WO1995008844A1 - Systeme refrigerant pour un module de puissance a semi-conducteurs - Google Patents

Systeme refrigerant pour un module de puissance a semi-conducteurs Download PDF

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Publication number
WO1995008844A1
WO1995008844A1 PCT/DE1994/001071 DE9401071W WO9508844A1 WO 1995008844 A1 WO1995008844 A1 WO 1995008844A1 DE 9401071 W DE9401071 W DE 9401071W WO 9508844 A1 WO9508844 A1 WO 9508844A1
Authority
WO
WIPO (PCT)
Prior art keywords
power semiconductor
base plate
semiconductor module
cooling device
cooling component
Prior art date
Application number
PCT/DE1994/001071
Other languages
German (de)
English (en)
Inventor
Reinhold Kuhnert
Walter Kiffe
Hans-Joachim Knaak
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1995008844A1 publication Critical patent/WO1995008844A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • a liquid-cooled semiconductor rectifier arrangement is known from German utility model 75 39 365, in which rectifier elements are fastened to metallized surface sections of a thermally highly conductive insulating material pane and the insulating material pane is either soldered onto a cooling component made of copper or metallized onto a cooling component made of copper Cooling component made of ceramic z. B. is glued, wherein the cooling component is flowed through by a liquid coolant and thus cooled.
  • the disadvantage here is that no conventional standard modules can be used and the semiconductor rectifier arrangement can only be used sensibly for liquid cooling due to the fixed connection to the cooling component.
  • the cooling component has a high weight and bores to be provided for coolant channels are comparatively complex to produce.
  • the object on which the invention is based is to provide a cooling device for power semiconductor modules which is particularly suitable for commercially available standard power semiconductor modules, in which the power module and the cooling component are detachably connected and which has the lowest possible heat transfer resistance between the power semiconductor module and the coolant .
  • This object is achieved by the features of patent claim 1.
  • Claims 2 to 4 are directed to advantageous embodiments of the invention and claim 5 to a preferred use of the invention.
  • Figure 1 is a sectional view of a cooling device according to the invention.
  • FIG. 2 shows a sectional illustration of a further cooling device according to the invention.
  • FIG. 1 shows a cooling device according to the invention, in which a cooling component KB has a trough-shaped depression W on one side S with an inlet opening E and an outlet opening A for a liquid coolant K, and in which the trough-shaped depression of the cooling component is completely covered by a metallic base plate M of a standard power semiconductor module LHM is completed and the metallic base plate M itself forms part of the cooling device.
  • the power semiconductor module LHM is essentially constructed in such a way that a good heat-conducting insulation layer ISO, for example made of ceramic material, is applied to the metallic base plate M, which has fastening holes, for example, and at least one semiconductor chip CHIP is applied to the insulation layer is, the connection between the semiconductor chip and the insulation layer and the connection between the insulation layer and the metallic base plate being insignificant for the invention.
  • a housing part enclosing the insulation layer ISO and the semiconductor chip CHIP is indicated in FIG.
  • the object of FIG. 2 differs from the object of FIG. 1 by another module LHM ', which has a different base plate M', and by cooling component KB 'without a trough-shaped recess.
  • finger or rib-like structures R are provided in the metallic base plate M ', which is somewhat thicker than in FIG. 1, and which can be linear or undulating in the direction of flow.
  • These rib-like structures R can be produced very easily, for example by milling or embossing the essentially flat base plate M ', and are, for example, approximately 1 mm wide and a few millimeters deep.
  • the cooling component KB ' is shown without a trough-shaped recess and has openings on one end face which enable the channels between the finger-like or rib-like structures to be supplied and disposed of.
  • the finger- or rib-like structures create a cooling duct cooling fin system of high efficiency, in which the heat transfer area is enlarged and a turbulent one
  • the cooling component KB or KB 'can consist, for example, of metal, ceramic or plastic, plastic being particularly advantageous because of its low weight, low sensitivity to breakage and ease of manufacture.
  • a cooling component can be implemented, for example, as a plastic injection molded part.
  • the power semiconductor module LHM is attached to the cooling component KB using screws S1 and S2, for example.
  • a frame-shaped groove N can advantageously be inserted into the cooling component KB around the trough-shaped recess in the side S facing the metallic base plate M or M ' Seal DI made of elastic material, such as VITON, is introduced.
  • the cooling component KB consists entirely of hard rubber and that the seal DI is taken into account as a sealing lip when shaping the component KB.
  • the component KB can be connected to the power semiconductor module, for example, by metal clips attached to the side.
  • the flow rate of the liquid coolant K is typically between 1 and 10 liters per minute for a power semiconductor module with a base plate dimension of 95 ⁇ 34 mm ⁇ .
  • a cooling device can be used in electric vehicles and mobile electrical systems, such as, for example, computer tomographs, since the properties specified in the task are advantageous here.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système qui comprend un composant réfrigérant (KB) présentant sur un côté (S) une cavité (W) en cuvette pourvue d'un orifice d'entrée et d'un orifice de sortie (E, A) pour un réfrigérant liquide, et sur lequel une plaque métallique de fond (M) du module de puissance à semiconducteurs peut être apposée de manière à obturer complètement la cavité en cuvette. La plaque métallique de fond constitue elle aussi une partie du système réfrigérant. Le principal avantage de ce système réside dans son poids réduit, dans sa faible résistance à la transmission de chaleur entre le module et le composant réfrigérant et dans son utilité pratique pour des modules de puissance à semi-conducteurs standard du commerce.
PCT/DE1994/001071 1993-09-21 1994-09-16 Systeme refrigerant pour un module de puissance a semi-conducteurs WO1995008844A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4332077 1993-09-21
DEP4332077.5 1993-09-21

Publications (1)

Publication Number Publication Date
WO1995008844A1 true WO1995008844A1 (fr) 1995-03-30

Family

ID=6498219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1994/001071 WO1995008844A1 (fr) 1993-09-21 1994-09-16 Systeme refrigerant pour un module de puissance a semi-conducteurs

Country Status (1)

Country Link
WO (1) WO1995008844A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998003997A1 (fr) * 1996-07-22 1998-01-29 Northrop Grumman Corporation Refroidissement en circuit ferme par un liquide dans des modules r.f.
DE19833707A1 (de) * 1998-07-27 2000-02-10 Abb Daimler Benz Transp Kühler zur Fluidkühlung eines elektronischen Bauteils
FR2786658A1 (fr) * 1998-11-27 2000-06-02 Alstom Technology Structure composite pour composant electronique de puissance procede de fabrication de cette structure et composant electronique de puissance pourvu d'une telle structure
EP1253639A2 (fr) * 2001-04-27 2002-10-30 Aavid Thermalloy S.r.l. Dissipateur de chaleur refroidi par un fluide pour composants électroniques
WO2008029858A1 (fr) 2006-09-05 2008-03-13 Kabushiki Kaisha Toshiba Boîtier de semiconducteur et assemblage de boîtier de semiconducteur
FR2911247A1 (fr) * 2007-01-08 2008-07-11 Sames Technologies Soc Par Act Carte electronique et plaque froide pour cette carte.
WO2008089711A1 (fr) * 2007-01-22 2008-07-31 Siemens Aktiengesellschaft Dispositif pour refroidir des composants
WO2012139196A1 (fr) * 2011-04-13 2012-10-18 Tm4 Inc. Dispositif de refroidissement doté d'un canal de dérivation
EP2559964A1 (fr) * 2011-08-15 2013-02-20 Pierburg GmbH Dispositif de refroidissement pour un composant sous contrainte thermique
US9326421B2 (en) 2011-01-14 2016-04-26 Azur Space Solar Power Gmbh Arrangement and method for cooling a support
CN106257656A (zh) * 2015-06-17 2016-12-28 Zf腓德烈斯哈芬股份公司 用于冷却功率模块的装置
CN106304811A (zh) * 2016-10-19 2017-01-04 中国科学院光电研究院 一种电子系统的自散热结构
EP3324449A1 (fr) * 2016-11-21 2018-05-23 Solergy Italia S.r.l. Dispositif récepteur de concentration de systèmes photovoltaiques
US10262921B2 (en) 2015-01-15 2019-04-16 Lappeenrannan Teknillinen Yliopisto Semiconductor module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
DE3744353C1 (en) * 1987-12-29 1989-04-13 Flender Himmelwerk Gmbh Cooling body for a semiconductor component
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500215A1 (fr) * 1981-02-13 1982-08-20 Thomson Csf Dispositif de refroidissement d'un composant electronique de puissance, et composant encapsule dans un boitier muni d'un tel dispositif
DE3744353C1 (en) * 1987-12-29 1989-04-13 Flender Himmelwerk Gmbh Cooling body for a semiconductor component
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4967832A (en) * 1989-12-27 1990-11-06 Nrc Corporation Cooling method and apparatus for integrated circuit chips

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998003997A1 (fr) * 1996-07-22 1998-01-29 Northrop Grumman Corporation Refroidissement en circuit ferme par un liquide dans des modules r.f.
DE19833707A1 (de) * 1998-07-27 2000-02-10 Abb Daimler Benz Transp Kühler zur Fluidkühlung eines elektronischen Bauteils
FR2786658A1 (fr) * 1998-11-27 2000-06-02 Alstom Technology Structure composite pour composant electronique de puissance procede de fabrication de cette structure et composant electronique de puissance pourvu d'une telle structure
EP1253639A2 (fr) * 2001-04-27 2002-10-30 Aavid Thermalloy S.r.l. Dissipateur de chaleur refroidi par un fluide pour composants électroniques
EP1253639A3 (fr) * 2001-04-27 2004-06-09 Aavid Thermalloy S.r.l. Dissipateur de chaleur refroidi par un fluide pour composants électroniques
US8405204B2 (en) 2006-09-05 2013-03-26 Kabushiki Kaisha Toshiba Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure
EP2061079A1 (fr) * 2006-09-05 2009-05-20 Kabushiki Kaisha Toshiba Boîtier de semiconducteur et assemblage de boîtier de semiconducteur
EP2061079A4 (fr) * 2006-09-05 2011-12-07 Toshiba Kk Boîtier de semiconducteur et assemblage de boîtier de semiconducteur
WO2008029858A1 (fr) 2006-09-05 2008-03-13 Kabushiki Kaisha Toshiba Boîtier de semiconducteur et assemblage de boîtier de semiconducteur
WO2008099085A1 (fr) * 2007-01-08 2008-08-21 Sames Technologies Carte electronique et plaque froide pour cette carte
US7916481B2 (en) 2007-01-08 2011-03-29 Sames Technologies Electronic board and cold plate for said board
FR2911247A1 (fr) * 2007-01-08 2008-07-11 Sames Technologies Soc Par Act Carte electronique et plaque froide pour cette carte.
WO2008089711A1 (fr) * 2007-01-22 2008-07-31 Siemens Aktiengesellschaft Dispositif pour refroidir des composants
US9326421B2 (en) 2011-01-14 2016-04-26 Azur Space Solar Power Gmbh Arrangement and method for cooling a support
WO2012139196A1 (fr) * 2011-04-13 2012-10-18 Tm4 Inc. Dispositif de refroidissement doté d'un canal de dérivation
CN102781202A (zh) * 2011-04-13 2012-11-14 Tm4股份有限公司 具有旁路通道的冷却器件
EP2559964A1 (fr) * 2011-08-15 2013-02-20 Pierburg GmbH Dispositif de refroidissement pour un composant sous contrainte thermique
US10262921B2 (en) 2015-01-15 2019-04-16 Lappeenrannan Teknillinen Yliopisto Semiconductor module
CN106257656A (zh) * 2015-06-17 2016-12-28 Zf腓德烈斯哈芬股份公司 用于冷却功率模块的装置
CN106304811A (zh) * 2016-10-19 2017-01-04 中国科学院光电研究院 一种电子系统的自散热结构
CN106304811B (zh) * 2016-10-19 2018-09-18 中国科学院光电研究院 一种电子系统的自散热结构
EP3324449A1 (fr) * 2016-11-21 2018-05-23 Solergy Italia S.r.l. Dispositif récepteur de concentration de systèmes photovoltaiques

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