DE112007003440A5 - Vorrichtung zur Kühlung von Bauelementen - Google Patents
Vorrichtung zur Kühlung von Bauelementen Download PDFInfo
- Publication number
- DE112007003440A5 DE112007003440A5 DE112007003440T DE112007003440T DE112007003440A5 DE 112007003440 A5 DE112007003440 A5 DE 112007003440A5 DE 112007003440 T DE112007003440 T DE 112007003440T DE 112007003440 T DE112007003440 T DE 112007003440T DE 112007003440 A5 DE112007003440 A5 DE 112007003440A5
- Authority
- DE
- Germany
- Prior art keywords
- cooling components
- cooling
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE2007/000107 WO2008089711A1 (de) | 2007-01-22 | 2007-01-22 | Vorrichtung zur kühlung von bauelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112007003440A5 true DE112007003440A5 (de) | 2010-01-21 |
Family
ID=38134929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112007003440T Withdrawn DE112007003440A5 (de) | 2007-01-22 | 2007-01-22 | Vorrichtung zur Kühlung von Bauelementen |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE112007003440A5 (de) |
WO (1) | WO2008089711A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8248809B2 (en) | 2008-08-26 | 2012-08-21 | GM Global Technology Operations LLC | Inverter power module with distributed support for direct substrate cooling |
US8169779B2 (en) | 2009-12-15 | 2012-05-01 | GM Global Technology Operations LLC | Power electronics substrate for direct substrate cooling |
DE102011000455A1 (de) * | 2011-01-14 | 2012-07-19 | Azur Space Solar Power Gmbh | Anordnen und Verfahren zum Kühlen eines Trägers |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995008844A1 (de) * | 1993-09-21 | 1995-03-30 | Siemens Aktiengesellschaft | Kühlvorrichtung für ein leistungshalbleitermodul |
JP4016271B2 (ja) * | 2003-03-26 | 2007-12-05 | 株式会社デンソー | 両面冷却型半導体モジュール |
-
2007
- 2007-01-22 WO PCT/DE2007/000107 patent/WO2008089711A1/de active Application Filing
- 2007-01-22 DE DE112007003440T patent/DE112007003440A5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2008089711A1 (de) | 2008-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |