WO1996041359B1 - Improved method and apparatus for a surface-mounted fuse device - Google Patents
Improved method and apparatus for a surface-mounted fuse deviceInfo
- Publication number
- WO1996041359B1 WO1996041359B1 PCT/US1996/009147 US9609147W WO9641359B1 WO 1996041359 B1 WO1996041359 B1 WO 1996041359B1 US 9609147 W US9609147 W US 9609147W WO 9641359 B1 WO9641359 B1 WO 9641359B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- fusible link
- conductive
- layer
- mount fuse
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract 33
- 239000011241 protective layer Substances 0.000 claims abstract 9
- 239000010409 thin film Substances 0.000 claims abstract 7
- 239000000463 material Substances 0.000 claims abstract 6
- 239000004593 Epoxy Substances 0.000 claims abstract 2
- 239000004642 Polyimide Substances 0.000 claims abstract 2
- 229920001721 Polyimide Polymers 0.000 claims abstract 2
- 125000003700 epoxy group Chemical group 0.000 claims abstract 2
- 230000003647 oxidation Effects 0.000 claims abstract 2
- 238000007254 oxidation reaction Methods 0.000 claims abstract 2
- 239000004814 polyurethane Substances 0.000 claims abstract 2
- 229920002635 polyurethane Polymers 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims 40
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 4
- -1 tin-lead Chemical compound 0.000 claims 4
- 239000011253 protective coating Substances 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Abstract
A thin film surface-mount fuse (58) having two material subassemblies. The first subassembly includes a fusible link (42), its supporting substrate (13) and terminal pads (34, 36). The second subassembly includes a protective layer (56) which overlies the fusible link (42) so as to provide protection from impacts and oxidation. The protective layer (56) is preferably made of a polymeric material. The most preferred polymeric material is a polyurethane gel or paste. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
Claims
1. A thin film surface-mount fuse, said fuse comprising two material subassemblies: a. the first subassembly comprising a fusible link, a supporting substrate and terminal pads including a plurality of conductive terminal pad layers, the supporting substrate having an upper surface, lower surface and opposing side surfaces, each of the opposing side surfaces having a groove therein, a first of the plurality of conductive terminal pad layers and the fusible link formed as a single-continuous layer and extending across the upper surface of the supporting substrate, the first of the conductive terminal pad layers further extending over the grooves of the opposing side surfaces; and, b. the second subassembly comprising a single protective layer which overlies the fusible link so as to provide protection from impacts and oxidation.
2. The surface-mount fuse of Claim 1, wherein said protective layer is made of a polymeric material.
3. The surface-mount fuse of Claim 1, wherein said protective layer is made of polyurethane. 36
4. The surface-mount fuse of Claim 1, wherein said supporting substrate is made of an FR-4 epoxy or a polyimide.
5. The surface-mount fuse of Claim
1, wherein said protective layer is clear and colorless.
6. The surface-mount fuse of Claim
2, wherein said polymeric material is clear and colored.
7. A method for the manufacture of a thin film surface-mount fuse comprising the steps of: a. providing a substrate having a 5 top, a bottom and opposing sides, the opposing sides each having a groove therein; and, b. depositing, upon the top of the substrate, a first conductive layer to simultaneously form a fusible link and
10 terminal pads at opposite ends of the fusible link, the fusible link and terminal pads being electrically connected.
8. The method as set forth in Claim 7 wherein the first conductive layer extends from the top of the substrate and is deposited upon a portion of the sides of the
5 substrate so that the terminal pads extend from the top of the substrate to a portion of the sides of the substrate.
9. The method as set forth in Claim 7, wherein the first conductive layer which forms said fusible link and terminal pads is deposited by vapor deposition.
10. The method as set forth in Claim 7, wherein the first conductive layer which forms said fusible link and terminal pads is electrochemically deposited.
11. A method of protecting a thin film surface-mount fuse having a fusible link and terminal pads, the terminal pads having a plurality of conductive terminal pad layers
5 and the substrate having a top, a bottom and opposing side surfaces, each of the opposing side surfaces having a groove therein, wherein a first of the plurality of conductive terminal pad layers and the fusible link form
10 a single continuous film which extends across the top surface of the substrate, the first of the conductive terminal pad layers further extending over the grooves of the opposing side surfaces and terminating on the lower
15 surface of the substrate, said method comprising placing a single protective layer over the entire top surface of the substrate.
38
12. A thin film surface mount fuse comprising: a. a substrate, having opposing side surfaces, each of the opposing side
5 surfaces having a groove therein; b. a fusible link and a first terminal pad layer formed as a single continuous layer disposed on the substrate, wherein the fusible link and the first
10 terminal pad layer are made of a metal selected from a group consisting of copper, silver, nickel, titanium, aluminum and alloys thereof; c. a second terminal pad layer 15 disposed on the first terminal pad layer, wherein the second terminal pad is made of the same metal as the first layer; d. a third terminal pad layer disposed on the second terminal pad layer,
20 wherein the third terminal pad layer is made of nickel; and, e. a fourth terminal pad layer disposed on the third terminal pad layer, wherein the fourth terminal pad layer is made
25 of tin-lead or tin.
13. The surface mount fuse of Claim 12, wherein the fusible link has a central portion with a tin-lead spot being disposed on the central portion.
14. The surface mount fuse of Claim 12, wherein a protective coating is applied over the fusible link. 39
15. The surface mount fuse of Claim 14, wherein the protective coating is also applied over a portion of the fourth terminal pad layer.
40
16. A thin film surface-mount fuse, said fuse comprising: a. a substrate, having opposing side surfaces, each of the opposing side
5 surfaces having a groove therein; b. a fusible link made of a first conductive metal deposited on the substrate; c. a second conductive metal, other than the first conductive metal,
10 deposited on the surface of the fusible link; d. terminal pads electrically connected to the fusible link, the terminal pads having a plurality of conductive layers, wherein a first of the plurality of conductive
15 layers and the fusible link form a single continuous film.
17. The device of Claim 16, wherein a second of the plurality of conductive layers is deposited on the first of the plurality of conductive layers and consists of the same
5 metal as the first conductive metal.
18. The device of Claim 17, wherein a third of the plurality of conductive layers is deposited on the second of the plurality of conductive layers and consists of nickel.
19. The device of Claim 18, wherein a fourth of the plurality of conductive layers is deposited on the third of the plurality of conductive layers and consists of tin-lead. 41
20. The surface-mount fuse of Claim 16, wherein the first conductive metal is selected from the group including copper, silver, nickel, titanium, aluminum or alloys
5 thereof.
21. The surface-mount fuse of Claim 16, wherein the second conductive metal is a tin-lead alloy.
22. The surface-mount fuse of Claim
21, wherein the second conductive metal is deposited onto the fusible link in the form of a rectangle.
23. The surface-mount fuse of Claim
22, wherein the fusible link has a central portion and the rectangle is deposited along the central portion of said fusible link.
24. The surface mount fuse of Claim 1, wherein the first conductive layer terminates on the lower surface of the substrate.
25. The surface mount fuse of Claim 12, wherein the first, second, third and fourth conductive layers extend over the grooves of the opposing side surfaces of the substrate.
26. The surface mount fuse of Claim 12, wherein the fusible link has a central 42
portion, the central portion having a tin-lead or tin spot thereon.
27. The surface mount fuse of Claim 12, wherein a protective coating is applied over the fusible link.
28. The method of Claim 8, wherein the first conductive layer is deposited in the grooves of the sides of the substrate so that the terminal pads are in the grooves of the substrate.
29. The method of Claim 8, wherein the first conductive layer extends from the sides of the substrate and is deposited on a portion of the bottom of the substrate so that the terminal pads extend onto a portion of the bottom of the substrate.
43
30. A method of manufacturing a thin film surface-mount fuse comprising the steps of: a. providing a substrate having a 5 upper surface, a lower surface and a pair of bores; and, b. depositing a first conductive layer on the upper surface of the substrate to simultaneously form a fusible link and
10 terminal pads on the upper surface of the substrate, the fusible link being deposited between the pair of bores and being electrically connected to the terminal pads.
31. The method of Claim 30, wherein the first conductive layer extends from the upper surface of the substrate into the bores so that the terminal pads extend from the
5 upper surface into the bores.
32. The method of Claim 31, wherein the first conductive layer extends from the bores and terminates on the lower surface of the substrate so that the terminal pads extend
5 from the bores and terminate on the lower surface of the substrate.
33. The method of Claim 32, further including the step of depositing one or more additional conductive layers on top of the terminal pads. 44
34. The method of Claim 33, further including the step of depositing a metallic spot onto the fusible link.
35. The method of Claim 34, further including the step of covering the fusible link with a protective layer.
36. The method of Claim 35, wherein the protective layer is applied to the fusible link using a stencil printing machine.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU61547/96A AU6154796A (en) | 1995-06-07 | 1996-06-06 | Improved method and apparatus for a surface-mounted fuse dev ice |
| JP9501537A JPH10512094A (en) | 1995-06-07 | 1996-06-06 | Thin film surface mount fuse and method of manufacturing the same |
| DK96919129T DK0830704T3 (en) | 1995-06-07 | 1996-06-06 | Improved method and apparatus for a surface mounted fuse |
| DE69600974T DE69600974T2 (en) | 1995-06-07 | 1996-06-06 | IMPROVED METHOD AND DEVICE FOR SURFACE MOUNTED LOCKING DEVICE |
| EP96919129A EP0830704B1 (en) | 1995-06-07 | 1996-06-06 | Improved method and apparatus for a surface-mounted fuse device |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47256395A | 1995-06-07 | 1995-06-07 | |
| US08/482,829 | 1995-06-07 | ||
| US08/482,829 US5943764A (en) | 1994-05-27 | 1995-06-07 | Method of manufacturing a surface-mounted fuse device |
| US08/472,563 | 1995-06-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1996041359A1 WO1996041359A1 (en) | 1996-12-19 |
| WO1996041359B1 true WO1996041359B1 (en) | 1997-02-06 |
Family
ID=27043825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1996/009147 WO1996041359A1 (en) | 1995-06-07 | 1996-06-06 | Improved method and apparatus for a surface-mounted fuse device |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0830704B1 (en) |
| JP (1) | JPH10512094A (en) |
| CN (1) | CN1191624A (en) |
| AT (1) | ATE173355T1 (en) |
| AU (1) | AU6154796A (en) |
| CA (1) | CA2224070A1 (en) |
| DE (1) | DE69600974T2 (en) |
| DK (1) | DK0830704T3 (en) |
| ES (1) | ES2124634T3 (en) |
| WO (1) | WO1996041359A1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923239A (en) * | 1997-12-02 | 1999-07-13 | Littelfuse, Inc. | Printed circuit board assembly having an integrated fusible link |
| CN1192413C (en) | 1998-04-24 | 2005-03-09 | 威克曼工厂股份有限公司 | Electrical fuse element |
| US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
| GB0001573D0 (en) * | 2000-01-24 | 2000-03-15 | Welwyn Components Ltd | Printed circuit board with fuse |
| US7489229B2 (en) | 2001-06-11 | 2009-02-10 | Wickmann-Werke Gmbh | Fuse component |
| US7551048B2 (en) | 2002-08-08 | 2009-06-23 | Fujitsu Component Limited | Micro-relay and method of fabricating the same |
| CN101197351B (en) * | 2006-12-05 | 2010-09-01 | 邱鸿智 | Slow fusing type fuse structure of chip and its production method |
| CN101894717B (en) * | 2009-05-21 | 2012-10-24 | 邱鸿智 | Fuse structure provided with drilling electrode and die coating and manufacturing method thereof |
| US9117615B2 (en) | 2010-05-17 | 2015-08-25 | Littlefuse, Inc. | Double wound fusible element and associated fuse |
| JP5505142B2 (en) * | 2010-07-06 | 2014-05-28 | 富士通株式会社 | Fuse and manufacturing method thereof |
| CN101964287B (en) * | 2010-10-22 | 2013-01-23 | 广东风华高新科技股份有限公司 | Film chip fuse and preparation method thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4164725A (en) * | 1977-08-01 | 1979-08-14 | Wiebe Gerald L | Three-piece solderless plug-in electrically conducting component |
| GB1604820A (en) * | 1978-05-30 | 1981-12-16 | Laur Knudson Nordisk Elektrici | Electrical safety fuses |
| DE3044711A1 (en) * | 1980-11-27 | 1982-07-01 | Wickmann-Werke GmbH, 5810 Witten | FUSE PROTECTION |
| DE3530354A1 (en) * | 1985-08-24 | 1987-03-05 | Opel Adam Ag | ELECTRICAL FUSE ARRANGEMENT |
| JPH0831303B2 (en) * | 1986-12-01 | 1996-03-27 | オムロン株式会社 | Chip type fuse |
| DE69104977T2 (en) * | 1990-03-13 | 1995-05-04 | Morrill Glasstek, Inc., Maryland Heights, Mo. | ELECTRICAL COMPONENT (FUSE) AND THEIR PRODUCTION PROCESS. |
| JPH0433230A (en) * | 1990-05-29 | 1992-02-04 | Mitsubishi Materials Corp | Chip type fuse |
| JPH04248221A (en) * | 1991-01-23 | 1992-09-03 | Hitachi Chem Co Ltd | Manufacture of chip type fuse |
| JPH04245132A (en) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | Base for chip fuse and chip fuse using it |
| JPH04245129A (en) * | 1991-01-30 | 1992-09-01 | Hitachi Chem Co Ltd | Chip type fuse |
| JPH04255627A (en) * | 1991-02-08 | 1992-09-10 | Hitachi Chem Co Ltd | Manufacture of chip-type fuse |
| JPH05166454A (en) * | 1991-12-11 | 1993-07-02 | Hitachi Chem Co Ltd | Chip type fuse |
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| JPH0636672A (en) * | 1992-07-16 | 1994-02-10 | Sumitomo Wiring Syst Ltd | Card type fuse and manufacture thereof |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
-
1996
- 1996-06-06 DE DE69600974T patent/DE69600974T2/en not_active Expired - Lifetime
- 1996-06-06 DK DK96919129T patent/DK0830704T3/en active
- 1996-06-06 CA CA002224070A patent/CA2224070A1/en not_active Abandoned
- 1996-06-06 JP JP9501537A patent/JPH10512094A/en active Pending
- 1996-06-06 AT AT96919129T patent/ATE173355T1/en not_active IP Right Cessation
- 1996-06-06 ES ES96919129T patent/ES2124634T3/en not_active Expired - Lifetime
- 1996-06-06 AU AU61547/96A patent/AU6154796A/en not_active Abandoned
- 1996-06-06 WO PCT/US1996/009147 patent/WO1996041359A1/en not_active Application Discontinuation
- 1996-06-06 EP EP96919129A patent/EP0830704B1/en not_active Expired - Lifetime
- 1996-06-06 CN CN96195755A patent/CN1191624A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9916921B2 (en) | Resistor and method for making same | |
| US6023028A (en) | Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components | |
| US6191928B1 (en) | Surface-mountable device for protection against electrostatic damage to electronic components | |
| CA2164017A1 (en) | Surface Mount Resistor and Method for Making Same | |
| US4400762A (en) | Edge termination for an electrical circuit device | |
| TW350071B (en) | Chip resistor and a method of producing the same | |
| GB2265761A (en) | Bulk metal chip resistor having terminals deposited at ends of elongated resistor body | |
| US5294910A (en) | Platinum temperature sensor | |
| WO1996041359B1 (en) | Improved method and apparatus for a surface-mounted fuse device | |
| JP2000512066A (en) | Surface mount fuse and its manufacturing method | |
| US5285184A (en) | Chip-type network resistor | |
| CA2155107A1 (en) | Active drug delivery device, electrode, and method for making same | |
| EP0830704B1 (en) | Improved method and apparatus for a surface-mounted fuse device | |
| KR20010025069A (en) | Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spacers and similar on said multiple printed panel | |
| US6856233B2 (en) | Chip resistor | |
| EP0834180B1 (en) | Method and apparatus for a surface-mountable device for protection against electrostatic damage to electronic components | |
| JP3825576B2 (en) | Manufacturing method of chip resistor | |
| JP3012875B2 (en) | Manufacturing method of chip resistor | |
| JP3118509B2 (en) | Chip resistor | |
| US4694568A (en) | Method of manufacturing chip resistors with edge around terminations | |
| MY114545A (en) | Chip-type composite electronic component | |
| CA1316231C (en) | Chip resistor | |
| JP2939425B2 (en) | Surface mount type resistor and its manufacturing method | |
| JP3323140B2 (en) | Chip resistor | |
| JP3353037B2 (en) | Chip resistor |