WO2008089711A1 - Dispositif pour refroidir des composants - Google Patents

Dispositif pour refroidir des composants Download PDF

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Publication number
WO2008089711A1
WO2008089711A1 PCT/DE2007/000107 DE2007000107W WO2008089711A1 WO 2008089711 A1 WO2008089711 A1 WO 2008089711A1 DE 2007000107 W DE2007000107 W DE 2007000107W WO 2008089711 A1 WO2008089711 A1 WO 2008089711A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
potting compound
reinforcing structure
ribs
Prior art date
Application number
PCT/DE2007/000107
Other languages
German (de)
English (en)
Inventor
Rainer Kreutzer
Norbert Reichenbach
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Priority to DE112007003440T priority Critical patent/DE112007003440A5/de
Priority to PCT/DE2007/000107 priority patent/WO2008089711A1/fr
Publication of WO2008089711A1 publication Critical patent/WO2008089711A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a device for cooling of components, in particular semiconductor components. Furthermore, the invention relates to a method for assembling a component comprising a component to be cooled.
  • Power semiconductors typically generate a considerable power loss, which is dissipated by means of separate cooling devices. For example, this comes into consideration for rib heat sinks of extruded light metal.
  • a device for dissipating heat from semiconductor components is known, for example, from DE 197 07 514 A1.
  • This device comprises a metal support plate on which, on the one hand, a heat sink and, on the other hand, a plurality of ceramic substrates equipped with semiconductor components rest.
  • Defined elastic points, so-called predetermined bending points, in the metal support plate are intended to reduce the mechanical stresses between the ceramic substrates and the metal support plate during mounting on the heat sink .
  • heat arising in the semiconductor components is conducted via the ceramic substrates and the metal carrier plate to the heat sink.
  • the object of the invention is to cool a component arranged on a planar substrate, in particular a semiconductor component, in a particularly effective manner.
  • the device comprises a substrate attached to at least one component to be cooled, a substrate which is directly adjacent to the substrate and arranged on the side facing away from the component for the passage of a cooling liquid Cooling volume, as well as a reinforcing structure, which on the with the Bau- element equipped side of the substrate is arranged and counteracts a caused by the pressure of the cooling liquid deflection of the substrate.
  • a substrate equipped with a component to be cooled is first of all inserted into a housing such that the substrate arranges the wall of a side of the substrate which faces away from the component, for
  • a reinforcing structure is fixed in or on the housing on the side of the substrate facing away from the cooling volume, wherein the reinforcing structure is spaced from the substrate, in particular from the at least one component arranged thereon. Only after completion of the assembly of the reinforcing structure of the space between the component and the reinforcing structure is poured with a potting compound. The cured potting compound thus forms a force-transmitting element between the substrate and the reinforcing structure and compensates for tolerances that are conceivable during assembly of the substrate and in particular the reinforcing structure completely.
  • DCB substrate As substrate on which the component to be cooled is arranged, in particular a direct copper bonding (DCB) substrate is suitable.
  • DCB substrates are known in principle, for example from DE 33 23 246 Al. They have a ceramic plate on which a copper layer is applied on both sides in the direct bonding method.
  • a potting compound based on epoxy resin is suitable.
  • a potting compound is preferably selected which has a coefficient of thermal expansion which is at most slightly different than the thermal expansion coefficient of the substrate.
  • the substrate including the component to be cooled, is supported on the reinforcing structure via the potting compound.
  • the reinforcing structure preferably has a plurality of ribs arranged orthogonally to the substrate, which ribs partially dip into the potting compound.
  • the entire reinforcing structure, including the ribs, is already mounted in the final positioning in or on the substrate receiving housing prior to filling the potting compound.
  • the after the introduction and curing of the potting compound from this outstanding ribs are based for example on a fixedly connected to the housing or a housing part performing carrier, which is arranged parallel to the substrate.
  • the carrier is formed, for example, as a rail attached to the housing or perforated plate. In any case, it is ensured by the geometry of the housing and of the carrier that, with the carrier mounted, the potting compound can be applied to the substrate without first disassembling any parts.
  • a mechanical connection between the potting compound and the carrier forming ribs for example, bolt or needle-shaped elements which are held in the carrier or integrally formed therewith, may be provided.
  • the advantage of the invention resides in particular in that a DCB substrate equipped with a heat-generating semiconductor component is cooled directly by a liquid flowing on the surface of the DCB substrate, a bending of the substrate being effectively counteracted by the substrate interposing a follow-up supported potting mass over a large area supported on a reinforcing structure.
  • This support makes it possible, although no bottom plate between the substrate and the cooling medium is arranged to build a high pressure in the cooling medium and thus a high flow rate.
  • high power losses of the semiconductor device can be derived in the smallest amount of space.
  • FIG. 1 shows a first embodiment of a device for cooling of components
  • FIG. 2 shows a second embodiment of a device for cooling of components.
  • FIGS 1 and 2 each show in a simplified
  • the assembly 1 comprises a planar substrate 2, which is equipped with a component 3 to be cooled.
  • the substrate 2 is formed as a direct copper bonding (DCB) substrate and covered on one side by a potting compound 4 enclosing the component 3.
  • DCB direct copper bonding
  • a pressurized liquid in particular water.
  • the substrate 2 is acted upon directly by the cooling liquid, which allows cooling of the substrate 2 and thus also of the device 3 with a very low thermal resistance.
  • the cooling volume 5, also referred to as a cooling channel, has a rectangular cross-section, which is bounded on one side by the substrate 2 and on three sides by a lower housing part 6 or a fixedly connected to such a part component, such as a heat sink.
  • the substrate 2 is sealed to the lower housing part 6 by means of a seal 8.
  • a reinforcing structure 7 is provided.
  • this is composed of a support 9 extending parallel to the substrate 2 and a plurality of ribs 10 held thereon, which form a right angle with the substrate 2.
  • the reinforcing structure 7 is arranged in an upper housing part 11 and bolted together with this by means of a plurality of screws 12 with the lower housing part 6.
  • the carrier 9 is made of metal, for example, while the ribs 10 held on it are made of plastic.
  • the ribs 10 are attached directly to the upper housing part 11 or formed integrally therewith.
  • the ribs 10 contact neither the substrate 2 nor arranged on this, also referred to as a circuit semiconductor device 3. Rather, the individual ribs 10 penetrate only partially into the potting compound 4, so that on the surface 17, a recess 16 is formed. In extreme cases, it is also possible for a rib 10 to contact the potting compound 4 only with a strip-shaped surface. In other words, the ribs 10 dip into the potting compound 4 and are then partially enclosed or enveloped by the potting compound. For this purpose, the potting compound 4 is at least as far as filled and the ribs 10 have such a length that a dipping of the ribs 10 in the potting compound 4 and thus a stable support of the carrier 9 after the curing of the potting compound 4 is possible.
  • the housing designated overall by the reference numeral 15 may be formed without a lid.
  • the introduction and complete curing of the epoxy-based potting compound 4 represents the last step in the production of the assembly 1 shown in the figures.
  • Assembly 1 with the potting compound 4 is a uniform distance of the ribs 10 from the surface of the substrate 2 is not a condition for the proper functioning of the assembly 1.
  • the potting compound 4 forms virtually within the assembly 1 a clearance and tolerance compensation, which is a particularly efficient production and Mounting favors.
  • the mounting compound 4 compensates assembly tolerances between the substrate 2 and the support 9 or the ribs 10 automatically.
  • a cavity 13 is formed, which is bridged by the ribs 10. This cavity 13 is available for the operation of the assembly 1 possible thermally induced dimensional changes of the potting compound 4.
  • the potting compound 4 has sufficient strength in all the temperatures occurring during operation of the assembly 1 in order to support the substrate 2 against the reinforcing structure 7. Compared to insulating soft casting materials based on silicone, the epoxy potting compound 4 is much harder and more rigid. The compliance of the whole sub- Strat 2 supporting system of potting compound 4, ribs 10, optionally support 9 (FIG. 1), lower housing part 6 and screws 12 is extremely small, so that the seal 8 has to compensate for at most slight dimensional changes of the gap 14 to be sealed. A dependence of geometric parameters of the substrate 2 on the pressure of the cooling medium in the cooling volume 5 is practically not given. In particular, bending of the substrate 2 is reliably prevented by the reinforcing structure 7.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Ce dispositif pour refroidir des composants comprend un substrat (2) équipé d'au moins un composant (3) à refroidir; un volume de refroidissement (5) directement adjacent au substrat (2), disposé sur le côté de ce dernier qui est opposé au composant (3) et prévu pour y faire passer un liquide de refroidissement; et une structure de renforcement (7), qui est disposée sur le côté du substrat (2) équipé du composant (3) et qui est conçue pour s'opposer à un fléchissement du substrat (2) causé par la pression du liquide de refroidissement.
PCT/DE2007/000107 2007-01-22 2007-01-22 Dispositif pour refroidir des composants WO2008089711A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112007003440T DE112007003440A5 (de) 2007-01-22 2007-01-22 Vorrichtung zur Kühlung von Bauelementen
PCT/DE2007/000107 WO2008089711A1 (fr) 2007-01-22 2007-01-22 Dispositif pour refroidir des composants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2007/000107 WO2008089711A1 (fr) 2007-01-22 2007-01-22 Dispositif pour refroidir des composants

Publications (1)

Publication Number Publication Date
WO2008089711A1 true WO2008089711A1 (fr) 2008-07-31

Family

ID=38134929

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2007/000107 WO2008089711A1 (fr) 2007-01-22 2007-01-22 Dispositif pour refroidir des composants

Country Status (2)

Country Link
DE (1) DE112007003440A5 (fr)
WO (1) WO2008089711A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8169779B2 (en) 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
DE102009027292B4 (de) * 2008-08-26 2012-08-16 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung
WO2012095437A3 (fr) * 2011-01-14 2012-11-15 Azur Space Solar Power Gmbh Ensemble et procédé pour refroidir un support

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008844A1 (fr) * 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Systeme refrigerant pour un module de puissance a semi-conducteurs
DE102004014911A1 (de) * 2003-03-26 2004-10-21 Denso Corp., Kariya Halbleitermodul

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008844A1 (fr) * 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Systeme refrigerant pour un module de puissance a semi-conducteurs
DE102004014911A1 (de) * 2003-03-26 2004-10-21 Denso Corp., Kariya Halbleitermodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
BAYERER R ET AL: "LEISTUNGSHALBLEITERMODULE IN DIREKT-BONDING-TECHNIK", TECHNISCHE RUNDSCHAU, EDITION COLIBRI AG., WABERN, CH, vol. 80, no. 32, 5 August 1988 (1988-08-05), pages 38 - 41,43,45, XP000110807, ISSN: 1023-0823 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009027292B4 (de) * 2008-08-26 2012-08-16 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Inverterleistungsmodul mit verteilter Stütze zur direkten Substratkühlung
US8248809B2 (en) 2008-08-26 2012-08-21 GM Global Technology Operations LLC Inverter power module with distributed support for direct substrate cooling
US8169779B2 (en) 2009-12-15 2012-05-01 GM Global Technology Operations LLC Power electronics substrate for direct substrate cooling
WO2012095437A3 (fr) * 2011-01-14 2012-11-15 Azur Space Solar Power Gmbh Ensemble et procédé pour refroidir un support

Also Published As

Publication number Publication date
DE112007003440A5 (de) 2010-01-21

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