FR2730657B1 - METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES - Google Patents

METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES

Info

Publication number
FR2730657B1
FR2730657B1 FR9502053A FR9502053A FR2730657B1 FR 2730657 B1 FR2730657 B1 FR 2730657B1 FR 9502053 A FR9502053 A FR 9502053A FR 9502053 A FR9502053 A FR 9502053A FR 2730657 B1 FR2730657 B1 FR 2730657B1
Authority
FR
France
Prior art keywords
installation
insulating film
electronic card
support strip
making holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9502053A
Other languages
French (fr)
Other versions
FR2730657A1 (en
Inventor
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to FR9502053A priority Critical patent/FR2730657B1/en
Priority to BR9603592A priority patent/BR9603592A/en
Priority to AU45432/96A priority patent/AU4543296A/en
Priority to PCT/FR1996/000061 priority patent/WO1996026039A1/en
Publication of FR2730657A1 publication Critical patent/FR2730657A1/en
Application granted granted Critical
Publication of FR2730657B1 publication Critical patent/FR2730657B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
FR9502053A 1995-02-22 1995-02-22 METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES Expired - Fee Related FR2730657B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9502053A FR2730657B1 (en) 1995-02-22 1995-02-22 METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES
BR9603592A BR9603592A (en) 1995-02-22 1996-01-15 Process and installation for the manufacture of a support strip for carrying modules containing an electronic card microcircuit
AU45432/96A AU4543296A (en) 1995-02-22 1996-01-15 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules
PCT/FR1996/000061 WO1996026039A1 (en) 1995-02-22 1996-01-15 Method and apparatus for making holes in an insulating film on a carrier strip for electronic card modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9502053A FR2730657B1 (en) 1995-02-22 1995-02-22 METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES

Publications (2)

Publication Number Publication Date
FR2730657A1 FR2730657A1 (en) 1996-08-23
FR2730657B1 true FR2730657B1 (en) 1997-03-28

Family

ID=9476404

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9502053A Expired - Fee Related FR2730657B1 (en) 1995-02-22 1995-02-22 METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES

Country Status (4)

Country Link
AU (1) AU4543296A (en)
BR (1) BR9603592A (en)
FR (1) FR2730657B1 (en)
WO (1) WO1996026039A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002312746A (en) * 2001-04-11 2002-10-25 Toshiba Corp Ic module, manufacturing method therefor and portable electronic device on which the ic module is mounted
US7136084B2 (en) 2002-09-17 2006-11-14 Miller Timothy J Random laser image projector system and method
DE102007047708A1 (en) * 2007-10-05 2009-04-09 Robert Bosch Gmbh Method and device for producing at least one printed circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990003662A1 (en) * 1988-09-30 1990-04-05 Raychem Limited Hybrid microchip bonding article
JPH02102071A (en) * 1988-10-11 1990-04-13 Olympus Optical Co Ltd Manufacture of ion flow recording head
JPH05228669A (en) * 1991-12-27 1993-09-07 Polymer Processing Res Inst Method and device for manufacturing perforated web with light beam

Also Published As

Publication number Publication date
WO1996026039A1 (en) 1996-08-29
BR9603592A (en) 1999-06-15
FR2730657A1 (en) 1996-08-23
AU4543296A (en) 1996-09-11

Similar Documents

Publication Publication Date Title
FR2740641B1 (en) METHOD AND CIRCUIT FOR DETERMINING A QUANTIFICATION INTERVAL IN AN IMAGE ENCODER
FR2691817B1 (en) METHOD AND ELECTRONIC BOARD FOR THE DEVELOPMENT OF AN INTEGRATED CIRCUIT.
NO964538D0 (en) Open electronic commerce system
DE69522418T2 (en) Cross-current minimization in electronic circuits
FR2764366B1 (en) METHOD AND INSTALLATION FOR COOLING THE CONTENT OF A SPEAKER
FR2737836B1 (en) ELECTRONIC INTEGRATION IN MAINTENANCE UNITS
FR2637747B1 (en) METHOD FOR PRODUCING A NULL OFFSET VOLTAGE IN A VOLTAGE TRACKING CIRCUIT AND A NULL OFFSET VOLTAGE AMPLIFIER
FR2617744B1 (en) METHOD AND INSTALLATION FOR FLOORING A METAL STRIP
KR960009003A (en) Thin film formation method and apparatus
DE69608630D1 (en) Edge connector for printed circuit boards and connection element therefor
FR2765137B1 (en) METHOD AND DEVICE FOR MANUFACTURING NARROW VENEER STRIPS
FR2690364B1 (en) METHOD AND APPARATUS FOR CASTING A METAL STRIP.
FR2730657B1 (en) METHOD AND INSTALLATION FOR MAKING HOLES IN THE INSULATING FILM OF A SUPPORT STRIP FOR ELECTRONIC CARD MODULES
FR2748601B1 (en) METHOD FOR FORMING INTERCONNECTIONS IN AN INTEGRATED CIRCUIT
FR2725563B1 (en) TERMINAL INSERTION DEVICE AND METHOD FOR INSERTING THE SAME
FR2733553B1 (en) LAMINATION DEVICE FOR SOLIDARIZING A METAL STRIP AND A STRIP OF INSULATING MATERIAL
FR2769917B1 (en) PROCESS FOR EMULSIONING AN ASPHALT IN WATER AND EMULSION THUS OBTAINED
FR2792118B1 (en) METHOD AND DEVICE FOR INTERCONNECTING TERMINALS
FR2754551B1 (en) METHOD AND DEVICE FOR MAKING A GROOVE IN A TRACK COVER
FR2773262B1 (en) METHOD FOR FORMING CONDUCTIVE ELEMENTS IN AN INTEGRATED CIRCUIT
FR2774025B1 (en) COOLING DEVICE IN A FOLDING INSTALLATION AND COOLING METHOD
FR2727780B1 (en) METHOD AND PLANT FOR SURFACE TREATMENT OF A STRIP OF PLASTIC MATERIAL BEARING MODULES FOR ELECTRONIC BOARDS
FR2785076B1 (en) ADDRESSING METHOD FOR A PLASMA SCREEN BASED ON SEPARATE ADDRESSING OF THE PAIR AND ODD LINES
FR2522547B1 (en) METHOD AND DEVICE FOR CONTROLLING THE WIDTH AND THICKNESS OF A STRIP
FR2789803B1 (en) METHOD OF MAKING A VERTICAL METAL CONNECTION IN AN INTEGRATED CIRCUIT

Legal Events

Date Code Title Description
ST Notification of lapse