JPH0831303B2 - Chip type pigweed -'s - Google Patents

Chip type pigweed -'s

Info

Publication number
JPH0831303B2
JPH0831303B2 JP61287081A JP28708186A JPH0831303B2 JP H0831303 B2 JPH0831303 B2 JP H0831303B2 JP 61287081 A JP61287081 A JP 61287081A JP 28708186 A JP28708186 A JP 28708186A JP H0831303 B2 JPH0831303 B2 JP H0831303B2
Authority
JP
Japan
Prior art keywords
chip
insulating base
conductive portion
formed
upper surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61287081A
Other languages
Japanese (ja)
Other versions
JPS63141233A (en
Inventor
覚 下川
英明 八段
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP61287081A priority Critical patent/JPH0831303B2/en
Priority claimed from AT87117577T external-priority patent/AT89435T/en
Publication of JPS63141233A publication Critical patent/JPS63141233A/en
Publication of JPH0831303B2 publication Critical patent/JPH0831303B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02Details
    • H01H85/04Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046Fuses formed as printed circuits

Description

【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、低価格で印刷回路基板への自動実装に適したチップ型ヒューズに関する。 DETAILED DESCRIPTION OF THE INVENTION (a) relates The present invention relates to a chip-type fuse which is suitable for automatic mounting on a printed circuit board at low cost.

(ロ)従来の技術 一般に、電子回路部品等においては、過電流が流れないようにヒューズを設け、破損等を防止するようにしている。 In (b) Description of the Related Art Generally, in an electronic circuit component such as a fuse provided such overcurrent does not flow, so as to prevent breakage. このヒューズにおいて、近年、プリント基板等に直接実装するために、チップ型のものが開発されている。 In this fuse, in recent years, in order to directly mounted on a printed circuit board or the like, those chip-type have been developed.

従来のチップ型ヒューズとしては、絶縁基台両端に電極を形成し、これら電極間を電気的に接続する金属薄膜よりなる導電部を、絶縁基台下面に設けられる凹部内に形成したものが知られている(実公昭61−11881号公報)。 The conventional chip-type fuse, the electrode is formed on the insulating base ends, the conductive portion made of a metal thin film for electrically connecting the electrodes, those formed in a recess provided in the insulating base underside Intellectual It is (Japanese Utility Model 61-11881 JP).

また、絶縁基台上に1対の電極を形成し、これら電極間に金(Au)線をワイヤボンディングし、絶縁基台表面に樹脂を盛り、この金線を封止してなるものも知られている(実開昭58−113247号公報)。 Further, to form a pair of electrodes on an insulating base, a gold (Au) wire wire bonding between the electrodes, the resin serving to the insulating base surface, also known made by sealing the gold wire It is (Japanese Utility Model 58-113247 JP).

(ハ)発明が解決しようとする問題点 上記従来のチップ型ヒューズは、絶縁基台下面に凹部を形成したり、電極間を金線でワイヤボンディングする加工が必要であり、製造コストが上昇する不都合があった。 (C) INVENTION AND SUMMARY problems above conventional chip-type fuses, or a recess in the insulating base lower surface, and between the electrodes necessary machining to wire bonding gold wire, the manufacturing cost is increased there is an inconvenience. また、角型チップ抵抗器に比べて複雑な形状を有しており、自動実装に適していないという不都合があった。 Also has a complicated shape as compared with the rectangular chip resistors, there is an inconvenience that it is not suitable for automatic mounting.

また、角型チップ型ヒューズを大きな絶縁基板に格子状のスリットを形成しておき、上面電極及びヒューズ部を形成した後、各チップヒューズにブレイクをする場合、側面電極はブレイク後に形成せねばならず、製造過程が複雑になるという問題があった。 Alternatively, it is acceptable to form a lattice-like slits square chip fuse large insulating substrate, after the formation of the upper electrode and the fuse unit, in the case of a break into chips fuse Senebanara formed after the side surface electrode Break not, there is a problem that the manufacturing process becomes complicated.

この発明は、上記不都合に鑑みなされたもので、製造が簡単で、製造コストが低く、かつ自動実装に適したチップ型ヒューズを提供することを目的としている。 This invention has been made in view of the above disadvantages, simple to manufacture, and its object is inexpensive to manufacture, and provides a chip-type fuse which is suitable for automatic mounting.

(ニ)問題点を解決するための手段及び作用 上記問題点を解決するための手段として、この発明のチップ型ヒューズは、直方体形状の絶縁基台と、この絶縁基台長手方向両端部にそれぞれ形成される金属薄膜からなる1対の電極と、前記絶縁基台上面に形成され、前記電極を電気的に接続する金属薄膜からなる導電部と、 As a means for solving means and effects the above problem to solve (d) problems, a chip-type fuse of the present invention, the insulating base of the rectangular parallelepiped block, respectively in the insulating base longitudinal ends a pair of electrodes made of a metal thin film formed, and the formed on the insulating base top surface, a conductive portion made of a metal thin film which electrically connects the electrode,
前記絶縁基台上面に設けられ、前記導電部を被覆する保護外装膜より構成されるものにおいて、 前記絶縁基台の1対の電極を形成した両端部の側部に、上面の各電極より下方に向けて、サイドスルーホールを形成している。 Wherein provided in the insulating upper base, in what is constructed from a protective exterior film covering the conductive portion, on the side of both end portions forming a pair of electrodes of the insulating base, below the respective electrodes of the top surface toward, to form a side through-hole.

従って、絶縁基台の加工が容易であり、また、導電部の形成もめっき又は印刷により容易に行うことができ、 Therefore, it is easy to process the insulating base, also formed of the conductive portion can also be easily performed by plating or printing,
また電極も上面部とともに、サイドスルーホールにより側部も同時に形成できるので、製造過程が簡単となり、 The electrode also with the upper surface portion, can be formed side at the same time by the side through-hole, the manufacturing process is simplified,
製造コストを低減することができる。 It is possible to reduce the manufacturing cost. 一方、その形状を直方体とし、チップ抵抗器と同じ大きさにできるため、 On the other hand, and its shape and a rectangular parallelepiped, it is possible to the same size as the chip resistor,
自動実装が容易となる。 Automatic mounting becomes easy.

(ホ)実施例 この発明の一実施例を、第1図及び第2図に基づいて以下に説明する。 (E) Example one embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第1図は、この発明の実施例に係るチップ型ヒューズ Figure 1 is a chip-type fuse according to an embodiment of the present invention
11の平面図、第2図は、同チップ型ヒューズの第1図中 Plan view of the 11, FIG. 2, in FIG. 1 of the chip-type fuse
II−II線における断面図である。 It is a sectional view taken along line II-II. 12は、セラミック基板(絶縁基台)である。 12 is a ceramic substrate (insulating base). このセラミック基板12は、角形チップ抵抗器等と同一の直方体形状とされ、その横方向長さl 1 、縦方向長さl 2は、それぞれ3.2mm及び1.6mmとされる。 The ceramic substrate 12 is a rectangular chip resistor or the like and the same rectangular shape, the lateral length l 1, the longitudinal length l 2 is the 3.2mm and 1.6mm respectively.

セラミック基板12の上面12aには、導電部13が形成される。 On the upper surface 12a of the ceramic substrate 12, the conductive portion 13 is formed. この導電部13は、上面12aに形成される金属薄膜であり、めっき又は印刷により形成される。 The conductive portion 13 is a metal thin film formed on the upper surface 12a, it is formed by plating or printing. この金属薄膜には、銀(Ag)−パラジウム(Pd)合金、銀−白金(Pt)合金、銀、銅、金等が使用できる。 The thin metal film, silver (Ag) - palladium (Pd) alloy, silver - platinum (Pt) alloy, silver, copper, gold or the like can be used. 導電部13の形状は、方形波状に屈曲する帯状である。 The shape of the conductive portion 13 is a strip which is bent into a square wave. さらに、この導電部13には、信頼性を向上させるため、トリミング部13 Further, this conductive portion 13, to improve the reliability, the trimming section 13
b、…、13bが設けられている。 b, ..., 13b are provided. このトリミング部13b The trimming portion 13b
は、例えばレーザによりトリミングされるが、その際、 Is trimmed by, for example, a laser, in which,
導電部13の抵抗を測定し、適切な抵抗値が得られるようにトリミング量を調整する。 The resistance was measured of the conductive portion 13 to adjust the amount of trimming to an appropriate resistance value is obtained. 導電部13の両端部13a、13a Both end portions 13a of the conductive portion 13, 13a
がセラミック基板2の端部12b、12bにそれぞれ達している。 There has reached each end 12b of the ceramic substrate 2, in 12b.

セラミック基板両端部12b、12bには、金属薄膜よりなる電極14、14が形成される。 Ceramic substrate end portions 12b, the 12b, the electrodes 14, 14 made of a metal thin film is formed. この電極14は、めっき等、 The electrodes 14, plating,
周知の手段により形成され、前記導電部端部13aに接続される。 Is formed by a known means, it is connected to the conductive portion end 13a. また、方向両端部12b、12bには、上面の電極1 Further, opposite end portions 12b, the 12b, the upper surface of the electrode 1
4、14より上下に延伸するサイドスルーホール12c、12c Side through-hole 12c which extends from the upper and lower 4,14, 12c
が設けられている。 It is provided.

セラミック基板上面12aには、シリコン樹脂膜(保護外装膜)15が形成される。 The ceramic substrate top surface 12a, a silicon resin film (protective outer layer) 15 is formed. このシリコン樹脂膜15は、導電膜13を完全に被覆する。 The silicone resin film 15 completely covers the conductive film 13. もっとも、第1図では便宜上、シリコン樹脂膜15を大部分、切欠いた図を示している。 However, in the FIG. 1 for convenience, most of the silicone resin film 15, shows a diagram notching.

このチップ型ヒューズ11は、チップ抵抗器と同じ形状であり、その梱包状態をテーピング仕様とすれば、容易に自動実装を行うことができ、印刷回路基板への実装コストが低減できる。 The chip fuse 11 is the same shape as the chip resistor, if the packed state and taping, it is possible to easily perform automatic mounting, it can be reduced implementation cost to the printed circuit board.

チップ型ヒューズ11に過電流が流れた場合には、導電部13の適所が溶断し、回路が遮断される。 If an overcurrent flows to the chip fuse 11, place is blown conductive portion 13, the circuit is interrupted. この時、導電部13をシリコン樹脂膜15で被覆しているため、溶断部で発生する金属蒸気が外部へ飛散する危険がない。 In this case, since the conductive portion 13 is covered with silicone resin film 15, the metal vapor generated by the fusion portion is no danger of scattering to the outside. また、 Also,
シリコン樹脂には消弧作用が認められ、溶断部で発生する金属蒸気によるアークの連続が防止され、電子部品の保護が完全に行える。 Extinguishing effect on the silicone resin is observed, is prevented continuous arc with metal vapor generated by the fusion portion is, protection of the electronic components can be performed completely. また、導電部13は、セラミック基板上面12aに直接形成されており、放熱効果が大きく、 The conductive portion 13 is directly formed on the ceramic substrate top surface 12a, the heat radiation effect is large,
小型にもかかわらず大電流容量とすることができる。 It can be a large current capacity in spite of the small size.

また、このチップ型ヒューズ11においては、過電流が流れた際に、導電部13のトリミング部13b、…、13bの何れかにおいて、優先的に溶断が生じる。 Further, in the chip-type fuse 11, when an overcurrent flows, the trimming portion 13b of the conductive portion 13, ..., in any of 13b, preferentially blown occurs. このため、過電流を確実に遮断でき、チップ型ヒューズ11の信頼性が向上される。 Thus, it can be surely cut off an overcurrent, the reliability of the chip-type fuse 11 is improved. また、このチップ型ヒューズ11は、導電部として金線を用いる従来のチップ型ヒューズに比べ、断線のおそれがなく、取扱いが容易であるとともに、発熱による導電部の熱応力に対しても強いものとすることができる。 Further, the chip-type fuse 11 as compared to the conventional chip-type fuses used a gold wire as the conductive portion, there is no fear of disconnection, together with ease of handling, stronger against thermal stress of the conductive portion due to heat it can be.

なお、上記実施例においては、導電部の形状として方形波状に屈曲する帯状のものを示しているが、これに限定されるものではなく、適宜変更可能である。 In the above embodiments, while indicating those of the strip to be bent in a square wave shape of the conductive portion, it is not limited thereto, it can be appropriately changed.

(ヘ)発明の効果 以上説明したように、この発明のチップ型ヒューズは、両端部の側部にスルーホールを形成するので、上面部と側部の電極を同時に形成でき、製造が容易で、そのコストが低減できる利点を有すると共に、チップ抵抗器と同じ直方体形状であり、自動実装が容易に行える利点を有している。 As described above the effect of (F) the invention, a chip-type fuse of the present invention, since a through hole is formed on the sides of both end portions, can form an electrode of the upper surface portion and the side at the same time, it is easy to manufacture, which has the advantage of reducing its cost, is the same rectangular shape as the chip resistor, has the advantage of easily automatically mounted.

また、実施例に示すように、保護外装膜をシリコン樹脂とすれば、シリコン樹脂の消弧剤としての作用により、導電部溶断時に発生する、金属蒸気によるアークの連続が防止され、電子部品を確実に保護できる利点をも有している。 Further, as shown in Examples, if the protective sheathing film and silicone resin, by the action of the arc-quenching agent for silicone resin, generated during the conductive portions blown continuous arc by the metal vapor is prevented, the electronic component also it has the advantage of reliably protected.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

第1図は、この発明の実施例に係るチップ型ヒューズの平面図、第2図は、同チップ型ヒューズの第1図中II− Figure 1 is a plan view of a chip-type fuse according to an embodiment of the present invention, FIG. 2, in FIG. 1 of the chip-type fuse II-
II線における断面図である。 It is a sectional view taken along the line II. 12:セラミック基板、 12c・12c:サイドスルーホール、 13:導電部、 14・14:電極、 15:シリコン樹脂膜。 12: ceramic substrate, 12c-12c: Side through-hole, 13: conductive portion, 14, 14: electrode, 15: a silicon resin film.

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】直方体形状の絶縁基台と、この絶縁基台長手方向両端部の上面にそれぞれ形成される金属薄膜からなる1対の電極と、前記絶縁基台上面に形成され、前記電極を電気的に接続する金属薄膜からなる導電部と、前記絶縁基台上面に設けられ、前記導電部を被覆する保護外装膜とよりなるチップ型ヒューズにおいて、 前記絶縁基台の1対の電極を形成した両端部の側部に、 And 1. A dielectric base having a rectangular parallelepiped shape, the a pair of electrodes made of a metal thin film are formed on the upper surface of the insulating base longitudinal ends, are formed on the insulating base upper surface, said electrode forming a conductive portion made of a thin metal film for electrically connecting, provided on the insulating base upper surface, the more becomes the chip-type fuse and the protective outer layer covering the conductive portion, a pair of electrodes of the insulating base on the side of the opposite end portions,
    上面の各電極より下方に向けて、サイドスルーホールを形成したことを特徴とするチップ型ヒューズ。 Towards from each electrode of the top surface downwardly, a chip-type fuse, characterized in that the formation of the side through-hole.
JP61287081A 1986-12-01 1986-12-01 Chip type pigweed -'s Expired - Lifetime JPH0831303B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type pigweed -'s

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP61287081A JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type pigweed -'s
DE19873785835 DE3785835T2 (en) 1986-12-01 1987-11-27 Chip assurance.
DE19873785835 DE3785835D1 (en) 1986-12-01 1987-11-27 Chip assurance.
EP87117577A EP0270954B1 (en) 1986-12-01 1987-11-27 Chip-type fuse
ES87117577T ES2046194T3 (en) 1986-12-01 1987-11-27 Fuse chip.
AT87117577T AT89435T (en) 1986-12-01 1987-11-27 Chip assurance.

Publications (2)

Publication Number Publication Date
JPS63141233A JPS63141233A (en) 1988-06-13
JPH0831303B2 true JPH0831303B2 (en) 1996-03-27

Family

ID=17712806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61287081A Expired - Lifetime JPH0831303B2 (en) 1986-12-01 1986-12-01 Chip type pigweed -'s

Country Status (4)

Country Link
EP (1) EP0270954B1 (en)
JP (1) JPH0831303B2 (en)
DE (2) DE3785835D1 (en)
ES (1) ES2046194T3 (en)

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Also Published As

Publication number Publication date
EP0270954A1 (en) 1988-06-15
JPS63141233A (en) 1988-06-13
DE3785835T2 (en) 1993-08-19
ES2046194T3 (en) 1994-02-01
DE3785835D1 (en) 1993-06-17
EP0270954B1 (en) 1993-05-12

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