TWI460395B - Flatness measurement device and measuring method thereof - Google Patents

Flatness measurement device and measuring method thereof Download PDF

Info

Publication number
TWI460395B
TWI460395B TW101126732A TW101126732A TWI460395B TW I460395 B TWI460395 B TW I460395B TW 101126732 A TW101126732 A TW 101126732A TW 101126732 A TW101126732 A TW 101126732A TW I460395 B TWI460395 B TW I460395B
Authority
TW
Taiwan
Prior art keywords
plane
light
module
gap
signal
Prior art date
Application number
TW101126732A
Other languages
Chinese (zh)
Other versions
TW201405093A (en
Inventor
Kuo Tang Huang
Ya Hui Tsai
Shang Chieh Lu
Chin Kuei Chang
Jyh Jye Jeng
Wei Chen Li
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW101126732A priority Critical patent/TWI460395B/en
Priority to CN201210368108.7A priority patent/CN103575240B/en
Publication of TW201405093A publication Critical patent/TW201405093A/en
Application granted granted Critical
Publication of TWI460395B publication Critical patent/TWI460395B/en

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)

Description

平整度檢測裝置及其檢測方法Flatness detecting device and detecting method thereof

本發明是有關於一種平整度檢測裝置及其檢測方法,且特別是有關於一種以光學影像訊號判斷待測工件之表面平整度的檢測裝置及其檢測方法。The present invention relates to a flatness detecting device and a detecting method thereof, and more particularly to a detecting device for determining the surface flatness of a workpiece to be tested by an optical image signal and a detecting method thereof.

在傳統平整度的檢測方法上,多是利用平台與間隙尺進行人工檢測。其平整度檢測方式過程為:先將待測物放置於一經過驗證之基準平台上,然後操作人員利用標準規格之間隙尺,塞入待測物與平台之間的間隙以檢驗平整度是否合格。但是採用此方式檢測待測物之平整度,受限於間隙尺的最小單位為0.1毫米(100微米),故其精度一般只能達到0.1毫米,且檢測過程需經由操作人員涉入判斷,因此會有標準不一致之問題。此外,此方式為接觸式之檢測方式,即檢測時待測物的表面需與間隙尺進行接觸,而在檢測過程中,難免發生碰撞與摩擦。如此,平台與間隙尺在長時間使用後其檢測精度必然會下降,並且也可能使待測物的表面產生刮痕,進而影響表面品質。In the traditional flatness detection method, the platform and the gap ruler are mostly used for manual detection. The flatness detection method is as follows: firstly, the object to be tested is placed on a verified reference platform, and then the operator uses a gap gauge of a standard specification to insert a gap between the object to be tested and the platform to check whether the flatness is qualified. . However, in this way, the flatness of the test object is detected, and the minimum unit limited by the gap ruler is 0.1 mm (100 μm), so the accuracy is generally only 0.1 mm, and the detection process needs to be judged by the operator, so There will be problems with standard inconsistencies. In addition, this method is a contact type detection method, that is, the surface of the object to be tested needs to be in contact with the gap ruler during the detection, and collision and friction are inevitable during the detection process. In this way, the detection accuracy of the platform and the gap gauge will inevitably decrease after a long period of use, and the surface of the object to be tested may be scratched, thereby affecting the surface quality.

本發明係有關於一種平整度檢測裝置及其檢測方法,藉由間隙透光影像處理之方式來做為平整度檢測的基準,並透過數值分析來計算待測物之下緣與承載平面之間的間隙高度,以判斷平整度是否合格。The invention relates to a flatness detecting device and a detecting method thereof, which are used as a reference for flatness detection by means of gap light transmission image processing, and numerical analysis is used to calculate between the lower edge of the object to be tested and the bearing plane The gap height is used to determine whether the flatness is acceptable.

根據本發明之一方面,提出一種平整度檢測裝置,包括一承載平台、一發光模組、一光接收模組、一影像處理模組以及一比對模組。承載平台具有一平面,用以承載一待測物以及供一光線穿透。發光模組配置於承載平台中,用以發出此光線。此光線由待測物靠近此平面之側邊與此平面間射出而產生一檢測光。光接收模組位於承載平台之一側,用以接收檢測光,並產生一影像訊號。影像處理模組用以接收並處理影像訊號,以量測待測物靠近此平面之側邊與平面間的一間隙高度。比對模組根據間隙高度與一標準值之比對結果,輸出一檢測訊號,以判斷間隙高度是否符合標準。According to an aspect of the present invention, a flatness detecting device includes a carrying platform, a lighting module, a light receiving module, an image processing module, and a matching module. The carrying platform has a plane for carrying a test object and for a light to penetrate. The light emitting module is disposed in the carrying platform to emit the light. The light is emitted by the object to be tested near the side of the plane and the plane to generate a detection light. The light receiving module is located on one side of the carrying platform for receiving the detecting light and generating an image signal. The image processing module is configured to receive and process the image signal to measure a gap height between the side of the object to be tested and the plane. The comparison module outputs a detection signal according to the ratio of the gap height to a standard value to determine whether the gap height meets the standard.

根據本發明之另一方面,提出一種平整度檢測方法,包括下列步驟。將一待測物放置於一承載平台之平面上。使一光線由待測物靠近此平面之側邊與平面間射出而產生一檢測光。對檢測光進行一影像處理,以量測待測物靠近此平面之側邊與平面間的一間隙高度。根據間隙高度與一標準值之比對結果,產生一檢測訊號,以判斷間隙高度是否符合標準。According to another aspect of the present invention, a flatness detecting method is provided, comprising the following steps. A test object is placed on a plane of a carrying platform. A detection light is generated by emitting a light from the side of the object close to the plane and the plane. Performing an image processing on the detection light to measure a gap height between the side of the object to be measured close to the plane and the plane. According to the ratio of the gap height to a standard value, a detection signal is generated to determine whether the gap height meets the standard.

為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式,作詳細說明如下:In order to provide a better understanding of the above and other aspects of the present invention, the following detailed description of the embodiments and the accompanying drawings

本實施例之平整度檢測裝置及其檢測方法,係將待測物放置於承載平台上,承載平台內具有發光模組朝待測物投射光線,光線會經由待測物與承載平台間的狹縫中透 出,再由光接收模組接收而產生影像訊號,影像訊號經由影像處理模組處理後,可用以計算待測物之下緣(側邊)與承載平面之間的間隙高度,並以間隙高度與一標準值進行比對。若比對結果顯示間隙高度大於標準值,則判定為不合格,若間隙高度小於標準值,則判定為合格,以做為平整度檢測之依據。本實施例之檢測裝置採用非接觸式量測,不會刮傷待測物,且為準標化自動檢測流程並根據比對結果自動判斷是否符合標準,故能提高精度(可達0.01毫米以下)、效率(檢測時間小於1.5秒/片)及準確率,以節省人力及成本,更能避免人為因素而造成標準不一致的問題。The flatness detecting device and the detecting method thereof of the embodiment are to place the object to be tested on the carrying platform, and the light emitting module has a light emitting module projecting light toward the object to be tested, and the light passes through the narrow between the object to be tested and the carrying platform. Through the seam And receiving the image signal by the light receiving module, and the image signal is processed by the image processing module, and can be used to calculate the gap height between the lower edge (side) of the object to be tested and the bearing plane, and the gap height Compare with a standard value. If the comparison result shows that the gap height is greater than the standard value, it is judged to be unqualified. If the gap height is less than the standard value, it is judged as qualified, as the basis for the flatness detection. The detecting device of the embodiment adopts non-contact measuring, does not scratch the object to be tested, and is a quasi-standardized automatic detecting process and automatically judges whether the standard is met according to the comparison result, thereby improving the precision (up to 0.01 mm or less) ), efficiency (detection time is less than 1.5 seconds / piece) and accuracy, to save manpower and cost, and to avoid the problem of standard inconsistency caused by human factors.

以下係提出各種實施例進行詳細說明,實施例僅用以作為範例說明,並非用以限縮本發明欲保護之範圍。The following is a detailed description of various embodiments, which are intended to be illustrative only and not to limit the scope of the invention.

第一實施例First embodiment

請參照第1及2圖,其中第1圖繪示依照本發明一實施例之平整度檢測裝置的方塊示意圖,第2圖繪示一實施例中承載平台之內部示意圖。在第1圖中,平整度檢測裝置100包括一承載平台110、一發光模組120、一光接收模組130、一影像處理模組140以及一比對模組150。承載平台110具有一平面112,用以承載一待測物10以及供一光線L穿透。此平面112包括一透光部,例如是一中空部、透明玻璃或壓克力,其係做為平整度檢測的基準面。承載平台110於平面112下方為一中空本體,用以放置發光模組120,例如為發光二極體陣列或其他發光元件122。 如第2圖所示,例如以多個串聯連接之發光二極體做為發光元件122,環繞於承載平台110的內部,並朝承載平台110的平面112直射發光,或者是朝側壁114發光並藉由反射將光線導向平面112,以使光線在各個方向上均勻發散。此外,藉由四周均勻發散的發光模組120可避免強光/雜光干擾而影響檢測的品質,並可同時在各個檢測方向A~F上進行平整度檢測,以提高效率。1 and 2, wherein FIG. 1 is a block diagram showing a flatness detecting device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing the internal portion of a carrying platform in an embodiment. In the first embodiment, the flatness detecting device 100 includes a carrying platform 110, a lighting module 120, a light receiving module 130, an image processing module 140, and a matching module 150. The carrying platform 110 has a plane 112 for carrying a test object 10 and for penetrating a light L. This plane 112 includes a light transmissive portion, such as a hollow portion, clear glass or acryl, which serves as a reference surface for flatness detection. The carrier platform 110 is a hollow body under the plane 112 for placing the light emitting module 120, such as an array of light emitting diodes or other light emitting elements 122. As shown in FIG. 2, for example, a plurality of LEDs connected in series are used as the light-emitting elements 122, surrounding the interior of the carrier platform 110, and emitting light directly toward the plane 112 of the carrier platform 110, or emitting light toward the sidewalls 114. The light is directed to the plane 112 by reflection so that the light is evenly diverged in all directions. In addition, the illuminating module 120 uniformly diverging around can avoid the glare/stray interference and affect the quality of the detection, and can simultaneously perform the flatness detection in each detection direction A~F to improve the efficiency.

在第1及2圖中,光線L例如是經由直射或反射後朝平面112前進,並穿過平面112而到達待測物10的下緣12。需說明的是,下緣12係指待測物10靠近平面112之側邊,其位於下方,故以方向性定義為「下緣」,並非指特定之側邊。此時,一部分光線會經由待測物10之下緣12與平面112間有狹縫之處射出而產生一檢測光T。檢測光T射出的方向大略平行於平面112。此檢測光T會被配置於檢測方向A~F其中之一上的光接收模組130接收,並產生一影像訊號。光接收模組130例如為一組影像感測器,其數量不限定為1個或多個,可依照實際情況增加或減少,例如6個影像感測器分別設置於不同檢測方向A~F上。In the first and second figures, the light L is advanced toward the plane 112, for example, by direct or reflective, and passes through the plane 112 to reach the lower edge 12 of the object to be tested 10. It should be noted that the lower edge 12 refers to the side of the object 10 to be close to the plane 112, which is located below, so the directionality is defined as the "lower edge", and does not refer to the specific side. At this time, a part of the light is emitted through a slit between the lower edge 12 of the object to be tested 10 and the plane 112 to generate a detection light T. The direction in which the detection light T is emitted is substantially parallel to the plane 112. The detection light T is received by the light receiving module 130 disposed in one of the detecting directions A to F, and generates an image signal. The light receiving module 130 is, for example, a group of image sensors, the number of which is not limited to one or more, and may be increased or decreased according to actual conditions. For example, six image sensors are respectively disposed in different detecting directions A~F. .

在第1及2圖中,影像處理模組140電性連接或無線連接光接收模組130,用以接收並處理影像訊號,並以間隙光影像處理的方式來量測待測物10的下緣12與平面112間的一間隙高度G。在一實施例中,影像處理模組140接收並處理不同檢測方向之影像訊號。由於各個檢測方向A~F上所得到的檢測數值是不同的,本實施例可透過數值 分析及運算比對來精確地得知各個檢測方向A~F上的間隙高度是否符合標準。數值越大表示間隙高度G越大,數值越小表示間隙高度G越小。In the first and second figures, the image processing module 140 is electrically connected or wirelessly connected to the light receiving module 130 for receiving and processing the image signal, and measuring the underside of the object to be tested 10 by means of gap light image processing. A gap height G between the edge 12 and the plane 112. In an embodiment, the image processing module 140 receives and processes image signals of different detection directions. Since the detection values obtained in the respective detection directions A to F are different, the embodiment can transmit numerical values. Analyze and calculate the comparison to accurately know whether the gap height in each detection direction A~F meets the standard. The larger the value, the larger the gap height G, and the smaller the value, the smaller the gap height G.

舉例來說,在一實施例中,影像處理模組140可連接至外部的比對模組150或以內建的方式將影像處理模組140與比對模組150整合為一檢測單元132。當間隙高度G大於一預設的標準值時,比對模組150可根據比對結果發出一不合格檢測訊號,倘若間隙高度G小於預設的標準值時,比對模組150可根據比對結果發出一合格檢測訊號。此外,假設各個檢測方向A~F中若有一個或多個間隙高度大於預設的標準值時,比對模組150亦可根據比對結果發出一不合格檢測訊號。For example, in an embodiment, the image processing module 140 can be connected to the external comparison module 150 or integrate the image processing module 140 and the comparison module 150 into a detection unit 132 in a built-in manner. When the gap height G is greater than a predetermined standard value, the comparison module 150 can send a failure detection signal according to the comparison result. If the gap height G is less than a preset standard value, the comparison module 150 can be compared according to the ratio. A qualified detection signal is sent to the result. In addition, if one or more gap heights in each of the detection directions A to F are greater than a preset standard value, the comparison module 150 may also issue a failure detection signal according to the comparison result.

請參照第1圖,除了利用影像處理模組140進行間隙光影像處理之外,本實施例之平整度檢測裝置100更可包括一調光模組160,連接於比對模組150與發光模組120之間,用以調整發光模組120的亮度,以使影像處理模組140能在最適化影像條件下進行處理,以避免在過度曝光或亮度不足的情況下進行檢測。調光機制係將一標準工件做為待測物10,放置在承載平台110上,且在標準工件的下緣12與平面112間的間隙高度為已知的條件下進行,並以已知的間隙高度做為調光時之標準值。The flatness detecting device 100 of the present embodiment may further include a dimming module 160 connected to the comparing module 150 and the light emitting module, in addition to the image processing module 140 for performing the gap optical image processing. Between the groups 120, the brightness of the light-emitting module 120 is adjusted to enable the image processing module 140 to perform processing under optimized image conditions to avoid detection under overexposure or insufficient brightness. The dimming mechanism uses a standard workpiece as the object to be tested 10, placed on the carrier platform 110, and is carried out under the condition that the gap height between the lower edge 12 and the plane 112 of the standard workpiece is known, and is known. The gap height is used as the standard value for dimming.

請參照第1及3圖,其中第3圖繪示依照一實施例之調光方法的流程圖。步驟S30為擷取影像,以進行間隙光之影像處理。步驟S32為進行數值分析,以計算待測物10的下緣12與平面112間的間隙高度。步驟S34為輸入一 間隙標準值於步驟S32,以進行步驟S36之運算比對。在步驟S36中,當間隙高度G與標準值之間的誤差值相對於標準值小於一比值(例如小於1%)時,則判定發光模組120之亮度在理想狀態下,如步驟S38。反之,倘若間隙高度G與標準值之間的誤差值相對於標準值大於或等於一比值(例如大於1%)時,則進行步驟S40之調整亮度,並於調整亮度後,進行步驟S42之重新擷取影像。上述步驟S32、S36、S40、S42之循環可進行一次或多次,直到發光模組120之亮度在理想狀態下為止。Please refer to FIGS. 1 and 3 , wherein FIG. 3 is a flow chart of a dimming method according to an embodiment. In step S30, the image is captured to perform image processing of the gap light. Step S32 is for performing numerical analysis to calculate the gap height between the lower edge 12 of the object 10 and the plane 112. Step S34 is inputting one The gap standard value is in step S32 to perform the operation comparison of step S36. In step S36, when the error value between the gap height G and the standard value is less than a ratio (for example, less than 1%) with respect to the standard value, it is determined that the brightness of the light-emitting module 120 is in an ideal state, as in step S38. On the other hand, if the error value between the gap height G and the standard value is greater than or equal to a ratio (for example, greater than 1%) with respect to the standard value, then the brightness is adjusted in step S40, and after the brightness is adjusted, the step S42 is performed again. Capture images. The loop of the above steps S32, S36, S40, and S42 may be performed one or more times until the brightness of the light emitting module 120 is in an ideal state.

接著,請參照第4及5圖,其中第4圖繪示依照本發明一實施例之間隙光影像處理方法的流程圖,第5圖繪示間隙光影像的放大示意圖。步驟S50為擷取間隙光影像,步驟S52係根據影像訊號中代表間隙高度的一亮紋訊號M,搜尋亮紋訊號M的下緣以做為一下方基準線S1。此下方基準線S1也就是對應第1圖中承載平台110之平面112的第一邊緣所形成之參考線。步驟S53係決定第一個畫素位置,例如P1,以開始進行數值運算。步驟S54係沿著垂直基準線S1的方向找出與亮紋訊號M的上緣(也就是對應於靠近平面112之下緣12的第二邊緣)相交的一座標點,例如(X1,Y1)。步驟S55為計算座標點與基準線S1之間的距離做為第一間隙高度G1。步驟S56係決定下一個畫素位置,例如P2、P3,並回到步驟S54,重複步驟S54與步驟S55至少一次,以找出對應的座標點,例如(X2,Y2)、(X3,Y3),並計算各個座標點與基準線S1之間的距離,以做為第二間隙高度G2與第三間隙高度G3,直 到完成一區間內多個座標點的量測為止,以計算區間的平均間隙高度。假設以10~30個畫素為一個區間單位,先計算一座標點到基準線S1之間的距離,再於基準線S1移動1~3個畫素,以計算另一個座標點到基準線S1之間的距離。待完成多個座標點的量測之後,計算此些座標點與基準線S1的平均距離。依此類推,待完成整個亮紋的量測之後,進行步驟S58,判斷距離是否符合設定值。舉例來說,判斷最小間隙高度是否小於標準值、判斷各個間隙高度是否分別小於標準值或判斷各區間之間隙高度平均值是否小於標準值。在一實施例中,若判斷的距離大於標準值,則判定為不合格,反之,倘若判斷的距離小於標準值,則判定為合格。Next, please refer to FIG. 4 and FIG. 5 , wherein FIG. 4 is a flow chart of a method for processing a gap light image according to an embodiment of the invention, and FIG. 5 is an enlarged schematic view of a gap light image. Step S50 is to capture the gap light image. Step S52 searches for the lower edge of the bright-grain signal M as a lower reference line S1 according to a bright-grain signal M representing the gap height in the image signal. The lower reference line S1 is also the reference line formed by the first edge corresponding to the plane 112 of the carrying platform 110 in FIG. Step S53 determines the first pixel position, for example, P1, to start the numerical operation. Step S54 finds a punctuation point, such as (X1, Y1), intersecting the upper edge of the bright-grain signal M (that is, the second edge corresponding to the lower edge 12 of the plane 112) along the direction of the vertical reference line S1. Step S55 is to calculate the distance between the coordinate point and the reference line S1 as the first gap height G1. Step S56 determines the next pixel position, for example, P2, P3, and returns to step S54, and repeats step S54 and step S55 at least once to find corresponding coordinate points, such as (X2, Y2), (X3, Y3). And calculating the distance between each coordinate point and the reference line S1 as the second gap height G2 and the third gap height G3, straight The average gap height of the interval is calculated until the measurement of multiple coordinate points in one interval is completed. Suppose that 10~30 pixels are used as an interval unit, first calculate the distance between a punctuation point and the reference line S1, and then move 1~3 pixels on the reference line S1 to calculate another coordinate point to the reference line S1. The distance between them. After the measurement of the plurality of coordinate points is completed, the average distance between the coordinate points and the reference line S1 is calculated. And so on, after the measurement of the entire bright line is completed, step S58 is performed to determine whether the distance meets the set value. For example, it is determined whether the minimum gap height is less than a standard value, whether each gap height is smaller than a standard value, or whether the gap height average of each section is smaller than a standard value. In one embodiment, if the determined distance is greater than the standard value, it is determined to be unsatisfactory, and if the determined distance is less than the standard value, the determination is deemed to be acceptable.

綜上所述,雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10‧‧‧待測物10‧‧‧Test object

12‧‧‧下緣(靠近平面之側邊)12‧‧‧ Lower edge (near the side of the plane)

100‧‧‧平整度檢測裝置100‧‧‧ flatness detection device

110‧‧‧承載平台110‧‧‧Loading platform

112‧‧‧平面112‧‧‧ plane

114‧‧‧側壁114‧‧‧ side wall

120‧‧‧發光模組120‧‧‧Lighting module

122‧‧‧發光元件122‧‧‧Lighting elements

130‧‧‧光接收模組130‧‧‧Light receiving module

132‧‧‧檢測單元132‧‧‧Detection unit

140‧‧‧影像處理模組140‧‧‧Image Processing Module

150‧‧‧比對模組150‧‧‧ Alignment module

160‧‧‧調光模組160‧‧‧ dimming module

A~F‧‧‧檢測方向A~F‧‧‧Detection direction

L‧‧‧光線L‧‧‧Light

M‧‧‧亮紋訊號M‧‧‧ bright grain signal

S1‧‧‧基準線S1‧‧‧ baseline

T‧‧‧檢測光T‧‧‧Detecting light

P1、P2、P3‧‧‧畫素位置P1, P2, P3‧‧‧ pixel location

G、G1、G2、G3‧‧‧間隙高度G, G1, G2, G3‧‧‧ gap height

(X1,Y1)、(X2,Y2)、(X3,Y3)‧‧‧座標點(X1, Y1), (X2, Y2), (X3, Y3) ‧ ‧ punctuation

第1圖繪示依照本發明一實施例之平整度檢測裝置的方塊示意圖。FIG. 1 is a block diagram showing a flatness detecting device according to an embodiment of the invention.

第2圖繪示一實施例中承載平台之內部示意圖。FIG. 2 is a schematic diagram showing the internal structure of the carrying platform in an embodiment.

第3圖繪示依照一實施例之調光方法的流程圖。FIG. 3 is a flow chart showing a dimming method according to an embodiment.

第4圖繪示依照本發明一實施例之間隙光影像處理 方法的流程圖。4 is a diagram showing gap light image processing according to an embodiment of the invention. Flow chart of the method.

第5圖繪示間隙光影像的放大示意圖。FIG. 5 is an enlarged schematic view showing a gap light image.

10‧‧‧待測物10‧‧‧Test object

12‧‧‧下緣12‧‧‧ Lower edge

100‧‧‧平整度檢測裝置100‧‧‧ flatness detection device

110‧‧‧承載平台110‧‧‧Loading platform

112‧‧‧平面112‧‧‧ plane

120‧‧‧發光模組120‧‧‧Lighting module

122‧‧‧發光元件122‧‧‧Lighting elements

130‧‧‧光接收模組130‧‧‧Light receiving module

132‧‧‧檢測單元132‧‧‧Detection unit

140‧‧‧影像處理模組140‧‧‧Image Processing Module

150‧‧‧比對模組150‧‧‧ Alignment module

160‧‧‧調光模組160‧‧‧ dimming module

L‧‧‧光線L‧‧‧Light

T‧‧‧檢測光T‧‧‧Detecting light

G‧‧‧間隙高度G‧‧‧ gap height

Claims (15)

一種平整度檢測裝置,包括:一承載平台,具有一平面,用以承載一待測物以及供一光線穿透;一發光模組,配置於該承載平台中,用以發出該光線,該光線由該待測物靠近該平面之側邊與該平面間射出而產生一檢測光;一光接收模組,位於該承載平台之一側,用以接收該檢測光,並產生一影像訊號;一影像處理模組,用以接收並處理該影像訊號,以量測該待測物靠近該平面之側邊與該平面間的一間隙高度,該影像處理模組連接一比對模組,該比對模組根據該間隙高度與一標準值之比對結果,輸出一檢測訊號,以判斷該間隙高度是否符合標準;以及一調光模組,連接於該比對模組與該發光模組之間,用以調整該發光模組的亮度。 A flatness detecting device includes: a carrying platform having a plane for carrying a test object and for transmitting a light; and a light emitting module disposed in the carrying platform for emitting the light, the light A detection light is generated by the object to be detected from the side of the plane and the plane; a light receiving module is located on one side of the carrier platform for receiving the detection light and generating an image signal; The image processing module is configured to receive and process the image signal to measure a gap height between the side of the object to be tested and the plane, and the image processing module is coupled to a comparison module. The module outputs a detection signal according to the ratio of the gap height to a standard value to determine whether the gap height meets the standard; and a dimming module connected to the comparison module and the illumination module For adjusting the brightness of the light-emitting module. 如申請專利範圍第1項所述之平整度檢測裝置,其中該待測物靠近該平面之側邊為該待測物之下緣。 The flatness detecting device of claim 1, wherein a side of the object to be tested near the plane is a lower edge of the object to be tested. 如申請專利範圍第1項所述之平整度檢測裝置,其中該光接收模組接收該檢測光的方向大略平行於該平面。 The flatness detecting device of claim 1, wherein the light receiving module receives the detected light in a direction substantially parallel to the plane. 如申請專利範圍第1項所述之平整度檢測裝置,其中當該待測物靠近該平面之側邊與該平面間的該間隙高度為一已知的間隙高度時,以該已知的間隙高度做為 該標準值,且該調光模組根據該間隙高度與該標準值之間的誤差值,調整該發光模組的亮度。 The flatness detecting device according to claim 1, wherein the known gap is when the height of the gap between the side of the object to be tested near the plane and the plane is a known gap height. Height as The standard value, and the dimming module adjusts the brightness of the light emitting module according to an error value between the gap height and the standard value. 如申請專利範圍第1項所述之平整度檢測裝置,其中該影像處理模組根據該影像訊號中代表該間隙高度的一亮紋訊號,搜尋該亮紋訊號對應該平面的第一邊緣以做為一基準線,再沿著垂直該基準線的方向找出與該亮紋訊號對應該側邊的第二邊緣相交的一座標點,並計算該座標點與該基準線之間的距離做為該間隙高度。 The flatness detecting device according to claim 1, wherein the image processing module searches for the first edge of the plane corresponding to the bright signal according to a bright signal representing the height of the gap in the image signal. a reference line, and then finding a punctuation point intersecting the second edge of the side corresponding to the bright-grain signal along the direction perpendicular to the reference line, and calculating a distance between the coordinate point and the reference line as the reference line Clearance height. 如申請專利範圍第5項所述之平整度檢測裝置,其中該亮紋訊號對應該平面的第一邊緣為該亮紋訊號之下緣,該亮紋訊號對應該側邊的第二邊緣為該亮紋訊號之上緣。 The flatness detecting device of claim 5, wherein the first edge of the bright-grain signal corresponding to the plane is the lower edge of the bright-grain signal, and the second edge of the bright-grain signal corresponding to the side is The upper edge of the bright signal. 如申請專利範圍第5項所述之平整度檢測裝置,其中該影像處理模組根據一區間中複數個座標點與該基準線之間的距離,計算該區間的平均間隙高度。 The flatness detecting device according to claim 5, wherein the image processing module calculates an average gap height of the interval according to a distance between the plurality of coordinate points in the interval and the reference line. 如申請專利範圍第1項所述之平整度檢測裝置,其中該發光模組包括複數個發光元件,該些發光元件環繞於該承載平台的內部,並朝該承載平台的該平面直射發光,或者是朝側壁發光並藉由反射將光線導向該平面。 The flatness detecting device of claim 1, wherein the light emitting module comprises a plurality of light emitting elements, the light emitting elements surround the inside of the carrying platform, and emit light directly toward the plane of the carrying platform, or It is illuminated toward the side wall and directs light to the plane by reflection. 一種平整度檢測方法,包括:將一待測物放置於一承載平台之平面上;調整一光線的亮度並使該光線由該待測物靠近該平面之側邊與該平面間射出而產生一檢測光; 對該檢測光進行一影像處理,以量測該待測物靠近該平面之側邊與該平面間的一間隙高度;以及根據該間隙高度與一標準值之比對結果,產生一檢測訊號,以判斷該間隙高度是否符合標準。 A flatness detecting method includes: placing a test object on a plane of a carrying platform; adjusting a brightness of a light and causing the light to be emitted from the side of the object close to the plane and the plane to generate a Detecting light; Performing an image processing on the detection light to measure a gap height between the side of the object to be tested near the plane and the plane; and generating a detection signal according to the ratio of the gap height to a standard value. To determine whether the gap height meets the standard. 如申請專利範圍第9項所述之平整度檢測方法,其中該待測物靠近該平面之側邊為該待測物之下緣。 The flatness detecting method according to claim 9, wherein the side of the object to be tested near the plane is the lower edge of the object to be tested. 如申請專利範圍第9項所述之平整度檢測方法,其中該檢測光射出的方向大略平行於該平面。 The flatness detecting method according to claim 9, wherein the direction in which the detecting light is emitted is substantially parallel to the plane. 如申請專利範圍第9項所述之平整度檢測方法,其中當該待測物靠近該平面之側邊與該平面間的該間隙高度為一已知的間隙高度時,更包括以該已知的間隙高度做為該標準值,並根據該間隙高度與該標準值之間的一誤差值,調整該檢測光的亮度。 The flatness detecting method according to claim 9, wherein when the height of the gap between the side of the object to be tested and the plane is a known gap height, the known The gap height is taken as the standard value, and the brightness of the detection light is adjusted according to an error value between the gap height and the standard value. 如申請專利範圍第9項所述之平整度檢測方法,其中進行該影像處理包括根據一影像訊號中代表該間隙高度的一亮紋訊號,搜尋該亮紋訊號對應該平面的第一邊緣以做為一基準線,再沿著垂直該基準線的方向找出與該亮紋訊號對應該側邊的第二邊緣相交的一座標點,以計算該座標點與該基準線之間的距離做為該間隙高度。 The method for detecting a flatness according to claim 9, wherein the performing the image processing comprises searching for a first edge of the plane corresponding to the brightness signal according to a brightness signal representing the height of the gap in an image signal a reference line, and then, along a direction perpendicular to the reference line, a punctuation point intersecting the second edge of the side corresponding to the bright-grain signal is found to calculate the distance between the coordinate point and the reference line as the reference line Clearance height. 如申請專利範圍第13項所述之平整度檢測方法,其中該亮紋訊號對應該平面的第一邊緣為該亮紋訊號之下緣,該亮紋訊號對應該側邊的第二邊緣為該亮紋訊號之上緣。 The method for detecting a flatness according to claim 13 , wherein the first edge of the bright-grain signal corresponding to the plane is the lower edge of the bright-grain signal, and the second edge of the bright-grain signal corresponding to the side is The upper edge of the bright signal. 如申請專利範圍第13項所述之平整度檢測方法,其中進行該影像處理包括根據一區間中複數個座標點 與該基準線之間的距離,計算該區間的平均間隙高度。 The method for detecting a flatness according to claim 13 wherein the image processing comprises performing a plurality of coordinate points according to an interval. The distance from the baseline is calculated as the average gap height of the interval.
TW101126732A 2012-07-25 2012-07-25 Flatness measurement device and measuring method thereof TWI460395B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101126732A TWI460395B (en) 2012-07-25 2012-07-25 Flatness measurement device and measuring method thereof
CN201210368108.7A CN103575240B (en) 2012-07-25 2012-09-28 Flatness detection device and detection method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101126732A TWI460395B (en) 2012-07-25 2012-07-25 Flatness measurement device and measuring method thereof

Publications (2)

Publication Number Publication Date
TW201405093A TW201405093A (en) 2014-02-01
TWI460395B true TWI460395B (en) 2014-11-11

Family

ID=50047538

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101126732A TWI460395B (en) 2012-07-25 2012-07-25 Flatness measurement device and measuring method thereof

Country Status (2)

Country Link
CN (1) CN103575240B (en)
TW (1) TWI460395B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103940379A (en) * 2014-03-31 2014-07-23 七海测量技术(深圳)有限公司 Method for measuring flatness of glass based on distorting mirror principle
CN103925892B (en) * 2014-04-30 2016-08-17 国家电网公司 Utilize the device of laser measurement metope or ground flat degree
TWI571611B (en) * 2015-12-11 2017-02-21 英業達股份有限公司 Flatness measuring device
CN106524907B (en) * 2016-10-18 2020-01-10 奇瑞汽车股份有限公司 Detection tool for cooling oil pipe of transmission
CN110039298B (en) * 2018-01-15 2020-06-19 浙江宇视科技有限公司 Flatness adjusting method and system
CN108396966A (en) * 2018-02-28 2018-08-14 黄群好 A kind of light sensation detection buildings waterproof constructing device
CN108385978A (en) * 2018-02-28 2018-08-10 黄群好 A kind of floor waterproof construction device with adjustable testing agency
CN108801198B (en) * 2018-04-18 2020-09-04 威创集团股份有限公司 Device for displaying flatness detection of large wall and detection method
CN109307488B (en) * 2018-11-14 2020-10-27 常州大学 Device and method for detecting installation flatness of piano white key
CN109520399B (en) * 2019-01-18 2020-11-03 南县伟业机械制造有限公司 Paddy field flatness detection system
CN113763322A (en) * 2021-07-30 2021-12-07 深圳顺络电子股份有限公司 Pin Pin coplanarity visual detection method and device
CN113701714A (en) * 2021-09-23 2021-11-26 深圳市微特精密科技股份有限公司 Method and device for identifying flattening calibration of DUT (device under test) by infrared reflection sensor
CN113834469A (en) * 2021-09-23 2021-12-24 深圳市微特精密科技股份有限公司 Method and device for identifying flattening calibration of DUT (device under test) by infrared reflection sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137820A (en) * 1992-10-27 1994-05-20 Chuo Riken:Kk Two-dimensional quantitative measuring method using one-dimensional ccd camera and its device
JPH0719855A (en) * 1993-06-30 1995-01-20 Nec Corp Flatness inspection apparatus
JPH09210652A (en) * 1996-02-02 1997-08-12 Komatsu Ltd Lead inspection device for ic package
TW200728683A (en) * 2005-12-06 2007-08-01 Shibaura Mechatronics Corp Surface roughness inspection apparatus
TW200839179A (en) * 2007-03-19 2008-10-01 Hon Hai Prec Ind Co Ltd Planeness measuring device and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4353479B2 (en) * 2004-10-08 2009-10-28 大日本スクリーン製造株式会社 Unevenness inspection apparatus, unevenness inspection method, and program for causing computer to inspect shading unevenness
CN101460809A (en) * 2006-03-21 2009-06-17 真理Ia有限责任公司 Method of, and apparatus for, measuring the quality of a surface of a substrate
CN101275827A (en) * 2007-03-27 2008-10-01 汉达精密电子(昆山)有限公司 Optical detect system and optical detect method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137820A (en) * 1992-10-27 1994-05-20 Chuo Riken:Kk Two-dimensional quantitative measuring method using one-dimensional ccd camera and its device
JPH0719855A (en) * 1993-06-30 1995-01-20 Nec Corp Flatness inspection apparatus
JPH09210652A (en) * 1996-02-02 1997-08-12 Komatsu Ltd Lead inspection device for ic package
TW200728683A (en) * 2005-12-06 2007-08-01 Shibaura Mechatronics Corp Surface roughness inspection apparatus
TW200839179A (en) * 2007-03-19 2008-10-01 Hon Hai Prec Ind Co Ltd Planeness measuring device and method

Also Published As

Publication number Publication date
CN103575240A (en) 2014-02-12
TW201405093A (en) 2014-02-01
CN103575240B (en) 2016-05-11

Similar Documents

Publication Publication Date Title
TWI460395B (en) Flatness measurement device and measuring method thereof
US11216687B2 (en) Image detection scanning method for object surface defects and image detection scanning system thereof
ES2910068T3 (en) Mobile and automated device for the detection and classification of damage to the bodywork of a vehicle
US9322644B2 (en) Method and apparatus for the examination of an object
CN107345789B (en) PCB hole position detection device and method
JP4740826B2 (en) Shape measuring device and shape measuring method
JP2017040600A (en) Inspection method, inspection device, image processor, program and record medium
CN106352850A (en) Sample levelness testing device and sample levelness testing method
TW201315965A (en) 3D vision inspection method and 3D vision inspection apparatus for light emitting diode
US9626752B2 (en) Method and apparatus for IC 3D lead inspection having color shadowing
CN106030240A (en) Visual inspection device and visual inspection method
CN104321614B (en) Method and apparatus for carrying out the process for the orientation of at least one rail that determines measuring station
KR102640295B1 (en) wafer measurement apparatus
US20170309035A1 (en) Measurement apparatus, measurement method, and article manufacturing method and system
US7345293B2 (en) Device and method for inspecting piston ring
JPH1123243A (en) Surface defect inspection device
KR101590552B1 (en) Curved spring shape inspection method
KR101374880B1 (en) Apparatus for testing LED
TWI528041B (en) The method of adjusting the displacement distance of the probe according to the horizontal position of the plurality of points to be measured
KR20230022725A (en) Lighting module inspection device for machine vision and light module inspection method for machine vision using thereof
JP6252178B2 (en) Shape measuring device, posture control device, structure manufacturing system, and shape measuring method
JP2005134294A (en) Method and apparatus for inspecting shape of cylindrical part
JP2015114297A (en) Measuring method and measurement program of opening length, and inspection device
CN104101482B (en) Light emitting module detection device and light emitting module detection method
JP2005322748A5 (en)