WO1995012907A1 - Manufacture of connector - Google Patents

Manufacture of connector Download PDF

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Publication number
WO1995012907A1
WO1995012907A1 PCT/JP1994/001818 JP9401818W WO9512907A1 WO 1995012907 A1 WO1995012907 A1 WO 1995012907A1 JP 9401818 W JP9401818 W JP 9401818W WO 9512907 A1 WO9512907 A1 WO 9512907A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
plating
forming
unnecessary
metal
Prior art date
Application number
PCT/JP1994/001818
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshiaki Nishikawa
Tetuo Yumuto
Original Assignee
Poripurasuchikkusu Co., Ltd.
Sankyoukasei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Poripurasuchikkusu Co., Ltd., Sankyoukasei Co., Ltd. filed Critical Poripurasuchikkusu Co., Ltd.
Priority to DE4498477A priority Critical patent/DE4498477B4/en
Priority to DE4498477T priority patent/DE4498477T1/en
Publication of WO1995012907A1 publication Critical patent/WO1995012907A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Definitions

  • the present invention relates to a method of manufacturing a connector for connecting an electrical component such as ic, a capacitor, a resistor, and the like to a circuit board in mm.
  • a conductive pattern on a vertical surface of the connector cannot be formed by a photoresist, so that a method of individually forming a contact portion, a non-contact portion, and a contact portion has been adopted.
  • a primary molded portion including a surface on which a conductive pattern is formed is injection-molded with a thermoplastic resin having good plating adhesion.
  • the surface on which the conductive pattern is to be formed is not included on the primary side, and the secondary elevation is integrated with a thermoplastic resin having poor adhesion.
  • the product is finished: When the metal mold is applied to the entire surface of the girder, only the surface of the primary molded portion where the conductive pattern is magnetized is plated, and the conductive pattern is formed.
  • the manufacturing process is complicated, and two kinds of materials and a mold are required, so that the manufacturing efficiency is low and the manufacturing cost is high.
  • An object of the present invention is to solve the above-mentioned problems and to provide a method of manufacturing a connector which can improve manufacturing efficiency and reduce I ⁇ cost.
  • a first method of the present invention made to achieve the above object is a method of manufacturing a connector for mounting electricity and electrically connecting the electric component and a circuit board, and includes the following steps. It is characterized by.
  • a desired conductive pattern is formed on the entirety of the connector-forming plate-shaped member by removing an unnecessary portion of a side metal-plated portion of the metal-plated connector-forming plate-shaped member.
  • the present invention further provides a second connector method comprising the following steps.
  • a multi-cavity mold is used to form a conductive pattern forming plate and a plurality of connectors for forming a slot between the runner portions by injection molding.
  • a desired conductive pattern is formed on the whole of the connector forming plate by removing unnecessary portions of the side metal plating portions of the separated connector forming plates.
  • the entire surface of the plate member for forming a connector is formed.
  • a conductive pattern can be easily formed on a desired portion in a considerably small amount of time by applying metal plating and removing an unnecessary portion on the side surface.
  • a plurality of connectors each having a slit formed between the side face for forming the conductive pattern and the runner portion are formed by injection molding into a multi-cavity mold. Then, a plate-like part and a plate-unnecessary part are formed at desired portions on the front surface and the back surface of each connector forming plate-like member. By impregnating the entire surface with the plating solution, the desired portions on the front and back surfaces are plated, and the plating solution and the plating solution flow in from the slit, and the top surface j is also plated. Finally, each connector — By separating the forming plate member from the runner and removing the unnecessary portion of the side plating, a plurality of connectors can be manufactured efficiently.
  • FIG. 1 is a flowchart illustrating a method for manufacturing a connector of the present invention
  • FIG. 2 is an explanatory view of a plurality of plate members for molding an injection-molded connector
  • FIG. 3 is a diagram illustrating a plurality of plate members provided with metal plating.
  • FIG. 4 is an explanatory view of a connector-forming plate-shaped member
  • FIG. 1 is a flowchart illustrating a method for manufacturing a connector of the present invention
  • FIG. 2 is an explanatory view of a plurality of plate members for molding an injection-molded connector
  • FIG. 3 is a diagram illustrating a plurality of plate members provided with metal plating.
  • FIG. 4 is an explanatory view of a connector-forming plate-shaped member
  • Fig. 5 is an explanatory view of a plate-shaped member for a connector with unnecessary portions removed from the side
  • Fig. 6 is an explanatory view of a completed connector
  • FIG. 7 is an explanatory diagram of another connector.
  • FIG. 1 is a flowchart illustrating a method for manufacturing a connector according to a first embodiment of the present invention.
  • FIG. 2 is a view showing a plurality of plate members for forming connectors formed in this manner. Specifically, FIG. 2A is a front view, FIG. 2B is a view for forming a conductive pattern, and FIG.
  • connector forming plates 8 are formed between the runner portions 1 and 1.
  • a file and a socket 2 are formed between the side of the conductive pattern forming side of the connector-forming flat plate 8 and the runner section 1.1, and a step 3 is formed of the connector-forming thin plate 8 Is formed. Further, a hole 4 for inserting a connection pin of an electric component is formed from the front surface to the rear surface.
  • each connector forming plate 8 is masked using a photomask (step S 2). That is, the portion where the conductive pattern is formed and the portion where the conductive pattern is not formed by the masking pattern, in other words , And the part of the metal part and the unnecessary part.
  • the entirety of the connector forming plate-shaped member 8 having the required metal part and the unnecessary part formed therein is impregnated with a metal member and a rubbing liquid (step S3).
  • the masked part Jil ⁇ on the front and back sides is metal-plated, but the metal-plated liquid also flows into the slit 2, so the entire unmasked side is also metal-plated (see Fig. 3).
  • a hatched portion 5 indicates a metal pattern and a ground portion
  • 6 indicates a conductive pattern formed by metal plating.
  • FIG. 6A is an explanatory view of the structure
  • FIG. 6B is a perspective view of the structure viewed from the bottom.
  • one terminal is formed by the conductive pattern 13 formed on the side surface 11 after removal, the conductive pattern 6 on the front surface 9 and the conductive pattern 15 on the back surface 14. Then, if the connection pins of electric components such as IC, a capacitor, and a resistor are inserted into the hole 4, it can be directly mounted on a circuit board by applying a surface mounting technology (SM).
  • SM surface mounting technology
  • reference numeral 16 denotes a connection surface for connection at a time
  • reference numeral 17 denotes a removed portion from which unnecessary portions have been removed.
  • the mother body of the connector is separately formed in the plated portion and the non-plated portion, and further, they are formed integrally without a fine manufacturing process.
  • the conductive pattern can be directly formed on the molded article obtained by one injection molding, the production process can be shortened.
  • FIG. 7 is a perspective view of another connector manufactured by the method of the present invention.
  • 18 is a connection surface for connecting to a connection terminal protrudingly formed on the circuit base
  • 19 is a cut surface from which an unnecessary portion is removed.
  • the conductive pattern is also formed on the vertical surface formed on the portion that enters inside from the side of the connector. It can be easily formed.
  • a long plate-shaped member for forming a connector cut it according to the number of electrical connection pins, and manufacture a plurality of connectors at once.
  • the side surface is to be planarly finished, only the unnecessary portion of the metal plating film may be cut or removed by shading.
  • a method of forming the required metal part and the unnecessary part of the metal part a method of directly patterning with a laser beam or the like, in addition to a method of transferring a photomask onto a plate-like plate for forming a connector. Is used.
  • a conductive pattern can be formed on a vertical surface of a connector in a small number of steps, and a desired conductive pattern can be formed on a front surface and a back surface using a photomask or the like. You can also. Moreover, since the matrix of one connector can be formed of one kind of material, the material cost is low. In addition, if a large number of mother bodies are manufactured at once using a multi-cavity mold, manufacturing efficiency can be further improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

A connector manufacturing method by which the manufacturing efficiency can be improved and the manufacturing cost can be reduced. This method includes the steps of: (a) forming plating parts and non-plating parts at desired parts on the front and back sides of a platy member; (b) plating with a metal the entire surface of the plate on which the abovementioned plating and non-plating parts have been formed; and (c) forming a desired conductive pattern on the entire surface of the platy member by removing the unnecessary plating layer on the edge face of the platy member.

Description

コネクタ一の製造方法  One connector manufacturing method
【技術分野】 【Technical field】
本発明は、 i c、 コンデンサ、 抵抗等の電気部品と回路基板とを mm的接続す るコネクターの製造方法に関する。  The present invention relates to a method of manufacturing a connector for connecting an electrical component such as ic, a capacitor, a resistor, and the like to a circuit board in mm.
【背景技術】 [Background Art]
従来、 このようなコネクタ一において、 コネクタ一の垂直面の導電性パターン はフォトレジス卜では形成できないため、 メツキ部と非メ、ソキ部とを個別に i¾i する方法が採られていた。 この従来の方法では、 先ず、 導電性パターンを形成す る面を含む一次側成形部をメッキ密着性の良好な熱可塑性樹脂で射出成形する。 その後、 一次側 部上へ導電性パターンを形成する面を含まなしヽニ次仰 部 をメツキ密着性の良好でない熱可塑性樹脂で一体 する。 そして、 出来上がつ た：戈形品全面に金属メ Vキを施すと、 一次側成形部の導電性パターンを磁する 面だけがメツキされ、 導電性パターンが形成される。  Conventionally, in such a connector, a conductive pattern on a vertical surface of the connector cannot be formed by a photoresist, so that a method of individually forming a contact portion, a non-contact portion, and a contact portion has been adopted. In this conventional method, first, a primary molded portion including a surface on which a conductive pattern is formed is injection-molded with a thermoplastic resin having good plating adhesion. After that, the surface on which the conductive pattern is to be formed is not included on the primary side, and the secondary elevation is integrated with a thermoplastic resin having poor adhesion. Then, the product is finished: When the metal mold is applied to the entire surface of the girder, only the surface of the primary molded portion where the conductive pattern is magnetized is plated, and the conductive pattern is formed.
従来の製造方法では、 製造工程が複雑な上、 二種類の材料と金型が必 なため 製造効率が悪いとともに、 製造コストがかかる。  In the conventional manufacturing method, the manufacturing process is complicated, and two kinds of materials and a mold are required, so that the manufacturing efficiency is low and the manufacturing cost is high.
本発明の目的は、 上述の問題点を解決し、 製造効率の向上及び I ^コストの低 減を達成することができるコネクタ一の製造方法を提供することにある。  An object of the present invention is to solve the above-mentioned problems and to provide a method of manufacturing a connector which can improve manufacturing efficiency and reduce I ^ cost.
【発明の開示】 DISCLOSURE OF THE INVENTION
前記目的を達成するためになされた本発明の第一の方法は、 電気 を搭載し その電気部品と回路基板とを電気的に接続するコネクターを製造する方法であり 以下のステ Vプを備えることを特徴とする。  A first method of the present invention made to achieve the above object is a method of manufacturing a connector for mounting electricity and electrically connecting the electric component and a circuit board, and includes the following steps. It is characterized by.
( a ) コネクター形成用板状離ォの表面及び裏面の所望部分にメ Vキ必要部と メツキ不要部とを形成する、 (a) The required parts on the front and back of the plate Forming a part that does not require plating,
( b ) 前記メヅキ必要部と前記メ キ不要部とが形成されたコネク夕一形成用 板状 ¾Wォの全面に金属メッキを施す、  (b) metal plating is applied to the entire surface of the connector-forming plate-shaped ¾W on which the above-mentioned required portion and the above-mentioned unnecessary portion are formed,
( c ) 前記金属メツキされたコネクター形成用板状部材の側面金属メツキ部の 不要部分を除去することにより、 コネクタ一形成用板状部材の全体に所望の導電 性パターンを形成する。  (c) A desired conductive pattern is formed on the entirety of the connector-forming plate-shaped member by removing an unnecessary portion of a side metal-plated portion of the metal-plated connector-forming plate-shaped member.
本発明は、 更に、 以下のステップを備えた第二のコネクター ¾i方法を提供す る。  The present invention further provides a second connector method comprising the following steps.
( a ) 多数個取り金型への射出成形により、 導電性パターン形成用 価とラン ナ部間にスリ 卜を形成した複数のコネクタ一形成用板状^ォを] する、 (a) A multi-cavity mold is used to form a conductive pattern forming plate and a plurality of connectors for forming a slot between the runner portions by injection molding.
( b ) 前記複数のコネクター形成用板状部材の各々の表面及び裏面の所望部分 にメッキ必 部とメッキ不要部とを形成する、 (b) forming a plating-necessary portion and a plating-unnecessary portion on desired portions of the front and back surfaces of each of the plurality of plate members for forming a connector,
( c ) 前記メツキ ^部と前記メツキ不要部とが形成された複数のコネクタ一 形成用板状部材の全面に金属メッキを施す、  (c) applying a metal plating to the entire surface of the plurality of connector-forming plate members on which the plating part and the plating unnecessary part are formed;
( d ) 前記金属メツキされた複数のコネクタ一形成用板状 ォをそれぞれラン ナ部から切り離す、  (d) separating the plurality of metal-plated connector-forming plates from the runner,
( e ) 切り離された各コネクター形成用板状 ォの側面金属メッキ部の不要部 分を除去することにより、 各コネクター形成用板状辦才の全体に所望の導電性パ ターンを形成する。  (e) A desired conductive pattern is formed on the whole of the connector forming plate by removing unnecessary portions of the side metal plating portions of the separated connector forming plates.
本発明の第一の製造方法では、 コネク夕一形成用板状部材の表面及び裏面の所 望部分にメツキ' 部とメ、ソキ不要部とを形成した後にコネクター形成用板状部 材全面に金属メツキを施し、 側面の不要部分を除去するという、 かなり少ないェ 程で所望部分に導電性パターンを容易に形成することができる。  In the first manufacturing method of the present invention, after forming a metal part, a female part, and an unnecessary part on a desired portion of the front and back surfaces of the plate member for forming a connector, the entire surface of the plate member for forming a connector is formed. A conductive pattern can be easily formed on a desired portion in a considerably small amount of time by applying metal plating and removing an unnecessary portion on the side surface.
また、 本発明の第二の製造方法では、 まず、 多数個取り金型への射出成形によ り、 導電性パターン形成用側面とランナ部間にスリツ卜が形成された複数のコネ クタ一形成用板状部材を成形し、 次に、 各コネクター形成用板状離ォの表面及び 裏面の所望部分にメツキ'必要部とメツキ不要部とを形成する。 その全体をメツキ 液に含浸することにより、 表裏面の所望部分がメッキされるとともに、 スリット からメ、ソキ液が流入し、 仰 j面もメツキされる。 最後に、 メツキされた各コネクタ —形成用板状部材をランナから切り離して、 側面メッキ部の不要部分を除去すれ ば複数のコネクターを効率よく製造することができる。 Further, in the second manufacturing method of the present invention, first, a plurality of connectors each having a slit formed between the side face for forming the conductive pattern and the runner portion are formed by injection molding into a multi-cavity mold. Then, a plate-like part and a plate-unnecessary part are formed at desired portions on the front surface and the back surface of each connector forming plate-like member. By impregnating the entire surface with the plating solution, the desired portions on the front and back surfaces are plated, and the plating solution and the plating solution flow in from the slit, and the top surface j is also plated. Finally, each connector — By separating the forming plate member from the runner and removing the unnecessary portion of the side plating, a plurality of connectors can be manufactured efficiently.
【図面の簡単な説明】 [Brief description of the drawings]
図 1は、 本発明のコネクターの製造方法を説明するフローチヤ一卜、 図 2は、 射出成型された複数のコネクター成形用板状部材の説明図、 図 3は、 金属メツキが施された複数のコネクタ一成形用板状 才の説明図、 図 4は、 個々に切り離されたコネクター成形用板状部材の説明図、  FIG. 1 is a flowchart illustrating a method for manufacturing a connector of the present invention, FIG. 2 is an explanatory view of a plurality of plate members for molding an injection-molded connector, and FIG. 3 is a diagram illustrating a plurality of plate members provided with metal plating. FIG. 4 is an explanatory view of a connector-forming plate-shaped member, and FIG.
図 5は、 側面の不要部分を除去したコネク夕一]^用板状部材の説明図、 図 6は、 完成したコネクターの説明図、  Fig. 5 is an explanatory view of a plate-shaped member for a connector with unnecessary portions removed from the side, Fig. 6 is an explanatory view of a completed connector,
図 7は、 別のコネクタ一の説明図である。  FIG. 7 is an explanatory diagram of another connector.
【発明を実陁するための最良の形態】BEST MODE FOR CARRYING OUT THE INVENTION
±説明した本発明の構成 ·作用をいっそう明らかにするために、 以下本発明 の好適な実施例について説明する。 図 1は、 本発明の第一^例であるコネクタ —の製造方法を説明するフローチヤ一卜である。  Preferred embodiments of the present invention will be described below in order to further clarify the configuration and operation of the present invention described above. FIG. 1 is a flowchart illustrating a method for manufacturing a connector according to a first embodiment of the present invention.
まず、 熱可塑性樹脂を多数個取り金型に射出) することにより、 複数のコネ クタ一形成用板状部 ίォを形成する （ステップ S 1 ) 。 図 2は、 このようにして形 成された複数のコネクター形成用板状部材を示す図である。 詳しくは、 図 2 Αは 、 正面図、 図 2 Bは、 導電性パターン形成用 腼図、 図 2 Cは、 麵図をそれそ' れ示す。  First, a plurality of plate-shaped portions for forming one connector are formed by injecting a thermoplastic resin into a multi-cavity mold (step S 1). FIG. 2 is a view showing a plurality of plate members for forming connectors formed in this manner. Specifically, FIG. 2A is a front view, FIG. 2B is a view for forming a conductive pattern, and FIG.
図示するように、 ランナ部 1， 1間に 4個のコネクター形成用板状 才8が形 成されている。 スリ、ソ卜 2が、 コネクタ一形成用板状離ォ8の導電性パターン形 成用側面とランナ部 1 . 1間に形成され、 段部 3が、 コネクタ一形細板状 8の使画に形成されている。 また、 電気部品の接続ピンを挿入するための孔 4が 、 表面から裏面へ貫 il¾成されている。  As shown in the figure, four connector forming plates 8 are formed between the runner portions 1 and 1. A file and a socket 2 are formed between the side of the conductive pattern forming side of the connector-forming flat plate 8 and the runner section 1.1, and a step 3 is formed of the connector-forming thin plate 8 Is formed. Further, a hole 4 for inserting a connection pin of an electric component is formed from the front surface to the rear surface.
この成形品が出来上がつた段階で各コネクター形成用板状 才 8の表面及び裏 面をフォトマスクを用いてマスキングする （ステップ S 2 ) 。 即ち、 マスキング パターンにより、 導電性パターンを形成する部分と形成しない部分、 言い替える と、 メツキ 部と不要部とに分ける。 次に、 メツキ必要部と不要部とが形成さ れたコネクター形成用板状部材 8全体を金属メ、ソキ液に含浸する （ステップ S 3 ) 。 すると、 表面及び裏面のマスキングした部分 Jil^の部分が金属メツキされる が、 金属メツキ液はスリット 2内にも流入するため、 マスキングされていない側 面全体も金属メツキされる （図 3参照） 。 ここで、 斜線部 5は金属メ、ソキ部、 6 は金属メッキにより形成された導電性パターンを示す。 When this molded article is completed, the front and back surfaces of each connector forming plate 8 are masked using a photomask (step S 2). That is, the portion where the conductive pattern is formed and the portion where the conductive pattern is not formed by the masking pattern, in other words , And the part of the metal part and the unnecessary part. Next, the entirety of the connector forming plate-shaped member 8 having the required metal part and the unnecessary part formed therein is impregnated with a metal member and a rubbing liquid (step S3). Then, the masked part Jil ^ on the front and back sides is metal-plated, but the metal-plated liquid also flows into the slit 2, so the entire unmasked side is also metal-plated (see Fig. 3). . Here, a hatched portion 5 indicates a metal pattern and a ground portion, and 6 indicates a conductive pattern formed by metal plating.
次に、 図 3に示す切断線 7に沿ってランナ部 1から 4個のコネクター形成用板 状部材を切り離す （ステップ S 4 ) 。 次に、 図 4に示すようにコネクター形成用 板状部材 8の側面 1 1を切断線 1 0に沿ってダイシングマシンやフライシンク、'マ シン等により切削し、 若しくはカッティングマシンにより切断し、 不要部分 1 2 を除去する （ステップ S 5 ) 。 除去後の状態を図 5に示す。 図 6 Aはその^ ί見説 明図、 図 6 Βは底面から見た斜視説明図である。  Next, the four connector forming plate members are cut off from the runner portion 1 along the cutting line 7 shown in FIG. 3 (step S4). Next, as shown in Fig. 4, the side surface 11 of the plate member 8 for forming a connector is cut along a cutting line 10 by a dicing machine, a fly sink, a machine, or the like, or is cut by a cutting machine. The part 1 2 is removed (step S5). Figure 5 shows the state after removal. FIG. 6A is an explanatory view of the structure, and FIG. 6B is a perspective view of the structure viewed from the bottom.
図示するように、 除去後に側面 1 1に形成された導電性パターン 1 3及び表面 9の導電性パ夕一ン 6及び裏面 1 4の導電性パターン 1 5により一つの端子が形 成される。 そして、 孔 4に I C、 コンデンサ、 抵抗等の電気部品の接続ピンを揷 入接続すれば、 表面実装技術 （S M丁） を適用して回路基板へ直に装着が可能と なる。 図において、 1 6は回 に接続するための接続面、 1 7は不要部分 が取り去られた除去部を示す。  As shown in the drawing, one terminal is formed by the conductive pattern 13 formed on the side surface 11 after removal, the conductive pattern 6 on the front surface 9 and the conductive pattern 15 on the back surface 14. Then, if the connection pins of electric components such as IC, a capacitor, and a resistor are inserted into the hole 4, it can be directly mounted on a circuit board by applying a surface mounting technology (SM). In the figure, reference numeral 16 denotes a connection surface for connection at a time, and reference numeral 17 denotes a removed portion from which unnecessary portions have been removed.
このように、 本発明のコネクターの製造方法によれば、 コネクターの母体をメ キ部と非メッキ部とに個別に形成し、 さらにそれらを一体成形するというネ穀隹 な製造工程を経なくても、 一回の射出成型により得られる成形品の彻而に直接簿 電性パターンを形成することができるため、 製 ίΙ 程を短縮することができる As described above, according to the method for manufacturing a connector of the present invention, the mother body of the connector is separately formed in the plated portion and the non-plated portion, and further, they are formed integrally without a fine manufacturing process. However, since the conductive pattern can be directly formed on the molded article obtained by one injection molding, the production process can be shortened.
。 しかも、 母体形成用の材料が一種類でよいため、 製造コストを低減することが できる。 さらに、 多数個取り金型を用いれば、 一度に多くの母体を すること ができるため、 一段と^効率を向上させることができる。 . In addition, since only one kind of material is required for forming the base, the manufacturing cost can be reduced. Furthermore, if a multi-cavity mold is used, a large number of molds can be formed at once, and the efficiency can be further improved.
図 7は本発明の方法により製造された別のコネクターの斜視言兌明図である。 こ こで、 1 8は回路基 に突出形成された接続端子と接続するための接続面、 1 9は不要部分を除去した切断面である。 このように、 本発明の方法によればコネ クター側面から内側に入り込んだ部分に形成された垂直面にも導電性パターンを 容易に形成することができる。 FIG. 7 is a perspective view of another connector manufactured by the method of the present invention. Here, 18 is a connection surface for connecting to a connection terminal protrudingly formed on the circuit base, and 19 is a cut surface from which an unnecessary portion is removed. As described above, according to the method of the present invention, the conductive pattern is also formed on the vertical surface formed on the portion that enters inside from the side of the connector. It can be easily formed.
なお、 長尺のコネクター形成用板状部材を形成し、 それを電気 の接続ピン 数に応じて切断し、 一度に複数のコネクターを製造することもできる。 また、 側 面を平面的に仕上げる場合は、 不要部分の金属メツキ膜だけを切削、 若しくはィ匕 学的処理により除去するようにしてもよい。 さらに、 メツキ必 部とメ、ソキ不要 部とを形成する方法としては、 フォ卜マスクをコネクター形成用板状¾^ォ上^^ 写する方法の他、 レーザ一光で直接パターンニングする方法等が用いられる。 In addition, it is also possible to form a long plate-shaped member for forming a connector, cut it according to the number of electrical connection pins, and manufacture a plurality of connectors at once. When the side surface is to be planarly finished, only the unnecessary portion of the metal plating film may be cut or removed by shading. In addition, as a method of forming the required metal part and the unnecessary part of the metal part, a method of directly patterning with a laser beam or the like, in addition to a method of transferring a photomask onto a plate-like plate for forming a connector. Is used.
J:説明したように、 本発明によれば、 少ない工程でコネクターの垂直面に導 電性パターンを形成することができるし、 表面及び裏面にフォ卜マスク等により 所望の導電性パターンを形成することもできる。 しかも、 コネクタ一の母体を一 種類の材料で形成することができるため材料費が安価である。 また、 多数個取り 金型により一度に多くの母体を製造すれば、 一段と製造効率を向上させることが できる。  J: As described above, according to the present invention, a conductive pattern can be formed on a vertical surface of a connector in a small number of steps, and a desired conductive pattern can be formed on a front surface and a back surface using a photomask or the like. You can also. Moreover, since the matrix of one connector can be formed of one kind of material, the material cost is low. In addition, if a large number of mother bodies are manufactured at once using a multi-cavity mold, manufacturing efficiency can be further improved.

Claims

請求の範囲 The scope of the claims
1 . 電気部品を搭載し、 その電気部品と回路基板とを電気的に接続するコネク ターの製造方法であって、  1. A method of manufacturing a connector for mounting an electrical component and electrically connecting the electrical component to a circuit board.
( a ) コネクター形成用板状 才の表面及び裏面の所望部分にメ キ必要部と メツキ不要部とを形成する、  (a) Forming a required portion and an unnecessary portion on desired portions of the front and rear surfaces of the connector forming plate;
( b ) 前記メ、ソキ必要部と前記メッキ不要部とが形成されたコネクター形成用 板状部材の全面に金属メッキを施す、  (b) applying metal plating to the entire surface of the plate member for forming a connector, on which the above-mentioned portion, the necessary portion and the unnecessary portion for plating are formed;
( c ) 前記金属メ、ソキされたコネク夕一形成用板状辦ォの側面金属メツキ部の 不要部分を除去することにより、 コネクター形成用板状部材の全体に所望の導電 性パターンを形成する、  (c) A desired conductive pattern is formed on the entirety of the connector forming plate-like member by removing unnecessary portions of the side metal plating portions of the metal member and the stripped connector forming plate. ,
ステップを備えることを特徵とするコネクタ一の製造方法。  A method for manufacturing a connector, comprising a step.
2 . 電気部品を搭載し、 その電気部品と回路基板とを電気的に接続するコネク ターの製造方法であって、  2. A method of manufacturing a connector that mounts electrical components and electrically connects the electrical components to a circuit board,
( a ) 多数個取り金型への射出 により、 導電性パターン形^ ffl 価とラン ナ部間にスリッ卜を形成した複数のコネクター形成用板状部 を!^する、 (a) By injecting into a multi-cavity mold, the conductive pattern type ^ ffl value and the plurality of connector-forming plate-like parts with slits formed between the runner parts!
( b ) 前記複数のコネクタ一形成用板状部材の各々の表面及び の所望部分 にメッキ必 部とメヅキ不要部とを形成する、 (b) forming a plating-necessary part and a plating-unnecessary part on a surface and a desired part of each of the plurality of connector-forming plate members;
( c ) 前記メツキ^部と前記メツキ不要部とが形成された複数のコネクタ一 形成用板状部材の全面に金属メ Vキを施す、  (c) applying a metal plating to the entire surface of the plurality of connector-forming plate members on which the plating part and the plating unnecessary part are formed;
( d ) 前記金属メ、ソキされた複数のコネクタ一形成用板状 才をそれぞれラン ナ部から切り離す、  (d) separating the metal plate and the plurality of stripped plates for forming one connector from the runner part,
( e ) 切り離された各コネクタ一形成用板状部材の 1貝価金属メツキ部の不要部 分を除去することにより、 各コネクター形成用板状部材の全体に所望の導電性パ ターンを形成する、  (e) A desired conductive pattern is formed on the entirety of the connector-forming plate-like member by removing an unnecessary portion of the one-piece metal value plating portion of each disconnected connector-forming plate-like member. ,
ステ、ソプを備えることを特徴とするコネクターの製造方法。  A method for manufacturing a connector, comprising a step and a sop.
PCT/JP1994/001818 1993-11-01 1994-10-27 Manufacture of connector WO1995012907A1 (en)

Priority Applications (2)

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DE4498477A DE4498477B4 (en) 1993-11-01 1994-10-27 Method for producing plate-shaped contact elements
DE4498477T DE4498477T1 (en) 1993-11-01 1994-10-27 Method of making a connection

Applications Claiming Priority (2)

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JP5/273836 1993-11-01
JP27383693A JP3345691B2 (en) 1993-11-01 1993-11-01 Manufacturing method of connector

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JPS63166973A (en) * 1986-12-27 1988-07-11 Sankyo Kasei Kk Production of formed article such as circuit board
JPH02228092A (en) * 1989-03-01 1990-09-11 Casio Comput Co Ltd Manufacture of double sided wiring substrate
JPH05206614A (en) * 1992-01-28 1993-08-13 Hitachi Cable Ltd Method for manufacturing plastic molding

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DE2042309C3 (en) * 1970-08-26 1974-01-10 Blaupunkt-Werke Gmbh, 3200 Hildesheim Process for the production of extensive cable runs on an insulating plate
US4689103A (en) * 1985-11-18 1987-08-25 E. I. Du Pont De Nemours And Company Method of manufacturing injection molded printed circuit boards in a common planar array
US4858313A (en) * 1987-05-01 1989-08-22 Labinal Components And Systems, Inc. Method of forming a connector
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Publication number Priority date Publication date Assignee Title
JPS62269392A (en) * 1986-05-17 1987-11-21 キヤノン株式会社 Manufacture of printed wiring unit
JPS63166973A (en) * 1986-12-27 1988-07-11 Sankyo Kasei Kk Production of formed article such as circuit board
JPH02228092A (en) * 1989-03-01 1990-09-11 Casio Comput Co Ltd Manufacture of double sided wiring substrate
JPH05206614A (en) * 1992-01-28 1993-08-13 Hitachi Cable Ltd Method for manufacturing plastic molding

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DE4498477B4 (en) 2008-05-15
JPH07130440A (en) 1995-05-19
JP3345691B2 (en) 2002-11-18
DE4498477T1 (en) 1995-12-07

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