WO1997028420A1 - Lead inspection apparatus of ic package - Google Patents

Lead inspection apparatus of ic package Download PDF

Info

Publication number
WO1997028420A1
WO1997028420A1 PCT/JP1997/000246 JP9700246W WO9728420A1 WO 1997028420 A1 WO1997028420 A1 WO 1997028420A1 JP 9700246 W JP9700246 W JP 9700246W WO 9728420 A1 WO9728420 A1 WO 9728420A1
Authority
WO
WIPO (PCT)
Prior art keywords
package
lead
light
lighting
inspection
Prior art date
Application number
PCT/JP1997/000246
Other languages
French (fr)
Japanese (ja)
Inventor
Hisashi Hamachi
Koichi Ishikawa
Yoshihiko Nakakoji
Original Assignee
Komatsu Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd. filed Critical Komatsu Ltd.
Publication of WO1997028420A1 publication Critical patent/WO1997028420A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination

Definitions

  • the present invention illuminates the lead terminals of the IC package and captures an image of the lead terminals, thereby reducing the flatness of the leads, the lead pitch variation, and the bending of the lead tips.
  • the present invention relates to a lead inspection device for an IC package for inspecting misalignment between terminals of a lead tip.
  • Inspection items for such IC packages include:
  • the first stage A in the first stage A, light is emitted from a light source arranged on the side of the IC package, and an image of the lead terminals arranged on the left side of the IC package is formed. An image is taken with the camera F arranged on the opposite side of the light source, and the flatness, pitch variation and short-circuit due to bending of the left lead are inspected based on the image data.
  • the IC package is moved to the second stage B, and an image of the right lead terminal is captured using another force G on this stage B, and the same inspection as described above is performed.
  • the IC package is moved to the third stage C.
  • the upper surface of the IC package is imaged using the camera H arranged above, and a mark is formed on the upper surface of the package based on the image data. Inspect for missing, blurred, or misaligned characters.
  • the IC package is moved to the fourth stage D, and the IC package turned upside down at this stage D is imaged by the camera I arranged above, thereby obtaining image data on the back surface of the IC package. Then, based on the image data, the positional deviation between the terminals at the leading end of the lead is inspected.
  • the image of the lead terminal is taken while the IC package is mounted on the stage during the inspection of the items (! To (3) in the stages A and B.
  • the image of the stage and the image of the lowest point of the lead terminal overlap, which makes it difficult to determine the flatness.
  • the light from the light source passes through the right lead terminal and enters the left lead terminal and the camera F, so that the image of the right lead terminal overlaps the image of the left lead terminal, and is flat.
  • the molding scratches and burrs formed on the lead surface are obtained.
  • irregular reflections were caused, and clear image data could not be obtained, making measurement impossible.
  • lead terminals are bent by press molding, but scratches due to the die occur at different positions for each die, and clear images can be obtained for lead terminals bent by a certain die.
  • a lead terminal bent by another mold may not be measurable due to a large amount of diffuse reflection depending on the lot (unit of mold), such that a measurable image cannot be obtained due to diffuse reflection.
  • the present invention has been made in view of such circumstances, and it is an object of the present invention to provide an IC package lead inspection device capable of measuring the flatness of a lead terminal with high accuracy.
  • Another object of the present invention is to provide an IC package lead inspection apparatus capable of obtaining clear image data even if irregular reflection occurs due to a die flaw at the tip of the lead. Disclosure of the invention
  • the bottom surface of the IC package in which the lead terminals of the IC package do not exist is provided.
  • the lighting device has a width corresponding to the central region of the IC package, and is longer than the standoff of the lead terminal of the IC package, and has a height from the tip of the lead to only irradiate the lead terminal on the central part side of the IC package.
  • an image pickup means for picking up an image of the lead terminal by the illumination light is provided.
  • the light is radiated in the lateral direction from the center of the bottom surface of the IC package toward the lead terminal, and an image of the lead terminal is captured by the irradiated light.
  • the height of the illumination source is set to a height that is longer than the stand-off of the lead terminals of the IC package and that the light is irradiated only from the tip of the lead to the lead terminal on the center side of the IC package. Light is prevented from sneaking out to the outside of the tip (bottom) of the lead.
  • the lead terminal of the IC package has a lead terminal.
  • Non-existent IC package Stands for lead terminals of IC package with width corresponding to central area on bottom surface
  • a translucent IC package supporting member that is longer than off and has a height such that only the lead terminals on the center side of the IC package from the lead end are irradiated with light is provided on the bottom of the IC package.
  • a light source for emitting light to the side surface of the member, and an image pickup means for picking up an image of the lead terminal by the light source light guided by the IC package support member are provided.
  • the light is incident on the side surface of the IC package supporting member, and then is irradiated in the lateral direction from the vicinity of the bottom surface of the IC package toward the lead terminals. Then, an image of the lead terminal is captured by the irradiation light. At this time, the height of the exposed part of the IC package supporting member from which the light passes through from the bottom of the IC package is longer than the standoff of the lead terminal of the IC package. The height is set so that only the lead terminals of the lead are irradiated with light, so that light does not wrap around to the outside of the tip (bottom) of the lead.
  • an IC package for inspecting an IC package lead terminal abnormality by illuminating a lead terminal of the IC package and an upper surface of the IC package and capturing an image of the lead terminal, and inspecting the IC package from the upper surface.
  • the lead terminal of the IC package has a width corresponding to the central area on the bottom of the IC package where the lead terminal of the IC package does not exist, and is longer than the stand-off of the lead terminal of the IC package.
  • a first lighting device having a height at which only the light is irradiated is provided at the center of the bottom surface of the IC package, and a second lighting device for illuminating the upper surface of the IC package is provided above the IC package.
  • Two mirror means respectively provided on both sides of the IC package; and a lead terminal image formed by light of the first lighting device provided above the IC package and guided by the mirror means.
  • One imaging means for imaging an upper surface of the IC package illuminated by the second illumination device; illumination of the first illumination device for the lead terminal; and the IC package of the second illumination device.
  • Control means for alternately and temporally switching and controlling the illumination of the upper surface of the IC, so that the inspection of the lead terminals and the inspection from the upper surface of the IC package are performed in one stage. I have to.
  • the inspection of the lead terminal and the inspection of the mark from the upper surface of the IC package are performed on the same stage, and the imaging camera at that time is also shared.
  • the IC package is placed on the stage so that the back surface thereof faces upward, and the back surface of the IC package is illuminated by the lighting device disposed above the IC package.
  • a lead inspection device for an IC package which inspects the lead of the IC package by imaging the back surface of the package, a plurality of lighting devices having different lighting conditions for the IC package are arranged above the IC package.
  • Control means for sequentially and temporally switching and controlling the illumination of the plurality of illumination devices with respect to the IC package is provided.
  • a plurality of lighting devices are installed so as to have different lighting conditions (illumination direction, distance to the IC package, illuminance, and the like) with respect to the IC package, and the plurality of lighting devices are switched and driven to provide a lead.
  • the shape and scratches are suppressed to obtain a clear image.
  • FIG. 1 is a front view conceptually showing a first embodiment of the present invention.
  • FIG. 2 is a plan view of the embodiment of FIG.
  • FIG. 3 is a view showing a shadow image captured by the embodiment of FIG.
  • FIG. 4 is an enlarged view of the vicinity of the lead terminal of the IC package in the execution order of FIG.
  • FIG. 5 is a diagram for explaining restrictions on L s + a.
  • FIG. 6 is a diagram showing a second embodiment of the present invention.
  • FIG. 7 is a diagram showing various modifications of the embodiment of FIG.
  • FIG. 8 is a diagram showing a third embodiment of the present invention.
  • FIG. 9 is a diagram showing various modifications of the embodiment in FIG.
  • FIG. 10 is a diagram showing a fourth embodiment of the present invention.
  • FIG. 11 is a diagram showing a fifth embodiment of the present invention.
  • FIG. 12 is a diagram showing a modification of the fifth embodiment shown in FIG.
  • FIG. 13 is a diagram showing a modification of the fifth embodiment shown in FIG.
  • Figure 14 is a diagram showing various inspection items of the lead terminals of the IC package.
  • Figure 15 shows the prior art. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 conceptually shows a first embodiment of the present invention.
  • This embodiment is a configuration for performing a flatness inspection of a lead terminal, a lead pitch and a short-circuit inspection.
  • an IC package (SOJ, PLCC) 2 having a J-lead terminal 1 is a light-transmitting support made of a material such as white acrylic as shown in the plan view of FIG. It is placed on the member 3.
  • the light source 4 is disposed below the IC package 2, and the light enters the IC package via the light diffusion plate 5 and the support member 3 from below.
  • the light-shielding mask 6 disposed on the side of the support member 3 is disposed so that light from the light source 4 does not directly enter the cameras 7 and 8.
  • Cameras 7 and 8 for capturing the image of the lead terminal 1 are provided on the left and right of the IC package 2, and the cameras 7 and 8 capture the images of the left lead terminal and the right lead terminal separately. .
  • the light is guided from below to the IC package 2, and the light that exits from the upper part of the support member 3 and reaches the cameras 7 and 8 through the lead terminals 1 is transmitted to each of the cameras 7 and 8.
  • the image is taken at step 8, and the taken image is as shown in FIG.
  • the hatched portion corresponds to the shadow
  • the portion indicated by reference numeral 9 corresponds to the body of the IC package 2
  • the portion indicated by reference numeral 10 corresponds to the lead terminal
  • the reference numeral 11 The portion indicated by corresponds to the light-shielding mask body 6.
  • the distance from the lower surface of the IC package 2 to the tip of the lead (lowest part) is called a standoff Ls.
  • the distance (Ls + ⁇ ), which is obtained by adding the distance ⁇ from the (bottom) to the upper surface of the light-shielding mask body 6, is a height such that light does not enter the lead tip (bottom) and the lead portion outside the lead tip. In other words, it is longer than the standoff.
  • the length La of the support member 3 that guides light from the light source 4 in the X direction is also limited to a length that does not allow light to reach the tip of the lead terminal of the IC package 2. (Not too big).
  • FIG. 6 shows a second embodiment of the present invention.
  • light emitted from the upper part of the support member 3 is reflected by the prism mirror 12 and the reflected light is reflected on the IC package 2.
  • One camera 13 arranged at the top is used to capture images, and the images of the left and right lead terminals are captured simultaneously by one camera 13.
  • measures such as blackening the upper surface of the light-shielding mask body 6 so as not to reflect light are performed.
  • the support member 3 having a relatively high height is used, and the distance adjustment of (Ls + a) is performed by the light shielding member 14 attached to the upper part of the light shielding mask body 6. I have.
  • a method of forming such a light shielding portion 14 there is a method of forming an integrally formed light shielding mask body 6 as shown in FIG. 7, and as shown in FIG. Forming separately from the body 6 and attaching it later, applying a light-blocking paint to the lower part of the support member 3 as shown in Fig. 7, and shading the lower part of the support member 3 as shown in Fig. 7 There is a method to change the quality.
  • FIG. 8 shows a third embodiment of the present invention.
  • flatness inspection of a lead terminal, lead pitch and short-circuit inspection are performed. It is a configuration for.
  • FIG. 8 fa is a plan view
  • FIG. 8B is a side view of FIG.
  • (Ls + ⁇ ) is set to a height such that light does not enter the lead tip (lowest part) and the lead part outside the lead tip.
  • a light-shielding mask body 18 is provided to regulate the height at which light is irradiated only from the lead end to the lead terminal on the central part side of the IC package.
  • the support member 3 is embedded in the light shielding mask 18.
  • a light shielding member having a concave shape as shown in FIG. 9 is placed over the support member 3, and a light shielding mask is provided below the support member 3 as shown in FIG.
  • a method of applying a conductive paint is applied to the support member 3 to form a light-shielding property as shown in FIG.
  • one camera is cut above the IC package as in the embodiment shown in FIG. 6, and the camera shown in FIG.
  • the images of the left and right lead terminals may be guided by two mirrors provided at the positions of the lines 15 and 16, respectively.
  • FIG. 10 shows a fourth embodiment of the present invention.
  • a light source 20 for illuminating the upper surface of the IC package 2 is added to the configuration of the embodiment shown in FIG.
  • the inspection of the mark on the upper surface of the IC package 2 is performed on the same stage.
  • the light source 4 when performing the flatness inspection of the lead terminals, the lead pitch and the short-circuit inspection, the light source 4 is turned on, the light source 20 is turned off, the image of the lead terminal is captured by the camera 13, and the mark inspection is performed.
  • the light source 20 is turned on, the light source 4 is turned off, and the mark on the upper surface of the IC package 2 is imaged by the camera 13.
  • LEDs, strobes, semiconductor lasers, etc. may be used as light sources 4 and 20.
  • the one that can switch on and off as fast as possible is adopted.
  • the light sources 4 and 20 that emit light at all times may be used, and the illumination may be alternately switched by opening and closing a shirt provided on the front surface of each of the light sources.
  • the light sources 4 and 20 may be shared by one light source, and the light of the one light source may be guided to the lower surface and the upper surface of the IC package by using different optical systems.
  • one of the light sources 4 or 20 that is always lit is used, and this one light source is turned on and off by opening and closing the shirt provided on the front, and the other light source 20 or 4 is turned on.
  • the lighting may be turned on and off by turning off the light.
  • the inspection performed by the imaging data of the force camera 13 disposed above the IC package is not limited to the inspection of the mark on the upper surface of the IC package. Whether the width of the lead is within the standard or not, it may be applied to the inspection of the lead width when the ICY is viewed from above.
  • FIG. 11 shows a fifth embodiment of the present invention.
  • the IC knockout 2 is placed on the stage 25 with the IC package 2 turned upside down, and the lower surface of the IC package is turned on.
  • the positional deviation between the terminals of the lead tips shown in FIG. 14 is to be inspected.
  • the light sources 30 (LEDs in this case) for illuminating the lower surface of the IC package are divided into three groups 30-a to 30-b.
  • the lighting conditions such as the installation height, mounting angle (lighting direction) and illuminance of the three light sources are made different, and these three groups of light sources 30-a to 30-1b are sequentially switched to light each group. Drive.
  • the light source of group 30-a is turned on first, the light sources of the other groups 30-b and 30-c are turned off, and then the light source of group 30-b is turned on and turned off.
  • the light sources of groups 30 — a and 30 — c are turned off, then the light sources of group 30 — c are turned on, and the light sources of the other groups 30 — a and 30 — b are turned off.
  • the switching drive such as repeating is performed.
  • the illumination conditions are variously changed depending on the light sources of a plurality of groups, so that the influence of the shape of the lead, scratches, etc. is suppressed, and the image is sharp. In order to obtain a suitable captured image.
  • FIG. 12 shows a modified example of the light source 30 of the embodiment of FIG. 11. In this case, a light source 35 constantly emitting light is used. Illumination switching control similar to that of the embodiment in FIG.
  • Fig. 13 also shows a modification of the light source 30 of the embodiment of Fig. 11.
  • one light source 40 for example, a fluorescent lamp
  • this light source light is Illumination switching control similar to that of the embodiment in FIG. 11 is performed by allowing the shutters 41 disposed at different positions and angles for each group to open and close so as to pass through the light blocking Z.
  • a part of the light sources 30-a to 30-c is always lit, and some of the light sources are provided by a shutter disposed on the front surface thereof.
  • the lighting may be turned on and off by opening and closing, and the lighting may be turned on and off by turning on and off the other light sources.
  • the present invention is applied to an IC package such as SOJ and PLCC having a J lead, but may be applied to a four-way terminal flat package (QFP).
  • IC package such as SOJ and PLCC having a J lead
  • QFP four-way terminal flat package
  • the emission color of part or all of the illumination may be changed to red, green, or the like.
  • illumination light is irradiated laterally from the center of the bottom surface of the IC package toward the lead terminals, and a shadow image of the lead terminals is captured by the irradiation light.
  • the height is set to be longer than the standoff of the lead terminal of the IC package so that light is emitted only from the leading end of the lead to the lead terminal at the center of the IC package. As a result, it is possible to prevent light from sneaking into the outside of the lead tip, and to obtain a clear image of the lead terminal. The accuracy of flatness measurement can be significantly improved.
  • the inspection of the lead terminals and the inspection of the mark on the upper surface of the IC package are performed at the same stage, so that the inspection of the lead terminals can be performed efficiently, and the space, cost and number of parts can be reduced. I can do it.
  • the lead is inspected by irradiating the back surface of the IC package with a plurality of lighting devices having different lighting conditions. Therefore, even if irregular reflection due to mold flaws or the like at the tip of the lead occurs. Clear imaging data can be obtained, and the measurement accuracy can be improved.

Abstract

An apparatus for inspecting leads of an IC package (2) by forming images of illuminated leads. Lighting devices (3 and 4) disposed at the center of the bottom surface of the IC package to illuminate the leads have a width corresponding to a center area of the bottom surface of the IC package, where the lead terminals (1) of the IC package (2) do not exist, a length greater than stand-off of the lead terminals (1) of the IC package (2) and a height such that light can be radiated to only the lead terminals closer to the center portion of the IC package from the distal end portions of the leads. Cameras (7 and 8) for imaging the leads (1) are disposed to measure highly precisely the flatness of the lead terminals.

Description

明 細 書  Specification
I cパッケージのリ一ド検査装置 技術分野 Ic package lead inspection equipment
この発明は I Cパッケージのリード端子を照明し、 その影像を撮像する事によ り、 リードの平坦度、 リードのピッチばらつき、 リード先端の曲がりによるショ The present invention illuminates the lead terminals of the IC package and captures an image of the lead terminals, thereby reducing the flatness of the leads, the lead pitch variation, and the bending of the lead tips.
—ト、 リード先端の端子間の位置ズレなどを検査する I Cパッケージのリード検 査装置に関する。 背景技術 The present invention relates to a lead inspection device for an IC package for inspecting misalignment between terminals of a lead tip. Background art
近年、 リード先端が J型に曲げられた S O J, P L C Cなどの I Cパッケージ が主流になりつつある。  In recent years, IC packages, such as SOJ and PLCC, whose lead ends are bent into a J-shape, are becoming mainstream.
このような I Cパッケージに関する検査の項目としては、  Inspection items for such IC packages include:
リードの平坦度 (図 1 4 (a))  Lead flatness (Fig. 14 (a))
(2)リ一ド接地部のピッチばらつき (図 1 4 (a)) (2) Pitch variation of lead grounding section (Fig. 14 (a))
3 リード先端の曲がりによるショート (図 1 4 (¾  3 Short due to bending of the lead tip (Fig. 14 (¾
リード先端の端子間の位置ズレ (図 1 4 W)  Misalignment between terminals at the end of the lead (Fig. 14 W)
パッケージ上面に刻印されたマークの文字欠け、 かすれ、 位置ズレなどの ' 検査  Inspection for missing, blurred, or misaligned marks on the mark on the top of the package
などがあり、 これら項目の検査には、 従来、 図 1 5に示すような検査装置を採用 するようにしていた。 Inspection of these items has traditionally employed an inspection device as shown in Fig. 15.
すなわち、 図 1 5の従来技術によれば、 1番目のステージ Aにおいて、 I Cパ ッケージの側方に配置した光源から光を照射し、 I Cパッケージの左側に並んで いるリ一ド端子の影像を光源と逆側に配置したカメラ Fで撮像し、 その撮像デ一 タに基づいて左側リードの平坦度、 ピッチばらつき、 曲がりによるショートを検 査する。  That is, according to the prior art shown in FIG. 15, in the first stage A, light is emitted from a light source arranged on the side of the IC package, and an image of the lead terminals arranged on the left side of the IC package is formed. An image is taken with the camera F arranged on the opposite side of the light source, and the flatness, pitch variation and short-circuit due to bending of the left lead are inspected based on the image data.
次に、 I Cパッケージを 2番目のステージ Bに移し、 このステージ Bで別の力 メラ Gを用いて右側のリード端子の影像を撮像し、 前記同様の検査を行う。 次に、 I Cパッケージを 3番目のステージ Cに移し、 このステージ Cで、 上方 に配置したカメラ Hを用いて I Cパッケージの上面を撮像し、 この撮像データに 基づいてパッケージ上面に刻印されたマークに、 文字欠け、 かすれ、 位置ズレな どがないかを検査する。 Next, the IC package is moved to the second stage B, and an image of the right lead terminal is captured using another force G on this stage B, and the same inspection as described above is performed. Next, the IC package is moved to the third stage C. At this stage C, the upper surface of the IC package is imaged using the camera H arranged above, and a mark is formed on the upper surface of the package based on the image data. Inspect for missing, blurred, or misaligned characters.
最後に、 I Cパッケージを 4番目のステージ Dに移し、 このステージ Dで表裏 反転した I Cパッケージを上方に配置したカメラ Iで撮像することにより、 I C パッケージの裏面の撮像デ一タを得る。 そして、 この撮像データに基づいて、 リ ―ド先端の端子間の位置ズレを検査する。  Finally, the IC package is moved to the fourth stage D, and the IC package turned upside down at this stage D is imaged by the camera I arranged above, thereby obtaining image data on the back surface of the IC package. Then, based on the image data, the positional deviation between the terminals at the leading end of the lead is inspected.
上記従来技術においては、 ステージ A、 Bにおける上記項目 (!ないし (3の検 査の際、 I Cパッケージをステージ上に載置した状態で、 リード端子の影像を撮 像するようにしているので、 そのステ一ジの影像とリ一ド端子の最下点の影像が 重なり、 平坦度を判定し難いという問題がある。 また、 この従来技術では、 例え ば、 左側のリ一ド端子の影像を得る場合、 光源からの光は右側のリ一ド端子を経 て左側のリード端子、 カメラ Fへの入射されるために、 右側のリード端子の影像 が左側のリード端子の影像に重なって、 平坦度、 ピッチばらつきなどを判定し難 いという問題もある。  In the above prior art, the image of the lead terminal is taken while the IC package is mounted on the stage during the inspection of the items (! To (3) in the stages A and B. There is a problem that the image of the stage and the image of the lowest point of the lead terminal overlap, which makes it difficult to determine the flatness. In this case, the light from the light source passes through the right lead terminal and enters the left lead terminal and the camera F, so that the image of the right lead terminal overlaps the image of the left lead terminal, and is flat. There is also a problem that it is difficult to determine the degree and pitch variation.
また、 上記従来技術によれば、 上記検査項目の内の (%>〜 )の検査を行うのに、 3ステージも必要であるために、 そのステージ移動などに時間がかかる、 大きな 検査スペースが必要である、 カメラ、 照明などの機材点数が多くなる等の問題が ある。  In addition, according to the above-described conventional technology, three stages are required to perform the inspection of (%> to) of the inspection items, so that it takes time to move the stages and a large inspection space is required. However, there are problems such as an increase in the number of equipment such as cameras and lighting.
さらに、 上記従来技術の最終ステージ Dにおいては、 所定の位置に固定配置し た光源を用いて I Cパッケージ裏面の撮像データを得るようにしていたので、 リ —ド表面に形成された成形キズ、 バリなどが乱反射の原因となって、 鮮明な撮像 データが得られず、 計測不能になることがあった。 すなわち、 リード端子は、 プ レス成形によって曲げ加ェされるが、 金型によるキズが金型毎に異なつた位置に 発生し、 ある金型によって曲げ加工されたリード端子は鮮明な画像が得られるが、 別の金型によって曲げ加工されたリード端子は、 乱反射によって計測可能な影像 が得られないというように、 ロッ ト (金型単位) によっては乱反射が大きくなつ て計測不能となることがあった この発明はこのような実情に鑑みてなされたもので、 リ一ド端子の平坦度を高 精度で計測することができる I Cパッケージのリード検查装置を提供することを 目的とする。 Further, in the final stage D of the prior art, since the imaging data of the back surface of the IC package is obtained using the light source fixedly arranged at a predetermined position, the molding scratches and burrs formed on the lead surface are obtained. Sometimes, irregular reflections were caused, and clear image data could not be obtained, making measurement impossible. In other words, lead terminals are bent by press molding, but scratches due to the die occur at different positions for each die, and clear images can be obtained for lead terminals bent by a certain die. However, a lead terminal bent by another mold may not be measurable due to a large amount of diffuse reflection depending on the lot (unit of mold), such that a measurable image cannot be obtained due to diffuse reflection. Was The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an IC package lead inspection device capable of measuring the flatness of a lead terminal with high accuracy.
またこの発明では、 効率のよいリード端子の検査をなし得、 省スペース、 省コ スト、 省部品点数をはかる I Cパッケージのリード検査装置を提供することを目 的とする。  It is another object of the present invention to provide an IC package lead inspection apparatus capable of performing efficient inspection of lead terminals and saving space, cost, and parts.
またこの発明では、 リード先端の金型キズによる乱反射が発生しても鮮明な撮 像データを得ることができる I Cパッケージのリード検査装置を提供することを 目的とする。 発明の開示  Another object of the present invention is to provide an IC package lead inspection apparatus capable of obtaining clear image data even if irregular reflection occurs due to a die flaw at the tip of the lead. Disclosure of the invention
この発明では、 I Cパッケージのリード端子を照明し、 その影像を撮像する事 により I Cパッケージのリード端子の異常を検査する I Cパッケージのリード検 査装置において、 I Cパッケージのリード端子が存在しない I Cパッケージ底面 の中央部領域に対応する幅を有し、 I Cパッケージのリード端子のスタンドオフ よりも長く リード先端部から I Cパッケージの中央部側のリード端子のみに光が 照射される高さを有する照明装置を I Cパッケージ底面の中央部に配設すると共 に、 この照明光による前記リード端子の影像を撮像する撮像手段を備えるように している。  According to the present invention, in an IC package lead inspection device that illuminates the lead terminals of an IC package and captures an image of the image to inspect the lead terminals of the IC package, the bottom surface of the IC package in which the lead terminals of the IC package do not exist is provided. The lighting device has a width corresponding to the central region of the IC package, and is longer than the standoff of the lead terminal of the IC package, and has a height from the tip of the lead to only irradiate the lead terminal on the central part side of the IC package. In addition to being provided at the center of the bottom surface of the IC package, an image pickup means for picking up an image of the lead terminal by the illumination light is provided.
すなわちかかる発明によれば、 光は I Cパッケージ底面の中央部からリード端 子に向けて横方向に照射し、 その照射光によるリード端子の影像を撮像する。 こ の際、 照明源の高さを I Cパッケージのリード端子のスタンドオフよりも長く リ 一ド先端部から I Cパッケージの中央部側のリード端子のみに光が照射される高 さに設定して、 リード先端 (最下部) の外側への光の回り込みが発生しないよう にしている。  That is, according to the invention, the light is radiated in the lateral direction from the center of the bottom surface of the IC package toward the lead terminal, and an image of the lead terminal is captured by the irradiated light. At this time, the height of the illumination source is set to a height that is longer than the stand-off of the lead terminals of the IC package and that the light is irradiated only from the tip of the lead to the lead terminal on the center side of the IC package. Light is prevented from sneaking out to the outside of the tip (bottom) of the lead.
またこの発明では、 I Cパッケージのリード端子を照明し、 その影像を撮像す る事により I Cパッケージのリ一ド端子の異常を検査する I Cパッケージのリ一 ド検査装置において、 I Cパッケージのリード端子が存在しない I Cパッケージ 底面の中央部領域に対応する幅を有し、 I Cパッケージのリード端子のスタンド オフよりも長く リード先端部から I Cパッケージの中央部側のリード端子のみに 光が照射される高さを有する透光性の I Cパッケージ支持部材を I Cパッケージ 底面に配設すると共に、 この I Cパッケージ支持部材に対し、 その側面に光を入 射する光源と、 前記 I Cパッケージ支持部材によって導光された前記光源光によ る前記リード端子の影像を撮像する撮像手段を備えるようにしている。 Further, according to the present invention, in a lead inspection device for an IC package which illuminates a lead terminal of the IC package and captures an image of the image to check for an abnormality of the lead terminal of the IC package, the lead terminal of the IC package has a lead terminal. Non-existent IC package Stands for lead terminals of IC package with width corresponding to central area on bottom surface A translucent IC package supporting member that is longer than off and has a height such that only the lead terminals on the center side of the IC package from the lead end are irradiated with light is provided on the bottom of the IC package. A light source for emitting light to the side surface of the member, and an image pickup means for picking up an image of the lead terminal by the light source light guided by the IC package support member are provided.
かかる発明によれば、 光は I Cパッケージ支持部材の側面から入射された後、 I Cパッケージ底面近傍からリード端子に向けて横方向に照射される。 そしてこ の照射光によるリード端子の影像を撮像する。 この際、 I Cパッケージ支持部材 の光が通過する露出している部分の I Cパッケージ底面からの高さが、 I cパッ ケージのリード端子のスタンドオフよりも長く リード先端部から I Cパッケージ の中央部側のリード端子のみに光が照射される高さに設定して、 リード先端 (最 下部) の外側への光の回り込みが発生しないようにしている。  According to this invention, the light is incident on the side surface of the IC package supporting member, and then is irradiated in the lateral direction from the vicinity of the bottom surface of the IC package toward the lead terminals. Then, an image of the lead terminal is captured by the irradiation light. At this time, the height of the exposed part of the IC package supporting member from which the light passes through from the bottom of the IC package is longer than the standoff of the lead terminal of the IC package. The height is set so that only the lead terminals of the lead are irradiated with light, so that light does not wrap around to the outside of the tip (bottom) of the lead.
またこの発明では、 I Cパッケージのリード端子および I Cパッケージの上面 を照明し、 リード端子の影像を撮像する事により I Cパッケージのリード端子の 異常を検査するとともに、 I Cパッケージ上面からの検査をする I Cパッケージ の検査装置において、  Further, according to the present invention, an IC package for inspecting an IC package lead terminal abnormality by illuminating a lead terminal of the IC package and an upper surface of the IC package and capturing an image of the lead terminal, and inspecting the IC package from the upper surface. In the inspection equipment of
I Cパッケージのリ一ド端子が存在しない I Cパッケージ底面の中央部領域に 対応する幅を有し、 I Cパッケージのリード端子のスタンドオフよりも長く リー ド先端部から I Cパッケージの中央部側のリード端子のみに光が照射される高さ を有する第 1の照明装置を I Cパッケージ底面の中央部に配設すると共に、 前記 I Cパッケージの上面を照明する第 2の照明装置を I Cパッケージの上方に配設 し、  The lead terminal of the IC package has a width corresponding to the central area on the bottom of the IC package where the lead terminal of the IC package does not exist, and is longer than the stand-off of the lead terminal of the IC package. A first lighting device having a height at which only the light is irradiated is provided at the center of the bottom surface of the IC package, and a second lighting device for illuminating the upper surface of the IC package is provided above the IC package. And
I Cパッケージの両側方にそれぞれ配設された 2つのミラー手段と、 I Cパッ ケージの上方に配設され、 前記ミラー手段によって導光された第 1の照明装置の 光によるリード端子像を撮像するとともに、 前記第 2の照明装置によって照明さ れた I Cパッケージの上面を撮像する 1台の撮像手段と、 前記第 1の照明装置の 前記リード端子に対する照明と前記第 2の照明装置の前記前記 I Cパッケージの 上面に対する照明とを時間的に交互に切換え制御する制御手段とを具え、 1つの ステージでリ一ド端子の検査及び I Cパッケージ上面からの検査を実行するよう にしている。 Two mirror means respectively provided on both sides of the IC package; anda lead terminal image formed by light of the first lighting device provided above the IC package and guided by the mirror means. One imaging means for imaging an upper surface of the IC package illuminated by the second illumination device; illumination of the first illumination device for the lead terminal; and the IC package of the second illumination device. Control means for alternately and temporally switching and controlling the illumination of the upper surface of the IC, so that the inspection of the lead terminals and the inspection from the upper surface of the IC package are performed in one stage. I have to.
かかる発明によれば、 リード端子の検査と I Cパッケージの上面からのマーク などの検査を同一ステージで実行するとともに、 その際の撮像カメラも共用する ようにしている。  According to this invention, the inspection of the lead terminal and the inspection of the mark from the upper surface of the IC package are performed on the same stage, and the imaging camera at that time is also shared.
又この発明によれば、 I Cパッケージをその裏面が上になるようにステージ上 に載置し、 この I Cパッケージの裏面を I Cパッケージの上方に配設した照明装 置により照明し、 該照明した I Cパッケージの裏面を撮像することにより I Cパ ッケージのリードの異常を検査する I Cパッケージのリード検査装置において、 前記 I Cパッケージに対する照明条件が異なる複数の照明装置を I Cパッケ一 ジの上方に配設すると共に、  According to the invention, the IC package is placed on the stage so that the back surface thereof faces upward, and the back surface of the IC package is illuminated by the lighting device disposed above the IC package. In a lead inspection device for an IC package, which inspects the lead of the IC package by imaging the back surface of the package, a plurality of lighting devices having different lighting conditions for the IC package are arranged above the IC package. ,
これら複数の照明装置の前記 I Cパッケージに対する照明を時間的に順次切り 換え制御する制御手段を具えるようにしている。  Control means for sequentially and temporally switching and controlling the illumination of the plurality of illumination devices with respect to the IC package is provided.
かかる発明によれば、 複数の照明装置を I Cパッケージに対する照明条件 (照 明方向、 I Cパッケージまでの距離、 照度など) が異なるように設置し、 これら 複数の照明装置を切替え駆動することにより、 リードの形状、 キズなどの影饗を 抑えて鮮明な撮像画像を得るようにしている。 図面の簡単な説明  According to this invention, a plurality of lighting devices are installed so as to have different lighting conditions (illumination direction, distance to the IC package, illuminance, and the like) with respect to the IC package, and the plurality of lighting devices are switched and driven to provide a lead. The shape and scratches are suppressed to obtain a clear image. BRIEF DESCRIPTION OF THE FIGURES
図 1は、 この発明の第 1の実施例を概念的に示す正面図。  FIG. 1 is a front view conceptually showing a first embodiment of the present invention.
図 2は、 図 1の実施例の平面図。  FIG. 2 is a plan view of the embodiment of FIG.
図 3は、 図 1の実施例によって撮像された影像画像を示す図。  FIG. 3 is a view showing a shadow image captured by the embodiment of FIG.
図 4は、 図 1の実施令において I Cパッケージのリード端子近傍の拡大図。 図 5は、 L s+ aに関する制限を説明するための図。  FIG. 4 is an enlarged view of the vicinity of the lead terminal of the IC package in the execution order of FIG. FIG. 5 is a diagram for explaining restrictions on L s + a.
図 6は、 この発明の第 2の実施例を示す図。  FIG. 6 is a diagram showing a second embodiment of the present invention.
図 7は、 図 6の実施例の各種変形例を示す図。  FIG. 7 is a diagram showing various modifications of the embodiment of FIG.
図 8は、 この発明の第 3の実施例を示す図。  FIG. 8 is a diagram showing a third embodiment of the present invention.
図 9は、 図 8の実施例の各種変形例を示す図。  FIG. 9 is a diagram showing various modifications of the embodiment in FIG.
図 1 0は、 この発明の第 4の実施例を示す図。  FIG. 10 is a diagram showing a fourth embodiment of the present invention.
図 1 1は、 この発明の第 5の実施例を示す図。 図 1 2は、 図 1 1に示す第 5の実施例の変形例を示す図。 FIG. 11 is a diagram showing a fifth embodiment of the present invention. FIG. 12 is a diagram showing a modification of the fifth embodiment shown in FIG.
図 1 3は、 図 1 1に示す第 5の実施例の変形例を示す図。  FIG. 13 is a diagram showing a modification of the fifth embodiment shown in FIG.
図 1 4は、 I Cパッケージのリード端子の各種検査項目を示す図。  Figure 14 is a diagram showing various inspection items of the lead terminals of the IC package.
図 1 5は、 従来技術を示す図。 発明を実施するための最良の形態  Figure 15 shows the prior art. BEST MODE FOR CARRYING OUT THE INVENTION
以下この発明の実施例を添付図面に従って詳細に説明する。  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
図 1は、 この発明の第 1の実施例を概念的に示すもので、 この実施例はリード 端子の平坦度検査、 リードのピッチおよびショート検査を行うための構成である。 図 1において、 J リード端子 1を有する I Cパッケージ (S O J , P L C C ) 2は、 図 2の平面図にも示すように、 白色のアク リルなどの材料からなる光散乱 性を有する透光性の支持部材 3の上に載置されている。 この場合、 光源 4は、 I Cパッケージ 2の下方に配置されており、 光拡散板 5、 支持部材 3を介して I C パッケージに対し、 下方から光を入射する。 支持部材 3の側方に配設された遮光 マスク体 6は、 光源 4からの光が直接カメラ 7、 8に入射されないように配設さ れている。 I Cパッケージ 2の左右には、 リード端子 1の影像を撮像するための カメラ 7、 8が設けられており、 各カメラ 7, 8によって左側リード端子および 右側リ一ド端子の影像を各別に撮像する。  FIG. 1 conceptually shows a first embodiment of the present invention. This embodiment is a configuration for performing a flatness inspection of a lead terminal, a lead pitch and a short-circuit inspection. In FIG. 1, an IC package (SOJ, PLCC) 2 having a J-lead terminal 1 is a light-transmitting support made of a material such as white acrylic as shown in the plan view of FIG. It is placed on the member 3. In this case, the light source 4 is disposed below the IC package 2, and the light enters the IC package via the light diffusion plate 5 and the support member 3 from below. The light-shielding mask 6 disposed on the side of the support member 3 is disposed so that light from the light source 4 does not directly enter the cameras 7 and 8. Cameras 7 and 8 for capturing the image of the lead terminal 1 are provided on the left and right of the IC package 2, and the cameras 7 and 8 capture the images of the left lead terminal and the right lead terminal separately. .
すなわち、 この図 1の構成によれば、 I Cパッケージ 2に対し下から光を導光 し、 支持部材 3の上部から出て、 リード端子 1を経てカメラ 7 , 8に至る光を各 カメラ 7 , 8で撮像するようにしており、 その撮像画像は図 3に示すようになる。 図 3において、 ハッチングを施した部分が影に対応しており、 符号 9で示す部分 が I Cパッケージ 2のボディに対応し、 符号 1 0で示す部分がリ一ド端子に対応 し、 符号 1 1で示す部分が遮光マスク体 6に対応する  That is, according to the configuration of FIG. 1, the light is guided from below to the IC package 2, and the light that exits from the upper part of the support member 3 and reaches the cameras 7 and 8 through the lead terminals 1 is transmitted to each of the cameras 7 and 8. The image is taken at step 8, and the taken image is as shown in FIG. In FIG. 3, the hatched portion corresponds to the shadow, the portion indicated by reference numeral 9 corresponds to the body of the IC package 2, the portion indicated by reference numeral 10 corresponds to the lead terminal, and the reference numeral 11 The portion indicated by corresponds to the light-shielding mask body 6.
ここで、 図 4に示すように、 I Cパッケージ 2の下面からリード先端 (最下部) までの距離はスタンドオフ Lsと称されるが、 このスタンドオフ Lsにリ一ド先端 Here, as shown in FIG. 4, the distance from the lower surface of the IC package 2 to the tip of the lead (lowest part) is called a standoff Ls.
(最下部) から遮光マスク体 6の上面までの距離 αを加えた距離 (Ls+ α ) は、 リード先端 (最下部) およびリード先端より外側のリード部分まで光が回り込ま ない程度の高さ、 別言すればスタンドオフよりも長く リード先端部から I Cノ ッ ケージの中央部側のリード端子のみに光が照射される高さに設定することにより、 リード先端 (最下部) の影像が鮮明に撮像されるようにする。 The distance (Ls + α), which is obtained by adding the distance α from the (bottom) to the upper surface of the light-shielding mask body 6, is a height such that light does not enter the lead tip (bottom) and the lead portion outside the lead tip. In other words, it is longer than the standoff. By setting the height at which light is irradiated only to the lead terminal on the center side of the cage, the image of the tip of the lead (bottom) is clearly captured.
因みに、 図 5に示すように、 αが大きすぎると、 リード先端 (最下部) および リ一ド先端より外側のリ一ド部分まで光が回り込み、 リ一ド先端 (最下部) を鮮 明な影として撮像できなくなり、 スタンドオフ L sを精度良く決めることができ ず、 また平坦度検査も精度が出なくなる。  By the way, as shown in Fig. 5, if α is too large, light wraps around the lead tip (lowest part) and the lead part outside the lead tip, and the lead tip (lowest part) is sharp. The image cannot be captured as a shadow, and the standoff Ls cannot be determined with high accuracy. In addition, the accuracy of the flatness inspection cannot be improved.
次に、 光源 4から光を導光する支持部材 3の X方向 (図 2参照) の長さ Laに 関しても、 I Cパッケージ 2のリード端子の先端まで光が回り込まない程度の長 さに抑える (大きく し過ぎない) ことも必要である。  Next, the length La of the support member 3 that guides light from the light source 4 in the X direction (see FIG. 2) is also limited to a length that does not allow light to reach the tip of the lead terminal of the IC package 2. (Not too big).
図 6はこの発明の第 2の実施例を示すもので、 この実施例では、 支持部材 3の 上部から出た光をプリズムミラ一 1 2によって反射して、 その反射光を I Cパッ ケージ 2の上部に配置した 1台のカメラ 1 3によって撮像するようにしており、 左右のリード端子の影像を 1台のカメラ 1 3で同時に撮像する。 なお、 この実施 例において、 遮光マスク体 6の上面は、 光の反射が起こらないように黒くするな どの処置を施すようにする。  FIG. 6 shows a second embodiment of the present invention. In this embodiment, light emitted from the upper part of the support member 3 is reflected by the prism mirror 12 and the reflected light is reflected on the IC package 2. One camera 13 arranged at the top is used to capture images, and the images of the left and right lead terminals are captured simultaneously by one camera 13. In this embodiment, measures such as blackening the upper surface of the light-shielding mask body 6 so as not to reflect light are performed.
また、 図 6の実施例においては、 比較的高さの高い支持部材 3を用い、 (Ls + a ) の距離調整を遮光マスク体 6の上部に付した遮光部材 1 4によって行うよ うにしている。  In the embodiment shown in FIG. 6, the support member 3 having a relatively high height is used, and the distance adjustment of (Ls + a) is performed by the light shielding member 14 attached to the upper part of the light shielding mask body 6. I have.
このような遮光部 1 4を構成する手法としては、 図 7 に示すように一体成 形した遮光マスク体 6を作成する手法、 図 7 (¾)に示すように上記段差部材 1 4 を遮光マスク体 6とは別に形成し、 後で取り付ける手法、 図 7 に示すように 支持部材 3の下部に遮光性の塗料を塗布する手法、 図 7 めに示すように支持部 材 3の下部を遮光性に変質させる手法などがある。  As a method of forming such a light shielding portion 14, there is a method of forming an integrally formed light shielding mask body 6 as shown in FIG. 7, and as shown in FIG. Forming separately from the body 6 and attaching it later, applying a light-blocking paint to the lower part of the support member 3 as shown in Fig. 7, and shading the lower part of the support member 3 as shown in Fig. 7 There is a method to change the quality.
図 8はこの発明の第 3の実施例を示すもので、 この実施例も先の第 1及び第 2 の実施例同様、 リ一ド端子の平坦度検査、 リードのピッチおよびショート検查を 行うための構成である。  FIG. 8 shows a third embodiment of the present invention. In this embodiment, as in the first and second embodiments, flatness inspection of a lead terminal, lead pitch and short-circuit inspection are performed. It is a configuration for.
図 8において、 faは平面図であり、 は図 8 bを矢印 M方向からみた側面図 である。  In FIG. 8, fa is a plan view, and FIG. 8B is a side view of FIG.
図 8の実施例においては、 光源 4を I Cパッケージの下に置くのではなく、 I Cパッケージの側面に配設しており、 光散乱性を有する半透明の支持部材 3を介 して I Cパッケージの下に側方から光を入射する。 光源 4と I Cパッケージ 2の 間には、 支持部材 3が挿入される遮光体 1 7が配設されており、 この遮光体 1 7 によって支持部材 3のみを介して光を側方から I Cパッケージ 2の下に導光する。 I Cパッケージ 2の下に導光された光は、 左右の側面に設けられたカメラ 1 5, 1 6に入射され、 これによつてリード端子 1の影像が撮像される。 ここで、 支持 部材 3の下方には、 例えば図 9 (¾)に示すように、 (Ls+ α ) をリード先端 (最 下部) およびリード先端より外側のリード部分まで光が回り込まない程度の高さ、 別言すればリード先端部から I Cパッケージの中央部側のリード端子のみに光が 照射される高さに規制するための遮光マスク体 1 8を設けている。 図 9 <¾)の場 合は、 支持部材 3を遮光マスク体 1 8に埋設するようにしている。 In the embodiment of FIG. 8, instead of placing light source 4 under the IC package, Light is incident from the side below the IC package via the translucent support member 3 which is disposed on the side surface of the C package and has light scattering properties. A light shield 17 into which the support member 3 is inserted is provided between the light source 4 and the IC package 2. The light shield 17 allows light from the side only to pass through the IC package 2 through the support member 3 alone. Guide light below. The light guided under the IC package 2 is incident on cameras 15 and 16 provided on the left and right side surfaces, whereby an image of the lead terminal 1 is captured. Here, below the support member 3, for example, as shown in FIG. 9 (¾), (Ls + α) is set to a height such that light does not enter the lead tip (lowest part) and the lead part outside the lead tip. In other words, a light-shielding mask body 18 is provided to regulate the height at which light is irradiated only from the lead end to the lead terminal on the central part side of the IC package. In the case of FIG. 9 <¾), the support member 3 is embedded in the light shielding mask 18.
なお、 遮光マスク体 1 8としては、 他にも、 図 9 に示すような凹形状の遮 光部材を支持部材 3にかぶせるようにしたもの、 図 9 に示すように支持部材 3の下部に遮光性の塗料を塗布する手法、 図 9 に示すように支持部材 3の下 部を遮光性に変質させる手法などがある。  In addition, as the light shielding mask body 18, a light shielding member having a concave shape as shown in FIG. 9 is placed over the support member 3, and a light shielding mask is provided below the support member 3 as shown in FIG. There is a method of applying a conductive paint, and a method of transforming the lower part of the support member 3 into a light-shielding property as shown in FIG.
なお、 この図 8、 図 9の実施例において、 先の図 6の実施例のように、 1台の カメラを I Cパッケージの上方に截置し、 この 1台のカメラに対し、 図 8のカメ ラ 1 5、 1 6の位置にそれぞれ配設した 2つのミラーによって、 左右リード端子 の影像を導光するようにしてもよい。  In the embodiment shown in FIGS. 8 and 9, one camera is cut above the IC package as in the embodiment shown in FIG. 6, and the camera shown in FIG. The images of the left and right lead terminals may be guided by two mirrors provided at the positions of the lines 15 and 16, respectively.
図 1 0はこの発明の第 4の実施例を示すもので、 この実施例は、 先の図 6に示 した実施例構成に、 I Cパッケージ 2の上面を照明するための光源 2 0を追加し たものであり、 リード端子の平坦度検査、 リードのピッチおよびショート検査の 他に、 I Cパッケージ 2の上面のマークの検査を同一のステージで実行するよう にしている。  FIG. 10 shows a fourth embodiment of the present invention. In this embodiment, a light source 20 for illuminating the upper surface of the IC package 2 is added to the configuration of the embodiment shown in FIG. In addition to the inspection of the flatness of the lead terminals, the inspection of the lead pitch and the short-circuit, the inspection of the mark on the upper surface of the IC package 2 is performed on the same stage.
すなわち、 リード端子の平坦度検査、 リードのピッチおよびショート検査を行 う場合には、 光源 4を点灯して光源 2 0を消灯してリード端子の影像をカメラ 1 3で撮像し、 マークの検査を行う場合には、 光源 2 0を点灯して光源 4を消灯し て I Cパッケージ 2の上面のマークをカメラ 1 3で撮像する。  In other words, when performing the flatness inspection of the lead terminals, the lead pitch and the short-circuit inspection, the light source 4 is turned on, the light source 20 is turned off, the image of the lead terminal is captured by the camera 13, and the mark inspection is performed. When performing the above, the light source 20 is turned on, the light source 4 is turned off, and the mark on the upper surface of the IC package 2 is imaged by the camera 13.
光源 4および 2 0としては、 L E D、 ストロボ、 半導体レーザ等を採用するこ とができ、 点灯及び消灯の切替えをできるだけ高速に行えるものを採用する。 なお、 光源 4および 2 0として、 常時発光しているものを用い、 これら各光源 の前面に配設したシャツタの開閉によって照明の交互切替えを行うようにしても よい。 さらに、 光源 4および 2 0を 1つの光源で共用し、 該 1つの光源の光を各 別の光学系を用いて、 I Cパッケージの下面および上面に導くようにしても良い。 さらに、 一方の光源 4または 2 0に常時点灯しているものを用い、 この一方の光 源はその前面に配設したシャツタの開閉によって照明のオンオフを行い、 他方の 光源 2 0または 4を点灯及び消灯により照明のオンオフを行うようにしてもよい。 また、 この図 1 0に示した実施例において、 I Cパッケージの上方に配した力 メラ 1 3の撮像データによって行う検査は、 I Cパッケージ上面のマークの検査 に限るわけではなく、 他にも、 I Cリードの横幅が規格内に入っているか否か、 i c y—ドを上からみたときのリード幅検査などに適用するするようにしてもよ レ、。 LEDs, strobes, semiconductor lasers, etc. may be used as light sources 4 and 20. The one that can switch on and off as fast as possible is adopted. The light sources 4 and 20 that emit light at all times may be used, and the illumination may be alternately switched by opening and closing a shirt provided on the front surface of each of the light sources. Further, the light sources 4 and 20 may be shared by one light source, and the light of the one light source may be guided to the lower surface and the upper surface of the IC package by using different optical systems. In addition, one of the light sources 4 or 20 that is always lit is used, and this one light source is turned on and off by opening and closing the shirt provided on the front, and the other light source 20 or 4 is turned on. Alternatively, the lighting may be turned on and off by turning off the light. In the embodiment shown in FIG. 10, the inspection performed by the imaging data of the force camera 13 disposed above the IC package is not limited to the inspection of the mark on the upper surface of the IC package. Whether the width of the lead is within the standard or not, it may be applied to the inspection of the lead width when the ICY is viewed from above.
図 1 1は、 この発明の第 5の実施例を示すもので、 この実施例は、 I Cノ ッケ —ジ 2を表裏反転した状態でステージ 2 5上に载置し、 I Cパッケージの下面を カメラ 2 6で撮像する事により、 先の図 1 4 に示したリード先端の端子間の 位置ズレを検査しようとするものである。  FIG. 11 shows a fifth embodiment of the present invention. In this embodiment, the IC knockout 2 is placed on the stage 25 with the IC package 2 turned upside down, and the lower surface of the IC package is turned on. By imaging with the camera 26, the positional deviation between the terminals of the lead tips shown in FIG. 14 is to be inspected.
この実施例において、 I Cパッケージの下面を照明するための光源 3 0 (この 場合は L E D ) は、 3つのグループ 3 0— a〜3 0— bに分けられており、 各グ ループ間で、 光源の配設高さ、 取り付け角度 (照明方向) および照度などの照明 条件を異ならせるようにしており、 これら 3つのグループの光源 3 0— a〜3 0 一 bを順次切替えて各グループ毎に点灯駆動する。  In this embodiment, the light sources 30 (LEDs in this case) for illuminating the lower surface of the IC package are divided into three groups 30-a to 30-b. The lighting conditions such as the installation height, mounting angle (lighting direction) and illuminance of the three light sources are made different, and these three groups of light sources 30-a to 30-1b are sequentially switched to light each group. Drive.
すなわち、 まずグループ 3 0— aの光源を点灯してそれ以外のグループ 3 0 - b, 3 0— cの光源は消灯し、 次に、 グループ 3 0— bの光源を点灯してそれ以 外のグループ 3 0— a, 3 0— cの光源は消灯し、 次にグループ 3 0— cの光源 を点灯してそれ以外のグループ 3 0 _ a, 3 0—bの光源は消灯し、 これを繰り 返すといった切替え駆動を実行する。  That is, the light source of group 30-a is turned on first, the light sources of the other groups 30-b and 30-c are turned off, and then the light source of group 30-b is turned on and turned off. The light sources of groups 30 — a and 30 — c are turned off, then the light sources of group 30 — c are turned on, and the light sources of the other groups 30 — a and 30 — b are turned off. The switching drive such as repeating is performed.
このように、 この図 1の実施例においては、 複数グループの光源によって照明 条件を様々に変えることによって、 リードの形状、 キズなどの影響を抑えて鮮明 な撮像画像を得るようにしている。 Thus, in the embodiment of FIG. 1, the illumination conditions are variously changed depending on the light sources of a plurality of groups, so that the influence of the shape of the lead, scratches, etc. is suppressed, and the image is sharp. In order to obtain a suitable captured image.
なお、 光源 3 0としては、 L E D、 ス トロボ、 半導体レーザ等を採用すること ができ、 点灯及び消灯の切替えをできるだけ高速に行えるものを採用する。 図 1 2は、 図 1 1の実施例の光源 3 0の変形例を示すもので、 この場合は常時 発光している光源 3 5を用い、 これらの光源光を各光源別に設けたシャツタ 3 6 の開閉駆動によって遮光 Z通過させることによって、 図 1 1の実施例と同様の照 明切替え制御を行うようにしている。  As the light source 30, an LED, a strobe, a semiconductor laser, or the like can be used, and a light source that can switch on and off as quickly as possible is used. FIG. 12 shows a modified example of the light source 30 of the embodiment of FIG. 11. In this case, a light source 35 constantly emitting light is used. Illumination switching control similar to that of the embodiment in FIG.
図 1 3も、 図 1 1の実施例の光源 3 0の変形例を示すもので、 この場合は、 左 右にそれぞれ 1つの光源 4 0 (例えば蛍光灯) を配置し、 この光源光を各グルー プ別に異なる位置、 角度に配設したシャツタ 4 1の開閉駆動によって遮光 Z通過 させることによって、 図 1 1の実施例と同様の照明切替え制御を行うようにして いる。  Fig. 13 also shows a modification of the light source 30 of the embodiment of Fig. 11. In this case, one light source 40 (for example, a fluorescent lamp) is arranged on each of the left and right sides, and this light source light is Illumination switching control similar to that of the embodiment in FIG. 11 is performed by allowing the shutters 41 disposed at different positions and angles for each group to open and close so as to pass through the light blocking Z.
さらに、 図 1 1に示す実施例において、 光源 3 0— a〜3 0— cの一部には、 常時点灯しているものを用い、 この一部の光源はその前面に配設したシャッタの 開閉によって照明のオンオフを行い、 他の光源は点灯及び消灯により照明のオン オフを行うようにしてもよい。  Further, in the embodiment shown in FIG. 11, a part of the light sources 30-a to 30-c is always lit, and some of the light sources are provided by a shutter disposed on the front surface thereof. The lighting may be turned on and off by opening and closing, and the lighting may be turned on and off by turning on and off the other light sources.
ところで、 上記実施例では、 本発明を J リードを有する S O J , P L C Cなど の I Cパッケージに適用するようにしたが、 4方向端子フラッ トパッケージ (Q F P ) に適用するようにしてもよい。  By the way, in the above embodiment, the present invention is applied to an IC package such as SOJ and PLCC having a J lead, but may be applied to a four-way terminal flat package (QFP).
また、 上記各実施例において、 照明の一部または全ての発光色を、 赤、 緑など に変えてもよい。 産業上の利用可能性  Further, in each of the above embodiments, the emission color of part or all of the illumination may be changed to red, green, or the like. Industrial applicability
以上説明したようにこの発明によれば、 照明光を I Cパッケージ底面の中央部 からリード端子に向けて横方向に照射し、 その照射光によるリード端子の影像を 撮像し、 その際の照明源の高さを I Cパッケージのリ一ド端子のスタンドオフよ りも長く リ一ド先端部から I Cパッケージの中央部側のリ一ド端子のみに光が照 射される高さに設定するようにしたので、 リード先端の外側への光の回り込みが 発生しないようになり、 鮮明なリード端子の影像を得ることができ、 スタンドォ フ、 平坦度の計測精度を格段に向上させることができる。 As described above, according to the present invention, illumination light is irradiated laterally from the center of the bottom surface of the IC package toward the lead terminals, and a shadow image of the lead terminals is captured by the irradiation light. The height is set to be longer than the standoff of the lead terminal of the IC package so that light is emitted only from the leading end of the lead to the lead terminal at the center of the IC package. As a result, it is possible to prevent light from sneaking into the outside of the lead tip, and to obtain a clear image of the lead terminal. The accuracy of flatness measurement can be significantly improved.
またこの発明では、 リード端子の検査と I Cパッケージ上面のマークの検査を 同一ステージで実行させるようにしたので、 効率のよいリード端子の検査をなし 得、 省スペース、 省コス ト、 省部品点数が図れる。  In addition, according to the present invention, the inspection of the lead terminals and the inspection of the mark on the upper surface of the IC package are performed at the same stage, so that the inspection of the lead terminals can be performed efficiently, and the space, cost and number of parts can be reduced. I can do it.
またこの発明では、 照明条件の異なる複数の照明装置によって I Cパッケージ の裏面を照射してリードの検査を行うようにしたので、 リ一ド先端の金型キズゃ バリなどによる乱反射が発生しても鮮明な撮像データを得ることができ、 その計 測精度を向上させることができる。  Further, in the present invention, the lead is inspected by irradiating the back surface of the IC package with a plurality of lighting devices having different lighting conditions. Therefore, even if irregular reflection due to mold flaws or the like at the tip of the lead occurs. Clear imaging data can be obtained, and the measurement accuracy can be improved.

Claims

請求の範囲 The scope of the claims
1 . I Cパッケージのリード端子を照明し、 その影像を撮像する事により I Cパ ッケージのリード端子の異常を検査する I Cパッケージのリード検査装置におい て、 1. In the lead inspection device of the IC package, which illuminates the lead terminals of the IC package and captures an image of the image to inspect the lead terminals of the IC package for abnormalities,
I Cパッケージのリ一ド端子が存在しない I cパッケージ底面の中央部領域に 対応する幅を有し、 I Cパッケージのリード端子のスタンドオフよりも長く リー ド先端部から I Cパッケージの中央部側のリード端子のみに光が照射される高さ を有する照明装置を I Cパッケージ底面の中央部に配設すると共に、  IC package lead terminals do not exist Ic The width corresponding to the central area on the bottom of the package, longer than the standoff of the lead terminals of the IC package Lead from the lead end to the central part of the IC package A lighting device with a height that irradiates light only to the terminals is installed at the center of the bottom of the IC package,
この照明光による前記リ一ド端子の影像を撮像する撮像手段を備えるようにし たことを特徴とする I Cパッケージのリード検査装置。  A lead inspection device for an IC package, comprising: an imaging unit that captures a shadow image of the lead terminal by the illumination light.
2 . 前記照明装置は、 I Cパッケージの下方に配設された光'源と、 2. The lighting device includes: a light source disposed below the IC package;
前記 I Cパッケージ底面の中央部領域に対応する蝠を有し、 前記光源の光を I Cパッケージの底面付近まで導光しかつ前記 I Cパッケージを支持する透光性の I Cパッケージ支持部材と、  A translucent IC package supporting member having a ton corresponding to a central area of the bottom surface of the IC package, guiding the light of the light source to near the bottom surface of the IC package, and supporting the IC package;
前記 I Cパッケージ支持部材の底面のみから前記光源の光を I Cパッケージ底 面付近に導光するよう前記 I Cパッケージ支持部材の底面より外側の領域を遮光 する第 1の遮光手段と、  First light blocking means for blocking an area outside the bottom surface of the IC package supporting member so as to guide the light of the light source to the vicinity of the bottom surface of the IC package only from the bottom surface of the IC package supporting member;
前記 I Cパッケージ支持部材の露出している部分の I Cパッケージ底面からの 高さが、 I Cパッケージのリード端子のスタンドオフよりも長く リード先端部か ら I Cパッケージの中央部側のリード端子のみに光が照射される高さになるよう I Cパッケージ支持部材の少なくともリード端子に対向している面を遮光する第 2の遮光手段と、  The height of the exposed portion of the IC package supporting member from the bottom surface of the IC package is longer than the stand-off of the lead terminal of the IC package. Light is applied only from the lead end to the lead terminal at the center of the IC package. Second light blocking means for blocking at least the surface of the IC package support member facing the lead terminals so as to reach the irradiation height;
を有する請求の範囲 1記載の I Cパッケージのリード検査装置。  2. The lead inspection device for an IC package according to claim 1, comprising:
3 . 前記第 1の遮光手段と第 2の遮光手段とを一体的に構成したことを特徴とす る請求の範囲 2記載の I Cパッケージのリード検査装置。 3. The lead inspection device for an IC package according to claim 2, wherein the first light-shielding means and the second light-shielding means are integrally formed.
4 . 前記撮像手段は、 I Cパッケージの両側方にそれぞれ配設された 2台のカメ ラである請求の範囲 1から請求の範囲 3のいずれかに記載の I Cパッケージのリ ―ド検査装置。 4. The lead inspection device for an IC package according to any one of claims 1 to 3, wherein the imaging means is two cameras arranged on both sides of the IC package.
5 . 前記撮像手段は、 I Cパッケージの両側方にそれぞれ配設された 2つのミラ 一手段と、 5. The imaging means includes two mirrors provided on both sides of the IC package, respectively.
これらミラ一手段によって導光されたリ一ド端子像を撮像する、 I Cパッケ一 ジの上方に配設された 1台のカメラ手段と、  One camera means disposed above the IC package for capturing a lead terminal image guided by these mirror means;
を有する請求の範囲 1から請求の範囲 3のいずれかに記載の I Cパッケージの リ一ド検査装置。  The lead inspection device for an IC package according to any one of claims 1 to 3, further comprising:
6 . I Cパッケージのリード端子を照明し、 その影像を撮像する事により I Cパ ッケージのリード端子の異常を検査する I Cパッケージのリード検査装置におい て、 6. In the lead inspection device of the IC package, which illuminates the lead terminals of the IC package and captures an image of the image to inspect the lead terminals of the IC package for abnormalities,
I Cパッケージのリード端子が存在しない I Cパッケージ底面の中央部領域に 対応する幅を有し、 I Cパッケージのリード端子のスタンドオフよりも長く リ一 ド先端部から I Cパッケージの中央部側のリード端子のみに光が照射される高さ を有する透光性の I Cパッケージ支持部材を I Cパッケージ底面に配設すると共 に、  There is no lead terminal of the IC package.It has a width corresponding to the central area on the bottom of the IC package.It is longer than the stand-off of the lead terminal of the IC package. Only the lead terminal at the center of the IC package from the leading end of the lead. A light-transmitting IC package supporting member having a height at which light is applied to the
この I Cパッケージ支持部材に対し、 その側面に光を入射する光源と、 前記 I Cパッケージ支持部材によって導光された前記光源光による前記リード 端子の影像を撮像する撮像手段を備えるようにしたことを特徴とする I Cパッケ ージのリード検査装置。  The IC package supporting member is provided with a light source for emitting light to a side surface thereof, and an imaging unit for capturing an image of the lead terminal by the light source light guided by the IC package supporting member. Lead inspection equipment for IC packages.
7 . 前記 I Cパッケージ支持部材の側面のみから前記光源の光を I Cパッケージ 底面付近に導光するよう前記 I Cパッケージ支持部材の側面以外の領域を遮光す る第 1の遮光手段を更に具える請求の範囲 6記載の I Cパッケージのリード検査 装置。 7. The apparatus further comprises a first light-shielding means for shielding an area other than the side surface of the IC package supporting member so as to guide the light of the light source to the vicinity of the bottom surface of the IC package only from the side surface of the IC package supporting member. Range 6 lead inspection equipment for IC packages.
8 . 前記 I Cパッケージ支持部材は、 該 I Cパッケージ支持部材の露出している 部分の I Cパッケージ底面からの高さが、 I Cパッケージのリード端子のスタン ドオフよりも長く リード先端部から I Cパッケージの中央部側のリード端子のみ に光が照射される高さになるよう I Cパッケージ支持部材の少なく ともリード端 子に対向している面を遮光する第 2の遮光手段を更に具える請求の範囲 6または 請求の範囲 7記載の I Cパッケージのリ一ド検査装置。 8. The height of the exposed portion of the IC package supporting member from the bottom surface of the IC package is longer than the stand-off of the lead terminal of the IC package. Claim 6 or Claim 7 further comprising a second light shielding means for shielding at least a surface of the IC package supporting member facing the lead terminal so that only the lead terminal on the side is irradiated with light. The lead inspection device for IC packages described in 7.
9 . 前記撮像手段は、 I Cパッケージの両側方にそれぞれ配設された 2つのミラ 一手段と、 9. The imaging means includes two mirrors provided on both sides of the IC package,
これらミラ一手段によって導光されたリード端子像を撮像する、 I Cパッケ一 ジの上方に配設された 1台のカメラ手段と、  One camera means disposed above the IC package for capturing a lead terminal image guided by these mirror means;
を有する請求の範囲 6から請求の範囲 8のいずれかに記載の I Cパッケージの リ一ド検査装置。  The lead inspection device for an IC package according to any one of claims 6 to 8, comprising:
1 0 . 前記撮像手段は、 I Cパッケージの両側方にそれぞれ配設された 2台の力 メラである請求の範囲 6から請求の範囲 8のいずれかに記載の I Cパッケージの リ一ド検査装置。 10. The IC package lead inspection apparatus according to any one of claims 6 to 8, wherein said imaging means is two force cameras respectively disposed on both sides of the IC package.
1 1 . I Cパッケージのリード端子および I Cパッケージの上面を照明し、 リ一 ド端子の影像を撮像する事により I Cパッケージのリード端子の異常を検査する とともに、 I Cパッケージ上面からの検査をする I Cパッケージの検査装置にお いて、 1 1. The IC package that inspects the lead terminals of the IC package by illuminating the lead terminals of the IC package and the top surface of the IC package and picks up an image of the lead terminals, and also inspects the IC package from the top surface. In the inspection equipment of
I Cパッケージのリード端子が存在しない I Cパッケージ底面の中央部領域に 対応する幅を有し、 I Cパッケージのリード端子のスタンドオフよりも長く リー ド先端部から I Cパッケージの中央部側のリード端子のみに光が照射される高さ を有する第 1の照明装置を I Cパッケージ底面の中央部に配設すると共に、 前記 I Cパッケージの上面を照明する第 2の照明装置を I Cパッケージの上方に配設 し、  There is no IC package lead terminal.It has a width corresponding to the center area of the bottom of the IC package and is longer than the stand-off of the IC package lead terminal. A first lighting device having a height at which light is irradiated is disposed at the center of the bottom surface of the IC package, and a second lighting device for illuminating the top surface of the IC package is disposed above the IC package;
I Cパッケージの両側方にそれぞれ g己設された 2つのミラー手段と、 I Cパッケージの上方に配設され、 前記ミラ一手段によって導光された第 1の 照明装置の光によるリード端子像を撮像するとともに、 前記第 2の照明装置によ つて照明された I Cパッケージの上面を撮像する 1台の撮像手段と、 Two mirrors, each installed on both sides of the IC package, An upper surface of the IC package, which is arranged above the IC package and captures a lead terminal image by light of the first lighting device guided by the mirror means, and illuminated by the second lighting device One imaging means for imaging the
前記第 1の照明装置の前記リード端子に対する照明と前記第 2の照明装置の前 記前記 I Cパッケージの上面に対する照明とを時間的に交互に切換え制御する制 御手段と、  Control means for alternately and temporally switching and controlling the illumination of the lead terminals of the first illumination device and the illumination of the top surface of the IC package of the second illumination device;
を具え、 1つのステージでリード端子の検査及び I Cパッケージ上面からの検 査を実行するようにしたことを特徴とする I Cパッケージの検査装置。  An inspection device for an IC package, wherein the inspection of the lead terminals and the inspection from the upper surface of the IC package are performed in one stage.
1 2 . 前記制御手段は、 前記第 1の照明装置および第 2の照明装置の点灯時期を 交互に切り換える請求の範囲 1 1記載の I Cパッケージの検査装置。 12. The IC package inspection device according to claim 11, wherein the control means alternately switches lighting times of the first lighting device and the second lighting device.
1 3 . 前記制御手段は、 前記第 1の照明装置および第 2の照明装置の前方にそれ ぞれ設けられて各照明装置からの光を遮断 通過させる第 1及び第 2のシャッタ 手段と、 13. The control means includes first and second shutter means provided in front of the first lighting device and the second lighting device, respectively, for blocking and passing light from each lighting device;
これら第 1のシャツタ手段の開閉制御を行うことにより前記第 1の照明装置の 前記リ一ド端子に対する照明と前記第 2の照明装置の前記 I Cパッケージの上面 に対する照明とを時間的に交互に切換えるシャツタ開閉制御手段と、  By controlling the opening and closing of the first shutter device, the illumination of the first illumination device for the lead terminal and the illumination of the second illumination device for the upper surface of the IC package are alternately switched in time. Shirt opening and closing control means,
を有する請求の範囲 1 1記載の I Cパッケージの検査装置。  The inspection device for an IC package according to claim 11, comprising:
1 4 . 前記制御手段は、 前記第 1及び第 2の照明装置の一方に設けられて当該照 明装置からの光を遮断 通過させるシャツタ手段と、 14. The control means is provided in one of the first and second lighting devices, and shuts off light from the lighting device to pass therethrough;
前記シャツタ手段が設けられていなレ、側の照明装置の点灯時期と、 前記シャッ タ手段が設けられてる側の照明装置のシャツタが開している時期が時間的に交互 になるよう前記シャッタ手段が設けられていない側の照明装置の点灯制御および 前記シャツタ手段の開閉制御を実行する照明制御手段と、  The shutter means so that the lighting timing of the lighting device on the side where the shutter device is not provided and the timing when the shutter device of the lighting device on the side where the shutter device is provided are open alternately in time. Lighting control means for performing lighting control of the lighting device on the side not provided and opening and closing control of the shutter means,
を有する請求の範囲 1 1記載の I Cパッケージの検査装置。  The inspection device for an IC package according to claim 11, comprising:
1 5 . I Cパッケージのリード端子および I Cパッケージの上面を照明し、 リ一 ド端子の影像を撮像する事により I Cパッケージのリ一ド端子の異常を検査する とともに、 I Cパッケージ上面からの検査をする I Cパッケージの検査装置にお いて、 15 5. Illuminate the lead terminals of the IC package and the top In the inspection equipment for IC packages, which inspects the lead terminals of the IC package for abnormalities by capturing the image of the lead terminals and inspects the IC package from the top,
I Cパッケージの下方に配設された第 1の照明装置と、  A first lighting device disposed below the IC package;
前記 I Cパッケージ底面の中央部領域に対応する幅を有し、 前記第 1の照明装 置の光を I Cパッケージの底面付近まで導光しかつ前記 I Cパッケージを支持す る透光性の I cパッケージ支持部材と、  A translucent Ic package having a width corresponding to a central region of the bottom surface of the IC package, guiding light of the first lighting device to near the bottom surface of the IC package, and supporting the IC package; A support member;
前記 I Cパッケージ支持部材の底面のみから前記第 1の照明装置の光を I cパ ッケージ底面付近に導光するよう前記 I Cパッケージ支持部材の底面より外側の 領域を遮光する第 1の遮光手段と、  First light blocking means for blocking a region outside the bottom surface of the IC package supporting member so as to guide the light of the first lighting device to the vicinity of the bottom surface of the Ic package only from the bottom surface of the IC package supporting member;
前記 I Cパッケージ支持部材の露出している部分の I Cパッケージ底面からの 高さ力 I Cパッケージのリ一ド端子のスタンドオフよりも長く リード先端部か ら I Cパッケージの中央部側のリード端子のみに光が照射される高さになるよう I Cパッケージ支持部材の少なくともリード端子に対向している面を遮光する第 2の遮光手段と、  The height of the exposed part of the IC package support member from the bottom of the IC package is longer than the stand-off of the lead terminal of the IC package. A second light-shielding means for shielding at least a surface of the IC package supporting member facing the lead terminal so that the surface is irradiated with light.
I Cパッケージの両側方にそれぞれ配設された 2つのミラー手段と、  Two mirror means respectively arranged on both sides of the IC package,
I Cパッケージの上方に配設されて I Cパッケージの上面を照明する第 2の照 明装置と、  A second lighting device disposed above the IC package to illuminate the top surface of the IC package;
I cパッケージの上方に配設され、 前記ミラー手段によって導光されたリード 端子像を撮像するとともに、 前記第 2の照明装置によって照明された I Cパッケ —ジの上面を撮像する 1台の撮像手段と、  One image pickup means disposed above the Ic package, for picking up an image of the lead terminal guided by the mirror means, and for picking up the upper surface of the IC package illuminated by the second lighting device. When,
前記第 1および第 2の照明装置の照明を時間的に交互に切替える照明制御手段 と、  Lighting control means for switching the lighting of the first and second lighting devices alternately with time;
を具え、 1つのステージでリード端子の検査及び I Cパッケージ上面の検査を 実行するようにしたことを特徴とする I Cパッケージの検査装置。  An inspection device for an IC package, wherein the inspection of the lead terminals and the inspection of the upper surface of the IC package are performed in one stage.
1 6 . I Cパッケージをその裏面が上になるようにステージ上に載置し、 この I Cパッケージの裏面を I Cパッケージの上方に配設した照明装置により照明し、 該照明した I Cパッケージの裏面を撮像することにより I Cパッケージのリード の異常を検査する I Cパッケージのリード検査装置において、 16. Place the IC package on the stage so that its back surface is up, illuminate the back surface of this IC package with the lighting device arranged above the IC package, and image the back surface of the illuminated IC package. To lead the IC package Inspection of IC package lead
前記 I Cパッケージに対する照明条件が異なる複数の照明装置を I Cパッケ一 ジの上方に配設すると共に、  A plurality of lighting devices having different lighting conditions for the IC package are arranged above the IC package, and
これら複数の照明装置の前記 I Cパッケージに対する照明を時間的に順次切り 換え制御する制御手段を  Control means for sequentially and temporally switching and controlling the illumination of the plurality of illumination devices with respect to the IC package.
具えるようにしたことを特徴とする I cパッケージのリード検査装置。  A lead inspection device for an IC package, characterized in that it is provided.
1 7 . 前記制御手段は、 前記複数の照明装置の点灯時期を順次切り換える請求の 範囲 1 6記載の I Cパッケージの検査装置。 17. The IC package inspection device according to claim 16, wherein said control means sequentially switches lighting times of said plurality of lighting devices.
1 8 . 前記制御手段は、 前記複数の照明装置の各前方にそれぞれ設けられて各照 明装置からの光を遮断 通過させる複数のシャツタ手段と、 18. The control unit includes a plurality of shutter units provided in front of the plurality of lighting devices, respectively, for blocking and passing light from each of the lighting devices;
これら複数のシャッタ手段の開閉を順次切り換え制御するシャッタ開閉制御手 段と、  A shutter opening / closing control means for sequentially controlling opening / closing of the plurality of shutter means;
を有する請求の範囲 1 6記載の I Cパッケージの検査装置。  The inspection device for an IC package according to claim 16, comprising:
1 9 . 前記制御手段は、 前記複数の照明装置の一部に設けられて当該照明装置か らの光を遮断 Z通過させる 1〜複数のシャッタ手段と、 1 9. The control means is provided in a part of the plurality of lighting devices, and intercepts light from the lighting devices and allows the light to pass therethrough.
前記シャッタ手段が設けられていない照明装置の点灯時期および前記シャッタ 手段が設けられてる照明装置のシャッタが開している時期が時間的に順次行われ るよう前記シャッタ手段が設けられていない側の照明装置の点灯制御および前記 シャツタ手段の開閉制御を実行する照明制御手段ど、  The lighting timing of the illuminating device without the shutter means and the timing of opening the shutter of the illuminating device with the shutter means are sequentially time-sequentially controlled so that the shutter means is not provided. Lighting control means for performing lighting control of a lighting device and opening / closing control of the shutter means,
を有する請求の範囲 1 6記載の I Cパッケージの検査装置。  The inspection device for an IC package according to claim 16, comprising:
PCT/JP1997/000246 1996-02-02 1997-01-31 Lead inspection apparatus of ic package WO1997028420A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8017744A JPH09210652A (en) 1996-02-02 1996-02-02 Lead inspection device for ic package
JP8/17744 1996-02-02

Publications (1)

Publication Number Publication Date
WO1997028420A1 true WO1997028420A1 (en) 1997-08-07

Family

ID=11952268

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1997/000246 WO1997028420A1 (en) 1996-02-02 1997-01-31 Lead inspection apparatus of ic package

Country Status (3)

Country Link
JP (1) JPH09210652A (en)
KR (1) KR19990081948A (en)
WO (1) WO1997028420A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000016076A1 (en) * 1998-09-17 2000-03-23 Viewwell Co., Ltd. Electronic component lead inspection device
KR100470402B1 (en) * 2001-01-15 2005-02-07 (주)포씨스 panel inspecting apparatus and inspecting method for panel

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460395B (en) * 2012-07-25 2014-11-11 Ind Tech Res Inst Flatness measurement device and measuring method thereof
JP2016225059A (en) * 2015-05-28 2016-12-28 凸版印刷株式会社 Inspection device for coating defect of fuel cell electrode, and inspection method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265440A (en) * 1987-04-22 1988-11-01 Mitsubishi Electric Corp Inspecting apparatus for lead shape of semiconductor device
JPH03227551A (en) * 1990-02-01 1991-10-08 Datsuku Eng Kk Inspecting method for lead
JPH05288527A (en) * 1992-04-10 1993-11-02 Matsushita Electric Ind Co Ltd Appearance inspecting method for mounted board and its device
JPH0621694A (en) * 1992-07-02 1994-01-28 Sanyo Electric Co Ltd Mounting apparatus for component
JPH0628615U (en) * 1992-09-17 1994-04-15 株式会社中央理研 IC terminal shape inspection device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63265440A (en) * 1987-04-22 1988-11-01 Mitsubishi Electric Corp Inspecting apparatus for lead shape of semiconductor device
JPH03227551A (en) * 1990-02-01 1991-10-08 Datsuku Eng Kk Inspecting method for lead
JPH05288527A (en) * 1992-04-10 1993-11-02 Matsushita Electric Ind Co Ltd Appearance inspecting method for mounted board and its device
JPH0621694A (en) * 1992-07-02 1994-01-28 Sanyo Electric Co Ltd Mounting apparatus for component
JPH0628615U (en) * 1992-09-17 1994-04-15 株式会社中央理研 IC terminal shape inspection device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000016076A1 (en) * 1998-09-17 2000-03-23 Viewwell Co., Ltd. Electronic component lead inspection device
US6727713B1 (en) 1998-09-17 2004-04-27 Viewwell Co., Inc. Electronic component lead inspection device
KR100470402B1 (en) * 2001-01-15 2005-02-07 (주)포씨스 panel inspecting apparatus and inspecting method for panel

Also Published As

Publication number Publication date
KR19990081948A (en) 1999-11-15
JPH09210652A (en) 1997-08-12

Similar Documents

Publication Publication Date Title
JP5323320B2 (en) Surface inspection device
KR100578560B1 (en) Automated optical inspection machine
KR20010040321A (en) Electronics assembly apparatus with improved imaging system
KR20080093850A (en) Pattern inspection apparatus and pattern inspection method
JP2000266681A (en) Line illumination apparatus
JP4987511B2 (en) Inspection equipment for printed wiring boards
KR960005090B1 (en) Bonding wire inspection apparatus
CN110021042B (en) Image inspection device and illumination device
WO1997028420A1 (en) Lead inspection apparatus of ic package
JPH10332792A (en) Lighting system for board inspecting camera
JP2000028320A (en) Image recognizing equipment and image recognizing method
US20020167660A1 (en) Illumination for integrated circuit board inspection
JP2579869B2 (en) Optical inspection equipment
JP2009300351A (en) Inspection apparatus and inspection method
KR101124567B1 (en) Wafer inspecting apparatus having hybrid illumination
JP2004101311A (en) Luminaire and lighting method for line sensor cameras
JP2004191214A (en) Line lighting system, and inspection device using line lighting system
JP3424536B2 (en) Electronic component mounting state inspection apparatus and mounting board inspection method
KR101015808B1 (en) Apparatus and method for measuring line width of bonding electrode
KR20070068169A (en) Vision inspection system
US6128034A (en) High speed lead inspection system
JP2000292126A (en) Visual inspection apparatus and manufacturing method of semiconductor device which uses the apparatus
JP4724756B2 (en) Substrate inspection apparatus with illumination device for substrate inspection camera
JP2862833B2 (en) Solder appearance inspection device
KR100978487B1 (en) A flood light apparatus for appearance inspection of surface

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): KR SG US

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1019980705664

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 1019980705664

Country of ref document: KR

WWW Wipo information: withdrawn in national office

Ref document number: 1019980705664

Country of ref document: KR