WO1995027308A1 - Boitier electronique metallique a cavite remplie - Google Patents

Boitier electronique metallique a cavite remplie Download PDF

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Publication number
WO1995027308A1
WO1995027308A1 PCT/US1995/003468 US9503468W WO9527308A1 WO 1995027308 A1 WO1995027308 A1 WO 1995027308A1 US 9503468 W US9503468 W US 9503468W WO 9527308 A1 WO9527308 A1 WO 9527308A1
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WO
WIPO (PCT)
Prior art keywords
electronic package
package
cavity
base
leadframe
Prior art date
Application number
PCT/US1995/003468
Other languages
English (en)
Inventor
Arvind Parthasarathi
Paul R. Hoffman
Dexin Liang
Deepak Mahulikar
Anthony M. Pasqualoni
Original Assignee
Olin Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corporation filed Critical Olin Corporation
Priority to JP7525729A priority Critical patent/JPH09511617A/ja
Priority to EP95913778A priority patent/EP0754350A4/fr
Priority to AU21038/95A priority patent/AU2103895A/en
Publication of WO1995027308A1 publication Critical patent/WO1995027308A1/fr

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    • H—ELECTRICITY
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un boîtier électronique(70) dans lequel les composants (52, 54) forment une cavité (56). Un dispositif à semi-conducteur (16) et une partie (28) du cadre en plomb (20) occupe une partie de la cavité (56). Le reste de la cavité (56) est pratiquement rempli d'un polymère (26) de façon à ce que la surface (74) la plus à l'extérieur du polymère (26) soit dans le même plan qu'une surface (76) de l'un des composants (54) du boîtier.
PCT/US1995/003468 1994-04-05 1995-03-20 Boitier electronique metallique a cavite remplie WO1995027308A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7525729A JPH09511617A (ja) 1994-04-05 1995-03-20 キャビティの充填がなされた金属製電子パッケージ
EP95913778A EP0754350A4 (fr) 1994-04-05 1995-03-20 Boitier electronique metallique a cavite remplie
AU21038/95A AU2103895A (en) 1994-04-05 1995-03-20 Cavity filled metal electronic package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22320794A 1994-04-05 1994-04-05
US223,207 1994-04-05

Publications (1)

Publication Number Publication Date
WO1995027308A1 true WO1995027308A1 (fr) 1995-10-12

Family

ID=22835525

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1995/003468 WO1995027308A1 (fr) 1994-04-05 1995-03-20 Boitier electronique metallique a cavite remplie

Country Status (5)

Country Link
EP (1) EP0754350A4 (fr)
JP (1) JPH09511617A (fr)
AU (1) AU2103895A (fr)
TW (1) TW358238B (fr)
WO (1) WO1995027308A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731001B2 (en) 2000-08-10 2004-05-04 Denso Corporation Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
GB2400238A (en) * 2003-02-21 2004-10-06 Visteon Global Tech Inc Slosh suppressor and heat sink
WO2005053022A1 (fr) * 2003-11-12 2005-06-09 U. S. Monolithics, L.L.C. Refroidissement de fluide a contact direct pour un dispositif a semi-conducteurs
WO2012155036A2 (fr) * 2011-05-11 2012-11-15 Vlt, Inc. Ensembles électroniques moulés en panneau
CN104350814A (zh) * 2012-06-15 2015-02-11 株式会社钟化 散热结构体
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US11101795B1 (en) 2016-04-05 2021-08-24 Vicor Corporation Method and apparatus for delivering power to semiconductors
US10998903B1 (en) 2016-04-05 2021-05-04 Vicor Corporation Method and apparatus for delivering power to semiconductors
US11398770B1 (en) 2016-04-05 2022-07-26 Vicor Corporation Delivering power to semiconductor loads
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads
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Also Published As

Publication number Publication date
JPH09511617A (ja) 1997-11-18
AU2103895A (en) 1995-10-23
EP0754350A4 (fr) 1998-10-07
TW358238B (en) 1999-05-11
EP0754350A1 (fr) 1997-01-22

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