WO1997003365A2 - Laser-induced metallic plasma for con-contact inspection - Google Patents

Laser-induced metallic plasma for con-contact inspection Download PDF

Info

Publication number
WO1997003365A2
WO1997003365A2 PCT/US1996/011698 US9611698W WO9703365A2 WO 1997003365 A2 WO1997003365 A2 WO 1997003365A2 US 9611698 W US9611698 W US 9611698W WO 9703365 A2 WO9703365 A2 WO 9703365A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductor
probes
plasma
laser
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1996/011698
Other languages
English (en)
French (fr)
Other versions
WO1997003365A3 (en
Inventor
David Banitt
Moshe Ben Shlomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXSIGHT ELECTRO OPTICAL SYSTEMS Ltd
Exsight Ltd
Original Assignee
EXSIGHT ELECTRO OPTICAL SYSTEMS Ltd
Exsight Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXSIGHT ELECTRO OPTICAL SYSTEMS Ltd, Exsight Ltd filed Critical EXSIGHT ELECTRO OPTICAL SYSTEMS Ltd
Priority to JP9506021A priority Critical patent/JPH11509321A/ja
Priority to AU64930/96A priority patent/AU6493096A/en
Priority to KR1019980700131A priority patent/KR19990028830A/ko
Priority to EP96924495A priority patent/EP0882237A2/en
Publication of WO1997003365A2 publication Critical patent/WO1997003365A2/en
Publication of WO1997003365A3 publication Critical patent/WO1997003365A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation

Definitions

  • the present invention relates to electrical inspection
  • LCD liquid crystal display
  • MCM multi chip modules
  • integrated circuit integrated circuit
  • probes' method use metallic probes mounted on an X-Y
  • the probes are made to touch a conductor at
  • the probes are electrically continuous. Inversely, the probes can be made to
  • non-contact methods make use of an electrically-conductive laser-
  • a laser is directed to a grid located above the electronic
  • the laser induces a discharge from the grid across
  • Electrons emitted from the grid serve to close the circuit
  • the present invention successfully addresses the shortcomings of the presently known configurations by providing an apparatus and
  • the present invention discloses a novel system and apparatus
  • FIG. 1 is a schematic side view of a laser and a probe useful in
  • FIG. 2 is a top view of one possible two-probe configuration of
  • the present invention is of a system and method for the non ⁇
  • the apparatus makes use of a
  • laser source 11 ( Figure 2) and includes means for directing laser
  • the source of pulsed laser radiation may be any convenient
  • Nd:YLF Q-switched Nd:YLF or Nd:YAG
  • the laser radiation preferably having an appropriate energy level.
  • the method may be conducted from the source using an optical fiber 10.
  • radiation may be focused with the help of a lens 12, or other focusing optics, onto a particular point in a conductor 14, typically made of
  • metal such as copper, which forms part of the electrical part being
  • test tested such as a printed circuit board, an integrated circuit, and the
  • a detector means 18 which is responsive to the amount of
  • parameter or parameters measured by detector means 18 may be any parameter or parameters measured by detector means 18.
  • a gas inlet pipe 20 may be introduced to the region through a gas inlet pipe 20.
  • the part being tested as well as probe 16 may be located
  • a closed chamber 22 which may be filled with gas, such as argon.
  • gas such as argon.
  • the gas may be at any desirable pressure including atmospheric
  • probe 16 and the rest of the assembly are referred to
  • X-Y positioning system 24 shown in more detail in
  • More than a single pair of probes 16 may be used. For each pair
  • the beam may be achieved by any suitable technique including, but not limited
  • optical fibers 10 are focused on two different points on conductor
  • Mechanism 30 may, for example, an autofocusing system

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
PCT/US1996/011698 1995-07-12 1996-07-11 Laser-induced metallic plasma for con-contact inspection Ceased WO1997003365A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9506021A JPH11509321A (ja) 1996-07-11 1996-07-11 非接触検査のための、レーザ誘導の金属プラズマ
AU64930/96A AU6493096A (en) 1995-07-12 1996-07-11 Laser-induced metallic plasma for con-contact inspection
KR1019980700131A KR19990028830A (ko) 1995-07-12 1996-07-11 비 접촉검사용 레이저 유도 금속성 플라즈마
EP96924495A EP0882237A2 (en) 1995-07-12 1996-07-11 Laser-induced metallic plasma for con-contact inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/501,685 US5587664A (en) 1995-07-12 1995-07-12 Laser-induced metallic plasma for non-contact inspection

Publications (2)

Publication Number Publication Date
WO1997003365A2 true WO1997003365A2 (en) 1997-01-30
WO1997003365A3 WO1997003365A3 (en) 1997-04-10

Family

ID=23994608

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1996/011698 Ceased WO1997003365A2 (en) 1995-07-12 1996-07-11 Laser-induced metallic plasma for con-contact inspection

Country Status (5)

Country Link
US (1) US5587664A (enExample)
EP (1) EP0882237A2 (enExample)
KR (1) KR19990028830A (enExample)
AU (1) AU6493096A (enExample)
WO (1) WO1997003365A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07140209A (ja) * 1993-09-20 1995-06-02 Fujitsu Ltd 回路配線基板の検査装置およびその検査方法
IL122654A0 (en) * 1997-12-18 1998-08-16 Exsight Electro Optical System Method and apparatus for guiding electric current
US6020747A (en) * 1998-01-26 2000-02-01 Bahns; John T. Electrical contact probe
WO1999056137A1 (en) * 1998-04-27 1999-11-04 Exsight Electro-Optical Systems Ltd. Method and apparatus for testing interconnect networks
WO1999056136A1 (en) * 1998-04-27 1999-11-04 Exsight Electro-Optical Systems Ltd. Method and apparatus for testing interconnect networks using guided electric currents
US6268719B1 (en) * 1998-09-23 2001-07-31 Delaware Capital Formation, Inc. Printed circuit board test apparatus
US6788078B2 (en) 2001-11-16 2004-09-07 Delaware Capital Formation, Inc. Apparatus for scan testing printed circuit boards
EP1692530A4 (en) * 2003-11-12 2011-01-05 Ibm IONIZATION TEST FOR ELECTRICAL VERIFICATION
EP2732299A4 (en) 2011-07-15 2015-03-25 Orbotech Ltd ELECTRICAL TESTING OF ELECTRONIC DEVICES BY MEANS OF ELECTRON BEAM-INDUCED PLASMA STONES
US10488852B2 (en) * 2015-03-12 2019-11-26 Limacorporate S.P.A. Quality control method for regulating the operation of an electromechanical apparatus, for example an EBM apparatus, in order to obtain certified processed products

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246793A (en) * 1979-02-08 1981-01-27 Battelle Development Corporation Nondestructive testing
US4417203A (en) * 1981-05-26 1983-11-22 International Business Machines Corporation System for contactless electrical property testing of multi-layer ceramics
US4415851A (en) * 1981-05-26 1983-11-15 International Business Machines Corporation System for contactless testing of multi-layer ceramics
US4507605A (en) * 1982-05-17 1985-03-26 Testamatic, Incorporated Method and apparatus for electrical and optical inspection and testing of unpopulated printed circuit boards and other like items
DE3231598A1 (de) * 1982-08-25 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zur elektrischen pruefung von mikroverdrahtungen
US4985681A (en) * 1985-01-18 1991-01-15 Siemens Aktiengesellschaft Particle beam measuring method for non-contact testing of interconnect networks
DE3671106D1 (de) * 1985-09-04 1990-06-13 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
ATE52620T1 (de) * 1985-09-04 1990-05-15 Siemens Ag Vorrichtung fuer die elektrische funktionspruefung von verdrahtungsfeldern, insbesondere von leiterplatten.
US4845425A (en) * 1985-09-23 1989-07-04 International Business Machines Corporation Full chip integrated circuit tester
US4703260A (en) * 1985-09-23 1987-10-27 International Business Machines Corporation Full chip integrated circuit tester
US4771230A (en) * 1986-10-02 1988-09-13 Testamatic Corporation Electro-luminescent method and testing system for unpopulated printed circuit boards, ceramic substrates, and the like having both electrical and electro-optical read-out
DE3683053D1 (de) * 1986-10-23 1992-01-30 Ibm Verfahren zur kontaktfreien pruefung von platinen fuer integrierte schaltungen unter atmosphaerischen bedingungen.
EP0264481B1 (en) * 1986-10-23 1992-05-13 International Business Machines Corporation Testing method for integrated circuit packaging boards using a laser in vacuum
US4843330A (en) * 1986-10-30 1989-06-27 International Business Machines Corporation Electron beam contactless testing system with grid bias switching
EP0285798A3 (de) * 1987-03-31 1990-03-07 Siemens Aktiengesellschaft Vorrichtung für die elektrische Funktionsprüfung von Verdrahtungsfeldern, insbesondere von Leiterplatten
ATE104059T1 (de) * 1987-12-21 1994-04-15 Siemens Ag Ansteuereinrichtung fuer die vorrichtung zur elektrischen funktionspruefung von verdrahtungsfeldern.
US5032788A (en) * 1989-06-26 1991-07-16 Digital Equipment Corp. Test cell for non-contact opens/shorts testing of electrical circuits
US4970461A (en) * 1989-06-26 1990-11-13 Lepage Andrew J Method and apparatus for non-contact opens/shorts testing of electrical circuits
US5017863A (en) * 1989-10-20 1991-05-21 Digital Equipment Corporation Electro-emissive laser stimulated test
US5179279A (en) * 1991-01-25 1993-01-12 Rensselaer Polytechnic Institute Non-contact electrical pathway
US5202623A (en) * 1992-02-26 1993-04-13 Digital Equipment Corporation Laser-activated plasma chamber for non-contact testing
JPH07140209A (ja) * 1993-09-20 1995-06-02 Fujitsu Ltd 回路配線基板の検査装置およびその検査方法

Also Published As

Publication number Publication date
EP0882237A4 (enExample) 1998-12-09
AU6493096A (en) 1997-02-10
EP0882237A2 (en) 1998-12-09
KR19990028830A (ko) 1999-04-15
US5587664A (en) 1996-12-24
WO1997003365A3 (en) 1997-04-10

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