WO1996026039A1 - Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules - Google Patents

Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules Download PDF

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Publication number
WO1996026039A1
WO1996026039A1 PCT/FR1996/000061 FR9600061W WO9626039A1 WO 1996026039 A1 WO1996026039 A1 WO 1996026039A1 FR 9600061 W FR9600061 W FR 9600061W WO 9626039 A1 WO9626039 A1 WO 9626039A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
insulating film
holes
conductive
sets
Prior art date
Application number
PCT/FR1996/000061
Other languages
French (fr)
Inventor
Benoît Thevenot
Original Assignee
Solaic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic filed Critical Solaic
Priority to AU45432/96A priority Critical patent/AU4543296A/en
Priority to BR9603592A priority patent/BR9603592A/en
Publication of WO1996026039A1 publication Critical patent/WO1996026039A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Definitions

  • the present invention relates to a method for manufacturing a support strip intended to carry modules comprising a microcircuit for an electronic card, comprising a step consisting in producing sets of holes in an insulating film, a step consisting in providing sets of conductive pads in a conductive film, and a step of gluing the insulating film and the conductive film against each other, so that the sets of holes and the sets of conductive pads are respectively opposite each other. other.
  • the present invention also relates to an installation for implementing this method.
  • the present invention proposes to remedy more particularly this problem and, to do this, it relates to a manufacturing process of the type indicated above, which is characterized in that the step consisting in producing the sets of holes is performed after bonding the insulating film and the conductive film against each other, using? of a laser beam.
  • the insulating and conductive films glued against each other can be driven continuously in the direction of their length, a set of holes being produced each time that part of the insulating film which covers an assembly of conductive pads reaches the path of the laser beam.
  • the insulating and conducting films can be driven step-by-step lengthwise and be immobilized each time a part of the insulating film which covers a set of conductive pads reaches the path of the laser beam, a set of holes being made in this case each time the insulating and conductive films are immobilized.
  • the laser beam used is a pulsed CO 2 laser beam TEA whose pulses have a duration of the order of 10 ⁇ s and which provides a power of the order of 150 to 300 mJ per pulse.
  • the installation according to the invention comprises:
  • a source for emitting a laser beam - an optical system for directing the laser beam onto the insulating film;
  • the mask consists of a rotating disc in which are provided several sets of perforations capable of being brought selectively onto the path of the laser beam, these sets of perforations being different to allow the production of different sets of holes in the insulating film. .
  • the modules are generally carried by a support strip from which they are removed for embedding in a card body.
  • the support strip 1 which can be seen in the single figure and which is being manufactured does not yet carry a module.
  • It comprises, in a manner known per se, an insulating film 2 in which sets of holes 3 are being produced and a conductive film 4 in which are defined sets of conductive pads 5.
  • the films 2 and 4 are fixed in a manner known per se against each other using an adhesive or an adhesive material, not shown, so that the sets of holes made 3 are respectively located opposite the sets of conductive pads 5. They have the same width and are provided along their longitudinal edges with equidistant perforations 6.
  • Two toothed wheels of which only the wheel bearing the reference 7 is shown, are engaged with perforations 6 formed along the longitudinal edges of the films 2 and 4. These wheels are capable of being driven in rotation by a conventional motor 8 so to move the support strip 1 in the direction of arrow F.
  • It comprises a laser source 10 designed to emit a laser beam 11, an optical system 12 for directing the laser beam onto the insulating film 2, a mask 13 interposed on the path of the laser beam and provided with several sets of perforations 14a, 14b, 14c, 14d each comprising several perforations, a slave motor 15 for rotating the mask 13 so as to selectively bring one of the sets of perforations on the path of the laser beam, measuring means 16 determining the position of the sets of conductive pads 5 relative to the locations of the spots formed by the laser beam on the insulating film, and trigger means 17 controlling the emission of the source laser 10 each time the measuring means 16 note that a set of conductive pads 5 reaches under the spots of the laser beam.
  • the laser source 10 is designed to emit a pulsed CO 2 laser beam TEA whose pulses have a duration of the order of 10 ⁇ s and which provides a power of the order of 150 to 300 mJ per pulse.
  • the optical system 12 comprises a first set of lenses 12a situated between the laser source 10 and the mask 13, a second set of lenses 12b separated from the first set of lenses 12a by the mask 13, and a mirror 12c separated from this the latter by the second set of lenses 12b.
  • the mask 13 consists of a simple disc in which the various sets of perforations 14a, 14b, 14c, 14d are arranged so as to be able to come selectively on the path of the laser beam 11 under the control of the motor 15 and to allow the laser beam 11 to form spots on the insulating film 2 whose distribution and configuration correspond to those of the holes in a set of holes to be produced.
  • the strip 1 can be driven in the direction of the arrow F either step by step. either continuously.
  • the measuring means 16 stop the motor 8 for driving the strip 1 as soon as a part of the insulating film 2 which covers a set of conductive pads 5 arrives on the path of the laser beam, and authorize the means trigger 17 to control the laser source 10 while the strip is immobilized.
  • the motor 8 operates continuously while the measurement means 16 authorize the trigger means 17 to control the emission of the laser source 10 each time that part of the insulating film 2 which covers a set of ranges conductive arrives on the path of the laser beam.
  • the insulating film 2 is made of plastic, preferably a homogeneous polymer from the family of polyimides, and may have a thickness of the order of 10 to
  • the laser source can emit a single pulse when the belt is driven continuously and 2 to 10 pulses when the belt is driven step by step.

Abstract

A method for making a carrier strip (1) for modules comprising an electronic card microcircuit. The method comprises the steps of making sets of holes (3) in an insulating film (2), providing sets of conductive pads (5) in a conductive film (4), and adhering together the insulating film (2) and the conductive film (4) with the sets of holes (3) and the sets of conductive pads (5) in a mutually facing relationship. The method is characterised in that the step of making the sets of holes (3) is performed after the insulating film (2) and the conductive film (4) are adhered to one another using a laser beam (11). An apparatus for carrying out the method is also disclosed.

Description

Procédé et installation pour réaliser des trous dans le film isolant d'une bande support pour modules de cartes électroniques Method and installation for making holes in the insulating film of a support strip for electronic card modules
La présente invention concerne un procédé pour la fabrication d'une bande support destinée à porter des modules comportant un microcircuit pour carte électronique, 5 comprenant une étape consistant à réaliser des ensembles de trous dans un film isolant, une étape consistant à ménager des ensembles de plages conductrices dans un film conducteur, et une étape consistant à coller le film isolant et le film conducteur l'un contre l'autre, de telle sorte que les ensembles de trous et les ensembles de- plages conductrices soient respectivement les uns en face des autres. 0 La présente invention concerne également une installation pour la mise en oeuvre de ce procédé.The present invention relates to a method for manufacturing a support strip intended to carry modules comprising a microcircuit for an electronic card, comprising a step consisting in producing sets of holes in an insulating film, a step consisting in providing sets of conductive pads in a conductive film, and a step of gluing the insulating film and the conductive film against each other, so that the sets of holes and the sets of conductive pads are respectively opposite each other. other. The present invention also relates to an installation for implementing this method.
Les procédés utilisés actuellement pour fabriquer les bandes supports destinées à porter des modules encastrables dans les cartes électroniques imposent de réaliser les ensembles de trous dans le film isolant avant que ce dernier soit collé contre le film 5 conducteur.The methods currently used to manufacture the support strips intended to carry modules which can be embedded in electronic cards make it necessary to produce sets of holes in the insulating film before the latter is glued against the conductive film.
Ces procédés, qui ont été conçus pour les besoins d'une production de masse, ne donnent toutefois pas pleinement satisfaction. Il arrive en effet fréquemment que de la colle parvienne dans les trous du film isolant lors de l'opération de collage et affecte la solidité des soudures réalisées entre des éléments conducteurs et les parties des plages C conductrices qui constituent le fond des trous.These processes, which were designed for the needs of mass production, however, are not fully satisfactory. It frequently happens that glue reaches the holes of the insulating film during the bonding operation and affects the solidity of the welds made between conductive elements and the parts of the conductive pads C which constitute the bottom of the holes.
La présente invention se propose de remédier plus particulièrement à ce problème et, pour ce faire, elle a pour objet un procédé de fabrication du type indiqué ci-dessus, qui se caractérise en ce que l'étape consistant à réaliser les ensembles de trous est exécutée après le collage du film isolant et du film conducteur l'un contre l'autre, à l'aide ? d'un faisceau laser.The present invention proposes to remedy more particularly this problem and, to do this, it relates to a manufacturing process of the type indicated above, which is characterized in that the step consisting in producing the sets of holes is performed after bonding the insulating film and the conductive film against each other, using? of a laser beam.
Grâce à ce procédé, les traces de matière adhésive situées sur les parties des plages conductrices obturant les trous sont éliminées avec le matériau situé à l'emplacement de ces derniers.By this method, the traces of adhesive material located on the portions of conductive tracks closing the holes are removed with the material situated at the location thereof.
II est donc possible maintenant de souder correctement des conducteurs contre les plages conductrices au fond des trous. Conformément à l'invention, les films isolant et conducteur collés l'un contre l'autre peuvent être entraînés en continu dans le sens de leur longueur, un ensemble de trous étant réalisé chaque fois qu'une partie du film isolant qui recouvre un ensemble de plages conductrices parvient sur la trajectoire du faisceau laser. En variante, les films isolant et conducteur peuvent être entraînés pas-à-pas dans le sens de leur longueur et être immobilisés chaque fois qu'une partie du film isolant qui recouvre un ensemble de plages conductrices parvient sur la trajectoire du faisceau laser, un ensemble de trous étant réalisé dans ce cas chaque fois que les films isolant et conducteur sont immobilisés. De préférence, le faisceau laser utilisé est un faisceau laser CO2 puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion.It is therefore now possible to correctly weld conductors against the conductive pads at the bottom of the holes. According to the invention, the insulating and conductive films glued against each other can be driven continuously in the direction of their length, a set of holes being produced each time that part of the insulating film which covers an assembly of conductive pads reaches the path of the laser beam. As a variant, the insulating and conducting films can be driven step-by-step lengthwise and be immobilized each time a part of the insulating film which covers a set of conductive pads reaches the path of the laser beam, a set of holes being made in this case each time the insulating and conductive films are immobilized. Preferably, the laser beam used is a pulsed CO 2 laser beam TEA whose pulses have a duration of the order of 10 μs and which provides a power of the order of 150 to 300 mJ per pulse.
Par ailleurs, l'installation conforme à l'invention comprend :Furthermore, the installation according to the invention comprises:
- une source pour émettre un faisceau laser ; - un système optique pour diriger le faisceau laser sur le film isolant ;- a source for emitting a laser beam; - an optical system for directing the laser beam onto the insulating film;
- un masque interposé sur la trajectoire du faisceau laser et pourvu d'au moins un jeu de perforations réparties et conformées pour que le faisceau laser forme sur le film isolant des spots dont la répartition et la configuration correspondent à celles d'un ensemble de trous ; - des moyens pour entraîner les films isolant et conducteur dans le sens de leur longueur ; et- a mask interposed on the path of the laser beam and provided with at least one set of distributed and shaped perforations so that the laser beam forms spots on the insulating film whose distribution and configuration correspond to those of a set of holes ; - Means for driving the insulating and conducting films in the direction of their length; and
- des moyens pour commander la source laser chaque fois qu'une partie du film isolant qui recouvre un ensemble de plages conductrices est située sur la trajectoire du faisceau laser. Avantageusement, le masque est constitué par un disque rotatif dans lequel sont ménagés plusieurs jeux de perforations aptes à être amenés sélectivement sur la trajectoire du faisceau laser, ces jeux de perforations étant différents pour permettre la réalisation d'ensembles de trous différents dans le film isolant.- Means for controlling the laser source whenever a part of the insulating film which covers a set of conductive pads is located on the path of the laser beam. Advantageously, the mask consists of a rotating disc in which are provided several sets of perforations capable of being brought selectively onto the path of the laser beam, these sets of perforations being different to allow the production of different sets of holes in the insulating film. .
Grâce à ce masque, il est donc possible de modifier à tout moment la forme et la répartition des trous ménagés dans le film isolant, et par conséquent de changer les types de fabrication pratiquement instantanément. Un mode d'exécution de la présente invention sera décrit ci-après à titre d'exemple nullement limitatif en référence à la figure unique annexée qui représente de façon schématique une installation conforme à l'invention.Thanks to this mask, it is therefore possible to modify at any time the shape and the distribution of the holes made in the insulating film, and consequently to change the types of manufacturing practically instantly. An embodiment of the present invention will be described below by way of nonlimiting example with reference to the single appended figure which schematically represents an installation according to the invention.
On rappellera tout d'abord que la plupart des cartes électroniques disponibles actuellement sur le marché possèdent un corps en matière plastique isolante dans lequel est encastré un module comportant un microcircuit.First of all, it will be recalled that most of the electronic cards currently available on the market have an insulating plastic body in which a module comprising a microcircuit is embedded.
Les modules sont en général portés par une bande support à partir de laquelle ils sont prélevés en vue de leur encastrement dans un corps de carte.The modules are generally carried by a support strip from which they are removed for embedding in a card body.
La bande support 1 que l'on peut voir sur la figure unique et qui est en cours de fabrication ne porte pas encore de module.The support strip 1 which can be seen in the single figure and which is being manufactured does not yet carry a module.
Elle comprend d'une manière connue en soi un film isolant 2 dans lequel des ensembles de trous 3 sont en cours de réalisation et un film conducteur 4 dans lequel sont délimités des ensembles de plages conductrices 5.It comprises, in a manner known per se, an insulating film 2 in which sets of holes 3 are being produced and a conductive film 4 in which are defined sets of conductive pads 5.
Les films 2 et 4 sont fixés d'une manière connue en soi l'un contre l'autre à l'aide d'une colle ou d'une matière adhésive, non représentée, de telle sorte que les ensembles de trous réalisés 3 soient respectivement situés en face des ensembles de plages conductrices 5. Ils ont la même largeur et sont pourvus le long de leurs bords longitudinaux de perforations équidistantes 6.The films 2 and 4 are fixed in a manner known per se against each other using an adhesive or an adhesive material, not shown, so that the sets of holes made 3 are respectively located opposite the sets of conductive pads 5. They have the same width and are provided along their longitudinal edges with equidistant perforations 6.
Deux roues dentées, dont seule la roue portant la référence 7 est représentée, sont en prise avec des perforations 6 ménagées le long des bords longitudinaux des films 2 et 4. Ces roues sont susceptibles d'être entraînées en rotation par un moteur classique 8 afin de déplacer la bande support 1 dans le sens de la flèche F.Two toothed wheels, of which only the wheel bearing the reference 7 is shown, are engaged with perforations 6 formed along the longitudinal edges of the films 2 and 4. These wheels are capable of being driven in rotation by a conventional motor 8 so to move the support strip 1 in the direction of arrow F.
L'installation qui est représentée schématiquement sur la figure unique a été mise au point pour réaliser les ensembles de trous 3 dans le film isolant 2 et éviter que des traces de colle ou de matière adhésive restent sur les parties des plages conductrices 5 qui constituent le fond des trous 3.The installation which is shown schematically in the single figure has been developed to make the sets of holes 3 in the insulating film 2 and to prevent traces of glue or adhesive material remaining on the parts of the conductive pads 5 which constitute the bottom of holes 3.
Elle comprend une source laser 10 conçue pour émettre un faisceau laser 11, un système optique 12 pour diriger le faisceau laser sur le film isolant 2, un masque 13 interposé sur la trajectoire du faisceau laser et pourvu de plusieurs jeux de perforations 14a, 14b, 14c, 14d comportant chacun plusieurs perforations, un moteur asservi 15 pour faire tourner le masque 13 de façon à amener sélectivement l'un des jeux de perforations sur la trajectoire du faisceau laser, des moyens de mesure 16 déterminant la position des ensembles de plages conductrices 5 par rapport aux emplacements des spots formes par le faisceau laser sur le film isolant, et des moyens de déclenchement 17 commandant l'émission de la source laser 10 chaque fois que les moyens de mesure 16 constatent qu'un ensemble de plages conductrices 5 parvient sous les spots du faisceau laser.It comprises a laser source 10 designed to emit a laser beam 11, an optical system 12 for directing the laser beam onto the insulating film 2, a mask 13 interposed on the path of the laser beam and provided with several sets of perforations 14a, 14b, 14c, 14d each comprising several perforations, a slave motor 15 for rotating the mask 13 so as to selectively bring one of the sets of perforations on the path of the laser beam, measuring means 16 determining the position of the sets of conductive pads 5 relative to the locations of the spots formed by the laser beam on the insulating film, and trigger means 17 controlling the emission of the source laser 10 each time the measuring means 16 note that a set of conductive pads 5 reaches under the spots of the laser beam.
La source laser 10 est conçue pour émettre un faisceau laser CO2 puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion.The laser source 10 is designed to emit a pulsed CO 2 laser beam TEA whose pulses have a duration of the order of 10 μs and which provides a power of the order of 150 to 300 mJ per pulse.
Par ailleurs, le système optique 12 comprend un premier jeu de lentilles 12a situé entre la source laser 10 et le masque 13, un second jeu de lentilles 12b séparé du premier jeu de lentilles 12a par le masque 13, et un miroir 12c séparé de ce dernier par le second jeu de lentilles 12b.Furthermore, the optical system 12 comprises a first set of lenses 12a situated between the laser source 10 and the mask 13, a second set of lenses 12b separated from the first set of lenses 12a by the mask 13, and a mirror 12c separated from this the latter by the second set of lenses 12b.
Le masque 13 est constitué par un simple disque dans lequel les différents jeux de perforations 14a, 14b, 14c, 14d sont ménagés de façon à pouvoir venir sélectivement sur la trajectoire du faisceau laser 11 sous la commande du moteur 15 et à permettre au faisceau laser 11 de former sur le film isolant 2 des spots dont la répartition et la configuration correspondent à celles des trous d'un ensemble de trous à réaliser.The mask 13 consists of a simple disc in which the various sets of perforations 14a, 14b, 14c, 14d are arranged so as to be able to come selectively on the path of the laser beam 11 under the control of the motor 15 and to allow the laser beam 11 to form spots on the insulating film 2 whose distribution and configuration correspond to those of the holes in a set of holes to be produced.
La bande 1 peut être entraînée dans le sens de la flèche F soit pas-à-pas. soit en continu. Dans le premier cas, les moyens de mesure 16 arrêtent le moteur 8 d'entraînement de la bande 1 dès qu'une partie du film isolant 2 qui recouvre un ensemble de plages conductrices 5 arrive sur la trajectoire du faisceau laser, et autorisent les moyens de déclenchement 17 à commander la source laser 10 pendant que la bande est immobilisée. Dans le second cas, le moteur 8 fonctionne en permanence tandis que les moyens de mesure 16 autorisent les moyens de déclenchement 17 à commander l'émission de la source laser 10 chaque fois qu'une partie du film isolant 2 qui recouvre un ensemble de plages conductrices arrive sur la trajectoire du faisceau laser.The strip 1 can be driven in the direction of the arrow F either step by step. either continuously. In the first case, the measuring means 16 stop the motor 8 for driving the strip 1 as soon as a part of the insulating film 2 which covers a set of conductive pads 5 arrives on the path of the laser beam, and authorize the means trigger 17 to control the laser source 10 while the strip is immobilized. In the second case, the motor 8 operates continuously while the measurement means 16 authorize the trigger means 17 to control the emission of the laser source 10 each time that part of the insulating film 2 which covers a set of ranges conductive arrives on the path of the laser beam.
Le film isolant 2 est réalisé en matière plastique, de préférence en un polymère homogène de la famille des polyimides, et peut avoir une épaisseur de l'ordre de 10 àThe insulating film 2 is made of plastic, preferably a homogeneous polymer from the family of polyimides, and may have a thickness of the order of 10 to
100 μm. Pour réaliser un ensemble de trous 3, la source laser peut émettre une impulsion unique lorsque la bande est entraînée en continu et 2 à 10 impulsions lorsque la bande est entraînée pas-à-pas. 100 μm. To make a set of holes 3, the laser source can emit a single pulse when the belt is driven continuously and 2 to 10 pulses when the belt is driven step by step.

Claims

REVENDICATIONS
1 Procédé pour la fabrication d'une bande support (1) destinée à porter des modules comportant un microcircuit pour carte électronique, comprenant une étape consistant à réaliser des ensembles de trous (3) dans un film isolant (2) , une étape consistant à ménager des ensembles de plages conductrices (5) dans un film conduc¬ teur (4) , et une étape consistant à coller le film isolant (2) et le film conducteur (4) l'un contre l'autre, de telle sorte que les ensembles de trous (3) et les ensembles de plages conductrices (5) soient respectivement les uns en face des autres, caractérisé en ce que l'étape consistant à réaliser les ensembles de trous (3) est exécutée à l'aide d'un faisceau laser (11) après le collage du film isolant (2) et du film conducteur (4) l'un contre l'autre1 Method for manufacturing a support strip (1) intended to carry modules comprising a microcircuit for an electronic card, comprising a step consisting in producing sets of holes (3) in an insulating film (2), a step consisting in providing sets of conductive pads (5) in a conductive film (4), and a step consisting in gluing the insulating film (2) and the conductive film (4) one against the other, so that the sets of holes (3) and the sets of conductive pads (5) are respectively opposite one another, characterized in that the step consisting in making the sets of holes (3) is carried out using a laser beam (11) after the insulating film (2) and the conductive film (4) have been bonded together
2 Procédé selon la revendication 1, caractérisé en ce que les films isolant (2) et conducteur (4) colles l'un contre l'autre sont entraînés en continu dans le sens de leur longueur, un ensemble de trous (3) étant réalisé chaque fois qu'une partie du film isolant (2) qui recouvre un ensemble de plages conductrices (5) parvient sur la trajectoire du faisceau laser (11)2 Method according to claim 1, characterized in that the insulating (2) and conductive (4) films glued against one another are driven continuously in the direction of their length, a set of holes (3) being produced each time a part of the insulating film (2) which covers a set of conductive pads (5) reaches the path of the laser beam (11)
3 Procédé selon la revendication 1, caractérise en ce que les films isolant (2) et conducteur (4) collés l'un contre l'autre sont entraînés pas-à-pas dans le sens de leur longueur et immobilisés chaque fois qu'une partie du film isolant (2) qui recouvre un ensemble de plages conductrices (5) parvient sur la trajectoire du faisceau laser (11) , un ensemble de trous (3) étant réalisé chaque fois que les films isolant (2) et conducteur (4) sont immobilisés3 Method according to claim 1, characterized in that the insulating (2) and conductive (4) films glued against each other are driven step by step in the direction of their length and immobilized each time a part of the insulating film (2) which covers a set of conductive pads (5) reaches the path of the laser beam (11), a set of holes (3) being produced each time that the insulating films (2) and conductive (4 ) are immobilized
4 Procédé selon l'une quelconque des revendica¬ tions 1 à 3, caractérisé en ce que le faisceau laser (11) utilisé est un faisceau laser C02 puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion4 Method according to any one of claims 1 to 3, characterized in that the laser beam (11) used is a C0 2 pulsed TEA laser beam whose pulses have a duration of the order of 10 μs and which provides a power of the order of 150 to 300 mJ per pulse
5. Installation pour la mise en oeuvre du procédé selon l'une quelconque des revendications précédentes, caractérisée en ce qu'elle comprend : - une source (10) pour émettre un faisceau laser5. Installation for implementing the method according to any one of the preceding claims, characterized in that it comprises: - a source (10) for emitting a laser beam
(11) ;(11);
- un système optique (12) pour diriger le fais¬ ceau laser (il) sur le film isolant (2) ;- an optical system (12) for directing the laser beam (it) onto the insulating film (2);
- un masque (13) interposé sur la trajectoire du faisceau laser (11) et pourvu d'au moins un jeu de perfora¬ tions (14a-l4d) réparties et conformées pour que le faisceau laser forme sur le film isolant (2) des spots dont la répartition et la configuration correspondent à celles d'un ensemble de trous ; - des moyens (6-8) pour entraîner les films isolant (2) et conducteur (4) dans le sens de leur lon¬ gueur; et- A mask (13) interposed on the path of the laser beam (11) and provided with at least one set of perforations (14a-l4d) distributed and shaped so that the laser beam forms on the insulating film (2) spots whose distribution and configuration correspond to those of a set of holes; - Means (6-8) for driving the insulating (2) and conductive (4) films in the direction of their length; and
- des moyens (16, 17) pour commander la source laser (10) chaque fois qu'une partie du film isolant (2) qui recouvre un ensemble de plages conductrices (5j est située sur la trajectoire du faisceau laser (11)- means (16, 17) for controlling the laser source (10) each time that part of the insulating film (2) which covers a set of conductive pads (5j is located on the path of the laser beam (11)
6. Installation selon la revendication 5, carac¬ térisée en ce que le masque (13) est constitué par un disque rotatif dans lequel sont ménagés plusieurs eux de perforations (14a-14d) aptes à être amenés sélectivement sur la trajectoire du faisceau laser (11) , ces eux de perforations étant différents pour permettre la réalisation d'ensembles de trous différents (3) dans le film isolant (2) . 6. Installation according to claim 5, charac¬ terized in that the mask (13) consists of a rotating disc in which are formed several of them with perforations (14a-14d) capable of being brought selectively onto the path of the laser beam ( 11), these perforations being different to allow the production of different sets of holes (3) in the insulating film (2).
7. Installation selon la revendication 5 ou 6, caractérisée en ce que la source laser (10) est conçue pour émettre un faisceau laser C02 puisé TEA dont les impulsions ont une durée de l'ordre de 10 μs et qui fournit une puissance de l'ordre de 150 à 300 mJ par impulsion 7. Installation according to claim 5 or 6, characterized in that the laser source (10) is designed to emit a C0 2 pulsed TEA laser beam whose pulses have a duration of the order of 10 μs and which provides a power of in the range of 150 to 300 mJ per pulse
PCT/FR1996/000061 1995-02-22 1996-01-15 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules WO1996026039A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU45432/96A AU4543296A (en) 1995-02-22 1996-01-15 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules
BR9603592A BR9603592A (en) 1995-02-22 1996-01-15 Process and installation for the manufacture of a support strip for carrying modules containing an electronic card microcircuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9502053A FR2730657B1 (en) 1995-02-22 1995-02-22 METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES
FR95/02053 1995-02-22

Publications (1)

Publication Number Publication Date
WO1996026039A1 true WO1996026039A1 (en) 1996-08-29

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PCT/FR1996/000061 WO1996026039A1 (en) 1995-02-22 1996-01-15 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules

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BR (1) BR9603592A (en)
FR (1) FR2730657B1 (en)
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JP2002312746A (en) * 2001-04-11 2002-10-25 Toshiba Corp Ic module, manufacturing method therefor and portable electronic device on which the ic module is mounted
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Also Published As

Publication number Publication date
AU4543296A (en) 1996-09-11
FR2730657A1 (en) 1996-08-23
FR2730657B1 (en) 1997-03-28
BR9603592A (en) 1999-06-15

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