WO1997028420A1

WO1997028420A1 - Lead inspection apparatus of ic package

Info

Publication number: WO1997028420A1
Application number: PCT/JP1997/000246
Authority: WO
Inventors: Hisashi Hamachi; Koichi Ishikawa; Yoshihiko Nakakoji
Original assignee: Komatsu Ltd.
Priority date: 1996-02-02
Filing date: 1997-01-31
Publication date: 1997-08-07
Also published as: JPH09210652A; KR19990081948A

Abstract

An apparatus for inspecting leads of an IC package (2) by forming images of illuminated leads. Lighting devices (3 and 4) disposed at the center of the bottom surface of the IC package to illuminate the leads have a width corresponding to a center area of the bottom surface of the IC package, where the lead terminals (1) of the IC package (2) do not exist, a length greater than stand-off of the lead terminals (1) of the IC package (2) and a height such that light can be radiated to only the lead terminals closer to the center portion of the IC package from the distal end portions of the leads. Cameras (7 and 8) for imaging the leads (1) are disposed to measure highly precisely the flatness of the lead terminals.

Description

Specification

Ic package lead inspection equipment

The present invention illuminates the lead terminals of the IC package and captures an image of the lead terminals, thereby reducing the flatness of the leads, the lead pitch variation, and the bending of the lead tips.

The present invention relates to a lead inspection device for an IC package for inspecting misalignment between terminals of a lead tip. Background art

In recent years, IC packages, such as SOJ and PLCC, whose lead ends are bent into a J-shape, are becoming mainstream.

Inspection items for such IC packages include:

Lead flatness (Fig. 14 (a))

(2) Pitch variation of lead grounding section (Fig. 14 (a))

3 Short due to bending of the lead tip (Fig. 14 (¾

Misalignment between terminals at the end of the lead (Fig. 14 W)

Inspection for missing, blurred, or misaligned marks on the mark on the top of the package

Inspection of these items has traditionally employed an inspection device as shown in Fig. 15.

That is, according to the prior art shown in FIG. 15, in the first stage A, light is emitted from a light source arranged on the side of the IC package, and an image of the lead terminals arranged on the left side of the IC package is formed. An image is taken with the camera F arranged on the opposite side of the light source, and the flatness, pitch variation and short-circuit due to bending of the left lead are inspected based on the image data.

Next, the IC package is moved to the second stage B, and an image of the right lead terminal is captured using another force G on this stage B, and the same inspection as described above is performed. Next, the IC package is moved to the third stage C. At this stage C, the upper surface of the IC package is imaged using the camera H arranged above, and a mark is formed on the upper surface of the package based on the image data. Inspect for missing, blurred, or misaligned characters.

Finally, the IC package is moved to the fourth stage D, and the IC package turned upside down at this stage D is imaged by the camera I arranged above, thereby obtaining image data on the back surface of the IC package. Then, based on the image data, the positional deviation between the terminals at the leading end of the lead is inspected.

In the above prior art, the image of the lead terminal is taken while the IC package is mounted on the stage during the inspection of the items (! To (3) in the stages A and B. There is a problem that the image of the stage and the image of the lowest point of the lead terminal overlap, which makes it difficult to determine the flatness. In this case, the light from the light source passes through the right lead terminal and enters the left lead terminal and the camera F, so that the image of the right lead terminal overlaps the image of the left lead terminal, and is flat. There is also a problem that it is difficult to determine the degree and pitch variation.

In addition, according to the above-described conventional technology, three stages are required to perform the inspection of (%> to) of the inspection items, so that it takes time to move the stages and a large inspection space is required. However, there are problems such as an increase in the number of equipment such as cameras and lighting.

Further, in the final stage D of the prior art, since the imaging data of the back surface of the IC package is obtained using the light source fixedly arranged at a predetermined position, the molding scratches and burrs formed on the lead surface are obtained. Sometimes, irregular reflections were caused, and clear image data could not be obtained, making measurement impossible. In other words, lead terminals are bent by press molding, but scratches due to the die occur at different positions for each die, and clear images can be obtained for lead terminals bent by a certain die. However, a lead terminal bent by another mold may not be measurable due to a large amount of diffuse reflection depending on the lot (unit of mold), such that a measurable image cannot be obtained due to diffuse reflection. Was The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an IC package lead inspection device capable of measuring the flatness of a lead terminal with high accuracy.

It is another object of the present invention to provide an IC package lead inspection apparatus capable of performing efficient inspection of lead terminals and saving space, cost, and parts.

Another object of the present invention is to provide an IC package lead inspection apparatus capable of obtaining clear image data even if irregular reflection occurs due to a die flaw at the tip of the lead. Disclosure of the invention

According to the present invention, in an IC package lead inspection device that illuminates the lead terminals of an IC package and captures an image of the image to inspect the lead terminals of the IC package, the bottom surface of the IC package in which the lead terminals of the IC package do not exist is provided. The lighting device has a width corresponding to the central region of the IC package, and is longer than the standoff of the lead terminal of the IC package, and has a height from the tip of the lead to only irradiate the lead terminal on the central part side of the IC package. In addition to being provided at the center of the bottom surface of the IC package, an image pickup means for picking up an image of the lead terminal by the illumination light is provided.

That is, according to the invention, the light is radiated in the lateral direction from the center of the bottom surface of the IC package toward the lead terminal, and an image of the lead terminal is captured by the irradiated light. At this time, the height of the illumination source is set to a height that is longer than the stand-off of the lead terminals of the IC package and that the light is irradiated only from the tip of the lead to the lead terminal on the center side of the IC package. Light is prevented from sneaking out to the outside of the tip (bottom) of the lead.

Further, according to the present invention, in a lead inspection device for an IC package which illuminates a lead terminal of the IC package and captures an image of the image to check for an abnormality of the lead terminal of the IC package, the lead terminal of the IC package has a lead terminal. Non-existent IC package Stands for lead terminals of IC package with width corresponding to central area on bottom surface A translucent IC package supporting member that is longer than off and has a height such that only the lead terminals on the center side of the IC package from the lead end are irradiated with light is provided on the bottom of the IC package. A light source for emitting light to the side surface of the member, and an image pickup means for picking up an image of the lead terminal by the light source light guided by the IC package support member are provided.

According to this invention, the light is incident on the side surface of the IC package supporting member, and then is irradiated in the lateral direction from the vicinity of the bottom surface of the IC package toward the lead terminals. Then, an image of the lead terminal is captured by the irradiation light. At this time, the height of the exposed part of the IC package supporting member from which the light passes through from the bottom of the IC package is longer than the standoff of the lead terminal of the IC package. The height is set so that only the lead terminals of the lead are irradiated with light, so that light does not wrap around to the outside of the tip (bottom) of the lead.

Further, according to the present invention, an IC package for inspecting an IC package lead terminal abnormality by illuminating a lead terminal of the IC package and an upper surface of the IC package and capturing an image of the lead terminal, and inspecting the IC package from the upper surface. In the inspection equipment of

The lead terminal of the IC package has a width corresponding to the central area on the bottom of the IC package where the lead terminal of the IC package does not exist, and is longer than the stand-off of the lead terminal of the IC package. A first lighting device having a height at which only the light is irradiated is provided at the center of the bottom surface of the IC package, and a second lighting device for illuminating the upper surface of the IC package is provided above the IC package. And

Two mirror means respectively provided on both sides of the IC package; anda lead terminal image formed by light of the first lighting device provided above the IC package and guided by the mirror means. One imaging means for imaging an upper surface of the IC package illuminated by the second illumination device; illumination of the first illumination device for the lead terminal; and the IC package of the second illumination device. Control means for alternately and temporally switching and controlling the illumination of the upper surface of the IC, so that the inspection of the lead terminals and the inspection from the upper surface of the IC package are performed in one stage. I have to.

According to this invention, the inspection of the lead terminal and the inspection of the mark from the upper surface of the IC package are performed on the same stage, and the imaging camera at that time is also shared.

According to the invention, the IC package is placed on the stage so that the back surface thereof faces upward, and the back surface of the IC package is illuminated by the lighting device disposed above the IC package. In a lead inspection device for an IC package, which inspects the lead of the IC package by imaging the back surface of the package, a plurality of lighting devices having different lighting conditions for the IC package are arranged above the IC package. ,

Control means for sequentially and temporally switching and controlling the illumination of the plurality of illumination devices with respect to the IC package is provided.

According to this invention, a plurality of lighting devices are installed so as to have different lighting conditions (illumination direction, distance to the IC package, illuminance, and the like) with respect to the IC package, and the plurality of lighting devices are switched and driven to provide a lead. The shape and scratches are suppressed to obtain a clear image. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a front view conceptually showing a first embodiment of the present invention.

FIG. 2 is a plan view of the embodiment of FIG.

FIG. 3 is a view showing a shadow image captured by the embodiment of FIG.

FIG. 4 is an enlarged view of the vicinity of the lead terminal of the IC package in the execution order of FIG. FIG. 5 is a diagram for explaining restrictions on L s + a.

FIG. 6 is a diagram showing a second embodiment of the present invention.

FIG. 7 is a diagram showing various modifications of the embodiment of FIG.

FIG. 8 is a diagram showing a third embodiment of the present invention.

FIG. 9 is a diagram showing various modifications of the embodiment in FIG.

FIG. 10 is a diagram showing a fourth embodiment of the present invention.

FIG. 11 is a diagram showing a fifth embodiment of the present invention. FIG. 12 is a diagram showing a modification of the fifth embodiment shown in FIG.

FIG. 13 is a diagram showing a modification of the fifth embodiment shown in FIG.

Figure 14 is a diagram showing various inspection items of the lead terminals of the IC package.

Figure 15 shows the prior art. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 conceptually shows a first embodiment of the present invention. This embodiment is a configuration for performing a flatness inspection of a lead terminal, a lead pitch and a short-circuit inspection. In FIG. 1, an IC package (SOJ, PLCC) 2 having a J-lead terminal 1 is a light-transmitting support made of a material such as white acrylic as shown in the plan view of FIG. It is placed on the member 3. In this case, the light source 4 is disposed below the IC package 2, and the light enters the IC package via the light diffusion plate 5 and the support member 3 from below. The light-shielding mask 6 disposed on the side of the support member 3 is disposed so that light from the light source 4 does not directly enter the cameras 7 and 8. Cameras 7 and 8 for capturing the image of the lead terminal 1 are provided on the left and right of the IC package 2, and the cameras 7 and 8 capture the images of the left lead terminal and the right lead terminal separately. .

That is, according to the configuration of FIG. 1, the light is guided from below to the IC package 2, and the light that exits from the upper part of the support member 3 and reaches the cameras 7 and 8 through the lead terminals 1 is transmitted to each of the cameras 7 and 8. The image is taken at step 8, and the taken image is as shown in FIG. In FIG. 3, the hatched portion corresponds to the shadow, the portion indicated by reference numeral 9 corresponds to the body of the IC package 2, the portion indicated by reference numeral 10 corresponds to the lead terminal, and the reference numeral 11 The portion indicated by corresponds to the light-shielding mask body 6.

Here, as shown in FIG. 4, the distance from the lower surface of the IC package 2 to the tip of the lead (lowest part) is called a standoff Ls.

The distance (Ls + α), which is obtained by adding the distance α from the (bottom) to the upper surface of the light-shielding mask body 6, is a height such that light does not enter the lead tip (bottom) and the lead portion outside the lead tip. In other words, it is longer than the standoff. By setting the height at which light is irradiated only to the lead terminal on the center side of the cage, the image of the tip of the lead (bottom) is clearly captured.

By the way, as shown in Fig. 5, if α is too large, light wraps around the lead tip (lowest part) and the lead part outside the lead tip, and the lead tip (lowest part) is sharp. The image cannot be captured as a shadow, and the standoff Ls cannot be determined with high accuracy. In addition, the accuracy of the flatness inspection cannot be improved.

Next, the length La of the support member 3 that guides light from the light source 4 in the X direction (see FIG. 2) is also limited to a length that does not allow light to reach the tip of the lead terminal of the IC package 2. (Not too big).

FIG. 6 shows a second embodiment of the present invention. In this embodiment, light emitted from the upper part of the support member 3 is reflected by the prism mirror 12 and the reflected light is reflected on the IC package 2. One camera 13 arranged at the top is used to capture images, and the images of the left and right lead terminals are captured simultaneously by one camera 13. In this embodiment, measures such as blackening the upper surface of the light-shielding mask body 6 so as not to reflect light are performed.

In the embodiment shown in FIG. 6, the support member 3 having a relatively high height is used, and the distance adjustment of (Ls + a) is performed by the light shielding member 14 attached to the upper part of the light shielding mask body 6. I have.

As a method of forming such a light shielding portion 14, there is a method of forming an integrally formed light shielding mask body 6 as shown in FIG. 7, and as shown in FIG. Forming separately from the body 6 and attaching it later, applying a light-blocking paint to the lower part of the support member 3 as shown in Fig. 7, and shading the lower part of the support member 3 as shown in Fig. 7 There is a method to change the quality.

FIG. 8 shows a third embodiment of the present invention. In this embodiment, as in the first and second embodiments, flatness inspection of a lead terminal, lead pitch and short-circuit inspection are performed. It is a configuration for.

In FIG. 8, fa is a plan view, and FIG. 8B is a side view of FIG.

In the embodiment of FIG. 8, instead of placing light source 4 under the IC package, Light is incident from the side below the IC package via the translucent support member 3 which is disposed on the side surface of the C package and has light scattering properties. A light shield 17 into which the support member 3 is inserted is provided between the light source 4 and the IC package 2. The light shield 17 allows light from the side only to pass through the IC package 2 through the support member 3 alone. Guide light below. The light guided under the IC package 2 is incident on cameras 15 and 16 provided on the left and right side surfaces, whereby an image of the lead terminal 1 is captured. Here, below the support member 3, for example, as shown in FIG. 9 (¾), (Ls + α) is set to a height such that light does not enter the lead tip (lowest part) and the lead part outside the lead tip. In other words, a light-shielding mask body 18 is provided to regulate the height at which light is irradiated only from the lead end to the lead terminal on the central part side of the IC package. In the case of FIG. 9 <¾), the support member 3 is embedded in the light shielding mask 18.

In addition, as the light shielding mask body 18, a light shielding member having a concave shape as shown in FIG. 9 is placed over the support member 3, and a light shielding mask is provided below the support member 3 as shown in FIG. There is a method of applying a conductive paint, and a method of transforming the lower part of the support member 3 into a light-shielding property as shown in FIG.

In the embodiment shown in FIGS. 8 and 9, one camera is cut above the IC package as in the embodiment shown in FIG. 6, and the camera shown in FIG. The images of the left and right lead terminals may be guided by two mirrors provided at the positions of the lines 15 and 16, respectively.

FIG. 10 shows a fourth embodiment of the present invention. In this embodiment, a light source 20 for illuminating the upper surface of the IC package 2 is added to the configuration of the embodiment shown in FIG. In addition to the inspection of the flatness of the lead terminals, the inspection of the lead pitch and the short-circuit, the inspection of the mark on the upper surface of the IC package 2 is performed on the same stage.

In other words, when performing the flatness inspection of the lead terminals, the lead pitch and the short-circuit inspection, the light source 4 is turned on, the light source 20 is turned off, the image of the lead terminal is captured by the camera 13, and the mark inspection is performed. When performing the above, the light source 20 is turned on, the light source 4 is turned off, and the mark on the upper surface of the IC package 2 is imaged by the camera 13.

LEDs, strobes, semiconductor lasers, etc. may be used as light sources 4 and 20. The one that can switch on and off as fast as possible is adopted. The light sources 4 and 20 that emit light at all times may be used, and the illumination may be alternately switched by opening and closing a shirt provided on the front surface of each of the light sources. Further, the light sources 4 and 20 may be shared by one light source, and the light of the one light source may be guided to the lower surface and the upper surface of the IC package by using different optical systems. In addition, one of the light sources 4 or 20 that is always lit is used, and this one light source is turned on and off by opening and closing the shirt provided on the front, and the other light source 20 or 4 is turned on. Alternatively, the lighting may be turned on and off by turning off the light. In the embodiment shown in FIG. 10, the inspection performed by the imaging data of the force camera 13 disposed above the IC package is not limited to the inspection of the mark on the upper surface of the IC package. Whether the width of the lead is within the standard or not, it may be applied to the inspection of the lead width when the ICY is viewed from above.

FIG. 11 shows a fifth embodiment of the present invention. In this embodiment, the IC knockout 2 is placed on the stage 25 with the IC package 2 turned upside down, and the lower surface of the IC package is turned on. By imaging with the camera 26, the positional deviation between the terminals of the lead tips shown in FIG. 14 is to be inspected.

In this embodiment, the light sources 30 (LEDs in this case) for illuminating the lower surface of the IC package are divided into three groups 30-a to 30-b. The lighting conditions such as the installation height, mounting angle (lighting direction) and illuminance of the three light sources are made different, and these three groups of light sources 30-a to 30-1b are sequentially switched to light each group. Drive.

That is, the light source of group 30-a is turned on first, the light sources of the other groups 30-b and 30-c are turned off, and then the light source of group 30-b is turned on and turned off. The light sources of groups 30 — a and 30 — c are turned off, then the light sources of group 30 — c are turned on, and the light sources of the other groups 30 — a and 30 — b are turned off. The switching drive such as repeating is performed.

Thus, in the embodiment of FIG. 1, the illumination conditions are variously changed depending on the light sources of a plurality of groups, so that the influence of the shape of the lead, scratches, etc. is suppressed, and the image is sharp. In order to obtain a suitable captured image.

As the light source 30, an LED, a strobe, a semiconductor laser, or the like can be used, and a light source that can switch on and off as quickly as possible is used. FIG. 12 shows a modified example of the light source 30 of the embodiment of FIG. 11. In this case, a light source 35 constantly emitting light is used. Illumination switching control similar to that of the embodiment in FIG.

Fig. 13 also shows a modification of the light source 30 of the embodiment of Fig. 11. In this case, one light source 40 (for example, a fluorescent lamp) is arranged on each of the left and right sides, and this light source light is Illumination switching control similar to that of the embodiment in FIG. 11 is performed by allowing the shutters 41 disposed at different positions and angles for each group to open and close so as to pass through the light blocking Z.

Further, in the embodiment shown in FIG. 11, a part of the light sources 30-a to 30-c is always lit, and some of the light sources are provided by a shutter disposed on the front surface thereof. The lighting may be turned on and off by opening and closing, and the lighting may be turned on and off by turning on and off the other light sources.

By the way, in the above embodiment, the present invention is applied to an IC package such as SOJ and PLCC having a J lead, but may be applied to a four-way terminal flat package (QFP).

Further, in each of the above embodiments, the emission color of part or all of the illumination may be changed to red, green, or the like. Industrial applicability

As described above, according to the present invention, illumination light is irradiated laterally from the center of the bottom surface of the IC package toward the lead terminals, and a shadow image of the lead terminals is captured by the irradiation light. The height is set to be longer than the standoff of the lead terminal of the IC package so that light is emitted only from the leading end of the lead to the lead terminal at the center of the IC package. As a result, it is possible to prevent light from sneaking into the outside of the lead tip, and to obtain a clear image of the lead terminal. The accuracy of flatness measurement can be significantly improved.

In addition, according to the present invention, the inspection of the lead terminals and the inspection of the mark on the upper surface of the IC package are performed at the same stage, so that the inspection of the lead terminals can be performed efficiently, and the space, cost and number of parts can be reduced. I can do it.

Further, in the present invention, the lead is inspected by irradiating the back surface of the IC package with a plurality of lighting devices having different lighting conditions. Therefore, even if irregular reflection due to mold flaws or the like at the tip of the lead occurs. Clear imaging data can be obtained, and the measurement accuracy can be improved.

Claims

The scope of the claims

1. In the lead inspection device of the IC package, which illuminates the lead terminals of the IC package and captures an image of the image to inspect the lead terminals of the IC package for abnormalities,

IC package lead terminals do not exist Ic The width corresponding to the central area on the bottom of the package, longer than the standoff of the lead terminals of the IC package Lead from the lead end to the central part of the IC package A lighting device with a height that irradiates light only to the terminals is installed at the center of the bottom of the IC package,

A lead inspection device for an IC package, comprising: an imaging unit that captures a shadow image of the lead terminal by the illumination light.

2. The lighting device includes: a light source disposed below the IC package;

A translucent IC package supporting member having a ton corresponding to a central area of the bottom surface of the IC package, guiding the light of the light source to near the bottom surface of the IC package, and supporting the IC package;

First light blocking means for blocking an area outside the bottom surface of the IC package supporting member so as to guide the light of the light source to the vicinity of the bottom surface of the IC package only from the bottom surface of the IC package supporting member;

The height of the exposed portion of the IC package supporting member from the bottom surface of the IC package is longer than the stand-off of the lead terminal of the IC package. Light is applied only from the lead end to the lead terminal at the center of the IC package. Second light blocking means for blocking at least the surface of the IC package support member facing the lead terminals so as to reach the irradiation height;

2. The lead inspection device for an IC package according to claim 1, comprising:

3. The lead inspection device for an IC package according to claim 2, wherein the first light-shielding means and the second light-shielding means are integrally formed.

4. The lead inspection device for an IC package according to any one of claims 1 to 3, wherein the imaging means is two cameras arranged on both sides of the IC package.

5. The imaging means includes two mirrors provided on both sides of the IC package, respectively.

One camera means disposed above the IC package for capturing a lead terminal image guided by these mirror means;

The lead inspection device for an IC package according to any one of claims 1 to 3, further comprising:

6. In the lead inspection device of the IC package, which illuminates the lead terminals of the IC package and captures an image of the image to inspect the lead terminals of the IC package for abnormalities,

There is no lead terminal of the IC package.It has a width corresponding to the central area on the bottom of the IC package.It is longer than the stand-off of the lead terminal of the IC package. Only the lead terminal at the center of the IC package from the leading end of the lead. A light-transmitting IC package supporting member having a height at which light is applied to the

The IC package supporting member is provided with a light source for emitting light to a side surface thereof, and an imaging unit for capturing an image of the lead terminal by the light source light guided by the IC package supporting member. Lead inspection equipment for IC packages.

7. The apparatus further comprises a first light-shielding means for shielding an area other than the side surface of the IC package supporting member so as to guide the light of the light source to the vicinity of the bottom surface of the IC package only from the side surface of the IC package supporting member. Range 6 lead inspection equipment for IC packages.

8. The height of the exposed portion of the IC package supporting member from the bottom surface of the IC package is longer than the stand-off of the lead terminal of the IC package. Claim 6 or Claim 7 further comprising a second light shielding means for shielding at least a surface of the IC package supporting member facing the lead terminal so that only the lead terminal on the side is irradiated with light. The lead inspection device for IC packages described in 7.

9. The imaging means includes two mirrors provided on both sides of the IC package,

The lead inspection device for an IC package according to any one of claims 6 to 8, comprising:

10. The IC package lead inspection apparatus according to any one of claims 6 to 8, wherein said imaging means is two force cameras respectively disposed on both sides of the IC package.

1 1. The IC package that inspects the lead terminals of the IC package by illuminating the lead terminals of the IC package and the top surface of the IC package and picks up an image of the lead terminals, and also inspects the IC package from the top surface. In the inspection equipment of

There is no IC package lead terminal.It has a width corresponding to the center area of the bottom of the IC package and is longer than the stand-off of the IC package lead terminal. A first lighting device having a height at which light is irradiated is disposed at the center of the bottom surface of the IC package, and a second lighting device for illuminating the top surface of the IC package is disposed above the IC package;

Two mirrors, each installed on both sides of the IC package, An upper surface of the IC package, which is arranged above the IC package and captures a lead terminal image by light of the first lighting device guided by the mirror means, and illuminated by the second lighting device One imaging means for imaging the

Control means for alternately and temporally switching and controlling the illumination of the lead terminals of the first illumination device and the illumination of the top surface of the IC package of the second illumination device;

An inspection device for an IC package, wherein the inspection of the lead terminals and the inspection from the upper surface of the IC package are performed in one stage.

12. The IC package inspection device according to claim 11, wherein the control means alternately switches lighting times of the first lighting device and the second lighting device.

13. The control means includes first and second shutter means provided in front of the first lighting device and the second lighting device, respectively, for blocking and passing light from each lighting device;

By controlling the opening and closing of the first shutter device, the illumination of the first illumination device for the lead terminal and the illumination of the second illumination device for the upper surface of the IC package are alternately switched in time. Shirt opening and closing control means,

The inspection device for an IC package according to claim 11, comprising:

14. The control means is provided in one of the first and second lighting devices, and shuts off light from the lighting device to pass therethrough;

The shutter means so that the lighting timing of the lighting device on the side where the shutter device is not provided and the timing when the shutter device of the lighting device on the side where the shutter device is provided are open alternately in time. Lighting control means for performing lighting control of the lighting device on the side not provided and opening and closing control of the shutter means,

The inspection device for an IC package according to claim 11, comprising:

15 5. Illuminate the lead terminals of the IC package and the top In the inspection equipment for IC packages, which inspects the lead terminals of the IC package for abnormalities by capturing the image of the lead terminals and inspects the IC package from the top,

A first lighting device disposed below the IC package;

A translucent Ic package having a width corresponding to a central region of the bottom surface of the IC package, guiding light of the first lighting device to near the bottom surface of the IC package, and supporting the IC package; A support member;

First light blocking means for blocking a region outside the bottom surface of the IC package supporting member so as to guide the light of the first lighting device to the vicinity of the bottom surface of the Ic package only from the bottom surface of the IC package supporting member;

The height of the exposed part of the IC package support member from the bottom of the IC package is longer than the stand-off of the lead terminal of the IC package. A second light-shielding means for shielding at least a surface of the IC package supporting member facing the lead terminal so that the surface is irradiated with light.

Two mirror means respectively arranged on both sides of the IC package,

A second lighting device disposed above the IC package to illuminate the top surface of the IC package;

One image pickup means disposed above the Ic package, for picking up an image of the lead terminal guided by the mirror means, and for picking up the upper surface of the IC package illuminated by the second lighting device. When,

Lighting control means for switching the lighting of the first and second lighting devices alternately with time;

An inspection device for an IC package, wherein the inspection of the lead terminals and the inspection of the upper surface of the IC package are performed in one stage.

16. Place the IC package on the stage so that its back surface is up, illuminate the back surface of this IC package with the lighting device arranged above the IC package, and image the back surface of the illuminated IC package. To lead the IC package Inspection of IC package lead

A plurality of lighting devices having different lighting conditions for the IC package are arranged above the IC package, and

Control means for sequentially and temporally switching and controlling the illumination of the plurality of illumination devices with respect to the IC package.

A lead inspection device for an IC package, characterized in that it is provided.

17. The IC package inspection device according to claim 16, wherein said control means sequentially switches lighting times of said plurality of lighting devices.

18. The control unit includes a plurality of shutter units provided in front of the plurality of lighting devices, respectively, for blocking and passing light from each of the lighting devices;

A shutter opening / closing control means for sequentially controlling opening / closing of the plurality of shutter means;

The inspection device for an IC package according to claim 16, comprising:

1 9. The control means is provided in a part of the plurality of lighting devices, and intercepts light from the lighting devices and allows the light to pass therethrough.

The lighting timing of the illuminating device without the shutter means and the timing of opening the shutter of the illuminating device with the shutter means are sequentially time-sequentially controlled so that the shutter means is not provided. Lighting control means for performing lighting control of a lighting device and opening / closing control of the shutter means,

The inspection device for an IC package according to claim 16, comprising: