the outer surface. It may be bonded on a transparent second substrate.
  • a metal layer was provided in a pattern on a transparent first substrate made of a film, and the metal layer was provided in a previous step in a plating solution for forming an electroplating film having a black color tone.
  • a black first electrodeposition layer is provided on the metal layer by immersing the transparent first substrate together with the counter electrode and energizing, and a part of the black electrodeposition layer is removed, and the exposed portion of the metal layer is used as a ground portion.
  • the black sheet is deposited on the adhesive sheet prepared by
  • Replacement form (Rule 26) It may be bonded to a transparent second substrate composed of a plate, a three-dimensional object, or a film having a functional layer so that m is the outer surface.
  • the eighteenth invention is directed to providing a metal layer on the entire surface of a transparent first substrate made of a film, providing a positive resist layer in a pattern on the metal layer, and covering a portion of the metal layer not covered with the positive resist layer.
  • the positive resist layer is removed by exposure and development, leaving a part of the metal layer and the positive electrode layer in the previous step in a plating solution that forms an electroplating film having a black color tone.
  • the transparent first substrate provided with the resist layer was immersed together with the counter electrode and energized to provide a black electrophoretic layer on the metal layer, exposing the remaining positive resist layer and exposing the metal layer.
  • the adhesive sheet produced by using the portion as a ground portion is placed on a transparent sheet made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer such that the black electrodeposition layer is on the outer surface. Paste on two substrates Even if the good.
  • the translucent electromagnetic wave shielding material according to the present invention is a translucent electromagnetic wave shielding material comprising: a transparent first substrate made of a film, a metal layer provided in a pattern, and a surface layer portion of the metal layer excluding a ground portion being a metal compound exhibiting black.
  • a translucent electromagnetic wave shielding material comprising: a transparent first substrate made of a film, a metal layer provided in a pattern, and a surface layer portion of the metal layer excluding a ground portion being a metal compound exhibiting black.
  • the translucent electromagnetic wave shielding material according to the nineteenth aspect of the present invention is a transparent electromagnetic wave shielding material, comprising: providing a metal layer in a pattern on a transparent first substrate made of a film; providing a mask layer on a part of the metal layer; Table not covered by the mask layer)!
  • the adhesive sheet prepared by removing the mask layer from the metal compound and then exposing the exposed metal layer to the ground is used as an adhesive layer. May be bonded on a transparent second substrate made of a plate, a solid, or a film having functionality.
  • a metal layer is provided on the entire surface of the transparent first substrate made of a film, and A positive resist layer is formed in a pattern, and the metal layer in the part not covered with the positive resist layer is removed by etching, and the positive resist layer is removed by exposure and development while leaving a part, and the chemical conversion treatment is performed.
  • the surface layer that is not covered with the positive resist layer of the metal layer is coated with a black metal compound, the remaining positive resist layer is removed, and the exposed metal layer is used as the grounding part.
  • the sheet may be obtained by laminating the sheet via a bonding layer on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so that the metal compound exhibiting black color becomes the outer surface. good.
  • the translucent electromagnetic wave shielding material of the present invention includes a release layer, a metal layer provided in a pattern on the release layer, and a black resist layer provided on the metal layer in register with the metal layer.
  • Transfer layer strength consisting of: The adhesive layer is transferred onto a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so that the release layer becomes the outer surface, and is peeled off.
  • a configuration in which only the ground portion of the metal layer is exposed on the layer side may be employed (20th invention).
  • the translucent electromagnetic wave shielding material of the present invention comprises: a release layer; a metal layer provided in a pattern on the release layer; and a black electrodeposition layer provided on the metal layer in register with the metal layer. Is transferred onto a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer via an adhesive layer so as to be an outer surface of a release layer, and A configuration in which only the ground portion is exposed on the release layer side of the metal layer may be employed (the twenty-first invention).
  • the translucent magnetic wave shielding material of the present invention comprises: a transfer layer comprising a release layer; and a metal layer which is a metal compound which is provided on the release layer in a pattern and has a blackened surface portion.
  • the second configuration may be adopted (the second invention).
  • the translucent electromagnetic wave shielding material of the present invention comprises a release layer, a black dyed layer comprising a pattern-shaped bleached portion provided on the release layer and other non-bleaching parts,
  • the transfer layer consisting of the decolored part and the metal layer provided in register is peeled off via the adhesive layer.
  • the layer is transferred to a transparent second substrate composed of a plate, a three-dimensional object, or a film having a functional layer so that the layer becomes a surface, and only the ground layer is exposed on the release layer side.
  • a configuration may be adopted (the 23rd invention).
  • the light-transmitting raw electromagnetic wave shielding material according to the twenty-third invention is characterized in that a release layer is provided on a first substrate made of a film, a black dye layer is provided on the release layer, a metal layer is provided on the black dye layer, and a metal layer is provided on the black dye layer.
  • a resist layer is provided in a pattern in the pattern, and a process of sequentially removing the metal layer in a portion not covered with the resist by using an etching solution is performed, and a portion not covered with the metal layer patterned in the etching process is performed.
  • the transfer sheet produced by decolorizing the black dyed layer with an etchant is made of a plate, a solid or a film having a functional layer via an adhesive layer such that the first substrate is the outer surface. After laminating on the transparent second substrate, only the first substrate is peeled off, a part of the non-bleaching part of the black dyed layer and the peeling layer thereover are removed, and the exposed part of the gold is grounded. May be obtained.
  • the light-transmitting electromagnetic wave shielding material provides a light-transmitting electromagnetic wave shielding material, wherein a peeling layer is provided on a first substrate made of a film, a black staining layer is provided on the peeling layer, a metal layer is provided on the black staining layer, Then, a resist layer is provided in a pattern, and a step of removing portions of the metal layer that are not covered with the resist layer using an etching solution is sequentially performed. Then, a portion of the portion that is not covered with the patterned metal layer is removed.
  • a transfer sheet produced by decolorizing the black dyed layer with a decolorizing solution different from the etching solution is applied to a plate, a solid or a functional layer via an adhesive layer such that the first substrate is on the outer surface.
  • a light-transmitting electromagnetic wave shield material comprising: a first substrate made of a film, a peeling layer, a black dyeing layer provided on the peeling layer, a metal layer provided on the black dyeing layer, A resist layer is provided in a pattern on the metal layer, and a step of removing the metal layer in a portion not covered with the resist layer using an etching solution is sequentially performed.
  • the transfer sheet produced by applying a resist removing liquid to a portion of the black dyed layer that is not covered with the patterned metal layer in the resist layer removing step is colored with a resist removing liquid.
  • a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so as to have an outer surface of the first substrate After laminating on a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer so as to have an outer surface of the first substrate, only the first substrate is peeled off, and the black dyed layer is removed. It may be obtained by removing a part of the non-bleaching part and a peeling layer thereover and leaving the exposed part of the metal layer as a ground part.
  • FIG. 1 is a schematic view showing one embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the first invention of the present invention.
  • FIG. 2 is a schematic view showing one embodiment of the pattern of the black resist layer of the first invention.
  • FIG. 3 is a schematic view showing one embodiment of the pattern of the black resist layer of the first invention.
  • FIG. 4 is a schematic view showing one embodiment of the pattern of the black resist layer of the first invention.
  • FIG. 5 is a schematic view showing one embodiment of the pattern of the black resist layer of the first invention.
  • FIG. 6 is a schematic view showing one embodiment of another manufacturing process of the translucent electromagnetic wave shielding material of the first invention of the present invention.
  • FIG. 7 is a schematic view showing one embodiment of the pattern of the release layer.
  • FIG. 8 is a schematic view showing one embodiment of the pattern of the release layer.
  • FIG. 9 is a schematic view showing one example of a pattern of the stripping and slaughter.
  • FIG. 10 is a schematic diagram showing one embodiment of the pattern of the release layer.
  • FIG. 11 is a schematic view showing one embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the second invention.
  • FIG. 12 is a schematic diagram showing an apparatus for depositing a black electrodeposition layer on a metal layer according to the second invention.
  • FIG. I3 is a schematic view showing one embodiment of a manufacturing process of the third electromagnetic wave transmitting electromagnetic wave shielding material.
  • FIG. 14 is a schematic view showing one embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the fourth invention.
  • FIG. 15 is a schematic diagram showing another embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the fourth invention.
  • FIG. 16 is a schematic view showing another embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the fourth invention.
  • FIG. 17 is a schematic view showing another embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the fourth invention.
  • FIG. 18 is a schematic diagram showing one embodiment of a translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 19 is a schematic diagram showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 20 is a schematic view showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 21 is a schematic diagram 121 showing another embodiment of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 22 is another embodiment of the second half of the manufacturing process of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 23 is a schematic view showing another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 24 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the fifth invention.
  • FIG. 25 is a schematic view showing another embodiment of the latter half of the manufacturing process of the transparent electromagnetic wave shield material according to the fifth invention.
  • FIG. 26 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the sixth invention. You.
  • FIG. 27 is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the sixth invention.
  • FIG. 28 is a schematic view showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shield material according to the sixth invention.
  • FIG. 29 is a schematic view showing another embodiment of the translucent electromagnetic wave shielding material according to the sixth invention.
  • FIG. 30 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the sixth invention.
  • FIG. 31 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the sixth invention.
  • FIG. 7 is a schematic view showing another embodiment of the latter half of the manufacturing process of the magnetic wave shielding material.
  • FIG. 33 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 34 is a schematic view showing one example of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 35 is a schematic view showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 36 is a schematic view showing another embodiment of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 37 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 38 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the seventh invention.
  • FIG. 39 is a schematic diagram showing another example of the latter half of the manufacturing process of the translucent electromagnetic wave shield material according to the seventh shimmer.
  • FIG. 40 is a schematic diagram showing an embodiment of the transparent and transmitted electromagnetic wave shielding material according to the eighth invention.
  • FIG. 4D is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 42 is a schematic view showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 43 is a schematic view showing another embodiment of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 44 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 45 is a schematic view showing another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 46 is a schematic view showing another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 47 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 48 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eighth invention.
  • FIG. 49 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the ninth invention.
  • FIG. 50 is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the ninth invention.
  • FIG. 51 shows another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the ninth invention.
  • FIG. 52 is a schematic diagram showing an example of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the ninth invention.
  • FIG. 53 is a schematic view showing another embodiment in the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the ninth invention! ].
  • FIG. 54 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the tenth invention.
  • FIG. 55 is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the tenth invention.
  • FIG. 56 is a schematic view showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the tenth invention! ].
  • FIG. 57 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent magnetic shielding material according to the tenth invention.
  • FIG. 58 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the eleventh invention.
  • FIG. 59 is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eleventh invention.
  • FIG. 60 is a schematic view showing an example of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eleventh invention.
  • FIG. 61 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the eleventh invention.
  • FIG. 62 is a schematic view showing one embodiment of the translucent electromagnetic wave shielding material according to the 12th invention.
  • FIG. 63 is a schematic view showing one embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the 12th invention.
  • me 4 is a schematic diagram showing one embodiment of the latter half of the manufacturing process of the translucent electromagnetic shielding material according to the 12th invention! ].
  • FIG. 65 is a schematic view showing another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the 12th invention.
  • FIG. 66 is a schematic view showing another embodiment of the first half of the manufacturing process of the translucent electromagnetic wave shielding material according to the 12th invention.
  • FIG. 67 is a schematic view showing another embodiment of the latter half of the manufacturing process of the translucent electromagnetic wave shielding material according to the first and second embodiments.
  • FIG. 68 is a translucent electromagnetic wave shielding material of the present invention, and is a basic plan view of an embodiment having a ground portion.
  • FIG. 69 is a view corresponding to FIG. 1, but showing an aspect in which the mask layer is formed first.
  • the black resist layer is formed before the mask layer.
  • FIG. 71 is a diagram showing a method without using a mask layer.
  • FIG. 72 is a view corresponding to FIG. 6, but showing an embodiment in which a mask layer is formed.
  • FIG. 73 shows a case where the order of forming the stripping layer 4 and the mask layer 101 in FIG. 72 is reversed.
  • FIG. 74 is a view showing a method of forming the ground portion 100 by removing only a part of the black resist layer 3 at the end without using a mask layer.
  • FIG. 75 is a view corresponding to FIG. 11, and is a view showing a method of forming a ground portion using a mask layer.
  • FIG. 76 is a diagram showing the deposition apparatus used in FIG.
  • FIG. 77 and FIG. 78 are diagrams showing a method of once forming the black deposition layer 3 on the metal layer, and then removing a portion of the deposition layer 3.
  • FIG. 78 shows the deposition apparatus used in FIG. 77 and FIG. FIG. 79 is a view showing a method of forming a positive resist layer 102 instead of the mask layer 101 and finally exposing that portion.
  • FIG. 80 shows the deposition apparatus used in FIG.
  • FIG. 81 is a view corresponding to FIG. 13, and a mask layer is formed on a part of the metal layer so as not to change into a metal compound.
  • FIG. 82 shows an embodiment in which a positive resist layer is formed instead of the mask layer, and the portion is finally removed by exposure.
  • FIG. 83 is a view corresponding to FIG. 21, and a part of the metal layer 32 is exposed to form a ground portion 100.
  • FIG. 84 shows an example of a method for manufacturing the translucent electromagnetic wave shielding material of the embodiment shown in FIG. # 85 is a state in which the black resist layer 33 is formed earlier than the mask # 101.
  • FIG. 86 shows a state in which the ground portion 100 is formed by removing a part of the black resist layer 33 without using the mask ⁇ .
  • FIG. 87 and FIG. 88 show embodiments obtained by attaching the one obtained in FIG. 86 to the second base 35.
  • FIGS. 89, 90 and 91 show embodiments using the free layer 37, and are the same as FIGS. 84 to 88 except that the metal layer is exposed using the free layer 37. .
  • FIGS. 92 to 97 are the same as the embodiments of FIGS. 83 to 88 except that the black layer is the black electrodeposition layer 33.
  • FIGS. 98 to 102 are the same except that the upper part of the metal layer 32 is a metal compound exhibiting black.
  • FIG. 103 to FIG. 106 are inventions corresponding to the ninth invention to the twelveth invention, but a part of the metal layer is also exposed to form a ground part.
  • FIG. 1 is a schematic diagram showing one embodiment of a manufacturing process of the translucent electromagnetic wave shielding material of the first invention of the present invention
  • FIGS. 2 to 5 are schematic diagrams showing one embodiment of a pattern of a black resist layer.
  • 1 indicates a transparent substrate
  • 2 indicates a metal layer
  • 3 indicates a black resist layer.
  • the metal layer 2 is provided on the entire surface of the transparent substrate 1 (see FIG. 1a).
  • the transparent substrate 1 examples include glass, acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysulfone resin, polyethersulfone resin, and polyvinyl chloride. Any transparent material may be used.
  • the transparent substrate 1 includes a plate, a film, and the like.
  • the material of the metal layer 2 for example, a material having sufficient conductivity, such as gold, silver, copper, iron, nickel, and chromium, that can shield electromagnetic waves sufficiently is used.
  • the metal layer 2 is not limited to a simple substance, but may be an alloy or a multilayer.
  • Examples of the method for forming the metal layer 2 include a method of deposition from a gas phase such as vapor deposition, sputtering, and ion plating, a method of bonding gold foil, and a method of electroless plating the surface of the transparent substrate 1. It is preferable that the thickness of the metal layer 2 be 0.1 ⁇ 50 ⁇ m. If it exceeds 50 m, it will be difficult to finish the pattern with high accuracy. If it is less than 0.1 / m, it will be impossible to stably secure the minimum necessary conductivity to maintain the electromagnetic shielding effect.
  • the black resist layer 3 is a layer for suppressing the reflection on the surface of the metal layer 2 to enhance visibility, and is a layer used for patterning the metal layer 2 in the process of manufacturing the light-transmitting electromagnetic wave shielding material. is there.
  • the black resist layer 3 includes a photo resist and a printing resist.
  • Fortress For example, roll coating, spin coating, full-surface printing, sculpting, etc., of photosensitive resins such as photosensitive polyimide, polyepoxy acrylate, and novolak containing black dyes and pigments are used.
  • a solid pattern is formed on the metal layer 2 using a mask, exposed using a mask, and developed to form a pattern.
  • the printing resist is, for example, a resin made of a resin such as polyester containing a black dye and pigment, and is formed in a pattern on the metal layer 2 by an offset printing method or a gravure printing method.
  • the pattern of the layer 3 includes, for example, a lattice (see FIG. 2), a honeycomb (see FIG.
  • the thickness of the black resist layer 3 is preferably set to Olm to 10 m. If it exceeds 10 m, it becomes difficult to finish the above pattern with high accuracy. If it is smaller than 10 m, sufficient light-shielding properties cannot be maintained, and it is difficult to suppress the reflection on the surface of the metal layer 2.
  • the part of the metal layer 2 not covered with the black resist layer 3 is etched and removed (see FIG. Lc).
  • a transparent electromagnetic wave shielding material is obtained in which the metal layer 2 is laminated in a pattern on the transparent substrate 1 and the black resist layer 3 corresponding to the metal layer 2 is layered on the gold layer 2.
  • the transmissive electromagnetic wave shielding material, a metal layer 2 force? Has a light-transmitting property in the removed portion is suppressed reflection at by Ri metal layer 2 surface in the black resist layer 3 register coincides with the metal layer 2 .
  • the etching solution is selected according to the material of the metal layer 2.
  • the material of the metal layer 2 is gold, it is aqua regia, silver is an aqueous solution of ferric nitrate, copper is an aqueous solution of ferric chloride or cupric chloride, and chromium is an aqueous solution of cerium nitrate. It is good to use such as.
  • the transfer method may be used. That is, a transfer material having a black resist layer 3, a metal layer 2 corresponding to the black resist layer 3, and a transfer layer composed of an adhesive layer provided on a peelable substrate sheet is used, and the transparent substrate 1 is plowed. Only the photosensitive layer may be transferred. If the translucent electromagnetic wave shielding material ⁇ made in this way is weak in strength, apply a protective layer made of a transparent material on one or both sides of the shielding material as necessary, or apply film lamination, etc. As the material of the protective layer, the protective layer can have various functions, such as a non-glare function, an antistatic function, an anti-Newton ring function, etc., so select a material according to each function. It does not need to be particularly limited.
  • FIG. 6 is a schematic view showing another example of the manufacturing process of the translucent electromagnetic wave shielding material of the first invention of the present invention.
  • Figure? 1 to 10 are schematic diagrams showing one embodiment of the pattern of the release layer.
  • 1 is a transparent substrate
  • 2 is a metal layer
  • 3 is a black resist layer
  • 4 is a release layer.
  • the metal layer 2 is provided on the transparent substrate 1 as in the method of FIG. 1 (see FIG. 6a).
  • a patterned release layer 4 is provided on the metal layer 2 (see FIG. 6B).
  • a generally available printing resist material / photoresist material is used as the material of the release layer 4.
  • the release layer 4 may be formed in a pattern on the metal layer 2 by a screen printing method using a printing resist material, or by a roll coating method, a spin coating method, or a dip method using a photoresist material.
  • a solid pattern is formed on the metal layer 2 by a coating method, a full-surface printing method, a transfer method, or the like, and is exposed to light using a mask, developed, and formed into a pattern. In this case, since black dyes and pigments are not contained, workability during exposure, development and printing does not matter much.
  • the pattern of the stripping layer 4 includes, for example, a reciprocal lattice (see FIG. 7), an inverted honeycomb (see FIG. 8), an inverted ladder (see FIG. 9), a polka dot (see FIG. 10), and the like. There is a pattern.
  • a black resist layer 3 is provided on the metal layer 2 and the peeling layer 4 (see FIG. 6c).
  • the above metal layer 2 is patterned during the manufacturing process of optical electromagnetic wave shielding material It is a layer used as an etching resist to perform As the material of the black resist layer 4, as in the case of the method of FIG. 1, for example, a material in which a black dye or pigment is added to a resin such as polyester is used.
  • Examples of a method for forming the black resist layer 3 include a roll coating method and a dip coating.
  • the thickness of the black resist layer 3 is preferably set to Olm to 10 / ⁇ . If it exceeds 10 m, the peeling of the release layer 4 becomes difficult, and if it is less than 0.1 m, sufficient light-shielding properties cannot be maintained, and reflection on the surface of the metal layer 2 becomes difficult to suppress.
  • the black resist layer 3 thereon is removed by peeling the peeling layer 4 with a peeling liquid (see FIG. 6d).
  • the black resist layer 3 becomes a pattern obtained by inverting the pattern of the release layer 4.
  • the patterns are lattice (see Fig. 2), honeycomb (see Fig. 3), ladder (see Fig. 4), and inverted polka dots (see Fig. 5).
  • the stripping solution used in this step a different type is used depending on the material of the stripping layer 4.
  • the release layer 4 is of an alkaline release type, an aqueous solution of potassium hydroxide or an aqueous solution of sodium hydroxide is used.
  • the stripping layer 4 is of a water stripping type, use water.
  • the stripping layer 4 is of a solvent stripping type, use ethyl acetate mouth sorp acetate, acetone, or the like.
  • the black resist layer 3 is simply formed, there is no need to consider workability at the time of exposure, development, and printing.
  • the material can be used in a wide range, and it is possible to obtain a transparent electro-magnetic shield material at low cost.
  • the metal layer 2 at the portion where the black resist layer 3 has been removed is removed by etching (see FIG. 6E). C
  • the metal layer 2 is laminated on the transparent substrate 1 in a pattern, and thus, a translucent electromagnetic shield material is obtained in which a black resist layer 3 which is in register with the metal layer 2 is laminated.
  • the translucent electromagnetic wave shielding material has translucency in a portion where the metal layer 2 is removed, and the reflection on the surface of the metal layer 2 is suppressed by the black resist layer 3 which is in register with the metal layer 2. Select the etching solution according to the material of the metal layer 2. You.
  • the material of the metal layer 2 is gold, aqua regia is used, when silver, ferric nitrate aqueous solution is used, when copper is used, ferric chloride or cupric chloride aqueous solution is used, when chromium is used, cerium nitrate aqueous solution is used. Good to use.
  • the protective layer made of a transparent material may be applied to one or both surfaces of the shielding material by coating or film laminating as necessary. You can set it.
  • the protective layer can include various functions, for example, a non-glare function, an antistatic function, an anti-Newton ring function, etc., so that a material suitable for each function may be selected. Not limited.
  • FIG. 11 is a schematic view showing still another example of the manufacturing process of the translucent electromagnetic wave shielding material of the second invention of the present invention.
  • FIG. 12 is a schematic view showing an apparatus for depositing a black electrodeposition layer on a metal layer according to the present invention. 1 indicates a transparent substrate, 2 indicates a metal layer, 5 indicates a black electrodeposited layer, and 6 indicates a counter electrode.
  • the metal 2 is provided on the transparent base 1 in a pattern (see FIG. 11a).
  • the metal layer 2 As a method of patterning the metal layer 2, there is a method in which the metal layer 2 is provided on the entire surface of the transparent substrate 1, and photolithography or the like is used for the metal layer 2. It is also possible to form a conductive metal film pattern in advance and then bond it to the transparent substrate 1.
  • the pattern of the metal layer 2 includes, for example, a lattice pattern (see FIG. 2), a honeycomb pattern (see FIG. 3), a ladder pattern (see FIG. 4), and a reverse polka dot pattern (see FIG. 5).
  • a black electrodeposition layer 5 that is in register with the metal layer 2 is deposited on the patterned metal layer 2 (see FIG. 11b).
  • the black electrodeposition layer 5 is a layer for suppressing the reflection of the surface of the metal layer 2 to enhance the visibility, and for example, there is an ionic polymer containing black particles. like this
  • the transparent substrate 1, on which the metal layer 2 was laminated in the previous step is immersed together with the facing electrode 6 in a solution of a polymer containing black particles, (See Figure 12).
  • black particles examples include carbon black, titanium black, and aniline black. Further, instead of the black-based particles, some particles other than the black-based particles may be combined so as to have a substantially black-based appearance.
  • the black type includes a color other than pure black, for example, a dark brown or a dark green.
  • an acrylic resin, a polyester resin, a polybutadiene resin, a maleic resin, an epoxy resin, a urethane resin, a polyamide resin, or a modified product thereof, which is obtained by amination or carboxylation is used.
  • the content of the ionic polymer in the aqueous solution is from 1 to 30 parts by weight of the solid content.
  • additives such as inorganic salts, organic salts, surfactants, and organic solvents are used for the purpose of stabilizing the conditions during energization and improving the conductivity and mechanical surface properties of the black electrodeposition layer 5. May be added to the solution of the ionic polymer.
  • the energization is performed by exposing a part of the metal layer 2 laminated on the transparent substrate 1 upward from the liquid interface or by connecting an insulated coated lead wire and applying a voltage of 1 to 300 V to the counter electrode 6. : Apply pressure.
  • the black electrodeposition layer 5 may be made of a black conductive polymer.
  • the transparent substrate 1 on which the metal layer 2 is laminated in the previous step together with the counter electrode 6 is immersed in a solution of the monomer of the conductive II polymer, and the current is applied. . It is so-called electrolytic polymerization.
  • the monomer of the conductive polymer is selected from, for example, virol, aniline, thiophene, and derivatives thereof.
  • Solvents for dissolving the monomers include water, acetonitrile, propion carbonate, tetrahydrofuran, nitromethane, methanol, ethanol, and sulfolane.
  • a dopant is added to a solution of a conductive polymer monomer in the solution. Examples of dopants include lithium perchlorate, tetraalkylammonium borofluoride, and sulfuric acid.
  • as a current supply method there is a method of periodically increasing and decreasing the potential, in addition to a constant potential electrolysis method and a constant current electrolysis method.
  • the color of the deposited conductive polymer varies depending on the conditions at the time of energization, the degree of polymerization, the type of monomer, etc., but it is generally black, and it is possible to suppress the reflection on the surface of the metal sludge. it can.
  • the thickness of the black electrodeposition layer 5 is 0.1 / ⁇ ! ⁇ And the power of 5 'preferred. If it exceeds m, it becomes difficult to finish the above pattern with high precision. If it is less than 0.1 m, sufficient light-shielding properties cannot be maintained, and it is difficult to suppress reflection on the surface of the metal layer 2.
  • the load It is anticipated that a black electrodeposition layer 5 composed of black particles of the same nature and that using a solution containing black particles in micelles in the production process will be obtained.
  • the black electrodeposition layer 5 is a layer for suppressing the reflection on the surface of the metal layer 2 to enhance the visibility, and an electroplated film having a black color tone may be used.
  • the transparent substrate 1 on which the metal layer 2 is laminated in the previous step is immersed together with a counter electrode in an electroplating solution for forming a coating having a black color tone. Then, turn on the power (see Fig. 12).
  • Nickel-based, chromium-based, rhodium-based, tin-nickel-copper ternary alloy or tin-nickel-molybdenum ternary alloy-based coatings can be used as the hot-plated coating having a black color tone.
  • the black type in the present invention includes, for example, black-brown brown or blackish green other than black.
  • Examples of the method of electroplating include placing the transparent substrate 1 on which the metal layer 2 is laminated in a rack, hanging it, immersing it, and applying electricity to it. There is a method in which a plating solution is sprayed onto the transparent substrate 1 on which the metal layer 2 is laminated to energize and adhere.
  • a continuous (hoop) plating method can be used.
  • the color tone of the deposited electroplated film slightly varies depending on the conditions at the time of energization, the composition of the plating solution components, and the like, it is basically black and can suppress reflection on the surface of the metal layer 2.
  • the thickness of the black electrodeposition layer 5 is preferably 0.1 m / m to 10 / m. If it exceeds 10 / im, it becomes difficult to finish the above pattern with high accuracy, and if it is less than 0.1 lm, sufficient light-shielding properties cannot be maintained and it becomes difficult to suppress reflection on the surface of the metal layer 2.
  • a protective layer may be provided on one or both surfaces of the shield material by film-laminate if necessary.
  • the protective layer can include various functions, for example, a non-glare function, an antistatic function, and an anti-Newton ring function. Not limited.
  • the translucent electromagnetic wave shielding material of the present invention is usually used so as to be seen through from the surface on which the metal layer 2 and the black electrodeposition layer 5 of the transparent substrate 1 are laminated, but the metal layer 2 has transparency. When formed to be as thin as possible, the transparent substrate 1 can be used so as to be seen through.
  • FIG. 13 is a schematic view showing one embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the third invention of the present invention.
  • 1 indicates a transparent substrate
  • 2 ' indicates a metal layer
  • 7 indicates a black-colored metal compound.
  • a metal layer 2 is provided in a pattern on a transparent base 1 (see FIG. 3 a).
  • the metal layer 2 ′ may be made of the same material as the metal layer used in FIG. 1, but it is necessary to generate a compound that exhibits a black color by a chemical conversion treatment. Use a conductive material that can shield electromagnetic waves.
  • the method of forming the patterned metal layer 2 ′ includes a method of depositing from a gas phase such as vapor deposition, sputtering, or ion plating, a method of bonding gold foil, and a method of electrolessly plating the surface of the transparent substrate 1. After providing the metal layer 2 ′ on the entire surface of the transparent substrate 1, patterning is performed. Thickness of the metal layer 2 ', the mosquitoes? Preferably to 0.1 m ⁇ 50 / m.
  • a photoresist may be solidly formed, exposed using a mask, developed, formed into a pattern, etched, and stripped.
  • a printing register may be used.
  • the pattern of the metal layer 2 includes, for example, a lattice (see FIG. 2), a honeycomb (see FIG. 3), a ladder (see FIG. 4), and a reverse polka dot (see FIG. 5). .
  • the surface layer of the metal layer 2 ' is formed into a black metal compound 7 by a chemical conversion treatment (see FIG. 13b).
  • the chemical conversion treatment is a treatment for changing the composition of the metal surface by a chemical or a solution thereof, and includes, for example, an oxidation treatment, a phosphoric acid treatment, and a sulfuration treatment.
  • a chemical conversion treatment is used so that the metal compound exhibits a black color according to the material of the metal layer 2.
  • the material of the metal layer 2 ′ is copper, sodium chlorite and hydroxide are used.
  • the metal layer 2 ' is immersed in an aqueous solution containing potassium, an aqueous solution containing antimony polysulfide, an aqueous solution containing sodium chlorite and sodium phosphate, and sodium hydroxide, and an aqueous solution containing persulfuric acid and sodium hydroxide. It is good.
  • the metal layer 2 ' is iron
  • the metal layer 2' is preferably immersed in an aqueous solution containing zinc dihydrogen phosphate.
  • the depth of formation of the black metal compound 7 is set to such an extent that the shielding effect of the metal layer 2 'is not impaired by adjusting conditions such as the composition, temperature, and immersion time of the solution for chemical conversion treatment.
  • black as used in the present invention includes, besides pure black, for example, dark brown and blackish green.
  • the translucent electromagnetic wave shielding material obtained as described above has translucency at the opening of the metal layer 2 ′, and the surface layer of the metal layer 2 ′ is black, so that the surface of the metal layer 2 ′ is black. Reflection is suppressed.
  • a protective layer may be provided on one or both surfaces of the shielding material by coating or film laminating as necessary.
  • the material of the protective layer is not particularly limited, since the protective layer can include various functions, such as a non-glare function, an antistatic function, and an anti-Newton ring function.
  • the light-transmitting electromagnetic wave shielding material of the present invention usually has a force used to see through from the surface on which the gold layer 2 ′ and the black electrodeposition S layer 7 of the transparent substrate are laminated, and the metal layer 2 ′ is transparent. In the case where it is formed thin enough to have the following, the transparent substrate 1 can be used so as to be seen through.
  • FIG. 14 is a schematic view showing one embodiment of the manufacturing process of the translucent electromagnetic wave shielding material of the fourth invention of the present invention.
  • FIGS. 15 to 17 are schematic views showing another embodiment of the process for producing the light-transmitting magnetic wave shielding material of the fourth invention.
  • 11 indicates a transparent substrate
  • 12 indicates a black dyed layer
  • 20 indicates a bleached portion
  • 21 indicates a non-bleached portion
  • 13 indicates a metal layer
  • 14 indicates a resist layer.
  • a black dyeing layer 12 and a metal layer 13 are sequentially provided on the transparent substrate 11 (see FIG. 14a). .
  • the material of the transparent substrate 11 is glass, acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysulfone resin, polyether sulfone. Any transparent material such as resin or polyvinyl chloride may be used.
  • the transparent substrate 11 may be a plate, a film, or the like.
  • the black dyed layer 12 is a slaughter for suppressing reflection on the back surface of the metal layer 13 and improving visibility. You.
  • the black dyed layer 12 is made of, for example, natural resin such as acrylic resin, polyester resin, cellulose resin, polyolefin resin, polyvinyl alcohol resin, gelatin, etc. Are dissolved or dispersed in a solvent together with a black dye, and formed by a roll coating method, a spin coating method, a full-surface printing method, or the like.
  • a film made of the above resin may be formed by a roll coating method, a spin coating method, a full-surface printing method, or the like, and then dyed with a black dye.
  • a heat transfer dye may be dyed on the resin film by heat transfer.
  • the type of dye that can be used differs depending on the type of the resin of the substrate.
  • the black dye a commercially available dye may be used, or a mixture of two or more dyes having a hue other than black may be used to make it black.
  • the material of the metal layer 13 for example, a material having sufficient conductivity such as gold, silver, copper, iron, nickel, and chromium to sufficiently shield the I magnetic wave is used.
  • the metal layer 13 is not limited to a simple substance, but may be an alloy or a multilayer. Examples of the method for forming the metal layer 13 include a method of depositing from a gas phase such as vapor deposition, sputtering, and ion plating, a method of bonding a gold JR foil, and a method of non-dissolving the surface of the transparent substrate 11. is there.
  • the thickness of the metal layer 13 is Ol / in! It is preferably set to ⁇ ⁇ ⁇ 50 / m.
  • a resist layer 14 is provided in a pattern on the metal layer 13 (see FIG. 14b).
  • the resist layer 14 is a layer used for patterning the metal layer 13 in the process of manufacturing the translucent electromagnetic wave shielding material.
  • Resist; ⁇ 14 includes photoresist and print resist.
  • a photosensitive resin such as photosensitive polyimide, polyepoxy acrylate, and novolak is formed on the metal layer 13 by a mouth coating method, a spin coating method, a full printing method, a transfer method, or the like. Solid type Formed, exposed using a mask, and developed.
  • the printing resist is formed in a pattern on the metal layer 13 by offset printing or gravure printing using a resin such as polyester, for example.
  • the pattern of the resist layer 14 includes, for example, a lattice (see FIG. 2), a honeycomb (see FIG. 3), a ladder (see FIG. 4), and a reverse polka dot (see FIG. 5). .
  • the etching solution is selected according to the material of the metal layer 13. For example, if the material of the metal layer 13 is gold, use aqua regia, use silver to use an aqueous ferric nitrate solution, use copper to use an aqueous ferric chloride or cupric chloride solution, use chromium to use an aqueous cerium nitrate solution, or the like. Good to use.
  • the material of the metal layer 13 is gold, use aqua regia, use silver to use an aqueous ferric nitrate solution, use copper to use an aqueous ferric chloride or cupric chloride solution, use chromium to use an aqueous cerium nitrate solution, or the like. Good to use.
  • the portion of the black stained layer 12 not covered with the patterned metal layer 13 in this etching step is decolorized by the acid of the etching solution. (See Figure 14c).
  • the black dye layer 1 2 dyes, those forces easily decolorized by an etchant? Are selectively used.
  • the black dyed layer 12 laminated on the transparent substrate 11 is composed of a pattern-shaped bleached portion 20 and other non-bleached portions 21 and is not bleached on the black stained layer 12
  • a translucent magnetic wave shielding material in which the metal layer 13 corresponding to the part 21 is laminated is obtained.
  • the transparent electromagnetic wave shielding material described above has a portion where the metal layer 13 has been removed and the decolorized portion 20 have a light-transmitting property, and the non-bleached portion of the black dyed layer 2 which is in register with the metal layer 12. 21 suppresses reflection on the surface of the metal layer 13.
  • the manufacturing process of the translucent electromagnetic wave shielding material is not limited to the above-described embodiment.
  • the resist layer 14 may be peeled off after the etching is completed using a peeling liquid (see FIG. 15).
  • a peeling liquid see FIG. 15
  • an alkali aqueous solution such as sodium hydroxide or potassium hydroxide, an organic solvent such as acetone or ethyl acetate-solve acetate, or a mixture thereof may be used.
  • a black dyeing layer 12 and a metal layer 13 are sequentially provided on the transparent substrate 11 (see FIG. 16a), and a resist layer 14 is provided in a pattern on the metal layer 13 (see FIG. 1).
  • the portion of the metal layer 13 not covered with the resist layer 14 is removed with an etching solution (see FIG. 16c), and then the portion of the metal layer 13 not covered with the patterned metal layer 13 is removed.
  • the black stained layer 12 may be decolorized with a decolorizing solution separate from the etching solution (see I3l6d).
  • Color liquids include surfactant aqueous solution, sodium chlorite aqueous solution, sodium hypochlorite aqueous solution, hydrogen peroxide aqueous solution, sodium nitrate aqueous solution, stannous chloride aqueous solution, formaldehyde sodium sulfoxylatonite
  • An aqueous solution, an aqueous solution of urea dioxide, an aqueous solution of hydrosulfite sodium, and an aqueous solution of a colorless and transparent dye intermediate are used.
  • an extra step only for decolorization is required, and decolorization at the same time as etching is more preferable.
  • the colorless and transparent dye intermediate which has a higher affinity for the resin forming the black dyed layer than the black dye dyed in the black dyed layer, takes precedence in the resin instead of the black dye. May be dyed. As a result, the black color of the portion where the metal layer is not laminated is bleached and becomes colorless and transparent. In order to perform decolorization by such a mechanism, it is necessary to properly select a combination of a resin, a black dye, and a colorless and transparent dye intermediate.
  • a black dyeing layer 12 and a metal layer 13 are sequentially provided on the transparent substrate 11 (see FIG. 17a), and the resist layer 14 is patterned on the metal layer 13. (See Figure 17b), remove the metal layer 13 that is not covered with the resist layer 14 with an etching solution (see Figure 17c), and then peel off the resist layer 14 Then, in the stripping step of the resist layer 14, the black dyeing / 212 of the portion not covered with the patterned metal layer 13 may be decolorized with a stripping solution (see FIG. 17d). In this case, since the decoloring is performed simultaneously with the peeling of the resist layer, a step only for the decoloring is not required, and the production of the translucent material is simple. In addition, the decolorization in the manufacturing process of the translucent electromagnetic wave shielding material of the present invention may be performed in a plurality of steps after the etching step.
  • a bleaching agent may be added to the etching solution and / or the stripping solution.
  • the decolorizing agent include surfactants, sodium chlorite, sodium hypochlorite, peroxides such as hydrogen peroxide, sodium nitrate, primary chloride, sodium formaldehyde sodium sulfoxylate dihydrate, Examples include thiourea dioxide, sodium hydrosulfite, and colorless and transparent dye intermediates.
  • FIG. 18 shows an embodiment of the translucent electromagnetic wave shielding material according to the fifth invention. That is, a metal sheet 32 is provided in a pattern on a transparent first substrate 31 made of a film, and a sticking sheet is provided in which a black resist pattern 33 matching the metal layer 32 is provided on gold 15 32. DOO 3 4 forces?, through the adhesive layer 3 6, bonding a first substrate 3 a transparent plate such that the outer surface, the second substrate 35 a transparent consisting film having a three-dimensional object or functional layer It has been.
  • an adhesive sheet 34 is prepared. Specifically, first, a metal layer 32 is provided on the entire surface of the transparent first substrate 31 made of a film (see FIG. 19a).
  • the material of the transparent first substrate 31 made of a film includes acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysalfone resin, polystyrene resin. Use ether sulfone resin, polyvinyl chloride resin, etc.
  • the material of the metal layer 32 for example, a material such as gold, silver, copper, iron, nickel, and chromium having conductivity enough to shield electromagnetic waves is used.
  • the metal layer 32 need not be a simple substance, but may be an alloy or a multilayer.
  • the method of forming the metal layer 32 is Examples of the method include a method of depositing from a gas phase such as vapor deposition, sputtering, and ion plating, a method of bonding a metal foil, and a method of electrolessly plating the surface of the transparent first substrate 31.
  • the thickness of the metal layer 32 is preferably 0.1; If it exceeds 50 / m, it will be difficult to finish the pattern with high precision. If it is less than 0.1 / m, it will not be possible to stably secure the minimum necessary conductivity to maintain the electromagnetic shielding effect.
  • a black resist layer 33 is provided in a pattern on the metal layer 32 (see FIG. 19b).
  • the black resist layer 33 is a layer for suppressing the reflection on the surface of the metal layer 32 to enhance the visibility, and is used for patterning the metal layer 32 in the process of manufacturing the translucent magnetic wave shielding material.
  • the black resist layer 33 includes a photoresist and a printing resist.
  • Photoresist is prepared, for example, by coating a photosensitive resin such as photosensitive polyimide, polyepoxyacrylate, and novolak with a black dye and pigment by a roll coating method, a spin coating method, a full-surface printing method, a transfer method, or the like; A solid pattern is formed on 13 2, exposed using a photomask, and developed to form a pattern.
  • the printing resist is formed in a pattern on the metal layer 32 by a screen printing method, an offset printing method, or a gravure printing method using, for example, a resin such as polyester containing a black pigment. It is formed.
  • the pattern of the black resist layer 33 is, for example, a lattice (see FIG. 2), a honeycomb (see FIG.
  • the thickness of the black resist layer 33 is preferably set to OlmOjum. If it exceeds 10 // m, it becomes difficult to finish the above pattern with high accuracy, and if it is smaller than 10 // m, sufficient light-shielding properties cannot be maintained and it is difficult to suppress reflection on the surface of the metal layer 32.
  • the portion of the metal layer 32 not covered with the black resist cover 33 is removed using an etchant (see FIG. 19c).
  • an etchant see FIG. 19c.
  • the adhesive sheet in which the metallic layer 32 is laminated in a pattern on the transparent first base 31 and the black resist layer 33 which is in register with the metallic layer 32 on the metallic layer 32 is laminated.
  • the etching solution is for the metal layer 3 2 Select according to the material.
  • the material of the gold layer 32 is gold, it is aqua regia, if it is silver, ferric nitrate aqueous solution, if it is copper, it is ferric chloride or cupric chloride aqueous solution, if it is chromium, it is cerium nitrate aqueous solution, etc. It is better to use
  • an adhesive layer 36 is provided on a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer, and the adhesive sheet 34 is formed so that the transparent first substrate 3 has a Yuka outer surface.
  • a translucent magnetic wave shielding material is obtained by bonding (see Fig. 20).
  • the material of the transparent second substrate 35 consisting of a plate and a three-dimensional object is glass, acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin.
  • the material of the transparent second substrate 35 made of a film having the functionality / g includes acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, and polypropylene.
  • Functional layers such as hardened layer, transparent conductive layer, anti-reflection layer, fine uneven layer, and fluorine-containing layer on the surface of resin film such as resin, polyester resin, polysulfone resin, polyethersulfone resin, and polyvinyl chloride resin. The provided ones can be mentioned.
  • These functional layers provide functions such as curing improvement, antistatic, antireflection, antifogging, and water repellency.
  • the material of the adhesive layer 36 may be, for example, epoxy resin, phenolic resin, reactive acrylic resin, polyurethane resin, melamine resin, rubber resin, urea resin, or a polymer containing these resins. A blend or a copolymer is used.
  • a method for forming the adhesive layer 36 include a coating method such as a gravure coating method, a black coating method, and a comma coating method, and a printing method such as a gravure coating method and a screen printing method.
  • the adhesive sheet 34 may be connected to the black resist layer 33 via the adhesive layer 36. It may be a plate, a three-dimensional object, or a film having a functional layer so that it has an outer surface. (See FIGS. 21 and 22). In this case, if necessary, a protective layer or a protective film may be provided on the black resist layer 33 side.
  • the adhesive sheet 36 is provided on the sticking sheet 34, and is made of a plate, a three-dimensional object, or a film having a functional layer.
  • a translucent electromagnetic wave shielding material may be obtained by bonding the transparent electromagnetic wave shielding material to the transparent second substrate 35 (see FIGS. 23 and 24).
  • the step of providing the black resist layer 33 in a pattern comprises providing the free layer 37 which is patterned on the metal layer 32. (See Fig. 25a), a black resist layer 33 is provided on the metal layer 32 and the free layer 37 (see Fig. 25b), and the free layer 37 is removed by removing the free layer 37 with the free removing solution.
  • the black resist layer 33 may also be removed (see FIG. 25c).
  • As the material of the free layer 37 a generally available printing resist material or a photoresist material is used.
  • a pattern is formed on the metal layer 32 by a screen printing method using a printing resist material, a roll coating method using a photoresist material, a spin coating method, or the like.
  • a solid pattern is formed on the metal layer 32 by a coating method, a dip coating method, a full-surface printing method, a transfer method, or the like, is exposed using a photomask, is developed, and is developed to form a pattern.
  • the pattern of the free layer 37 includes, for example, a reciprocal lattice shape (see Fig. 7), a reverse honeycomb shape (see Fig. 8), a reverse ladder shape (see Fig. 9), a polka dot shape (see Fig. 10), and the like. .
  • the liberation removing solution a different type is used depending on the material of the game. For example, if the free layer 37 is of an alkaline stripping type, use an aqueous solution of potassium hydroxide or sodium hydroxide. If the free layer 37 is a water-peelable type, use water. If the free layer 37 is a solvent-peelable type, use ethyl acetate-soluble acetate, acetone, or the like.
  • (Sixth invention) ⁇ 26 shows an example of the translucent mane magnetic wave shielding material according to the 6th Akira. That is, a metal layer 32 was provided in a pattern on a transparent first substrate 31 made of a film, and a black electrodeposition layer 38 was provided on the metal layer 32 in register with the metal layer 32. A transparent second substrate 3 made of a plate, a solid, or a film having a functional layer is formed such that the bonding sheet 39 is provided with the transparent first substrate 31 as an outer surface via the adhesive layer 36. It is attached to 5.
  • an adhesive sheet 39 is produced.
  • a metal layer 32 is provided in a pattern on a transparent first substrate 31 made of a film (see FIG. 27a).
  • the material and material thickness of the transparent first base 31 and the metal slaughter 32 are the same as those of the fifth invention.
  • Examples of the method of forming the patterned metal layer 32 include a method of depositing from a gas phase such as vapor deposition, sputtering, or ion plating, a method of bonding a metal foil, and a method of forming a transparent first substrate 31 with a non-decomposable surface.
  • the metal layer 32 is provided on the entire surface of the transparent first substrate 31 by a method such as the above, patterning is performed.
  • a photoresist may be solidly formed, exposed using a photomask, developed, formed into a pattern, etched, and stripped. Further, a printing resist may be used.
  • the pattern of the metal layer 32 has a lattice shape, a honeycomb shape, a ladder shape, an inverted polka dot shape, and the like.
  • the transparent first substrate 31 provided with the metal layer 32 in the previous step is immersed together with the counter electrode 41 in a solution 40 of an ion-containing polymer containing black particles, and a current is applied (see FIG. 27 b).
  • black particles include carbon black, titanium black, and aniline black.
  • some particles other than the black-based particles may be combined so as to have a substantially black-based appearance.
  • the term “black system” as used in the present invention includes, for example, black brown and power other than black, and blackish green.
  • the ionic polymer include acryl resin, polyester resin, polybutadiene resin, male resin, epoxy resin, urethane resin, polyamide resin and modified products thereof.
  • the content of the ionic polymer in the aqueous solution is 1 to 30 parts by weight of solid content.
  • the energization is performed by exposing a part of the metal layer 32 laminated on the transparent first substrate 31 upward from the liquid interface or connecting a lead wire that is completely covered, and connecting the counter electrode 41 with a voltage of 1 to 300 V. Voltage.
  • inorganic salts, organic salts, surfactants, organic solvents, and the like are used for the purpose of stabilizing the conditions during energization and improving the compressibility and mechanical surface properties of the resulting black electrodeposited layer 38. Additives may be added to the solution of the ionic polymer.
  • a black electrodeposition layer 38 was deposited on the metal layer 32, and as a result, a metal layer 32 was provided in a pattern on the transparent first substrate 31 and a metal layer was formed on the metal layer 32.
  • An adhesive sheet 39 in which a black electrodeposition layer 38 corresponding to the layer 32 is laminated is obtained (see FIG. 27c).
  • the black electrodeposition layer 38 is a layer for suppressing the reflection on the surface of the metal layer 32 to enhance the visibility.
  • An adhesive layer 36 is provided on a transparent second substrate 35 made of a material, a plate, a three-dimensional object, or a film having a functional layer, and the adhesive sheet 39 is used as the outer surface of the transparent first substrate 31.
  • a translucent electromagnetic wave shielding material is obtained by bonding as shown in Figure 28.
  • the material of the transparent second substrate 35 and the adhesive layer 36 and the method of forming the adhesive layer 36 are the same as those of the fifth invention.
  • the adhesive sheet 39 may be provided with a black electrodeposition layer via an adhesive layer 36. It may be bonded to a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer so that 38 is the outer surface (see FIGS. 29 and 30). In this case, a protective film or a protective film may be provided on the black electrodeposition work 38 side as necessary.
  • an adhesive layer 36 is provided on the sticking sheet 39 in advance, and a film having a plate, a three-dimensional object, or a functional layer is provided.
  • a translucent electromagnetic wave shield material may be obtained by attaching the transparent electromagnetic wave shield material to a transparent second base material 35 (see FIGS. 31 and 32).
  • the step of providing the black electrodeposition layer 38 comprises the steps of: forming a metal layer 32 on a transparent first substrate 1 made of a film;
  • the transparent first substrate 31 provided with the metal 32 in the previous step may be immersed together with the counter electrode 41 in a solution of the conductive polymer monomer and may be energized.
  • electrolytic polymerization The monomer of the conductive polymer is selected from pyrrole, aniline, thiophene and derivatives thereof.
  • a solvent for dissolving the monomer water, acetonitrile, probion force, tetrahydrofuran, nitromethane, methanol, ethanol, sulfolane, or the like is used.
  • a dopant is added to a solution of a conductive polymer monomer in the solution. Examples of the dopant include lithium perchlorate, tetraalkylammonium borofluoride, and sulfuric acid. Further, in order to more stably form the black electrodeposition layer 38, it is desirable to control the mane position using the reference electrode.
  • a compressing method there is a method of periodically increasing and decreasing the potential, in addition to a constant potential electrolysis method and a constant flow S solution.
  • the color of the deposited conductive polymer varies in color depending on the conditions at the time of conduction, the degree of polymerization, the type of monomer, etc., but is generally black and suppresses reflection on the metal (132) surface. be able to.
  • black electrodeposited particles 38 comprising charged black-based particles and those using a solution containing black-based particles in micelles in the production process are possible. Is done.
  • the process for providing the black electrodeposition layer 38 includes the steps of:
  • the transparent first substrate 31 provided with the metal layer 32 in the previous step is immersed together with the counter electrode 41 in a plating solution for forming an electric plating film having a color tone of It may be an electric device.
  • the electroplating film having a black color tone As the electroplating film having a black color tone, a nickel-based, chromium-based, rhodium-based, tin-nickel-copper ternary alloy-based or tin-nickel-molybdenum ternary alloy-based one can be used.
  • the black type in the present invention includes, for example, black-brown brown or blackish green other than black.
  • FIG. 33 shows an embodiment of the translucent electromagnetic wave shielding material according to the seventh invention. That is, the adhesive sheet 43 provided on the transparent first base body 31 made of a film in the form of a metal layer 32 in a force pattern, and the surface layer of the metal layer 32 is a metal compound 42 having a black color.
  • the transparent first substrate 31 is bonded via an adhesive layer 36 to a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer so that the transparent first substrate 31 is an outer surface.
  • an adhesive sheet 43 is prepared. Specifically, first, a metal layer 32 is provided in a pattern on a transparent first substrate 31 made of a film (see FIG. 34a). The material and thickness of the transparent first base 31 and the metal layer 32, the method of forming the patterned metal layer 32, the pattern of the metal layer 32, and the like are the same as in the sixth invention.
  • the surface layer of the metal layer 32 is formed into a black metal compound 42 by a chemical conversion treatment (see FIG. 34b).
  • a chemical conversion treatment is a treatment for changing the composition of the metal surface by a chemical or a solution thereof, and includes, for example, an oxidation treatment, a phosphoric acid treatment, and a sulfuration treatment.
  • a chemical conversion treatment is used so that the metal compound exhibits a black color according to the material of the metal layer 32.
  • the metal layer 32 when the material of the metal layer 32 is copper, sodium chlorite and hydroxyl An aqueous solution containing potassium potassium, an aqueous solution containing antimony polysulfide, an aqueous solution containing sodium chlorite and sodium phosphate, sodium hydroxide, It is recommended that the metal layer 32 be immersed in an aqueous solution containing potassium perluate and sodium hydroxide. Layer 32 may be immersed.
  • the black metal compound 42 is a part for suppressing the reflection of the surface of the metal layer 32 to enhance the visibility. The formation depth of the black metal compound 42 depends on the composition and temperature of the chemical conversion solution. The shielding effect of the metal layer 32 is set so as not to hinder by adjusting conditions such as the immersion time.
  • the black in the present invention includes a color other than black, for example, a dark brown or a dark green.
  • An adhesive layer 36 is provided on a transparent second substrate 35 made of a material, a plate, a three-dimensional object, or a functional film, and the adhesive sheet 43 is formed so that the transparent first substrate 31 becomes the outer surface. Then, a translucent magnetic wave shielding material is obtained by pasting it on the substrate (see Fig. 35).
  • the material of the transparent second substrate 35 and the adhesive layer 36 and the method of forming the adhesive layer 36 are the same as those of the first invention.
  • the adhesive sheet 43 may be a metal compound that exhibits black via the adhesive layer 36. It may be bonded to a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer so that 2 is the outer surface (see FIGS. 36 and 37). In this case, if necessary, a protective layer or a protective film may be provided on the side of the metal compound 42 exhibiting black color.
  • the adhesive sheet 36 is provided on the sticking sheet 43 so that a plate, a three-dimensional object, or a film having a functional layer is provided.
  • a translucent electromagnetic wave shielding material may be obtained by bonding to a transparent second substrate 35 (see FIGS. 38 and 39).
  • FIG. 40 shows an embodiment of the translucent electromagnetic wave shielding material according to the eighth invention. That is, On the transparent first substrate 31 made of a film, a black dyed layer 46 composed of a pattern-shaped decolorizing part 44 and other non-decolored parts 45 is provided, and a non-decolored part is formed on the black dyed layer 46. 4 Adhesive sheet provided with a metal layer 3 2 that matches register 5 4 7 A plate, a three-dimensional object, or a functional layer so that the transparent first base 31 is the outer surface via the adhesive layer 36 It is bonded to a transparent second substrate 35 made of a film having
  • an adhesive sheet 47 is prepared. Specifically, first, a black dye layer 46 and a metal layer 32 are sequentially provided on a transparent first substrate 31 made of a film (see FIG. 41a). The material of the transparent first base 31 and the metal layer 32 and the method of forming the metal layer 32 are the same as those of the fifth invention.
  • the black dyed layer 46 is a layer for suppressing reflection of the metal layer 32 to enhance visibility.
  • the black dyed layer 46 is made of, for example, an acrylic resin, a polyester resin, a cellulose resin, a polyolefin resin, a polyvinyl alcohol resin, a natural polymer resin such as gelatin, a copolymer thereof, a mixture thereof, or the like.
  • a film made of the above resin may be formed by a roll coating method, a spin coating method, a full-surface printing method, or the like, and then dyed with a black dye.
  • the resin film may be dyed with a heat transfer dye by heat transfer. Since the decolorization of the dye from the black dyed layer 46 substrate greatly differs depending on the combination of the dye and the substrate, the type of dye that can be used differs depending on the type of the resin of the substrate.
  • the black dye a commercially available dye may be used, or two or more dyes having a hue other than black may be mixed to black.
  • a resist layer 48 is provided in a pattern on the metal layer 32 (see FIG. 4 lb).
  • the material of the resist layer 48 include a photoresist and a printing resist.
  • the photoresist is formed by coating a photosensitive resin such as photosensitive polyimide, polyepoxy acrylate, and novolak by a roll coating method, a spin coating method, a full printing method, a transfer method, or the like. Solid on top and exposed using photo mask And then developed.
  • the printing resist is formed in a pattern on the metal layer 32 by offset printing or gravure printing using a resin such as polyester, for example.
  • the pattern of the resist layer 48 includes, for example, a lattice shape, a honeycomb shape, a ladder shape, and a reverse polka dot pattern.
  • portions of the metal layer 32 not covered with the resist layer 48 are removed using an etching solution, and the portions of the black stained layer 4 not covered with the patterned metal layer 32 in this etching step are removed.
  • the adhesive sheet 47 is obtained by decolorizing 6 with an etchant (see FIG. 41c).
  • the etching solution is selected according to the material of the metal layer 32. For example, when the material of the metal layer 32 is gold, aqua regia is used for gold, ferric nitrate aqueous solution is used for silver, ferric chloride or cupric chloride aqueous solution is used for copper, and cerium nitrate aqueous solution is used for chromium. You may want to use something like that.
  • the dye of the black dyed layer 46 a dye which is easily decolored by the above-mentioned etching solution is selectively used.
  • the resist layer 48 may be left, or may be removed using a resist removing solution.
  • a resist removing solution an aqueous solution of sodium hydroxide such as sodium hydroxide or potassium hydroxide, an organic solvent such as acetone or ethyl acetate solvent, or a mixed solution thereof may be used.
  • An adhesive layer 36 is provided on a transparent second substrate 35 made of a material, a plate, a three-dimensional object, or a film having a functional layer, and the adhesive sheet 47 is used as the outer surface of the transparent first substrate 31.
  • a translucent magnetic shielding material is obtained by bonding as shown in Fig. 42.
  • the material of the transparent second substrate 35 and the adhesive layer 36 and the method of forming the adhesive layer 36 are the same as those of the fifth invention.
  • the configuration of the translucent electromagnetic wave shielding material according to the eighth invention is not limited to the above-described embodiment.
  • the metal sheet 3 may be attached via the bonding sheet 4 and the adhesive layer 36. It may be bonded to a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having functionality, such that 2 is the outer surface (see FIGS. 43 and 44). in this case, If necessary, a protective layer or a protective film may be provided on the metal layer 32 side.
  • the adhesive sheet 36 is provided on the sticking sheet 47, and is made of a plate, a three-dimensional object, or a film having a functional layer.
  • a light-transmitting / electromagnetic shielding material may be obtained by bonding to the transparent second substrate 35 (see FIGS. 45 and 46).
  • the step of providing a black dyeing part 46 comprising a pattern-like decolorization part 44 and another non-bleaching part 45 includes a transparent film-forming step.
  • a black dye layer 46 and a metal layer 32 are provided on the first base 31 and a resist layer 48 is provided in a pattern on the gold JS layer 32 (see FIG. 47a).
  • the metal layer 32 that is not covered is removed using an etchant (see FIG. 47 b), and then the black dyed layer 46 that is not covered by the patterned metal layer 32 is etched. It may be one that decolorizes with another decolorizing solution (see Figure 47c).
  • the decolorizing solution examples include an aqueous solution of a surfactant, an aqueous solution of sodium chlorite, an aqueous solution of sodium hypochlorite, an aqueous solution of hydrogen peroxide, an aqueous solution of sodium nitrate, an aqueous solution of stannous chloride, and an aqueous solution of sodium formaldehyde sodium sulfoxylate 3 ⁇ 4 ⁇ .
  • Thiourea dioxide aqueous solution, sodium hydrosulfite aqueous solution, colorless and transparent dye intermediate aqueous solution, etc., and a bleaching agent suitable for the dye of the black dye layer 46 is appropriately used.
  • the resist layer 48 may be left after the etching step, or may be removed using a resist removing liquid before or after decolorization with the decolorizing liquid.
  • the step force 5 providing a black dyed layer 4 6 made of other non-bleaching unit 4 5 which the pattern of bleaching unit 4 4, from the film
  • a black dyed layer 46 and a metal layer 32 are provided on the transparent first base 31, and a resist layer 48 is provided in a pattern on the metal layer 32 (see FIG. 48 a).
  • the portion of the metal layer 32 not covered with the metal layer 32 is removed using an etchant (see FIG. 48 b), and then the resist layer 48 is removed using a resist remover.
  • the black dyed layer 46 in the portion not covered with the patterned gold layer 32 may be decolorized with a resist removing liquid (see FIG. 48 c).
  • a dye which is easily decolored by a resist removing solution is selected and used.
  • a plurality of decolorization using an etching solution, decolorization using a decolorization solution different from the etching solution, and decolorization using a resist removal solution may be combined.
  • FIG. 49 shows an embodiment of the translucent magnetic wave shielding material according to the ninth invention. That is, a release layer 49, a metal layer 32 provided in a pattern on the release layer 49, and a black resist layer 3 provided on the metal layer 32 in register with the metal layer 32.
  • the transparent second substrate 3 made of a plate, a three-dimensional object, or a film having functionality so that the transfer layer 50 composed of 3 and the peeling layer 49 becomes the outer surface via the adhesive layer 36. 5 has been transcribed.
  • a transfer sheet 52 is prepared. Specifically, first, a release layer 49 and a gold-like layer 32 are sequentially provided on the entire surface of the first substrate 51 made of a film (see FIG. 50a).
  • the material K of the first substrate 51 made of a film is acrylic resin, polycarbonate resin, polyethylene resin, AS resin, vinyl acetate resin, polystyrene resin, polypropylene resin, polyester resin, polysulfone resin, polyether. Sulfone resin, polyvinyl chloride resin, etc. are used and need not be transparent.
  • Peeling 49 is a layer which becomes the outermost surface of the translucent electromagnetic wave shielding material when peeled from first substrate 51 when first substrate 51 is peeled after transfer.
  • the material of the stripping layer 49 may be a polyacrylic resin, a polyester resin, a polyvinyl chloride resin, a cellulose resin, a rubber resin, a polyurethane resin, a polyvinyl acetate resin, or the like.
  • a copolymer such as a vinyl monovinyl acetate copolymer resin or an ethylene monovinyl acetate copolymer resin.
  • a method for forming the release layer 49 There are coating methods such as gravure coating, roll coating, and comma coating, and printing methods such as gravure coating and screen printing.
  • the material, forming method and the like of the metal layer 32 are the same as in the fifth invention.
  • a black resist layer 33 is provided in a pattern on the metal layer 32 (see FIG. 5 Ob).
  • the material and pattern forming method of the black resist layer 33 are the same as in the fifth invention.
  • a method of performing patterning using the free layer 37 is also possible as in the fifth invention.
  • the portion of the metal layer 32 that is not covered with the black resist layer 33 is removed using an etchant (see FIG. 50c).
  • the metallized layer 3 2 is laminated on the first substrate 51, the metallized layer 3 2 is patterned on the laminated layer 3 1, and the metallic layer 3 2 is laminated on the metallized layer 3 2.
  • a transfer sheet 52 in which a black resist layer 33 corresponding to 2 is formed is obtained.
  • the same etchant as that of the fifth invention is used.
  • an adhesive S36 is provided on a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having functionality, and the transfer sheet 52 is attached so that the first substrate 51 is an outer surface. After joining (see Fig. 52), only the first substrate 51 is peeled off to make it translucent! : Obtain magnetic shielding material.
  • the material of the transparent second substrate 35 and the adhesive layer 36 made of a plate, a three-dimensional object, or a film having a functional layer and the method of forming the adhesive layer 36 are the same as those of the fifth invention.
  • the transfer sheet 52 is provided with an adhesive layer 36 in advance, and the transfer sheet 52 becomes the first substrate 51 as an outer surface. After such bonding (see FIG. 53), only the first substrate 51 may be peeled off to obtain a light-transmitting electromagnetic wave shield material.
  • the light-transmitting electromagnetic wave shielding material formed by the above method may be provided with a protective layer or a protective film on the peeling layer 49 if necessary.
  • FIG. 54 shows an embodiment of the translucent electromagnetic wave shielding material according to the tenth invention. That is, the release layer 49, the metal layer 32 provided in a pattern on the release layer 49, and the black electricity provided in register with the metal layer 32 on the metal layer 32.
  • a transparent second substrate made of a plate, a three-dimensional object, or a film having a functional layer, such that the transfer layer 53 composed of the deposition layer 38 and the release layer 49 becomes the outer surface via the adhesive layer 36 It is transcribed on 35.
  • a transfer sheet 5 is prepared. Specifically, first, a release layer 49 is provided on the entire surface of the first substrate 51 made of a film, and a metal layer 32 is provided on the release layer 49 in a pattern (see FIG. 55a).
  • the material of the first base 51 and the release layer 49 and the method of forming the release layer 49 are the same as those of the ninth invention.
  • the material and thickness of the metal layer 32 and the method of forming the patterned metal layer 32 are the same as in the sixth invention.
  • the first substrate 51 provided with the release layer 49 and the metal footwear 32 in the previous step in the solution 40 of the ion-polymer containing black particles was infiltrated with the counter electrode 41, (See Figure 55b).
  • the materials of the black particles and the ionic polymer, and other conditions for energization are the same as in the sixth invention.
  • a black electrodeposition layer 38 was deposited on the metal layer 32, and as a result, a stripping layer 49 was laminated on the first substrate 51, and the metal layer 32 was formed thereon.
  • a transfer sheet 54 is obtained in which a black electrodeposition layer 38 which is provided in a pattern and is in register with the metal layer 32 on the metal layer 32 is laminated (see FIG. 55c).
  • an adhesive layer 36 is provided on a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer, and the transfer sheet 54 is formed so that the first substrate 51 becomes an outer surface. Then, only the first substrate 51 is peeled off to obtain a light-transmitting electromagnetic wave shielding material.
  • the material of the transparent second base member 35 made of a plate, a three-dimensional object, or a film having functional properties and the material of the adhesive layer 36, and the method of forming the adhesive layer 36 are the same as those of the sixth invention. The same is true.
  • the transfer sheet 54 is provided with an adhesive layer 36 in advance, and the transfer sheet 54 becomes the outer surface of the first base 51. After bonding as described above (see FIG. 57), only the first substrate 51 may be peeled off to obtain a light-transmitting electromagnetic shielding material family.
  • the step of providing the black compressible gas-deposited layer 38 includes the steps of: providing a release layer 49 over the entire surface of the first substrate 51 made of a film; A metal layer 32 is provided in a pattern on the layer 49, and the first base 51 provided with the metal layer 32 in the previous step in a solution of a monomer of the conductive polymer is placed together with the counter electrode 41 on the first substrate 51, It may be passed.
  • the material of the solvent for dissolving the monomer and monomer of the conductive polymer and other conditions for energization are the same as in the sixth invention.
  • a black electrodeposition coating may be an electroplated film having a black color tone. The method of forming the plating layer is the same as that of the second invention.
  • a protective S or a protective film may be provided on the peeling layer 49 as needed after the light-transmitting compressive wave shielding material formed by the above method is peeled off.
  • FIG. 58 shows an example of the translucent electromagnetic wave shielding material according to the eleventh embodiment. That is, a transfer layer 55 composed of a release layer 49 and a metal layer 32, which is a metal compound 42 provided in a pattern on the release layer 49 and having a surface portion exhibiting a blue color, It is transferred onto a transparent second base member 35 made of a plate, a three-dimensional object, or a film having a functional layer via the adhesive layer 36 so that the peeling layer 49 becomes the outer surface.
  • a transfer sheet 56 is prepared. Specifically, first, a release layer 49 is provided on the entire surface of the first substrate 51 made of a film, and a metal layer 32 is provided on the release layer 49 in a pattern (see FIG. 59a).
  • the material of the first substrate 51 and the peeling layer 49 and the method of forming the peeling layer 49 are the same as in the ninth invention.
  • the material and thickness of the metal layer 32 and the method of forming the patterned metal layer 32 are the same as in the seventh invention.
  • the surface layer of the metal layer 32 is formed into a black metal compound 42 by a chemical conversion treatment (see FIG. 59b).
  • the peeling layer 49 is laminated on the first base 51, the metal layer 32 is provided in a pattern on the peeling layer 49, and the surface layer of the metal layer 32 has a force s ′ of a metal exhibiting black.
  • a transfer sheet 56 which is the compound 42 is obtained.
  • the chemical conversion treatment is the same as in the seventh invention.
  • an adhesive layer 36 is provided on a transparent second substrate 35 made of a plate, a three-dimensional object, or a film having a functional layer so that the transfer sheet 56 becomes the outer surface of the first substrate 51. Then, only the first base member 51 is peeled off to obtain a light-transmitting electromagnetic wave shielding material.
  • the material of the transparent second base member 35 and the adhesive layer 36 made of a plate, a three-dimensional object, or a film having a functional layer, and the method of forming the adhesive layer 36 are the same as in the seventh invention.
  • the adhesive layer 36 is provided on the transfer sheet 56, and the transfer sheet 56 is formed on the outer surface of the first base 51. After bonding (see FIG. 61), only the first base member 51 may be peeled off to obtain a light-transmitting electromagnetic wave shield material.
  • the light-transmitting electromagnetic wave shielding material formed by the above method may be provided with a protective layer or a protective film on the peeling layer 49 if necessary.
  • FIG. 62 shows an embodiment of the translucent electromagnetic wave shielding material according to the 12th invention. That is, a black dyed layer 46 composed of a release layer 49, a pattern-shaped bleached part 44 provided on the release layer 49, and other non-bleached parts 45, and a black dyed layer 46
  • the transfer layer 57 composed of the metal layer 32 provided in register with the non-bleaching portion 45 on the transfer layer 57, and the release layer 49 becomes the outer surface via the adhesive layer 36. From boards, three-dimensional objects or films with functional layers Is transferred onto a transparent second substrate 35.
  • a transfer sheet 58 is prepared. Specifically, first, an exfoliation layer 49, a black dyeing layer 46, and a metal layer 32 are sequentially provided on the entire surface of the first substrate 51 made of a film (see FIG. 63a).
  • the material of the first base 51 and the release layer 49 and the method of forming the release layer 49 are the same as in the ninth invention.
  • the material and forming method of the black dyed layer 46 and the metal layer 32 are the same as in the eighth invention.
  • a resist layer 48 is provided in a pattern on the metal layer 32 (see FIG. 63B).
  • the material and forming method of the resist layer 48 are the same as those of the eighth invention.
  • portions of the metal layer 32 not covered with the resist layer 48 are removed using an etching solution, and the portions of the black stained layer 4 not covered with the patterned metal layer 32 in this etching step are removed.
  • the transfer sheet 58 is obtained by decolorizing 6 with an etchant (see FIG. 63 c).
  • the etching solution and the dye for the black dyed layer 46 are the same as those used in the eighth invention.
  • the resist layer 48 may be left, or may be removed using a resist removing liquid. The same resist removing solution as that used in the eighth invention is used.
  • An adhesive layer 36 is provided on a transparent second substrate 35 made of a material, a plate, a three-dimensional object, or a film having functionality / S, and the transfer sheet 58 is formed so that the first substrate 51 becomes the outer surface. After bonding (see FIG. 64), only the first substrate 51 is peeled off to obtain a transparent electromagnetic wave shielding material family.
  • the material of the transparent second base member 35 and the adhesive layer 36 made of a plate, a three-dimensional object, or a film having functionality II, and the method of forming the adhesive layer 36 are the same as in the eighth invention.
  • the transfer sheet 58 is provided with an adhesive layer 36 in advance, and the transfer sheet 58 is formed on the outer surface of the first base 51. After bonding (see FIG. 65), only the first substrate 51 may be peeled off to obtain a light-transmitting electromagnetic wave shielding material. Further, in the method for producing a translucent electromagnetic wave shielding material according to the twelfth invention, a step of providing a black stained layer 46 comprising a pattern-shaped bleached portion 44 and another non-bleached portion 45 is performed.
  • a peeling layer 49, a black dyeing layer 46, and a metal layer 32 are provided on a transparent first substrate 51 made of, and a resist layer 48 is provided in a pattern on the metal layer 32 (Fig. 66a). (See FIG. 66B.) Then, the portion of the metal layer 32 not covered with the resist layer 48 is removed using an etchant (see FIG. 66 b), and then the portion not covered with the patterned metal layer 32.
  • the black dyed layer 46 may be decolorized with a decolorizing solution different from the etching solution (see FIG. 66c). As the decolorizing solution, use the same one as described in VIII.
  • the resist layer 48 may be left after the etching step, or may be removed using a resist removing liquid before or after decolorization with the decolorizing liquid. As the resist removing liquid, the same liquid as in the eighth invention is used.
  • the step of providing a black dyed layer 46 composed of a pattern-shaped bleached portion 44 and other non-bleached portions 45 comprises: A release layer 49, a black dyeing layer 46, and a metal layer 32 are provided on the transparent first base 31 and a resist layer 48 is provided in a pattern on the metal layer 32 (see FIG. 67a). Then, the portion of the metal layer 32 not covered with the resist layer 48 is removed using an etchant (see FIG. 67 b), and then the resist layer 48 is removed using a resist remover.
  • the portion of the black stained layer 46 not covered with the patterned metal layer 32 is decolorized with a resist removing solution (see FIG. 67c). Good.
  • a dye which is decolorized by removing the resist is selectively used as the dye of the black dyed layer 53.
  • a combination of decolorization with an etching solution, decolorization with a decolorization solution different from the etching solution, and decolorization with a resist removal solution is combined. You may.
  • the translucent electromagnetic wave shielding material formed by the above method is used to peel off the first base 51. Thereafter, if necessary, a protective layer or a protective film may be provided on the release layer 49c (the thirteenth invention to the twenty-third invention).
  • FIG. 68 is a basic plan view of the translucent electromagnetic wave shielding material of the present invention.
  • 1 indicates a transparent substrate
  • 3 indicates a black portion, for example, a black resist layer.
  • the uncovered portion of the M-color resist layer 3 becomes the ground portion 100.
  • FIG. 68 a frame-shaped pattern surrounding the light-transmitting electromagnetic wave shield part, a rod-shaped pattern adjacent to the end of the light-transmitting electromagnetic wave shield part, as shown in FIG.
  • Various modes are conceivable.
  • FIG. 69 is a drawing corresponding to FIG. 1, but a part of the metal layer is covered with the mask layer 101 instead of the black resist layer 3, and this part is finally removed and grounded. The part 100 is formed. In this case, the mask layer is formed first.
  • FIG. 70 shows a method in which a black resist layer is formed first.
  • a printing resist material or a photo resist material which is generally commercially available is used.
  • the mask layer may be formed on a part of the metal layer by screen printing using a printing resist, or by mouth coating, dip coating, or full-surface printing using a photoresist material.
  • a solid is formed on the metal layer by tilling, etc., exposed using a photomask, developed, and partially formed.
  • the following methods may be used to remove the mask and the part of the non-bleaching part of the black resist layer, the black electrodeposition layer, the positive resist layer, and the black stain layer described later.
  • each black layer there are a method of dissolving and removing with a peeling liquid, a method of peeling by bonding to an adhesive tape, and a method of mechanically shaving. Even if there is a slight gap between the mask layer or the positive resist layer and each black layer, the grounding and the translucent electromagnetic wave shield will be disconnected by etching, so to prevent this. Is a mask layer or positive type It is preferable to form each black layer on the dist layer so as to partially overlap.
  • 1171 is a method that does not use a mask layer.
  • the ground portion 100 is formed by finally removing a part of the black resist layer 3.
  • H72 is a drawing corresponding to Fig. 6, but first, a mask layer 101 is formed, followed by a release layer 4, and finally, both the mask layer 101 and the black resist layer 3 are removed. As a result, a ground portion 100 is formed.
  • FIG. 73 shows a case where the order of forming the release layer 4 and the mask layer 101 is reversed.
  • the ground portion 100 is formed by removing the black resist layer 3 only partially at the end without using the mask layer 101 as well.
  • FIG. 75 is a diagram corresponding to FIG. Also in this case, the ground layer 100 is formed by finally peeling off the mask layer 101 using the mask layer 101.
  • the black layer 3 is a black electrodeposition layer, and the deposition apparatus for it is shown in FIG. 76 in the same manner as in FIG. However, the mask slaughter 101 is formed in a place where the precipitation is not necessary.
  • the black deposition layer 3 is formed once on the metal layer, and then a part of the deposition layer 3 is removed.
  • Fig. 78 shows a deposition apparatus for that purpose.
  • FIG. 80 shows a deposition apparatus for that purpose.
  • a material of the positive resist layer a generally available photoresist of a posi type is used.
  • the positive resist layer can be formed by solid coating on the metal layer by roll coating, spin coating, dip coating, full-surface printing, transfer, etc., and exposure using a photomask. Then, it is developed and partially formed.
  • FIG. 81 is a drawing corresponding to FIG. In this embodiment, a part of the metal layer changes to the metal compound 3 exhibiting black. Some of the metal ⁇ does not change to a metal compound ',: The mask layer 101 is formed. In FIG. 82, instead of the mask layer 101, a post-type resist layer 102 is formed, and finally, the portion is removed by exposure.
  • FIG. 83 is a drawing corresponding to FIG. 21.
  • a part of the metal layer 32 is exposed to form a ground portion 100.
  • FIG. 84 shows an example of a method of manufacturing the translucent electromagnetic wave shielding material of the embodiment shown in FIG. In this method, a part of the metal layer 32 is protected by the mask layer 101 and formed.
  • FIG. 85 shows an embodiment in which the black resist layer 33 is formed earlier than the mask layer 101.
  • FIG. 86 shows an embodiment in which the ground portion 100 is formed by removing a part of the black resist layer 33 without using a mask layer.
  • FIG. 87 and FIG. 88 show an embodiment in which the one obtained in FIG. 86 is attached to the second substrate 35.In FIG. 87, the adhesive layer 36 is present on the second substrate 35, In FIG. 88, it is on the adhesive sheet 34.
  • FIGS. 89, 90 and 91 show embodiments using the free layer 37, and are the same as FIGS. 84 to 88 except that the metal layer is exposed using the free layer
  • FIGS. 92 to 97 are the same as the embodiments of FIGS. 83 to 88 except that the black layer is the black electrodeposition layer 33.
  • FIGS. 98 to 102 are the same except that the upper part of the metal layer 32 is a metal compound exhibiting black.
  • FIG. 103 to FIG. 106 are inventions corresponding to the ninth invention to the 12th invention, but also a part of the metal layer is exposed to form an earth portion.
  • a 1.1 mm thick borosilicate glass plate on which 0.3 / ⁇ -thick nickel was vapor-deposited was used as one provided with a metal layer on one surface of the transparent substrate.
  • ink containing carbon black in polyethylene terephthalate resin offset printing on nickel layer A black resist layer having a thickness of 5 was provided in a reverse polka dot pattern with a pitch of 110 // m and a pitch of 100 / um.
  • portions of the metal layer not covered with the black resist layer were removed by etching with an aqueous ferric chloride solution.
  • a transparent substrate provided with a metal layer on one surface As a transparent substrate provided with a metal layer on one surface, a polyester film having a thickness of 35 ⁇ m and a copper foil attached thereto was used. Using an ink containing carbon black in the photosensitive polyimide resin, a black resist layer with a thickness of 1 is formed on the entire surface of the copper foil layer by the roll coating method, and is exposed using a photomask. It was developed with an aqueous cupric solution and patterned into a hiiragi pattern with a width of 10 m and an eye size of lOOX lOO m. Finally, the portion of the metal layer not covered with the black resist layer was etched away with an aqueous cupric chloride solution.
  • a 3-mm-thick acrylic plate was used as a transparent substrate.
  • An acrylic resin “BR-77” (manufactured by Mitsubishi Rayon Co., Ltd.) was applied on one side of the plate, immersed in 1% potassium hydroxide for 5 minutes, and then palladium chloride chloride ⁇ Immersed in a colloid solution, immersed in 1% potassium hydroxide for 1 minute, and subjected to electroless nickel plating.
  • “Color Mosaic CK” manufactured by Fuji Hunt Electronics Technology Co., Ltd.
  • a black resist layer with a thickness of 1.5 m is formed on the entire metal layer by the ⁇ -coating method, and a photomask is formed.
  • a 1-mm-thick methacryl sheet was used as a transparent substrate, and a metal layer was provided on the upper surface of the methacryl sheet by bonding a thick copper foil with an acrylic resin.
  • a release layer was provided on the metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 10 m and a mesh size of 100 / mx 100 / m.
  • a black carbon ink using a black carbon ink, a metal layer and a black resist layer having a thickness of 1 were formed on the upper surface of the peeling 11 by a roll coating method.
  • water was used as a stripping solution, and the black resist layer was removed by stripping the stripping layer.
  • the portion of the metal layer from which the black resist layer was removed was removed by etching with a second aqueous chloride solution.
  • a 2 mm thick polycarbonate sheet was used as the transparent substrate, and a 0.3 m thick metal layer was formed by sputtering nickel on the top surface.
  • a photo resist material of an alkali development type is roll-coated on the metal layer, pre-baked, exposed and developed using a photo mask, and the release layer is formed to have a lattice width of ⁇ with a size of lOO.um.
  • a black resist layer having a thickness of 1 was provided on the upper surface of the metal layer and the release layer by a roll coating method using black ink.
  • an aqueous potassium hydroxide solution was used as a stripping solution, and the black resist layer thereon was removed by stripping the stripping layer. Finally, the portion of the metal layer from which the black resist layer was removed was removed by etching with a nitric acid aqueous solution.
  • Example 7 An acrylic layer having a thickness of 2 mm was used as a transparent substrate, and a transparent ink composed of cellulose acetate propionate was roll-coated on the upper surface to form an anchor layer.
  • a metal layer was provided.
  • a release layer was provided on the metal layer by screen printing using an aqueous printing resist ink in a reciprocal lattice pattern having a lattice width of 10 / m and an eye size of 100 m ⁇ 100 m.
  • a black resist layer having a thickness of 1 m was formed on the upper surface of the metal layer and the release layer by a roll coating method using black carbon ink.
  • water was used as the stripping solution, and the stripping layer was stripped to remove the black resist layer thereon.
  • the portion of the metal layer from which the black resist layer had been removed was etched away with an aqueous ferric chloride solution.
  • the translucent electromagnetic wave shielding materials of Examples 1 to 7 thus obtained were excellent in visibility and high in the shielding effect.
  • a metal layer of a 100 / i-in-thick polyester film laminated with a copper foil with a thickness of 100 / i in by photolithography is formed into a grid pattern with a line width of 10 / um and an eye size of 100X100 // m. It has become. Connect a conductive wire to this, immerse it in a water solution containing 1% carbon black, aminated epoxidized boritabutinine (number average molecular weight about 1000), and 1% triethylamine, and apply a voltage of 10V for 1 minute. Thus, a black electrodeposition layer was formed. The substrate was dried at 60 for 30 minutes, and after cooling, a film was laminated thereon to obtain a transparent electromagnetic wave shielding material.
  • a polymethyl methacrylate film having a thickness of I00 / m was used as a transparent substrate, and a nickel layer having a thickness of 0.2 m was formed on one side thereof by nickel vapor deposition.
  • This metal layer was patterned by photolithography into a honeycomb shape with a connection width of 20 / m and an eye diameter of 200, um.
  • a conductive wire is connected to this metal layer, and carbon black 1%, maleated polybutadiene 15 %, And immersed in an aqueous solution containing triethylamine, and a voltage of 30 V was applied for 5 minutes to form a black electrodeposited layer having a thickness of 1.
  • the substrate was dried at 60 for 30 minutes, and after cooling, a film was laminated thereon to obtain a translucent electromagnetic wave shielding material.
  • a 3-mm-thick acrylic plate was used as a transparent substrate.
  • An acrylic resin (BR-77 manufactured by Mitsubishi Rayon Mori Co., Ltd.) was applied on one side of the plate, immersed in 1% potassium hydroxide for 5 minutes, and then palladium chloride Z tin chloride They were immersed in a colloid solution, immersed in potassium hydroxide for 1 minute, and subjected to electroless nickel plating.
  • the metal layer was patterned by photolithography into a grid with a line width of 30 m and an eye size of 150 X I50 / m.
  • a conductive wire was connected to this metal layer, and titanium black 1%, aminated epoxidized polybutadiene 20 «3 ⁇ 4, and triethylamine 1.
  • a metal layer of an ll mm thick borate glass plate on which a 0.3 mm thick nickel was deposited was patterned by photolithography into an inverted polka dot shape with an inner diameter of 100 pitch l lO ⁇ m.
  • a conductive wire is connected to this metal layer, immersed in an acetoniril solution containing 0.5M pyrrole, 0.5M sulfuric acid, and 0.2M tetraethylammonium borofluoride, and a platinum plate as the counter electrode and saturated as the reference electrode.
  • a calomel electrode was set up, and electricity was passed at 0.8 V vs. SCE for 3 minutes to form a black electrodeposited layer having a thickness of 1 m. Then 60 dry 30 minutes to obtain a light-transmitting electromagnetic wave shielding material after cooling film thereon by one preparative lamination c
  • a metal layer of a 100-m-thick polyester film laminated with a copper foil of a thickness of 35 m was applied by photolithography with a line width of 10 m and an eye size of 100 mx 100 Patterned in a grid of m. Connect the conductive wire to this, nickel sulfate 70 g Z l, It was immersed in a 55 degree plating solution containing nickel ammonium sulfate 40 g / 1, zinc sulfate 20 g / sodium thiocyanate 20 g / 1, and a current of 1.0 A / dm2 was applied. A black electrodeposition layer was formed over 3 minutes. The substrate was dried at 60 ° C. for 30 minutes, and after cooling, a film was laminated thereon to obtain a translucent electromagnetic wave shielding material having a black color tone in the electroplated film.
  • a 100-m thick polymethyl methacrylate film was used as a transparent substrate, and a metal layer having a thickness of 2 was provided on one surface thereof by nickel vapor deposition.
  • This metal layer was patterned into a honeycomb shape with a line width of 20 ⁇ and an eye diameter of 200 m by photolithography.
  • Connect a conductive wire to this metal layer and dip it into a plating solution with 30 g containing 200 g of dichromium triacid / 4.5 g of barium acetate / 8.5 g / sodium acetate.
  • a current of 100 A / dm 2 was applied for 5 minutes to form a black electric layer having a thickness of 1 m.
  • the substrate was dried at 60 for 30 minutes, and after cooling, a film was laminated thereon to obtain a light-transmitting electromagnetic shielding material having an electroplated film having a black color tone.
  • a 3 mm thick acrylic plate was used as a transparent substrate.
  • An acrylic resin (BR-77, manufactured by Mitsubishi Rayon Co., Ltd.) was applied on one side of the plate, immersed in 1% potassium hydroxide for 5 minutes, and then palladium chloride / tin chloride They were immersed in a colloid solution *, crushed in 1% 7j potassium oxide for 1 minute, and subjected to electroless nickel plating.
  • the metal layer was patterned into a lattice shape with a line width of 30 / m and an eye size of 150 ⁇ 150 / m by photolithography.
  • a conductive layer was connected to this metal layer, immersed in a plating solution with a ⁇ dime concentration of 3.0 g / sulfuric acid concentration of 27 g / 1, and a current of 4 A / dm 2 of 5 g.
  • a black electrodeposited layer having a thickness of 0 was formed over a minute.
  • This substrate was dried at 60 "C for 30 minutes, and after cooling, a film was laminated thereon to obtain a light-transmitting shielding material having an electroplated film having a black color tone.
  • a metal layer of a borosilicate glass plate with a thickness of 0.3 mm and a thickness of 2 mm nickel and a thickness of 1 .1 mm was formed in reverse polka dots with an inner diameter of lOO m and a pitch of 110 m by photolithography. Patterned. Connect a conductive wire to this metal layer and add potassium pyrophosphate 200 I, tin pyrophosphate 15 g / 1, nickel sulfate 15 g, sodium molybdate 105 g / and glycine 20 g / 1. The resultant was immersed in a plating solution containing 50% and a current of 0.2 A / dm 2 was supplied for 3 minutes to form a black electrodeposited layer having a thickness of 1. Thereafter, the film was dried at 60 ° C. for 30 minutes, and after cooling, a film was laminated thereon to obtain a translucent magnetic wave shielding material having a black color tone with an electroplated film.
  • the translucent electromagnetic wave shielding materials of Examples 8 to 15 and the method of manufacturing the same have the following configurations, and therefore have the following effects.
  • a 100 / m-thick polyester film having a 35 /; m-thick copper foil bonded thereto was used as one having a metal layer provided on one surface of the transparent substrate.
  • a positive type photoresist (OFPR800, manufactured by Tokyo Kogaku Kogyo Co., Ltd.) is solid-formed on this copper foil and exposed using a photomask. Photo-development patterned into a grid with a width of 10 / m and an eye size of 100 ⁇ 100 / m. Next, the copper foil was etched with an aqueous cupric chloride solution, and the resist was stripped off.
  • a polyester film having a thickness of 100 / ym with a 35 m-thick iron foil bonded thereto was used as a metal substrate provided on one surface of the transparent substrate.
  • a positive photo resist (OFPR 800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on this iron foil and exposed and developed using a photomask to form a grid with a width of 10 / um and an eye size of lOOXlOO m. Patterned.
  • the resist was stripped off. This was immersed in an aqueous solution of 80 containing zinc dihydrogen phosphate O.IM for 2 minutes to obtain a translucent electromagnetic wave shielding material so that the surface layer of the iron foil was black.
  • the translucent electromagnetic wave shielding material and the method of manufacturing the same according to the third aspect of the invention have the following configuration, and therefore have the following effects.
  • the metal layer is laminated in a pattern on the transparent substrate, There were no restrictions imposed by the standards, and the design was optimal for visibility and electromagnetic shielding. Therefore, the visibility of the translucent electromagnetic wave shielding material and the electromagnetic wave shielding effect are improved.
  • the surface portion of the metal layer is a metal compound exhibiting black color, no metallic luster is produced. Therefore, the visibility of the translucent electromagnetic wave shielding material was improved. Also, since the metal layers are laminated in a pattern, visibility can be obtained without making the conductive material transparent. Therefore, it is not necessary to limit the material to a transparent conductive material, and a material having high conductivity can be selected from a wider range of materials, and the electromagnetic shielding effect has been improved.
  • a 2 mm thick acryl plate was used as a transparent substrate, and N, N-dimethylformamide solution of polyacrylonitrile was applied to one surface of the plate with a bar coater, dried, and then a black dye (Sumitomo Chemical Co., Ltd.) (Sumiacryl Black FFP) was immersed in a dyeing bath for 20 minutes to form a black dyed layer. Next, a metal layer was formed by vapor deposition over the entire surface of the black dyed layer.
  • a black dye Suditomo Chemical Co., Ltd.
  • a metal layer was formed by vapor deposition over the entire surface of the black dyed layer.
  • a resist layer is formed on the entire surface of the gold layer by a spin coating method, exposed using a photomask, developed, and developed to a line width of 20 / m2. It was patterned into a grid with a pitch of 150 m.
  • the metal layer in the area not covered with the resist layer was removed with an aqueous solution of ferric nitrate 'sodium chlorite, and at the same time, the black stained layer in the area not covered with the metal layer was decolorized with the above etching solution. .
  • a 1-mm-thick cellulose acetate plate was used as the transparent substrate, and one side of the substrate was mixed with a solution of n-propyl alcohol of an ethylene-vinyl alcohol copolymer (Eval F manufactured by Kuraray Co., Ltd.)
  • a black dye (Lanasyn Brill Black A manufactured by Sando Co.) was added and applied with an applicator and dried to form a black dye layer.
  • chloride After immersion in an aqueous palladium solution, electroless copper plating was performed to provide a metal layer.
  • a resist layer is formed on the entire metal layer by spin coating, exposed using a photomask, developed, and developed to a width of 30 m and a pitch of 200 ⁇ m. m was patterned into a honeycomb shape.
  • the metal layer in the area not covered with the resist layer was removed with an aqueous ferric chloride solution.
  • the resist layer was peeled off with a 3% aqueous potassium hydroxide solution, and at the same time, the portion of the black dyed layer not covered with the metal layer was decolorized with the above peeling solution.
  • the translucent electromagnetic wave shielding material and the method of manufacturing the same according to the fourth aspect of the invention have the following configuration, and therefore have the following effects.
  • the metal layer is laminated in a pattern on the transparent substrate, there is no restriction on the line width and the pitch according to the standard, and a design that is optimal in terms of visibility and electromagnetic wave shielding effect can be freely performed. Therefore, the visibility of the translucent electromagnetic wave shielding material and the electromagnetic wave shielding effect were improved.
  • a polyethylene terephthalate film was used as a first substrate, and a release layer was provided on one surface of the first substrate by applying methyl methacrylate by a comma coating method.
  • a metal layer having a thickness of 0.3 / m was formed by evaporating nickel.
  • a black resist layer having a thickness of 10 m was provided in a reverse polka dot pattern with an inner diameter of 500 m and a pitch of 700 / im.
  • a portion of the metal layer that was not covered with the black resist layer was removed by etching with a second chloride solution to produce a transfer sheet.
  • a borosilicate glass plate of lmm was used as a transparent second substrate, and a bisphenol A type epoxy resin was applied on one surface thereof by a roll coating method to provide an adhesive layer. Finally, after the transfer sheet was bonded onto the second substrate so that the first substrate was the outer surface, only the first substrate was peeled off to obtain a light-transmitting electromagnetic wave shielding material.
  • a polyethylene terephthalate film was used as a first substrate, and on one surface thereof, a polyethylene methacrylate was applied by a comma coating method to provide a peeling layer.
  • a metal layer was provided by bonding a copper foil having a thickness of 35 m.
  • a black resist layer having a thickness of 1 ⁇ was formed on the entire metal layer by a roll coating method using an ink containing carbon black as the photosensitive polyimide resin, and was exposed using a photomask. Then, it was developed with an aqueous solution of sodium carbonate and patterned into a lattice pattern having a width of 10 m and an eye size of 100 ⁇ 100 / im.
  • a transfer sheet was prepared by etching away the metal layer in a portion not covered with the black resist layer using an aqueous cupric chloride solution.
  • a 3 mm thick polyester plate was used as a transparent second substrate, and a bisphenol F type epoxy resin was applied on one surface thereof by a roll coating method to provide an adhesive layer.
  • the transfer sheet was bonded onto the second substrate so as to be the outer surface of the first substrate, only the first substrate was peeled off to obtain a light-transmitting electromagnetic wave shielding material.
  • a polymethyl methacrylate film was used as a transparent first substrate, and an acrylic resin “BR-77” (manufactured by Mitsubishi Rayon Co., Ltd.) was applied on one side of the substrate and immersed in 1% potassium hydroxide for 5 minutes.
  • the metal layer was immersed in a palladium-tin-tin chloride colloid solution, immersed in 1% sodium hydroxide for 1 minute, and subjected to electroless nickel plating to form a metal layer.
  • an acrylic plate with a thickness of 3 mm was used as a transparent second substrate, and an adhesive layer was formed by applying a glycidylamine type epoxy resin to one surface of the substrate by a roll coating method.
  • a polymethyl methacrylate film was used as a transparent first substrate, and a metal layer having a thickness of 0.2 / rn was provided on one surface thereof by silver vapor deposition.
  • a black resist layer with a thickness of 0.7 / m was formed on the entire surface of the metal layer by spin coating, and after exposure using a photomask, Developed with a 50-fold dilution of “Developer V-259D” (Shin Kogyo Co., Ltd.) and patterned into a honeycomb shape with a width of 20 // m and an eye diameter of 200 ”m.
  • the portion of the metal layer that was not covered with the black resist layer was removed by etching with a nitric acid second solution, and an aminophenol type epoxy resin was applied thereon by a roll coating method to provide an adhesive layer.
  • an affixed sheet was prepared.
  • a 2 mm-thick polymethyl methacrylate plate was used as a transparent second substrate, and an adhesive sheet was attached to the second substrate so that the first substrate was the outer surface, and a translucent electromagnetic wave shielding material was applied. Obtained.
  • polyethylene terephthalate film as a transparent first substrate, one side of which A metal layer was provided by bonding a copper foil having a thickness of 18 m.
  • a free layer was provided on the metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 100 ⁇ and an eye size of 300 m ⁇ 300 ym.
  • a black resist layer having a thickness of 1 / m was provided on the upper surface of the metal layer and the free layer by roll coating using black carbon ink.
  • water was used as a release removing solution, and the free layer was removed to remove the black resist layer thereon.
  • the metal layer where the black resist layer was removed was removed by etching with an aqueous ferric chloride solution. Further, a bisphenol-type epoxy resin was applied thereon by a mouth coating method, and an adhesive layer was provided, thereby producing an adhesive sheet.
  • a translucent electromagnetic wave shielding material was obtained by using a methacrylic plate having a thickness of 2 mm as a transparent second substrate and laminating the adhesive sheet on the second substrate such that the first substrate was the outer surface. .
  • a polyethylene film was used as a first substrate, and polymethyl methacrylate was applied on one surface thereof by a spray nozzle method to provide a peeling.
  • a metal layer having a thickness of 0.3 m was formed by sputtering nickel.
  • an alkali-developable photoresist material is roll-coated on the metal layer, prebaked, exposed and developed using a photomask to develop a free layer with a grid width of 10 m, eye size of 100, "mx100
  • a black resist layer having a thickness of 1 was formed on the upper surface of the metal layer and the free layer by roll coating using black carbon ink.
  • the black resist layer was removed by removing the floating layer using an aqueous solution of potassium oxide, and finally, the metal layer in the portion from which the black resist layer had been removed was removed by etching with a nitric acid aqueous solution.
  • a transfer sheet was prepared.
  • a 2 mm thick polycarbonate plate was used as a transparent second substrate, and an aminophenol-type epoxy resin was applied on one side of the substrate by a roll coating method to provide an adhesive layer. Finally, after the tilling sheet was attached on the second substrate so that the first substrate was the outer surface, only the first substrate was peeled off to obtain a light-transmitting electromagnetic wave shield material.
  • a polymethyl methacrylate film as a transparent first substrate, roll coating a transparent ink made of cellulose acetate propionate on one surface to form an energized layer, then applying electroless copper plating to a thickness of 0.2 / m metal layer was provided.
  • aqueous printing resist ink a free layer was provided on the metal layer by screen printing in a reciprocal lattice pattern having a lattice width of 80 / m and an eye size of 300 / mx 300; m.
  • a black resist layer having a thickness of 1 was formed on the upper surface of the metal layer and the free layer by roll coating using black carbon ink.
  • an acrylic plate having a thickness of 2 mm was used as a transparent second substrate, and an adhesive layer was provided on one surface thereof by applying a glycidylamine type epoxy resin by a roll coating method.
  • the adhesive sheet was attached on the second substrate so as to have an outer surface of the first substrate force 5 to obtain a translucent electromagnetic wave shielding material.
  • a polyethylene terephthalate film was used as a first substrate, and a release layer was provided on one surface of the first substrate by applying polyethylene methacrylate by a comma coating method.
  • a metal layer was provided by bonding a copper foil having a thickness of 35 m.
  • a positive photo resist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on this metal layer, and exposed using a photomask. Patterned in a grid of m.
  • the resist was stripped.
  • a lead wire is connected to this metal layer, and carbon black 1%, aminated epoxidized polybutadiene (Number average molecular weight: about 1000)
  • a transfer sheet was prepared by immersion in an aqueous solution containing 20% and triethylamine 1%, and applying a voltage of 10 V for 1 minute to form a black electrodeposited layer having a thickness of 1 m.
  • a 100 m-thick polyethylene terephthalate film formed by sputtering TO on one side is used as a transparent second substrate, and a polyurethane-based adhesive is applied by roll coating on the other side of the ITO and the adhesive layer is formed.
  • a polyurethane-based adhesive is applied by roll coating on the other side of the ITO and the adhesive layer is formed.
  • a polyethylene terephthalate film was used as a first substrate.
  • Polymethyl methacrylate was applied on one side of the substrate by a comma coating method to form a release layer.
  • an acrylic resin (BR-77 manufactured by Mitsubishi Rayon Co., Ltd.) was applied and immersed in 1% potassium hydroxide for 5 minutes, then immersed in a palladium chloride-tin chloride colloid solution, and then added to 196 potassium hydroxide for 1 minute.
  • the metal layer was provided by immersion and electroless nickel plating.
  • a positive photoresist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on the metal layer, exposed and developed using a photomask, and patterned into a 200 m-diameter honeycomb shape with a line width of 20 ⁇ .
  • the resist was stripped.
  • a conductive wire is connected to this metal layer, immersed in an aqueous solution containing titanium black 1%, aminated epoxidized polybutadiene 20%, and triethylamine 1%, and applied with a voltage of 30 V for 3 minutes to a thickness of 1 m. Formed a black electrodeposited layer.
  • a transfer sheet was prepared by applying a glycidyl ether type epoxy resin thereon by a roll coating method and providing an adhesive layer.
  • Example 30 a 3 mm-thick polymethyl methacrylate plate is used as a transparent second substrate.
  • the transfer sheet is laminated on the second substrate so that the first substrate is the outer surface.
  • a polyethylene terephthalate film was used as a first substrate, and on one surface thereof, a polyethylene methacrylate was applied by a comma coating method to provide a peeling layer.
  • an acrylic resin (BR-77, manufactured by Mitsubishi Rayon Co., Ltd.) was applied and immersed in 1% potassium hydroxide for 5 minutes, and then immersed in a palladium chloride / tin chloride colloid solution, and then immersed in 1% potassium hydroxide. It was immersed for a while and electroless nickel plating was applied to form a metal layer.
  • a positive photoresist (OFPR800 manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on the metal layer, exposed and developed using a photomask, and has a line width of 30 / ym and an eye size of 150 ⁇ 15 cm. Patterned in a grid.
  • the resist was stripped. A conductive wire was connected to this metal layer, immersed in an aqueous solution containing titanium black 1 ⁇ 3 ⁇ 4, aminated epoxidized polybutadiene 20%, and triethylamine 1%, and applied with a voltage of 30 V for 3 minutes to a thickness of 1 ⁇ m.
  • a transfer sheet was prepared by forming a black electrodeposited layer of m.
  • an acrylic plate having a thickness of 3 mm was used as a transparent second substrate, and an adhesive layer was formed by applying a glycidyl ether type epoxy resin on one surface thereof by a roll coating method.
  • the transfer sheet was bonded onto the second substrate so that the first substrate was the outer surface
  • the first substrate alone was peeled off to obtain a light-transmitting electromagnetic wave shield material.
  • a polymethyl methacrylate film was used as a transparent first substrate, and a metal layer was provided on one surface thereof by vapor-depositing nickel.
  • a positive photo resist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on the metal layer, exposed and developed using a photomask, and patterned into a reverse polka dot shape with an inner diameter of 100 m and a pitch of 110 / im. did.
  • the metal layer was etched with a ferric chloride solution, the resist was stripped.
  • a conductive wire was connected to this metal layer, and further immersed in an acetonitrile solution containing 0.5 M of pyrrole, 0.5 M of sulfuric acid, and 0.2 M of tetraethylammonium borofluoride.
  • a ⁇ -mel electrode having a saturation force was set as a reference electrode, and a current of 0.8 V vs. SCE was applied for 3 minutes to form a black electrodeposited layer having a thickness of 1 m.
  • a phenol-polak type epoxy resin was applied thereon by a mouth coating method and an adhesive layer was provided to produce an adhesive sheet.
  • a borosilicate glass plate having a thickness of Umm was used as a transparent second substrate. Then, the adhesive sheet was adhered on the second substrate so that the first substrate was the outer surface, to obtain a light-transmitting electromagnetic wave shield material.
  • a polyethylene terephthalate film was used as a transparent first substrate, and a metal layer was provided on one surface thereof by bonding a copper foil having a thickness of 35 ⁇ m.
  • a positive photoresist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on the copper foil, exposed and developed using a photomask, and the width is 10 / m and the eye size is lOO X lOO m. Patterned in a grid.
  • the resist was stripped off.
  • a 2 mm-thick polyester plate was used as a transparent second substrate, and an adhesive sheet was adhered to the second substrate so that the first substrate was on the outer surface, to obtain a translucent electromagnetic wave shielding material.
  • a polyethylene terephthalate film was used as a first substrate, and a release layer was provided on one surface of the first substrate by applying polyethylene methacrylate by a comma coating method.
  • a metal layer was provided by bonding a copper foil having a thickness of 35 / in to one of them.
  • a photo resist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was solid-formed, exposed and developed using a photomask, and was patterned into a lattice pattern having a width of 0; zm and an eye size of lOO x lOOm.
  • the copper foil was etched with an aqueous ferric chloride solution, and the resist was stripped off.
  • This is transferred by subjecting it to a chemical treatment in which it is immersed in a boiling aqueous solution containing 1 part by weight of potassium persulfate and 5 parts by weight of sodium hydroxide for 1 minute, and the copper foil has a black surface layer.
  • the sheet was torn.
  • a 2-mm thick polymethyl methacrylate plate was used as a transparent second substrate, and an adhesive layer was provided on one surface of the second substrate by applying a bisfuninol A-type epoxy resin by a roll coating method.
  • a metal layer was provided by bonding an iron foil having a thickness to one surface thereof.
  • a positive photoresist (OFPR800, manufactured by Tokyo Ohka Kogyo Co., Ltd.) is solid-formed on the iron foil, exposed and developed using a photomask, and developed to a width of 10 / im and an eye size of 100 ⁇ 100; / m. In a lattice pattern.
  • the resist was stripped off. This was subjected to a chemical conversion treatment in which it was immersed for 2 minutes in an aqueous solution containing 0.1 M of zinc dihydrogen phosphate at 80 to produce a metal compound in which the surface layer of the iron foil had a black color.
  • a pressure-sensitive adhesive on one side and a low-reflection-treated polyurethane film (3-7 top manufactured by Asahi Glass Co., Ltd.) on the other side were used as a transparent second substrate with an adhesive layer.
  • the adhesive sheet was attached on the second substrate such that the first substrate was on the outer surface to obtain a transparent A raw electromagnetic wave shielding material.
  • Example 3 5 A polyethylene terephthalate film was used as a first substrate, and a release layer was provided on one surface of the first substrate by applying polyethylene methacrylate by a comma coating method. Next, a solution of polyacrylonitrile in ⁇ , ⁇ -dimethylformamide is applied with a bar coater, dried, and immersed in a dye bath of a black dye (Sumiacryl Black FFP manufactured by Sumitomo Chemical Co., Ltd.) for 20 minutes. It was crushed to provide a black dyed layer. Next, silver was vapor-deposited on the entire surface of the black dyeing layer to provide a metal layer.
  • a black dye Sudiacryl Black FFP manufactured by Sumitomo Chemical Co., Ltd.
  • a resist layer is formed on the entire metal layer by spin coating, exposed using a photomask, developed, and developed to a width of 20 Aim. It was patterned in a grid pattern with a pitch of 150 / m.
  • the portion of the metal layer not covered with the resist layer is removed with an aqueous solution of ferric nitrate and sodium chlorite, and at the same time, the portion of the black stained layer not covered with the metal layer is decolorized with an etchant.
  • a transfer sheet was prepared.
  • an acrylic plate having a thickness of 2 mm was used as a transparent second substrate, and an adhesive layer was formed by applying a glycidylamine type epoxy resin to one surface thereof by a roll coating method.
  • the transfer sheet was bonded onto the second substrate so that the first substrate was the outer surface, and then the first substrate alone was stripped to obtain a translucent electromagnetic wave shielding material.
  • a polycarbonate film was used as the transparent first substrate, and a black dye (sand sand) was placed in a mixed solvent of ethylene-vinyl alcohol copolymer (Eval F manufactured by Kuraray Co., Ltd.) and n-propyl alcohol-water.
  • the product added with Lanasyn Brill Black A) was coated with an abricator and dried to form a black dyed layer.
  • electroless copper plating was performed to provide a metal layer.
  • a resist layer is formed on the entire surface of the metal layer by a roll coating method using a post type photo resist (OFPR800 manufactured by Tokyo Ohka Kogyo Co., Ltd.), exposed using a photomask, developed, and developed. 30, "m, and a honeycomb pattern of pitch 200 ⁇ ⁇ . then, using a ferric chloride solution as an etching solution, the metal layer which is not covered with the resist layer is removed Was. Finally, using a 3% aqueous potassium hydroxide solution as a resist remover, the resist layer is removed, and at the same time, the black stained layer not covered with the metal layer is decolorized with the resist remover, and the adhesive sheet is removed. Was prepared.
  • a post type photo resist OFPR800 manufactured by Tokyo Ohka Kogyo Co., Ltd.
  • a cellulose acetate plate having a thickness of l mm was used as a transparent second substrate, and an adhesive layer was provided on one surface of the substrate by applying a glycidylamine type epoxy resin by a roll coating method.
  • the sticking sheet was stuck on the second substrate so that the metal layer became the outer surface, to obtain a light-transmitting electromagnetic wave shielding material.
  • the translucent electromagnetic wave shielding material and the method of manufacturing the same according to the fifth to the twelveth inventions have the above-described configuration, and thus have the following effects.
  • the translucent electromagnetic wave shielding material of the present invention comprises a plate after forming each layer of the electromagnetic wave shield on a transparent first base made of a film which is easier to handle more heavily than a plate to produce an adhesive sheet. Since it is bonded to the transparent second substrate, no large-scale equipment is required for forming each layer of the electromagnetic wave shield.
  • each layer of electromagnetic wave shielding is formed on the transparent first substrate made of film to produce an adhesive sheet, it is adhered along the transparent second substrate made of a three-dimensional object.
  • An electromagnetic shielding effect can be imparted to such a transparent substrate.
  • each electromagnetic wave shielding layer is formed on a transparent first substrate made of a normal film which is less expensive than a film having a functional layer to produce an adhesive sheet.
  • a transparent second layer made of a functional film is formed. Since it is bonded to the base, if pinholes, scratches, etc. are found in a part at the stage of the bonding sheet, it can be used by avoiding the part of the bonding sheet, and there is no need to discard the expensive second base.
  • the translucent electromagnetic wave shielding material obtained by the present invention has a good yield and a low product cost.
  • each layer of electromagnetic wave shielding is formed and adhered on a transparent first substrate made of a film.
  • the attached sheet After the attached sheet is prepared, it is bonded along the transparent second substrate consisting of a plate, a three-dimensional object, or a film having a functional layer, so that the second substrate is heated as required during the formation of each layer of the electromagnetic wave shield.
  • the material of the second substrate can be selected from a wider range than before without being damaged by the treatment or various chemical treatments.
  • the present invention provides a method for producing a transfer sheet in which a release layer and an electromagnetic wave shielding layer are provided on a first substrate made of a film, and then forming the transfer sheet on a transparent substrate made of a film having a plate, a three-dimensional object, or a functional layer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un matériau tout à fait transparent à la lumière et ayant de très bonnes propriétés d'écran électromagnétique. Le matériau d'écran est fabriqué par formation de couches métalliques et de couches noires, d'une manière non ordonnée, sur un substrat transparent et les couches métalliques et noires, sont disposées suivant un motif en alignement mutuel. L'invention concerne également un procédé pour produire ce matériau.
PCT/JP1997/000626 1996-02-29 1997-02-28 Materiau ecran electromagnetique transparent a la lumiere et procede pour le realiser WO1997032458A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP7114996 1996-02-29
JP8/71149 1996-02-29
JP8/134282 1996-04-30
JP13428296 1996-04-30
JP13596796A JPH09298384A (ja) 1996-05-02 1996-05-02 透光性電磁波シールド材料とその製造方法
JP8/135967 1996-05-02
JP15755196 1996-05-28
JP8/157551 1996-05-28
JP16383296 1996-06-03
JP8/163832 1996-06-03
JP19831896 1996-07-08
JP8/198318 1996-07-08

Publications (1)

Publication Number Publication Date
WO1997032458A1 true WO1997032458A1 (fr) 1997-09-04

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WO (1) WO1997032458A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0914033A2 (fr) * 1997-09-29 1999-05-06 Nisshinbo Industries Inc. Matériau et panneau faisant écran aux radiations électromagnétiques ainsi que leur procédé de fabrication
EP1024683A2 (fr) * 1999-01-28 2000-08-02 Nisshinbo Industries, Inc. Matériau transparente pour le blindage contre les radiations électromagnétiques et méthode de sa production
EP1215705A2 (fr) * 2000-12-12 2002-06-19 Nisshinbo Industries, Inc. Matériau transparent de blindage contre les radiations électromagnétiques
CN105075417A (zh) * 2013-03-21 2015-11-18 株式会社则武 电磁波屏蔽板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154898A (en) * 1981-02-23 1982-09-24 Optical Coating Laboratory Inc Transparent electromagnetic shield and method of producing same
JPS59106176U (ja) * 1983-01-06 1984-07-17 森電機株式会社 導電性を有するスクリ−ンフイルタ−
JPS60257235A (ja) * 1984-06-04 1985-12-19 日本電信電話株式会社 導電性高分子フイルム及びその製造方法
JPS61134189A (ja) * 1984-12-04 1986-06-21 Dainippon Printing Co Ltd 電磁波シ−ルド用フイルタ−
JPS62213140A (ja) * 1986-03-14 1987-09-19 Nec Corp 配線の製造方法
JPS63195800U (fr) * 1987-06-03 1988-12-16
JPH0772321A (ja) * 1993-08-31 1995-03-17 Toppan Printing Co Ltd カラーフィルター及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154898A (en) * 1981-02-23 1982-09-24 Optical Coating Laboratory Inc Transparent electromagnetic shield and method of producing same
JPS59106176U (ja) * 1983-01-06 1984-07-17 森電機株式会社 導電性を有するスクリ−ンフイルタ−
JPS60257235A (ja) * 1984-06-04 1985-12-19 日本電信電話株式会社 導電性高分子フイルム及びその製造方法
JPS61134189A (ja) * 1984-12-04 1986-06-21 Dainippon Printing Co Ltd 電磁波シ−ルド用フイルタ−
JPS62213140A (ja) * 1986-03-14 1987-09-19 Nec Corp 配線の製造方法
JPS63195800U (fr) * 1987-06-03 1988-12-16
JPH0772321A (ja) * 1993-08-31 1995-03-17 Toppan Printing Co Ltd カラーフィルター及びその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0914033A2 (fr) * 1997-09-29 1999-05-06 Nisshinbo Industries Inc. Matériau et panneau faisant écran aux radiations électromagnétiques ainsi que leur procédé de fabrication
EP0914033A3 (fr) * 1997-09-29 2000-03-15 Nisshinbo Industries Inc. Matériau et panneau faisant écran aux radiations électromagnétiques ainsi que leur procédé de fabrication
US6143674A (en) * 1997-09-29 2000-11-07 Nisshinbo Industries, Ltd. Electromagnetic radiation shield material and panel and methods of producing the same
EP1024683A2 (fr) * 1999-01-28 2000-08-02 Nisshinbo Industries, Inc. Matériau transparente pour le blindage contre les radiations électromagnétiques et méthode de sa production
EP1024683A3 (fr) * 1999-01-28 2000-11-02 Nisshinbo Industries, Inc. Matériau transparente pour le blindage contre les radiations électromagnétiques et méthode de sa production
US6433481B1 (en) 1999-01-28 2002-08-13 Nisshinbo Industries, Inc. Transparent electromagnetic radiation shield material
EP1215705A2 (fr) * 2000-12-12 2002-06-19 Nisshinbo Industries, Inc. Matériau transparent de blindage contre les radiations électromagnétiques
EP1215705A3 (fr) * 2000-12-12 2003-05-21 Nisshinbo Industries, Inc. Matériau transparent de blindage contre les radiations électromagnétiques
CN105075417A (zh) * 2013-03-21 2015-11-18 株式会社则武 电磁波屏蔽板
CN105075417B (zh) * 2013-03-21 2018-07-10 株式会社则武 电磁波屏蔽板
US10655209B2 (en) 2013-03-21 2020-05-19 Noritake Co., Limited Electromagnetic shield

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