EP0834180B1 - Method and apparatus for a surface-mountable device for protection against electrostatic damage to electronic components - Google Patents
Method and apparatus for a surface-mountable device for protection against electrostatic damage to electronic components Download PDFInfo
- Publication number
- EP0834180B1 EP0834180B1 EP96925471A EP96925471A EP0834180B1 EP 0834180 B1 EP0834180 B1 EP 0834180B1 EP 96925471 A EP96925471 A EP 96925471A EP 96925471 A EP96925471 A EP 96925471A EP 0834180 B1 EP0834180 B1 EP 0834180B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrodes
- protection device
- substrate
- circuit protection
- mount circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/08—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by vapour deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/1013—Thin film varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
Definitions
- FIG. 10 shows the strip of FIG. 9, depicting the region where the voltage variable polymeric strip will be applied.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Thermistors And Varistors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (12)
- A thin film surface-mount circuit protection device comprising:a first subassembly including a substrate (13) having a top surface (57), a bottom surface (58) and opposing side surfaces (59), first and second multi-layered terminal pads (34, 36) and first and second electrodes (21), the first and second electrodes (21) being disposed on the top surface (57) of the substrate (13) and being spaced apart to form a gap (25), the first and second terminal pads (34, 36) being electrically connected to the first and second electrodes (21) respectively, the first and second terminal pads (34, 36) extending over the side surfaces (59) of the substrate (13) and terminating on the bottom surface (58) of the substrate (13); and,a second subassembly including a voltage variable polymeric material (43) deposited in the gap (25);
- The surface-mount circuit protection device as claimed in Claim 1 characterised in that said protective layer 56 is made of a polymeric material.
- The surface-mount circuit protection device as claimed in either of Claims 1 or 2 characterised in that said supporting substrate (13) is made of an FR-4 epoxy material.
- The surface mount circuit protection device as claimed in either of Claims 1 or 2 characterised in that said supporting substrate (13) is made of a polyimide material.
- The surface-mount circuit protection device as claimed in any one of Claims 1 to 4 characterised in that the protective layer (56) is transparent and colorless.
- The surface mount circuit protection device as claimed in any one of Claims 1 to 4 characterised in that the protective layer (56) is transparent and colored.
- The surface-mount circuit protection device as claimed in any one of Claims 1 to 6 characterised in that said first conductive metal is selected from the group consisting of copper, silver, nickel, titanium, aluminum or alloys thereof.
- The surface-mount circuit protection device as claimed in any one of Claims 1 to 7 characterised in that the layer of the first conductive metal of the electrodes (21) forms a part of the multi-layered terminal pads (34, 36).
- The surface-mount circuit protection device as claimed in any one of Claims 1 to 8 characterised in that the layer of the first conductive metal of the electrodes (21) and part of the multi-layered terminal pads (34, 36) is one continuous layer.
- The surface-mount circuit protection device as claimed in any one of Claims 1 to 9 characterised in that the electrodes (21) extend substantially the width of the surface-mount circuit protection device.
- A method of manufacturing a thin film surface-mount circuit device comprising the steps of:a) providing a substrate (13) having a top (57), a bottom (58) and opposing sides (59);b) depositing upon the top (13) of a substrate, a first conductive layer to simultaneously form a pair of electrodes (21) and a first terminal pad layer, the electrodes (13) being spaced apart by a gap (25);c) depositing a voltage variable polymeric material (43) in the gap (25);
- The method of manufacturing a thin film surface-mount circuit protection device as claimed in Claim 11 characterised in that the first terminal pad layer extends from the top of the substrate (13) and is deposited upon the sides of the substrate (13) simultaneously with the depositing of the first terminal pad layer on the top of the substrate (13) and the depositing of the electrodes (21) on the top of the substrate (13).
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US474502 | 1983-03-11 | ||
US47450295A | 1995-06-07 | 1995-06-07 | |
US474940 | 1995-06-07 | ||
US08/474,940 US6023028A (en) | 1994-05-27 | 1995-06-07 | Surface-mountable device having a voltage variable polgmeric material for protection against electrostatic damage to electronic components |
PCT/US1996/012217 WO1996041356A2 (en) | 1995-06-07 | 1996-06-06 | Method and apparatus for a surface-mountable device for protection against electrostatic damage to electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0834180A2 EP0834180A2 (en) | 1998-04-08 |
EP0834180B1 true EP0834180B1 (en) | 2000-05-17 |
Family
ID=27044479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP96925471A Expired - Lifetime EP0834180B1 (en) | 1995-06-07 | 1996-06-06 | Method and apparatus for a surface-mountable device for protection against electrostatic damage to electronic components |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0834180B1 (en) |
JP (1) | JPH11507766A (en) |
CN (1) | CN1191623A (en) |
AT (1) | ATE193149T1 (en) |
AU (1) | AU6597296A (en) |
CA (1) | CA2223746A1 (en) |
DE (1) | DE69608440T2 (en) |
WO (1) | WO1996041356A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0922286A1 (en) * | 1996-01-22 | 1999-06-16 | Littelfuse, Inc. | Surface mountable electrical device comprising a ptc element |
US6023403A (en) * | 1996-05-03 | 2000-02-08 | Littlefuse, Inc. | Surface mountable electrical device comprising a PTC and fusible element |
NL1014319C2 (en) | 2000-02-08 | 2001-08-09 | Fci S Hertogenbosch B V | Connector comprising an ESD suppressor. |
US7258819B2 (en) | 2001-10-11 | 2007-08-21 | Littelfuse, Inc. | Voltage variable substrate material |
US7567416B2 (en) | 2005-07-21 | 2009-07-28 | Cooper Technologies Company | Transient voltage protection device, material, and manufacturing methods |
US7567415B2 (en) * | 2006-07-11 | 2009-07-28 | Honeywell International Inc. | Separable transient voltage suppression device |
CN101950645A (en) * | 2010-08-27 | 2011-01-19 | 广东风华高新科技股份有限公司 | Chip overvoltage protector and manufacturing method thereof |
US20120307467A1 (en) * | 2011-06-03 | 2012-12-06 | Navarro Luis A | Oxygen-Barrier Packaged Surface Mount Device |
KR20130117397A (en) * | 2012-04-17 | 2013-10-28 | 주식회사 이노칩테크놀로지 | Circuit protection device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4097834A (en) * | 1976-04-12 | 1978-06-27 | Motorola, Inc. | Non-linear resistors |
FR2513032B1 (en) * | 1981-09-14 | 1985-12-13 | Carreras Michelle | INTEGRATED PROTECTION AGAINST OVERVOLTAGES OF AN ELECTRONIC CIRCUIT, AND ELECTRONIC CIRCUIT PROTECTED BY THIS DEVICE |
US4726991A (en) * | 1986-07-10 | 1988-02-23 | Eos Technologies Inc. | Electrical overstress protection material and process |
US4977357A (en) * | 1988-01-11 | 1990-12-11 | Shrier Karen P | Overvoltage protection device and material |
US5262754A (en) * | 1992-09-23 | 1993-11-16 | Electromer Corporation | Overvoltage protection element |
US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
-
1996
- 1996-06-06 AT AT96925471T patent/ATE193149T1/en not_active IP Right Cessation
- 1996-06-06 AU AU65972/96A patent/AU6597296A/en not_active Abandoned
- 1996-06-06 DE DE69608440T patent/DE69608440T2/en not_active Expired - Fee Related
- 1996-06-06 CN CN96195759A patent/CN1191623A/en active Pending
- 1996-06-06 JP JP9502323A patent/JPH11507766A/en active Pending
- 1996-06-06 WO PCT/US1996/012217 patent/WO1996041356A2/en not_active Application Discontinuation
- 1996-06-06 EP EP96925471A patent/EP0834180B1/en not_active Expired - Lifetime
- 1996-06-06 CA CA002223746A patent/CA2223746A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
ATE193149T1 (en) | 2000-06-15 |
AU6597296A (en) | 1996-12-30 |
JPH11507766A (en) | 1999-07-06 |
WO1996041356A3 (en) | 1997-01-30 |
CA2223746A1 (en) | 1996-12-19 |
WO1996041356A2 (en) | 1996-12-19 |
EP0834180A2 (en) | 1998-04-08 |
MX9709973A (en) | 1998-06-28 |
DE69608440T2 (en) | 2001-01-04 |
DE69608440D1 (en) | 2000-06-21 |
CN1191623A (en) | 1998-08-26 |
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