WO1994023556A1 - Multilayer printed board - Google Patents

Multilayer printed board Download PDF

Info

Publication number
WO1994023556A1
WO1994023556A1 PCT/JP1994/000404 JP9400404W WO9423556A1 WO 1994023556 A1 WO1994023556 A1 WO 1994023556A1 JP 9400404 W JP9400404 W JP 9400404W WO 9423556 A1 WO9423556 A1 WO 9423556A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer printed
printed board
board
heat transfer
cooling
Prior art date
Application number
PCT/JP1994/000404
Other languages
French (fr)
Japanese (ja)
Inventor
Junichi Sato
Yoshiaki Kurobe
Original Assignee
Fanuc Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Ltd filed Critical Fanuc Ltd
Publication of WO1994023556A1 publication Critical patent/WO1994023556A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Definitions

  • the present invention relates to an improvement in a multilayer print substrate.
  • the present invention relates to an improvement in which a device to be mounted on a multilayer printed circuit board, for example, a position where an Ic or the like is mounted can be freely selected, thereby improving a cooling capacity.
  • the multilayer printed circuit board has a plurality of insulating layers laminated, and signal wiring, power supply wiring, grounding wiring, etc. penetrate the multilayer printed board or an insulating material constituting the same. It is often arranged inside along layers.
  • the equipment attached to it such as IC, had a cooling means, such as a heat sink, a cooling plate, and a cooling fin, integrated with the IC body.
  • devices such as Ic to which these cooling means are attached are attached to the multilayer printed circuit board.
  • the object of the present invention is that the size of the cooling means can be freely selected.
  • the equipment to be mounted and the position where the cooling means is attached can be freely selected, and there is an advantage without limitation in design.
  • An object of the present invention is to provide a multilayer printed circuit board. Disclosure of the invention
  • a heat transfer plate is embedded in the multilayer print board, and a heating element such as an IC or the like is formed through a heat transfer wire connected thereto.
  • a multi-layer printed circuit board with a cooling body such as a heat sink, a cooling plate, and a cooling fin mounted on the surface.
  • FIG. 1 is a sectional view of a multilayer printed board according to one embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION ''
  • a heat transfer plate 2 is embedded in a multilayer printed board 1, and a plurality of heat transfer wires 4 connected to the heat transfer plate 2 are formed by a multilayer print. It protrudes from the surface of the multilayer printed board 1 through a through hole provided through the printed board 1. Then, by connecting to the heat propagation wire 4, a cooling element such as a heating element 31 such as a power IC, a heat sink 51 or a cooling fin 52 is formed. Mounted on the surface of the printed circuit board 1.
  • the cooling body can be sized as desired as shown in the figure, and can be mounted at a desired position. This eliminates the design limitation of the multilayer printed circuit board. Industrial applicability
  • the multilayer printed board according to the present invention is extremely useful as a multilayer printed board for a numerically controlled machine tool that uses a large amount of power IC or the like that generates a large amount of heat.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

In this board (1), a sheet (2) for heat transfer is buried. Devices (3) such as power ICs and cooling elements (5) such as heat sinks, which are mounted on the board (1), are thermally connected through heat transfer wires (4) to the sheet (2).

Description

明 細 書  Specification
多層プリ ン ト基板 技術分野  Technical field of multilayer printed circuit board
本発明は多層プリ ン ト基板の改良に関する。 特に、 多層プリ ン ト 基板に取り付けられる機器例えば I c等が取り付けられる位置を自 由に選択できるようにし、 冷却能力を向上する改良に関する。 背景技術  The present invention relates to an improvement in a multilayer print substrate. In particular, the present invention relates to an improvement in which a device to be mounted on a multilayer printed circuit board, for example, a position where an Ic or the like is mounted can be freely selected, thereby improving a cooling capacity. Background art
多層プリ ン ト基板は、 複数の絶緣物層が積層されており、 信号用 配線、 電源供給用配線、 接地用配線等が、 多層プリ ン ト基板を貫通 し、 または、 これを構成する絶縁物層にそって内部に配設されてい る場合が多い。 しかし、 これに取り付けられる機器例えば I C等は. ヒー ト シンク、 冷却板、 冷却フィ ン等の冷却手段が I C本体と一体 にされていた。 換言すれば、 これらの冷却手段が取り付けられた I c等の機器が、 多層ブリ ン ト基板に取り付けられていた。  The multilayer printed circuit board has a plurality of insulating layers laminated, and signal wiring, power supply wiring, grounding wiring, etc. penetrate the multilayer printed board or an insulating material constituting the same. It is often arranged inside along layers. However, the equipment attached to it, such as IC, had a cooling means, such as a heat sink, a cooling plate, and a cooling fin, integrated with the IC body. In other words, devices such as Ic to which these cooling means are attached are attached to the multilayer printed circuit board.
そのため、 冷却手段の大きさが制限されたり、 機器例えば I C等 や冷却手段が取り付けられる位置が制限されたりする等の欠点を免 れなかった。 これは、 設計上大きな制厄になっていた。  As a result, there were inevitable drawbacks such as limitations on the size of the cooling means, and restrictions on the position of equipment such as ICs and cooling means. This has been a major stumbling block in design.
本発明の目的は、 冷却手段の大きさを自由に選択するこ とができ . 実装される機器や冷却手段の取り付けられる位置を自由に選択する ことができ、 設計上の制限のない利益を有する多層プリ ン ト基板を 提供することにある。 発明の開示  The object of the present invention is that the size of the cooling means can be freely selected. The equipment to be mounted and the position where the cooling means is attached can be freely selected, and there is an advantage without limitation in design. An object of the present invention is to provide a multilayer printed circuit board. Disclosure of the invention
本発明に係る多層プリ ン ト基板は、 多層プリ ン ト基板中に、 熱伝 播用板状体が埋め込まれており、 これと連結する熱伝播用線を介し て、 I C等の発熱体またはヒー ト シンク · 冷却板 · 冷却フィ ン等の 冷却体が表面に取り付けられている多層プリ ン ト基板である。 図面の簡単な説明 In the multilayer printed board according to the present invention, a heat transfer plate is embedded in the multilayer print board, and a heating element such as an IC or the like is formed through a heat transfer wire connected thereto. It is a multi-layer printed circuit board with a cooling body such as a heat sink, a cooling plate, and a cooling fin mounted on the surface. BRIEF DESCRIPTION OF THE FIGURES
第 1図は、 本発明の一実施例に係る多層プリ ン ト基板の断面図で ある。 発明を実施するための最良の形態 '  FIG. 1 is a sectional view of a multilayer printed board according to one embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION ''
図面を参照して本発明の一実施例に係る多層プリ ン ト基板につい て説明する。  An embodiment of the present invention will be described with reference to the accompanying drawings.
第 1図において、 多層プリ ン ト基板 1 中に熱伝播用板状体 2が埋 め込まれており、 この熱伝播用板状体 2に連結される複数の熱伝播 用線 4が多層プリ ン ト基板 1 を貫通して設けられたスルーホールを 介して多層プリ ン ト基板 1 の表面に突出している。 そして、 この熱 伝播用線 4に接続して、 電力用 I C等の発熱体 3 1、 3 2、 3 3、 3 4や放熱板 5 1や冷却フィ ン 5 2等の冷却体が、 多層プリ ン ト基 板 1 の表面に取り付けられている。 冷却体は、 図示するように、 所 望の大きさにすることができ、 所望の位置に取り付けることができ. 多層プリ ン ト基板の設計上の制限を解消することができる。 産業上の利用可能性  In FIG. 1, a heat transfer plate 2 is embedded in a multilayer printed board 1, and a plurality of heat transfer wires 4 connected to the heat transfer plate 2 are formed by a multilayer print. It protrudes from the surface of the multilayer printed board 1 through a through hole provided through the printed board 1. Then, by connecting to the heat propagation wire 4, a cooling element such as a heating element 31 such as a power IC, a heat sink 51 or a cooling fin 52 is formed. Mounted on the surface of the printed circuit board 1. The cooling body can be sized as desired as shown in the figure, and can be mounted at a desired position. This eliminates the design limitation of the multilayer printed circuit board. Industrial applicability
以上のように、 本発明に係る多層プリ ン ト基板は、 発熱量の大き な電力用 I C等を多く使用する数値制御工作機械用の多層プリ ン ト 基板等として、 極めて有用である。  As described above, the multilayer printed board according to the present invention is extremely useful as a multilayer printed board for a numerically controlled machine tool that uses a large amount of power IC or the like that generates a large amount of heat.

Claims

請 求 の 範 囲 The scope of the claims
1 . 多層プリ ン ト基板 （ 1 ) 中に熱伝播用板状体 （ 2 ) が埋設され ており、 1. The heat transfer plate (2) is embedded in the multilayer printed board (1).
該熱伝播用板状体 （ 2 ) に連結する複数の熱伝播角線 （ 4 ) が前 記多層プリ ン ト基板 （ 1 ) を貫通して設けられたスルーホールを介 して、 前記多層プリ ン ト基板 （ 1 ) の表面に突出しており、 該複数 の熱伝播用線 （ 4 ) に、 機器本体 （ 3 ) または冷却手段 （ 5 ) が独 立して接続されてなる  A plurality of heat propagation angle lines (4) connected to the heat propagation plate (2) are passed through the multilayer printed board (1) to form the multilayer printed circuit board. The main body (3) or the cooling means (5) is independently connected to the plurality of heat transfer wires (4), protruding from the surface of the mounting board (1).
ことを特徴とする多層プリ ン ト基板。  A multilayer printed board characterized by the above-mentioned.
PCT/JP1994/000404 1993-03-31 1994-03-15 Multilayer printed board WO1994023556A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1569693U JPH0677281U (en) 1993-03-31 1993-03-31 Multilayer printed circuit board
JP5/15696U 1993-03-31

Publications (1)

Publication Number Publication Date
WO1994023556A1 true WO1994023556A1 (en) 1994-10-13

Family

ID=11895941

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1994/000404 WO1994023556A1 (en) 1993-03-31 1994-03-15 Multilayer printed board

Country Status (2)

Country Link
JP (1) JPH0677281U (en)
WO (1) WO1994023556A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951650B2 (en) 2006-02-28 2011-05-31 Juniper Networks, Inc. Thermal management of electronic devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2803603B2 (en) * 1995-09-18 1998-09-24 日本電気株式会社 Multi-chip package structure
JPH1098287A (en) * 1996-09-19 1998-04-14 Toshiba Corp Cooler for circuit board module and portable electronic equipment having the cooler
WO2004068923A1 (en) * 2003-01-28 2004-08-12 Cmk Corporation Metal core multilayer printed wiring board
JP2010080572A (en) * 2008-09-25 2010-04-08 Denso Corp Electronic equipment
JP6119111B2 (en) * 2012-05-16 2017-04-26 富士通株式会社 Circuit board, circuit board manufacturing method, electronic device, and electronic device manufacturing method
WO2015049807A1 (en) * 2013-10-04 2015-04-09 株式会社日立製作所 Server device
JP6251420B1 (en) * 2016-05-30 2017-12-20 三菱電機株式会社 Electronic module and method for manufacturing electronic module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396075U (en) * 1990-01-22 1991-10-01
JPH0487398A (en) * 1990-07-30 1992-03-19 Matsushita Electric Ind Co Ltd High-density functional device
JPH0499873U (en) * 1991-02-04 1992-08-28

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396075U (en) * 1990-01-22 1991-10-01
JPH0487398A (en) * 1990-07-30 1992-03-19 Matsushita Electric Ind Co Ltd High-density functional device
JPH0499873U (en) * 1991-02-04 1992-08-28

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951650B2 (en) 2006-02-28 2011-05-31 Juniper Networks, Inc. Thermal management of electronic devices
US8318546B2 (en) 2006-02-28 2012-11-27 Juniper Networks, Inc. Thermal management of electronic devices
EP1827070B1 (en) * 2006-02-28 2017-10-18 Juniper Networks, Inc. Thermal management of electronic devices

Also Published As

Publication number Publication date
JPH0677281U (en) 1994-10-28

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