WO1996003615A1 - Cartographie d'epaisseur de couche mince par imagerie spectrale interferometrique - Google Patents

Cartographie d'epaisseur de couche mince par imagerie spectrale interferometrique Download PDF

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Publication number
WO1996003615A1
WO1996003615A1 PCT/US1995/008708 US9508708W WO9603615A1 WO 1996003615 A1 WO1996003615 A1 WO 1996003615A1 US 9508708 W US9508708 W US 9508708W WO 9603615 A1 WO9603615 A1 WO 9603615A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
film
interferometer
spectral intensity
pixel
Prior art date
Application number
PCT/US1995/008708
Other languages
English (en)
Inventor
Dario Cabib
Robert A. Buckwald
Michael E. Adel
Original Assignee
C.I. Systems (Israel) Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C.I. Systems (Israel) Ltd. filed Critical C.I. Systems (Israel) Ltd.
Priority to JP8505769A priority Critical patent/JPH10509508A/ja
Priority to US08/776,063 priority patent/US5856871A/en
Publication of WO1996003615A1 publication Critical patent/WO1996003615A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J2003/2866—Markers; Calibrating of scan

Definitions

  • the present invention relates to a method and apparatus for spectral
  • the size of the chips is also decreasing, so that the uniformity
  • the film thickness map of the wafer as one of the many
  • test sites on a large number of points (test sites), and at a wide thickness range.
  • the present invention relates to a method and apparatus for mapping
  • a spectrometer is an apparatus designed to accept light, to separate
  • imaging spectrometer is one which collects incident light from a scene
  • the former measures the spectrum only at one point, therefore, with
  • the wafer must be moved point by point relative to the
  • the latter i.e., an imaging spectrometer or spectral imager, can be
  • mapping of the earth surface from airplanes and satellites could be used for
  • a grating has higher order diffraction: in order for it to be useful for
  • the lower wavelength is larger than 2. This problem can be solved by
  • optic crystal tunable filters The importance of the wavelength range is
  • thickness t of the film is less than ( ⁇ /4)n, where ⁇ is the minimum
  • n is the refractive index
  • each frame gives the separate and simultaneous information about the OPD
  • interferometer such that it outputs modulated radiation corresponding to a
  • CARIS constant angle reflection interference spectroscopy
  • the further processing includes compensation for different parameters
  • the present invention successfully addresses the shortcomings of the
  • FIG. 1 schematically depicts an apparatus and method according to
  • the spectral imager is any of the various types
  • FIG. 2 shows a wafer surrounded by four reflectance standards for
  • the present invention is of an apparatus and method for measuring
  • Figure 1 schematically depicts an
  • radiation source 10 preferably a light source, such as a halogen lamp, is
  • the light may be guided from source 10 to
  • the normal varies.
  • the variation of incidence angle is accounted for
  • spectral imaging system 16 which analyzes the optical image of the film
  • Spectral imaging system 16 is preferably of the type disclosed in
  • interferometer which is preferably a Sagnac, a Fabry-Perot or a Michelson
  • interferometer means for passing the light through the interferometer
  • the interferometer or scanning the interferometer itself, to scan the optical
  • system 16 is further processed, using, for example, a suitable computer, to
  • An apparatus and method according to the present invention may be any apparatus and method according to the present invention.
  • a bare silicon wafer i.e., a silicon wafer which does not
  • the bare wafer is placed on a suitable wafer
  • thickness of the film must be such that at least two interference minima are
  • d can be taken and a different n is then entered for each pair of minima.
  • the present invention may be enhanced by increasing the uniformity of the illumination of the wafer.
  • the performance could be further enhanced

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Un procédé, qui permet de déterminer la cartométrie d'épaisseur d'une couche mince (14) surmontant un substrat (14) consiste à éclairer (10) cette couche mince simultanément sous des angles différents et à analyser l'intensité spectrale du rayonnement réfléchi par chaque point de cette couche mince (14). L'analyse s'effectue par réception du rayonnement réfléchi par la couche mince (14), passage de ce rayonnement par un interféromètre (16) qui donne en sortie un rayonnement modulé correspondant à un ensemble déterminé de combinaisons linéaires propres à l'intensité spectrale du rayonnement émis par chaque pixel, balayage simultané et séparé sur les différences de trajets optiques engendrées dans cet interféromètre (16) pour chaque pixel, focalisation du rayonnement provenant de l'interféromètre (16) sur un réseau de détecteurs, et traitement du signal de sortie de ce réseau de détecteurs pour déterminer l'intensité spectrale de chacun de ses pixels et obtenir ainsi une répartition d'intensité spectrale. Enfin, ce procédé consiste à traiter cette répartition d'intensité spectrale pour déterminer la répartition spatiale de l'épaisseur de la couche mince (16).
PCT/US1995/008708 1993-08-18 1995-07-12 Cartographie d'epaisseur de couche mince par imagerie spectrale interferometrique WO1996003615A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP8505769A JPH10509508A (ja) 1994-07-26 1995-07-12 干渉法スペクトル画像処理を用いる薄膜厚マップ測定方法
US08/776,063 US5856871A (en) 1993-08-18 1995-07-12 Film thickness mapping using interferometric spectral imaging

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL110466 1994-07-26
IL11046694A IL110466A (en) 1994-07-26 1994-07-26 Film thickness mapping using interferometric spectral imaging

Publications (1)

Publication Number Publication Date
WO1996003615A1 true WO1996003615A1 (fr) 1996-02-08

Family

ID=11066388

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/008708 WO1996003615A1 (fr) 1993-08-18 1995-07-12 Cartographie d'epaisseur de couche mince par imagerie spectrale interferometrique

Country Status (3)

Country Link
JP (1) JPH10509508A (fr)
IL (1) IL110466A (fr)
WO (1) WO1996003615A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0874973A1 (fr) * 1996-10-30 1998-11-04 Applied Spectral Imaging Ltd. Procede d'imagerie spectrale d'objets mobiles mettant en oeuvre un interferometre
DE19757706A1 (de) * 1997-12-23 1999-07-01 Biotul Bio Instr Gmbh Vorrichtung und Verfahren zur schnellen Auswertung von Bindungsreaktionen in strukturierten interferometrischen Mikrotiterplatten
US9418414B2 (en) 2012-05-30 2016-08-16 Panasonic Intellectual Property Management Co., Ltd. Image measurement apparatus, image measurement method and image measurement system
EP2160591B1 (fr) * 2007-05-23 2020-11-04 Energiatudományi Kutatóközpont Dispositif d'inspection optique d'imagerie avec un appareil à sténopé
WO2022191969A1 (fr) * 2021-03-11 2022-09-15 Applied Materials Isreal Ltd. Modèles de métrologie optique pour mesures d'épaisseur de film en ligne

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101548032B1 (ko) * 2008-05-29 2015-09-04 노스이스턴 유니버시티 세포의 질병 검출에 유용한 세포 스펙트럼의 재구성 방법
WO2017141299A1 (fr) * 2016-02-15 2017-08-24 信越半導体株式会社 Procédé de mesure de distribution d'épaisseur de film
JP6520795B2 (ja) * 2016-02-15 2019-05-29 信越半導体株式会社 膜厚分布測定方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4815856A (en) * 1986-06-05 1989-03-28 Storage Technology Partners Ii Method and apparatus for measuring the absolute thickness of dust defocus layers
US5120966A (en) * 1988-07-12 1992-06-09 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for measuring film thickness
US5227861A (en) * 1989-09-25 1993-07-13 Mitsubishi Denki Kabushiki Kaisha Apparatus for and method of evaluating multilayer thin film
US5289266A (en) * 1989-08-14 1994-02-22 Hughes Aircraft Company Noncontact, on-line determination of phosphate layer thickness and composition of a phosphate coated surface
US5402233A (en) * 1991-10-31 1995-03-28 Surface Combustion, Inc. Furnace control apparatus using polarizing interferometer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4815856A (en) * 1986-06-05 1989-03-28 Storage Technology Partners Ii Method and apparatus for measuring the absolute thickness of dust defocus layers
US5120966A (en) * 1988-07-12 1992-06-09 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for measuring film thickness
US5289266A (en) * 1989-08-14 1994-02-22 Hughes Aircraft Company Noncontact, on-line determination of phosphate layer thickness and composition of a phosphate coated surface
US5227861A (en) * 1989-09-25 1993-07-13 Mitsubishi Denki Kabushiki Kaisha Apparatus for and method of evaluating multilayer thin film
US5402233A (en) * 1991-10-31 1995-03-28 Surface Combustion, Inc. Furnace control apparatus using polarizing interferometer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0874973A1 (fr) * 1996-10-30 1998-11-04 Applied Spectral Imaging Ltd. Procede d'imagerie spectrale d'objets mobiles mettant en oeuvre un interferometre
EP0874973A4 (fr) * 1996-10-30 2001-01-10 Applied Spectral Imaging Asi L Procede d'imagerie spectrale d'objets mobiles mettant en oeuvre un interferometre
DE19757706A1 (de) * 1997-12-23 1999-07-01 Biotul Bio Instr Gmbh Vorrichtung und Verfahren zur schnellen Auswertung von Bindungsreaktionen in strukturierten interferometrischen Mikrotiterplatten
DE19757706C2 (de) * 1997-12-23 2002-01-24 Jandratek Gmbh Substrat, Vorrichtung und Verfahren zur schnellen Auswertung von Bindungsreaktionen durch interferometrische Schichtdickenmessung
EP2160591B1 (fr) * 2007-05-23 2020-11-04 Energiatudományi Kutatóközpont Dispositif d'inspection optique d'imagerie avec un appareil à sténopé
US9418414B2 (en) 2012-05-30 2016-08-16 Panasonic Intellectual Property Management Co., Ltd. Image measurement apparatus, image measurement method and image measurement system
WO2022191969A1 (fr) * 2021-03-11 2022-09-15 Applied Materials Isreal Ltd. Modèles de métrologie optique pour mesures d'épaisseur de film en ligne
US12062583B2 (en) 2021-03-11 2024-08-13 Applied Materials Israel Ltd. Optical metrology models for in-line film thickness measurements

Also Published As

Publication number Publication date
IL110466A0 (en) 1994-10-21
JPH10509508A (ja) 1998-09-14
IL110466A (en) 1998-07-15

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