WO1997027619A3 - Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper - Google Patents
Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper Download PDFInfo
- Publication number
- WO1997027619A3 WO1997027619A3 PCT/DE1997/000130 DE9700130W WO9727619A3 WO 1997027619 A3 WO1997027619 A3 WO 1997027619A3 DE 9700130 W DE9700130 W DE 9700130W WO 9727619 A3 WO9727619 A3 WO 9727619A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling devices
- section elements
- shaped
- several metal
- manufacture
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 239000011324 bead Substances 0.000 abstract 3
- 238000005452 bending Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49924—Joining by deforming of parallel side-by-side elongated members
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Die Bonding (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP97907016A EP0956587A2 (de) | 1996-01-27 | 1997-01-17 | Verfahren zur herstellung von kühlkörpern zum anbau an halbleiterbauelemente |
AU19233/97A AU1923397A (en) | 1996-01-27 | 1997-01-17 | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method |
DE29712058U DE29712058U1 (de) | 1996-01-27 | 1997-01-17 | Kühlkörper zum Anbau an Halbleiterbauelemente sowie Teilprofile zur Herstellung solcher Kühlkörper |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1996102943 DE19602943C2 (de) | 1996-01-27 | 1996-01-27 | Verfahren zur Herstellung von Kühlkörpern zum Anbau an Halbleiterbauelemente sowie Schalenprofile zur Herstellung solcher Kühlkörper |
DE19602943.0 | 1996-01-27 | ||
DE19619207 | 1996-05-11 | ||
DE19619207.2 | 1996-05-11 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/584,803 Continuation US6279648B1 (en) | 1996-01-27 | 2000-05-31 | Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997027619A2 WO1997027619A2 (de) | 1997-07-31 |
WO1997027619A3 true WO1997027619A3 (de) | 1997-10-23 |
Family
ID=26022421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/000130 WO1997027619A2 (de) | 1996-01-27 | 1997-01-17 | Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper |
Country Status (5)
Country | Link |
---|---|
US (1) | US6279648B1 (de) |
EP (1) | EP0956587A2 (de) |
AU (1) | AU1923397A (de) |
DE (1) | DE29712058U1 (de) |
WO (1) | WO1997027619A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103228823B (zh) * | 2010-11-29 | 2016-09-14 | 原子能及能源替代委员会 | 半导体材料固结和/或结晶系统的热交换器 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10058574B4 (de) | 2000-11-24 | 2005-09-15 | Danfoss Drives A/S | Kühlgerät für Leistungshalbleiter |
DE10141988C1 (de) * | 2001-08-28 | 2003-01-09 | Manfred Diels | Verfahren zur Herstellung von Kühlkörpern |
US6637109B2 (en) * | 2001-09-27 | 2003-10-28 | Emerson Energy Systems Ab | Method for manufacturing a heat sink |
US6446709B1 (en) * | 2001-11-27 | 2002-09-10 | Wuh Choung Industrial Co., Ltd. | Combination heat radiator |
US6604575B1 (en) * | 2002-08-30 | 2003-08-12 | Southeastern Univer. Research Assn. Inc. | Heat exchange apparatus |
US6901993B2 (en) * | 2003-03-05 | 2005-06-07 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly having combined fins |
US20050145365A1 (en) * | 2003-12-24 | 2005-07-07 | Hung-Shen Chang | Guide flow heat sink |
CN2701072Y (zh) * | 2004-04-29 | 2005-05-18 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
TWI274539B (en) * | 2005-04-01 | 2007-02-21 | Delta Electronics Inc | Heat dissipating assembly with composite heat dissipating structure |
US20070223196A1 (en) * | 2006-03-22 | 2007-09-27 | Ming-Sho Kuo | Composite heatsink plate assembly |
TWI337837B (en) * | 2007-06-08 | 2011-02-21 | Ama Precision Inc | Heat sink and modular heat sink |
TWM341833U (en) * | 2008-02-01 | 2008-10-01 | Asia Vital Components Co Ltd | Assembling structure for radiator |
US20090260779A1 (en) * | 2008-04-21 | 2009-10-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having an improved fin structure |
TWM374257U (en) * | 2009-07-29 | 2010-02-11 | Asia Vital Components Co Ltd | Structure of heat dissipation unit and heat dissipator thereof |
CN102609060A (zh) * | 2011-01-19 | 2012-07-25 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
TWI516713B (zh) * | 2013-06-18 | 2016-01-11 | 旭闊系統股份有限公司 | Led照明裝置及其散熱器(二) |
TW201509286A (zh) * | 2013-08-29 | 2015-03-01 | Delta Electronics Inc | 組合式鋁擠型散熱器 |
CN105277037B (zh) * | 2015-10-26 | 2017-08-25 | 重庆盛镁镁业有限公司 | 扣合式导流式铝合金散热型材 |
DE202019101580U1 (de) * | 2019-03-20 | 2020-06-30 | Otto Fuchs - Kommanditgesellschaft - | Profilverbund |
DE102019107280A1 (de) * | 2019-03-21 | 2020-09-24 | apt Extrusions GmbH & Co. KG | Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands |
US11786959B2 (en) * | 2019-10-21 | 2023-10-17 | Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. | Double-sided expanded plate riveting structure and method |
GB2586094B (en) * | 2020-06-22 | 2022-06-15 | Zhong Qingchang | Rackless thermal-efficient modular power electronic system |
AU2021221639A1 (en) * | 2021-08-25 | 2023-03-16 | Redarc Technologies Pty Ltd | Modular and stackable electronics housing |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3415554A1 (de) * | 1983-04-30 | 1984-10-31 | Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid | Kuehlkoerper fuer leistungselektronische bauelemente |
FR2571546A1 (fr) * | 1984-10-08 | 1986-04-11 | Nixdorf Computer Ag | Bloc de refroidissement pour des composants et/ou des appareils electroniques |
EP0444595A1 (de) * | 1990-03-02 | 1991-09-04 | Behr GmbH & Co. | Wärmetauscher, insbesondere Ölkühler für Kraftfahrzeuge |
DE4134929A1 (de) * | 1991-10-23 | 1993-04-29 | Vaw Ver Aluminium Werke Ag | Verbundkoerper |
DE9315056U1 (de) * | 1993-10-05 | 1993-12-16 | Julius & August Erbslöh GmbH & Co, 42553 Velbert | Kühlkörper für Halbleiterbauelemente |
US5384948A (en) * | 1992-09-15 | 1995-01-31 | Valeo | Method of assembling a transverse plate with a crown ring of a torsion damper |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517472A (en) * | 1967-05-08 | 1970-06-30 | Anchor Enterprises Corp | Structural element with thermal barrier means |
US3735465A (en) * | 1969-01-21 | 1973-05-29 | Airco Inc | Assembling apparatus for rolling and clamping a part to a tubular member |
DE3518310A1 (de) | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
GB8807449D0 (en) | 1988-03-28 | 1988-05-05 | Semikron Ltd | Cooling electrical/electronic equipment |
US5042257A (en) * | 1989-05-01 | 1991-08-27 | Kendrick Julia S | Double extruded heat sink |
SE467070B (sv) | 1990-01-24 | 1992-05-18 | Pavel Cech | Anordning vid termoelektrisk kylare/vaermare |
JP2549817Y2 (ja) * | 1991-01-31 | 1997-10-08 | 株式会社椿本チエイン | マウントプレート及びガスケットが一体化された油圧式テンショナ |
DE9412818U1 (de) | 1994-03-01 | 1994-11-03 | AMA Audio-Mobile-Acoustic GmbH, 41363 Jüchen | Car Audio-Verstärker mit Zusatzkühlkörper |
DE9409517U1 (de) | 1994-06-13 | 1994-07-28 | Siemens AG, 80333 München | Kühlkörper |
TW265430B (en) * | 1994-06-30 | 1995-12-11 | Intel Corp | Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
DE29520474U1 (de) | 1995-12-23 | 1996-02-22 | Mark-Tronik Zubehör für die Elektronikindustrie GmbH, 58762 Altena | Quaderförmiger Kühlkörper |
US5689873A (en) * | 1996-01-11 | 1997-11-25 | Allfast Fastening Systems, Inc. | Tacking fastener |
-
1997
- 1997-01-17 DE DE29712058U patent/DE29712058U1/de not_active Expired - Lifetime
- 1997-01-17 EP EP97907016A patent/EP0956587A2/de not_active Withdrawn
- 1997-01-17 WO PCT/DE1997/000130 patent/WO1997027619A2/de not_active Application Discontinuation
- 1997-01-17 AU AU19233/97A patent/AU1923397A/en not_active Abandoned
-
2000
- 2000-05-31 US US09/584,803 patent/US6279648B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3415554A1 (de) * | 1983-04-30 | 1984-10-31 | Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid | Kuehlkoerper fuer leistungselektronische bauelemente |
FR2571546A1 (fr) * | 1984-10-08 | 1986-04-11 | Nixdorf Computer Ag | Bloc de refroidissement pour des composants et/ou des appareils electroniques |
EP0444595A1 (de) * | 1990-03-02 | 1991-09-04 | Behr GmbH & Co. | Wärmetauscher, insbesondere Ölkühler für Kraftfahrzeuge |
DE4134929A1 (de) * | 1991-10-23 | 1993-04-29 | Vaw Ver Aluminium Werke Ag | Verbundkoerper |
US5384948A (en) * | 1992-09-15 | 1995-01-31 | Valeo | Method of assembling a transverse plate with a crown ring of a torsion damper |
DE9315056U1 (de) * | 1993-10-05 | 1993-12-16 | Julius & August Erbslöh GmbH & Co, 42553 Velbert | Kühlkörper für Halbleiterbauelemente |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103228823B (zh) * | 2010-11-29 | 2016-09-14 | 原子能及能源替代委员会 | 半导体材料固结和/或结晶系统的热交换器 |
Also Published As
Publication number | Publication date |
---|---|
AU1923397A (en) | 1997-08-20 |
WO1997027619A2 (de) | 1997-07-31 |
EP0956587A2 (de) | 1999-11-17 |
DE29712058U1 (de) | 1998-04-02 |
US6279648B1 (en) | 2001-08-28 |
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