WO1997027619A3 - Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper - Google Patents

Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper Download PDF

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Publication number
WO1997027619A3
WO1997027619A3 PCT/DE1997/000130 DE9700130W WO9727619A3 WO 1997027619 A3 WO1997027619 A3 WO 1997027619A3 DE 9700130 W DE9700130 W DE 9700130W WO 9727619 A3 WO9727619 A3 WO 9727619A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling devices
section elements
shaped
several metal
manufacture
Prior art date
Application number
PCT/DE1997/000130
Other languages
English (en)
French (fr)
Other versions
WO1997027619A2 (de
Inventor
Manfred Diels
Joachim Bayer
Original Assignee
Manfred Diels
Joachim Bayer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1996102943 external-priority patent/DE19602943C2/de
Application filed by Manfred Diels, Joachim Bayer filed Critical Manfred Diels
Priority to EP97907016A priority Critical patent/EP0956587A2/de
Priority to AU19233/97A priority patent/AU1923397A/en
Priority to DE29712058U priority patent/DE29712058U1/de
Publication of WO1997027619A2 publication Critical patent/WO1997027619A2/de
Publication of WO1997027619A3 publication Critical patent/WO1997027619A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49915—Overedge assembling of seated part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49924—Joining by deforming of parallel side-by-side elongated members

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

Verfahren zur Herstellung von aus mehreren Teilprofilen (1, 2) aus Metall bestehenden Kühlkörpern, bei dem an den Teilprofilen ausgebildete Nuten (112, 122, 212, 232) und Stegleisten (111, 211, 231) jeweils ineinandergesteckt und in Querrichtung durch Druckbeaufschlagung verbunden werden. Dabei werden nach außen abstehende bzw. vorstehende Nutwandungen bzw. Stege (121, 221, 233) eines Teilprofiles (1, 2) in entsprechende Nuten (122, 212, 232) eines benachbarten Teilprofiles (1, 2) nach innen gebogen und/oder mit plastischer Verformung gedrückt zur formschlüssigen Verklammerung der in die zugehörige Nut jeweils eingreifenden Stegleiste.
PCT/DE1997/000130 1996-01-27 1997-01-17 Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper WO1997027619A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP97907016A EP0956587A2 (de) 1996-01-27 1997-01-17 Verfahren zur herstellung von kühlkörpern zum anbau an halbleiterbauelemente
AU19233/97A AU1923397A (en) 1996-01-27 1997-01-17 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
DE29712058U DE29712058U1 (de) 1996-01-27 1997-01-17 Kühlkörper zum Anbau an Halbleiterbauelemente sowie Teilprofile zur Herstellung solcher Kühlkörper

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE1996102943 DE19602943C2 (de) 1996-01-27 1996-01-27 Verfahren zur Herstellung von Kühlkörpern zum Anbau an Halbleiterbauelemente sowie Schalenprofile zur Herstellung solcher Kühlkörper
DE19602943.0 1996-01-27
DE19619207 1996-05-11
DE19619207.2 1996-05-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US09/584,803 Continuation US6279648B1 (en) 1996-01-27 2000-05-31 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method

Publications (2)

Publication Number Publication Date
WO1997027619A2 WO1997027619A2 (de) 1997-07-31
WO1997027619A3 true WO1997027619A3 (de) 1997-10-23

Family

ID=26022421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/000130 WO1997027619A2 (de) 1996-01-27 1997-01-17 Verfahren zur herstellung von aus mehreren teilprofilen aus metall bestehenden kühlkörpern zum anbau an halbleiterbauelemente sowie profile zur herstellung solcher kühlkörper und nach dem verfahren hergestellte kühlkörper

Country Status (5)

Country Link
US (1) US6279648B1 (de)
EP (1) EP0956587A2 (de)
AU (1) AU1923397A (de)
DE (1) DE29712058U1 (de)
WO (1) WO1997027619A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228823B (zh) * 2010-11-29 2016-09-14 原子能及能源替代委员会 半导体材料固结和/或结晶系统的热交换器

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DE10058574B4 (de) 2000-11-24 2005-09-15 Danfoss Drives A/S Kühlgerät für Leistungshalbleiter
DE10141988C1 (de) * 2001-08-28 2003-01-09 Manfred Diels Verfahren zur Herstellung von Kühlkörpern
US6637109B2 (en) * 2001-09-27 2003-10-28 Emerson Energy Systems Ab Method for manufacturing a heat sink
US6446709B1 (en) * 2001-11-27 2002-09-10 Wuh Choung Industrial Co., Ltd. Combination heat radiator
US6604575B1 (en) * 2002-08-30 2003-08-12 Southeastern Univer. Research Assn. Inc. Heat exchange apparatus
US6901993B2 (en) * 2003-03-05 2005-06-07 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly having combined fins
US20050145365A1 (en) * 2003-12-24 2005-07-07 Hung-Shen Chang Guide flow heat sink
CN2701072Y (zh) * 2004-04-29 2005-05-18 鸿富锦精密工业（深圳）有限公司 散热装置
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
US20070223196A1 (en) * 2006-03-22 2007-09-27 Ming-Sho Kuo Composite heatsink plate assembly
TWI337837B (en) * 2007-06-08 2011-02-21 Ama Precision Inc Heat sink and modular heat sink
TWM341833U (en) * 2008-02-01 2008-10-01 Asia Vital Components Co Ltd Assembling structure for radiator
US20090260779A1 (en) * 2008-04-21 2009-10-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having an improved fin structure
TWM374257U (en) * 2009-07-29 2010-02-11 Asia Vital Components Co Ltd Structure of heat dissipation unit and heat dissipator thereof
CN102609060A (zh) * 2011-01-19 2012-07-25 鸿富锦精密工业（深圳）有限公司 散热装置
TWI516713B (zh) * 2013-06-18 2016-01-11 旭闊系統股份有限公司 Led照明裝置及其散熱器(二)
TW201509286A (zh) * 2013-08-29 2015-03-01 Delta Electronics Inc 組合式鋁擠型散熱器
CN105277037B (zh) * 2015-10-26 2017-08-25 重庆盛镁镁业有限公司 扣合式导流式铝合金散热型材
DE202019101580U1 (de) * 2019-03-20 2020-06-30 Otto Fuchs - Kommanditgesellschaft - Profilverbund
DE102019107280A1 (de) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands
US11786959B2 (en) * 2019-10-21 2023-10-17 Huizhou Hanxu Hardware & Plastic Technology Co., Ltd. Double-sided expanded plate riveting structure and method
GB2586094B (en) * 2020-06-22 2022-06-15 Zhong Qingchang Rackless thermal-efficient modular power electronic system
AU2021221639A1 (en) * 2021-08-25 2023-03-16 Redarc Technologies Pty Ltd Modular and stackable electronics housing

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DE3415554A1 (de) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Kuehlkoerper fuer leistungselektronische bauelemente
FR2571546A1 (fr) * 1984-10-08 1986-04-11 Nixdorf Computer Ag Bloc de refroidissement pour des composants et/ou des appareils electroniques
EP0444595A1 (de) * 1990-03-02 1991-09-04 Behr GmbH & Co. Wärmetauscher, insbesondere Ölkühler für Kraftfahrzeuge
DE4134929A1 (de) * 1991-10-23 1993-04-29 Vaw Ver Aluminium Werke Ag Verbundkoerper
DE9315056U1 (de) * 1993-10-05 1993-12-16 Julius & August Erbslöh GmbH & Co, 42553 Velbert Kühlkörper für Halbleiterbauelemente
US5384948A (en) * 1992-09-15 1995-01-31 Valeo Method of assembling a transverse plate with a crown ring of a torsion damper

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Publication number Priority date Publication date Assignee Title
DE3415554A1 (de) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Kuehlkoerper fuer leistungselektronische bauelemente
FR2571546A1 (fr) * 1984-10-08 1986-04-11 Nixdorf Computer Ag Bloc de refroidissement pour des composants et/ou des appareils electroniques
EP0444595A1 (de) * 1990-03-02 1991-09-04 Behr GmbH & Co. Wärmetauscher, insbesondere Ölkühler für Kraftfahrzeuge
DE4134929A1 (de) * 1991-10-23 1993-04-29 Vaw Ver Aluminium Werke Ag Verbundkoerper
US5384948A (en) * 1992-09-15 1995-01-31 Valeo Method of assembling a transverse plate with a crown ring of a torsion damper
DE9315056U1 (de) * 1993-10-05 1993-12-16 Julius & August Erbslöh GmbH & Co, 42553 Velbert Kühlkörper für Halbleiterbauelemente

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103228823B (zh) * 2010-11-29 2016-09-14 原子能及能源替代委员会 半导体材料固结和/或结晶系统的热交换器

Also Published As

Publication number Publication date
AU1923397A (en) 1997-08-20
WO1997027619A2 (de) 1997-07-31
EP0956587A2 (de) 1999-11-17
DE29712058U1 (de) 1998-04-02
US6279648B1 (en) 2001-08-28

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